Photosensitive assembly and camera module

Abstract

Disclosed are a photosensitive assembly and a camera module. The photosensitive assembly comprises: a substrate comprising a fixed portion, a movable portion, and at least one pair of suspension arms extending between the fixed portion and the movable portion, the movable portion being suspendedly arranged in the fixed portion through the at least one pair of suspension arms, the at least one pair of suspension arms being symmetrically arranged relative to the movable portion; a photosensitive chip electrically connected to the movable portion; and at least one pair of piezoelectric elements, wherein each piezoelectric element of the at least one pair of piezoelectric elements is respectively arranged on each suspension arm of the at least one pair of suspension arms, and is configured to, after being turned on, actuate the at least one pair of suspension arms through its own deformation to simultaneously raise or lower the movable portion from the first side and the second side opposite to the movable portion, so that the photosensitive surface of the photosensitive chip is raised or lowered. In this way, the photosensitive chip is driven to move by the MEMS actuator to realize optical focusing.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of camera modules, and in particular to a photosensitive assembly and a camera module, which adopts a MEMS actuator (Micro-Electro-Mechanical Systems) as a driving element to meet the optical focusing requirements of the camera module. BACKGROUND

[0002] With the popularity of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (e.g., videos or images) have developed rapidly and made great progress, and in recent years, camera modules have been widely used in many fields such as medical treatment, security, and industrial production.

[0003] Optical focusing plays a key role in improving the shooting performance of mobile electronic devices. This technology mainly moves the optical lens along the optical axis direction by a driver to change the distance between the optical lens and the photosensitive chip, so as to improve the clarity of shooting.

[0004] In existing mobile electronic devices (e.g., smart phones, cameras, camcorders) with camera modules, the optical lens in the camera module is usually moved by an electromagnetic driver such as a voice coil motor (VCM) to perform optical focusing. However, in mobile electronic devices with small space volume, it becomes more and more difficult to install electromagnetic drivers to achieve optical focusing.

[0005] Moreover, as the imaging system of mobile electronic devices becomes more and more complex, camera modules are developing towards high pixels and large chips, and existing electromagnetic drivers such as voice coil motors have gradually become difficult to meet the driving requirements and packaging size requirements of camera modules. Specifically, as the photosensitive chip develops towards large pixels and large size, the size and weight of the optical lens adapted to it also gradually increase, and the existing electromagnetic motor is difficult to drive components of more than 100 mg.

[0006] Therefore, there is a need for an adapted new driving scheme for camera modules, and the new driver not only meets the driving requirements of the camera module for optical performance adjustment, but also meets the development requirements of the camera module for lightening and thinning. SUMMARY

[0007] An advantage of the present application is to provide a camera module, wherein the camera module adopts a new MEMS actuator as a driving element to drive the displacement of the photosensitive chip to achieve optical focusing.

[0008] Other advantages and features of the present application will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating the principles of the application.

[0009] To achieve at least one of the above advantages, the present application provides a photosensitive assembly, comprising:

[0010] a substrate, comprising a fixed part, a movable part, and at least one pair of suspension arms extending between the fixed part and the movable part, the movable part being suspendedly arranged in the fixed part through the at least one pair of suspension arms, the at least one pair of suspension arms being symmetrically arranged relative to the movable part;

[0011] a photosensitive chip arranged in and electrically connected to the movable part; and

[0012] at least one pair of piezoelectric elements, wherein each piezoelectric element of the at least one pair of piezoelectric elements is respectively arranged in each suspension arm of the at least one pair of suspension arms, and is configured to, after being turned on, actuate the at least one pair of suspension arms through its own deformation to generate the same height of warping from the first side and the second side opposite to the movable part, so as to generate a stroke in the height direction of the photosensitive surface of the photosensitive chip relative to the fixed part, thereby performing optical focusing.

[0013] In the photosensitive assembly according to the present application, each of the suspension arms has opposite first and second ends, the first end being fixed to the fixed part, and the second end being fixed to the movable part.

[0014] In the photosensitive assembly according to the present application, the at least one pair of suspension arms comprises a first suspension arm and a second suspension arm, the first suspension arm and the second suspension arm being symmetrically arranged relative to the movable part; the at least one pair of piezoelectric elements comprises a first piezoelectric element and a second piezoelectric element, wherein the first piezoelectric element is arranged in the first suspension arm, and the second piezoelectric element is arranged in the second suspension arm.

[0015] In the photosensitive assembly according to the present application, the first piezoelectric element is configured to, after being turned on, drive the first suspension arm to warp relative to the fixed part along a direction set by the photosensitive axis of the photosensitive chip through its own deformation to drive the movable part and the photosensitive chip from the first side of the movable part, and the second piezoelectric element is configured to, after being turned on, drive the second suspension arm to warp relative to the fixed part along a direction set by the photosensitive axis of the photosensitive chip through its own deformation to drive the movable part and the photosensitive chip from the second side of the movable part, wherein the height of the photosensitive chip driven by the first piezoelectric element to rise or fall from the first side of the movable part is equal to the height of the photosensitive chip driven by the second piezoelectric element to rise or fall from the second side of the movable part, in this way, the photosensitive surface of the photosensitive chip generates a stroke in the height direction relative to the fixed part to perform optical focusing.

[0016] In the photosensitive assembly according to the present application, the first suspension arm includes a first suspension arm body and a first separation groove at least partially penetrating the first suspension arm body, wherein the first suspension arm body is divided into a first suspension arm part and a second suspension arm part that are movable relative to each other through the first separation groove, the first suspension arm part has a first suspension arm subpart and a second suspension arm subpart divided by the first end, and the second suspension arm part has a third suspension arm subpart and a fourth suspension arm subpart divided by the second end, wherein the first piezoelectric element includes the first piezoelectric sheet arranged in the first suspension arm subpart, a second piezoelectric sheet arranged in the second suspension arm subpart, the third piezoelectric sheet arranged in the third suspension arm subpart, and a fourth piezoelectric sheet arranged in the fourth suspension arm subpart.

[0017] In the photosensitive assembly according to the present application, the second suspension arm includes a second suspension arm body and a second separation groove at least partially penetrating the second suspension arm body, wherein the second suspension arm body is divided into a third suspension arm part and a fourth suspension arm part that are movable relative to each other through the second separation groove, the third suspension arm part has a fifth suspension arm subpart and a sixth suspension arm subpart divided by the first end, and the fourth suspension arm part has a seventh suspension arm subpart and an eighth suspension arm subpart divided by the second end, wherein the second piezoelectric element includes the fifth piezoelectric sheet arranged in the fifth suspension arm subpart, a sixth piezoelectric sheet arranged in the sixth suspension arm subpart, the seventh piezoelectric sheet arranged in the seventh suspension arm subpart, and an eighth piezoelectric sheet arranged in the eighth suspension arm subpart.

[0018] In the photosensitive assembly according to the present application, the first suspension arm includes a first suspension arm body and a first partition groove and a second partition groove at least partially penetrating the first suspension arm body, wherein the first suspension arm body is divided into a first suspension arm part, a second suspension arm part and a third suspension arm part movable relative to each other by the first partition groove and the second partition groove, the first suspension arm part has a first suspension arm subpart and a second suspension arm subpart divided by the first partition groove, the second suspension arm part has a third suspension arm subpart and a fourth suspension arm subpart divided by the first partition groove, and the third suspension arm part has a fifth suspension arm subpart and a sixth suspension arm subpart divided by the first partition groove and the second partition groove, wherein the first piezoelectric element includes the first piezoelectric sheet arranged in the first suspension arm subpart, a second piezoelectric sheet arranged in the second suspension arm subpart, the third piezoelectric sheet arranged in the third suspension arm subpart, and a fourth piezoelectric sheet arranged in the fourth suspension arm subpart, a fifth piezoelectric sheet arranged in the fifth suspension arm subpart, and a sixth piezoelectric sheet arranged in the sixth suspension arm subpart.

[0019] In the photosensitive assembly according to the present application, the first partition groove has a cross shape.

[0020] In the photosensitive assembly according to the present application, the second suspension arm includes a second suspension arm body and a third partition groove and a fourth partition groove at least partially penetrating the second suspension arm body, wherein the second suspension arm body is divided into a fourth suspension arm part, a fifth suspension arm part and a sixth suspension arm part movable relative to each other by the third partition groove and the fourth partition groove, the fourth suspension arm part has a seventh suspension arm subpart and an eighth suspension arm subpart divided by the third partition groove, the fifth suspension arm part has a ninth suspension arm subpart and a tenth suspension arm subpart divided by the third partition groove, and the sixth suspension arm part has an eleventh suspension arm subpart and a twelfth suspension arm subpart divided by the third partition groove and the fourth partition groove, wherein the second piezoelectric element includes the seventh piezoelectric sheet arranged in the seventh suspension arm subpart, an eighth piezoelectric sheet arranged in the eighth suspension arm subpart, the ninth piezoelectric sheet arranged in the ninth suspension arm subpart, a tenth piezoelectric sheet arranged in the tenth suspension arm subpart, the eleventh piezoelectric sheet arranged in the eleventh suspension arm subpart, and a twelfth piezoelectric sheet arranged in the twelfth suspension arm subpart.

[0021] In the photosensitive assembly according to the present application, the third partition groove has a cross shape.

[0022] In the photosensitive assembly according to the present application, the at least one pair of suspension arms further includes a third suspension arm and a fourth suspension arm, wherein the first suspension arm and the second suspension arm are symmetrically arranged relative to the movable part with the X axis as the symmetric axis, and the third suspension arm and the fourth suspension arm are symmetrically arranged relative to the movable part with the Y axis as the symmetric axis.

[0023] In the photosensitive assembly according to the present application, the at least one pair of piezoelectric elements further comprises a third piezoelectric element and a fourth piezoelectric element, wherein the third piezoelectric element is arranged on the third suspension arm, and the fourth piezoelectric element is arranged on the fourth suspension arm; wherein the third piezoelectric element and the fourth piezoelectric element are configured to, after being turned on, respectively actuate the third suspension arm and the fourth suspension arm through their own deformation to simultaneously raise or lower the movable part from the third side and the fourth side opposite to the movable part to make the photosensitive surface of the photosensitive chip be raised or lowered, and optical focusing is performed in this way.

[0024] In the photosensitive assembly according to the present application, the third piezoelectric element is configured to, after being turned on, actuate the third suspension arm to warp relative to the fixed part along the direction set by the photosensitive axis of the photosensitive chip to drive the movable part and the photosensitive chip from the third side of the movable part through its own deformation, and the second piezoelectric element is configured to, after being turned on, actuate the fourth suspension arm to warp relative to the fixed part along the direction set by the photosensitive axis of the photosensitive chip to drive the movable part and the photosensitive chip from the fourth side of the movable part through its own deformation, wherein the height of the photosensitive chip driven by the third piezoelectric element to rise or fall from the third side of the movable part is equal to the height of the photosensitive chip driven by the fourth piezoelectric element to rise or fall from the fourth side of the movable part, and optical focusing is performed in this way.

[0025] In the photosensitive assembly according to the present application, the first suspension arm comprises a first suspension arm segment extending along the X-axis direction and a second suspension arm segment extending along the Y-axis direction, and the second suspension arm comprises a third suspension arm segment extending along the X-axis direction and a fourth suspension arm segment extending along the Y-axis direction, wherein the at least one pair of piezoelectric elements comprises a first piezoelectric element and a second piezoelectric element, the first piezoelectric element is arranged on the first suspension arm segment of the first suspension arm, and the second piezoelectric element is arranged on the third suspension arm segment of the second suspension arm, wherein the first piezoelectric element is configured to, after being turned on, actuate the first suspension arm through its own deformation to drive the movable part and the photosensitive chip from the first side of the movable part, and the second piezoelectric element is configured to, after being turned on, actuate the second suspension arm through its own deformation to drive the movable part and the photosensitive chip from the second side of the movable part, wherein the height of the photosensitive chip driven by the first piezoelectric element to rise or fall from the first side of the movable part is equal to the height of the photosensitive chip driven by the second piezoelectric element to rise or fall from the second side of the movable part, and optical focusing is performed in this way.

[0026] In the photosensitive assembly according to the present application, the at least one pair of piezoelectric elements further comprises a third piezoelectric element and a fourth piezoelectric element, the third piezoelectric element is arranged on the second cantilever segment of the first cantilever arm, and the fourth piezoelectric element is arranged on the fourth cantilever segment of the second cantilever arm; wherein the third piezoelectric element is configured to actuate the first cantilever arm by deforming itself after being turned on to drive the movable part and the photosensitive chip from the first side of the movable part; the fourth piezoelectric element is configured to actuate the second cantilever arm by deforming itself after being turned on to drive the movable part and the photosensitive chip from the second side of the movable part opposite to the first side, wherein the height of the photosensitive chip driven by the third piezoelectric element from the first side of the movable part to rise or fall is equal to the height of the photosensitive chip driven by the fourth piezoelectric element from the second side of the movable part to rise or fall, in this way, the photosensitive surface of the photosensitive chip generates a stroke in the height direction relative to the fixed part to perform optical focusing.

[0027] In the photosensitive assembly according to the present application, the first cantilever beam has an "L" type structure, and / or the second cantilever arm has an "L" type structure.

[0028] In the photosensitive assembly according to the present application, the thickness of the cantilever beam ranges from 0.1 mm to 0.3 mm.

[0029] In the photosensitive assembly according to the present application, the substrate has an upper surface and a lower surface opposite to the upper surface, and the substrate further has a hollow structure at least partially penetrating between the lower surface and the upper surface, wherein the substrate forms the fixed part, the movable part and the at least one pair of cantilever arms extending between the fixed part and the movable part through the hollow structure.

[0030] In the photosensitive assembly according to the present application, the fixed part, the movable part and the at least one pair of cantilever arms have an integrated structure.

[0031] In the photosensitive assembly according to the present application, the photosensitive assembly further comprises a reinforcing plate arranged on the lower surface of the substrate.

[0032] In the photosensitive assembly according to the present application, the photosensitive assembly further comprises a filter element held on the photosensitive path of the photosensitive chip.

[0033] According to another aspect of the present application, a camera module is also provided, comprising:

[0034] The photosensitive assembly as described above; and

[0035] An optical lens held on the photosensitive path of the photosensitive assembly

[0036] These and other objects, features, and advantages of the present application will become apparent with reference to the following detailed description of the application.

[0037] These and other objects, features, and advantages of the present application will become apparent with reference to the following detailed description of the application. BRIEF DESCRIPTION OF DRAWINGS

[0038] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description of embodiments of the present application taken in conjunction with the accompanying drawings, in which:

[0039] Figure 1 FIG. 1 illustrates a schematic diagram of a camera module according to embodiments of the present application.

[0040] Figure 2 FIG. 2 illustrates a schematic diagram of a photosensitive assembly of the camera module according to embodiments of the present application.

[0041] Figure 3A FIG. 3 illustrates a schematic diagram of a substrate and at least one pair of piezoelectric elements of the photosensitive assembly according to embodiments of the present application.

[0042] Figure 3B FIG. 4 illustrates another schematic diagram of the substrate and the at least one pair of piezoelectric elements of the photosensitive assembly according to embodiments of the present application.

[0043] Figure 4 FIG. 5 illustrates a top view schematic diagram of the substrate and the at least one pair of piezoelectric elements of the photosensitive assembly according to embodiments of the present application.

[0044] Figure 5 FIG. 6 illustrates a schematic diagram of the suspension arm of the substrate being actuated according to embodiments of the present application.

[0045] Figure 6A FIG. 7 illustrates a schematic diagram of the movement of the semiconductor substrate and the at least one piezoelectric element according to embodiments of the present application.

[0046] Figure 6B FIG. 8 illustrates another schematic diagram of the movement of the semiconductor substrate and the at least one piezoelectric element according to embodiments of the present application.

[0047] Figure 7 FIG. 9 illustrates a schematic diagram of a variant embodiment of the suspension arm according to embodiments of the present application.

[0048] Figure 8Fig. 3 illustrates a schematic diagram of another variant of the substrate according to an embodiment of the present application.

[0049] Figure 9 Fig. 4 illustrates a schematic diagram of yet another variant of the substrate according to an embodiment of the present application. DETAILED DESCRIPTION

[0050] In the following, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It is apparent that the described embodiments are only a part of the embodiments of the present application, and the present application should not be limited to the example embodiments described herein.

[0051] SUMMARY

[0052] As described above, optical focusing plays a key role in improving the shooting performance of mobile electronic devices. This technology mainly moves the optical lens along the optical axis direction by a driver to change the distance between the optical lens and the photosensitive chip to improve the clarity of the shooting.

[0053] In existing mobile electronic devices (for example, smart phones, cameras, video cameras) with camera modules, optical focusing is usually performed by moving the optical lens in the camera module through an electromagnetic driver such as a voice coil motor (VCM). However, in mobile electronic devices with a small space volume, it becomes increasingly difficult to install an electromagnetic driver to achieve optical focusing.

[0054] Moreover, as the imaging system of mobile electronic devices becomes more and more complex, the camera module tends to develop towards high pixels and large chips, and existing electromagnetic drivers such as voice coil motors have gradually become difficult to meet the driving requirements and packaging size requirements of the camera module. Specifically, as the photosensitive chip develops towards large pixels and large size, the size and weight of the optical lens adapted thereto also gradually increase, and the existing electromagnetic motor is difficult to drive components of more than 100 mg.

[0055] Therefore, there is a need for an adapted new driving scheme for the camera module, and the new driver not only meets the driving requirements of the camera module for optical performance adjustment, but also meets the development needs of the lightening and thinning of the camera module.

[0056] In view of the above technical problems, the technical concept of the present application is to use a MEMS (Micro-Electro-Mechanical Systems) driver as a driving element to perform sensor shift to achieve optical focusing. In particular, the driver used in the present application is a MEMS actuator, and the actuation object of the MEMS actuator is a photosensitive chip.

[0057] Compared with the conventional optical focusing technology based on a voice coil motor, driving the image sensor to move along the optical axis direction by the MEMS actuator to perform optical focusing has many advantages: high performance, sub-micron precision positioning within 10 ms, responding to the shaking of the mobile electronic device within 15 ms, small size, no electromagnetic interference. And, compared with the voice coil motor, it has low cost, and when the substrate is implemented as a semiconductor substrate, mass production can be performed.

[0058] Based on this, the application provides a photosensitive assembly, comprising: a substrate, comprising: a fixed part, a movable part, and at least one pair of suspension arms extending between the fixed part and the movable part, the movable part being suspendedly arranged in the fixed part through the at least one pair of suspension arms, the at least one pair of suspension arms being symmetrically arranged relative to the movable part; a photosensitive chip arranged in and electrically connected to the movable part; and at least one pair of piezoelectric elements, wherein each piezoelectric element of the at least one pair of piezoelectric elements is arranged on each suspension arm of the at least one pair of suspension arms respectively, and is configured to actuate the at least one pair of suspension arms by its own deformation after being turned on to simultaneously raise or lower the movable part from the first side and the second side opposite to the movable part to make the photosensitive surface of the photosensitive chip be raised or lowered, thereby performing optical focusing.

[0059] After introducing the basic principles of the application, the various non-limiting embodiments of the application will be specifically introduced below with reference to the accompanying drawings.

[0060] Exemplary camera module

[0061] As Figure 1 shown, the camera module according to the embodiment of the application is illustrated, which comprises: a photosensitive assembly 10 and a lens assembly 20 held on the photosensitive path of the photosensitive assembly 10. In particular, in the embodiment of the application, the camera module takes the MEMS actuator as the driver and selects the photosensitive chip of the photosensitive assembly 10 as the driving object to perform optical focusing.

[0062] Correspondingly, as Figure 1As shown, the lens assembly 20 comprises a lens carrier 21 and an optical lens 22 mounted on the lens carrier 21, wherein the optical lens 22 is provided with an optical axis. Generally, the optical lens 22 comprises a lens barrel and at least one optical lens mounted in the lens barrel. It is known to those skilled in the art that the resolving power of the optical lens 22 is proportional to the number of optical lenses within a certain range, that is, the higher the resolving power, the more the number of optical lenses. In specific embodiments, the optical lens 22 can be implemented as a one-piece lens or a split lens, wherein when the optical lens 22 is implemented as a one-piece lens, the optical lens 22 comprises a lens barrel and all the optical lenses are mounted in the lens barrel; and when the optical lens is implemented as a split optical lens 22, the optical lens 22 is assembled by at least two parts of lens units.

[0063] In particular, in the embodiments of the present application, the lens carrier 21 is a fixed carrier, that is, when the optical lens 22 is mounted on the lens carrier 21, the relative positional relationship between the lens carrier 21 and the optical lens 22 does not change. It is worth mentioning that in some examples of the present application, the optical lens can also be implemented as a "bare lens", that is, the optical lens 22 only comprises at least one optical lens 22 and the lens carrier 21 forms a bearing part of the at least one optical lens, which is not limited by the present application.

[0064] Correspondingly, as Figure 2 shown, in the embodiments of the present application, the photosensitive assembly 10 comprises a substrate 11, a photosensitive chip 12 electrically connected to the substrate 11, at least one pair of piezoelectric elements 13 arranged on the substrate 11, and a bracket 14 arranged on the substrate 11. In the embodiments of the present application, the photosensitive chip 12 is provided with a photosensitive axis, and the photosensitive axis is coaxial with the optical axis of the optical lens 22, that is, the optical axis of the optical lens 22 and the photosensitive axis of the photosensitive chip 12 are the same axis.

[0065] As Figure 2 shown, the substrate 11 comprises a fixed part 111 and a movable part 112 suspended in the fixed part 111, in this way, the movable part 112 of the substrate 11 is adapted to be displaced relative to the fixed part 111 under the action of the at least one pair of piezoelectric elements 13. In particular, in the embodiments of the present application, the photosensitive chip 12 is arranged and electrically connected to the movable part 112, so that the photosensitive chip 12 is adapted to be displaced with the fixed part 111 to perform optical focusing.

[0066] It should be noted that in this embodiment, the bracket 14 is disposed on the fixing portion 111 of the substrate 11 and the lens assembly 20 is mounted on the bracket 14. In a specific example, the bracket 14 is implemented as a plastic bracket, which is fixed to the fixing portion 111 of the substrate 11 by an adhesive. It should be understood that in other embodiments of this application, the bracket 14 can also be implemented as other types of brackets 14, such as molded brackets, and this is not limited to this application. In this embodiment, the photosensitive assembly 10 further includes a filter element 17 disposed on the bracket 14, wherein the filter element 17 is held in the photosensitive path of the photosensitive chip 12 for filtering the imaging light entering the photosensitive chip 12.

[0067] More specifically, such as Figure 2 As shown, the substrate 11 further includes at least a pair of suspension arms 113 disposed between the fixed portion 111 and the movable portion 112, so that the movable portion 112 is suspended within the fixed portion 111 by the at least one pair of suspension arms 113. That is, in this embodiment, the movable portion 112 is suspended inside the fixed portion 111 by the at least one pair of suspension arms 113, so as to allow the movable portion 112 to be displaced relative to the fixed portion 111 for optical focusing. More specifically, in this embodiment, each of the suspension arms includes an opposing first end 1131 and a second end 1132, wherein the first end 1131 is fixed to the fixed portion 111, and the second end 1132 is fixed to the movable portion 112, in such a way that the movable portion 112 is suspended inside the fixed portion 111 by the at least one pair of suspension arms 113.

[0068] To achieve optical focusing, in the embodiments of the present application, the at least one pair of suspension arms 113 are symmetrically arranged relative to the movable part 112. Also, in the embodiments of the present application, each piezoelectric element of the at least one pair of piezoelectric elements 13 is respectively arranged on each suspension arm of the at least one pair of suspension arms 113 to form the MEMS actuator, and is configured to actuate the at least one pair of suspension arms 113 by its own deformation after being turned on to simultaneously raise or lower the movable part 112 from the first side and the second side opposite to the movable part 112, so that the light receiving surface of the light receiving chip 12 is raised or lowered, thereby achieving optical focusing. That is, in the embodiments of the present application, each piezoelectric element of the at least one pair of piezoelectric elements 13 is respectively arranged on each suspension arm of the at least one pair of suspension arms 113, and is configured to actuate the at least one pair of suspension arms 113 by its own deformation after being turned on to generate the same height of warping from the first side and the second side opposite to the movable part 112, so that the light receiving surface of the light receiving chip 12 generates a stroke in the height direction relative to the fixed part 111, thereby achieving optical focusing.

[0069] Here, in the embodiments of the present application, the piezoelectric element arranged on the suspension arm forms a MEMS actuator. Preferably, in the embodiments of the present application, each piezoelectric element of the at least one pair of piezoelectric elements 13 is respectively arranged on the upper surface of each suspension arm of the at least one pair of suspension arms 113.

[0070] In one specific example of the present application, the substrate 11 is implemented as a semiconductor substrate, for example, a semiconductor substrate as shown in Figure 3A and 3B . As shown in Figure 3A and Figure 3B , in this specific example, the substrate 11 includes, from bottom to top, a silicon base layer, a silicon oxide layer and a silicon crystal layer, that is, the substrate 11 includes a silicon base layer, a silicon oxide layer stacked on the silicon base layer and a silicon crystal layer stacked on the silicon oxide layer, wherein the lower surface of the silicon base layer forms the lower surface of the substrate 11, and the upper surface of the silicon crystal layer forms the upper surface of the substrate 11. In a specific implementation, the substrate 11 can be made of an SOI (Silicon-on-insulator) wafer, which is a mature semiconductor device known to those skilled in the art. Accordingly, in the embodiments of the present application, the silicon crystal layer of the substrate 11 is provided with an integrated circuit, for example, the integrated circuit is manufactured on the circuit layer of the SOI wafer using a standard SOI CMOS process.

[0071] In order to protect the integrated circuit, in this specific example, the substrate 11 further comprises a passivation layer superposed on the silicon crystal layer to protect the integrated circuit arranged on the silicon crystal layer by the passivation layer. In addition, in the embodiment of the present application, the electrically connecting structure 16 such as a pad and a wire can be attached on the silicon crystal layer by a surface mounting process.

[0072] Further, as shown in Figure 3A and Figure 3B In this example, the substrate 11 has opposite upper and lower surfaces, and a hollow structure 110 at least partially penetrating between the lower surface and the upper surface, wherein the substrate 11 forms the fixed portion 111, the movable portion 112 and the at least one pair of suspension arms 113 extending between the fixed portion 111 and the movable portion 112 by the hollow structure 110. That is, by hollowing the substrate 11, the substrate 11 is divided into two portions: the fixed portion 111 and the movable portion 112, wherein the movable portion 112 is suspended in the fixed portion 111 by the at least one pair of suspension arms 113.

[0073] It is worth mentioning that, in this specific example, the fixed portion 111, the movable portion 112 and the at least one pair of suspension arms 113 are processed from the semiconductor substrate, thus the fixed portion 111, the movable portion 112 and the at least one pair of suspension arms 113 have an integrated structure. The thickness of each suspension arm of the pair of suspension arms is less than the thickness of the fixed portion 111, so that the suspension arms can be warped in the direction set along the optical axis under the action of the piezoelectric element.

[0074] In order to reinforce the substrate 11, as shown in Figure 2 In the embodiment of the present application, the light-sensitive assembly 10 further comprises a reinforcing plate arranged on the lower surface of the substrate 11. In specific implementation, the reinforcing plate can be implemented as a metal plate, for example, a steel plate, etc.

[0075] It should be appreciated that, in the embodiments of the present application, in order to meet the requirement of electrical connection, an electrical connection structure 16 (for example, when the substrate 11 is a semiconductor substrate, the electrical connection structure 16 is part of an integrated circuit) can be arranged between the fixed part 111 and the movable part 112 of the substrate 11, and the electrical connection structure 16 is used to realize the electrical connection of the circuit of the camera module. Of course, in other examples, the electrical connection structure 16 such as a pad and a wire can be attached to the upper surface of the substrate 11 through a surface mounting process; or an LDS slot can be arranged on the upper surface of the substrate 11 through an LDS (laser direct structuring) technology, and a conductive plating layer (for example, a nickel-palladium-gold plating layer) can be plated on the surface of the LDS slot, and the connection circuit is connected to the conductive plating layer in the LDS slot to export the circuit; or the wire can be formed on the substrate 11 through an insert molding technology, and the connection circuit is electrically connected to the wire to export the circuit.

[0076] Correspondingly, in the embodiments of the present application, the upper surface of the movable part 112 is provided with the electrical connection structure 16, so that when the photosensitive chip 12 is attached to the upper surface of the movable part 112, the photosensitive chip 12 can be electrically connected to the movable part 112 through the electrical connection structure 16 formed on the upper surface of the movable part 112. Similarly, when each piezoelectric element of the at least one pair of piezoelectric elements 13 is arranged on each suspension arm of the at least one pair of suspension arms 113 respectively, the at least one pair of piezoelectric elements 13 can also be electrically connected to the at least one pair of suspension arms 113 through the electrical connection structure 16 formed on the surface of the at least one pair of suspension arms 113. Of course, the electrical connection structure 16 can also be arranged on the upper surface of the fixed part 111, and the electrical connection structure 16 is used to realize the electrical connection with the external circuit. The electrical connection structure 16 on the surface of the fixed part 111, the movable part 112 and the at least one pair of suspension arms 113 can be an integral structure or a split structure, and the present application is not limited in this regard.

[0077] It is worth mentioning that, in other examples of the present application, the substrate 11 can also be implemented as other types of substrates, including but not limited to plastic substrates, metal substrates, etc. For ease of illustration, in the embodiments of the present application, the substrate 11 is implemented as a semiconductor substrate as an example.

[0078] More specifically, as Figure 4In the embodiment, the at least one pair of suspension arms 113 includes a first suspension arm 114, a second suspension arm 115, a third suspension arm 116, and a fourth suspension arm 117. The first suspension arm 114 and the second suspension arm 115 are symmetrically arranged relative to the movable part 112 with the X axis as the axis of symmetry, the third suspension arm 116 and the fourth suspension arm 117 are symmetrically arranged relative to the movable part 112 with the Y axis as the axis of symmetry, and the first suspension arm 114 is arranged adjacent to the third suspension arm 116, and the second suspension arm 115 is arranged adjacent to the fourth suspension arm 117. That is, in the embodiment, the at least one pair of suspension arms 113 includes two pairs of suspension arms, wherein the first suspension arm 114 and the second suspension arm 115 form a pair of suspension arms, and the third suspension arm 116 and the fourth suspension arm 117 form another pair of suspension arms.

[0079] In the embodiment, the first suspension arm 114, the second suspension arm 115, the third suspension arm 116, and the fourth suspension arm 117 are arranged on the four sides of the movable part 112 to allow the light-sensitive chip 12 to be raised or lowered simultaneously in the X axis direction or the Y axis direction of the light-sensitive chip 12 for optical focusing. Here, for ease of description, the side on which the first suspension arm 114 is arranged is defined as the first side, the side on which the second suspension arm 115 is arranged is defined as the second side, the side on which the third suspension arm 116 is arranged is defined as the third side, and the side on which the fourth suspension arm 117 is arranged is defined as the fourth side.

[0080] Correspondingly, the at least one pair of piezoelectric elements 13 includes a first piezoelectric element 131, a second piezoelectric element 132, a third piezoelectric element 133, and a fourth piezoelectric element 134. The first piezoelectric element 131 is arranged on the first suspension arm 114, the second piezoelectric element 132 is arranged on the second suspension arm 115, the third piezoelectric element 133 is arranged on the third suspension arm 116, and the fourth piezoelectric element 134 is arranged on the fourth suspension arm 117. That is, in the embodiment, the at least one pair of piezoelectric elements 13 includes two pairs of piezoelectric elements, wherein the first piezoelectric element 131 and the second piezoelectric element 132 form a pair of piezoelectric elements, and the third piezoelectric element 133 and the fourth piezoelectric element 134 form another pair of piezoelectric elements.

[0081] In operation, the first piezoelectric element 131 is configured to, after being turned on, drive the first suspension arm 114 to warp relative to the fixed portion 111 in a direction set by the optical axis of the photosensitive chip 12 (i.e., the direction set by the optical axis) by its own deformation to drive the movable portion 112 and the photosensitive chip 12 from the first side of the movable portion 112, and the second piezoelectric element 132 is configured to, after being turned on, drive the second suspension arm 115 to warp relative to the fixed portion 111 in the direction set by the optical axis of the photosensitive chip 12 to drive the movable portion 112 and the photosensitive chip 12 from the second side of the movable portion 112, wherein the height by which the first piezoelectric element 131 drives the photosensitive chip 12 to rise or fall from the first side of the movable portion 112 is equal to the height by which the second piezoelectric element 132 drives the photosensitive chip 12 to rise or fall from the second side of the movable portion 112, in this way, the photosensitive surface of the photosensitive chip 12 is caused to have a travel in the height direction relative to the fixed portion 111 to perform optical focusing.

[0082] In a specific implementation, the same voltage can be input to the first piezoelectric element 131 and the second piezoelectric element 132, in this way, the height by which the first piezoelectric element 131 drives the photosensitive chip 12 to rise or fall from the first side of the movable portion 112 is equal to the height by which the second piezoelectric element 132 drives the photosensitive chip 12 to rise or fall from the second side of the movable portion 112, in this way, optical focusing is performed. That is, the same voltage is input to the first piezoelectric element 131 and the second piezoelectric element 132, so that the first piezoelectric element 131 and the second piezoelectric element 132 drive the first suspension arm 114 and the second suspension arm 115 to have the same height of warping from the opposite first side and second side of the movable portion 112, so that the photosensitive surface of the photosensitive chip 12 has a travel in the height direction relative to the fixed portion 111, in this way, optical focusing is performed.

[0083] In operation, the third piezoelectric element 133 is configured to, after being powered on, warp the third suspension arm 116 relative to the fixed part 111 in a direction set by the optical axis of the photosensitive chip 12 through its own deformation to drive the movable part 112 and the photosensitive chip 12 from the third side of the movable part 112, and the second piezoelectric element 132 is configured to, after being powered on, warp the fourth suspension arm 117 relative to the fixed part 111 in a direction set by the optical axis of the photosensitive chip 12 through its own deformation to drive the movable part 112 and the photosensitive chip 12 from the fourth side of the movable part 112, wherein the height of the photosensitive chip 12 driven by the third piezoelectric element 133 from the third side of the movable part 112 to rise or fall is equal to the height of the photosensitive chip 12 driven by the fourth piezoelectric element 134 from the fourth side of the movable part 112 to rise or fall, in this way, optical focusing is performed.

[0084] In specific implementation, the same voltage can be input to the third piezoelectric element 133 and the fourth piezoelectric element 134, so that the height of the photosensitive chip 12 driven by the third piezoelectric element 133 from the third side of the movable part 112 to rise or fall is equal to the height of the photosensitive chip 12 driven by the fourth piezoelectric element 134 from the fourth side of the movable part 112 to rise or fall, in this way, optical focusing is performed.

[0085] It is worth mentioning that, in operation, the first piezoelectric element 131 and the second piezoelectric element 132 work simultaneously, and the third piezoelectric element 133 and the fourth piezoelectric element 134 work simultaneously. That is, in operation, at least one pair of piezoelectric elements 13 works to drive at least one pair of suspension arms 113 to perform optical focusing. In specific implementation, one pair of piezoelectric elements can be controlled to work, for example, the first piezoelectric element 131 and the second piezoelectric element 132 are controlled to work simultaneously, or two pairs of piezoelectric elements can be controlled to work simultaneously, that is, the first piezoelectric element 131, the second piezoelectric element 132, the third piezoelectric element 133 and the fourth piezoelectric element 134 are controlled to work simultaneously.

[0086] Correspondingly, in the embodiment of the present application, the at least one pair of piezoelectric elements 13 is arranged on opposite sides of the movable part 112, and the same voltage is applied to each piezoelectric element in the at least one pair of piezoelectric elements 13, so that the light-sensing surface of the light-sensing chip 12 moves along the height direction of the optical axis to achieve optical focusing. In terms of quantification, in the embodiment of the present application, the automatic focusing of the camera module is formed to be 200-600 um, preferably 400 um. That is, the MEMS actuator formed by the piezoelectric element drives the light-sensing chip 12 to perform optical focusing, which has a relatively long focusing stroke.

[0087] More specifically, as shown in Figure 4 In the embodiment of the present application, each of the suspension arms has two opposite long sides and two opposite short sides, wherein the first end 1131 and the second end 1132 of the suspension arm are formed on the two long sides. That is, in the embodiment of the present application, the first end 1131 and the second end 1132 of the suspension arm extend outward from the two long sides of the suspension arm, respectively, and are connected to the fixed part 111 and the movable part 112, respectively.

[0088] As shown in Figure 4 Further, in the embodiment of the present application, each of the suspension arms has a suspension arm body and a separation groove at least partially penetrating the suspension arm body, wherein the suspension arm body is divided into two suspension arm parts movable relative to each other by the separation groove, wherein the edges of the suspension arm parts form the long sides, and in the embodiment of the present application, each of the suspension arm parts is divided into two suspension arm sub-parts by the first end 1131 and the second end 1132.

[0089] Specifically, in the embodiment of the present application, the first suspension arm 114 includes a first suspension arm body 1141 and a first separation groove 1142 at least partially penetrating the first suspension arm body 1141, wherein the first suspension arm body 1141 is divided into a first suspension arm part 1143 and a second suspension arm part 1144 movable relative to each other by the first separation groove, the first suspension arm part 1143 has a first suspension arm sub-part 1145 and a second suspension arm sub-part 1146 divided by the first end 1131, and the second suspension arm part 1144 has a third suspension arm sub-part 1147 and a fourth suspension arm sub-part 1148 divided by the second end 1132.

[0090] The second suspension arm 115 comprises a second suspension arm body 1151 and a second partition groove 1152 at least partially penetrating the second suspension arm body 1151, wherein the second suspension arm body 1151 is divided into a third suspension arm part 1153 and a fourth suspension arm part 1154 which are movable relative to each other by the second partition groove 1152, the third suspension arm part 1153 has a fifth suspension arm subpart 1155 and a sixth suspension arm subpart 1156 divided by the first end 1131, and the fourth suspension arm part 1154 has a seventh suspension arm subpart 1157 and an eighth suspension arm subpart 1158 divided by the second end 1132.

[0091] The third suspension arm 116 comprises a third suspension arm body 1161 and a third partition groove 1162 at least partially penetrating the third suspension arm body 1161, wherein the third suspension arm body 1161 is divided into a fifth suspension arm part 1163 and a sixth suspension arm part 1164 which are movable relative to each other by the third partition groove 1162, the fifth suspension arm part 1163 has a ninth suspension arm subpart 1165 and a tenth suspension arm subpart 1166 divided by the first end 1131, and the sixth suspension arm part 1164 has an eleventh suspension arm subpart 1167 and a twelfth suspension arm subpart 1168 divided by the second end 1132.

[0092] The fourth suspension arm 117 comprises a fourth suspension arm body 1171 and a fourth partition groove 1172 at least partially penetrating the fourth suspension arm body 1171, wherein the fourth suspension arm body 1171 is divided into a seventh suspension arm part 1173 and an eighth suspension arm part 1174 which are movable relative to each other by the fourth partition groove 1172, the seventh suspension arm part 1173 has a thirteenth suspension arm subpart 1175 and a fourteenth suspension arm subpart 1176 divided by the first end 1131, and the eighth suspension arm part 1174 has a fifteenth suspension arm subpart 1177 and a sixteenth suspension arm subpart 1178 divided by the second end 1132.

[0093] Correspondingly, in this embodiment, the first piezoelectric element 131 comprises a first piezoelectric sheet 1311 arranged on the first suspension arm subpart 1145, a second piezoelectric sheet 1312 arranged on the second suspension arm subpart 1146, a third piezoelectric sheet 1313 arranged on the third suspension arm subpart 1147, and a fourth piezoelectric sheet 1314 arranged on the fourth suspension arm subpart 1148, so as to drive the first suspension arm part 1143 and / or the second suspension arm part 1144 to bend upwards or downwards by the contraction or expansion of the four piezoelectric sheets, as shown in Figure 5The first piezoelectric element 131 includes a first piezoelectric sheet 1311, a second piezoelectric sheet 1312, a third piezoelectric sheet 1313 and a fourth piezoelectric sheet 1314. The first piezoelectric sheet 1311 is arranged on the upper surface of the first cantilever sub-portion 1145, the second piezoelectric sheet 1312 is arranged on the upper surface of the second cantilever sub-portion 1146, the third piezoelectric sheet 1313 is arranged on the upper surface of the third cantilever sub-portion 1147, and the fourth piezoelectric sheet 1314 is arranged on the upper surface of the fourth cantilever sub-portion 1148. The first piezoelectric element 131 is configured to drive the first cantilever portion 1143 and / or the second cantilever portion 1144 to bend upwards or downwards by the contraction or expansion of the four piezoelectric sheets, and in turn drive the movable portion 112 and the photosensitive chip 12 from the first side of the photosensitive chip 12.

[0094] The second piezoelectric element 132 includes a fifth piezoelectric sheet 1321, a sixth piezoelectric sheet 1322, a seventh piezoelectric sheet 1323 and an eighth piezoelectric sheet 1324. The fifth piezoelectric sheet 1321 is arranged on the upper surface of the fifth cantilever sub-portion 1155, the sixth piezoelectric sheet 1322 is arranged on the upper surface of the sixth cantilever sub-portion 1156, the seventh piezoelectric sheet 1323 is arranged on the upper surface of the seventh cantilever sub-portion 1157, and the eighth piezoelectric sheet 1324 is arranged on the upper surface of the eighth cantilever sub-portion 1158. The second piezoelectric element 132 is configured to drive the third cantilever portion 1153 and / or the fourth cantilever portion 1154 to bend upwards or downwards by the contraction or expansion of the four piezoelectric sheets, and in turn drive the movable portion 112 and the photosensitive chip 12 from the second side of the photosensitive chip 12.

[0095] In particular, in the embodiment, the first piezoelectric element 131 drives the photosensitive chip 12 to rise or fall from the first side of the movable portion 112 by a height equal to the height by which the second piezoelectric element 132 drives the photosensitive chip 12 to rise or fall from the second side of the movable portion 112, thereby performing optical focusing. That is, the same voltage is applied to the first piezoelectric element 131 and the second piezoelectric element 132, so that the first piezoelectric element 131 and the second piezoelectric element 132 can bend by the same height, thereby causing the photosensitive surface of the photosensitive chip 12 to have a stroke in the height direction relative to the fixed portion 111, thereby performing optical focusing.

[0096] Accordingly, in this embodiment, the third piezoelectric element 133 includes the ninth piezoelectric sheet 1331 disposed on the ninth cantilever sub-portion 1165, the tenth piezoelectric sheet 1332 disposed on the tenth cantilever sub-portion 1166, the eleventh piezoelectric sheet 1333 disposed on the eleventh cantilever sub-portion 1167, and the twelfth piezoelectric sheet 1334 disposed on the twelfth cantilever sub-portion 1168, to drive the fifth cantilever portion 1163 and / or the sixth cantilever portion 1164 to warp upward or downward by contraction or expansion of the four piezoelectric sheets, as shown in FIG. 12. In particular, in this embodiment, the ninth piezoelectric sheet 1331, the tenth piezoelectric sheet 1332, the eleventh piezoelectric sheet 1333, and the twelfth piezoelectric sheet 1334 are disposed on the upper surfaces of the ninth cantilever sub-portion 1165, the tenth cantilever sub-portion 1166, the eleventh cantilever sub-portion 1167, and the twelfth cantilever sub-portion 1168, to drive the fifth cantilever portion 1163 and / or the sixth cantilever portion 1164 to warp upward or downward by contraction or expansion of the four piezoelectric sheets, thereby driving the movable portion 112 and the photosensitive web 12 from the third side of the photosensitive web 12. Figure 5

[0097] Accordingly, in this embodiment, the fourth piezoelectric element 134 includes the thirteenth piezoelectric sheet 1341 disposed on the thirteenth cantilever sub-portion 1175, the fourteenth piezoelectric sheet 1342 disposed on the fourteenth cantilever sub-portion 1176, the fifteenth piezoelectric sheet 1343 disposed on the fifteenth cantilever sub-portion 1177, and the sixteenth piezoelectric sheet 1344 disposed on the sixteenth cantilever sub-portion 1178, to drive the seventh cantilever portion 1173 and / or the eighth cantilever portion 1174 to warp upward or downward by contraction or expansion of the four piezoelectric sheets. In particular, in this embodiment, the thirteenth piezoelectric sheet 1341, the fourteenth piezoelectric sheet 1342, the fifteenth piezoelectric sheet 1343, and the sixteenth piezoelectric sheet 1344 are disposed on the upper surfaces of the thirteenth cantilever sub-portion 1175, the fourteenth cantilever sub-portion 1176, the fifteenth cantilever sub-portion 1177, and the sixteenth cantilever sub-portion 1178, to drive the seventh cantilever portion 1173 and / or the eighth cantilever portion 1174 to warp upward or downward by contraction or expansion of the four piezoelectric sheets, thereby driving the movable portion 112 and the photosensitive web 12 from the fourth side of the photosensitive web 12.

[0098] ​Specifically, in this embodiment, the height by which the third piezoelectric element 133 raises or lowers the photosensitive chip 12 from the third side of the movable part 112 is equal to the height by which the fourth piezoelectric element 134 raises or lowers the photosensitive chip 12 from the fourth side of the movable part 112. Optical focusing is achieved in this manner. That is, the same voltage is applied to the third piezoelectric element 133 and the fourth piezoelectric element 134 so that they can warp to the same height.

[0099] More specifically, such as Figure 6A As shown, in one driving mode, the first piezoelectric sheet 1311 and the second piezoelectric sheet 1312 of the first piezoelectric element 131 disposed on the first cantilever 114 contract under the action of a certain voltage, causing the first cantilever sub-part 1145 and the second cantilever sub-part 1146 to bend upward; the third piezoelectric sheet 1313 and the fourth piezoelectric sheet 1314 of the first piezoelectric element 131 contract under the action of a certain voltage, causing the third cantilever sub-part 1147 and the fourth cantilever sub-part 1148 to bend upward. In this way, the movable part 112 and the photosensitive chip 12 are raised from the first side of the photosensitive chip 12.

[0100] At the same time, such as Figure 6A As shown, the fifth piezoelectric element 1321 and the sixth piezoelectric element 132 of the second piezoelectric element 132 disposed on the second cantilever 115 contract under a certain voltage, causing the fifth cantilever sub-parts 1155 and 1156 of the second cantilever 115 to warp upwards; the seventh piezoelectric element 1323 and the eighth piezoelectric element 132 contract under a certain voltage, causing the seventh cantilever sub-parts 1157 and 1158 to warp upwards. In this way, the movable part 112 and the photosensitive chip 12 are raised from the second side of the photosensitive chip 12.

[0101] In particular, such as Figure 6A As shown, in this embodiment, the height by which the first piezoelectric element 131 drives the photosensitive chip 12 to rise from the first side of the movable part 112 is equal to the height by which the second piezoelectric element 132 drives the photosensitive chip 12 to rise from the second side of the movable part 112. In this way, the photosensitive surface of the photosensitive chip 12 travels along the height direction relative to the fixed part 111, and optical focusing is performed in this way.

[0102] It is worth mentioning that, in specific implementations, the voltages set on the first piezoelectric element 1311, the second piezoelectric element 1312, the third piezoelectric element 1313, and the fourth piezoelectric element 1314 can be the same or different. When the voltages are the same, the upward warping height of the first cantilever sub-part 1145 and the second cantilever sub-part 1146 is the same as the upward warping height of the third cantilever sub-part 1147 and the fourth cantilever sub-part 1148. When the voltages are different, the upward warping height of the first cantilever sub-part 1145 and the second cantilever sub-part 1146 is different from the upward warping height of the third cantilever sub-part 1147 and the fourth cantilever sub-part 1148. Similarly, the voltages set on the fifth piezoelectric element 1321 and the sixth piezoelectric element 1322, the seventh piezoelectric element 1323 and the eighth piezoelectric element 132 can be the same or different. When the voltages are the same, the upward warping heights of the fifth cantilever sub-parts 1155 and the sixth cantilever sub-parts 1156 are the same as the upward warping heights of the seventh cantilever sub-parts 1157 and the eighth cantilever sub-parts 1158. When the voltages are different, the upward warping heights of the fifth cantilever sub-parts 1155 and the sixth cantilever sub-parts 1156 are different from the upward warping heights of the seventh cantilever sub-parts 1157 and the eighth cantilever sub-parts 1158.

[0103] More specifically, such as Figure 6B As shown, in another driving mode, the first piezoelectric sheet 1311 and the second piezoelectric sheet 1312 of the first piezoelectric element 131 disposed on the first cantilever 114 expand under the action of a certain voltage, causing the first cantilever sub-part 1145 and the second cantilever sub-part 1146 to warp downward; the third piezoelectric sheet 1313 and the fourth piezoelectric sheet 1314 of the first piezoelectric element 131 expand under the action of a certain voltage, causing the third cantilever sub-part 1147 and the fourth cantilever sub-part 1148 to warp downward. In this way, the movable part 112 and the photosensitive chip 12 are lowered from the first side of the photosensitive chip 12.

[0104] At the same time, such as Figure 6B As shown, the fifth piezoelectric element 1321 and the sixth piezoelectric element 132 of the second piezoelectric element 132 disposed on the second cantilever 115 expand under a certain voltage, causing the fifth cantilever sub-section 1155 and the sixth cantilever sub-section 1156 of the second cantilever 115 to warp downwards; the seventh piezoelectric element 1323 and the eighth piezoelectric element 132 expand under a certain voltage, causing the seventh cantilever sub-section 1157 and the eighth cantilever sub-section 1158 to warp downwards. In this way, the movable part 112 and the photosensitive chip 12 are lowered from the second side of the photosensitive chip 12.

[0105] In particular, such as Figure 6B As shown, in this embodiment, the height by which the first piezoelectric element 131 drives the photosensitive chip 12 to descend from the first side of the movable part 112 is equal to the height by which the second piezoelectric element 132 drives the photosensitive chip 12 to descend from the second side of the movable part 112, thereby performing optical focusing.

[0106] It should be understood that the camera module according to the embodiments of this application can also be driven in other driving modes. For example, by simultaneously raising or lowering the photosensitive chip 12 through the first piezoelectric element 131, the second piezoelectric element 132, the third piezoelectric element 133 and the fourth piezoelectric element 134, the photosensitive surface of the photosensitive chip 12 can travel in the height direction relative to the fixed part 111, thereby performing optical focusing.

[0107] To facilitate the movement of the movable part 112 by the piezoelectric element actuating the cantilever arm, the cantilever arm preferably has a relatively small thickness. Specifically, in this embodiment, the thickness of the cantilever arm ranges from 0.1 mm to 0.3 mm. In this embodiment, the piezoelectric element can be implemented as a PZT-doped material with excellent piezoelectric properties. The thickness of the piezoelectric element is between 1 μm and 0.5 mm to ensure good reliability of the cantilever arm when the piezoelectric element has a large driving force.

[0108] Of course, an elastic member (not shown in the figure) can also be provided between the at least one piezoelectric element and the at least one pair of cantilever arms 113 to increase the movable stroke of the movable part 112 and the photosensitive chip 12.

[0109] It is worth mentioning that, although in the embodiments of the present application, two pairs of suspension parts and two pairs of piezoelectric elements are taken as examples, it can be understood that in other examples of the present application, the at least one pair of suspension arms 113 can also be implemented as other pairs of suspension arms, and the at least one pair of piezoelectric elements 13 can also be implemented as other pairs of piezoelectric elements. For example, in other examples of the present application, the at least one pair of suspension arms 113 only includes one pair of suspension arms: a first suspension arm 114 and a second suspension arm 115, and the at least one pair of piezoelectric elements 13 only includes one pair of piezoelectric elements, wherein the first piezoelectric element 131 is configured to, after being turned on, drive the first suspension arm 114 to warp in the direction set by the fixed part 111 along the light axis of the photosensitive chip 12 through its own deformation to drive the movable part 112 and the photosensitive chip 12 from the first side of the movable part 112, and the second piezoelectric element 132 is configured to, after being turned on, drive the second suspension arm 115 to warp in the direction set by the fixed part 111 along the light axis of the photosensitive chip 12 through its own deformation to drive the movable part 112 and the photosensitive chip 12 from the second side of the movable part 112, wherein the height of the first piezoelectric element 131 driving the photosensitive chip 12 to rise or fall from the first side of the movable part 112 is equal to the height of the second piezoelectric element 132 driving the photosensitive chip 12 to rise or fall from the second side of the movable part 112, in this way, optical focusing is performed, and the present application is not limited thereto.

[0110] Of course, in this application, the first cantilever arm 114 and the first piezoelectric element 131 can also be divided in other ways. For example, the first cantilever arm 114 is divided into a first cantilever portion 1143 and a second cantilever portion 1144 by the first end 1131 and the second end 1132. The first cantilever portion 1143 is divided into a first cantilever sub-portion 1145 and a second cantilever sub-portion 1146 by the dividing groove. The first cantilever sub-portion 1145 is connected to the first end 1131, and the second cantilever sub-portion 1146 is connected to the second end 1132. The first piezoelectric sheet 1311 is disposed on the first cantilever sub-portion 1145, and the second piezoelectric sheet 1312 is disposed on the second cantilever sub-portion 1146. The first piezoelectric sheet 1311 extends along a first direction, and the second piezoelectric sheet 1312 extends along a second direction. The first direction and the second direction are the positive and negative directions along the x-axis, respectively. Upon power-up, the first cantilever sub-section 1145 and the second cantilever sub-section 1146 of the first cantilever portion 1143 travel along the height direction under the drive of the first piezoelectric element 1311 and the second piezoelectric element 1312. The height direction is the direction set by the photosensitive axis. Since the movable portion and the photosensitive chip 12 can move by a superimposed travel of the first cantilever sub-section 1145 and the second cantilever sub-section 1146, a larger optical focusing travel is achieved.

[0111] The second cantilever portion 1144 is divided into a third cantilever sub-portion 1147 and a fourth cantilever sub-portion 1148 by the dividing groove. The third cantilever sub-portion 1147 is connected to the first end 1131, and the fourth cantilever sub-portion 1148 is connected to the second end 1132. A third piezoelectric sheet 1313 is disposed on the third cantilever sub-portion 1147, and a fourth piezoelectric sheet 1314 is disposed on the fourth cantilever sub-portion 1148. The third piezoelectric sheet 1313 extends along a first direction, and the fourth piezoelectric sheet 1314 extends along a second direction. After being energized, the third cantilever sub-portions 1147 and 1148 of the second cantilever portion 1144 generate a stroke along the height direction under the drive of the third piezoelectric sheet 1313 and the fourth piezoelectric sheet 1314.

[0112] Figure 7 The illustration shows a schematic diagram of a modified embodiment of the cantilever arm according to an embodiment of this application. For example... Figure 7 As shown, in this modified embodiment, the at least one pair of cantilever arms 113 includes a first cantilever arm 114A and a second cantilever arm 115A that are centrally symmetrical with respect to the movable portion 112. Furthermore, compared to... Figure 1 In the embodiment shown in Figure 3, in this modified embodiment, the shape of the cantilever arm was adjusted in order to further obtain a greater focusing stroke.

[0113] As an example, the first suspension arm 114A is illustrated in FIG. 12A, which shows that the first suspension arm 114A includes a first suspension arm body 1141A and a first partition slot 1142A and a second partition slot 1152A which are at least partially through the first suspension arm body 1141A. The first suspension arm body 1141A is divided into a first suspension arm portion 1143A, a second suspension arm portion 1144A and a third suspension arm portion 1153A which are movable relative to each other by the first partition slot 1142A and the second partition slot 1152A. The first suspension arm portion 1143A has a first suspension arm sub-portion 1145A and a second suspension arm sub-portion 1146A which are divided by the first partition slot 1142A. The second suspension arm portion 1144A has a third suspension arm sub-portion 1147A and a fourth suspension arm sub-portion 1148A which are divided by the first partition slot 1142A. The third suspension arm portion 1153A has a fifth suspension arm sub-portion 1155A and a sixth suspension arm sub-portion 1156A which are divided by the first partition slot 1142A and the second partition slot 1152A. Figure 7 As an example, the first suspension arm 114A is illustrated in FIG. 12A, which shows that the first suspension arm 114A includes a first suspension arm body 1141A and a first partition slot 1142A and a second partition slot 1152A which are at least partially through the first suspension arm body 1141A. The first suspension arm body 1141A is divided into a first suspension arm portion 1143A, a second suspension arm portion 1144A and a third suspension arm portion 1153A which are movable relative to each other by the first partition slot 1142A and the second partition slot 1152A. The first suspension arm portion 1143A has a first suspension arm sub-portion 1145A and a second suspension arm sub-portion 1146A which are divided by the first partition slot 1142A. The second suspension arm portion 1144A has a third suspension arm sub-portion 1147A and a fourth suspension arm sub-portion 1148A which are divided by the first partition slot 1142A. The third suspension arm portion 1153A has a fifth suspension arm sub-portion 1155A and a sixth suspension arm sub-portion 1156A which are divided by the first partition slot 1142A and the second partition slot 1152A. Figure 4 As an example, the first suspension arm 114A is illustrated in FIG. 12A, which shows that the first suspension arm 114A includes a first suspension arm body 1141A and a first partition slot 1142A and a second partition slot 1152A which are at least partially through the first suspension arm body 1141A. The first suspension arm body 1141A is divided into a first suspension arm portion 1143A, a second suspension arm portion 1144A and a third suspension arm portion 1153A which are movable relative to each other by the first partition slot 1142A and the second partition slot 1152A. The first suspension arm portion 1143A has a first suspension arm sub-portion 1145A and a second suspension arm sub-portion 1146A which are divided by the first partition slot 1142A. The second suspension arm portion 1144A has a third suspension arm sub-portion 1147A and a fourth suspension arm sub-portion 1148A which are divided by the first partition slot 1142A. The third suspension arm portion 1153A has a fifth suspension arm sub-portion 1155A and a sixth suspension arm sub-portion 1156A which are divided by the first partition slot 1142A and the second partition slot 1152A.

[0114] As an example, the first suspension arm 114A is illustrated in FIG. 12A, which shows that the first suspension arm 114A includes a first suspension arm body 1141A and a first partition slot 1142A and a second partition slot 1152A which are at least partially through the first suspension arm body 1141A. The first suspension arm body 1141A is divided into a first suspension arm portion 1143A, a second suspension arm portion 1144A and a third suspension arm portion 1153A which are movable relative to each other by the first partition slot 1142A and the second partition slot 1152A. The first suspension arm portion 1143A has a first suspension arm sub-portion 1145A and a second suspension arm sub-portion 1146A which are divided by the first partition slot 1142A. The second suspension arm portion 1144A has a third suspension arm sub-portion 1147A and a fourth suspension arm sub-portion 1148A which are divided by the first partition slot 1142A. The third suspension arm portion 1153A has a fifth suspension arm sub-portion 1155A and a sixth suspension arm sub-portion 1156A which are divided by the first partition slot 1142A and the second partition slot 1152A.

[0115] Accordingly, in this modified embodiment, the first piezoelectric element 131A includes a first piezoelectric piece 1311A disposed in the first cantilever sub-part 1145A, a second piezoelectric piece 1312A disposed in the second cantilever sub-part 1146A, a third piezoelectric piece 1313A disposed in the third cantilever sub-part 1147A, a fourth piezoelectric piece 1314A disposed in the fourth cantilever sub-part 1148A, and a fifth piezoelectric piece 1314A disposed in the fifth cantilever sub-part 1155A. The fifth piezoelectric element 1321A and the sixth piezoelectric element 1322A disposed on the sixth cantilever sub-part 1156A drive the movable part 112 and the photosensitive chip 12 from the first side of the photosensitive chip 12 by the contraction or expansion of the first piezoelectric element 1311A and the second piezoelectric element 1312A, the third piezoelectric element 1313A and the fourth piezoelectric element 1314A, as well as the fifth piezoelectric element 1321A and the sixth piezoelectric element 1322A.

[0116] Similarly, in this modified embodiment, the second cantilever arm 115A, which is paired with the first cantilever arm 114A, includes: a second cantilever body 1151A and a third partition groove 1162A and a fourth partition groove 1172A that at least partially penetrate the second cantilever body 1151A, wherein the second cantilever body 1151A is divided into a fourth cantilever portion 1154A, a fifth cantilever portion 1163A, and a sixth cantilever portion 1164A that are movable to each other through the third partition groove 1162A and the fourth partition groove 1172A. The fourth cantilever portion 1154A has a seventh cantilever sub-portion 1157A and an eighth cantilever sub-portion 1158A divided by the third dividing groove 1162A; the fifth cantilever portion 1163A has a ninth cantilever sub-portion 1165A and a tenth cantilever sub-portion 1166A divided by the third dividing groove 1162A; and the sixth cantilever portion 1164A has an eleventh cantilever sub-portion 1167A and a twelfth cantilever sub-portion 1168A divided by the third dividing groove 1162A and the fourth dividing groove 1172A.

[0117] Accordingly, such as Figure 7 As shown, in this modified embodiment, the third dividing groove 1162A is cross-shaped, dividing the second cantilever body 1151A in both the longitudinal and transverse directions to form a fourth cantilever portion 1154A having a seventh cantilever sub-part 1157A and an eighth cantilever sub-part 1158A, and a fifth cantilever portion 1163A having a ninth cantilever sub-part 1165A and a tenth cantilever sub-part 1166A. Further, the fourth dividing groove 1172A and the third dividing groove 1162A cooperate to further divide the fifth cantilever portion 1163A to form a sixth cantilever portion 1164A having an eleventh cantilever sub-part 1167A and a twelfth cantilever sub-part 1168A.

[0118] Accordingly, the second piezoelectric element 132A includes the seventh piezoelectric sheet 1323A disposed at the seventh cantilever sub-portion 1157A, the eighth piezoelectric sheet 1324A disposed at the eighth cantilever sub-portion 1158A, the ninth piezoelectric sheet 1331A disposed at the ninth cantilever sub-portion 1165A, the tenth piezoelectric sheet 1332A disposed at the tenth cantilever sub-portion 1166A, the eleventh piezoelectric sheet 1333A disposed at the eleventh cantilever sub-portion 1167A, and the twelfth piezoelectric sheet 1334A disposed at the twelfth cantilever sub-portion 1168A, to drive the movable portion 112 and the photosensitive chip 12 from the second side of the photosensitive chip 12 by the contraction or expansion of the seventh piezoelectric sheet 1323A and the eighth piezoelectric sheet 1324A, the ninth piezoelectric sheet 1331A and the tenth piezoelectric sheet 1332A, and the eleventh piezoelectric sheet 1333A and the twelfth piezoelectric sheet 1334A.

[0119] In particular, the height of the photosensitive chip 12 driven by the first piezoelectric element 131A from the first side of the movable portion 112 to rise or fall is equal to the height of the photosensitive chip 12 driven by the second piezoelectric element 132 from the second side of the movable portion 112 to rise or fall, in this way, the optical focusing is performed.

[0120] Figure 8 Fig. 6 illustrates a schematic diagram of another variant of the substrate 11 according to an embodiment of the present application. In this variant, the shape of the cantilever arm is changed again.

[0121] In particular, as shown in Fig. 6, the first piezoelectric element 131A includes the first piezoelectric sheet 1311A disposed at the first cantilever sub-portion 1151A, the second piezoelectric sheet 1312A disposed at the second cantilever sub-portion 1152A, the third piezoelectric sheet 1313A disposed at the third cantilever sub-portion 1153A, the fourth piezoelectric sheet 1314A disposed at the fourth cantilever sub-portion 1154A, the fifth piezoelectric sheet 1315A disposed at the fifth cantilever sub-portion 1155A, and the sixth piezoelectric sheet 1316A disposed at the sixth cantilever sub-portion 1156A, to drive the movable portion 112 and the photosensitive chip 12 from the first side of the photosensitive chip 12 by the contraction or expansion of the first piezoelectric sheet 1311A and the second piezoelectric sheet 1312A, the third piezoelectric sheet 1313A and the fourth piezoelectric sheet 1314A, and the fifth piezoelectric sheet 1315A and the sixth piezoelectric sheet 1316A. Figure 8As shown, the first suspension arm 114B includes a first suspension arm segment 1141B extending along the X-axis direction and a second suspension arm segment 1142B extending along the Y-axis direction, and the second suspension arm 115B includes a third suspension arm segment 1151B extending along the X-axis direction and a fourth suspension arm segment 1152B extending along the Y-axis direction, wherein the at least one pair of piezoelectric elements 13 includes a first piezoelectric element 131 and a second piezoelectric element 132, the first piezoelectric element 131 is arranged on the first suspension arm segment 1141B of the first suspension arm 114B, and the second piezoelectric element 132 is arranged on the third suspension arm segment 1151B of the second suspension arm 115B, wherein the first piezoelectric element 131 is configured to actuate the first suspension arm 114B by deforming itself after being turned on to drive the movable part 112 and the photosensitive chip 12 from the first side of the movable part 112, and the second piezoelectric element 132 is configured to actuate the second suspension arm 115B by deforming itself after being turned on to drive the movable part 112 and the photosensitive chip 12 from the second side of the movable part 112, wherein the height of the photosensitive chip 12 driven by the first piezoelectric element 131 from the first side of the movable part 112 to rise or fall is equal to the height of the photosensitive chip 12 driven by the second piezoelectric element 132 from the second side of the movable part 112 to rise or fall, in this way, the photosensitive surface of the photosensitive chip 12 generates a stroke along the height direction relative to the fixed part 111, and optical focusing is performed in this way.

[0122] In this variant, the at least one pair of piezoelectric elements 13 further includes a third piezoelectric element 133 and a fourth piezoelectric element 134, the third piezoelectric element 133 is arranged on the second suspension arm segment 1142B of the first suspension arm 114B, and the fourth piezoelectric element 134 is arranged on the fourth suspension arm segment 1152B of the second suspension arm 115B; wherein the third piezoelectric element 133 is configured to actuate the first suspension arm 114B by deforming itself after being turned on to drive the movable part 112 and the photosensitive chip 12 from the first side of the movable part 112, and the fourth piezoelectric element 134 is configured to actuate the second suspension arm 115B by deforming itself after being turned on to drive the movable part 112 and the photosensitive chip 12 from the second side of the movable part 112 opposite to the first side, wherein the height of the photosensitive chip 12 driven by the third piezoelectric element 133 from the first side of the movable part 112 to rise or fall is equal to the height of the photosensitive chip 12 driven by the fourth piezoelectric element 134 from the second side of the movable part 112 to rise or fall, in this way, the photosensitive surface of the photosensitive chip 12 generates a stroke along the height direction relative to the fixed part 111, and optical focusing is performed in this way.

[0123] More specifically, in this variant embodiment, the first suspension arm 114B has an "L" shape, and / or the second suspension arm 115B has an "L" shape. That is, the first suspension arm 114 and the second suspension arm 115B are L-shaped arms. To enable smooth movement of the photosensitive chip 12, the first end 1131 of the first suspension arm 114B and the second suspension arm 115B connected to the movable part 112 is located at the midpoint of the opposite sides of the movable part 112, respectively.

[0124] Figure 9 Fig. 6 illustrates a schematic diagram of another variant of the substrate 11 according to an embodiment of the present application. In this variant embodiment, the shape of the suspension arm is adjusted again. As shown in the figure, in this embodiment, the first suspension arm 114B and the second suspension arm 115B have a three-segment structure, which includes a second suspension arm segment 1142B extending along the Y-axis direction and two first suspension arm segments 1141B extending along the X-axis direction. Of course, in other variant embodiments of the present application, the shape of the suspension arm can also be heterogenized in other manners, which is not limited in the present application. Accordingly, the one or more pairs of piezoelectric elements can be arranged on the first suspension arm segment 1141B and the second suspension arm segment 1142B based on the principles described above to perform optical focusing. Figure 9

[0125] It is also worth mentioning that, in the above-mentioned embodiments, the piezoelectric element is taken as an example arranged on the upper surface of the suspension arm, it can be understood that in other examples of the present application, the piezoelectric element can be arranged on the upper surface and the lower surface of the suspension arm at the same time, or only on the lower surface of the suspension arm, which is not limited in the present application.

[0126] In summary, the camera module based on the embodiments of the present application is illustrated, wherein the camera module adopts a new type of MEMS actuator as a driving element to drive the photosensitive chip 12 to displace to achieve optical focusing. In particular, in the embodiments of the present application, the MEMS actuator is composed of a piezoelectric element arranged on the substrate 11, compared with the traditional optical focusing technology based on the voice coil motor, the technical scheme of actuating the photosensitive chip 12 based on the MEMS actuator to perform optical focusing has many advantages: high performance, sub-micron precision positioning within 10 ms, larger optical focusing stroke, small size, no electromagnetic interference.

[0127] ​Those skilled in the art will understand that the embodiments of the application described above and shown in the drawings are merely illustrative and that numerous other modifications and configurations can be devised without departing from the principles of the present application. The scope of the application is best defined by the appended claims.

Claims

1. A photosensitive component, characterized in that, The application relates to a substrate, a photosensitive chip and at least one pair of piezoelectric elements. The substrate comprises a fixed part, a movable part and at least one pair of suspension arms extending between the fixed part and the movable part, the movable part being suspendedly arranged in the fixed part through the at least one pair of suspension arms, the at least one pair of suspension arms being symmetrically arranged relative to the movable part. The photosensitive chip is arranged in and electrically connected to the movable part. Each piezoelectric element of the at least one pair of piezoelectric elements is arranged in a corresponding suspension arm of the at least one pair of suspension arms and is configured to actuate the corresponding suspension arm through its own deformation after being turned on to generate a same height of warping from a first side and a second side of the movable part, so that a photosensitive surface of the photosensitive chip generates a stroke in a height direction relative to the fixed part to perform optical focusing. The substrate has an upper surface and a lower surface opposite to the upper surface, and further has a hollow structure at least partially penetrating between the lower surface and the upper surface, wherein the substrate forms the fixed part, the movable part and the at least one pair of suspension arms extending between the fixed part and the movable part through the hollow structure.

2. The photosensitive assembly of claim 1, wherein, Each suspension arm has a first end and a second end opposite to each other, the first end being fixed to the fixed part, and the second end being fixed to the movable part.

3. The photosensitive assembly of claim 2, wherein, The at least one pair of suspension arms comprises a first suspension arm and a second suspension arm, the first suspension arm and the second suspension arm being symmetrically arranged relative to the movable part; the at least one pair of piezoelectric elements comprises a first piezoelectric element and a second piezoelectric element, wherein the first piezoelectric element is arranged in the first suspension arm, and the second piezoelectric element is arranged in the second suspension arm.

4. The photosensitive assembly of claim 3, wherein, The first piezoelectric element is configured to actuate the first suspension arm to warp in a direction set along an optical axis of the photosensitive chip relative to the fixed part through its own deformation after being turned on to drive the movable part and the photosensitive chip from a first side of the movable part, and the second piezoelectric element is configured to actuate the second suspension arm to warp in the direction set along the optical axis of the photosensitive chip relative to the fixed part through its own deformation after being turned on to drive the movable part and the photosensitive chip from a second side of the movable part, wherein a height of the photosensitive chip driven upward or downward from the first side of the movable part by the first piezoelectric element is equal to a height of the photosensitive chip driven upward or downward from the second side of the movable part by the second piezoelectric element, so that the photosensitive surface of the photosensitive chip generates a stroke in the height direction relative to the fixed part to perform optical focusing.

5. The photosensitive assembly of claim 4, wherein, The first suspension arm includes a first arm main body and a first partition groove at least partially penetrating the first arm main body, wherein the first arm main body is divided into a first arm portion and a second arm portion movable relative to each other by the first partition groove, the first arm portion has a first arm sub-portion and a second arm sub-portion divided by the first end, and the second arm portion has a third arm sub-portion and a fourth arm sub-portion divided by the second end, wherein the first piezoelectric element includes a first piezoelectric sheet disposed in the first arm sub-portion, a second piezoelectric sheet disposed in the second arm sub-portion, a third piezoelectric sheet disposed in the third arm sub-portion, and a fourth piezoelectric sheet disposed in the fourth arm sub-portion.

6. The photosensitive assembly of claim 5, wherein, The second suspension arm includes a second arm main body and a second partition groove at least partially penetrating the second arm main body, wherein the second arm main body is divided into a third arm portion and a fourth arm portion movable relative to each other by the second partition groove, the third arm portion has a fifth arm sub-portion and a sixth arm sub-portion divided by the first end, and the fourth arm portion has a seventh arm sub-portion and an eighth arm sub-portion divided by the second end, wherein the second piezoelectric element includes a fifth piezoelectric sheet disposed in the fifth arm sub-portion, a sixth piezoelectric sheet disposed in the sixth arm sub-portion, a seventh piezoelectric sheet disposed in the seventh arm sub-portion, and an eighth piezoelectric sheet disposed in the eighth arm sub-portion.

7. The photosensitive assembly of claim 4, wherein, The first suspension arm includes a first arm main body and a first partition groove and a second partition groove at least partially penetrating the first arm main body, wherein the first arm main body is divided into a first arm portion, a second arm portion, and a third arm portion movable relative to each other by the first partition groove and the second partition groove, the first arm portion has a first arm sub-portion and a second arm sub-portion divided by the first partition groove, the second arm portion has a third arm sub-portion and a fourth arm sub-portion divided by the first partition groove, and the third arm portion has a fifth arm sub-portion and a sixth arm sub-portion divided by the first partition groove and the second partition groove, wherein the first piezoelectric element includes a first piezoelectric sheet disposed in the first arm sub-portion, a second piezoelectric sheet disposed in the second arm sub-portion, a third piezoelectric sheet disposed in the third arm sub-portion, a fourth piezoelectric sheet disposed in the fourth arm sub-portion, a fifth piezoelectric sheet disposed in the fifth arm sub-portion, and a sixth piezoelectric sheet disposed in the sixth arm sub-portion.

8. The photosensitive assembly of claim 7, wherein, The first partition groove has a cross-shaped structure.

9. The photosensitive assembly of claim 8, wherein, The second suspension arm comprises a second suspension arm body and a third partition groove and a fourth partition groove at least partially penetrating through the second suspension arm body, wherein the second suspension arm body is divided into a fourth suspension arm part, a fifth suspension arm part and a sixth suspension arm part which are movable relative to each other by the third partition groove and the fourth partition groove, the fourth suspension arm part has a seventh suspension arm subpart and an eighth suspension arm subpart divided by the third partition groove, the fifth suspension arm part has a ninth suspension arm subpart and a tenth suspension arm subpart divided by the third partition groove, and the sixth suspension arm part has an eleventh suspension arm subpart and a twelfth suspension arm subpart divided by the third partition groove and the fourth partition groove, wherein the second piezoelectric element comprises a seventh piezoelectric sheet arranged in the seventh suspension arm subpart, an eighth piezoelectric sheet arranged in the eighth suspension arm subpart, a ninth piezoelectric sheet arranged in the ninth suspension arm subpart, a tenth piezoelectric sheet arranged in the tenth suspension arm subpart, an eleventh piezoelectric sheet arranged in the eleventh suspension arm subpart and a twelfth piezoelectric sheet arranged in the twelfth suspension arm subpart.

10. The photosensitive assembly of claim 9, wherein, The third partition groove has a cross-shaped structure.

11. The photosensitive assembly of claim 4, wherein, The at least one pair of suspension arms further comprises a third suspension arm and a fourth suspension arm, wherein the first suspension arm and the second suspension arm are symmetrically arranged relative to the movable part with the X axis as the axis of symmetry, and the third suspension arm and the fourth suspension arm are symmetrically arranged relative to the movable part with the Y axis as the axis of symmetry.

12. The photosensitive assembly of claim 11, wherein, The at least one pair of piezoelectric elements further comprises a third piezoelectric element and a fourth piezoelectric element, wherein the third piezoelectric element is arranged in the third suspension arm, and the fourth piezoelectric element is arranged in the fourth suspension arm; wherein the third piezoelectric element and the fourth piezoelectric element are configured to actuate the third suspension arm and the fourth suspension arm respectively by their own deformation after being turned on to simultaneously raise or lower the movable part from the third side and the fourth side opposite to the movable part to raise or lower the light receiving surface of the light receiving chip to perform optical focusing.

13. The photosensitive assembly of claim 12, wherein, The third piezoelectric element is configured to actuate the third suspension arm to warp in a direction set along the light receiving axis of the light receiving chip relative to the fixed part by its own deformation after being turned on to drive the movable part and the light receiving chip from the third side of the movable part, and the second piezoelectric element is configured to actuate the fourth suspension arm to warp in a direction set along the light receiving axis of the light receiving chip relative to the fixed part by its own deformation after being turned on to drive the movable part and the light receiving chip from the fourth side of the movable part, wherein the height of the light receiving chip raised or lowered by the third piezoelectric element from the third side of the movable part is equal to the height of the light receiving chip raised or lowered by the fourth piezoelectric element from the fourth side of the movable part to perform optical focusing.

14. The photosensitive assembly of claim 2, wherein, The at least one pair of suspension arms comprises a first suspension arm and a second suspension arm; the first suspension arm comprises a first suspension arm segment extending along the X-axis direction and a second suspension arm segment extending along the Y-axis direction, and the second suspension arm comprises a third suspension arm segment extending along the X-axis direction and a fourth suspension arm segment extending along the Y-axis direction; the at least one pair of piezoelectric elements comprises a first piezoelectric element and a second piezoelectric element; the first piezoelectric element is arranged on the first suspension arm segment of the first suspension arm, and the second piezoelectric element is arranged on the third suspension arm segment of the second suspension arm; the first piezoelectric element is configured to drive the first suspension arm to drive the movable part and the photosensitive chip from the first side of the movable part by deforming itself after being turned on, and the second piezoelectric element is configured to drive the second suspension arm to drive the movable part and the photosensitive chip from the second side of the movable part by deforming itself after being turned on; the height of the photosensitive chip driven by the first piezoelectric element from the first side of the movable part to rise or fall is equal to the height of the photosensitive chip driven by the second piezoelectric element from the second side of the movable part to rise or fall, so as to perform optical focusing.

15. The photosensitive assembly of claim 14, wherein, The at least one pair of piezoelectric elements further comprises a third piezoelectric element and a fourth piezoelectric element; the third piezoelectric element is arranged on the second suspension arm segment of the first suspension arm, and the fourth piezoelectric element is arranged on the fourth suspension arm segment of the second suspension arm; the third piezoelectric element is configured to drive the first suspension arm to drive the movable part and the photosensitive chip from the first side of the movable part by deforming itself after being turned on, and the fourth piezoelectric element is configured to drive the second suspension arm to drive the movable part and the photosensitive chip from the second side of the movable part opposite to the first side by deforming itself after being turned on; the height of the photosensitive chip driven by the third piezoelectric element from the first side of the movable part to rise or fall is equal to the height of the photosensitive chip driven by the fourth piezoelectric element from the second side of the movable part to rise or fall, so as to make the photosensitive surface of the photosensitive chip produce a stroke in the height direction relative to the fixed part to perform optical focusing.

16. The photosensitive assembly of claim 15, wherein, The first suspension arm has an "L" type structure, and / or the second suspension arm has an "L" type structure.

17. The photosensitive assembly of claim 1, wherein, The thickness of the suspension arm ranges from 0.1 mm to 0.3 mm.

18. The photosensitive assembly of claim 1, wherein, The fixed part, the movable part and the at least one pair of suspension arms have an integrated structure.

19. The photosensitive assembly of claim 1, further comprising a reinforcing plate arranged on the lower surface of the substrate.

20. The photosensitive assembly of claim 1, further comprising a filter element held on the photosensitive path of the photosensitive chip.

21. An image capture module, comprising: comprises: The photosensitive assembly of any one of claims 1 to 20; and an optical lens held on the photosensitive path of the photosensitive assembly.

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