A heat dissipation device

Abstract

A heat dissipation device includes: an air compressor for supplying compressed air; heat dissipation fins disposed in and abutting against a heat dissipation area; and an air duct connected to the air compressor, a portion of which is embedded in the heat dissipation fins. The air duct has an air outlet located at a corresponding position on the heat dissipation fins. Furthermore, since heat dissipation is achieved through compressed air, damage to components caused by leakage, as is common with liquid cooling, can be avoided in the event of equipment failure. Simultaneously, delivering compressed air to the heat dissipation area via the air duct allows for flexible placement of the air compressor, reducing the space required for equipment installation and avoiding interference with the installation location and space of components.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a heat dissipation device. Background Technology

[0002] Electrical equipment contains a large number of components. Some components, such as chips, generate a lot of heat during operation, which can cause the temperature of the components to rise and affect their normal operation.

[0003] To reduce the temperature of components and dissipate heat, the most common methods used in the market are liquid cooling and gas cooling. Liquid cooling involves arranging multiple water channels around the component to be cooled, along with an inlet and outlet. The circulation of the liquid removes more heat to ensure the chip's normal operation. Gas cooling uses air as the cooling medium. This requires increasing the component's heat dissipation area, increasing the airflow rate over the component per unit time, or using both methods to achieve the goal of lowering the component's temperature.

[0004] While liquid cooling offers significantly better cooling performance than gas cooling, it requires much larger equipment and space, and is considerably more expensive. Furthermore, because liquid cooling components are more numerous and complex, reliability is lower; leaks due to operational errors can cause severe damage to components. Gas cooling is much smaller and cheaper than liquid cooling, but its cooling effect is not as good as liquid cooling, and it is easily affected by ambient air quality. If used in a confined space, it requires additional intake and exhaust ventilation equipment.

[0005] Therefore, there is an urgent need for a heat dissipation device that can reduce installation space, improve cooling effect, enhance equipment stability, and prevent damage to components. Summary of the Invention

[0006] In view of the above-mentioned problems of the prior art, this application provides a heat dissipation device that can reduce installation space, improve cooling effect, improve equipment stability, and avoid damage to components.

[0007] This application provides a heat dissipation device, comprising: an air compressor for providing compressed air; heat dissipation fins disposed in and abutting against a heat dissipation area; and an air duct connected to the air compressor, a portion of which is embedded in the heat dissipation fins, and an air outlet disposed on the air duct at a position corresponding to the heat dissipation fins.

[0008] Therefore, heat dissipation fins can be installed in areas requiring heat dissipation, such as chips. Compressed air supplied by an air compressor can be blown onto the heat dissipation fins through air ducts, thereby dissipating heat and improving cooling efficiency. Furthermore, embedding the air ducts into the heat dissipation fins improves their stability, preventing vibrations caused by compressed air passing through. This enhances heat dissipation stability and reduces equipment noise. Simultaneously, since compressed air is used for heat dissipation, damage to components caused by leakage, as is common with liquid cooling, can be avoided in the event of equipment failure. Moreover, delivering compressed air to the heat dissipation area via air ducts allows for flexible placement of the air compressor, reducing the space required for equipment installation and avoiding interference with the installation location and space of components.

[0009] In some embodiments, the heat dissipation fins include: a main body portion for attaching to the heat dissipation area; and fins, wherein a plurality of fins are disposed on the main body portion and arranged at intervals in the thickness direction of the fins; wherein the air outlet is disposed at the intervals of the fins.

[0010] As described above, by setting the air outlet at the intervals facing the fins, compressed air can be blown between the fins, thereby accelerating the heat dissipation of the heat dissipation fins and improving the heat dissipation effect.

[0011] In some embodiments, the fins are provided with notched insertion ports, the notches of which are located on the side of the fins facing away from the main body. The insertion ports of the plurality of fins form a channel for the air duct to pass through, and the air duct passes through the insertion ports.

[0012] As described above, the air conduit can be embedded into the insertion port, which can prevent the air conduit from twisting during the delivery of compressed air, thereby improving the stability of the air conduit.

[0013] In some embodiments, the insertion port is located near one end of the fin.

[0014] Typically, the size of the heat sink fins is larger than the size of the heat dissipation area. After installation, the heat dissipation area is positioned in the middle of the fins. Therefore, placing the insertion port near one end of the fins avoids reducing the heat dissipation area on the fins corresponding to the heat dissipation area, thus improving cooling efficiency.

[0015] In some embodiments, the air outlet is positioned toward the other end of the fin.

[0016] As such, by positioning the air outlet towards the other end of the fins, compressed air can be blown from one end of the fins to the other, ensuring that compressed air reaches all positions on the heat dissipation fins corresponding to the heat dissipation area. This improves the cooling effect.

[0017] In some embodiments, the heat dissipation fins further include a cover plate disposed on the fins and located on the side away from the main body, wherein the cover plate, the main body, and two adjacent fins form a heat dissipation channel.

[0018] As described above, by setting up a heat dissipation channel formed by the cover plate, fins, and main body, the compressed air flowing out of the outlet can pass through the heat dissipation channel, thereby reducing the pressure loss of compressed air when flowing between two adjacent fins, increasing the flow velocity of compressed air, and thus improving heat dissipation efficiency. In addition, setting a cover plate on the fins can also increase the heat dissipation area of ​​the heat dissipation device, thereby increasing the heat dissipation efficiency of the heat dissipation device.

[0019] In some embodiments, the fins are S-shaped, and a plurality of the fins are arranged radially around the center of the heat dissipation area; the air duct is located in the middle of the fins.

[0020] As described above, compressed air can be blown from the middle of the fins into the space between the fins. Because the fins are S-shaped, the compressed air changes direction as it flows between the fins, guided by the fins. This increases the airflow velocity on the fin surface, improving heat dissipation efficiency.

[0021] In some embodiments, the air duct is provided with air outlets in multiple heat dissipation areas.

[0022] As described above, by setting air outlets in multiple heat dissipation areas through air ducts, multiple heat dissipation areas can be cooled simultaneously.

[0023] In some embodiments, multiple air ducts are provided.

[0024] As mentioned above, by setting up multiple air ducts, one or more heat dissipation areas of one or more electrical devices can be cooled, thereby increasing the application range of the heat dissipation device.

[0025] In some embodiments, the air compressor is provided with a control valve for opening / closing the compressed air supplied by the air compressor to the air duct.

[0026] Therefore, compressed air can be controlled by a control valve. When cooling of the heat dissipation area is needed, the control valve is opened to allow compressed air to cool the area. When cooling is not needed, the control valve is closed. This reduces the energy consumption of the heat dissipation device.

[0027] In some embodiments, the control valve is a gas flow rate control valve, which can control the flow rate of compressed air delivered to the air duct.

[0028] Based on the above, the flow rate of compressed air can be controlled by controlling the valve according to the temperature of the heat dissipation area, thereby adjusting the cooling performance of the heat dissipation area, dynamically regulating the temperature of the heat dissipation area, and reducing the energy consumption of the heat dissipation device.

[0029] These and other aspects of the invention will become more apparent from the following description of several embodiments. Attached Figure Description

[0030] The various features of the present invention and the relationships between them are further explained below with reference to the accompanying drawings. The drawings are exemplary; some features are not shown to scale, and some drawings may omit conventional features in the field of this application that are not essential to this application, or additional features that are not essential to this application may be shown. The combination of features shown in the drawings is not intended to limit the present application. Furthermore, throughout this specification, the same reference numerals refer to the same things. Specific descriptions of the drawings are as follows:

[0031] Figure 1 This is a schematic diagram of the heat dissipation device in the embodiments of this application;

[0032] Figure 2 This is a schematic diagram of another heat dissipation fin structure in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the structure of the third type of heat dissipation fin in the embodiments of this application;

[0034] Figure 4 This is a schematic diagram of the electrical connections of the heat dissipation device in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures

[0036] 100 Heat dissipation device; 110 Air compressor; 111 Control valve; 120 Air duct; 121 Air outlet; 130 Heat dissipation fins; 131 Main body; 132 Fins; 133 Embedding port; 134 Cover plate; 135 Heat dissipation channel; 140 Controller; 150 Temperature sensor. Detailed Implementation

[0037] The term "comprising" as used in the specification and claims should not be construed as limiting itself to what follows; it does not exclude other elements or steps. Therefore, it should be interpreted as specifying the presence of the mentioned feature, integral, or component, but does not exclude the presence or addition of one or more other features, integrals, or components, or groups thereof. Thus, the statement "device comprising means A and B" should not be limited to a device consisting solely of components A and B.

[0038] The term "an embodiment" or "an embodiment" as used in this specification means that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in at least one embodiment of the invention. Therefore, the terms "in one embodiment" or "in an embodiment" appearing throughout this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics can be combined in any suitable manner, as will be apparent to those skilled in the art from this disclosure.

[0039] The specific structure of the heat dissipation device 100 in the embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0040] Figure 1 This is a schematic diagram of the heat dissipation device 100 in an embodiment of this application. Figure 1 As shown, the heat dissipation device 100 in this embodiment includes an air compressor 110, an air duct 120, and heat dissipation fins 130.

[0041] The air compressor 110 provides compressed air, and the air duct 120 is connected to the air compressor 110. Heat sink fins 130 can be attached to the heat dissipation area to conduct heat away from the area, increasing the heat dissipation surface area. The heat dissipation area can be components and areas requiring heat dissipation, such as chips. One end of the air duct 120 is connected to the air compressor 110, and the other end is sealed. The air duct 120 has an air outlet in the heat dissipation area, specifically facing the heat sink fins 130, allowing compressed air to be discharged from the outlet towards the heat sink fins 130, thus dissipating heat from the heat dissipation area. Specifically, the dimensions of the air duct and the air outlet can be set according to the installation space of the equipment and the heat dissipation requirements of the heat dissipation area. For example, the air duct can be a circular pipe with a diameter of approximately 4 mm, and the air outlet can be a circular hole with a diameter of approximately 1 mm. Thus, the air duct 120 can blow the compressed air provided by the air compressor 110 to the area requiring heat dissipation, thereby improving the cooling effect. Furthermore, since heat dissipation is achieved through compressed air, damage to components caused by leakage, as is often the case with liquid cooling, can be avoided in the event of equipment malfunction. Simultaneously, by delivering compressed air to the heat dissipation area via the air duct 120, the installation location of the air compressor 110 can be flexibly configured, reducing the space required for equipment installation and avoiding any impact on the installation location and space of components.

[0042] like Figure 1 As shown, the heat dissipation fins 130 can be made of aluminum alloy or other materials with good thermal conductivity. The heat dissipation fins 130 are generally rectangular in shape, including a main body 131 and fins 132. The main body 131 is a rectangular plate for attaching to the heat dissipation area to conduct heat away from the area. Multiple fins 132 are provided, each fin is a rectangular plate and stands upright on the main body 131, thereby increasing the heat dissipation area and improving heat dissipation efficiency. The multiple fins 132 are arranged at intervals along the thickness direction of the fins 132, and the air outlets are positioned facing the intervals between the fins 132. Thus, by positioning the air outlets facing the intervals between the fins 132, compressed air can be blown between the fins 132, thereby accelerating the heat dissipation of the heat dissipation fins 130 and improving the heat dissipation effect.

[0043] like Figure 1As shown, the fin 132 has a notch-shaped insertion port 133. The notch of the insertion port 133 is located on the side of the fin 132 facing away from the main body 131. The insertion ports 133 of multiple fins 132 form a channel for the air duct 120 to pass through. Specifically, the size of the insertion port 133 is adapted to the size of the air duct 120, and can be a square notch with a side length of 4mm. Thus, an air duct 120 with a diameter of 4mm can be inserted into the insertion port 133, thereby preventing the air duct 120 from twisting during the delivery of compressed air, thereby improving the stability of the air duct 120.

[0044] like Figure 1 As shown, the insertion port 133 is located near one end of the fin 132, for example, 2mm from one end of the fin 132. The insertion ports 133 on multiple fins 132 form a rectangular channel for installing the air duct 120. To improve the thermal conductivity between the heat dissipation fins 130 and the heat dissipation area, the size of the heat dissipation fins 130 is usually larger than the size of the heat dissipation area. After the heat dissipation fins 130 are installed, the heat dissipation area is located in the middle of the heat dissipation fins 130. Therefore, by placing the insertion port 133 near one end of the fin 132, the insertion port 133 avoids the position on the fin 132 corresponding to the heat dissipation area, thus preventing a reduction in the heat dissipation area at the position on the fin 132 corresponding to the heat dissipation area and improving the cooling effect.

[0045] Furthermore, the air outlet is positioned towards the other end of the fin 132. By positioning the air outlet towards the other end of the fin 132, compressed air can be blown from one end of the fin 132 to the other, ensuring that compressed air can reach all positions on the heat dissipation fin 130 corresponding to the heat dissipation area. This improves the cooling effect.

[0046] Figure 2 This is a schematic diagram of another heat dissipation fin 130 in an embodiment of this application. Figure 2 As shown, in some possible embodiments, in Figure 1 Based on the heat dissipation fins 130, the heat dissipation fins 130 may further include a cover plate 134. The cover plate 134 is disposed on the fins 132, located on the side away from the main body 131. The cover plate 134, the main body 131, and two adjacent fins 132 form a heat dissipation channel 135. The heat dissipation channel 135 can be, for example... Figure 2The square channel shown can also be of other shapes; there is no limitation on this. By forming the heat dissipation channel 135, the compressed air flowing out of the outlet 121 can pass through the heat dissipation channel 135, thereby reducing the pressure loss of compressed air when flowing between two adjacent fins 132, increasing the flow velocity of compressed air, and thus improving heat dissipation efficiency. In addition, providing a cover plate 134 on the fins 132 can increase the heat dissipation area of ​​the heat dissipation device 100 and increase the heat dissipation efficiency of the heat dissipation device 100.

[0047] Figure 3 This is a schematic diagram of the structure of the third type of heat dissipation fin 130 in an embodiment of this application. Figure 3 As shown, in some possible embodiments, the heat dissipation fins 130 can be as follows: Figure 3 The device shown is cylindrical, comprising a main body 131 with a circular plate-like structure and S-shaped plate-like fins 132. In some embodiments, it can still be rectangular in plan view, with the heat dissipation fins 130 extending outwards. Multiple fins 132 are arranged in a circular array on the main body 131, centered on the center of the main body 131. One S-shaped portion of each fin 132 is attached to the main body. A circular region is formed in the middle of the multiple fins 132 for connecting the air duct 120.

[0048] The end of the air duct 120 is fixed to a circular area, and an air outlet 121 is provided on the outer circumferential surface of the air duct 120 at intervals between two adjacent fins 132. For example... Figure 3 As shown, the air outlet 121 is positioned on one side facing the fin 132. Figure 3 The dashed arrow indicates the flow direction of the compressed air blown out of the outlet 121, such as... Figure 3 As shown by the dashed arrow, because the fin 132 is S-shaped, compressed air, after being blown to one side of the fin 132, will change direction under the guidance of the fin 132 and blow towards the other side of the adjacent fin 132. Therefore, by directly blowing compressed air to the side of the fin 132, the airflow velocity on the surface of the fin 132 can be increased, thereby improving the heat dissipation efficiency of the fin 132. Furthermore, because compressed air, after being blown to one side of the fin 132, will cause the heat dissipation fin 130 to be subjected to, for example... Figure 3 A counter-clockwise force. Simultaneously, the compressed air, guided by the fins 132, changes direction and blows towards the side of the adjacent fins 132, causing the heat dissipation fins 130 to be subjected to a force directed towards, for example... Figure 3 The force is directed clockwise. This allows the forces in the two directions to cancel each other out, thereby reducing the thrust of the compressed air on the heat dissipation fins 132 and preventing the heat dissipation fins 130 from shaking under the blowing of the compressed air.

[0049] Furthermore, the air duct 120 is provided with air outlets in multiple heat dissipation areas. Specifically, one air duct 120 can be deployed in multiple heat dissipation areas, so that multiple heat dissipation areas can be cooled simultaneously through the air outlets. Alternatively, multiple air ducts 120 can be provided, each corresponding to a heat dissipation area, so that multiple heat dissipation areas can be cooled simultaneously through the air outlets.

[0050] Furthermore, the heat dissipation device 100 in this application can correspond to an electrical device, and can dissipate heat from one or more chips or other components in the electrical device through one or more air ducts 120. It can also correspond to multiple electrical devices, and can dissipate heat from one or more chips or other components in multiple electrical devices through multiple air ducts 120 connected to an air compressor 110.

[0051] Figure 4 This is a schematic diagram of the electrical connections of the heat dissipation device 100 in an embodiment of this application. Figure 1 , Figure 4 As shown, the air compressor 110 is equipped with a control valve 111, specifically, it can be installed on the exhaust pipe of the air compressor 110. The air duct 120 is connected to the exhaust pipe of the air compressor 110, thereby obtaining compressed air supplied by the air compressor 110. The control valve 111 is used to open / close the compressed air supplied by the air compressor 110 to the air duct 120. When it is necessary to cool the heat dissipation area, the control valve 111 can be opened to allow the compressed air to cool the heat dissipation area. When it is not necessary to cool the heat dissipation area, the control valve 111 can be closed. This reduces the energy consumption of the heat dissipation device 100.

[0052] like Figure 4 As shown, the heat dissipation device 100 in this embodiment of the application also includes a controller 140 and a temperature sensor 150. The controller 140 is electrically connected to the control valve 111 and the temperature sensor 150, respectively.

[0053] Temperature sensor 150 is installed at a location corresponding to the heat dissipation area to detect the temperature of the heat dissipation area. Temperature sensor 150 can send the detected temperature information to controller 140. When the temperature information shows that the temperature of the heat dissipation area exceeds the first temperature threshold, controller 140 can control control valve 111 to open, allowing compressed air to be discharged through air duct 120 from the air outlet, thereby cooling the heat dissipation fins 130 and the heat dissipation area.

[0054] Furthermore, the control valve 111 can also be a gas flow rate control valve, capable of controlling the flow rate of compressed air delivered to the air duct 120. Thus, the controller 140 can adjust the flow rate of compressed air by controlling the valve 111 based on the temperature of the heat dissipation area detected by the temperature sensor 150, thereby adjusting the cooling performance of the heat dissipation area and dynamically regulating its temperature, thereby reducing the energy consumption of the heat dissipation device 100.

[0055] Note that the above are merely preferred embodiments and the technical principles employed in this application. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present application has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, all of which fall within the scope of protection of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: An air compressor is used to provide compressed air; Heat dissipation fins are disposed in the heat dissipation area and abut against the heat dissipation area; An air duct is connected to the air compressor. A portion of the air duct is embedded in the heat dissipation fins. An air outlet is provided on the air duct and is located at a corresponding position on the heat dissipation fins. The heat dissipation fins include: The main body is used to attach to the heat dissipation area; Multiple fins are provided and erected on the main body, arranged at intervals in the thickness direction of the fins; the air outlet is positioned facing the intervals of the fins; the fins are S-shaped, and multiple fins are arranged radially around the center of the heat dissipation area in a circular pattern; the air duct is located in the middle of the fins, and compressed air blown from the air outlet is delivered to one side of the fin, and then changes direction under the guidance of the fins to blow onto the other side of the adjacent fin; A cover plate is disposed on the fins and located on the side away from the main body. The cover plate, the main body, and two adjacent fins form a heat dissipation channel.

2. The heat dissipation device according to claim 1, characterized in that, The air compressor is equipped with a control valve, which is used to open / close the compressed air supplied by the air compressor to the air duct.

3. The heat dissipation device according to claim 2, characterized in that, The control valve is a gas flow rate control valve, which can control the flow rate of compressed air delivered to the air duct.

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