Display panel and packaging method thereof

Abstract

The application provides a display screen and a packaging method thereof. The packaging method comprises the following steps: (1) attaching a black adhesive film to one side of a unit board provided with pixel units, wherein the pixel units are provided with arrayed blue light chips; (2) placing a protective film with an opening on the side of the black adhesive film away from the pixel units, pressing, cleaning, removing the black adhesive film at the opening of the protective film, forming a pit, and the opening position of the protective film corresponds to the position of at least part of the blue light chips in the pixel units; (3) filling red quantum dot material and green quantum dot material into the pit obtained in step (2) respectively, curing, forming red quantum dots and green quantum dots, and obtaining a semi-finished product; (4) placing a packaging adhesive film on the side of the semi-finished product obtained in step (3) away from the pixel units, vacuum degassing, curing, and completing the packaging of the display screen. The display screen packaging method provided by the application is simple, has good display effect, and the light color is uniform.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of light emitting diode, and particularly relates to a display screen and a packaging method thereof. BACKGROUND

[0002] LED (Light Emitting Diode) display screen is an electronic display screen composed of LED dot matrix, which is used to display various information such as text, image, video, etc. LED display screen is divided into monochrome screen, double-color screen and full-color screen. Monochrome screen refers to the display screen using one color of LED, double-color screen refers to the display screen using two colors (red and green) of LED, and full-color screen refers to the display screen using three colors (red, green and blue) of LED. Full-color screen has the widest color range, and is widely used.

[0003] With the continuous development of society, the LED industry has become one of the most active industries today, and LED display screen products have gradually entered various fields of society and life. The research on LED display screen and its preparation method is also more and more in-depth.

[0004] CN111599909A discloses an LED display screen module and a preparation method thereof. The preparation method comprises: 1) fixing an LED display screen module comprising an LED chip array on a jig, with the LED chip array placed upward; 2) injecting a black filling glue solution into the gap between the LED chips; 3) curing the black filling glue solution; 4) forming a transparent encapsulation layer; and 5) forming an ink color layer on the transparent encapsulation layer. By using the combination of transparent encapsulation layer and ink color layer, the thickness of the ink color layer is greatly reduced compared with the traditional compression mold layer, which can reduce the path change of light at different angles of emission through the ink color layer, and reduce the defects of changing display screen module luminance and color with viewing angle.

[0005] CN111554205A discloses a diversified decorative surface LED display screen and a preparation method thereof. The preparation method comprises: providing an LED display screen comprising a PCB board and LED lamp beads attached to the PCB board; using encapsulation glue to encapsulate the LED lamp beads to form an encapsulation layer, the encapsulation layer having a planar encapsulation surface; forming a decorative layer on the planar encapsulation surface; and forming a plurality of hollow structures on the decorative layer corresponding to the positions of the LED lamp beads. The diversified decorative surface LED display screen prepared by the preparation method of the diversified decorative surface LED display screen has a planar encapsulation surface 130a of the encapsulation layer, and a decorative layer is formed on the planar encapsulation surface of the encapsulation layer. The LED display screen obtained in this way can adjust the decorative layer according to the environment, so that the LED display screen can be well integrated into the environment when not working.

[0006] CN110783360A discloses a quantum dot three-color LED display screen and a preparation method thereof. The quantum dot three-color LED display screen comprises a blue light chip, a substrate arranged in layers, a support substrate, and a lens. The blue light chip is directly prepared on one side of the substrate close to the support substrate. The side of the support substrate close to the lens is uniformly coated with transparent material, green quantum dot material, and red quantum dot material. Three blue light chips are arranged at corresponding positions of each pixel area on the substrate. The transparent material, green quantum dot material, and red quantum dot material on the support substrate correspond to the three blue light chips. Each lens corresponds to one blue light chip on the substrate. The blue light chip is directly prepared on the substrate in advance, and then the substrate, support substrate, and lens are spliced to obtain the quantum dot three-color LED display screen.

[0007] In the prior art, an LED display screen usually adopts RGB three-color chips to mix white light, but there is a problem of difficult correction of multiple chip bins. The quantum dot LED backlight display screen uses a filter to filter the blue light transmitted from the quantum dot film, but the use of the filter increases the thickness of the display screen and reduces the color brightness of the original light color. Therefore, how to provide a new packaging method for quantum dot material has become a technical problem to be solved at present. SUMMARY

[0008] In view of the deficiencies of the prior art, the purpose of the present application is to provide a display screen and a packaging method thereof. In the present application, a black adhesive film is arranged on one side of a pixel unit, a protective film with an opening is then pressed on one side of the black adhesive film, and the opening position of the protective film corresponds to the position of at least part of the blue light chips in the pixel unit. Then, the black adhesive film at the opening position is removed by cleaning, and the red quantum dot material and the green quantum dot material are filled, solidified, packaged, and a three-color LED display screen is obtained.

[0009] To achieve this purpose, the present application adopts the following technical solutions:

[0010] In a first aspect, the present application provides a packaging method for a display screen, comprising the following steps:

[0011] (1) A black adhesive film is attached to one side of a unit board provided with a pixel unit, and the pixel unit is provided with an array of blue light chips;

[0012] (2) A protective film with an opening is placed on the side of the black adhesive film away from the pixel unit, pressed, cleaned, and the black adhesive film at the opening of the protective film is removed to form a pit. The opening position of the protective film corresponds to the position of at least part of the blue light chips in the pixel unit;

[0013] (3) filling the red quantum dot material and the green quantum dot material into the pits obtained in step (2) respectively, curing, forming the red quantum dot and the green quantum dot, and obtaining a semi-finished product;

[0014] (4) placing the encapsulation adhesive film on the side of the semi-finished product obtained in step (3) away from the pixel unit, vacuum degassing, and curing to complete the encapsulation of the display screen.

[0015] In the present application, the black adhesive film on the side of the pixel unit is provided with a protective film, and the opening position of the protective film corresponds to the position of at least part of the blue light chips in the pixel unit. Then, the black adhesive film at the opening position is removed by cleaning, and the red quantum dot material and the green quantum dot material are filled, cured, and encapsulated to obtain a three-color LED display screen.

[0016] In the present application, the opening position of the protective film corresponds to the position of at least part of the blue light chips in the pixel unit, which refers to the first case: the protective film on the side of the blue light chip is provided with an opening at the position corresponding to part of the blue light chips, so that the black adhesive film on the side of the part of the blue light chips can be cleaned and removed to form a pit, and then the red quantum dot material and the green quantum dot material can be filled in the pit to form the red quantum dot and the green quantum dot. The other part of the blue light chips exists as a blue quantum dot, and the protective film on the side of the other part of the blue light chips is not provided with an opening structure, so that the surface black adhesive film cannot be cleaned and removed, and thus cannot be filled with the red quantum dot material or the green quantum dot material. Therefore, the other part of the blue light chips can exist as a blue quantum dot, and a three-color LED display screen with red quantum dots, green quantum dots and blue quantum dots is formed. In the second case, the protective film on the side of the blue light chip is provided with an opening at the position corresponding to all the blue light chips, so that the black adhesive film on the side of the blue light chip is cleaned and removed to form a pit. In this case, step (3) in the above preparation method of the display screen is replaced by step (3'): filling the red quantum dot material, the green quantum dot material and a transparent material into the pit obtained in step (2) respectively, curing, forming the red quantum dot, the green quantum dot and the blue quantum dot, and obtaining a semi-finished product. The red quantum dot material and the green quantum dot material form the red quantum dot and the green quantum dot after curing, respectively. The transparent material fills the pit formed after the black adhesive film is removed, and does not affect the light emission of the blue light chip, and thus a blue quantum dot is obtained, thereby forming a three-color LED display screen with red quantum dots, green quantum dots and blue quantum dots. It should be noted that the transparent material is not limited in the present application, and exemplary embodiments include but are not limited to the transparent material with signal 2309 produced by Jiangsu Sdic New Material Science and Technology Co., Ltd.

[0017] It should be noted that the preparation method of the unit plate provided with the pixel unit is that the blue light chip is fixed on the unit plate according to the requirement of the pixel unit at a certain interval, a pixel area is formed, then reflow is performed, and the unit plate provided with the pixel unit is obtained. The unit plate is a PCB unit plate.

[0018] The following is a preferred technical solution of the present application, but not as a limitation on the technical solutions provided by the present application. Through the following preferred technical solution, the purpose and beneficial effects of the present application can be better achieved and realized.

[0019] As a preferred technical solution of the present application, the interval between the blue light chips is 0.2-2mm, for example, it can be 0.2mm, 0.4mm, 0.6mm, 0.8mm, 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm or 2mm, etc.

[0020] Preferably, the height of the blue light chip is 70-100μm, for example, it can be 70μm, 72μm, 75μm, 77μm, 80μm, 81μm, 84μm, 88μm, 90μm, 92μm, 94μm, 97μm or 100μm, etc.

[0021] As a preferred technical solution of the present application, the maximum thickness of the black adhesive film is 110-130μm, for example, it can be 110μm, 112μm, 115μm, 118μm, 120μm, 123μm, 125μm, 127μm or 130μm, etc.

[0022] It should be noted that after the black adhesive film covers one side of the unit plate provided with the pixel unit, the distance between each position on the side surface of the black adhesive film away from the unit plate and the unit plate is the same. Since the black adhesive film covers one side of the unit plate provided with the pixel unit, and the pixel unit is provided with an array of blue light chips, the thickness of the black adhesive film covering the blue light chip is smaller, and the thickness of the black adhesive film not covering the blue light chip is larger, so as to ensure that the distance between each position on the side surface of the black adhesive film away from the unit plate and the unit plate is the same. The maximum thickness of the black adhesive film refers to the thickness of the black adhesive film not covering the blue light chip.

[0023] In the present application, by controlling the thickness of the black adhesive film within a specific range, when the opening position of the protective film corresponds to the position of part of the blue light chip, the corresponding position of the protective film on the other part of the blue light chip is not provided with an opening, and the black adhesive film cannot be removed, so the blue light needs to be emitted through the black adhesive film. Therefore, if the thickness of the black adhesive film is too large, it will hinder the emission of blue light, and if the thickness of the black adhesive film is too small, it cannot form a pit, and thus the red and green quantum dots cannot be obtained. In the present application, by controlling the thickness of the black adhesive film within a specific range, a three-color LED display screen with excellent performance can be prepared.

[0024] As a preferred technical solution of the present application, the thickness of the protective film is 110-130 μm, for example, it can be 110 μm, 112 μm, 114 μm, 116 μm, 118 μm, 120 μm, 122 μm, 124 μm, 126 μm, 128 μm or 130 μm, etc.

[0025] Preferably, the protective film is a release film.

[0026] As a preferred technical solution of the present application, the cleaning method of step (3) includes gaseous ion cleaning.

[0027] Preferably, the cleaning time is 12-18 min, for example, it can be 12 min, 13 min, 14 min, 15 min, 16 min, 17 min or 18 min, etc.

[0028] Preferably, the cleaning power is 800-1200 W, for example, it can be 800 W, 810 W, 840 W, 860 W, 880 W, 900 W, 940 W, 980 W, 1000 W, 1050 W, 1100 W, 1150 W or 1200 W, etc.

[0029] In the present application, by controlling the cleaning time and the cleaning power within a specific range, the black adhesive film can be effectively removed to form a pit, and the blue light chip will not be damaged. If the cleaning time is too short or the power is too low, the formed pit is shallower and the black adhesive film cannot be effectively removed; if the cleaning time is too long or the power is too high, the blue light chip will be damaged, and the production time will be too long, which will consume a lot of resources and have adverse effects.

[0030] It should be noted that the cleaning method in the present application is: under the conditions of oxygen flow of 250-350sccm, CF4 flow of 50-70sccm, power of 800-1200W, and pressure of 25-35Pa, cleaning for 12-18min. The oxygen flow can be 250sccm, 270sccm, 300sccm, 320sccm or 350sccm, etc., the CF4 flow can be 50sccm, 52sccm, 55sccm, 57sccm, 60sccm, 63sccm, 66sccm, 68sccm or 70sccm, etc., and the pressure can be 25Pa, 27Pa, 30Pa, 33Pa or 35Pa, etc.

[0031] Preferably, the cleaning further comprises a post-treatment step.

[0032] Preferably, the post-treatment method comprises removing the protective film.

[0033] As a preferred technical solution of the present application, the curing temperature in step (3) is 80-100℃, for example, it can be 80℃, 82℃, 84℃, 86℃, 88℃, 90℃, 92℃, 94℃, 96℃, 98℃ or 100℃, etc.

[0034] Preferably, the curing time in step (3) is 8-12min, for example, it can be 8min, 9min, 10min, 11min or 12min, etc.

[0035] As a preferred technical solution of the present application, the encapsulation adhesive film comprises a diffusion region.

[0036] The preparation raw material of the encapsulation adhesive film of the diffusion region comprises diffusion powder.

[0037] The diffusion region corresponds to the position of the blue light chip.

[0038] In the present application, by adding diffusion powder in the preparation raw material of the encapsulation adhesive film at the position corresponding to the blue light chip, the light emitted by the red quantum dots, green quantum dots and blue quantum dots has good diffuse reflection effect, and a display screen with uniform light color is prepared.

[0039] Preferably, the thickness of the encapsulation adhesive film is 110-130μm, for example, it can be 110μm, 112μm, 114μm, 116μm, 118μm, 120μm, 122μm, 124μm, 126μm, 128μm or 130μm, etc.

[0040] As a preferred technical scheme of the present application, the time for vacuum debubbling in step (4) is 100-120s, for example, it can be 100s, 102s, 104s, 106s, 108s, 110s, 112s, 114s, 116s, 118s or 120s, etc.

[0041] Preferably, the temperature for solidification in step (4) is 90-110℃, for example, it can be 90℃, 92℃, 94℃, 96℃, 98℃, 100℃, 102℃, 104℃, 106℃, 108℃ or 110℃, etc.

[0042] Preferably, the time for solidification in step (4) is 3-5h, for example, it can be 3h, 3.5h, 4h, 4.5h or 5h, etc.

[0043] In the present application, the packaging method of the display screen specifically comprises the following steps:

[0044] (1) Fixing blue light chips on a unit board according to the requirements of pixel units to form pixel areas, then reflowing, to obtain the unit board provided with pixel units, the spacing between the blue light chips is 0.2-2mm, and the height of the blue light chips is 70-100μm;

[0045] Attaching a black adhesive film with a maximum thickness of 110-130μm to one side of the unit board provided with pixel units;

[0046] (2) Placing a protective film with a thickness of 110-130μm and openings on the side of the black adhesive film away from the pixel units, and pressing, under the conditions of an oxygen flow of 250-350sccm, a CF4 flow of 50-70sccm, a power of 800-1200W, and a pressure of 25-35Pa, cleaning for 12-18min to remove the black adhesive film at the openings of the protective film, forming pits, and the opening positions of the protective film correspond to the positions of part of the blue light chips in the pixel units;

[0047] (3) Filling red quantum dot material and green quantum dot material into the pits obtained in step (2) respectively, and solidifying at 80-100℃ for 8-12min to form red quantum dots and green quantum dots, obtaining a semi-finished product;

[0048] (4) Placing a packaging adhesive film with a thickness of 110-130μm on the side of the semi-finished product obtained in step (3) away from the pixel units, vacuum debubbling for 100-120s, and solidifying at 90-110℃ for 3-5h to complete the packaging of the display screen.

[0049] In a second aspect, the present application provides a display screen prepared by the packaging method of the first aspect, wherein the display screen comprises a unit board, and one side of the unit board is provided with pixel areas.

[0050] The pixel area is composed of pixel units.

[0051] As a preferred technical scheme of the present application, each of the pixel units comprises 2, 3 or 4 quantum dots.

[0052] Preferably, each of the pixel units comprises 4 quantum dots, the 4 quantum dots form a square, the 4 quantum dots comprise 1 red light quantum dot, 1 blue light quantum dot and 2 green light quantum dots, and the 2 green light quantum dots are located at the diagonal lines of the square.

[0053] Preferably, each of the pixel units comprises 3 quantum dots, the 3 quantum dots are arranged in a column, and the 3 quantum dots are 1 red light quantum dot, 1 blue light quantum dot and 1 green light quantum dot, respectively.

[0054] Preferably, each of the pixel units comprises 2 quantum dots, the 2 quantum dots are located at the diagonal lines of a square, and the quantum dots in three pixel units adjacent in the same column are arranged in the order of 1 red light quantum dot, 1 blue light quantum dot, 1 green light quantum dot, 1 red light quantum dot, 1 blue light quantum dot and 1 green light quantum dot.

[0055] Compared with the prior art, the present application has the following beneficial effects:

[0056] In the present application, by designing the display screen packaging method, further by controlling the thickness of the black adhesive film within a specific range, and cooperating with the packaging adhesive film having a specific structure, and simultaneously adopting the method of full blue light chip plus quantum dot light emitting material, the production cost of the display screen is reduced, and the display screen prepared has good display effect and uniform light color. BRIEF DESCRIPTION OF DRAWINGS

[0057] Figure 1 is a pixel area structure schematic diagram of the display screen provided by Embodiment 1 of the present application;

[0058] Figure 2 is a pixel area structure schematic diagram of the display screen provided by Embodiment 2 of the present application;

[0059] Figure 3 is Figure 2 is a sectional structure schematic diagram at A-A in the display screen;

[0060] Figure 4 is a pixel area structure schematic diagram of the display screen provided by Embodiment 3 of the present application;

[0061] In the display screen, 1 is a unit plate, 2 is a pixel area, 21 is a pixel unit, 211 is a red light quantum dot, 212 is a green light quantum dot, 213 is a blue light quantum dot, 3 is a black adhesive film, 4 is a blue light chip, 5 is a packaging adhesive film, and 51 is a diffusion area. Detailed Implementation

[0062] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be considered as specific limitations thereof.

[0063] The sources of some components in the following examples and comparative examples are as follows:

[0064] Black adhesive film: jointly developed by Jiangsu Sidike New Material Technology Co., Ltd. and Lehman, model number 2309.

[0065] Protective film: jointly developed by Jiangsu Sidike New Material Technology Co., Ltd. and Lehman, model number 2509.

[0066] Encapsulating film 1: purchased from Jiangsu Sidike New Material Technology Co., Ltd.; the encapsulating film 1 includes a diffusion region, and the raw materials for preparing the encapsulating film 1 of the diffusion region include diffusion powder, and the diffusion region corresponds to the position of the blue light chip;

[0067] Encapsulating film 2: purchased from Jiangsu Sidike New Material Technology Co., Ltd.; the raw materials used in the preparation of each part of the encapsulating film 2 contain diffusion powder;

[0068] Encapsulating film 3: purchased from Jiangsu Sidike New Material Technology Co., Ltd.; the raw materials used in the preparation of encapsulating film 3 do not contain diffusion powder;

[0069] Red quantum dot materials: Guangdong Pujiafu Optoelectronics Technology Co., Ltd.;

[0070] Green quantum dot materials: Guangdong Pujiafu Optoelectronics Technology Co., Ltd.;

[0071] Transparent material: Jiangsu Sidike New Material Technology Co., Ltd.

[0072] It should be noted that in the following embodiments, the blue light chip not covered by the red and green quantum dot materials exists as a blue light quantum dot.

[0073] Example 1

[0074] This embodiment provides a display screen and its packaging method, such as Figure 1 As shown, the display screen includes a unit board 1, and a pixel area 2 is provided on one side of the unit board 1. The pixel area 2 is composed of pixel units 21.

[0075] Each of the pixel units 21 comprises 4 quantum dots, the 4 quantum dots form a square, the 4 quantum dots comprise 1 red quantum dot 211, 1 blue quantum dot 213 and 2 green quantum dots 212, the 2 green quantum dots 212 are located at the diagonal positions of the square.

[0076] The packaging method of the display screen is as follows:

[0077] (1) Fix the blue light chips 4 on the unit plate 1 according to the requirements of the pixel units 21 to form the pixel area 2, and then reflow the fixed chips to obtain the unit plate 1 provided with the pixel units 21, the spacing between the blue light chips 4 is 0.2 mm, and the height of the blue light chip 4 is 90 μm;

[0078] The black adhesive film 3 with a maximum thickness of 120 μm is attached to one side of the unit plate 1 provided with the pixel units 21;

[0079] (2) Place the protective film with a thickness of 120 μm and an opening on the side of the black adhesive film 3 away from the pixel units, and press together, clean for 15 min under the conditions of an oxygen flow of 300 sccm, a CF4 flow of 60 sccm, a power of 1000 W and a pressure of 30 Pa, remove the black adhesive film 3 at the opening of the protective film, form a pit, and the opening position of the protective film corresponds to the position of part of the blue light chips 4 in the pixel units 21;

[0080] (3) Fill the red quantum dot material and the green quantum dot material in the pit obtained in step (2) respectively, and solidify at 80℃ for 10 min to form the red quantum dot 211 and the green quantum dot 212, and obtain a semi-finished product;

[0081] (4) Place the packaging adhesive film 5 with a thickness of 120 μm on the side of the semi-finished product obtained in step (3) away from the pixel units, vacuum degassing for 120 s, and solidify at 100℃ for 4 h to complete the packaging of the display screen, the packaging adhesive film 5 comprises a diffusion area 51, the packaging adhesive film 5 of the diffusion area 51 comprises diffusion powder in the raw materials, and the diffusion area 51 corresponds to the position of the blue light chip 4.

[0082] Embodiment 2

[0083] The embodiment provides a display screen and a packaging method thereof, as shown in Figure 2 , Figure 2 The cross-sectional structure schematic view at A-A in the display screen is shown in Figure 3 , the display screen comprises a unit plate 1, one side of the unit plate 1 is provided with a pixel area 2, and the pixel area 2 is composed of pixel units 21;

[0084] Each of the pixel units 21 comprises three quantum dots arranged in a column, and the three quantum dots are respectively a red quantum dot 211, a blue quantum dot 213 and a green quantum dot 212.

[0085] The packaging method of the display screen is as follows:

[0086] (1) The blue light chips 4 are fixed on the unit plate 1 according to the requirements of the pixel units 21 to form the pixel area 2, and then the die bonding reflow is performed to obtain the unit plate 1 provided with the pixel units 21, the spacing between the blue light chips 4 is 1 mm, and the height of the blue light chip 4 is 90 μm;

[0087] The black adhesive film 3 with a maximum thickness of 140 μm is attached to one side of the unit plate 1 provided with the pixel units 21;

[0088] (2) The protective film with a thickness of 120 μm and an opening is placed on the side of the black adhesive film away from the pixel units, and is pressed and combined, and under the conditions of an oxygen flow of 250 sccm, a CF4 flow of 70 sccm, a power of 800 W, a pressure of 35 Pa, and a cleaning time of 18 min, the black adhesive film 3 at the opening of the protective film is removed to form a pit, and the opening position of the protective film corresponds to the position of part of the blue light chips 4 in the pixel units 21;

[0089] (3) The red quantum dot material and the green quantum dot material are respectively filled in the pit obtained in step (2), and are cured at 100℃ for 8 min to form the red quantum dot 211 and the green quantum dot 212, and a semi-finished product is obtained;

[0090] (4) The packaging adhesive film 5 with a thickness of 130 μm is placed on the side of the semi-finished product obtained in step (3) away from the pixel units 21, and is vacuum degassed for 100 s, and is cured at 110℃ for 3 h to complete the packaging of the display screen, and the packaging adhesive film 5 comprises a diffusion area 51, the preparation raw material of the packaging adhesive film 5 of the diffusion area 51 comprises diffusion powder, and the diffusion area 51 corresponds to the position of the blue light chip 4.

[0091] Embodiment 3

[0092] The embodiment provides a display screen and a packaging method thereof, as shown in the drawings. Figure 4 The display screen comprises a unit plate 1, and one side of the unit plate 1 is provided with a pixel area 2, and the pixel area 2 is composed of pixel units 21.

[0093] Each of the pixel units includes two quantum dots, the two quantum dots are located at the diagonal positions of the quadrilateral, and the quantum dots in the three pixel units adjacent in the same column are arranged in turn as one red light quantum dot 211, one blue light quantum dot 213, one green light quantum dot 212, one red light quantum dot 211, one blue light quantum dot 213 and one green light quantum dot 212.

[0094] The packaging method of the display screen is as follows:

[0095] (1) The blue light chips 4 are fixed on the unit plate 1 according to the requirements of the pixel units 21 to form the pixel area 2, and then the die bonding reflow is performed to obtain the unit plate 1 provided with the pixel units 21, the spacing between the blue light chips 4 is 2 mm, and the height of the blue light chip 4 is 90 μm;

[0096] The black adhesive film 3 with a maximum thickness of 130 μm is attached to one side of the unit plate 1 provided with the pixel units 21;

[0097] (2) The protective film with a thickness of 120 μm and an opening is placed on the side of the black adhesive film 3 away from the pixel units 21, and is pressed, under the conditions of an oxygen flow of 350 sccm, a CF4 flow of 50 sccm, a power of 1200 W, a pressure of 25 Pa, and cleaning for 12 min, the black adhesive film 3 at the opening of the protective film is removed to form a pit, and the opening position of the protective film corresponds to the position of the blue light chip 4 in the pixel unit 21;

[0098] (3) The red light quantum dot material, the green light quantum dot material and the transparent material are respectively filled in the pit obtained in step (2), and are cured at 80℃ for 12 min to form the red light quantum dot 211, the green light quantum dot 212 and the blue light quantum dot 213, thereby obtaining a semi-finished product;

[0099] (4) The packaging adhesive film 5 with a thickness of 130 μm is placed on the side of the semi-finished product obtained in step (3) away from the pixel units 21, vacuum debubbling is performed for 120 s, and curing is performed at 90℃ for 5 h to complete the packaging of the display screen, the packaging adhesive film 5 includes a diffusion area 51, the preparation raw material of the packaging adhesive film 5 of the diffusion area 51 includes diffusion powder, and the diffusion area 51 corresponds to the position of the blue light chip 4.

[0100] Example 4

[0101] The embodiment provides a display screen and a packaging method thereof, and the difference from the embodiment 1 is that the maximum thickness of the black adhesive film is 100 μm, and the other conditions are the same as those of the embodiment 1.

[0102] Example 5

[0103] The embodiment provides a display screen and a packaging method thereof, and the only difference from the embodiment 1 is that the maximum thickness of the black adhesive film is 150 microns, and other conditions are the same as those in the embodiment 1.

[0104] Embodiment 6

[0105] The embodiment provides a display screen and a packaging method thereof, and the only difference from the embodiment 1 is that the packaging adhesive film 1 is replaced by a packaging adhesive film 2, the preparation raw material of the packaging adhesive 2 comprises diffusion powder, the preparation raw material of each position of the packaging adhesive film 2 prepared by the method comprises diffusion powder, and other conditions are the same as those in the embodiment 1.

[0106] Embodiment 7

[0107] The embodiment provides a display screen and a packaging method thereof, and the only difference from the embodiment 1 is that the packaging adhesive film 1 is replaced by a packaging adhesive film 3, the preparation raw material of the packaging adhesive 2 does not comprise diffusion powder, and other conditions are the same as those in the embodiment 1.

[0108] The display screen is prepared by the packaging method (the embodiments 1-3), the thickness of the black adhesive film is controlled in a specific range, the packaging adhesive film with a specific structure is used, the full blue chip and the quantum dot light emitting material are used, the production cost of the display screen is reduced, and the prepared display screen has good display effect and uniform light color.

[0109] Compared with the embodiment 1, if the thickness of the black adhesive film is too small (the embodiment 4), the concave pits cannot be formed, the red quantum dots and the green quantum dots cannot be obtained, the display effect of the prepared display screen is poor, and the uniformity of light color is poor; if the thickness of the black adhesive film is too large (the embodiment 5), the emission of blue light is hindered, the display effect of the prepared display screen is also poor, and the uniformity of light color is also poor.

[0110] Compared with the embodiment 1, if the packaging adhesive film 2 with uniform composition (the embodiment 6) or the packaging adhesive film 3 prepared from the raw material without diffusion powder (the embodiment 7) is selected, the diffuse reflection effect of the light emitted by the red quantum dots, the green quantum dots and the blue quantum dots is poor, and the uniformity of light color of the prepared display screen is also poor.

[0111] The applicant states that the present application is illustrated by the above-mentioned embodiments to show the detailed structural features and process flow of the present application, but the present application is not limited to the above-mentioned detailed structural features and process flow, i.e. it does not mean that the present application must rely on the above-mentioned detailed structural features and process flow to be implemented. It should be understood by those skilled in the art that any improvement of the present application, equivalent replacement of the selected components of the present application, addition of auxiliary components, selection of specific modes, etc., as well as equivalent replacement of raw materials of the products of the present application and addition of auxiliary components, selection of specific modes, etc., all fall within the protection scope and disclosure scope of the present application.

Claims

1. A method for packaging a display screen, characterized in that, The encapsulation method includes the following steps: (1) A black adhesive film is attached to one side of a unit board with pixel units, wherein blue light chips are arranged in an array in the pixel units; (2) Place the protective film with the opening on the side of the black adhesive film away from the pixel unit, press, clean, remove the black adhesive film at the opening of the protective film to form a pit, and the opening position of the protective film corresponds to the position of part of the blue light chip in the pixel unit. (3) Fill the pits obtained in step (2) with red quantum dot material and green quantum dot material respectively, and solidify them to form red quantum dots and green quantum dots, thus obtaining a semi-finished product; (4) Place the encapsulating film on the side away from the pixel unit of the semi-finished product obtained in step (3), degas it under vacuum, and cure it to complete the encapsulation of the display screen. The encapsulating film includes a diffusion region; The raw materials used to prepare the encapsulating film in the diffusion region include diffusion powder; The diffusion region corresponds to the position of the blue light chip; The height of the blue light chip is 70–100 μm; The maximum thickness of the black adhesive film is 110–130 μm; The cleaning method described in step (2) includes gaseous ion cleaning; The cleaning time is 12-18 minutes; The cleaning power is 800-1200W; The thickness of the encapsulating film is 110–130 μm.

2. The packaging method according to claim 1, characterized in that, The spacing between the blue light chips is 0.2 to 2 mm.

3. The packaging method according to claim 1, characterized in that, The thickness of the protective film is 110–130 μm.

4. The packaging method according to claim 1, characterized in that, The protective film is a release film.

5. The packaging method according to claim 1, characterized in that, The cleaning process also includes a post-processing step.

6. The packaging method according to claim 5, characterized in that, The post-processing method includes removing the protective film.

7. The packaging method according to claim 1, characterized in that, The curing temperature in step (3) is 80-100℃.

8. The packaging method according to claim 1, characterized in that, The curing time in step (3) is 8 to 12 minutes.

9. The packaging method according to claim 1, characterized in that, The vacuum degassing time in step (4) is 100-120 seconds.

10. The packaging method according to claim 1, characterized in that, The curing temperature in step (4) is 90-110℃.

11. The packaging method according to claim 1, characterized in that, The curing time in step (4) is 3 to 5 hours.

12. A display screen prepared by the packaging method according to any one of claims 1-11, characterized in that, The display screen includes a unit board, and a pixel area is provided on one side of the unit board; The pixel area is composed of pixel units.

13. The display screen according to claim 12, characterized in that, Each pixel unit includes 2, 3, or 4 quantum dots.

14. The display screen according to claim 12, characterized in that, Each pixel unit includes four quantum dots arranged in a square. The four quantum dots include one red quantum dot, one blue quantum dot, and two green quantum dots, with the two green quantum dots located at the diagonal of the square.

15. The display screen according to claim 12, characterized in that, Each pixel unit includes three quantum dots arranged in a row, namely one red quantum dot, one blue quantum dot, and one green quantum dot.

16. The display screen according to claim 12, characterized in that, Each pixel unit includes two quantum dots located at the diagonal of a square. The quantum dots in three adjacent pixel units in the same column are arranged in the following order: one red quantum dot, one blue quantum dot, one green quantum dot, one red quantum dot, one blue quantum dot, and one green quantum dot.

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