A module pin soldering device

Abstract

The present invention provides a module pin welding device, which includes a support table, a workbench, a preheater, a pick-and-place device, a presser, and a cleaner; the workbench includes a support shaft, a work disk, and a fixing part; the workbench rotates the fixing part to the first station, the second station, the third station, and the fourth station respectively through the support shaft. The first station is the position where the work disk rotates to the working range of the preheater; the second station is the position where the work disk rotates to the working range of the cleaner, the position where the pick-and-place device places the substrate into the working range of the fixing part, and the position where the pick-and-place device takes out the module; the third station is the position where the work disk rotates to the position where the pick-and-place device places the pins into the working range of the fixing part; the fourth station is the position where the work disk rotates to the working range where the presser welds and presses the substrate and the pins. The module pin welding device of the present invention has a simple structure and is easy to assemble and produce.

Description

Technical Field

[0001] The present invention relates to the technical field of welding equipment, and in particular to a module pin welding device. Background Art

[0002] A module generally includes a substrate and pins welded to the substrate. At present, the power device module in the module, namely the Modular Intelligent Power System (MIPS), is a power drive product that combines power electronics and integrated circuit technologies. The process of welding pins has a great impact on the assembly production of the module.

[0003] In the related module assembly production, the pins are welded by using the Surface Mounted Technology (SMT) process. However, the SMT process has high requirements for the accuracy and high temperature resistance of the substrate carrier, resulting in an increase in the price of the substrate carrier and a reduction in the service life of the carrier. A large number of substrate carriers are required for the automated production line to produce modules, which greatly increases the production cost of the module.

[0004] Therefore, it is necessary to design a new device to solve the above technical problems. Summary of the Invention

[0005] In view of the above deficiencies in the related art, the present invention provides a module pin welding device with a simple structure and easy to assemble and produce.

[0006] To solve the above technical problems, an embodiment of the present invention provides a module pin welding device. The module pin welding device includes a support table, a workbench mounted on the support table, and a preheater, a pick-and-place device, a presser, and a cleaner that are fixed to the support table and arranged at intervals; the workbench includes a support shaft mounted on the support table and rotatably connected to the support table in an axial manner, a work disk fixed to one end of the support shaft away from the support table, and a fixing portion provided on a side of the work disk away from the support table.

[0007] The workbench is used to rotate the fixing part to the first station, the second station, the third station, and the fourth station respectively through the support shaft. The first station is the position where the work disk rotates to the working range of the preheater; the second station is the position where the work disk rotates to the working range of the cleaner. The second station is also the position where the work disk rotates to the working range where the pick-and-place device places the substrate to be welded externally into the fixing part. The second station is also the position where the work disk rotates to the working range where the pick-and-place device takes out the module fixed in the fixing part and formed by welding the substrate and the pins to be welded externally. The third station is the position where the work disk rotates to the working range where the pick-and-place device places the pins into the fixing part; the fourth station is the position where the work disk rotates to the working range where the presser presses and welds the substrate and the pins.

[0008] The preheater is used to heat the fixing part in the first station to a preset temperature.

[0009] The pick-and-place device is used to fix the substrate in the fixing part in the second station, and is also used to fix the pins in the fixing part in the third station, and is also used to take out the module fixed in the fixing part in the second station.

[0010] The presser is used to press and weld the substrate and the pins in the fixing part in the fourth station by welding.

[0011] The cleaner is used to clean the module in the fixing part in the second station.

[0012] Preferably, the work disk is in a disc shape, and there are multiple fixing parts. The multiple fixing parts are arranged at the same position along the radial direction of the work disk and are symmetrically and evenly distributed.

[0013] Preferably, the fixing part includes a substrate fixing position for fixing the substrate to be welded and matching the shape of the substrate, and a pin fixing position for fixing the pins to be welded and matching the shape of the pins. The substrate fixing position and the pin fixing position correspond one by one.

[0014] Preferably, the preheater is arranged at an interval from the support shaft and is located between the work disk and the support table. The substrate fixing position is provided with a support groove penetrating through it; after the substrate to be welded is fixed to the substrate fixing position, the side of the substrate facing the support table is exposed outside the work disk through the support groove; the preheater heats the substrate to the preset temperature by abutting against the side of the substrate facing the support table.

[0015] Preferably, the preheater includes a cylinder fixed to the support table, a base extending from an end of the cylinder away from the support table, a heating rod installed on the base, and a heating platform extending from an end of the base away from the support table;

[0016] The cylinder is used to move the base away from or close to the support table, so as to realize that the heating platform abuts against the substrate or is away from the substrate;

[0017] The heating platform is connected to the heating rod so that the heat generated by heating the heating rod is transferred to the heating platform.

[0018] Preferably, the pick-and-place device includes a first body fixed to the support table where it is located, a first robotic arm fixed to the first body and sliding along a first direction, a second robotic arm fixed to the first robotic arm and sliding along a second direction, a third robotic arm fixed to the second robotic arm and sliding along a third direction, and a finger cylinder fixed to the third robotic arm and rotatably connected to the third robotic arm; the first direction, the second direction, and the third direction are perpendicular to each other in pairs;

[0019] The finger cylinder includes cylinder fingers for clamping the substrate, and the finger cylinder is used to pneumatically control the opening or closing of the cylinder fingers, so as to fix the substrate and the pins to the fixing part or take out the module.

[0020] Preferably, the first robotic arm includes a first guide rail fixed to the first body and extending along the first direction, a first lead screw installed on the first guide rail and slidably connected to the first guide rail, and a first motor extending from the first lead screw and driving the first lead screw to slide;

[0021] The second robotic arm includes a second guide rail fixed to the first robotic arm and extending along the second direction, a second lead screw installed on the second guide rail and slidably connected to the second guide rail, and a second motor extending from the second lead screw and driving the second lead screw to slide;

[0022] The third robotic arm includes a third guide rail fixed to the second robotic arm and extending along the third direction, a third lead screw installed on the third guide rail and slidably connected to the third guide rail, and a third motor extending from the third lead screw and driving the third lead screw to slide;

[0023] The finger cylinder further includes a cylinder motor extending from the cylinder fingers and driving the cylinder fingers to rotate around an axis of the third robotic arm;

[0024] The pick-and-place device further includes a vision positioning camera fixed to the finger cylinder. The vision positioning camera is used to position the fixing part in the second station fixed by the substrate and the pins or the module, so as to place the substrate and the pins or take out the module.

[0025] Preferably, the presser includes a second body fixed to the support table, a fourth robotic arm fixed to the second body and sliding along a first direction, a fifth robotic arm fixed to the fourth robotic arm and sliding along a third direction, and a press jaw fixed to the fifth robotic arm;

[0026] The fourth robotic arm includes a fourth guide rail fixed to the second body and extending along the first direction, a fourth lead screw installed on the fourth guide rail and forming a sliding connection with the fourth guide rail, and a fourth motor extending from the fourth lead screw and driving the fourth lead screw to slide;

[0027] The fifth robotic arm includes a fifth guide rail fixed to the fourth robotic arm and extending along the third direction, a fifth lead screw installed on the fifth guide rail and forming a sliding connection with the fifth guide rail, and a fifth motor extending from the fifth lead screw and driving the fifth lead screw to slide.

[0028] Preferably, the cleaner includes a third body fixed to the support table, and a suction device and a blowing device respectively extending from one side of the third body away from the support table. The suction device and the blowing device face each other and are spaced apart from each other to form a receiving space, and the module fixed to the fixing part in the second station is received in the receiving space.

[0029] Preferably, there are four fixing parts. The four fixing parts are respectively located in the first station, the second station, the third station, and the fourth station, and the angle between two adjacent fixing parts on the working disk is 90°;

[0030] When the working disk rotates clockwise, one of the fixing parts rotates to the second station after passing through the second station, the first station, the third station, and the fourth station in sequence.

[0031] Compared with the related art, the module pin welding device of the present invention is provided with a support table, and a workbench, a preheater, a pick-and-place device, a presser and a cleaner are installed on the support table; the workbench includes a support shaft, a work disk and a fixing part, and the workbench rotates the fixing part to the first station, the second station, the third station and the fourth station respectively through the support shaft. The first station, the second station, the third station and the fourth station are respectively the working stations corresponding to the preheater, the pick-and-place device, the presser and the cleaner in the workbench. Specifically: the first station is the position where the work disk rotates to the working range of the preheater; the second station is the position where the work disk rotates to the working range of the cleaner, and the second station is also the position where the work disk rotates to the working range of the pick-and-place device; the fourth station is the position where the work disk rotates to the working range where the presser welds and presses the substrate and the pins. This structure is simple, avoiding the need for a large number of better substrate carriers in the related art, facilitating the welding of the leads to the substrate, and facilitating assembly and production. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention will be described in detail below with reference to the drawings. Through the detailed description in conjunction with the following drawings, the above or other aspects of the present invention will become clearer and easier to understand. In the drawings:

[0033] Figure 1 is a three-dimensional structural schematic diagram of the module pin welding device of the present invention;

[0034] Figure 2 is a three-dimensional structural schematic diagram of the workbench of the module pin welding device of the present invention during module assembly;

[0035] Figure 3 is Figure 2 an enlarged view of part A;

[0036] Figure 4 is Figure 2 an enlarged view of part B;

[0037] Figure 5 is a three-dimensional structural schematic diagram of the preheater of the module pin welding device of the present invention;

[0038] Figure 6 is a partial three-dimensional structural schematic diagram of the pick-and-place device of the module pin welding device of the present invention;

[0039] Figure 7 is a partial three-dimensional structural schematic diagram of the presser of the module pin welding device of the present invention;

[0040] Figure 8 is a three-dimensional structural schematic diagram of the cleaner of the module pin welding device of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0041] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0042] The specific embodiments / embodiments described herein are specific embodiments of the present invention and are used to illustrate the concept of the present invention. They are all explanatory and exemplary and should not be construed as limiting the embodiments of the present invention and the scope of the present invention. Except for the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the content disclosed in the claims and the specification of this application. These technical solutions include technical solutions that make any obvious substitutions and modifications to the embodiments described herein, and they are all within the protection scope of the present invention.

[0043] The present invention provides a module pin welding device 100. The module pin welding device 100 is used to weld an external substrate 200 and pins 300 to form a module 400. In this embodiment, the module 400 is a power device module.

[0044] Please refer to Figure 1 as shown, Figure 1 which is a three-dimensional structural schematic diagram of the module pin welding device 100 of the present invention.

[0045] Specifically, the module pin welding device 100 includes a support table 1, a workbench 2 installed on the support table 1, and a preheater 3, a pick-and-place device 4, a presser 5, and a cleaner 6 that are fixed to the support table 1 and are arranged at intervals.

[0046] The support table 1 is used for support. In this embodiment, the support table 1 is a workbench panel fixed to the ground.

[0047] Please refer to Figure 2 as shown, Figure 2 which is a three-dimensional structural schematic diagram when the workbench 2 of the module pin welding device 100 of the present invention is assembled with the module 400.

[0048] Specifically, the workbench 2 includes a support shaft 21 installed on the support table 1 and rotatably connected to the support table 1 to form an axis, a work disk 22 fixed to one end of the support shaft 21 away from the support table 1, and a fixing portion 23 provided on a side of the work disk 22 away from the support table 1.

[0049] The workbench 2 is used to rotate the fixing portion 23 to a first station S1, a second station S2, a third station S3, and a fourth station S4 respectively through the support shaft 21. The first station S1 is a position where the work disk 22 rotates to within the working range of the preheater 3.

[0050] Among them, the second station S2 is the position where the working disk 22 rotates into the working range of the cleaner 6. The second station S2 is also the position where the working disk 22 rotates into the working range where the pick-and-place device 4 places the substrate 200 to be welded externally into the fixing portion 23. The second station S2 is also the position where the working disk 22 rotates into the working range where the pick-and-place device 4 takes out the module 400 fixed in the fixing portion 23 and formed by welding the substrate 200 and the pins 300 to be welded externally. The third station S3 is the position where the working disk 22 rotates into the working range where the pick-and-place device 4 places the pins 300 into the fixing portion 23. The fourth station S4 is the position where the working disk 22 rotates into the working range where the presser 5 welds and presses the substrate 200 and the pins 300. In this structure, the first station S1, the second station S2, the third station S3, and the fourth station S4 are respectively the working stations on the workbench 2 corresponding to the preheater 3, the pick-and-place device 4, the presser 5, and the cleaner 6. This structure is simple and easy to assemble and produce the module 400.

[0051] The working disk 22 is in a disk shape. There are multiple fixing portions 23, and the multiple fixing portions 23 are arranged at the same position along the radial direction of the working disk 22 and are symmetrically and evenly distributed. In this embodiment, there are four fixing portions 23, and the four fixing portions 23 are respectively located at the first station S1, the second station S2, the third station S3, and the fourth station S4. The angle between two adjacent fixing portions 23 on the working disk 22 is 90°.

[0052] When the working disk 22 rotates clockwise, one of the fixing portions 23 rotates to the second station S2 after passing through the second station S2, the first station S1, the third station S3, and the fourth station S4 in sequence. The structure of the working disk 22 makes it easy to operate when assembling the module 400, and enables the mutual arrangement positions of the workbench 2, the preheater 3, the pick-and-place device 4, the presser 5, and the cleaner 6 to be fully utilized. This structure is simple and enables a high production efficiency in assembling the module 400.

[0053] Please refer to Figure 3 and Figure 4 as shown in Figure 3 which is Figure 2 an enlarged view of part A; Figure 4 which is Figure 2 an enlarged view of part B. Specifically, Figure 3 is a three-dimensional structure schematic diagram of the fixing portion 23. Figure 4 is a three-dimensional structure schematic diagram of the assembly of the fixing portion 23 and the module 400.

[0054] Specifically, the fixing part 23 includes a substrate fixing position 231 for fixing the substrate 200 to be welded and matching the shape of the substrate 200, and a pin fixing position 232 for fixing the pins 300 to be welded and matching the shape of the pins 300.

[0055] Among them, the substrate fixing positions 231 and the pin fixing positions 232 correspond one by one. The structure of the fixing part 23 can avoid a large number of substrate carriers in the related art, so that the structure of the module pin welding device 100 of the invention is simple and easy to apply.

[0056] In this embodiment, the substrate fixing position 231 is provided with a support groove 2310 penetrating therethrough. The support groove 2310 is used for heating the substrate 200. The sinking height of the substrate fixing position 231 from the surface of the working disk 22 is the same as the thickness of the substrate 200. The center of the support groove 2310 is a hollow structure, and there are hollow side ears at its two short sides. The function of the hollow side ears is to facilitate the loading and unloading of the substrate 200.

[0057] The pin fixing position 232 is higher than the reference plane of the circular working disk 22 and plays a role in supporting the pins 300. Positioning posts are provided at the four corner positions of the pin fixing position 232 to position the pins 300, and there are also sinking side ears at the short sides of the pin fixing position 232 to facilitate the installation of the pins 300.

[0058] The structures of the substrate fixing position 231 and the pin fixing position 232 are simple. When assembling and producing the module 400, the template carriers in the related art can be avoided, which can improve production efficiency and save costs.

[0059] In this embodiment, after the substrate 200 to be welded is fixed to the substrate fixing position 231, the side of the substrate 200 facing the support table 1 is exposed from the working disk 22 through the support groove 2310. The preheater 3 heats the substrate 200 to a preset temperature by abutting against the side of the substrate 200 facing the support table 1. This structure makes the structure of the module pin welding device 100 of the invention simple.

[0060] The preheater 3 is used to heat the fixing part 23 in the first station S1 to a preset temperature. The preheater 3 is arranged at an interval from the support shaft 21 and is located between the working disk 22 and the support table 1.

[0061] Please refer to Figure 5 shown Figure 5 which is a three-dimensional structural schematic diagram of the preheater 3 of the module pin welding device 100 of the present invention.

[0062] Specifically, the preheater 3 includes a cylinder 31 fixed to the support table 1, a base 32 extending from one end of the cylinder 31 away from the support table 1, a heating rod 33 mounted on the base 32, and a heating platform 34 extending from one end of the base 32 away from the support table 1.

[0063] The cylinder 31 is used to move the base 32 away from or close to the support table 1, so as to enable the heating platform 34 to abut against the substrate 200 or move away from the substrate 200.

[0064] The heating platform 34 is connected to the heating rod 33 so that the heat generated by heating the heating rod 33 is transferred to the heating platform 34.

[0065] When the circular working disk 22 drives the substrate 200 in the fixing part 23 to rotate to the preheating position, that is, the first working station S1, the cylinder 31 drives the base 32 to rise, the heating platform 34 contacts the back surface of the substrate 200, and then the heating rod 33 is powered on to preheat the substrate 200. The structure of the preheater 3 makes the structure of the module pin welding device 100 of the invention simple.

[0066] The pick-and-place device 4 is used to fix the substrate 200 in the fixing part 23 at the second working station S2. The pick-and-place device 4 is also used to fix the pins 300 in the fixing part 23 at the third working station S3. The pick-and-place device 4 is also used to take out the module 400 fixed in the fixing part 23 at the second working station S2.

[0067] Please refer to Figure 6 as shown in Figure 6 which is a partial three-dimensional structural schematic diagram of the pick-and-place device 4 of the module pin welding device 100 of the present invention.

[0068] Specifically, the pick-and-place device 4 includes a first body 41 fixed to the support table 1, a vision positioning camera 42, a first robotic arm 43 fixed to the first body 41 and sliding along a first direction X, a second robotic arm 44 fixed to the first robotic arm 43 and sliding along a second direction Y, a third robotic arm 45 fixed to the second robotic arm 44 and sliding along a third direction Z, and a finger cylinder 46 fixed to the third robotic arm 45 and rotatably connected to the third robotic arm 45.

[0069] Wherein, the first direction X, the second direction Y and the third direction Z are perpendicular to each other in pairs.

[0070] The visual positioning camera 42 is fixed to the finger cylinder 46. The visual positioning camera 42 is used to position the fixing part 23 in the second station S2 fixed by the substrate 200 and the pins 300 or the module 400, so as to place the substrate 200 and the pins 300 or take out the module 400.

[0071] The first robotic arm 43 includes a first guide rail 431 fixed to the first body 41 and extending along the first direction X, a first lead screw 432 installed on the first guide rail 431 and slidably connected to the first guide rail 431, and a first motor 433 extending from the first lead screw 432 and driving the first lead screw 432 to slide.

[0072] The second robotic arm 44 includes a second guide rail 441 fixed to the first robotic arm 43 and extending along the second direction Y, a second lead screw 442 installed on the second guide rail 441 and slidably connected to the second guide rail 441, and a second motor 443 extending from the second lead screw 442 and driving the second lead screw 442 to slide.

[0073] The third robotic arm 45 includes a third guide rail 451 fixed to the second robotic arm 44 and extending along the third direction Z, a third lead screw 452 installed on the third guide rail 451 and slidably connected to the third guide rail 451, and a third motor 453 extending from the third lead screw 452 and driving the third lead screw 452 to slide.

[0074] The finger cylinder 46 includes cylinder fingers 461 for clamping the substrate 200 and a cylinder motor 462 extending from the cylinder fingers 461 and driving the cylinder fingers 461 to rotate around the third robotic arm 45 as an axis.

[0075] The finger cylinder 46 is used to pneumatically control the opening or closing of the cylinder fingers 461, so as to fix the substrate 200 and the pins 300 to the fixing part 23 or take out the module 400.

[0076] The press 5 is used to press and weld the substrate 200 and the pins 300 in the fixing part 23 in the fourth station S4.

[0077] Please refer to Figure 7 as shown in Figure 7 This is a partial three-dimensional structural schematic diagram of the press 5 of the module pin welding device 100 of the present invention;

[0078] Specifically, the presser 5 includes a second body 51 fixed to the support table 1, a fourth robotic arm 52 fixed to the second body 51 and sliding along the first direction X, a fifth robotic arm 53 fixed to the fourth robotic arm 52 and sliding along the third direction Z, and a press jaw 54 fixed to the fifth robotic arm 53.

[0079] The fourth robotic arm 52 includes a fourth guide rail 521 fixed to the second body 51 and extending along the first direction X, a fourth lead screw 522 installed on the fourth guide rail 521 and forming a sliding connection with the fourth guide rail 521, and a fourth motor 523 extending from the fourth lead screw 522 and driving the fourth lead screw 522 to slide.

[0080] The fifth robotic arm 53 includes a fifth guide rail 531 fixed to the fourth robotic arm 52 and extending along the third direction Z, a fifth lead screw 532 installed on the fifth guide rail 531 and forming a sliding connection with the fifth guide rail 531, and a fifth motor 533 extending from the fifth lead screw 532 and driving the fifth lead screw 532 to slide.

[0081] When the presser 5 works, after the press jaw 54 presses down to the in-place position, the heating rod on the press jaw 54 at the pressing position is powered on, and the temperature at the pressing position instantly rises to 300 °C, melting the solder on the solder joints on the substrate 200 to weld the pins to the substrate 200. Then, the heating rod on the press jaw 54 is powered off, and after the temperature at the heating position drops below the melting point of the solder, the press jaw 54 is raised.

[0082] The cleaner 6 is used to clean the module 400 in the fixing part 23 in the second working station S2.

[0083] Please refer to Figure 8 shown in Figure 8 which is a schematic three-dimensional structure diagram of the cleaner 6 of the module pin welding device 100 of the present invention.

[0084] Specifically, the cleaner 6 includes a third body 61 fixed to the support table 1, and a suction device 62 and a blowing device 63 respectively extending from one side of the third body 61 away from the support table 1. The suction device 62 and the blowing device 63 face each other and are spaced apart from each other to form a receiving space 60, and the module 400 fixed in the fixing part 23 in the second working station S2 is received in the receiving space 60.

[0085] The suction device 62 controls the suction holes by the solenoid valve inside to suck away the solid residues on the module 400.

[0086] The blowing device 63 blows compressed air with a pressure of 0.5 MPa through the air holes controlled by the solenoid valve inside it to separate the solid residues on the pressed module 400 from the module 400.

[0087] It should be noted that the preheater 3, the pick-and-place device 4, the press 5 and the cleaner 6 in this embodiment can also adopt other commonly used devices in the art. Although the structures of other preheaters, pick-and-place devices, presses and cleaners in the art are not as simple as those of the preheater 3, the pick-and-place device 4, the press 5 and the cleaner 6 in this embodiment, they can also achieve the function of assembling the module 400. The specific device models can be selected according to actual needs and will not be elaborated in detail here.

[0088] Compared with the related art, the module pin welding device 100 of the present invention is provided with a support table 1, and a workbench 2, a preheater 3, a pick-and-place device 4, a press 5 and a cleaner 6 are installed on the support table 1; the workbench includes a support shaft, a work disk and a fixing part, and the workbench rotates the fixing part to the first station S1, the second station S2, the third station S3 and the fourth station S4 respectively through the support shaft. The first station S1, the second station S2, the third station S3 and the fourth station S4 are respectively the working stations corresponding to the preheater 3, the pick-and-place device 4, the press 5 and the cleaner 6 in the workbench 2, specifically: S1 is the position where the work disk 22 rotates to the working range of the preheater 3; the second station S2 is the position where the work disk 22 rotates to the working range of the cleaner 6, and the second station S2 is also the position where the work disk 22 rotates to the working range of the pick-and-place device 4; the third station S3 is the position where the work disk 22 rotates to the working range where the pick-and-place device 4 places the pin 300 into the fixing part 23. The fourth station S4 is the position where the work disk 22 rotates to the working range where the press 5 welds and presses the substrate 200 and the pin 300. This structure is simple, avoiding the need for a large number of better substrate carriers in the related art, facilitating welding the leads to the substrate and facilitating assembly production.

[0089] The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope, and the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A module pin soldering device, characterized in that, The module pin soldering device includes a support table, a workbench installed on the support table, and a preheater, a pick-and-place device, a press-fitting device, and a cleaner that are fixed to the support table and arranged at intervals; the workbench includes a support shaft installed on the support table and rotatably connected to the support table to form a shaft, a work disk fixed to one end of the support shaft away from the support table, and a fixing portion provided on a side of the work disk away from the support table; The workbench is used to rotate the fixing portion to the first station, the second station, the third station, and the fourth station respectively through the support shaft. The first station is a position where the work disk rotates to the working range of the preheater; the second station is a position where the work disk rotates to the working range of the cleaner. The second station is also a position where the work disk rotates to the working range where the pick-and-place device places an external substrate to be soldered into the fixing portion. The second station is also a position where the work disk rotates to the working range where the pick-and-place device takes out the module fixed in the fixing portion and formed by the substrate and the external pins to be soldered through soldering processing; the third station is a position where the work disk rotates to the working range where the pick-and-place device places the pins into the fixing portion; the fourth station is a position where the work disk rotates to the working range where the press-fitting device performs soldering and press-fitting on the substrate and the pins; The preheater is used to heat the fixing portion in the first station to a preset temperature; The pick-and-place device is used to fix the substrate to the fixing portion in the second station, and is also used to fix the pins to the fixing portion in the third station, and is also used to take out the module fixed in the fixing portion in the second station; The press-fitting device is used to perform soldering and press-fitting on the substrate and the pins in the fixing portion in the fourth station; The cleaner is used to clean the module in the fixing portion in the second station; The preheater includes a cylinder fixed to the support table, a base extending from one end of the cylinder away from the support table, a heating rod installed on the base, and a heating platform extending from one end of the base away from the support table; The cylinder is used to move the base away from or close to the support table to enable the heating platform to abut against the substrate or move away from the substrate; The heating platform is connected to the heating rod so that the heat generated by the heating of the heating rod is transferred to the heating platform; The pick-and-place device includes a first body fixed to the support table where it is located, a first robotic arm fixed to the first body and sliding in a first direction, a second robotic arm fixed to the first robotic arm and sliding in a second direction, a third robotic arm fixed to the second robotic arm and sliding in a third direction, and a finger cylinder fixed to the third robotic arm and rotatably connected to the third robotic arm; the first direction, the second direction, and the third direction are perpendicular to each other in pairs; The finger cylinder includes cylinder fingers for clamping the substrate, and the finger cylinder is used to pneumatically control the opening or closing of the cylinder fingers to fix the substrate and the pins to the fixing part or take out the module. The press includes a second body fixed to the supporting table, a fourth robotic arm fixed to the second body and sliding along a first direction, a fifth robotic arm fixed to the fourth robotic arm and sliding along a third direction, and a press jaw fixed to the fifth robotic arm. The fourth robotic arm includes a fourth guide rail fixed to the second body and extending along the first direction, a fourth lead screw installed on the fourth guide rail and forming a sliding connection with the fourth guide rail, and a fourth motor extending from the fourth lead screw and driving the fourth lead screw to slide. The fifth robotic arm includes a fifth guide rail fixed to the fourth robotic arm and extending along the third direction, a fifth lead screw installed on the fifth guide rail and forming a sliding connection with the fifth guide rail, and a fifth motor extending from the fifth lead screw and driving the fifth lead screw to slide.

2. The module pin soldering device according to claim 1, wherein, The working disk is disk-shaped, and there are multiple fixing parts. The multiple fixing parts are arranged at the same position along the radial direction of the working disk and are symmetrically and evenly distributed.

3. The module pin soldering device according to claim 2, characterized in that The fixing part includes a substrate fixing position for fixing the substrate to be welded and matching the shape of the substrate, and a pin fixing position for fixing the pins to be welded and matching the shape of the pins. The substrate fixing position and the pin fixing position correspond one by one.

4. The module pin soldering device according to claim 3, characterized in that, The preheater is spaced from the support shaft and is located between the working disk and the supporting table. The substrate fixing position is provided with a support groove penetrating therethrough. After the substrate to be welded is fixed to the substrate fixing position, the side of the substrate facing the supporting table is exposed from the working disk through the support groove. The preheater heats the substrate to a preset temperature by abutting against the side of the substrate facing the supporting table.

5. The module pin welding device according to claim 1, wherein The first robotic arm includes a first guide rail fixed to the first body and extending along the first direction, a first lead screw installed on the first guide rail and forming a sliding connection with the first guide rail, and a first motor extending from the first lead screw and driving the first lead screw to slide. The second robotic arm includes a second guide rail fixed to the first robotic arm and extending along the second direction, a second lead screw installed on the second guide rail and forming a sliding connection with the second guide rail, and a second motor extending from the second lead screw and driving the second lead screw to slide. The third robotic arm includes a third guide rail fixed to the second robotic arm and extending along the third direction, a third lead screw installed on the third guide rail and forming a sliding connection with the third guide rail, and a third motor extending from the third lead screw and driving the third lead screw to slide. The finger cylinder further includes a cylinder motor extending from the cylinder fingers and driving the cylinder fingers to rotate around the axis formed by the third robotic arm. The pick-and-place device further includes a vision positioning camera fixed to the finger cylinder. The vision positioning camera is used to position the substrate and the pins or the module fixed in the fixing part in the second station, so as to place the substrate and the pins or take out the module.

6. The module pin soldering device according to claim 1, wherein The cleaner includes a third body fixed to the support table and a suction device and a blowing device respectively extending from a side of the third body away from the support table. The suction device and the blowing device face each other and are spaced apart from each other to form a receiving space. The module fixed to the fixing part in the second station is received in the receiving space.

7. The module pin soldering device according to claim 2, wherein There are four fixing parts. The four fixing parts are respectively located in the first station, the second station, the third station and the fourth station. The angle between two adjacent fixing parts on the working disk is 90°; When the working disk rotates clockwise, one of the fixing parts rotates to the second station after passing through the second station, the first station, the third station and the fourth station in sequence.

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