Bonding finger tilt angle measurement method, device, terminal and storage medium

Abstract

The present invention provides a method, device, terminal and storage medium for measuring the inclination angle of a bonding finger. The method comprises: acquiring an image containing a bonding finger; determining the position of the bonding finger based on visual detection technology and the image; determining the position of a test point based on the position of the bonding finger; the test point is a point on the bonding finger; and measuring the test point by a laser sensor to obtain the inclination angle of the bonding finger. The present invention determines the position of the bonding finger by visual detection technology, and then determines the test point, which is more accurate than the position of the test point selected manually, so the inclination angle measurement result based on this test point is also more accurate.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging testing, and in particular to a method, device, terminal and storage medium for measuring the inclination angle of a bonding finger. Background Art

[0002] When performing appearance inspection on packaged electronic components, it is necessary to check the inclination of the bonding finger. At present, the commonly used inspection technology is to first manually select the measurement position, then use a line laser to scan the contour of a certain generatrix of the bonding finger, and extract the height difference between the highest and lowest points of the contour curve as the corresponding measurement point based on the fluctuation of the scanning contour curve, and then calculate the inclination angle of the bonding finger.

[0003] Since the measurement position is selected by manual judgment, there is a deviation from the actual position. It is not the busbar in the middle area. The highest and lowest points scanned are not the points marked on the drawing. There is a deviation in the horizontal spacing, resulting in inaccurate detection results. Summary of the invention

[0004] The present invention provides a bonding finger tilt angle measurement method, device, terminal and storage medium to solve the problem of inaccurate bonding finger tilt angle detection.

[0005] In a first aspect, the present invention provides a method for measuring a bonding finger tilt angle, comprising:

[0006] acquiring an image including the bonding fingers;

[0007] Determine the position of the bonding fingers based on visual inspection technology and images;

[0008] Determining the position of the test point based on the position of the bonding finger; wherein the test point is a point on the bonding finger;

[0009] The test point is measured by a laser sensor to obtain the tilt angle of the bonding finger.

[0010] In a possible implementation, the number of test points is at least two;

[0011] The laser sensor is used to measure the test points and obtain the tilt angle of the bonding finger, including:

[0012] Extract the center line profile of the bonding finger by using a line laser sensor;

[0013] Determining an average profile between two test points based on a plurality of midline profiles; wherein the two test points are points on the midline of the bonding finger;

[0014] The average profile is fitted based on the least square method, and the tilt angle between two test points is calculated to obtain the tilt angle of the bonding finger.

[0015] In a possible implementation, the number of test points is at least two;

[0016] The laser sensor is used to measure the test points and obtain the tilt angle of the bonding finger, including:

[0017] The height of two test points is measured by a point laser sensor;

[0018] The tilt angle between the two test points is calculated based on the height difference between the two test points and the horizontal distance between the two test points to obtain the tilt angle of the bonding finger.

[0019] In a possible implementation, before determining the position of the bonding finger based on the visual inspection technology and the image, the method further includes:

[0020] Learn the characteristics of bonding fingers through AI technology;

[0021] Determine the location of bond fingers based on visual inspection techniques and images, including:

[0022] Extract the features of the bonding finger in the image by visual inspection technology;

[0023] The features of the bonding finger are compared with the learned features, and the location of the bonding finger is determined based on the comparison results.

[0024] In a possible implementation, after measuring the test point by using a laser sensor to obtain the tilt angle of the bonding finger, the method further includes:

[0025] If the inclination angle of the bonding finger is within the first preset range, the inclination angle of the bonding finger is determined to be qualified;

[0026] If the inclination angle of the bonding finger is not within the first preset range, the inclination angle of the bonding finger is determined to be unqualified.

[0027] In a possible implementation, after measuring the test point by using a laser sensor to obtain the tilt angle of the bonding finger, the method further includes:

[0028] If the bonding index quantity of the packaged product with a qualified tilt angle is within the second preset range, the packaged product is placed in the qualified area, and / or,

[0029] If the number of bonding indices with qualified tilt angles on the packaged product is not within a second preset range, the packaged product is placed in an unqualified area; wherein the second preset range is determined based on the total number of bonding fingers on the packaged product.

[0030] In a possible implementation, after measuring the test point by using a laser sensor to obtain the tilt angle of the bonding finger, the method further includes:

[0031] The tilt angle of each bonding finger on each packaged product is recorded to count the fluctuation of the tilt angle of the bonding finger.

[0032] In a second aspect, the present invention provides a device for measuring a bonding finger tilt angle, comprising:

[0033] An acquisition module, used for acquiring an image including bonding fingers;

[0034] A recognition module for determining the position of the bonding fingers based on visual inspection technology and images;

[0035] A positioning module, for determining the position of a test point based on the position of the bonding finger; the test point is a point on the bonding finger;

[0036] The measuring module is used to measure the test point through a laser sensor to obtain the tilt angle of the bonding finger.

[0037] In a third aspect, the present invention provides a terminal comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the steps of the first aspect or any possible implementation method of the first aspect are implemented.

[0038] In a fourth aspect, the present invention provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the steps of the first aspect or any possible implementation method of the first aspect.

[0039] The present invention provides a method, device, terminal and storage medium for measuring the inclination angle of a bonding finger, the method comprising: obtaining an image containing a bonding finger; determining the position of the bonding finger based on visual detection technology and the image; determining the position of a test point based on the position of the bonding finger; the test point is a point on the bonding finger; measuring the test point by a laser sensor to obtain the inclination angle of the bonding finger. The present invention determines the position of the bonding finger by visual detection technology, and then determines the test point, which is more accurate than the position of the test point selected manually, so the inclination angle measurement result based on this test point is also more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0041] Figure 1 is a flow chart of an implementation method of a bonding finger tilt angle measurement method provided by an embodiment of the present invention;

[0042] Figure 2 is a schematic structural diagram of a bonding finger provided in one embodiment of the present invention;

[0043] Figure 3 is a schematic structural diagram of a bonding finger tilt angle measuring device provided by an embodiment of the present invention;

[0044] Figure 4 is a schematic diagram of a terminal provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0045] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0046] In order to make the purpose, technical solutions and advantages of the present invention more clear, specific embodiments will be described below in conjunction with the accompanying drawings.

[0047] See also Figure 1 , which shows a flow chart of the implementation of the method for measuring the inclination angle of the bonding finger provided by an embodiment of the present invention, and is described in detail as follows:

[0048] Step 101, acquiring an image including bonding fingers.

[0049] In this embodiment, there are usually multiple bonding fingers on the packaged product, such as a ceramic package tube shell. Currently, in order to measure whether the inclination angle of the bonding finger is qualified, two test points are usually selected manually on the bonding finger, wherein the two test points are both on the longitudinal midline of the bonding finger, and the two test points divide the length of the longitudinal midline into three equal parts. In this embodiment, in order to improve the accuracy of the test point selection, an image containing the bonding finger is first obtained, and then the position of the bonding finger is detected in the image to determine the position of the test point. The specific acquisition process can be to take a photo of the packaged product by a camera or other shooting device. The packaged product can be placed individually for inspection, or multiple packaged products can be placed together for batch photo inspection.

[0050] Step 102 , determining the position of the bonding finger based on visual inspection technology and images.

[0051] In this embodiment, the visual inspection technology can replace manual judgment of the position of the bonding finger in the image, and then accurately determine the actual position of the bonding finger to determine the test point.

[0052] Step 103, determining the position of the test point based on the position of the bonding finger; wherein the test point is a point on the bonding finger.

[0053] In this embodiment, the test point can be a point on the midline of the bonding finger, or other points can be selected for testing according to actual needs. According to geometry, the actual position of the test point can be determined by substituting the relative position relationship between the test point and the bonding finger into the actual position of the bonding finger.

[0054] Step 104 , measuring the test point by using a laser sensor to obtain the tilt angle of the bonding finger.

[0055] In this embodiment, a straight line on the bonding finger can be determined by two test points, and the laser sensor can determine the inclination angle of the straight line by measuring the test points. Finally, the inclination angle of the plane where the straight line is located can be determined based on the inclination angle of the straight line.

[0056] In a possible implementation, the number of test points is at least two;

[0057] The laser sensor is used to measure the test points and obtain the tilt angle of the bonding finger, including:

[0058] Extract the center line profile of the bonding finger by using a line laser sensor;

[0059] Determining an average profile between two test points based on a plurality of midline profiles; wherein the two test points are points on the midline of the bonding finger;

[0060] The average profile is fitted based on the least square method, and the tilt angle between two test points is calculated to obtain the tilt angle of the bonding finger.

[0061] In this embodiment, Figure 2 FIG. 1 shows a schematic diagram of the structure of a bonding finger, where W represents the width of the bonding finger and L represents the length of the bonding finger. Figure 2 It can be seen that the two test points are set on the longitudinal midline of the bonding finger, the distance from the long side of the bonding finger is 1 / 2 of the width of the bonding finger, the distance between the two test points is 2 / 3 of the length of the bonding finger, and the distance from each test point to the end of the bonding finger is the set value L1 of the length of the bonding finger. The line laser sensor can scan the contour of the object. After determining the actual position of the bonding finger and the test point, the line laser sensor can scan the contour of the midline of the bonding finger to determine the average contour between the two test points. The least squares method can further fit the accurate contour between the test points, and finally determine the inclination angle of the bonding finger.

[0062] In a possible implementation, the number of test points is at least two;

[0063] The laser sensor is used to measure the test points and obtain the tilt angle of the bonding finger, including:

[0064] The height of two test points is measured by a point laser sensor;

[0065] The tilt angle between the two test points is calculated based on the height difference between the two test points and the horizontal distance between the two test points to obtain the tilt angle of the bonding finger.

[0066] In this embodiment, the heights of the two test points can also be measured separately by a point laser sensor, specifically the heights relative to a horizontal plane or other reference plane. Finally, the horizontal distance between the two test points is a known parameter, and the inclination angle of the bonding finger can be determined through the trigonometric function relationship.

[0067] In a possible implementation, before determining the position of the bonding finger based on the visual inspection technology and the image, the method further includes:

[0068] Learn the characteristics of bonding fingers through AI technology;

[0069] Determine the location of bond fingers based on visual inspection techniques and images, including:

[0070] Extract the features of the bonding finger in the image by visual inspection technology;

[0071] The features of the bonding finger are compared with the learned features, and the location of the bonding finger is determined based on the comparison results.

[0072] In this embodiment, for different types of packaged products, the appearance of the bonding fingers is usually quite different, and AI technology has a strong learning ability and can learn the characteristics of the target object, so as to accurately distinguish the bonding fingers from the package shell and the tilted bonding fingers. After learning, the visual inspection technology can accurately identify the bonding fingers in the image and determine the actual position of the bonding fingers.

[0073] In a possible implementation, after measuring the test point by using a laser sensor to obtain the tilt angle of the bonding finger, the method further includes:

[0074] If the inclination angle of the bonding finger is within the first preset range, the inclination angle of the bonding finger is determined to be qualified;

[0075] If the inclination angle of the bonding finger is not within the first preset range, the inclination angle of the bonding finger is determined to be unqualified.

[0076] In this embodiment, the bonding finger is a key bonding area on the packaged product. If the inclination angle of the bonding finger is unqualified, it will affect the bonding efficiency and reliability of the chip. Therefore, the inclination angle of the bonding finger can be considered qualified only when it is within the first preset range. The first preset range needs to be specifically set according to the type and purpose of the bonding finger.

[0077] In a possible implementation, after measuring the test point by using a laser sensor to obtain the tilt angle of the bonding finger, the method further includes:

[0078] If the bonding index quantity of the packaged product with a qualified tilt angle is within the second preset range, the packaged product is placed in the qualified area, and / or,

[0079] If the number of bonding indices with qualified tilt angles on the packaged product is not within a second preset range, the packaged product is placed in an unqualified area; wherein the second preset range is determined based on the total number of bonding fingers on the packaged product.

[0080] In this embodiment, the packaged product usually has multiple bonding fingers, and a certain number or a certain proportion of the bonding fingers are allowed to have unqualified inclination angles. If the number of unqualified bonding fingers exceeds this number, the packaged product is considered to be an unqualified product. After determining whether the product is qualified, this embodiment can also automatically distinguish and place qualified and unqualified products, thereby realizing automatic measurement and screening of the inclination angles of the bonding fingers of the ceramic package shell.

[0081] In a possible implementation, after measuring the test point by using a laser sensor to obtain the tilt angle of the bonding finger, the method further includes:

[0082] The tilt angle of each bonding finger on each packaged product is recorded to count the fluctuation of the tilt angle of the bonding finger.

[0083] In this embodiment, the inclination angle of the bonding finger may be affected by the production process and the storage method. By counting the inclination angle of the bonding finger, abnormal conditions of the bonding finger can be discovered in time, and the corresponding causes can be found to monitor the processing level. After measuring the inclination angle of the bonding finger, this embodiment can automatically record the measurement results without adding other operations and will not affect the measurement speed.

[0084] The method for measuring the inclination angle of a bonding finger provided by an embodiment of the present invention comprises: acquiring an image containing a bonding finger; determining the position of the bonding finger based on visual detection technology and the image; determining the position of a test point based on the position of the bonding finger; the test point is a point on the bonding finger; and measuring the test point by a laser sensor to obtain the inclination angle of the bonding finger. The present invention determines the position of the bonding finger by visual detection technology and then determines the test point, which is more accurate than the position of the test point selected manually, so the inclination angle measurement result based on this test point is also more accurate.

[0085] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0086] The following is an embodiment of the device of the present invention. For details not described in detail therein, reference may be made to the corresponding method embodiment described above.

[0087] Figure 3 A schematic diagram of the structure of a device for measuring the inclination angle of a bonding finger provided in an embodiment of the present invention is shown. For ease of description, only the parts related to the embodiment of the present invention are shown, which are described in detail as follows:

[0088] like Figure 3 As shown, the bonding finger tilt angle measuring device 3 comprises:

[0089] An acquisition module 31, used to acquire an image including bonding fingers;

[0090] A recognition module 32 for determining the position of the bonding finger based on visual inspection technology and images;

[0091] A positioning module 33, for determining the position of a test point based on the position of the bonding finger; the test point is a point on the bonding finger;

[0092] The measuring module 34 is used to measure the test point by using a laser sensor to obtain the tilt angle of the bonding finger.

[0093] In a possible implementation, the number of test points is at least two;

[0094] The measurement module 34 is specifically used for:

[0095] Extract the center line profile of the bonding finger by using a line laser sensor;

[0096] Determining an average profile between two test points based on a plurality of midline profiles; wherein the two test points are points on the midline of the bonding finger;

[0097] The average profile is fitted based on the least square method, and the tilt angle between two test points is calculated to obtain the tilt angle of the bonding finger.

[0098] In a possible implementation, the number of test points is at least two;

[0099] The measurement module 34 is specifically used for:

[0100] The height of two test points is measured by a point laser sensor;

[0101] The tilt angle between the two test points is calculated based on the height difference between the two test points and the horizontal distance between the two test points to obtain the tilt angle of the bonding finger.

[0102] In a possible implementation, the identification module 32 is specifically configured to:

[0103] Learn the characteristics of bonding fingers through AI technology;

[0104] Extract the features of the bonding finger in the image by visual inspection technology;

[0105] The features of the bonding finger are compared with the learned features, and the location of the bonding finger is determined based on the comparison results.

[0106] In a possible implementation, the bonding finger tilt angle measuring device 3 further includes a judgment module;

[0107] The judgment module is specifically used for:

[0108] After measuring the test point by a laser sensor to obtain the inclination angle of the bonding finger, if the inclination angle of the bonding finger is within a first preset range, the inclination angle of the bonding finger is determined to be qualified;

[0109] If the inclination angle of the bonding finger is not within the first preset range, the inclination angle of the bonding finger is determined to be unqualified.

[0110] In a possible implementation, the determination module is specifically used for:

[0111] If the bonding index quantity of the packaged product with a qualified tilt angle is within the second preset range, the packaged product is placed in the qualified area, and / or,

[0112] If the number of bonding indices with qualified tilt angles on the packaged product is not within a second preset range, the packaged product is placed in an unqualified area; wherein the second preset range is determined based on the total number of bonding fingers on the packaged product.

[0113] In a possible implementation, the determination module is specifically used for:

[0114] The tilt angle of each bonding finger on each packaged product is recorded to count the fluctuation of the tilt angle of the bonding finger.

[0115] The bonding finger tilt angle measuring device provided by the embodiment of the present invention comprises: an acquisition module for acquiring an image containing bonding fingers; an identification module for determining the position of the bonding fingers based on visual detection technology and images; a positioning module for determining the position of a test point based on the position of the bonding fingers; the test point is a point on the bonding finger; and a measurement module for measuring the test point through a laser sensor to obtain the tilt angle of the bonding finger. The present invention determines the position of the bonding finger through visual detection technology and then determines the test point, which is more accurate than the position of the test point selected manually, so the tilt angle measurement result based on this test point is also more accurate.

[0116] Figure 4 is a schematic diagram of a terminal provided by an embodiment of the present invention. Figure 4 As shown, the terminal 4 of this embodiment includes: a processor 40, a memory 41, and a computer program 42 stored in the memory 41 and executable on the processor 40. When the processor 40 executes the computer program 42, the steps in the above-mentioned embodiments of the method for measuring the tilt angle of each bonding finger are implemented, for example Figure 1 Alternatively, when the processor 40 executes the computer program 42, the functions of each module / unit in the above-mentioned device embodiments are realized, for example Figure 3 The functions of the modules 31 to 34 are shown.

[0117] Exemplarily, the computer program 42 may be divided into one or more modules / units, which are stored in the memory 41 and executed by the processor 40 to implement the present invention. The one or more modules / units may be a series of computer program instruction segments capable of implementing specific functions, which are used to describe the execution process of the computer program 42 in the terminal 4. For example, the computer program 42 may be divided into Figure 3 Modules 31 to 34 are shown.

[0118] The terminal 4 may be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The terminal 4 may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will appreciate that Figure 4 It is only an example of terminal 4 and does not constitute a limitation on terminal 4. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the terminal may also include input and output devices, network access devices, buses, etc.

[0119] The processor 40 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0120] The memory 41 may be an internal storage unit of the terminal 4, such as a hard disk or memory of the terminal 4. The memory 41 may also be an external storage device of the terminal 4, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the terminal 4. Further, the memory 41 may also include both an internal storage unit and an external storage device of the terminal 4. The memory 41 is used to store the computer program and other programs and data required by the terminal. The memory 41 may also be used to temporarily store data that has been output or is to be output.

[0121] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0122] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0123] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0124] In the embodiments provided by the present invention, it should be understood that the disclosed devices / terminals and methods can be implemented in other ways. For example, the device / terminal embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0125] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0126] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0127] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present invention implements all or part of the process in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned embodiments of the method for measuring the tilt angle of each bonding finger can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practices in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practices, computer-readable media does not include electrical carrier signals and telecommunication signals.

[0128] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A method for measuring the inclination angle of a bonding finger, characterized in that: include: acquiring an image including the bonding fingers; determining a position of the bonding finger based on visual inspection techniques and the image; Determining the position of a test point based on the position of the bonding finger; wherein the test point is a point on the bonding finger; Measuring the test point by a laser sensor to obtain the tilt angle of the bonding finger; The number of the test points is at least two; The step of measuring the test point by a laser sensor to obtain the tilt angle of the bonding finger includes: Extracting the centerline profile of the bonding finger by a line laser sensor; Determining an average profile between two test points based on a plurality of midline profiles; wherein the two test points are points on the midline of the bonding finger; Fitting the average profile based on the least square method, calculating the tilt angle between two test points, and obtaining the tilt angle of the bonding finger; Or, the measuring the test point by a laser sensor to obtain the tilt angle of the bonding finger includes: The height of two test points is measured by a point laser sensor; The tilt angle between the two test points is calculated based on the height difference between the two test points and the horizontal distance between the two test points to obtain the tilt angle of the bonding finger.

2. The method for measuring the bonding finger tilt angle according to claim 1, characterized in that: Before determining the position of the bonding finger based on the visual inspection technique and the image, the method further comprises: Learn the characteristics of bonding fingers through AI technology; The determining the position of the bonding finger based on the visual inspection technology and the image comprises: extracting features of the bonding finger from the image using visual inspection technology; The feature of the bonding finger is compared with the learned feature, and the position of the bonding finger is determined based on the comparison result.

3. The method for measuring the bonding finger tilt angle according to claim 1, characterized in that: After measuring the test point by a laser sensor to obtain the tilt angle of the bonding finger, the method further includes: If the inclination angle of the bonding finger is within a first preset range, the inclination angle of the bonding finger is determined to be qualified; If the inclination angle of the bonding finger is not within a first preset range, the inclination angle of the bonding finger is determined to be unqualified.

4. The method for measuring the bonding finger tilt angle according to claim 3, characterized in that: After measuring the test point by a laser sensor to obtain the tilt angle of the bonding finger, the method further includes: If the bonding index quantity of the packaged product with a qualified tilt angle is within the second preset range, the packaged product is placed in the qualified area, and / or, If the number of bonding indices with qualified tilt angles on the packaged product is not within a second preset range, the packaged product is placed in an unqualified area; wherein the second preset range is determined based on the total number of bonding fingers on the packaged product.

5. The method for measuring the bonding finger tilt angle according to claim 4, characterized in that: After measuring the test point by a laser sensor to obtain the tilt angle of the bonding finger, the method further includes: The tilt angle of each bonding finger on each packaged product is recorded to count the fluctuation of the tilt angle of the bonding finger.

6. A device for measuring the inclination angle of a bonding finger, characterized in that: include: An acquisition module, used for acquiring an image including bonding fingers; A recognition module for determining the position of the bonding finger based on visual inspection technology and the image; A positioning module, used to determine the position of a test point based on the position of the bonding finger; the test point is a point on the bonding finger; A measuring module, used to measure the test point by a laser sensor to obtain the tilt angle of the bonding finger; The number of the test points is at least two; The measuring module is specifically used for: Extracting the centerline profile of the bonding finger by a line laser sensor; Determining an average profile between two test points based on a plurality of midline profiles; wherein the two test points are points on the midline of the bonding finger; Fitting the average profile based on the least square method, calculating the tilt angle between two test points, and obtaining the tilt angle of the bonding finger; Or, the measuring module is specifically used for: The height of two test points is measured by a point laser sensor; The tilt angle between the two test points is calculated based on the height difference between the two test points and the horizontal distance between the two test points to obtain the tilt angle of the bonding finger.

7. A terminal comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the bonding finger tilt angle measurement method as described in any one of claims 1 to 5 are implemented.

8. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the method for measuring the tilt angle of a bonding finger as claimed in any one of claims 1 to 5 are implemented.

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