Modified bismaleimide prepolymer, resin composition and application of resin composition

Abstract

The present invention provides a modified bismaleimide prepolymer, characterized by being prepared by reacting a bismaleimide compound, a double-bond-containing silicone resin, and a hydrocarbon resin. The double-bond-containing silicone resin comprises the following structure: #imgabs0#, wherein R and R' are C1-C5 alkyl groups, and m is an integer from 1 to 30. The modified bismaleimide prepolymer provided by the present invention exhibits significantly improved toughness, dielectric properties, and processability compared to unmodified bismaleimide compounds.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic materials, and in particular to a modified bismaleimide prepolymer, a resin composition containing the modified bismaleimide prepolymer, and applications of the resin composition. Background Art

[0002] In recent years, electronic devices have been moving towards miniaturization and higher performance. This has led to increasing wiring density and integration within printed circuit boards (PCBs), placing higher demands on the heat resistance and reliability of copper-clad laminates. In semiconductor packaging substrates, in particular, the difference in thermal expansion between the chip and the organic substrate during package assembly can lead to warping.

[0003] Bismaleimide resin cured products have excellent properties such as high temperature resistance, moisture and heat resistance, high modulus, low CTE, and high strength. They are suitable for use as the base resin for IC packaging substrates and similar substrates. However, bismaleimide has the problem of greater brittleness and poor processability during application, which limits its application in the field of high-frequency and high-speed packaging substrates. Summary of the Invention

[0004] The present invention provides a modified bismaleimide prepolymer, a resin composition, and applications of the resin composition. By reacting a bismaleimide compound with a double-bond-containing organosilicon resin and a hydrocarbon resin, silicon-oxygen bonds and carbon-hydrogen bonds are introduced into the bismaleimide compound, while simultaneously incorporating silicon-oxygen bonds into the structure of the double-bond organosilicon resin. This improves the toughness and dielectric properties of the bismaleimide curing system, enhances the processability of the prepolymer, and overcomes the problems of brittleness and poor dielectric properties of the prior art bismaleimide curing systems.

[0005] In order to achieve one of the above-mentioned objects of the invention, one embodiment of the present invention provides a modified bismaleimide prepolymer, which is prepared by reacting a bismaleimide compound, a double-bond-containing silicone resin, and a hydrocarbon resin, wherein the double-bond-containing silicone resin contains the following structure:

[0006] Wherein R and R' are C1-C5 alkyl groups, and m is an integer of 1-30.

[0007] As a further improvement of one embodiment of the present invention, the double bond-containing silicone resin is represented by the following structural formula (1):

[0008]

[0009] Wherein, R and R' are C1-C5 alkyl groups or at least one of them is a reactive group, R" is a C1-C5 alkylene group, and n is an integer of 1-30.

[0010] As a further improvement of one embodiment of the present invention, the side chains R and R' of the double-bond-containing silicone resin contain at least one carbon-carbon double bond, and the carbon-carbon double bond is ethyl, allyl, propenyl, styryl or methacrylate.

[0011] As a further improvement of one embodiment of the present invention, the hydrocarbon resin contains anhydride groups, epoxy groups or hydroxyl groups.

[0012] One embodiment of the present invention further provides a resin composition comprising the following components by weight:

[0013] (a) modified bismaleimide prepolymer: 30-100 parts;

[0014] (b) epoxy resin: 5-50 parts;

[0015] (c) curing agent: 2 to 50 parts;

[0016] Wherein, the modified bismaleimide prepolymer is the modified bismaleimide prepolymer according to any one of claims 1 to 3.

[0017] As a further improvement of one embodiment of the present invention, the epoxy resin is at least one of the following structures:

[0018]

[0019]

[0020] The numbers of repeating units p, n, and m in the structural formulae (2) to (6) are integers of 1 to 10.

[0021] As a further improvement of one embodiment of the present invention, the curing agent is selected from at least one of amine compounds, amide compounds, acid anhydride compounds, phenol compounds, cyanate compounds, and active ester compounds.

[0022] As a further improvement of one embodiment of the present invention, the curing agent is at least one of the following structures:

[0023] R 11 is a methyl group, and n is an integer from 1 to 10;

[0024] kz is an integer from 1 to 10;

[0025] n is an integer from 1 to 10;

[0026] p is an integer from 1 to 10, R 3 and R 4 It is a C1~C5 alkyl group.

[0027] As a further improvement of one embodiment of the present invention, it further comprises a filler, wherein the content thereof is 20 to 80 parts by weight based on 100 parts by weight of the resin composition;

[0028] The filler includes inorganic fillers, organic fillers, and composite fillers. The inorganic filler is selected from at least one of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder. The organic filler is selected from at least one of polytetrafluoroethylene powder, polyphenylene sulfide powder, and polyethersulfone powder.

[0029] As a further improvement of one embodiment of the present invention, the filler is surface treated with a silane coupling agent, and the silane coupling agent is selected from the following structures:

[0030]

[0031] One embodiment of the present invention further provides a use of the aforementioned resin composition in prepregs, laminates, insulating films, insulating boards, copper-clad boards, circuit substrates, and electronic devices.

[0032] One or more technical solutions provided by the present invention have at least the following technical effects or advantages:

[0033] The present invention reacts a bismaleimide compound with a double-bond silicone resin and a hydrocarbon resin, introducing silicon-oxygen and carbon-hydrogen bonds into the bismaleimide compound. Simultaneously, the double-bond silicone resin contains the aforementioned silicon-oxygen bonds. This improves prepolymer processability, the toughness, and the dielectric properties of the bismaleimide curing system. This results in the modified bismaleimide prepolymer exhibiting excellent heat resistance, dielectric properties, low water absorption, and low CTE when used in high-frequency and high-speed packaging substrates. DETAILED DESCRIPTION

[0034] The present invention will be described in detail below with reference to specific embodiments, but these embodiments do not limit the present invention. Changes in reaction conditions, reactants, or raw material amounts made by ordinary technicians in this field according to these embodiments are all included in the scope of protection of the present invention.

[0035] The embodiment of the present invention provides a modified bismaleimide prepolymer, which is prepared by reacting a bismaleimide compound, a double-bond-containing silicone resin, and a hydrocarbon resin, wherein the double-bond-containing silicone resin contains the following structure:

[0036] Wherein R and R' are C1-C5 alkyl groups, and m is an integer of 1-30.

[0037] Furthermore, the double bond-containing silicone resin is represented by the following structural formula (1):

[0038]

[0039] Wherein, R and R' are C1-C5 alkyl groups or at least one of them is a reactive group, R" is a C1-C5 alkylene group, and n is an integer of 1-30.

[0040] Preferably, the side chains R and R' of the aforementioned double-bond-containing silicone resin contain at least one carbon-carbon double bond, and the carbon-carbon double bond is an ethyl group, an allyl group, a propenyl group, a styryl group or a methacrylate group.

[0041] Preferably, the hydrocarbon resin contains anhydride groups, epoxy groups, or hydroxyl groups. Using a hydrocarbon resin containing reactive groups can further enhance the reactivity of the prepolymer. In particular, when used in an epoxy resin system as described below, the prepolymer can react with the epoxy resin or curing agent, resulting in a denser structure and increased crosslinking density, further improving heat resistance, CTE, and water absorption.

[0042] The modified bismaleimide prepolymer is prepared by the following reaction:

[0043] reacting a bismaleimide compound and a double-bond-containing silicone resin at 50 to 90° C. for 30 to 120 minutes to obtain a pre-reactant;

[0044] A hydrocarbon resin is added to the pre-reactant and reacted at 90-130°C for 30-150 minutes to obtain the modified bismaleimide prepolymer. Furthermore, during the reaction of the bismaleimide compound with the double-bond-containing silicone resin and the hydrocarbon resin, at least one of aminophenol, carboxylic acid, or carboxylic anhydride is added in an amount of 0.1-10 parts by weight to enhance reactivity.

[0045] The double bonds on the bismaleimide compound react with the double bonds on the double-bond-containing silicone resin to introduce silicon-oxygen bonds into the bismaleimide compound. The silicon-oxygen bonds can improve the toughness of the bismaleimide compound. The hydrocarbon resin can then be used to increase the crosslinking density of the cured product, control the overall free radical reaction rate, effectively retain unreacted carbon-carbon double bonds, and improve the reactivity of the modified bismaleimide prepolymer while retaining the reactive groups in the hydrocarbon resin.

[0046] Furthermore, an appropriate amount of initiator can be added during the preparation of the modified bismaleimide prepolymer, and the initiator is 0.001-6 parts by weight based on 100 parts by weight of the resin composition; the initiator can be selected from an azo initiator, a peroxide initiator, or a redox initiator, preferably one or more of the following initiators: diisopropyl benzene peroxide, di-tert-butyl peroxide, tert-butyl perbenzoate, dicyclohexyl peroxydicarbonate, isopropyl benzene hydroperoxide, and azobisisobutyronitrile.

[0047] Furthermore, the bismaleimide compound is selected from at least one of the following structures:

[0048]

[0049]

[0050] R2 is hydrogen, methyl or ethyl, R1 is methylene, ethylene or n is an integer from 1 to 10;

[0051]

[0052] n is an integer from 1 to 10;

[0053] n is an integer from 1 to 10;

[0054] n is an integer from 1 to 10;

[0055]

[0056] R is hydrogen, methyl or ethyl, and n is an integer of 1-10.

[0057] The present invention also provides a resin composition comprising the following components by weight:

[0058] (a) modified bismaleimide prepolymer: 30-100 parts;

[0059] (b) epoxy resin: 5-50 parts;

[0060] (c) curing agent: 2 to 50 parts;

[0061] Wherein, the modified bismaleimide prepolymer is the aforementioned modified bismaleimide prepolymer.

[0062] Furthermore, the epoxy resin is selected from one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol E epoxy resin, phosphorus-containing epoxy resin, o-cresol epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, triphenylmethane epoxy resin, tetraphenylethane epoxy resin, biphenyl epoxy resin, naphthalene ring epoxy resin, dicyclopentadiene epoxy resin, isocyanate epoxy resin, aralkyl linear novolac epoxy resin, alicyclic epoxy resin, glycidyl amine epoxy resin, glycidyl ether epoxy resin, and glycidyl ester epoxy resin.

[0063] Preferably, the epoxy resin is at least one of the following structures:

[0064]

[0065] The number of repeating units (p, n, m) in the above structures (2) to (6) is an integer of 1 to 10.

[0066] Furthermore, the curing agent is selected from at least one of amine compounds, amide compounds, acid anhydride compounds, phenol compounds, cyanate compounds, and active ester compounds.

[0067] Wherein, the amine compound is selected from diaminodiphenylmethane, diaminodiphenyl sulfone, diethylenetriamine, dicarboxyphthalimide, dicyandiamide or imidazole.

[0068] The amide compound is selected from low molecular weight polyamides.

[0069] The acid anhydride compound is selected from phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, maleic anhydride, hydrogenated phthalic anhydride, nadic anhydride or styrene-maleic anhydride.

[0070] The phenolic compound is selected from bisphenol A novolac resin, phenol novolac resin, naphthalene-type novolac resin, biphenyl-phenol-type novolac resin, biphenyl-phenol-type naphthol resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin, naphthol aralkyl resin or trimethylolmethane resin.

[0071] The active ester compound is selected from the compound shown in the following structural formula (2):

[0072] Wherein, X is phenyl or naphthyl; j is 0 or 1; k is 0 or 1; and n represents a repeating unit and is 0.25 to 1.25.

[0073] Preferably, the curing agent is at least one of the following structures:

[0074] R 11 is a methyl group, and n is an integer from 1 to 10;

[0075] kz is an integer from 1 to 10;

[0076] n is an integer from 1 to 10;

[0077] p is an integer from 1 to 10, R 3 and R 4 It is a C1~C5 alkyl group.

[0078] Furthermore, the resin composition further comprises 0.01 to 5 parts by weight of a catalyst, wherein the catalyst is at least one of an imidazole catalyst, a pyridine catalyst, and an organic metal salt catalyst. Preferably, the catalyst is at least one of 4-dimethylaminopyridine, 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole, and zinc octoate.

[0079] Furthermore, the resin composition further comprises 5-50 parts by weight of an elastomer, and the elastomer is selected from at least one of styrene elastomers, methacrylate elastomers, and silicone elastomers.

[0080] Furthermore, the resin composition includes a filler, the content of which is 20 to 80 parts by weight based on 100 parts by weight of the resin composition. The filler includes an inorganic filler, an organic filler, and a composite filler. The inorganic filler is selected from at least one of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder. The organic filler is selected from at least one of polytetrafluoroethylene powder, polyphenylene sulfide powder, and polyethersulfone powder.

[0081] Preferably, the filler is spherical silica, alumina or aluminum hydroxide, more preferably spherical silica.

[0082] Furthermore, the filler is surface treated with a silane coupling agent, wherein the silane coupling agent is at least one of an aminosilane coupling agent, a carbon-carbon double bond-containing silane coupling agent, or an epoxysilane coupling agent. Preferably, the silane coupling agent is selected from the following structures:

[0083] The brands are KBM-573 manufactured by Shin-Etsu Chemical Co., Ltd. and Z-6883 manufactured by Dow Corning Corporation;

[0084] The brand is KBM-1003 manufactured by Shin-Etsu Chemical Co., Ltd.

[0085] The brand is KBM-1403 manufactured by Shin-Etsu Chemical Co., Ltd.

[0086] Furthermore, the resin composition also includes a silane coupling agent and a dispersant, the silane coupling agent is an epoxy silane coupling agent, the dispersant is a phosphate or / and modified polyurethane, and the weight ratio of the silane coupling agent to the dispersant is 2:1 to 10:1.

[0087] Furthermore, the resin composition also includes a flame retardant, which contains 5 to 50 parts by weight of the flame retardant based on 100 parts by weight of the resin composition. The flame retardant is selected from brominated flame retardants, phosphorus flame retardants, nitrogen flame retardants, silicone flame retardants, organic metal salt flame retardants, etc.

[0088] Preferably, the flame retardant is selected from phosphazene with the brand name SPB-100 manufactured by Otsuka Chemical Co., Ltd. of Japan; modified phosphazenes with the brands BP-PZ, PP-PZ, SPCN-100, SPV-100 and SPB-100L.

[0089] Furthermore, a dye may be added to the resin composition, which may be a fluorescent dye or a black dye. The fluorescent dye may be a pyrazoline compound, and the black dye may be a liquid or powdered carbon black, a pyridine complex, an azo complex, a quinone compound, zirconium nitride, titanium oxide, titanium nitride, black talc, cobalt chromium metal oxide, azine or phthalocyanine.

[0090] The present invention also provides applications of the resin composition in prepregs, laminates, insulating films, insulating boards, circuit substrates, and electronic devices, as specifically described below:

[0091] The present invention also provides a prepreg, comprising a reinforcing material and the aforementioned resin composition. The prepreg is prepared by dissolving the resin composition in a solvent to prepare a glue solution, then immersing the reinforcing material in the glue solution, taking out the immersed reinforcing material and baking it at 100 to 180° C. for 1 to 15 minutes; and after drying, the prepreg is obtained.

[0092] The solvent is selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0093] The reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics. Preferably, the reinforcing material is glass fiber cloth; preferably, open fiber cloth or flat cloth is used as the reinforcing material; and preferably, the glass fiber cloth is E glass fiber cloth, S glass fiber cloth, or Q glass fiber cloth.

[0094] In addition, when glass fiber cloth is used as the reinforcing material, the glass fiber cloth is chemically treated with a coupling agent to improve the interface bonding between the resin composition and the glass fiber cloth. The coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent to provide good water resistance and heat resistance.

[0095] An embodiment of the present invention further provides a laminate comprising a piece of the aforementioned prepreg and a metal foil disposed on at least one surface of the prepreg; or comprising a composite sheet formed by overlapping a plurality of the aforementioned prepregs and a metal foil disposed on at least one surface of the composite sheet.

[0096] The laminate is produced by coating one or both sides of a prepreg with metal foil, or by stacking at least two prepregs to form a composite sheet, coating one or both sides with metal foil, and then hot pressing to form a metal foil laminate. The hot pressing conditions are: 0.2-2 MPa, 150-250°C, 2-4 hours.

[0097] Preferably, the metal foil is selected from copper foil or aluminum foil. The thickness of the metal foil is 5 microns, 8 microns, 12 microns, 18 microns, 35 microns or 70 microns.

[0098] An embodiment of the present invention further provides an insulating board comprising at least one of the aforementioned prepregs.

[0099] An embodiment of the present invention further provides an insulating film, comprising a carrier film and the aforementioned resin composition coated thereon, wherein the thermal index of the insulating film is significantly improved.

[0100] The insulating film is prepared by the following method: the resin composition is dissolved in a solvent to prepare a glue solution, the glue solution is then coated on a carrier film, and the carrier film coated with the glue solution is heated and dried to obtain the insulating film.

[0101] The aforementioned solvent is selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0102] The carrier film is selected from at least one of PET film, PP film, PE film and PVC film.

[0103] An embodiment of the present invention further provides a circuit substrate, comprising one or more of the aforementioned prepreg, laminate, insulating plate, and insulating film.

[0104] An embodiment of the present invention further provides an electronic device comprising the aforementioned circuit substrate. Since the heat resistance of the circuit substrate is greatly improved, the safety of the electronic device is significantly improved.

[0105] The technical solution of the present application is further illustrated below with reference to some specific synthesis examples and comparative examples.

[0106] Synthesis Example 1: Modified bismaleimide prepolymer Y1

[0107] Step 1: Add 200 g of bismaleimide resin (BMI-2300, manufactured by Yamato Chemical), 20 g of double-bond silicone resin (X-22-164A, manufactured by Shin-Etsu Chemical, with a double bond equivalent of 860 g / mol), 3 g of aminophenol and an appropriate amount of organic solvent into a beaker, and react at 80° C. for 70 min to obtain a pre-reactant;

[0108] Step 2: Raise the temperature to 110° C., add 30 g of hydrocarbon resin (Caoda B3000), and continue the reaction at 110° C. for 30 min to obtain a modified bismaleimide prepolymer Y1.

[0109] Synthesis Example 2: Modified bismaleimide prepolymer Y2

[0110] Step 1: Add 200 g of bismaleimide resin (NIPPON KAYAKU, MIR-3000), 30 g of double bond-containing silicone resin (Shin-Etsu Chemical, X-22-164A, double bond equivalent of 860 g / mol), 3 g of aminophenol and an appropriate amount of organic solvent into a beaker, and react at 90 ° C for 60 min to obtain a pre-reactant;

[0111] Step 2: Raise the temperature to 120° C., add 45 g of hydrocarbon resin (Caoda B2000), and continue the reaction at 120° C. for 30 min to obtain a modified bismaleimide prepolymer Y2.

[0112] Synthesis Example 3: Modified bismaleimide prepolymer Y3

[0113] Step 1: Add 200 g of bismaleimide resin (NIPPON KAYAKU, MIR-3000), 30 g of double bond-containing silicone resin (Shin-Etsu Chemical, X-22-164A, double bond equivalent of 860 g / mol), 3 g of aminophenol and an appropriate amount of organic solvent into a beaker, and react at 90 ° C for 60 min to obtain a pre-reactant;

[0114] Step 2: Raise the temperature to 120° C., add 45 g of epoxy-modified hydrocarbon resin (Caoda JP-100), and continue the reaction at 120° C. for 30 min to obtain modified bismaleimide prepolymer Y3.

[0115] Comparative Synthesis Example 1: Modified Bismaleimide Prepolymer Y4

[0116] Add 200 g of bismaleimide resin (BMI-2300, manufactured by Yamato Chemical), 20 g of double-bond-containing silicone resin (X-22-164A, manufactured by Shin-Etsu Chemical, double bond equivalent of 860 g / mol) and an appropriate amount of organic solvent to a beaker, and react at 110°C for 120 min to obtain pre-reactant Y4.

[0117] Comparative Synthesis Example 2: Modified Bismaleimide Prepolymer Y5

[0118] 200 g of bismaleimide resin (BMI-2300, manufactured by Yamato Chemical Industry Co., Ltd.), 40 g of hydrocarbon resin (Soda B3000) and an appropriate amount of organic solvent were added to a beaker and reacted at 110° C. for 120 min to obtain a pre-reactant Y5.

[0119] According to the data in Table 1, the corresponding solid substances were weighed, and the glue solution of each weighed solid substance was adjusted to a solid content of 60% by solvent. The glue solution was applied to E glass fiber cloth, and after soaking, it was taken out and placed in a 160°C forced air drying oven and baked for 3 to 6 minutes to make a semi-cured sheet.

[0120] The prepreg was cut to 300 × 300 mm, and an electrolytic copper foil was placed on each side of the prepreg. The sheets were stacked into a certain structure and then sent into a vacuum press to be pressed to obtain a metal foil laminate (or copper clad laminate). The specific performance tests are shown in Table 2.

[0121] Table 1 Resin composition ingredients

[0122]

[0123] Table 2 Performance table

[0124]

[0125] Performance tests were performed on the prepregs and copper-clad laminates prepared in all of Examples 1 to 3 and Comparative Examples 1 to 2.

[0126] 1) Glass transition temperature was determined by TMA (thermomechanical analysis) at a heating rate of 10°C / min;

[0127] 2) Dk and Df: measured at 10 GHz using the flat plate method in accordance with IPC-TM-650 2.5.5.9;

[0128] 3) X / Y coefficient of thermal expansion (CTE): TMA (thermomechanical analysis) was used with a heating rate of 10°C / min and a test temperature range of 30-100°C.

[0129] 4) Sub-surface defects: Use the standard test method specified in IPC-TM-650 to determine whether there are defects such as dried flowers and white lines in the substrate by visual inspection or sectioning.

[0130] 5) PCT 2HR Water Absorption: Three samples (10 cm x 10 cm, 0.40 mm thick, with the metal foil removed from both sides) were dried at 100°C for 2 hours and weighed (W1). The samples were then cooked in a pressure cooker at 121°C and 2 atm for 2 hours. The weight was then weighed (W2). The water absorption was determined as (W2 - W1) / W1 × 100%.

[0131] It can be seen from the above experimental data that Examples 1 to 3 have excellent high Tg, low dielectric constant and dielectric loss and low CTE values. Among them, Example 1 has a higher Tg value and low Dk / Df than Comparative Example 1, and Example 2 has a higher Tg value than Comparative Example 2, and the CTE and water absorption rate are significantly reduced.

[0132] It should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation method can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0133] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A modified bismaleimide prepolymer, characterized in that: It is prepared by reacting a bismaleimide compound, a double-bond-containing silicone resin and a hydrocarbon resin, wherein the double-bond-containing silicone resin contains the following structure: ; wherein R and R' are C1~C5 alkyl groups, and m is an integer from 1 to 30; The modified bismaleimide prepolymer is prepared by the following reaction: The bismaleimide compound and the double-bond-containing silicone resin are reacted at 50-90° C. for 30-120 minutes to obtain a pre-reactant; a hydrocarbon resin is added to the pre-reactant and reacted at 90-130° C. for 30-150 minutes to obtain the modified bismaleimide prepolymer.

2. The modified bismaleimide prepolymer according to claim 1, characterized in that The double bond-containing silicone resin is represented by the following structural formula (1): Structural formula (1), Wherein, R and R' are C1-C5 alkyl groups, R'' is C1-C5 alkylene group, and n is an integer of 1-30.

3. The modified bismaleimide prepolymer according to claim 1, characterized in that The hydrocarbon resin contains anhydride groups, epoxy groups or hydroxyl groups.

4. A resin composition, characterized in that By weight, it includes the following components: (a) modified bismaleimide prepolymer: 30-100 parts; (b) epoxy resin: 5-50 parts; (c) Curing agent: 2-50 parts; Wherein, the modified bismaleimide prepolymer is the modified bismaleimide prepolymer according to any one of claims 1 to 3.

5. The resin composition according to claim 4, characterized in that The epoxy resin is at least one of the following structures: Structural formula (2); Structural formula (3); Structural formula (4); Structural formula (5); Structural formula (6); The numbers of repeating units p, n, and m in the structural formulas (2) to (6) are integers ranging from 1 to 10.

6. The resin composition according to claim 4, characterized in that The curing agent is selected from at least one of amine compounds, amide compounds, acid anhydride compounds, phenol compounds, cyanate compounds, and active ester compounds.

7. The resin composition according to claim 6, characterized in that The curing agent is at least one of the following structures: Structural formula (7), R 11 is a methyl group, and n is an integer from 1 to 10; Structural formula (8), kz is an integer from 1 to 10; Structural formula (9), n is an integer from 1 to 10; Structural formula (10), p is an integer from 1 to 10, R 3 and R 4 It is a C1~C5 alkyl group.

8. The resin composition according to claim 4, characterized in that The resin composition further comprises a filler, wherein the filler content is 20 to 80 parts by weight based on 100 parts by weight of the resin composition; The fillers include inorganic fillers, organic fillers, and composite fillers, wherein the inorganic fillers are selected from at least one of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder, and the organic fillers are selected from at least one of polytetrafluoroethylene powder, polyphenylene sulfide powder, and polyethersulfone powder.

9. The resin composition according to claim 8, characterized in that The filler is surface treated with a silane coupling agent, wherein the silane coupling agent is selected from the following structures: Structural formula (11); Structural formula (12); Structural formula (13).

10. Use of the resin composition according to any one of claims 4 to 9 in prepregs, laminates, insulating films, insulating boards, copper-clad boards, circuit substrates and electronic devices.

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