Vapor Chamber and Electronic Devices

Abstract

The present application provides a temperature averaging plate and an electronic device, wherein the temperature averaging plate comprises a heat transfer portion and a heat dissipation portion; the heat dissipation portion is attached to the condensation surface of the heat transfer portion, the heat transfer portion has a vacuum cavity, a heat transfer medium is injected into the vacuum cavity, the vacuum cavity comprises an evaporation cavity and a condensation cavity connected to each other, the heat transfer medium flows in the evaporation cavity and the condensation cavity; the wall thickness of at least part of the evaporation cavity is greater than the wall thickness of the condensation cavity. The temperature averaging plate and the electronic device provided by the present application can improve the heat dissipation performance of the temperature averaging plate and dissipate heat for heat sources with higher power consumption.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a temperature homogenizing plate and an electronic device. Background Art

[0002] Vapor Chambers (VC), also known as heat spreader or planar heat pipe, is a highly efficient heat dissipation electronic device, which is widely used in the heat dissipation of high-power electronic devices such as CPU, NP, ASIC, etc.

[0003] In the related art, the temperature equalizer is usually made of upper cover and lower cover and other parts; first, these parts are made into a plate with a cavity by diffusion welding or brazing, then pure water and other working fluids are injected into the cavity, and finally, vacuum is evacuated to form a vacuum cavity to make the temperature equalizer. After absorbing the heat from the heat source, the liquid working fluid at the bottom of the vacuum cavity evaporates and diffuses into the vacuum cavity, transferring the heat to a part far away from the heat source, and then condenses into liquid and returns to the bottom to complete the heat dissipation.

[0004] However, the heat flux density limit of the heat source that the above-mentioned temperature plate can withstand is 120W / cm 2 It is difficult to meet the increasing heat dissipation requirements of electronic devices such as CPUs. Summary of the invention

[0005] The present application provides a temperature homogenizing plate and an electronic device, which are used to solve the heat dissipation problem caused by the increasing power consumption of electronic devices.

[0006] The present application provides a temperature homogenizing plate, which includes a heat transfer portion and a heat dissipation portion;

[0007] The heat dissipation part is attached to the condensation surface of the heat transfer part. The heat transfer part has a vacuum cavity. A heat transfer medium is injected into the vacuum cavity. The vacuum cavity includes an evaporation cavity and a condensation cavity that are connected. The heat transfer medium flows in the evaporation cavity and the condensation cavity.

[0008] Wherein, at least a part of the wall thickness of the evaporation chamber is greater than the wall thickness of the condensation chamber.

[0009] The temperature homogenizing plate provided in the present application comprises a heat transfer portion and a heat dissipation portion. The heat dissipation portion is fitted and connected to the condensation surface of the heat transfer portion to quickly take away the heat of the heat transfer portion. The heat transfer portion has a vacuum cavity, and a heat transfer medium is injected into the vacuum cavity. The heat transfer medium absorbs heat at the heat source. In a low vacuum environment, the heat transfer medium produces a liquid phase vaporization phenomenon and is quickly distributed to the entire vacuum cavity to quickly transfer the heat at the heat source to the entire temperature homogenizing plate to preliminarily reduce the temperature of the heat source. The gas phase heat transfer medium moves to the wall surface with a lower temperature, and the heat transfer medium produces a condensation phenomenon to release the heat accumulated during evaporation. The heat dissipation portion quickly diffuses the heat to the outside to keep the wall surface at a lower temperature. The liquid phase heat transfer medium then flows back to the heat source, and the cycle is repeated to achieve heat dissipation. The present application divides the vacuum chamber in the heat transfer part into two connected evaporation chambers and condensation chambers to collect the heat dissipation medium into the evaporation chamber, accelerates the flow rate of the heat transfer medium inside the temperature equalizing plate, and thus improves its heat dissipation performance. In addition, the wall thickness of at least part of the evaporation chamber is made greater than the wall thickness of the condensation chamber to increase the wall thickness of the evaporation chamber, so that the heat can be initially diffused in the chamber wall, and the local temperature of the chamber wall is prevented from being too high and exceeding the bearing limit of the temperature equalizing plate, causing the heat transfer medium at that location in the evaporation chamber to be burned out, resulting in a sudden drop in the heat dissipation performance of the temperature equalizing plate. That is, setting an evaporation chamber and increasing the wall thickness of the evaporation chamber can improve the heat dissipation performance of the temperature equalizing plate, so as to dissipate heat for heat sources with higher power consumption.

[0010] In one possible implementation, at least one boss is provided on the wall surface of the heat transfer portion opposite to the condensation surface, the boss includes a heat transfer wall and a side wall, the side wall is connected to the circumferential edge of the heat transfer wall, the heat transfer wall and the side wall are arranged to form an evaporation chamber, and the heat transfer wall is used to connect to a heat source.

[0011] In a possible implementation, the average thickness of the heat transfer wall is greater than the wall thickness of the condensation chamber.

[0012] In a possible implementation, the inner wall surface in the middle of the heat transfer wall is an evaporation surface, and the thickness of the heat transfer wall gradually decreases from the edge of the evaporation surface to the side wall.

[0013] In a possible implementation, the area of ​​the evaporation surface is greater than or equal to the area of ​​the heat generating surface of the heat source.

[0014] In a possible implementation, the thickness of the side wall is greater than the wall thickness of the condensation chamber.

[0015] In a possible implementation, the inner wall surface of the heat transfer wall is provided with a protrusion, and the surface of the protrusion is provided with capillary particles;

[0016] And / or, the inner wall surface of the heat transfer wall is provided with a recessed portion, and the surface of the recessed portion is provided with capillary particles.

[0017] In a possible implementation, the heat dissipation portion includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals on the condensation surface.

[0018] In a possible implementation, the heat dissipation part also includes multiple heat pipes, including at least two first heat pipes and at least one second heat pipe, at least two first heat pipes are arranged at intervals along the height direction of the heat dissipation fins, and both ends of the second heat pipe are respectively connected to two adjacent first heat pipes.

[0019] The present application also provides an electronic device, which includes an electronic device and a temperature averaging plate provided by any one of the above implementations, wherein the temperature averaging plate is thermally connected to the electronic device.

[0020] The electronic device provided by the present application includes an electronic device and a temperature averaging plate, the temperature averaging plate and the electronic device are thermally connected, wherein the temperature averaging plate includes a heat transfer part and a heat dissipation part, the electronic device is connected to the heat transfer part as a heat source, the heat transfer part transfers heat to the heat dissipation part, and the heat dissipation part dissipates the heat to the outside to complete the heat dissipation. The present application divides the vacuum chamber in the heat transfer part into two connected evaporation chambers and condensation chambers, so as to collect the heat dissipation medium into the evaporation chamber, accelerate the speed of the change and flow of the heat transfer medium inside the temperature averaging plate, thereby improving its heat dissipation performance, and make the wall thickness of at least part of the evaporation chamber greater than the wall thickness of the condensation chamber, so as to increase the wall thickness of the evaporation chamber, so that the heat can be initially diffused in the cavity wall, avoid the local temperature of the cavity wall being too high, exceeding the bearing limit of the temperature averaging plate, causing the heat transfer medium in the evaporation chamber to be burned dry, resulting in a sudden drop in the heat dissipation performance of the temperature averaging plate, that is, setting the evaporation chamber and increasing the wall thickness of the evaporation chamber can improve the heat dissipation performance of the temperature averaging plate, so as to dissipate heat for heat sources with higher power consumption.

[0021] The construction of the present application and its other inventive objectives and beneficial effects will be more clearly understood through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and other purposes, features and advantages of the embodiments of the present application will become more easily understood through the following detailed description with reference to the accompanying drawings. In the accompanying drawings, multiple embodiments of the present application will be described in an exemplary and non-limiting manner, wherein:

[0023] Figure 1 A schematic diagram of the structure of a temperature homogenizing plate provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the relationship between the thermal resistance of the temperature vapor chamber provided in an embodiment of the present application and the power consumption of the electronic device;

[0025] Figure 3 A schematic diagram of the relationship between the height of the evaporation chamber and the power consumption of the electronic device provided in the embodiment of the present application;

[0026] Figure 4 A schematic diagram of the structure of an evaporation chamber provided in an embodiment of the present application;

[0027] Figure 5 A schematic diagram of the structure of another evaporation chamber provided in an embodiment of the present application.

[0028] Reference numerals:

[0029] 100-heat transfer part; 110-vacuum chamber; 111-evaporation chamber; 112-condensation chamber; 120-boss; 121-heat transfer wall; 1211-protrusion; 1212-recess; 122-side wall; 130-capillary particles; 140-condensation surface; 150-evaporation surface;

[0030] 200-heat dissipation unit; 210-heat dissipation fins; 220-heat pipe; 221-first heat pipe; 222-second heat pipe;

[0031] 300-thermal interface material;

[0032] 400-Heat source. DETAILED DESCRIPTION

[0033] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0034] Vapor Chambers (VC), also known as heat spreader or planar heat pipe, is a highly efficient heat transfer and heat dissipation electronic device, which is widely used in the heat dissipation of high-power electronic devices such as CPU, NP, ASIC, etc.

[0035] In the related art, the temperature equalizer is usually made of components such as an upper cover and a lower cover; first, these components are made into a plate with a cavity by diffusion welding or brazing, and then a working fluid such as pure water is injected into the cavity. Finally, vacuum is drawn to form a vacuum cavity to obtain the temperature equalizer.

[0036] The heating surface of the heat source is usually attached to the lower cover of the temperature equalizer. When the heat is conducted from the heat source to the lower cover, the working fluid in the cavity will begin to gasify in the liquid phase in a low vacuum environment. At this time, the working fluid absorbs heat energy and expands rapidly in volume. The gas phase working fluid will quickly fill the entire cavity. When the gas phase working fluid contacts the colder upper cover, condensation will occur, and the heat accumulated during evaporation will be released through condensation. The condensed liquid phase working fluid returns to the lower cover, and the cycle continues to achieve rapid heat dissipation.

[0037] It should be noted that the heat flux density limit of the heat source that the temperature plate can withstand is generally 120W / cm 2If this limit is exceeded, the water in the local area of ​​the temperature equalization board cavity will be dried up, resulting in a significant increase in the thermal resistance of this part and a significant decrease in the heat dissipation performance. Among them, heat flux density, also known as heat flux, refers to the heat energy passing through a unit area per unit time, and the "heat flux density of the heat source" refers to the heat energy passing through the heating surface of the heat source per unit area per unit time.

[0038] However, there are currently electronic devices (i.e. heat sources) in the industry with a heating surface size of 25*31.5mm and a power consumption of 795W, and an average heat flux density of 101W / cm 2 Considering the non-uniformity of the heat source, the heat flux density in the local area of ​​the device has basically reached the maximum heat flux density limit that the temperature spreader can withstand. With the development of technology, the power consumption of electronic devices will become larger and larger, and the heat flux density will become higher and higher, exceeding the heat flux density limit of the temperature spreader. After that, the above-mentioned temperature spreader will no longer be able to meet the heat dissipation needs of electronic devices.

[0039] In view of this, the present application provides a temperature equalizing plate and an electronic device, wherein the temperature equalizing plate includes a heat transfer portion and a heat dissipation portion, the vacuum chamber in the heat transfer portion is divided into two connected evaporation chambers and a condensation chamber, and the wall thickness of at least part of the evaporation chamber is greater than the wall thickness of the condensation chamber, so as to collect the heat transfer medium and increase the degree of heat diffusion in the chamber wall, thereby dissipating heat for a heat source with higher power consumption.

[0040] The temperature homogenizing plate and the electronic device provided in this embodiment will be described in detail below with reference to the accompanying drawings.

[0041] Embodiment 1

[0042] Figure 1 This is a schematic diagram of the structure of the temperature equalization plate provided in the embodiment of the present application. Figure 1 As shown, an embodiment of the present application provides a temperature equalizing plate, which includes a heat transfer portion 100 and a heat dissipation portion 200. The heat dissipation portion 200 is bonded to a condensation surface 140 of the heat transfer portion 100. The heat transfer portion 100 has a vacuum chamber 110, and a heat transfer medium is injected into the vacuum chamber 110. The heat transfer portion 100 contacts a heat source 400 to transfer the heat generated by the heat source 400 to the heat dissipation portion 200, and then the heat dissipation portion 200 dissipates the heat to the outside, thereby achieving rapid heat dissipation.

[0043] The vacuum chamber 110 of the temperature homogenizing plate includes an evaporation chamber 111 and a condensation chamber 112 which are connected to each other. The heat transfer medium flows in the evaporation chamber 111 and the condensation chamber 112. The wall thickness of at least part of the evaporation chamber 111 is greater than the wall thickness of the condensation chamber 112. The evaporation chamber 111 has the function of collecting the heat dissipation medium. The evaporation chamber 111 can accelerate the speed of the change and flow of the heat transfer medium inside it, thereby improving its heat dissipation performance. Increasing the wall thickness of the evaporation chamber 111 can make the heat initially diffuse in the chamber wall, avoiding the local temperature of the chamber wall being too high and exceeding the bearing limit of the temperature homogenizing plate, causing the heat transfer medium in the evaporation chamber 111 to be burned dry, resulting in a sudden drop in the heat dissipation performance of the temperature homogenizing plate. That is, the evaporation chamber 111 is provided and the wall thickness of the evaporation chamber 111 is increased to improve the heat dissipation performance of the temperature homogenizing plate, so as to dissipate heat for the heat source 400 with higher power consumption.

[0044] For example, the heat transfer portion 100 may be made of a high thermal conductivity material such as copper or aluminum to quickly take away the heat generated by the heat source 400 and enhance the heat dissipation performance of the temperature vapor chamber.

[0045] The heat dissipation portion 200 may include a plurality of heat dissipation fins 210 , and the plurality of heat dissipation fins 210 are disposed at intervals on the condensation surface 140 to increase the heat dissipation area of ​​the condensation surface 140 and improve the heat dissipation efficiency of the temperature vapor chamber.

[0046] In addition, the heat dissipation unit 200 may further include a plurality of heat pipes 220, the plurality of heat pipes 220 including at least two first heat pipes 221 and at least one second heat pipe 222, the at least two first heat pipes 221 being arranged at intervals along the height direction of the heat dissipation fins 210, and the two ends of the second heat pipe 222 being respectively connected to the two adjacent first heat pipes 221, such as Figure 1 As shown, heat can be transferred from the first heat pipe 221 at a lower position to the second heat pipe 222, and then to the second heat pipe 222 at a higher position, so as to further enhance the heat transfer efficiency of the heat dissipation portion 200 and the heat dissipation performance of the temperature vapor chamber.

[0047] Exemplarily, the heat dissipation unit 200 may include two groups of heat pipes 220 , each group of heat pipes 220 includes two first heat pipes 221 and one second heat pipe 222 , and the two groups of heat pipes 220 are symmetrically arranged to enhance the heat transfer efficiency and the heat dissipation performance of the temperature vapor chamber.

[0048] In some specific examples, such as Figure 1As shown, at least one boss 120 may be provided on a side wall 122 of the heat transfer portion 100 opposite to the condensation surface 140. The boss 120 may include a heat transfer wall 121 and a side wall 122. The side wall 122 is connected to the circumferential edge of the heat transfer wall 121. The heat transfer wall 121 and the side wall 122 are arranged to form an evaporation chamber 111. The heat transfer wall 121 is used to connect the heat source 400. By way of example, the heat source 400 may be an electronic device such as a CPU. The heat transfer wall 121 is thermally conductive with the electronic device to conduct the heat generated by the heat source 400 to the heat dissipation medium in the evaporation chamber 111.

[0049] In practical applications, the heating surface of the heat source 400 can be connected to the heat transfer wall 121 by means of a thermal interface material 300 (TIM) to fill the air gap between the heat source 400 and the heat transfer wall 121 due to the rough surface, thereby reducing the contact thermal resistance between the heat source 400 and the heat transfer wall 121. Alternatively, the heat source 400 can also be thermally connected to the heat transfer wall 121 by other means, which is not limited in this embodiment.

[0050] Figure 2 Schematic diagram of the relationship between the thermal resistance of the heat spreader provided in the embodiment of the present application and the power consumption of the electronic device. The solid line represents the heat spreader without the boss 120 (i.e., without the evaporation chamber 111), and the dotted line represents the heat spreader with the boss 120 (i.e., with the evaporation chamber 111). Except for whether the boss 120 is provided, the other data of the two groups of heat spreaders are consistent, such as Figure 2 As shown, the power consumption corresponding to the minimum thermal resistance point of the temperature homogenizing plate provided with the boss 120 is significantly greater than the power consumption corresponding to the minimum thermal resistance point of the temperature homogenizing plate not provided with the boss 120 .

[0051] It should be noted that thermal resistance refers to the ratio between the temperature difference at both ends of an object and the power of the heat source 400 when heat is transferred on the object, and the unit is Kelvin per watt (K / W) or Celsius per watt (℃ / W). The smaller the thermal resistance of an object, the better its thermal conductivity. When the thermal resistance of the vapor chamber is the smallest, its thermal conductivity is the best. At this time, the corresponding power consumption is the maximum heat transfer capacity Q of the vapor chamber. max ,like Figure 2 As shown, after the boss 120 is provided, the maximum heat transfer Q of the temperature homogenizing plate max The power of the heat sink has been increased from about 600W to about 800W. The heat dissipation capacity of the temperature equalizer has been significantly improved, which can dissipate heat for electronic devices with higher power consumption.

[0052] Figure 3 A schematic diagram of the relationship between the height of the evaporation chamber and the power consumption of the electronic device provided in the embodiment of the present application. Figure 3As shown, the greater the power consumption of the electronic device, the larger the evaporation space required. According to empirical data, the specific height of the evaporation chamber 111 can be determined according to the power consumption of the electronic device. For example, when the temperature equalizing plate is used to dissipate heat for an electronic device of about 1000W, the height of the evaporation chamber 111 can be set to about 5mm.

[0053] Exemplarily, the heat transfer portion 100 may be provided with only one boss 120. In this case, the temperature equalizer may dissipate heat for one heat source 400 alone, or the temperature equalizer provided with only one boss 120 may also dissipate heat for multiple heat sources 400 at the same time. The height difference between different heat sources 400 may be filled by thermal interface materials 300 of different thicknesses. However, it is understandable that the height difference between multiple heat sources 400 should not be too large to avoid the thermal interface material 300 being too thick, resulting in excessive thermal resistance.

[0054] When the temperature equalizer needs to dissipate heat for multiple heat sources 400 with large height differences at the same time, the heat transfer portion 100 can be provided with multiple bosses 120 of different heights, and the heat sources 400 of different heights can be respectively connected to the bosses 120 of different heights to control the thickness of the thermal interface material 300 and avoid excessive thermal resistance.

[0055] See again Figure 1 , the average thickness of the heat transfer wall 121 can be greater than the wall thickness of the condensing chamber 112. As shown by the dotted arrow in the figure, the heat of the heat source 400 can be initially diffused in the heat transfer wall 121, avoiding the problem of excessively high local temperature on the inner wall surface of the heat transfer wall 121, causing the heat transfer medium there to be burned out, resulting in a sudden drop in the heat dissipation performance of the temperature equalizing plate, thereby improving the heat dissipation performance of the temperature equalizing plate to dissipate heat for the heat source 400 with higher power consumption.

[0056] Taking the power consumption of the heat source 400 = 835W, the area of ​​the heating surface of the heat source 400 = 25mm*25mm, and the area of ​​the outer wall of the heat transfer wall 121 = 40mm*40mm as an example, the thickness of the heat transfer wall 121 increases from 1mm to 4mm, and the heat transferred by the corresponding area between the inner wall of the heat transfer wall 121 and the heating surface of the heat source 400 (referred to as the detection area) is detected, and the heat flux density of the detection area is calculated, and the following table is obtained:

[0057] Table 1 Correspondence between the thickness of the heat transfer wall and the heat flux density in the detection area

[0058] Thickness of heat transfer wall (mm) Heat of the detection area (W) <![CDATA[Heat flux density of the detection area (W / cm 2 )]]> 1.00 760.81 121.73 2.00 702.20 112.35 3.00 649.00 103.84 4.00 603.12 96.50

[0059] As shown in Table 1, when the thickness of the heat transfer wall 121 increases from 1 mm to 4 mm, the heat flux density in the detection area can be increased from 121.73 W / cm 2 Reduced to 96.5W / cm 2, effectively avoiding the problem of local over-temperature in the evaporation chamber 111, so as to meet the heat dissipation requirements of high-power electronic devices.

[0060] In addition, although the thermal resistance of the heat transfer wall 121 will increase as the thickness increases, affecting the heat dissipation performance, compared with the thermal resistance increased due to the drying of the heat transfer medium, the thermal resistance increased due to the increase in wall thickness is almost negligible. Therefore, for high-power electronic devices, appropriately increasing the wall thickness can effectively improve the heat dissipation performance of the temperature equalizer.

[0061] Figure 4 This is a schematic diagram of the structure of an evaporation chamber provided in an embodiment of the present application. Figure 4 As shown, the inner wall surface in the middle of the heat transfer wall 121 is the evaporation surface 150, and the thickness of the heat transfer wall 121 can be gradually reduced from the edge of the evaporation surface 150 to the side wall 122. Since the evaporation surface 150 (the inner wall surface in the middle of the heat transfer wall 121) is closer to the heat source 400, its temperature is usually higher than that of the surroundings. The temperature difference between the inner and outer wall surfaces in the middle of the heat transfer wall 121 is smaller than the temperature difference between the inner and outer wall surfaces at the edge of the heat transfer wall 121. The thermal resistance at the edge of the heat transfer wall 121 is relatively large and there is almost no risk of the heat transfer medium drying up. Appropriately reducing its thickness can reduce the overall thermal resistance of the heat spreader and improve its heat dissipation performance. Moreover, the wall thickness in the middle of the heat transfer wall 121 is relatively large, which still has the effect of preventing the heat transfer medium from drying up and improving the applicable power consumption of the heat spreader.

[0062] It should be noted that the inner wall surface in the middle of the heat transfer wall 121 is the "evaporation surface", which means that the wall surface can play the main role of heating the evaporating heat transfer medium, but it does not mean that the inner wall surfaces at other positions do not have the function of heating the evaporating heat transfer medium. In fact, the inner wall surfaces in the evaporation chamber 111 all have the function of heating the evaporating heat transfer medium.

[0063] For example, the area of ​​the evaporation surface 150 may be greater than or equal to the area of ​​the heating surface of the heat source 400, so as to ensure that the area close to the heat source 400 has a suitable wall thickness to avoid the problem of the heat transfer medium drying out. For example, when the area of ​​the heating surface of the heat source 400 is 25mm*25mm, the area of ​​the outer wall surface of the heat transfer wall 121 may be 40mm*40mm, and the area of ​​the evaporation surface 150 inside the heat transfer wall 121 may be 26mm*26mm or 28mm*28mm, etc.

[0064] In addition to the heat transfer wall 121 of the evaporation chamber 111, its side wall 122 can also be appropriately thickened, that is, the thickness of the side wall 122 can be greater than the wall thickness of the condensation chamber 112 to improve the heat diffusion capacity of the side wall 122 and avoid local over-temperature.

[0065] Similarly, taking the power consumption of the heat source 400 = 835W, the area of ​​the heating surface of the heat source 400 = 25mm*25mm, and the area of ​​the outer wall of the heat transfer wall 121 = 40mm*40mm as an example, the thickness and structure of the heat transfer wall 121 and the thickness of the side wall 122 are changed, and the heat transferred by the corresponding area between the inner wall of the heat transfer wall 121 and the heating surface of the heat source 400 (referred to as the detection area) is detected, and the heat flux density of the area is calculated, and the following table is obtained:

[0066] Table 2 Correspondence between the evaporation chamber structure and the heat flux density of the detection area

[0067]

[0068]

[0069] As shown in Table 2, after the edge of the heat transfer wall 121 is thinned, the heat flux density in the detection area can be increased from 96.50 W / cm 2 Reduced to 92.16W / cm 2 After the thickness of the side wall 122 is increased, the heat flux density in the detection area can be increased from 92.16W / cm 2 Reduced to 88.10W / cm 2 , which can effectively avoid the problem of local over-temperature in the evaporation chamber 111, so as to meet the heat dissipation requirements of high-power electronic devices.

[0070] See again Figure 1 The inner wall surface of the evaporation chamber 111 may be provided with capillary particles 130. The provision of the capillary particles 130 may increase the heat transfer area in contact with the heat transfer medium and increase the maximum heat transfer amount Q. max (Maximum heat transfer = heat flux density * heat transfer area), which is used to dissipate heat for high-power electronic devices.

[0071] In practical applications, the thickness of the capillary particles 130 can be determined by the following empirical formula:

[0072]

[0073] Where, δ(r,Q in) is the thickness of the capillary particle;

[0074] K 1 is the thermal conductivity of the heat transfer medium;

[0075] H v is the height of the vacuum chamber;

[0076] P v is the density of the gas phase heat transfer medium;

[0077] P l is the density of the liquid phase heat transfer medium;

[0078] ΔT is the difference between the saturation temperature of the heat transfer medium and the temperature of the inner wall corresponding to the condensation surface;

[0079] Qin is the input power consumption.

[0080] Exemplarily, the density of the capillary particles 130 can be set to 100-200 mesh (the number of particles on an area of ​​1 square inch), the thickness of the capillary particles 130 can be set to 0.05-0.10 mm, and can be set to a multi-layer structure such as two layers or three layers. The sizes of the two layers of capillary particles 130 can be the same or different, and this embodiment is not limited.

[0081] Figure 5 This is a schematic diagram of another evaporation chamber structure provided in an embodiment of the present application. Figure 5 As shown, the inner wall surface of the heat transfer wall 121 may be provided with a protrusion 1211, and the surface of the protrusion 1211 is provided with capillary particles 130 to further increase the heat transfer area and improve the maximum heat transfer amount Q max , increasing the power consumption range of applicable electronic devices.

[0082] Alternatively, the inner wall surface of the heat transfer wall 121 may also be provided with a recessed portion 1212, and the surface of the recessed portion 1212 may be provided with capillary particles 130; or, the inner wall surface of the heat transfer wall 121 may be provided with both a protrusion 1211 and a recessed portion 1212 to increase the heat transfer area and increase the power consumption range of applicable electronic devices.

[0083] Embodiment 2

[0084] This embodiment further provides an electronic device, which includes an electronic device and the temperature averaging plate provided in the first embodiment, wherein the temperature averaging plate is thermally connected to the electronic device.

[0085] Exemplarily, the electronic device may be a computer or other device, the electronic device may be a CPU or other device, and the electronic device serves as a heat source 400, and its heating surface may directly or indirectly contact the heat transfer wall 121 of the temperature equalizing plate. For example, the heating surface may contact the temperature equalizing plate through a thermal interface material 300, or the heating surface may contact the temperature equalizing plate through other heat transfer components to transfer heat to the temperature equalizing plate to achieve heat dissipation.

[0086] The specific heat dissipation process of the temperature vapor chamber is as follows:

[0087] Heat is transferred from the heating surface of the electronic device to the wall surface of the evaporation chamber 111 of the temperature homogenizer. The heat transfer medium absorbs heat from the inner wall surface of the evaporation chamber 111. In a low vacuum environment, the heat transfer medium produces a liquid phase vaporization phenomenon and is quickly distributed to the entire vacuum chamber 110, so as to quickly transfer the heat at the heat source 400 to the entire vacuum chamber 110 including the condensation chamber 112, so as to preliminarily reduce the temperature of the heat source 400. The gas phase heat transfer medium moves to the inner wall surface of the condensation chamber 112, and the heat transfer medium produces a condensation phenomenon, releasing the heat accumulated during evaporation. The heat dissipation part 200 quickly diffuses the heat of the condensation surface 140 to the outside, so that the wall surface at this location maintains a low temperature. The liquid phase heat transfer medium flows back to the heat source 400, and the cycle is repeated to achieve heat dissipation.

[0088] In addition, the structure and function of the temperature homogenizing plate are described in detail in the first embodiment and will not be repeated here.

[0089] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "height", "inside", "outside", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0090] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0091] In the description of this specification, the description with reference to the terms "embodiment", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0092] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned implementation modes, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some or all of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the implementation modes of the present application.

Claims

1. A temperature equalizing plate, characterized in that: including a heat transfer portion and a heat dissipation portion; The heat dissipation part is attached to the condensation surface of the heat transfer part, the heat transfer part has a vacuum cavity, a heat transfer medium is injected into the vacuum cavity, the vacuum cavity includes an evaporation cavity and a condensation cavity connected to each other, and the heat transfer medium flows in the evaporation cavity and the condensation cavity; At least one boss is provided on a wall surface of the heat transfer portion opposite to the condensing surface, the boss comprises a heat transfer wall and a side wall, the side wall is connected to the circumferential edge of the heat transfer wall, the heat transfer wall and the side wall are arranged to form the evaporation chamber, and the heat transfer wall is used to connect a heat source; The wall thickness of the heat transfer wall and the side wall is greater than the wall thickness of the condensation chamber; When the temperature homogenizing plate dissipates heat for a plurality of heat sources with height differences at the same time, the heat transfer portion is provided with a plurality of bosses with different heights, and the bosses with different heights are respectively connected to the heat sources with different heights.

2. The temperature equalizing plate according to claim 1, characterized in that: The average thickness of the heat transfer wall is greater than the wall thickness of the condensation chamber.

3. The temperature equalizing plate according to claim 2, characterized in that: The inner wall surface in the middle of the heat transfer wall is an evaporation surface, and the thickness of the heat transfer wall gradually decreases from the edge of the evaporation surface to the side wall.

4. The temperature equalizing plate according to claim 3, characterized in that: The area of ​​the evaporation surface is greater than or equal to the area of ​​the heat generation surface of the heat source.

5. The temperature homogenizing plate according to claim 1, characterized in that: The inner wall surface of the heat transfer wall is provided with a protrusion, and the surface of the protrusion is provided with capillary particles; And / or, the inner wall surface of the heat transfer wall is provided with a recessed portion, and the surface of the recessed portion is provided with capillary particles.

6. The temperature homogenizing plate according to any one of claims 1 to 5, characterized in that: The heat dissipation part includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals on the condensation surface.

7. The temperature equalizing plate according to claim 6, characterized in that: The heat dissipation part also includes a plurality of heat pipes, which include at least two first heat pipes and at least one second heat pipe. At least two first heat pipes are arranged at intervals along the height direction of the heat dissipation fins, and both ends of the second heat pipe are respectively connected to two adjacent first heat pipes.

8. An electronic device, comprising an electronic device and the temperature evaporating plate according to claims 1 to 7, wherein the temperature evaporating plate is thermally connected to the electronic device.

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