A laser chip automatic test equipment

Abstract

The application discloses a kind of laser chip automatic test equipment, comprising: pedestal, the main body platform of this device, the upper end of the pedestal is equipped with dust cover;The upper surface of the pedestal is fixedly installed with wafer placement table, high temperature detection table, normal temperature detection table, detection mechanism, classification placement table, transfer detection table by rivet, the high temperature detection table is arranged at the left side of the wafer placement table, the normal temperature detection table is arranged at the left side of the high temperature detection table, the classification placement table is arranged at the left side of the normal temperature detection table, the detection mechanism is located at the front end of the normal temperature detection table and the high temperature detection table, and the detection mechanism is provided with two groups;The detection device for laser chip can utilize three groups of detection platforms to detect laser chip under high temperature and normal temperature, so as to more accurately detect the physical quality of laser chip, and also has quite high detection efficiency, can satisfy the rapid detection demand of large quantities of laser chip.

Description

Technical Field

[0001] This invention relates to the field of laser chip testing technology, specifically to an automated testing device for laser chips. Background Technology

[0002] With the increasing demand for the Internet and multimedia communication, and the continuous advancement of technology, the hardware requirements for various networks are also increasing. Fiber optic communication, with its high bandwidth and low latency, is gradually being applied to fields such as network communication. The development of optoelectronic devices, including laser chips, is also maturing. However, due to limitations in the manufacturing process, laser chips may exhibit different qualities during production. Therefore, testing equipment is needed to test the quality of laser chips.

[0003] As disclosed in application number CN2021215581 16, this invention discloses an automatic chip testing device, comprising: a testing platform with multiple testing modules arrayed on it; a loading and unloading mechanism located on the side of the testing platform for placing chip trays; a shuttle mechanism with one inlet / outlet end located at the loading and unloading mechanism and the other inlet / outlet end located at the testing modules; a loading and unloading head mechanism located above the loading and unloading mechanism; and a testing head mechanism located above the testing platform. This invention replaces manual labor with automated testing, employing a shuttle mechanism with two loading platforms that alternately reciprocate to meet the platform's high-speed and high-efficiency requirements, thereby improving the overall efficiency of the platform. It not only provides precise positioning but also significantly improves testing efficiency, supporting simultaneous loading, unloading, and testing of multiple chip groups.

[0004] The laser chip detection devices described above still have the following shortcomings:

[0005] Since laser chips need to operate in a high-temperature environment, their temperature resistance directly affects their performance level. Existing devices cannot meet the requirements for laser chip testing at high temperatures.

[0006] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and proposed an automatic testing device for laser chips in order to achieve a more practical purpose. Summary of the Invention

[0007] The purpose of this invention is to provide an automated testing device for laser chips to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: an automatic testing device for laser chips, comprising:

[0009] The base is the main platform of this device, and a dust cover is provided on the upper end of the base;

[0010] The upper surface of the base is fixedly mounted with the following components by rivets: a wafer placement stage, a high-temperature detection stage, a room-temperature detection stage, a detection mechanism, a sorting and placement stage, and a transfer detection stage. The high-temperature detection stage is located to the left of the wafer placement stage, the room-temperature detection stage is located to the left of the high-temperature detection stage, and the sorting and placement stage is located to the left of the room-temperature detection stage. The detection mechanism is located at the front end of the room-temperature detection stage and the high-temperature detection stage, and there are two sets of the detection mechanism. The transfer detection stage is located behind the wafer placement stage, the high-temperature detection stage, the room-temperature detection stage, and the sorting and placement stage. A detection probe is fixedly mounted on the front of the transfer detection stage by screws. The detection probe extends to the upper end of the wafer placement stage, the high-temperature detection stage, and the room-temperature detection stage, and there are three sets of the detection probe.

[0011] Preferably, the four corners of the base surface are fixed with casters and positioning feet by screws.

[0012] Preferably, the outer side of the dust cover is provided with an operation panel and an opening / closing door.

[0013] Preferably, the wafer placement stage includes: a platform rotation mechanism, a transverse slide, a transverse sliding motor, a longitudinal slide, a longitudinal drive motor, a longitudinal sliding platform, and a die-expanding disk. The platform rotation mechanism serves as the connection mechanism between the wafer placement stage and the base. The transverse slide is fixedly mounted on the upper end of the platform rotation mechanism. The longitudinal slide is slidably mounted on the upper end of the transverse slide, forming a sliding structure with the transverse slide. The transverse sliding motor is fixedly mounted on the outer side of the transverse slide and connected to the longitudinal slide via a synchronous belt. The longitudinal sliding platform is slidably mounted on the upper end of the longitudinal slide, forming a sliding structure with the longitudinal slide. The longitudinal drive motor is located on the outer side of the longitudinal sliding platform and connected to the longitudinal sliding platform via a synchronous belt. The die-expanding disk is fixedly mounted on the upper end of the longitudinal sliding platform.

[0014] Preferably, the inner side of the high-temperature testing platform is provided with: a first rotary motor and a first rotating wheel, wherein the first rotating wheel and the first rotating wheel are connected by a synchronous belt, a high-temperature placement platform is provided at the upper end of the first rotating wheel, and a first laser rangefinder and a first straightness measuring device are also provided at the upper end of the high-temperature testing platform. The first laser rangefinder is located at the rear side of the high-temperature placement platform, and the first straightness measuring device is installed at the upper end of the first laser rangefinder.

[0015] Preferably, the inner side of the ambient temperature testing platform is provided with a second rotary motor and a second rotating wheel, wherein the second rotating wheel is connected to the second rotating wheel by a synchronous belt, and the upper end of the second rotating wheel is provided with an ambient temperature cone placement platform. The ambient temperature testing platform is also provided with a second laser rangefinder and a second straightness measuring device. The second laser rangefinder is located on the rear side of the ambient temperature cone placement platform, and the second straightness measuring device is installed on the upper end of the second laser rangefinder.

[0016] Preferably, the detection mechanism further includes: a detection support frame as the main support component of the detection mechanism; a lifting driver and a chip detection head are fixedly installed at the upper end of the detection mechanism; the chip detection head and the detection support frame are connected by a sliding connection; and the chip detection head is provided with detection probes, with two sets of detection probes in total.

[0017] Preferably, the upper surface of the sorting and placing platform is slidably provided with multiple sets of sliding platforms, and the inner side of the sorting and placing platform is provided with a sliding motor and a transmission roller. The output shaft of the sliding motor is connected to the transmission roller through a synchronous belt, and the transmission roller is connected to the sliding platform through a synchronous belt.

[0018] Preferably, the transfer and testing platform is provided with a longitudinal sliding plate, and two sets of longitudinal sliding plates are arranged longitudinally. A unidirectional extraction device and a bidirectional extraction device are slidably arranged on the longitudinal sliding plate. The unidirectional extraction device extends to the front end of the transfer and testing platform. A lifting device is provided inside the unidirectional extraction device. An extraction head is provided below the lifting device. The bidirectional extraction device has a similar structure to the unidirectional extraction device, but the lifting device of the bidirectional extraction device is provided with two sets of extraction heads. The transfer and testing platform is also provided with two sets of sliding drive motors. The sliding drive motors correspond one-to-one with the longitudinal sliding plates. The sliding drive motors are connected to the unidirectional extraction device and the bidirectional extraction device through a synchronous belt.

[0019] Compared with the prior art, the beneficial effects of the present invention are: the detection device for laser chips can use three sets of detection platforms to detect laser chips at high temperature and room temperature, thereby more accurately detecting the quality of laser chips, and also has a high detection efficiency, which can meet the rapid detection needs of large batches of laser chips.

[0020] 1. The high-temperature testing station can generate a certain temperature to simulate the operation of the chip at high temperature. At the same time, the probe of the testing mechanism will extend to the chip to detect and inspect it. Meanwhile, the detection probe is above to monitor the chip from another angle. The high-temperature testing station can be driven by the first rotating motor to make the high-temperature placement platform carrying the chip rotate continuously to meet the monitoring needs of multiple angles.

[0021] 2. With the wafer placement stage, sorting stage, and transfer inspection stage, staff only need to place the chip to be inspected on the wafer placement stage. The wafer placement stage will automatically track the chip position and pick up and inspect the chip through the one-way and two-way extraction devices of the transfer inspection stage. Finally, the chip is transported to the sorting stage, thus quickly completing the chip inspection and stacking work. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall three-dimensional isometric structure of the present invention;

[0023] Figure 2 This is an isometric structural diagram of the present invention after the dust cover has been removed;

[0024] Figure 3 This is an isometric structural diagram of the wafer placement stage portion of the present invention;

[0025] Figure 4 This is an isometric structural diagram of the high-temperature testing station and the room-temperature testing station of the present invention.

[0026] Figure 5 This is a schematic diagram of the isometric structure of the detection mechanism of the present invention;

[0027] Figure 6 This is an isometric structural diagram of the classification and placement platform of the present invention;

[0028] Figure 7 This is an isometric structural diagram of the transfer and testing platform of the present invention.

[0029] In the diagram: 1. Base; 11. Casters; 12. Positioning feet; 2. Dust cover; 21. Control panel; 22. Opening door; 3. Wafer placement stage; 31. Platform rotation mechanism; 32. Horizontal slide; 33. Horizontal sliding motor; 34. Vertical slide; 35. Vertical drive motor; 36. Vertical sliding platform; 37. Die-expanding disk; 4. High-temperature testing stage; 41. First rotary motor; 42. First rotating wheel; 43. High-temperature placement stage; 44. First laser rangefinder; 45. First straightness meter; 5. Room temperature testing stage; 51. Second rotary... 52. Motor; 53. Second rotating wheel; 54. Room temperature cone placement stage; 55. Second laser rangefinder; 6. Second straightness measuring device; 7. Detection mechanism; 81. Detection support frame; 92. Lifting driver; 103. Chip detection head; 11. Detection probe; 12. Classification placement stage; 13. Sliding platform; 14. Sliding motor; 15. Transmission roller; 16. Transfer detection stage; 17. Longitudinal sliding plate; 18. Sliding drive motor; 19. Unidirectional extraction device; 104. Lifting device; 11. Extraction head; 12. Bidirectional extraction device; 13. Detection probe. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see Figure 1-7 An automatic testing device for laser chips includes: a base 1, which is the main platform of the device, and a dust cover 2 is provided on the upper end of the base 1; the upper surface of the base 1 is fixedly mounted with: a wafer placement stage 3, a high-temperature testing stage 4, a room-temperature testing stage 5, a testing mechanism 6, a sorting and placement stage 7, and a transfer testing stage 8 by rivets. The high-temperature testing stage 4 is located to the left of the wafer placement stage 3, the room-temperature testing stage 5 is located to the left of the high-temperature testing stage 4, the sorting and placement stage 7 is located to the left of the room-temperature testing stage 5, the testing mechanism 6 is located at the front end of the room-temperature testing stage 5 and the high-temperature testing stage 4, and two sets of the testing mechanism 6 are provided; the transfer testing stage 8 is located behind the wafer placement stage 3, the high-temperature testing stage 4, the room-temperature testing stage 5 and the sorting and placement stage 7, and a testing probe 9 is fixedly mounted on the front of the transfer testing stage 8 by screws. The testing probe 9 extends to the upper end of the wafer placement stage 3, the high-temperature testing stage 4 and the room-temperature testing stage 5, and three sets of the testing probe 9 are provided. The base 1 has casters 11 and positioning feet 12 fixed to its four corners with screws, allowing for quick position adjustment as needed on site. The dust cover 2 has an operation panel 21 and an opening / closing door 22 on its outer side, providing ample protection for the internal testing equipment and allowing for equipment adjustments via the operation panel 21.

[0032] Please see Figure 3An automated testing device for laser chips includes a wafer placement stage 3 comprising a platform rotation mechanism 31, a transverse slide 32, a transverse sliding motor 33, a longitudinal slide 34, a longitudinal drive motor 35, a longitudinal sliding platform 36, and a die expansion disk 37. The platform rotation mechanism 31 serves as the connection mechanism between the wafer placement stage 3 and a base 1. The transverse slide 32 is fixedly mounted on the upper end of the platform rotation mechanism 31. The longitudinal slide 34 is slidably mounted on the upper end of the transverse slide 32, forming a sliding structure between the longitudinal slide 34 and the transverse slide 32. The transverse sliding motor 33 is fixedly mounted on the outer side of the transverse slide 32, and the transverse sliding motor 33 is connected to the longitudinal slide... The components 34 are connected by a synchronous belt. The longitudinal sliding platform 36 is slidably mounted on the upper end of the longitudinal sliding platform 34, forming a sliding structure with the longitudinal sliding platform 36 and the longitudinal sliding platform 34. The longitudinal drive motor 35 is located on the outside of the longitudinal sliding platform 36, and the longitudinal drive motor 35 is connected to the longitudinal sliding platform 36 by a synchronous belt. The expansion disk 37 is fixedly mounted on the upper end of the longitudinal sliding platform 36. Based on the working principle of the expansion disk 37, the chip can be preliminarily inspected. When the entire board of chips is placed on the expansion disk 37, the position of the expansion disk 37 can be adjusted according to the inspection data, thereby facilitating the extraction head 85 to extract the chip.

[0033] Please see Figure 4-5 An automatic testing device for laser chips includes: a first rotary motor 41 and a first rotating wheel 42 are arranged on the inner side of a high-temperature testing platform 4, wherein the first rotating wheel 42 is connected to the first rotating wheel 42 by a synchronous belt, a high-temperature placement platform 43 is provided on the upper end of the first rotating wheel 42, and a first laser rangefinder 44 and a first straightness measuring device 45 are also provided on the upper end of the high-temperature testing platform 4. The first laser rangefinder 44 is located on the rear side of the high-temperature placement platform 43, and the first straightness measuring device 45 is installed on the upper end of the first laser rangefinder 44. The inner side of the ambient temperature testing platform 5 is equipped with a second rotary motor 51 and a second rotating wheel 52, which are connected to each other by a synchronous belt. An ambient temperature cone placement platform 53 is located at the upper end of the second rotating wheel 52. A second laser rangefinder 54 and a second straightness meter 55 are also mounted on the ambient temperature testing platform 5. The second laser rangefinder 54 is located behind the ambient temperature cone placement platform 53, and the second straightness meter 55 is mounted on top of the second laser rangefinder 54. The testing mechanism 6 also includes a testing support frame 61, which is the main supporting component of the testing mechanism 6. A lifting driver 62 and a chip detection head 63 are fixedly mounted on the upper end of the testing mechanism 6. The chip detection head 63 is slidably connected to the testing support frame 61. Two sets of detection probes 64 are provided on the chip detection head 63. The high temperature testing platform 4 and the ambient temperature testing platform 5 can simulate chip testing conditions at high and ambient temperatures, and both can allow the chip to rotate at multiple angles, thus facilitating the detection of more comprehensive and detailed test data.

[0034] Please see Figure 6-7 An automatic testing device for laser chips includes: a sorting and placement table 7 with multiple sets of sliding platforms 71 slidably disposed on its upper surface; a sliding motor 72 and a transmission roller 73 disposed on the inner side of the sorting and placement table 7; the output shaft of the sliding motor 72 is connected to the transmission roller 73 via a synchronous belt; and the transmission roller 73 is connected to the sliding platform 71 via a synchronous belt. According to the different quality grades of the chips, multiple sets of different sliding platforms 71 are set up, so that chips of different quality can be sorted and stacked by means of test data, and the sorting work can be completed. The transfer and testing platform 8 is equipped with a longitudinal sliding plate 81, with two sets of longitudinally arranged sliding plates 81. A unidirectional extraction device 83 and a bidirectional extraction device 86 are slidably mounted on the longitudinal sliding plate 81. The unidirectional extraction device 83 extends to the front end of the transfer and testing platform 8, and a lifting device 84 is provided inside the unidirectional extraction device 83. An extraction head 85 is provided below the lifting device 84. The bidirectional extraction device 86 has a similar structure to the unidirectional extraction device 83, but the lifting device 84 of the bidirectional extraction device 86 is equipped with two sets of extraction heads 85. The transfer and testing platform 8 is also equipped with two sets of sliding drive motors 82, which correspond one-to-one with the longitudinal sliding plates 81. The sliding drive motors 82 are connected to the unidirectional extraction device 83 and the bidirectional extraction device 86 through a synchronous belt. The unidirectional extraction device 83 can accurately place the tested chips on the placement platform, while the bidirectional extraction device 86 can complete the transfer of chips between different testing platforms with higher efficiency, thereby effectively improving the testing efficiency of the equipment.

[0035] In summary: The device uses the base 1 as the main platform, the dust cover 2 protects the working equipment, and the operation panel 21 can also control the equipment to a certain extent. The chip to be tested can be placed in through the opening and closing door 22.

[0036] The wafer placement stage 3 is used to place the chip to be tested and also performs preliminary testing on the wafer placement stage 3. The transfer and testing stage 8 has a one-way extraction device 83 and a two-way extraction device 86, which can extract the chip for movement. The testing probe 9 can test the chip. The high-temperature testing stage 4 is used to test the chip's properties at high temperatures, and the room-temperature testing stage 5 can test the chip's properties at room temperature. All tests are completed by the testing mechanism 6. Finally, the chip is transported to the sorting and placement stage 7, and based on the chip's quality, it is placed on different sliding platforms 71.

[0037] The wafer placement stage 3 can be rotated by the platform rotation mechanism 31 to adjust the chip stacking angle. The vertical slide 34 can slide on the horizontal slide 32 and is driven by the horizontal sliding motor 33. The vertical sliding platform 36 slides on the vertical sliding platform 36 under the drive of the vertical drive motor 35. The expansion disk 37 can place chips to facilitate detection by the detection probe 9.

[0038] The high-temperature testing platform 4 is driven by the first rotating wheel 42 through the first rotating motor 41, which causes the high-temperature placement platform 43 to rotate at multiple angles. The high-temperature placement platform 43 is used to place the chip to be tested. The first laser rangefinder 44 is used to locate the chip position. The angle and position of the chip are tracked by the first straightness measuring device 45.

[0039] The structure and principle of the ambient temperature testing station 5 are similar to those of the high temperature testing station 4. It can drive the second rotating wheel 52 through the second rotary motor 51 to make the ambient temperature cone placement stage 53 rotate. At the same time, the second laser rangefinder 54 locates the chip position, and the chip angle is tracked by the second straightness measuring device 55.

[0040] The testing mechanism 6 is supported by the testing support frame 61. The lifting driver 62 can drive the chip testing head 63 to move. The testing probe 64 can extend to the high temperature placement stage 43 and the normal temperature cone placement stage 53 to perform testing.

[0041] The transfer and testing station 8 has two sets of longitudinal sliding plates 81. The first set travels between the wafer placement stage 3 and the ambient temperature testing stage 5. The bidirectional extraction device 86 moves through this set of longitudinal sliding plates 81. The second set travels between the ambient temperature testing stage 5 and the sorting and placement stage 7. The unidirectional extraction device 83 moves through this set of longitudinal sliding plates 81. The sliding drive motor 82 can drive the bidirectional extraction device 86 and the unidirectional extraction device 83 to move laterally. The bidirectional extraction device 86 is slidably mounted on the first set of longitudinal sliding plates 81. The bidirectional extraction device 86 can drive the extraction head 85 to move up and down through the lifting device 84, and simultaneously extract two chips for displacement. The other set of unidirectional extraction devices 83 can transport the chips from the ambient temperature testing stage 5 to the sorting and placement stage 7 for stacking.

[0042] The sorting and placement table 7 has multiple sets of sliding platforms 71. The sliding motor 72 drives the transmission roller 73 to move the sliding platforms 71 back and forth, thereby sorting and stacking the chips, thus completing the entire process of using the device.

[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated testing device for laser chips, characterized in that, include: The base (1) is the main platform of this device, and the upper end of the base (1) is provided with a dust cover (2). The upper surface of the base (1) is fixedly mounted with the following components by rivets: a wafer placement stage (3), a high-temperature detection stage (4), a room-temperature detection stage (5), a detection mechanism (6), a sorting and placement stage (7), and a transfer detection stage (8). The high-temperature detection stage (4) is located to the left of the wafer placement stage (3), the room-temperature detection stage (5) is located to the left of the high-temperature detection stage (4), the sorting and placement stage (7) is located to the left of the room-temperature detection stage (5), and the detection mechanism (6) is located between the room-temperature detection stage (5) and the high-temperature detection stage (3). At the front end of the high temperature testing station (4), the testing mechanism (6) is provided in two sets; the transfer testing station (8) is located behind the wafer placement stage (3), the high temperature testing station (4), the room temperature testing station (5), and the sorting placement stage (7); the front of the transfer testing station (8) is fixedly installed with a testing probe (9) by screws; the testing probe (9) extends to the upper end of the wafer placement stage (3), the high temperature testing station (4), and the room temperature testing station (5); the testing probe (9) is provided in three sets. The transfer testing platform (8) is provided with a longitudinal sliding plate (81), and two sets of longitudinal sliding plates (81) are arranged longitudinally. A one-way extraction device (83) and a two-way extraction device (86) are slidably arranged on the longitudinal sliding plate (81). The one-way extraction device (83) extends to the front end of the transfer testing platform (8). A lifting device (84) is provided on the inner side of the one-way extraction device (83). An extraction head (85) is provided below the lifting device (84). The two-way extraction device (86) has a similar structure to the one-way extraction device (83), but the lifting device (84) of the two-way extraction device (86) is provided with two sets of extraction heads (85). The transfer testing platform (8) is also provided with two sets of sliding drive motors (82). The sliding drive motors (82) correspond one-to-one with the longitudinal sliding plates (81). The sliding drive motors (82) are connected to the one-way extraction device (83) and the two-way extraction device (86) through a synchronous belt.

2. The automatic testing equipment for laser chips according to claim 1, characterized in that, The four corners of the base (1) are fixed with casters (11) and positioning feet (12) by screws.

3. The automatic testing equipment for laser chips according to claim 1, characterized in that, The dust cover (2) is provided with an operation panel (21) and an opening and closing door (22) on the outside.

4. The automatic testing equipment for laser chips according to claim 1, characterized in that, The wafer placement stage (3) includes: a platform rotation mechanism (31), a horizontal slide (32), a horizontal sliding motor (33), a vertical slide (34), a vertical drive motor (35), a vertical sliding platform (36), and a die expansion disk (37). The platform rotation mechanism (31) is the connection mechanism between the wafer placement stage (3) and the base (1). The horizontal slide (32) is fixedly installed on the upper end of the platform rotation mechanism (31), and the vertical slide (34) is slidably installed on the upper end of the horizontal slide (32). The vertical slide (34) and the horizontal slide (32) form a sliding structure. The horizontal sliding motor... The motor (33) is fixedly installed on the outside of the transverse slide (32). The transverse sliding motor (33) is connected to the longitudinal slide (34) by a synchronous belt. The longitudinal sliding platform (36) is slidably installed on the upper end of the longitudinal slide (34). The longitudinal sliding platform (36) and the longitudinal slide (34) form a sliding structure. The longitudinal drive motor (35) is located on the outside of the longitudinal sliding platform (36). The longitudinal drive motor (35) and the longitudinal sliding platform (36) are connected by a synchronous belt. The expansion disk (37) is fixedly installed on the upper end of the longitudinal sliding platform (36).

5. The automatic testing equipment for laser chips according to claim 1, characterized in that, The high-temperature testing platform (4) is provided with a first rotary motor (41) and a first rotating wheel (42) on its inner side. The first rotating wheel (42) and the first rotating wheel (42) are connected by a synchronous belt. The upper end of the first rotating wheel (42) is provided with a high-temperature placement platform (43). The upper end of the high-temperature testing platform (4) is also provided with a first laser rangefinder (44) and a first straightness measuring device (45). The first laser rangefinder (44) is located on the rear side of the high-temperature placement platform (43), and the first straightness measuring device (45) is installed on the upper end of the first laser rangefinder (44).

6. The automatic testing equipment for laser chips according to claim 1, characterized in that, The inner side of the ambient temperature testing platform (5) is provided with a second rotary motor (51) and a second rotating wheel (52), wherein the second rotating wheel (52) and the second rotating wheel (52) are connected by a synchronous belt. The upper end of the second rotating wheel (52) is provided with an ambient temperature cone placement platform (53). The ambient temperature testing platform (5) is also provided with a second laser rangefinder (54) and a second straightness measuring device (55). The second laser rangefinder (54) is located on the rear side of the ambient temperature cone placement platform (53), and the second straightness measuring device (55) is installed on the upper end of the second laser rangefinder (54).

7. The automatic testing equipment for laser chips according to claim 1, characterized in that, The detection mechanism (6) further includes: a detection support frame (61) which is the main support component of the detection mechanism (6); a lifting driver (62) and a chip detection head (63) are fixedly installed on the upper end of the detection mechanism (6); the chip detection head (63) and the detection support frame (61) are connected by a sliding connection; the chip detection head (63) is provided with detection probes (64); and two sets of detection probes (64) are provided.

8. The automatic testing equipment for laser chips according to claim 1, characterized in that, The upper surface of the sorting and placement platform (7) is slidably provided with multiple sets of sliding platforms (71). The inner side of the sorting and placement platform (7) is provided with a sliding motor (72) and a transmission roller (73). The output shaft of the sliding motor (72) is connected to the transmission roller (73) through a synchronous belt. The transmission roller (73) is connected to the sliding platform (71) through a synchronous belt.

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