Container and substrate handling system

Abstract

A container for receiving a substrate type sensor is disclosed. The container includes: a main body having a receiving space opened at one side; a door selectively opening and closing the receiving space; a shelf member supporting the substrate type sensor in the receiving space; and a charging module charging the substrate type sensor supported by the shelf member, and the charging module includes a charging part moving between a standby position and a charging position for charging the substrate type sensor supported by the shelf member.

Description

Technical Field

[0001] The present disclosure relates to a container and a substrate processing system. Background Art

[0002] Plasma refers to an ionized gas including ions, radicals, and electrons. Plasma is generated by a very high temperature, a strong electric field, or a radio frequency (RF) electromagnetic field. A semiconductor device manufacturing process may include an etching process of removing a thin film formed on a substrate such as a wafer by using plasma. When ions and / or radicals of the plasma collide with or react with the thin film on the substrate, the etching process is performed.

[0003] An apparatus for processing a substrate by using plasma includes a processing chamber, a support chuck (e.g., ESC) that supports the substrate in the processing chamber and is connected to an RF power source, and a focusing ring that surrounds an outer periphery of the substrate disposed on the support chuck. The focusing ring is installed to distribute the plasma with high uniformity, and the focusing ring is etched with the substrate by the plasma. When the substrate is repeatedly etched, the focusing ring is also etched, so that the shape of the focusing ring is gradually changed. The direction in which ions and / or radicals are input to the substrate is changed according to the change in the shape of the focusing ring, and thus the etching characteristics of the substrate are changed. Therefore, when a specific number or more of substrates are etched or the shape of the focusing ring is changed to deviate from an allowable range, it is necessary to replace the focusing ring.

[0004] Generally, an operator exchanges the focusing ring by opening the processing chamber, taking out the used focusing ring from the opened processing chamber, and installing an unused focusing ring in the processing chamber. However, in the exchange scheme, a large amount of working time is consumed, and the possibility of introducing particles into the processing chamber is very high. Therefore, in recent years, an exchange scheme has been used in which a transfer robot of a substrate processing apparatus carries out the used focusing ring from the processing chamber and carries in a ring cassette, and then the transfer robot carries out a new focusing ring from the ring cassette and carries the focusing ring into the processing chamber.

[0005] Meanwhile, the focusing ring is transferred by a transfer robot that transfers the substrate. The transfer robot transfers the focusing ring to a specific position in the processing chamber. In addition, in order to identify whether the focusing ring is transferred to the specific position, the focusing ring is photographed by a vision wafer having a shape similar to the shape of the substrate. The vision wafer is driven while consuming electric power. A power supply device such as a battery is installed in the vision wafer, and it is necessary to charge the power supply device in the vision wafer.

[0006] Generally, a device for charging a vision wafer is not provided in a container that receives the vision wafer, such as a FOUP. Therefore, in order to charge the vision wafer, a charging component for charging the vision wafer is provided separately. When the vision wafer is located in the charging component, the charging component charges the vision wafer. However, since the charging component for the vision wafer is provided separately from the substrate processing equipment, several transfer sequences must be performed to transfer the vision wafer into the processing chamber. In addition, when a charging device for charging a vision wafer is installed in a container such as a FOUP, the charging device may collide with the transfer hand of the transfer robot that enters the container. SUMMARY OF THE INVENTION

[0007] Embodiments of the inventive concept provide a container that can effectively charge a substrate-type sensor, and a substrate processing system.

[0008] Embodiments of the inventive concept also provide a container and a substrate processing system that can minimize the collision between a charging module installed in the container and the hand of a transfer robot when the hand of the transfer robot enters the container.

[0009] Aspects of the present disclosure are not limited thereto, and other aspects not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0010] The present disclosure provides a container for receiving a substrate-type sensor. The container includes: a main body having a receiving space opened at one side; a door selectively opening and closing the receiving space; a shelf member supporting the substrate-type sensor in the receiving space; and a charging module charging the substrate-type sensor supported by the shelf member, and the charging module includes a charging component moving between a standby position and a charging position for charging the substrate-type sensor supported by the shelf member.

[0011] According to one embodiment, the charging module may include: a guiding component guiding the movement of the charging component in a direction parallel to one surface of the substrate-type sensor supported by the shelf member; a supporting component supporting the charging component while moving along the guiding component; and a driving component moving the supporting component in one direction.

[0012] According to one embodiment, the driving component may include: a driving source generating a driving force; and an arm connected to the charging component and moving the charging component in one direction by using the driving force.

[0013] According to one embodiment, the charging component may move in a region on the lower side of the substrate-type sensor supported by the shelf member.

[0014] According to an embodiment, a plurality of shelf members and a plurality of charging modules may be provided, and the charging modules may charge substrate-type sensors supported by the shelf members, respectively.

[0015] According to an embodiment, the container may further include: a first position sensor that detects whether a substrate-type sensor is placed on a shelf member; a second position sensor that detects the position of a charging member; and an open / close sensor that detects whether the receiving space is open or closed.

[0016] According to an embodiment, when the first position sensor detects that a substrate-type sensor is placed on a shelf member and the open / close sensor detects that the receiving space is closed by a door, the charging member may move to a charging position.

[0017] According to an embodiment, when the second position sensor detects that the charging member has completely moved to the charging position, the charging member may start charging the substrate-type sensor.

[0018] According to an embodiment, when it is detected that the substrate-type sensor is fully charged or when the open / close sensor detects that the receiving space is open, the charging member may move to a standby position.

[0019] The present disclosure provides a substrate processing system. The substrate processing system includes: a transfer member having a load port; a process execution member that receives a substrate from the transfer member and processes the substrate; and a container positioned in the load port and receiving a substrate-type sensor brought into the process execution member. The container further includes: a main body having a receiving space opened at one side; a door that selectively opens and closes the receiving space; a shelf member that supports the substrate-type sensor in the receiving space; and a charging module that charges the substrate-type sensor supported by the shelf member, and the charging module includes a charging member that moves between a first position and a second position, and the second position is closer to the one side than the first position.

[0020] According to an embodiment, the container may include: a first position sensor that detects whether a substrate-type sensor is placed on a shelf member; a second position sensor that detects the position of a charging member; and an open / close sensor that detects whether the receiving space is open or closed.

[0021] According to an embodiment, the substrate processing system may further include a controller, and the controller may control the charging module based on detection values detected by the first position sensor, the second position sensor, or the open / close sensor.

[0022] According to one embodiment, the controller may control the charging module based on the detected value such that the charging module is in a charging mode or a standby mode. The charging mode is for charging the substrate type sensor supported by the shelf member. In the standby mode, the charging member is located at a second position.

[0023] According to one embodiment, the controller may control the charging module such that when the first position sensor detects that the substrate type sensor is placed on the shelf member and the open / close sensor detects that the receiving space is closed by the door, the charging module is in the charging mode.

[0024] According to one embodiment, the controller may control the charging module such that when the substrate type sensor is fully charged, when the first position sensor detects that the substrate is not positioned on the shelf member, or when the open / close sensor detects that the receiving space is open, the charging module is in the standby mode.

[0025] According to one embodiment, the charging module may further include: a guiding member that guides the movement of the charging member in a direction parallel to one surface of the substrate type sensor supported by the shelf member; a supporting member that supports the charging member when moving along the guiding member; and a driving member that moves the supporting member in one direction.

[0026] According to one embodiment, the driving member may include: a driving source that generates a driving force; and an arm that is coupled to the charging member and moves the charging member in one direction by using the driving force.

[0027] The present disclosure provides a substrate processing system. The substrate processing system includes: a transfer member having a transfer robot and a loading port; a process execution member that receives a substrate from the transfer member and processes the substrate; and a container that is positioned in the loading port and receives the substrate type sensor brought into the process execution member. The container includes: a main body having a receiving space opened at one side; a door that selectively opens and closes the receiving space; a shelf member that supports the substrate type sensor in the receiving space; and a charging module that charges the substrate type sensor supported by the shelf member in a wireless charging scheme. The charging module includes a charging member that moves between a standby position and a charging position closer to the one side than the standby position and moves in a region below the substrate type sensor supported by the shelf member; a first position sensor that detects whether the substrate type sensor is placed on the shelf member; a second position sensor that detects the position of the charging member; and an open / close sensor that detects whether the receiving space is open or closed.

[0028] According to one embodiment, the driving member may include: a driving source that generates a driving force; and an arm that is coupled to the charging member and moves the charging member in one direction by using the driving force.

[0029] According to one embodiment, the substrate processing system may further include a controller, and the controller may generate a control signal for moving the charging member to a charging position when a first position sensor detects that a substrate type sensor is placed on a shelf member and an open / close sensor detects that a receiving space is closed by a door; may generate a control signal for causing the charging member to start charging the substrate type sensor when a second position sensor detects that the charging member has completely moved to the charging position; and may generate a control signal for moving the charging member to a standby position when it is detected that the substrate type sensor has been fully charged or when the open / close sensor detects that the receiving space is open. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other objects and features of the present disclosure will become apparent by describing embodiments in detail with reference to the accompanying drawings.

[0031] Figure 1 is a plan view schematically showing a substrate processing system according to an embodiment of the present disclosure;

[0032] Figure 2 shows Figure 1 a perspective view of the appearance of a first container;

[0033] Figure 3 shows a substrate Figure 2 received in the first container;

[0034] Figure 4 shows Figure 1 a plan sectional view of the appearance of a second container;

[0035] Figure 5 shows Figure 4 the appearance of a support slot;

[0036] Figure 6 shows a ring member Figure 4 received in the second container;

[0037] Figure 7 is a perspective view showing an example of a ring carrier for transporting a ring member;

[0038] Figure 8 is Figure 7 a plan view of the ring carrier;

[0039] Figure 9 shows Figure 8Enlarged view of a part of the ring bracket;

[0040] Figure 10 Schematically shows Figure 1 View of the appearance of the first transfer hand;

[0041] Figure 11 Shows the appearance where the substrate is positioned on Figure 10 the first transfer hand;

[0042] Figure 12 Shows the appearance where the ring member and the ring bracket are positioned on Figure 10 the first transfer hand;

[0043] Figure 13 Shows the appearance of the alignment unit provided in Figure 1 the alignment chamber;

[0044] Figure 14 and Figure 15 Shows the appearance where Figure 13 the alignment unit aligns the ring bracket;

[0045] Figure 16 Shows Figure 1 Planar sectional view of the appearance of the load lock chamber;

[0046] Figure 17 Shows the appearance where the substrate is positioned on Figure 16 the support shelf;

[0047] Figure 18 Shows the appearance where the ring member is positioned on Figure 16 the support shelf;

[0048] Figure 19 Shows the appearance where Figure 18 the ring bracket is taken out from the load lock chamber;

[0049] Figure 20 Shows Figure 1 View of the appearance of the second transfer hand;

[0050] Figure 21 Shows the appearance where the substrate is positioned on Figure 20 the second transfer hand;

[0051] Figure 22 Shows the appearance where the ring member is positioned on Figure 20 the second transfer hand;

[0052] Figure 23 Shows the appearance of the alignment unit provided in Figure 1View of a substrate processing apparatus in a processing chamber;

[0053] Figure 24 is a flowchart showing the order of positions of alignment ring members according to an embodiment of the present disclosure;

[0054] Figure 25 and Figure 26 is a view showing an appearance in which the center position of a ring member is detected by an image acquired by a substrate type sensor;

[0055] Figure 27 is showing Figure 1 cross-sectional view of a third container;

[0056] Figure 28 is when viewed from the top Figure 27 view of a charging module;

[0057] Figure 29 is a conceptual view showing a substrate type sensor charging system according to an embodiment of the present disclosure;

[0058] Figure 30 is showing a Figure 27 charging module in standby mode;

[0059] Figure 31 is a view showing a state in which a transfer hand enters a third container; and

[0060] Figure 32 is a view showing a Figure 27 charging module in charging mode. Detailed Description

[0061] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure pertains can easily implement the present disclosure. However, the present disclosure can be implemented in various different forms and is not limited to the embodiments to be described below. In addition, when describing the preferred embodiments of the present disclosure in detail, a detailed description of related known functions or configurations may be omitted when it unnecessarily obscures the essence of the present disclosure. In addition, throughout the drawings, the same reference numerals are used for components performing similar functions and operations.

[0062] The expression "including" some elements may mean that another element may be further included without being excluded, unless there is a particularly contradictory description. Specifically, the terms "including" and "having" are used to indicate the presence of features, numbers, steps, operations, elements, components, or combinations thereof described in the specification, and it can be understood that one or more other features, numbers, steps, operations, elements, components, or combinations thereof can be added.

[0063] Unless otherwise specified, terms in the singular form may include the plural form. In addition, in the drawings, the shapes and sizes of elements may be exaggerated for clearer description.

[0064] Terms such as first and second may be used to describe various elements, but these elements are not limited by the terms. These terms may be used only for the purpose of distinguishing one element from another. For example, without departing from the scope of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0065] When referring to an element "connected to" or "electrically connected to" another element, it should be understood that the first element may be directly connected or electrically connected to the second element, but a third element may be provided therebetween. On the other hand, when referring to an element "directly connected to" or "directly electrically connected to" another element, it should be understood that there is no third element therebetween. It should be understood that other expressions describing the relationship between elements, such as "between", "directly between", "adjacent", and "directly adjacent", may have the same purpose.

[0066] In addition, unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure pertains. Terms defined in a general dictionary should be understood to have a meaning consistent with the context of the related art, and should not be understood to have an ideal or overly formal meaning unless explicitly defined in the specification of the present disclosure.

[0067] Hereinafter, embodiments of the present disclosure will be described in detail with reference to Figures 1 to 25 Embodiments of the present disclosure will be described in detail.

[0068] Figure 1 is a view schematically showing a substrate processing system according to an embodiment of the present disclosure. Referring to Figure 1 , a substrate processing system according to an embodiment of the present disclosure may include a substrate processing apparatus 10, a container 20, and a ring carrier 30.

[0069] The container 20 according to an embodiment of the present disclosure may be positioned on the load port 110 of the substrate processing apparatus 10. The container 20 may be positioned on the load port 110 of the substrate processing apparatus 10 by an overhead hoist transport (OHT) device. Various articles may be received in the container 20. Depending on the type of the received articles, the container 20 may include various types of containers. The container 20 may be referred to as a FOUP or a POD.

[0070] For example, as Figure 2As shown, an object to be processed by the substrate processing apparatus 10 can be received in the first container 21, which is any one of the containers 20. The object to be processed can be a substrate "W", such as Figure 3 the wafer shown. In addition, a notch "N" can be formed in the substrate "W". In order to correctly process the substrate "W" with the substrate processing apparatus 10, it is necessary to accurately transfer the substrate "W" to a desired position of the substrate processing apparatus 10. The notch "N" formed in the substrate "W" is used to align the substrate "W" for accurate transfer of the substrate. Alignment of the substrate "W" can be performed by an alignment unit 200, which will be described later.

[0071] In addition, as Figure 4 shown, a consumable component that is mounted on the substrate processing apparatus 10 and is exchangeable can be received in the second container 22, which is the other of the containers 20. The consumable component can be a ring member "R", such as a focusing ring or a dielectric ring. The outer peripheral diameter of the ring member "R" can be larger than the outer peripheral diameter of the substrate "W". Therefore, the volume of the space in the second container 22 can be much larger than the volume of the space in the first container 21. In addition, when viewed from above, a plurality of support slots 22a and 22c for supporting the ring member "R" in the second container 22 can be provided at different positions. In addition, the support slots 22a and 22c can be provided at positions corresponding to the openings 32 formed in the ring carrier 30, which will be described below. This is because when the ring member "R" is taken out of the second container 22 by using the ring carrier 30, interference of the ring carrier 30 with the support slots 22a and 22c can be prevented.

[0072] In addition, as Figure 5 shown, alignment pins 22b can be formed in one or more (e.g., a plurality of) the support slots 22a among the support slots 22a and 22c. Figure 6 As shown, the alignment pins 22b can be inserted into alignment recesses "G" formed on the lower surface of the ring member "R". Importantly, the ring member "R" is transferred to an accurate position to correctly mount the ring member "R" to a desired position of the substrate processing apparatus 10. Importantly, the ring member "R" is positioned at the same position of the first transfer hand 152 (which will be described below) to transfer the ring member "R" to an accurate position. By restricting a change in the lateral position of the ring member "R", the alignment pins 22b can allow the ring member "R" to be positioned at the same position of the first transfer hand 152.

[0073] In addition, by inserting the alignment pin 22b into the alignment recess “G” formed on the lower surface of the ring member “R”, the operator can simply receive the ring member “R” at an accurate position in the second container 22. The position where the ring member “R” is received in the second container 22 may vary depending on the proficiency of the operator, but the alignment pin 22b can minimize the problem. In addition, the direction of the ring member “R” aligned by the alignment pin 22b can be aligned in the same direction. For example, the flat areas of the ring member “R” aligned by the alignment pin 22b can be aligned in the same direction. For example, since the ring member “R” is aligned in the same direction by the alignment pin 22b, it is not necessary to separately align the direction of the ring member “R” to position the ring member “R” on the ring bracket 30.

[0074] The ring bracket 30 according to an embodiment of the present disclosure can be used to transfer the ring member “R”. For example, the ring bracket 30 can be used to transfer the ring member “R” between the indexing chamber 130, the alignment chamber 170, and the load lock chamber 310, which will be described below. The ring bracket 30 can be received in the above-described container 20. For example, the ring bracket 30 can be received in the above-described second container 22. The ring bracket 30 can be received below the ring member “R” received in the second container 22. The ring bracket 30 received in the second container 22 can be received in the second container 22 while its direction is aligned. The ring bracket 30 can be used to enable the first transfer robot 150, which will be described below, to transfer the ring member “R”.

[0075] Figure 7 is a perspective view showing an example of a ring bracket for transferring a ring member. Figure 8 is Figure 7 a plan view of the ring bracket. Figure 9 is a view showing Figure 8 an enlarged view of a part of the ring bracket. Refer to Figures 7 to 9 , the ring bracket 30 according to an embodiment of the present disclosure can include a main body 31 and a guide member 34.

[0076] The main body 31 may have a placement surface on which the ring member “R” is positioned. The ring member “R” may be positioned on the upper surface of the main body 31. The main body 31 may have a plate shape. The main body 31 may have a disk shape. The main body 31 has a disk shape so that the operation of aligning the direction of the ring bracket 30 by the alignment unit 200 is the same as or at least similar to the operation of aligning the direction of the substrate “W”.

[0077] A baffle without holes can be provided in the central region of the main body 31. In addition, one or more openings 32 can be formed in the peripheral region of the main body 31. A plurality of openings 32 can be formed in the peripheral region of the main body 31. The openings 32 can extend from the upper surface of the main body 31 to the lower surface. That is to say, the openings 32 can penetrate the main body 31. The openings 32 can be formed in the peripheral region of the main body 31 and can be formed in the peripheral region of the main body 31 including the outer periphery of the main body 31. That is to say, the openings 32 can extend to the outer periphery of the main body 31. In addition, when viewed from the top, the openings 32 can be formed at positions overlapping with the support shelves 320 provided in the load lock chamber 310. In addition, when viewed from the top, the openings 32 can be formed at positions overlapping with the support slots 22a and 22c of the second container 22. This is because when the ring member "R" is transferred by using the ring bracket 30, the ring bracket 30 can be prevented from overlapping with the support shelves 320 or the support slots 22a and 22c.

[0078] An alignment hole 33 can be formed in the main body 31. When viewed from the top, the alignment hole 33 can be formed between the first guiding member 35 and the second guiding member 36. The alignment hole 33 can be a hole used when aligning the alignment unit 200 with the ring bracket 30 described below. The alignment hole 33 can extend from the upper surface of the main body 31 to the lower surface. That is to say, the alignment hole 33 can penetrate the main body 31. In addition, the alignment hole 33 can be formed at a position overlapping with the notch "N" formed in the substrate "W". For example, the distance from the center of the main body 31 to the center of the alignment hole 33 can be the same as the distance from the center of the substrate "W" to the center of the notch "N". This is for the purpose of making the operation of aligning the direction of the ring bracket 30 by the alignment unit 200 the same as or at least similar to the operation of aligning the direction of the substrate "W".

[0079] When the ring member "R" is positioned on the ring bracket 30 and the ring bracket 30 is transferred by the first transfer hand 152, the ring member "R" can slide through the linear motion of the first transfer hand 152, or the placement position of the ring member "R" can be deformed by the rotation of the first transfer hand 152. The guiding member 34 can prevent the sliding or deformation of the ring member "R". The guiding member 34 can also be referred to as a guiding boss.

[0080] The guiding member 34 can protrude from the upper surface of the main body 31. The guiding member 34 can protrude upward from the upper surface of the main body 31. The inner periphery of the ring member "R" positioned on the ring bracket 30 can have a flat region FZ and a circular region RZ, and the guiding member 34 can be formed at a position facing the inner periphery of the flat region FZ of the ring member "R". The guiding member 34 can have a shape corresponding to the inner periphery of the ring member "R". The guiding member 34 can have a shape corresponding to the inner periphery of the ring member "R" including the flat region FZ.

[0081] The guiding member 34 may include a first guiding member 35 (first guiding boss) and a second guiding member 36 (second guiding boss). The first guiding member 35 and the second guiding member 36 may have symmetrical shapes. For example, the first guiding member 35 and the second guiding member 36 may have shapes that are symmetrical to each other with respect to the alignment hole 33 formed therebetween.

[0082] The first guiding member 35 may include a first flat portion 35F and a first circular portion 35R. The second guiding member 36 may include a second flat portion 36F and a second circular portion 36R. The first flat portion 35F may have a shape corresponding to the inner periphery of the flat region FZ. The first circular portion 35Z may be curved and extend from the first flat portion 35F, and may have a shape corresponding to the inner periphery of the circular region RZ of the ring member "R". The first flat portion 35F and the first circular portion 35Z have shapes symmetrical to the second flat portion 36F and the second circular portion 36Z, and repeated description thereof will be omitted.

[0083] The guiding member 34 helps to align the flat region FZ of the ring member "R" on the ring bracket 30 in a specific direction. In addition, the alignment hole 33 is formed between the first guiding member 35 and the second guiding member 36. Therefore, when aligning the ring bracket 30 by using the alignment unit 200 to be described below, the direction of the flat region FZ of the ring member "R" positioned on the ring bracket 30 can also be aligned in a desired direction. In addition, the outer peripheries of the first circular portion 35Z and the second circular portion 36Z may have the same curvature radius as the inner periphery of the circular region RZ. In addition, the outer peripheries of the first circular portion 35Z and the second circular portion 36Z may have the same curvature radius as the outer periphery of the substrate "W".

[0084] Refer again to Figure 1 According to an embodiment of the present disclosure, the substrate processing apparatus 10 may include a transfer member 100, a process execution member 300, and a controller 700. When viewed from the top, the transfer member 100 and the process execution member 300 may be arranged along a first direction "X". Hereinafter, the direction perpendicular to the first direction "X" when viewed from the top is defined as a second direction "Y". In addition, the direction perpendicular to the first direction "X" and the second direction "Y" is defined as a third direction "Z". Here, the third direction "Z" may refer to the direction perpendicular to the ground.

[0085] The transfer member 100 may include a load port 110, a transfer chamber 130, a first transfer robot 150, and an alignment chamber 170.

[0086] The container 20 can be placed in the loading port 110. As described above, the container 20 can be transferred to the loading port 110 by the OHT device for loading into or unloading from the loading port 110 and can be transferred. However, the present disclosure is not limited thereto, and the container 20 can be transferred by various devices for transferring the container 20. In addition, the operator can directly load the container 20 into the loading port 110 or unload the container 20 placed in the loading port 110 from the loading port 110.

[0087] The indexing chamber 130 can be provided between the loading port 110 and the process execution unit 300. That is, the loading port 110 can be connected to the indexing chamber 130. The inside of the indexing chamber 130 can be maintained in an atmospheric pressure environment.

[0088] In addition, the first transfer robot 150 can be provided in the indexing chamber 130. The first transfer robot 150 can transfer the substrate "W" and the ring member "R" between the container 20 placed in the loading port 110, the load lock chamber 310 (to be described below), and the alignment chamber 170. In addition, the first transfer robot 150 can have a first transfer hand 152. As Figure 10 shown, a plurality of first support pads 153 can be provided on the upper surface of the first transfer hand 152. For example, three first support pads 153 can be provided, and the three first support pads can support the transfer target object positioned on the first transfer hand 152 at three points. The first support pad 153 can prevent the substrate "W" or the ring carrier 30 positioned on the first transfer hand 152 from sliding. When viewed from the top, the first support pads 153 can be arranged along the circumferential direction of an imaginary circle having a radius. In addition, the first transfer hand 152 can have a size through which it can easily enter the above-mentioned container 20. In addition, as Figure 11 shown, the substrate "W" can be positioned on the first transfer hand 152, and as Figure 12 shown, the ring carrier 30 supporting the ring member "R" can be positioned.

[0089] The alignment chamber 170 provided with the alignment unit 200 to be described below can be installed on one side and / or the opposite side of the indexing chamber 130. The substrate "W" or the ring carrier 30 can be aligned in the alignment chamber 170. Figure 13 is a view showing the appearance of the alignment unit provided in the Figure 1 alignment chamber. Referring to Figure 13 , the alignment unit 200 provided in the alignment chamber 170 can align the substrate "W". For example, the alignment unit 200 can align the direction of the notch "N" formed in the substrate "W". In addition, the alignment unit 200 can align the direction of the alignment hole 33 formed in the ring carrier 30.

[0090] The alignment unit 200 may include a chuck 210, a support mechanism 220, an irradiation member 230, and a light receiving member 240. The chuck 210 may support the central region of the substrate "W". The chuck 210 may support the substrate "W" in a vacuum adsorption manner. Alternatively, pads for preventing the target support object from sliding may be provided on the upper surface of the chuck 210. The chuck 210 may rotate the substrate "W".

[0091] The support mechanism 220 may support the irradiation member 230 and the light receiving member 240. The irradiation member 230 may irradiate light "L" in a direction from the upper side to the lower side of the substrate "W" supported by the chuck 210. The light "L" may be a laser beam having a specific width. The light receiving member 240 may be arranged to face the irradiation member 230. For example, the light receiving member 240 may be provided on the irradiation path of the light "L" irradiated by the irradiation member 230. The chuck 210 may rotate the substrate "W" until the light "L" irradiated by the irradiation member 230 passes through the notch "N" formed in the substrate "W" and reaches the light receiving member 240. When the light receiving member 240 receives the light "L", the chuck 210 stops the rotation of the substrate "W", and the alignment of the substrate "W" may be completed.

[0092] As Figure 14 shown, the alignment unit 200 may align the ring bracket 30 in a similar manner to the above-described method of aligning the substrate "W". As described above, the alignment hole 33 is formed in the ring bracket 30. When the ring bracket 30 is positioned on the chuck 210, the chuck 210 may rotate the ring bracket 30 until the light "L" irradiated by the irradiation member 230 passes through the alignment hole 33 formed in the ring bracket 30 and reaches the light receiving member 240. When the light receiving member 240 receives the light "L", the chuck 210 stops the rotation of the ring bracket 30, and the alignment of the ring bracket 30 may be completed. As described above, since the position where the alignment hole 33 is formed may overlap with the position where the notch "N" is formed, the ring bracket 30 and the substrate "W" may be aligned by using the same alignment unit 200.

[0093] As an example, Figure 14 it is shown that the ring bracket 30 is aligned in a state where the ring member "R" is positioned on the ring bracket 30, but the present disclosure is not limited thereto. If necessary, as Figure 15 shown, the ring bracket 30 may be aligned in a state where the ring member "R" is not positioned on the ring bracket 30.

[0094] Referring again to Figure 1 , the process execution unit 300 may include a load lock chamber 310, a transfer chamber 330, a second transfer robot 350, and a processing chamber 370.

[0095] The load lock chamber 310 may be provided between the indexing chamber 130 and the transfer chamber 330. As described above, the internal environment of the indexing chamber 130 may be maintained in an atmospheric pressure environment. As will be described later, the internal environment of the transfer chamber 330 may be maintained in a vacuum pressure environment. The load lock chamber 310 may be provided between the indexing chamber 130 and the transfer chamber 330, and its internal environment may be changed between an atmospheric pressure environment and a vacuum pressure environment.

[0096] Figure 16 is a plan sectional view showing the Figure 1 appearance of the load lock chamber. Referring to Figure 16 , the load lock chamber 310 may include a housing 311 and a support shelf 320.

[0097] The housing 311 may have an internal space 312. The housing 311 may have an internal space 312 in which the substrate "W" or the ring member "R" is placed. The housing 311 may be provided between the indexing chamber 130 and the transfer chamber 330 described above. In addition, the housing 311 may have an opening. A plurality of openings may be provided in the housing 311. For example, the first opening 311a among the openings may be selectively communicated with the indexing chamber 130 through a gate valve (not shown). In addition, the second opening 311b among the openings may be selectively communicated with the transfer chamber 330 through a gate valve (not shown).

[0098] In addition, the housing 311 may have a vent hole 313 through which exhaust gas is supplied to the internal space 312 of the housing 311. In addition, the housing 311 may have a decompression hole that reduces the pressure in the internal space 312 of the housing 311. The exhaust gas may be an inert gas. For example, the exhaust gas may be a gas including nitrogen, argon, etc. However, the present disclosure is not limited thereto, and the exhaust gas may be various known inert gases. In addition, the decompression hole 314 may be connected to a decompression member (not shown). The decompression member may be a pump. However, the present disclosure is not limited thereto, and the decompression member may be differently modified to a known device for reducing the pressure of the internal space 312. Since the ventilation hole 313 and the decompression hole 314 are formed in the housing 311, the pressure of the internal space of the housing 311 can be freely changed between atmospheric pressure and vacuum pressure.

[0099] The support shelf 320 may be provided in the internal space 312. The support shelf 320 may support the substrate "W" or the ring member "R" in the internal space 312. In addition, the diameter of the ring member "R" may be larger than the diameter of the substrate "W".

[0100] One or more support shelves 320 may be provided. For example, a plurality of support shelves 320 may be provided. Three support shelves 320 may be provided. When viewed from the top, the support shelves 320 may be arranged to be spaced apart from each other. When viewed from the top, the support shelves 320 may be disposed at a position overlapping the opening 32 formed in the above-mentioned ring bracket 30. For example, when viewed from the top, the support shelves 320 may be disposed at a position overlapping the opening 32 formed in the ring bracket 30, and the orientation of the ring bracket is aligned by the alignment unit 200. In addition, when viewed from its cross-section, the support shelf 320 may have a substantially inverted "L" shape.

[0101] In addition, the support shelf 320 may include a first pad 324 and a second pad 326. The first pad 324 and the second pad 326 may be formed of a material having anti-friction properties against the substrate "W" or the ring member "R". For example, the first pad 324 and the second pad 326 may be formed of polyether ether ketone (PEEK) filled with carbon. However, the embodiment in which PEEK filled with carbon is used as the material of the first pad 324 and the second pad 326 is merely an example, and various modifications may be made using other known materials having similar properties.

[0102] When viewed from the top, the first pad 324 may have a substantially arc shape. The first pad 324 may be arranged closer to the pressure relief hole 314 than the second pad 326. When viewed from the top, the first pad 324 may be disposed inside the outer periphery of the substrate "W". That is, as Figure 17 shown, among the substrate "W" and the ring member "R", the first pad 324 may support the substrate "W".

[0103] When viewed from the top, the second pad 326 may have a substantially arc shape. The second pad 326 may be arranged farther from the pressure relief hole 314 than the first pad 324. When viewed from the top, the second pad 326 may be disposed outside the outer periphery of the substrate "W" and outside the inner periphery of the ring member "R", and may be disposed inside the outer periphery of the ring member "R". That is, among the substrate "W" and the ring member "R", the second pad 326 may support the ring member "R".

[0104] In addition, when viewed from the top, the support shelf 320 may be disposed at a position overlapping the opening 32 formed in the above-mentioned ring bracket 30. Therefore, as Figure 18 shown, when the first transfer hand 152 transports the ring bracket 30 on which the ring member "R" is positioned into the load lock chamber 310 and the first transfer hand 152 moves downward, the ring member "R" is positioned on the support shelf 320, and the ring bracket 30 may move downward while being positioned on the first transfer hand 152. Thereafter, as Figure 19As shown, when the first transfer arm 152 retracts, the ring carrier 30 can be separated from the ring member "R" and removed from the load lock chamber 310.

[0105] Referring again to Figure 1 , a transfer chamber 330 can be provided between the load lock chamber 310 and the processing chamber 370. The internal environment of the transfer chamber 330 can be maintained in a vacuum pressure environment. A second transfer robot 350 can be provided in the transfer chamber 330. The second transfer robot 350 can transfer the substrate "W" and the ring member "R" between the load lock chamber 310 and the processing chamber 370. In addition, the second transfer robot 350 can have a second transfer arm 352.

[0106] Figure 20 is a view showing Figure 1 the appearance of the second transfer arm. Referring to Figure 20 , the second transfer arm 352 of the second transfer robot 350 can have a larger size than the first transfer arm 152. A pair of first transfer pads 353, a pair of second transfer pads 354, a pair of third transfer pads 355, and a pair of fourth transfer pads 356 can be provided on the second transfer arm 352. The second transfer pads 354 and the third transfer pads 355 can be provided between the first transfer pads 353 and the fourth transfer pads 356. When viewed from the top, the second transfer pads 354 and the third transfer pads 355 can be provided inside the outer periphery of the substrate "W". That is, as Figure 21 shown, among the substrate "W" and the ring member "R", the second transfer pads 354 and the third transfer pads 355 can support the substrate "W". When viewed from the top, the first transfer pads 353 and the fourth transfer pads 356 can be provided outside the outer periphery of the substrate "W" and outside the inner periphery of the ring member "R", and can be provided inside the outer periphery of the ring member "R". That is, among the substrate "W" and the ring member "R", the second pads 326 can support the ring member "R".

[0107] Referring again to Figure 1, one or more processing chambers 370 may be connected to the transfer chamber 330. The processing chamber 370 may be a chamber that performs a process on the substrate “W”. The processing chamber 370 may be a liquid processing chamber that processes the substrate “W” by supplying a processing liquid to the substrate “W”. In addition, the processing chamber 370 may be a plasma chamber that processes the substrate “W” by using plasma. In addition, some of the processing chambers 370 may be liquid processing chambers that process the substrate “W” by supplying a processing liquid to the substrate, and some of the processing chambers 370 may be plasma chambers that process the substrate “W” by using plasma. However, the present disclosure is not limited thereto, and the substrate processing process performed in the processing chamber 370 may be differently modified to a known substrate processing process. In addition, when the processing chamber 370 is a plasma chamber that processes the substrate “W” by using plasma, the plasma chamber may be a chamber that performs an etching or ashing process of removing a thin film on the substrate “W” by using plasma. However, the present disclosure is not limited thereto, and the plasma processing process performed in the processing chamber 370 may be differently modified to a known plasma processing process.

[0108] Figure 23 is a view showing a substrate processing apparatus disposed in the Figure 1 processing chamber. Referring to Figure 23 , the substrate processing apparatus 500 disposed in the processing chamber 370 will be described in detail. The substrate processing apparatus 500 may process the substrate “W” by transferring plasma to the substrate “W”.

[0109] The substrate processing apparatus 500 may include a processing container 510, a gate valve 520, an exhaust pipeline 530, a power supply unit 540, a support unit 550, a first lift pin module 560, a second lift pin module 570, a baffle 580, and a gas supply unit 590.

[0110] The processing container 510 may have a processing space. The processing container 510 may be grounded. The processing container 510 may provide a processing space for processing the substrate “W”. When processing the substrate “W”, the processing space of the processing container 510 may be substantially maintained in a vacuum pressure environment. An inlet 512 may be formed on one side of the processing chamber 510, through which the substrate “W” or the ring member “R” is brought in and taken out. The gate valve 520 may selectively open and close the inlet 512.

[0111] An exhaust hole 514 may be formed on the bottom surface of the processing container 510. An exhaust pipeline 530 may be connected to the exhaust hole 514. The exhaust pipeline 530 may discharge processing gases, process by-products, etc. supplied to the processing space of the processing container 510 to the outside of the processing container 510 through the exhaust hole 514. In addition, an exhaust plate 532 that enables more uniform evacuation of the processing space may be provided at the upper portion of the exhaust hole 514. When viewed from the top, the exhaust plate 532 may substantially have an annular shape. In addition, at least one exhaust hole may be formed in the exhaust plate 532. An operator may select an exhaust plate 532 that can uniformly evacuate the processing space from among a plurality of exhaust plates 532 having various shapes and sizes and install the exhaust plate 532 at the upper portion of the exhaust hole 514.

[0112] In addition, the processing container 510 may further include a support member 516. The support member 516 may support at least a part of a pedestal included in the support unit 550, which will be described below. For example, the support member 516 may be configured to support the lower portion of a separator plate 554 included in the support unit 550.

[0113] The power supply unit 540 may generate RF power, which will excite the processing gas supplied by the gas supply unit 590 into a plasma state, which will be described below. The power supply unit 540 may include a power supply 542 and a matcher 544. The power supply 542 and the matcher 544 may be installed on a power transmission line. In addition, the power transmission line may be connected to the chuck 552.

[0114] The support unit 550 may support a substrate "W" in the processing space of the processing container 510. The support unit 550 may include a chuck 552, a separator plate 554, and a quartz ring 556.

[0115] The chuck 552 may have a support surface for supporting the substrate "W". The chuck 552 may support the substrate "W" and may suck the supported substrate "W". For example, an electrostatic plate (not shown) may be provided in the chuck 552, and the chuck 552 may be an electrostatic chuck that sucks the substrate "W" by using electrostatic force. For example, the chuck 552 may be an electrode electrostatic chuck (ESC). However, the present disclosure is not limited thereto, and the chuck 552 may suck the substrate "W" by a vacuum suction scheme.

[0116] When viewed from the top, the separator plate 554 may have a circular shape. The above-mentioned chuck 552 and the quartz ring 556, which will be described below, may be positioned on the separator plate 554. The separator plate 554 may be a dielectric body. For example, the separator plate 554 may be formed of a material including ceramics.

[0117] The quartz ring 556 can be formed of a material including quartz. When viewed from the top, the quartz ring 556 can substantially have an annular shape. When viewed from the top, the quartz ring 556 can substantially have a shape surrounding the chuck 552. When viewed from the top, the quartz ring 556 can have a shape surrounding the substrate "W" supported by the chuck 552. In addition, a ring member "R" (e.g., a focusing ring) can be positioned on the upper surface of the inner side of the quartz ring 556.

[0118] When viewed from the top, the ring member "R" positioned on the upper surface of the quartz ring 556 can have an annular shape. The ring member "R" can have a shape in which the height of the upper surface of its inner side is lower than the height of the upper surface of its outer side. The lower surface of the peripheral region of the substrate "W" can be positioned on the upper surface of the inner side of the ring member "R". In addition, the ring member "R" can have an inclined surface that slopes upward in a direction facing the outside of the substrate from the center of the substrate "W" between its inner upper surface and outer upper surface. Therefore, even when the substrate "W" is positioned on the upper surface of the inner side of the ring member "R" with a rather inaccurate position, when the substrate "W" slides along the inclined surface of the ring member "R", the substrate "W" can be correctly positioned on the upper surface or the inner side of the ring member "R".

[0119] The first lifting pin module 560 can lift the ring member "R" positioned on the upper surface of the quartz ring 556. The first lifting pin module 560 can include a first lifting pin 562 and a first pin driving member 564. A plurality of first lifting pins 562 can be provided, and a plurality of first pin driving members 564 for moving the first lifting pins 562 up and down can be provided. In addition, when viewed from the top, the first lifting pins 562 can be arranged not to overlap with the chuck 552. The lifting pins 562 can move up and down along the pin holes formed in the partition plate 554 and / or the quartz ring 556. In addition, the pin driving member 564 can be a cylinder or a motor using air pressure or hydraulic pressure.

[0120] The second lifting pin module 570 can lift the substrate "W". The second lifting pin module 570 can include a second lifting pin 572, a lifting plate 574, and a second pin driving member 576. The second lifting pin 572 can be coupled to the lifting plate 574. The lifting plate 574 can move up and down by the second pin driving member 576.

[0121] The baffle 580 may be disposed at an upper portion of the support unit 550. The baffle 580 may be formed of an electrode material. At least one baffle hole 582 may be formed in the baffle 580. For example, a plurality of baffle holes 582 may be formed, and the baffle holes may be uniformly formed in the entire area of the baffle 580 when viewed from the top. The baffle 580 enables the process gas supplied by the gas supply unit 590 to be uniformly delivered to the substrate "W", which will be described below.

[0122] The gas supply unit 590 may supply a process gas into the processing space of the processing chamber 510. The process gas may be a gas excited into a plasma state by the power supply unit 540, which will be described below. The gas supply unit 590 may include a gas supply source 592 and a gas supply line 594. One end of the gas supply line 594 may be connected to the gas supply source 592, and the other end of the gas supply line 594 may be connected to an upper portion of the processing chamber 510. Accordingly, the process gas delivered by the gas supply source 592 may be supplied to an upper region of the baffle 580 through the gas supply line 594. The process gas supplied to the upper region of the baffle 580 may be introduced into the processing space of the processing chamber 510 through the baffle holes 582.

[0123] Referring again to Figure 1 , the controller 700 may control the substrate processing apparatus 10. The controller 700 may control the indexing member 100 and the process execution unit 300. The controller 700 may control the first transfer robot 150 and the second transfer robot 350. The controller 700 may control the substrate processing apparatus 500 disposed in the processing chamber 370 such that the substrate "W" can be processed in the processing chamber 370 by using plasma. In addition, the controller 700 may control the configuration of the substrate processing apparatus 10 such that the substrate processing apparatus 10 can perform a transfer method for transferring the ring member "R" which will be described below.

[0124] In addition, the controller 700 may include a process controller, which includes a microprocessor (computer) that executes the control of the substrate processing apparatus 10, a keyboard for inputting commands to allow an operator to manage the substrate processing apparatus 10, a user interface including a display for visualizing and displaying the operation status of the substrate processing apparatus 10, and a memory unit for storing a control program for executing a process performed by the substrate processing apparatus 10 under the control of the process controller or a program for executing a process (i.e., a process recipe in an element according to various data and process conditions). In addition, the user interface and the memory unit may be connected to the process controller. The process recipe may be stored in a memory medium of the memory unit, and the memory medium may be a hard disk, and may be a removable disk such as a CD-ROM, a DVD, or a semiconductor memory such as a flash memory.

[0125] In the following, a method for transferring the ring member "R" according to an embodiment of the present disclosure will be described. Specifically, the transfer sequence for transferring the unused ring member "R" to the processing chamber 370 will be described.

[0126] When the replacement cycle of the ring member "R" installed on the processing chamber 370 is reached, the OHT device can transfer the second container 22 to the loading port 110. When the second container 22 is transferred to the loading port 110, the first transfer manipulator 150 can take out the ring carrier 30 received in the second container 22 by using the first transfer hand 152. Then, the orientation of the ring carrier 30 can be received while being aligned. When it is necessary to align the orientation of the ring carrier 30, the first transfer manipulator 150 can transfer the ring carrier 30 to the alignment chamber 170, and the alignment unit 200 can align the ring carrier 30 in a state where the ring member "R" is not positioned on the ring carrier 30.

[0127] Thereafter, the first transfer hand 152 can enter the second container 22 while supporting the ring carrier 30. When the first hand 152 completely enters the second container 22, the first transfer hand 152 can move upward to position the unused ring member "R" received in the second container 22 on the ring carrier 30. Then, the ring member "R" can be in a state where its orientation is aligned by the alignment pin 22b in the second container. Therefore, the ring member "R" can be positioned on the ring carrier 30 in a state where its orientation is aligned.

[0128] When the ring member "R" is positioned on the ring carrier 30, the ring carrier 30 can be transferred to the alignment chamber 170, and its orientation can be aligned by the alignment unit 200. After aligning the orientation of the ring carrier 30 by the alignment unit 200 in the state where the ring member "R" is positioned, the first transfer manipulator 150 can transfer the ring carrier to the load lock chamber 310 in the state where the ring member "R" is positioned on the ring carrier 30.

[0129] When the first transfer hand 152 completely enters the load lock chamber 310, the first transfer hand 152 can move downward. Therefore, the ring member "R" on the ring carrier 30 can be placed on the support shelf 320, and the ring carrier 30 can be separated from the ring member "R". When the ring carrier 30 is separated from the ring member "R", it can be taken out from the load lock chamber 310. The ring member "R" placed on the support shelf 320 in the load lock chamber 310 can be taken out by the second transfer hand 352 of the second transfer manipulator 350 and transferred into the processing chamber 370.

[0130] The removal of the used ring member "R" in the processing chamber 370 is performed in the reverse order of the order in which the unused ring member "R" is brought in as described above, and thus a repeated description thereof will be omitted.

[0131] Hereinafter, the order of aligning the ring member "R" according to an embodiment of the present disclosure will be described. Figure 24 is a flowchart showing the order of the positions of the alignment ring members according to an embodiment of the present disclosure. As described above, when the ring member "R" is completely transferred into the processing chamber 370, a substrate type sensor (e.g., a vision wafer VW having an image acquisition module such as a camera) received in the third container 23 can be transferred into the processing chamber, and the third container is any one of the containers 20. The third container 23 can be transferred to the loading port 110 by an overhead transfer (OHT) device.

[0132] When the substrate type sensor VW is transferred into the processing chamber 370, the substrate type sensor VW can capture an image including the ring member "R" and the chuck 552 provided in the processing chamber 370. The captured image can be delivered to the controller 700. When the image is transferred to the controller 700, the substrate type sensor VW can be removed from the processing chamber 370. Thereafter, the controller 700 can measure the interval between the ring member "R" and the chuck 552 based on the image received from the substrate type sensor VW. For example, as Figure 25 shown, when the interval "G" between the ring member "R" and the chuck 552 is constant, the controller 700 determines that the ring member "R" has been transferred to a preset position. In this case, the substrate "W" starts to be processed in the processing chamber 370. In contrast, as Figure 26 shown, when the interval between the ring member "R" and the chuck 552 includes a first interval G1 and a second interval G2 different from the first interval G1, it can be determined that the ring member "R" has not been correctly transferred to the preset position, and the second transfer robot 350 can perform alignment (centering) of the ring member "R" again. If necessary, based on the deformation values obtained from the first interval G1 and the second interval G2, the transfer operations of the first transfer robot 150 and the second transfer robot 350 can be taught. When the alignment is correctly performed, the substrate "W" starts to be processed in the processing chamber 370. In contrast, when the alignment is not correctly performed, the substrate type sensor VW can be transferred into the processing chamber 370 again. Thereafter, again through the image acquired by the substrate type sensor VW, the controller 700 can determine whether the position of the ring member "R" is the preset position. When the position of the ring member "R" deviates from the preset range, the controller 700 can generate an alarm so that the operator can recognize it.

[0133] In the following, a container according to an embodiment of the present disclosure will be described, and the container can charge the substrate type sensor VW. The container 20 (to be described below) that can charge the substrate type sensor VW may be the third container 23 that receives the substrate type sensor VW in the container 20.

[0134] Figure 27 is a cross-sectional view of the third container that shows Figure 1 . Figure 28 is a view of the charging module when viewed from the top Figure 27 . Referring to Figure 27 and Figure 28 , the third container 23 according to an embodiment of the present disclosure can receive the substrate type sensor VW. The third container 23 can receive the substrate type sensor VW and can charge the received substrate type sensor VW.

[0135] The third container 23 may include a main body 610, a door 620, a head 630, a shelf member 640, a charging module 650, and a battery member 660. Through the head 630 mounted on the upper side of the main body 610, the third container 23 can be clamped by a transfer device (such as an OHT device). The main body 610 may have a receiving space 612 that is open on one side. The main body 610 may have a container shape that is open on one side. The above-mentioned substrate type sensor VW can be received in the receiving space 612 of the main body 610. The receiving space 612 of the main body 610 can be opened and closed by the door 620 that selectively closes one side of the main body 610. In addition, an open / close sensor 611 for detecting whether the receiving space 612 is opened and closed by the door 620 may be provided in the main body 610. The open / close sensor 611 may be a magnetic sensor that determines whether the door 620 and the main body 610 are in contact with each other by using magnetism.

[0136] However, the present disclosure is not limited thereto, and the open / close sensor 611 may include an irradiating member that irradiates light and a light receiving member that receives light. In this case, it can be detected whether the receiving space 612 is open or closed according to whether the light irradiated by the irradiating member is received by the light receiving member. In addition, the type of the open / close sensor 611 is not limited thereto, and it can be differently modified to a known device that can detect whether the door 620 is closed.

[0137] A plurality of shelf members 640 may be provided in the receiving space 612. Each of the shelf members 640 forms a pair. For example, when viewed from the top, the shelf members 640 can support one side and the opposite side of the substrate type sensor VW.

[0138] In addition, a first position sensor 641 that detects whether the substrate type sensor VW is positioned at a first position on the shelf member 640 may be provided in the shelf member 640. The first position sensor 641 may be a weight sensing sensor. Alternatively, the first position sensor 641 may be an optical sensor. Alternatively, the first position sensor 641 may be a distance sensing sensor. The type of the first position sensor 641 is not limited thereto, and may be variously modified into a known device that can detect whether the substrate type sensor VW is positioned on the shelf member 640.

[0139] In addition, a second position sensor 642 that can detect the position of the charging member 651 of the charging module 650 may be provided in the shelf member 640. The second position sensor 642 may detect whether the charging member 651 to be described below is correctly positioned at the charging position. The second position sensor 642 may be an optical sensor, a distance sensing sensor, or a magnetic sensor. The type of the second position sensor 642 is not limited thereto, and may be variously modified into a known device that can detect the position of the charging member 651, which will be described below.

[0140] The charging module 650 may receive power from the battery member 660 (an example of a power supply device) and may charge the substrate type sensor VW placed on the shelf member 640. The charging module 650 may charge the substrate type sensor VW in a wireless charging scheme. A plurality of charging modules 650 may be provided. For example, the number of charging modules 650 may be the same as the maximum number of substrate type sensors VW that can be received in the receiving space 612. The number of charging modules 650 may be the same as the number of the plurality of shelf members 640. That is, since a plurality of charging modules 650 are provided, a plurality of substrate type sensors VW can be charged simultaneously.

[0141] Each of the charging modules 650 may include a charging member 651, a support member 652, a guide member 653, and a driving member 654. The charging member 651 is a member that directly delivers power to the power supply device (e.g., a battery) of the substrate type sensor VW. For example, the charging member 651 may have a wireless charging coil. The charging member 651 may charge the substrate type sensor VW in a wireless charging scheme, for example, in an electromagnetic induction scheme. When the charging member 651 charges the substrate type sensor VW in the electromagnetic induction scheme, the substrate type sensor VW may be rapidly charged, and due to the characteristics of the electromagnetic induction scheme, the charging member 651 may become smaller, whereby the standard of the signal transmission / reception coil may be different.

[0142] The charging component 651 can be moved between a standby position (an example of a first position) and a charging position (an example of a second position) by a support component 652, a guide component 653, and a drive component 654. The standby position can be a position spaced apart from one side of the main body 610, and the side is opened and closed by the door 620. For example, when one side of the main body 610 is the front side and the side corresponding to one side of the main body 610 is the rear side, the standby position can be a position closer to the rear side than the front side of the main body 610. When the charging component 651 is in the standby position, even when the first transfer hand 152 enters the receiving space 612, the first transfer hand 152 does not collide with the charging component 651. The charging position can be a position closer to the front side of the main body 610 than the standby position. The charging position can be a position suitable for charging the substrate type sensor VW. The charging position can be a position where the charging component 651 can start charging the substrate type sensor VW.

[0143] In the inner wall of the main body 610, the guide component 653 can be provided on the side wall of the main body 610. The guide component 653 can be a guide rail, and the guide rail can guide the movement of the charging component 651 in a direction parallel to the upper surface or the lower surface of the substrate type sensor VW supported by the shelf component 640. The support component 652 can be coupled to the charging component 651 and can have a bar shape, whereby the support component 652 can move along the guide component 653. The drive component 654 can generate a driving force for moving the charging component 651 connected to the support component 652 in one direction along the guide component 653.

[0144] The drive component 654 can include a drive source 654a, a drive transmission source 654b, and an arm 654a. The drive source 654a can generate a driving force. The drive source 654a can be a motor. The arm 654a can receive the driving force from the drive source 654a. The arm 654a can be a pantograph. The arm 654a can have a structure that can be extended and contracted. The arm 654a can be coupled to the charging component 651. The arm can receive the driving force generated by the drive transmission source 654b through the medium of the drive transmission source 654c. The drive transmission source 654b can be a lead screw. The type of the drive transmission source 654c that transmits the driving force for generating the drive transmission source 654b to the arm 654a is not limited to a lead screw and can be differently modified to a known device that can transmit the driving force.

[0145] Figure 29 is a conceptual view showing a substrate type sensor charging system according to an embodiment of the present disclosure. Refer to Figure 29, the battery component 660 installed in the third container 23 can be charged by the charging unit 800 provided in the loading port 110. The controller 700 can control the first switch SW1 to selectively charge the battery component 660. The controller 700 can control the on / off operation of the first switch SW1 with reference to whether the third container 23 is properly placed in the loading port 110. For example, when the third container 23 is properly placed in the loading port 110, the charging unit 800 provided in the loading port 110 can charge the battery component 660 installed in the third container 23 (so-called FOUP charging mode). The electric energy stored in the battery component 660 can be delivered to the charging component 651.

[0146] The charging module 650 can be controlled to be in a standby mode and a charging mode. The standby mode can be a mode of waiting to charge the substrate type sensor VW. In the standby mode, the charging component 651 can be located at the standby position (see Figure 30 ). For example, when the substrate type sensor VW has been fully charged and the open / close sensor detects that the receiving space 612 is open, the standby mode can be started. In addition, when the receiving space 612 is open, the first transfer hand 152 can enter the receiving space 612 (see Figure 31 ), and then, since the charging component 651 is located at the standby position, the collision between it and the first transfer hand 152 can be minimized.

[0147] The charging mode can be a mode of performing charging of the substrate type sensor VW. In the charging mode, the charging component 651 can be located at the charging position (see Figure 32 ). When the first position sensor 641 detects that the substrate type sensor VW is placed on the shelf component 640 and the open / close sensor 611 detects that the receiving space 612 is closed by the door 620, the charging mode can be started. When the charging mode is started, the second switch SW2 installed between the battery component 660 and the charging component 651 can be turned on. When the charging mode is started, the drive source 654a can generate a driving force to move the charging component 641. When the second position sensor 642 detects that the charging component 651 has completely moved to the charging position, the drive source 654a can stop generating the driving force, and the charging component 651 can start charging.

[0148] Generally, the substrate-type sensor VW is charged outside the substrate processing apparatus 10, and multiple transfer sequences are required to transfer the substrate-type sensor VW to the processing chamber 370. However, according to an embodiment of the present disclosure, since the substrate-type sensor VW is charged in the third container 23 that can be positioned in the load port 110, the problem of requiring multiple transfer sequences can be solved, which will be described below. In particular, when the substrate-type sensor VW is charged in the third container 23, the charging member 651 and the first transfer arm 152 may collide with each other, and since the charging member 651 of the present disclosure can move between the standby position and the charging position, the above-mentioned collision problem can be minimized. In addition, since the substrate-type sensor VW is selectively charged according to the standby mode and the charging mode, unnecessary waste of charging energy can be minimized.

[0149] According to an embodiment of the present disclosure, the ring member can be effectively transferred.

[0150] In addition, according to an embodiment of the present disclosure, the ring member can be transferred without changing the structure of the transfer arm.

[0151] In addition, according to an embodiment of the present disclosure, when the ring member is transferred, the sliding and deformation of the ring member can be minimized.

[0152] The effects of the present disclosure are not limited to the above effects, and those skilled in the art to which the present disclosure pertains can clearly understand the effects not mentioned from the specification and the drawings.

[0153] The above detailed description illustrates the present disclosure. In addition, the above describes exemplary embodiments of the present disclosure, and the present disclosure can be used in various other combinations, changes, and environments. That is, the present disclosure can be modified and corrected without departing from the scope of the present disclosure disclosed in the specification, the equivalent scope of the written disclosure, and / or the technical or knowledge scope of those skilled in the art. The written embodiments describe the best state for implementing the technical spirit of the present disclosure, and various changes required for the application fields and purposes of the detailed description of the present disclosure can be made. Therefore, the detailed description of the present disclosure is not intended to limit the present invention in the state of the disclosed embodiments. In addition, it should be understood that the appended claims include other embodiments.

Claims

1. A container for receiving a substrate-type sensor, the container comprising: A main body having a receiving space opened on one side; A door configured to selectively open and close the receiving space; A shelf member configured to support the substrate-type sensor in the receiving space; And A charging module configured to charge the substrate-type sensor supported by the shelf member, and Wherein the charging module includes: A charging member configured to move between a standby position and a charging position for charging the substrate-type sensor supported by the shelf member, and the charging position is closer to the one side than the standby position.

2. The container according to claim 1, wherein the charging module includes: A guiding member configured to guide the charging member to move in a direction parallel to one surface of the substrate-type sensor supported by the shelf member; A supporting member configured to support the charging member when moving along the guiding member; And A driving member configured to move the supporting member in the one direction.

3. The container according to claim 2, wherein the driving member includes: A driving source configured to generate a driving force; And An arm coupled to the charging member and configured to move the charging member in the one direction by using the driving force.

4. The container according to any one of claims 1 to 3, wherein the charging member is configured to move in an area on the lower side of the substrate-type sensor supported by the shelf member.

5. The container according to any one of claims 1 to 3, wherein a plurality of shelf members and a plurality of charging modules are provided, and Wherein the charging modules are configured to charge the substrate-type sensors supported by the shelf members respectively.

6. The container according to any one of claims 1 to 3, further comprising: A first position sensor configured to detect whether the substrate-type sensor is placed on the shelf member; A second position sensor configured to detect the position of the charging member; And An open / close sensor configured to detect whether the receiving space is open or closed.

7. The container according to claim 6, wherein when the first position sensor detects that the substrate-type sensor is placed on the shelf member and the open / close sensor detects that the receiving space is closed by the door, the charging member moves to the charging position.

8. The container according to claim 7, wherein When the second position sensor detects that the charging member has completely moved to the charging position, the charging member starts to charge the substrate-type sensor.

9. The container according to claim 6, wherein When it is detected that the substrate-type sensor is fully charged or when the open / close sensor detects that the receiving space is open, the charging member moves to the standby position.

10. A substrate processing system, comprising: A transfer member having a load port; A process execution member configured to receive a substrate from the transfer member and process the substrate; And A container positioned in the load port and configured to receive a substrate type sensor brought into the process execution member, Wherein the container further comprises: A main body having a receiving space open on one side; A door configured to selectively open and close the receiving space; A shelf member configured to support the substrate type sensor in the receiving space; and A charging module configured to charge the substrate type sensor supported by the shelf member, and Wherein the charging module comprises: A charging member configured to move between a first position and a second position, the second position being closer to the one side than the first position.

11. The substrate processing system according to claim 10, wherein the container comprises: A first position sensor configured to detect whether the substrate type sensor is placed on the shelf member; A second position sensor configured to detect the position of the charging member; And An open / close sensor configured to detect whether the receiving space is open or closed.

12. The substrate processing system according to claim 11, further comprising: A controller, Wherein the controller is configured to: Control the charging module based on a detection value detected by the first position sensor, the second position sensor, or the open / close sensor.

13. The substrate processing system according to claim 12, wherein the controller is configured to: Control the charging module based on the detection value such that the charging module is in a charging mode or a standby mode, the charging mode being for charging the substrate type sensor supported by the shelf member, and in the standby mode, the charging member is located at the first position.

14. The substrate processing system according to claim 13, wherein the controller is configured to: Control the charging module such that when the first position sensor detects that the substrate type sensor is placed on the shelf member and the open / close sensor detects that the receiving space is closed by the door, the charging module is in the charging mode.

15. The substrate processing system according to claim 13, wherein the controller is configured to: Control the charging module such that when the substrate type sensor is fully charged, when the first position sensor detects that the substrate is not positioned on the shelf member, or when the open / close sensor detects that the receiving space is open, the charging module is in the standby mode.

16. The substrate processing system according to any one of claims 10 to 15, wherein The charging module further comprises: A guiding member configured to guide the charging member to move in a direction parallel to one surface of the substrate type sensor supported by the shelf member; A supporting member configured to support the charging member when moving along the guiding member; And A driving member configured to move the supporting member in the one direction.

17. The substrate processing system according to claim 16, wherein the driving member includes: A driving source configured to generate a driving force; And An arm connected to the charging member and configured to move the charging member in the one direction by using the driving force.

18. A substrate processing system, comprising: A transfer member having a transfer robot and a load port; A process execution member configured to receive a substrate from the transfer member and process the substrate; And A container positioned in the load port and configured to receive the substrate type sensor brought into the process execution member, Wherein the container includes: A main body having a receiving space opened at one side; A door configured to selectively open and close the receiving space; A shelf member configured to support the substrate type sensor in the receiving space; and A charging module configured to charge the substrate type sensor supported by the shelf member in a wireless charging scheme, and Wherein the charging module includes: A charging member configured to move between a standby position and a charging position closer to the one side than the standby position, and configured to move in a region below the substrate type sensor supported by the shelf member; A first position sensor configured to detect whether the substrate type sensor is placed on the shelf member; A second position sensor configured to detect the position of the charging member; and An open / close sensor configured to detect whether the receiving space is open or closed.

19. The container according to claim 18, wherein the charging module includes: A guiding member configured to guide the charging member to move in a direction parallel to one surface of the substrate type sensor supported by the shelf member; A supporting member configured to support the charging member when moving along the guiding member; And A driving member configured to move the supporting member in the one direction.

20. The substrate processing system according to claim 19, wherein the driving member includes: A driving source configured to generate a driving force; And An arm coupled to the charging member and configured to move the charging member in the one direction by using the driving force.

21. The substrate processing system according to any one of claims 18 to 20, further comprising: A controller wherein the controller is configured to: generate a control signal for moving the charging component to the charging position when the first position sensor detects that the substrate-type sensor is placed on the shelf component and the open / close sensor detects that the receiving space is closed by the door; generate a control signal for causing the charging component to start charging the substrate-type sensor when the second position sensor detects that the charging component has been fully moved to the charging position; and generate a control signal for moving the charging component to the standby position when it is detected that the substrate-type sensor has been fully charged or when the open / close sensor detects that the receiving space is open.

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