Semiconductor module, electrical component, and connection structure between semiconductor module and electrical component

Abstract

A semiconductor module includes a resin molded part (19) that encapsulates a semiconductor chip (10), a first terminal (15) having a plate-like shape, and a second terminal (16) having a plate-like shape. The first terminal (15) and the second terminal (16) are arranged so as to overlap each other in the thickness direction. The first terminal (15) is exposed from a first surface of the resin molded part (19), and the second terminal (16) protrudes to the outside of the resin molded part (19) from a second surface of the resin molded part (19), the second surface being different from the first surface from which the first terminal (15) is exposed. Therefore, inductance can be suppressed and insulation can be easily ensured.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor module, an electric component, and a connection structure between the semiconductor module and the electric component. Background Art

[0002] There has been a demand for reducing wiring inductance in a connection structure between semiconductor modules constituting a three-phase inverter circuit and capacitor modules including a smoothing capacitor.

[0003] For example, JP 2018-190965 A discloses a semiconductor module having two terminals connected to a semiconductor chip on an upper arm and a lower arm. The two terminals are arranged to overlap each other in the thickness direction and protrude from a resin molded part in an overlapping state. JP 2018-190965 A also discloses a capacitor module in which the two terminals connected to a smoothing capacitor are arranged to overlap each other in the thickness direction and protrude from a housing in an overlapping state. The two terminals are arranged one on top of the other in a manner to reduce wiring inductance. Summary of the Invention

[0004] In JP 2018-190965 A, the two terminals in each of the semiconductor module and the capacitor module have different protrusion lengths. Specifically, in the semiconductor module, the P terminal, which is connected to the positive pole of the power supply via the capacitor module, has a longer protrusion length than the N terminal, which is connected to the negative pole of the power supply. Furthermore, insulating paper is arranged between the P terminal and the N terminal to cover the N terminal. In the capacitor module, the P terminal has a shorter protrusion length than the N terminal, and insulating paper is arranged between the P terminal and the N terminal to cover the P terminal.

[0005] In the connection structure of the semiconductor module and the capacitor module, two terminals of the semiconductor module and two terminals of the capacitor module are arranged to face each other so that the P terminals contact each other and the N terminals contact each other.

[0006] With such terminal structures in semiconductor modules and capacitor modules, it is difficult to ensure insulation between two terminals with different potentials. Specifically, in semiconductor modules, the length of the insulating paper protruding from the N terminal defines the creepage distance between the P and N terminals. Therefore, increasing the creepage distance increases the size of the connection structure. Similarly, in capacitor modules, increasing the creepage distance increases the size of the connection structure.

[0007] An object of the present disclosure is to provide a semiconductor module, an electric component, and a connection structure between the semiconductor module and the electric component, which can easily ensure insulation while reducing inductance.

[0008] According to one aspect of the present disclosure, a semiconductor module includes a resin molded part that encapsulates a semiconductor chip therein, a first terminal having a plate-like shape, and a second terminal having a plate-like shape. The first terminal and the second terminal are arranged to overlap each other in a thickness direction of the first terminal and the second terminal. The first terminal is exposed from a first surface of the resin molded part. The second terminal protrudes from a second surface of the resin molded part, the second surface being different from the first surface from which the first terminal is exposed.

[0009] In such a configuration, since the first terminal and the second terminal are arranged so as to overlap each other, it is possible to reduce wiring inductance. In addition, since the first terminal is exposed from a first surface of the resin molded part that is different from the second surface from which the second terminal protrudes, it is easier to ensure an insulation distance between the first terminal and the second terminal, for example, compared to a configuration in which the first terminal and the second terminal protrude from the same surface.

[0010] According to a second aspect of the present disclosure, an electrical component includes a housing, a third terminal having a plate-like shape, and a fourth terminal having a plate-like shape. The third terminal and the fourth terminal are arranged to overlap each other in a thickness direction of the third terminal and the fourth terminal and protrude from the housing in an overlapping state. The third terminal is provided with a first bolt on a surface opposite to the fourth terminal. The fourth terminal is provided with a second bolt on a surface opposite to the third terminal.

[0011] In this configuration, the overlapping arrangement of the third and fourth terminals reduces wiring inductance. Furthermore, the third and fourth terminals have first and second bolts, respectively. When the electrical component is connected to the semiconductor module, the first and second terminals of the semiconductor module can slide relative to the third and fourth terminals. This makes it easy to connect the semiconductor module and the electrical component, and to ensure insulation between the semiconductor module and the electrical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The objects, features and advantages of the present disclosure will become more apparent from the following detailed description made with reference to the accompanying drawings, in which like parts are represented by like reference numerals, and in which:

[0013] Figure 1 is a circuit diagram of a three-phase inverter circuit according to a first embodiment of the present disclosure;

[0014] Figure 2 is a diagram illustrating the internal structure of a semiconductor module according to a first embodiment of the present disclosure;

[0015] Figure 3 is a top view of the semiconductor module;

[0016] Figure 4is a bottom view of the semiconductor module before external terminals are bonded thereto;

[0017] Figure 5 is a bottom view of the semiconductor module after external terminals are bonded thereto;

[0018] Figure 6 is a side view of a semiconductor module;

[0019] Figure 7 is a cross-sectional view of a portion of the semiconductor module around the connection terminals;

[0020] Figure 8 is a cross-sectional view of a portion of the semiconductor module around the connection terminals;

[0021] Figure 9 is a cross-sectional view of a portion of the semiconductor module around the connection terminals;

[0022] Figure 10 is a top view of a capacitor module according to a first embodiment of the present disclosure;

[0023] Figure 11 is a side view of a portion of the capacitor module around the connection terminals;

[0024] Figure 12 is a top view of the connection structure between the semiconductor module and the capacitor module;

[0025] Figure 13 It is a bottom view of the connection structure between the semiconductor module and the capacitor module;

[0026] Figure 14 is a side view of the connection structure before a nut is tightened thereon; and

[0027] Figure 15 It is a side view of the connection structure after the nut is tightened thereon. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the embodiments described below, the same or equivalent parts are denoted by the same reference numerals.

[0029] (First embodiment)

[0030] A first embodiment of the present disclosure will be described. This embodiment includes a semiconductor module provided with a three-phase inverter circuit for driving a three-phase AC motor and a capacitor module provided with a smoothing capacitor connected to the three-phase inverter circuit.

[0031] like Figure 1As shown, a three-phase inverter circuit 1 is used to drive a load 3, which is a three-phase AC motor, based on a DC power supply 2. A smoothing capacitor 4 is connected in parallel with the three-phase inverter circuit 1 and is configured to reduce ripple and suppress the effects of noise during switching, thereby generating a constant power supply voltage.

[0032] The three-phase inverter circuit 1 has three upper-lower arm circuits connected in parallel, each of which includes upper arms 51, 53, 55 and lower arms 52, 54, 56 connected in series. The three-phase inverter circuit 1 alternately applies an intermediate potential between the upper arms 51, 53, 55 and the lower arms 52, 54, 56 to the U-phase, V-phase, and W-phase of a three-phase AC motor serving as a load 3.

[0033] Specifically, the upper and lower arms 51-56 respectively have semiconductor switching elements 51a-56a (such as IGBTs and MOSFETs), and rectifying elements 51b-56b for return current, such as FWDs. As the semiconductor switching elements 51a-56a of the upper and lower arms 51-56 of each phase are controlled to be turned on and off, three-phase AC power with different cycles is supplied to the three-phase AC motor. This drives the three-phase AC motor. Here, IGBT is the abbreviation of Insulated Gate Bipolar Transistor. MOSFET is the abbreviation of Metal-Oxide-Semiconductor Field-Effect Transistor. FWD is the abbreviation of Free Wheeling Diode.

[0034] In this embodiment, the semiconductor chip forming the three-phase inverter circuit 1, which is composed of semiconductor switching elements 51a-56a and rectifying elements 51b-56b, is modularized and integrated. That is, the three-phase inverter circuit 1 is configured as a semiconductor module having a 6-in-1 structure in which six arms are integrated.

[0035] The structure of the semiconductor module will be described in detail. Figure 2-7 The semiconductor module 6 shown in FIG. 1 includes a semiconductor chip 10, lead frames 11 and 12, an output terminal 13, a control terminal 14, connection terminals 15 and 16, and heat dissipation plates 17 and 18. These components of the semiconductor module 6 are encapsulated by a rectangular plate-like resin molding 19.

[0036] In the semiconductor module 6, six semiconductor chips 10 are provided corresponding to the upper and lower arms 51 to 56. The semiconductor chips 10 constituting the upper and lower arms 51 to 56 are referred to as semiconductor chips 101 to 106, respectively.

[0037] like Figure 2 As shown, six semiconductor chips 10 are arranged in three rows. Specifically, the semiconductor chips 101, 103, and 105 constituting the upper arms 51, 53, and 55 are arranged in this order along one direction parallel to the upper surface of the resin mold 19. The semiconductor chips 102, 104, and 106 are arranged in this order along the one direction (i.e., the arrangement direction of the semiconductor chips 101, 103, and 105).

[0038] The semiconductor chips 101, 103, and 105 of the upper arm are mounted on the front surface side of the lead frame 11, and the semiconductor chips 102, 104, and 106 of the lower arm are mounted on the rear surface side of the lead frame 12. The semiconductor chips 101, 103, and 105 are connected to the output terminal 13 via the lead frame 11. The semiconductor chips 102, 104, and 106 are connected to the output terminal 13 via the lead frame 12, a wiring layer (not shown), and the lead frame 11.

[0039] The semiconductor module 6 has three output terminals 13. The three output terminals 13 are respectively connected to the U phase, V phase, and W phase of the load 3. Each output terminal 13 is made of a plate-like conductive member and protrudes from a side surface of the resin mold 19.

[0040] Each semiconductor chip 10 is connected to a control terminal 14. The control terminal 14 is provided by a rod-shaped conductive member. One end of the control terminal 14 is connected to the semiconductor chip 10, and the other end of the control terminal 14 protrudes from the side surface of the resin mold 19. The portion of the control terminal 14 exposed from the resin mold 19 has a bent portion so as to protrude toward the upper surface side of the resin mold 19.

[0041] A control terminal 14 is provided for each semiconductor chip 10. The control terminals 14 corresponding to the semiconductor chips 101, 103, and 105 of the upper arm protrude from the same side surface of the resin mold 19 as the output terminals 13. The control terminals 14 corresponding to the semiconductor chips 102, 104, and 106 of the lower arm protrude from the side surface of the resin mold 19 on the opposite side to the output terminals 13.

[0042] Connection terminals 15 and 16 are used to connect semiconductor chip 10 to capacitor module 7, which will be described later. Each of connection terminals 15 and 16 has a plate-like shape. Connection terminals 15 and 16 are arranged one on top of the other, overlapping in their thickness direction, and projecting from the side surfaces of resin mold 19 in an overlapping state. Note that connection terminals 15 and 16 are spaced apart from each other and electrically insulated. The thickness direction is also referred to as the overlapping direction and corresponds to a direction perpendicular to the surfaces of connection terminals 15 and 16.

[0043] The connection terminal 15 is a terminal for connecting the semiconductor chips 101, 103, and 105 to the positive electrode of the DC power supply 2 via the capacitor module 7. The connection terminal 16 is a terminal for connecting the semiconductor chips 102, 104, and 106 to the negative electrode of the DC power supply 2 via the capacitor module 7. The connection terminal 15 corresponds to a first terminal, and the connection terminal 16 corresponds to a second terminal.

[0044] The connection terminals 15 include internal terminals 15a encapsulated in the resin mold 19 and external terminals 15b arranged outside the resin mold 19. The internal terminals 15a are provided by plate-shaped conductive members and are connected to the semiconductor chips 101, 103, and 105 of the upper arm via the lead frame 11.

[0045] The semiconductor module 6 has two connection terminals 15. The two connection terminals 15 are arranged on opposite sides of the semiconductor chips 103 and 104 in the middle row of the six semiconductor chips 10 arranged in three rows. In other words, the two connection terminals 15 are arranged so that the semiconductor chips 103 and 104 in the middle row are positioned between them relative to the arrangement direction of the semiconductor chips 101, 103, and 105. Specifically, the internal terminal 15a of one of the two connection terminals 15 is arranged so as to pass between the semiconductor chips 101 and 103 of the upper arm and between the semiconductor chips 102 and 104 of the lower arm. The internal terminal 15a of the other of the two connection terminals 15 is arranged so as to pass between the semiconductor chips 103 and 105 of the upper arm and between the semiconductor chips 104 and 106 of the lower arm.

[0046] The internal terminal 15a is connected to the semiconductor chips 101, 103, 105 at one end thereof in the longitudinal direction, and the other end thereof protrudes from the side surface of the resin mold 19 on the side opposite to the output terminal 13. Figures 3 to 7 As shown, the resin molded part 19 is formed with a rectangular plate-shaped protrusion 19a on the side surface from which the control terminal 14 of the lower arm protrudes. The portion of the internal terminal 15a protruding from the side surface of the resin molded part 19 is covered by the protrusion 19a and is partially exposed from an opening formed on the bottom surface of the protrusion 19a, as shown in FIG. Figure 4 and Figure 7 The exposed portion of the internal terminal 15a is joined to the external terminal 15b by ultrasonic welding, soldering, etc. Figure 5 shown.

[0047] The external terminal 15b is provided by a plate-like conductive member and is bent to have a crank shape when viewed from the side, as shown in FIG. Figure 6As shown. One end of the external terminal 15b, located on one side of the bend, is connected to the internal terminal 15a, and the other end of the external terminal 15b, located on the other side of the bend, protrudes outside the protrusion 19a. The other end of the external terminal 15b extends along the bottom surface of the protrusion 19a, spaced apart from the surface of the protrusion 19a. The distance between the other end of the external terminal 15b and the protrusion 19a is greater than 0.1mm and less than 2mm to prevent foreign matter from biting. The other end of the external terminal 15b is connected to the capacitor module 7.

[0048] The connection terminal 16 is provided by a plate-shaped conductive member. The connection terminal 16 is connected to the semiconductor chip 10 of the lower arm via the lead frame 12. One end of the connection terminal 16 in its longitudinal direction is connected to the semiconductor chip 102, 104, 106 of the lower arm, and the other end of the connection terminal 16 protrudes from the side surface of the resin molded part 19 on the side opposite to the output terminal 13. The other end of the connection terminal 16 protrudes from the tip end surface of the protrusion 19a. The other end of the connection terminal 16 protrudes in the same direction as the external terminal 15b. The base of the connection terminal 16 is covered with the protrusion 19a. The connection terminal 16 is connected to the capacitor module 7 at the portion exposed from the protrusion 19a.

[0049] The semiconductor module 6 includes two connection terminals 16. In addition, as described above, the semiconductor module 6 includes two connection terminals 15. Figure 2 As shown, each of the two internal terminals 15 a is layered with a corresponding one of the two connection terminals 16 and the lead frame 12 in a region covered with the resin mold 19 .

[0050] The internal terminal 15a is exposed on a surface of the resin mold 19 different from the surface of the resin mold 19 from which the connection terminal 16 protrudes. Specifically, the connection terminal 16 protrudes from the tip end surface of the protrusion 19a. The internal terminal 15a is arranged along the connection terminal 16 inside the protrusion 19a, as shown in FIG. Figure 2 and Figure 7 Furthermore, as described above, the internal terminal 15a is exposed from the opening formed on the bottom surface of the protruding portion 19a.

[0051] It is designed so that a creepage distance between the internal terminal 15 a and the connection terminal 16 along the surface of the protrusion 19 a is greater than a length that ensures insulation between the internal terminal 15 a and the connection terminal 16 when a predetermined effective voltage is applied.

[0052] exist Figure 7In the embodiment, for example, the bottom surface of the protrusion 19a from which the internal terminal 15a is exposed is a flat surface. As another example, the protrusion 19a may have a protrusion 19b on the bottom surface from which the internal terminal 15a is exposed, such as Figure 8 As another example, the protrusion 19a may have an uneven or rough portion 19c on the bottom surface from which the internal terminal 15a is exposed, as shown in FIG. Figure 9 As a result, the creepage distance between the internal terminal 15 a and the connection terminal 16 can be increased.

[0053] The surface of the external terminal 15b that is perpendicular to the overlapping direction of the internal terminal 15a and the connecting terminal 16 has the same shape as the surface of the connecting terminal 16 that is perpendicular to the overlapping direction. Specifically, the tip of the external terminal 15b and the tip of the connecting terminal 16 that protrude from the protrusion 19a each have a U-shape divided into two parts. The tip of the external terminal 15b and the tip of the connecting terminal 16 have the same or substantially the same U-shape. In addition, the external terminal 15b and the connecting terminal 16 have the same or substantially the same protrusion length in the protruding direction. That is, the tip of the external terminal 15b and the tip of the connecting terminal 16 are located at the same or substantially the same position relative to the tip surface of the protrusion 19a.

[0054] The width of the opening at the tip end of each of the external terminal 15b and the connecting terminal 16 is larger than the diameter of the bolts 21a and 22a to be described later. In addition, the external terminal 15b and the connecting terminal 16 are designed so that the opening from the base to the U-shaped tip end has a certain length in order to provide space for the tightening work of the nuts 26 and 27 with the bolts 21a and 22a, which will be described later.

[0055] On the side surface of the resin molded part 19 opposite to the output terminal 13, the control terminal 14 and the connecting terminals 15 and 16 are arranged with a predetermined distance between them in the arrangement direction. For example, the distance between the control terminal 14 and the connecting terminals 15 and 16 is designed to be greater than a distance that can ensure insulation between the control terminal 14 and the connecting terminals 15 and 16 when a predetermined surge voltage is applied.

[0056] The heat sinks 17 and 18 serve as heat sinks. Each of the heat sinks 17 and 18 is arranged with a surface facing the semiconductor chip 10. The semiconductor chip 10 is connected to the heat sinks 17 and 18 via the lead frames 11 and 12, and the surfaces of the heat sinks opposite the lead frames 11 and 12 are exposed from the resin mold 19. As described above, each semiconductor chip 10 is placed between the heat sinks 17 and 18. The semiconductor module 6 is used to drive the load 3 while dissipating heat while being sandwiched between cooling devices (not shown) arranged on both sides in the thickness direction.

[0057] The smoothing capacitor 4 is set as Figure 10 and Figure 11 The capacitor module 7 shown in FIG. 1 includes a housing 20, connection terminals 21 and 22, insulating paper 23, and connection terminals 24 and 25. The capacitor module 7 corresponds to an electrical component.

[0058] The housing 20 is made of resin. A plurality of smoothing capacitors 4 are provided inside the housing 20. Connection terminals 21, 22, 24, and 25 are connected to the smoothing capacitors 4 inside the housing 20. The connection terminals 21 and 22 are terminals for connecting the smoothing capacitors 4 to the semiconductor modules 6.

[0059] Each of the connection terminals 21 and 22 is formed of a plate-shaped conductive member. The connection terminals 21 and 22 are arranged one on top of the other, i.e., they overlap each other and protrude from the housing 20 in an overlapping state. The protruding portion of the connection terminal 21 is connected to the external terminal 15b of the semiconductor module 6, and the protruding portion of the connection terminal 22 is connected to the connection terminal 16. The connection terminal 21 corresponds to the third terminal, and the connection terminal 22 corresponds to the fourth terminal. The overlapping direction of the connection terminals 21 and 22 corresponds to the plate thickness direction of the connection terminals 21 and 22.

[0060] The surfaces of the connection terminals 21 and 22 in a direction perpendicular to the overlapping direction have the same or substantially the same shape as each other. The connection terminals 21 and 22 have the same or substantially the same length protruding from the housing 20. For this reason, compared with a configuration in which one of the connection terminals 21 and 22 is longer than the other, it is easy to ensure insulation and shorten the connection structure, which will be described later.

[0061] In the protrusion of the connection terminal 21 protruding from the housing 20, a bolt 21a is formed on the surface opposite to the connection terminal 22. In the protrusion of the connection terminal 22 protruding from the housing 20, a bolt 22a is formed on the surface opposite to the connection terminal 21. The bolts 21a and 22a are each made of conductive metal.

[0062] Two bolts 21a and 22a are formed corresponding to the two connection terminals 15 and the two connection terminals 16. The connection terminals 21 and 22 are designed to have a certain length from the base to the bolts 21a, 22a in order to provide space for the tightening work of nuts 26, 27, which will be described later.

[0063] Insulation paper 23 is arranged between connection terminal 21 and connection terminal 22. Insulation paper 23 is used to suppress contact between connection terminal 21 and connection terminal 22 to maintain electrical insulation. Insulation paper 23 is made of, for example, Nomex (registered trademark). Insulation paper 23 corresponds to an insulating layer.

[0064] Insulating paper 23 protrudes from housing 20, just like connecting terminals 21 and 22. Insulating paper 23 covers the surface of connecting terminal 21 facing connecting terminal 22 and the surface of connecting terminal 22 facing connecting terminal 21. That is, outside housing 20, the surface of the protruding portion of connecting terminal 21 and the surface of the protruding portion of connecting terminal 22 are entirely opposite to each other with insulating paper 23 interposed therebetween.

[0065] As a result, the creepage distance of connection terminals 21 and 22 along insulating paper 23 is twice the protruding length of insulating paper 23 relative to connection terminals 21 and 22. This is designed so that the creepage distance is greater than the length required to ensure insulation of connection terminals 21 and 22 when a predetermined effective voltage is applied. Insulating paper 23 is designed so that its thickness is greater than the thickness required to ensure insulation of connection terminals 21 and 22 when a predetermined surge voltage is applied.

[0066] like Figure 11 As shown, the tip of the insulating paper 23 is bent to have a crank shape when viewed from the side surface of the housing 20 to avoid contact with the connection terminals 15 and 16 of the semiconductor module 6. The connection terminals 15 and 16 may be protected by insulating tape to avoid contact with the insulating paper 23.

[0067] Connection terminals 24 and 25 protrude from the side surface of the housing 20 opposite to the side from which the connection terminals 21 and 22 protrude. The connection terminals 24 and 25 are terminals for connecting the smoothing capacitor 4 to the DC power supply 2. By connecting the connection terminals 21 and 22 to the semiconductor module 6 and connecting the connection terminals 24 and 25 to the DC power supply 2, the smoothing capacitor 4 and each semiconductor chip 10 are connected to the DC power supply 2.

[0068] The connection structure of the semiconductor module 6 and the capacitor module 7 will be described. The connection structure is formed by connecting the semiconductor module 6 and the capacitor module 7, as shown in FIG. Figures 12 to 15 shown.

[0069] That is, the external terminal 15b and the connection terminal 16 of the semiconductor module 6 slide relative to the connection terminals 21 and 22 of the capacitor module 7 so that the tip end of the external terminal 15b and the tip end of the connection terminal 16 come into contact with the bolts 21a and 22a. Figure 14 As shown, the connection terminals 21 and 22 and the insulating paper 23 are received between the external terminal 15 b and the connection terminal 16 .

[0070] Then, if Figure 12 、 13 As shown in FIG15, the external terminal 15b is connected to the connection terminal 21 by means of a bolt 21a and a nut 26. Similarly, the connection terminal 16 is connected to the connection terminal 22 by means of a bolt 22a and a nut 27. The nuts 26 and 27 are made of conductive metal.

[0071] As described above, the connection structure has a stacked structure in which the connection terminals 15 and 16 and the connection terminals 21 and 22 are arranged one on top of another in the thickness direction of the connection terminals 15 , 16 , 21 , and 22 .

[0072] For example, Figure 14 As shown, the distance between the external terminal 15b and the connection terminal 16 in the thickness direction is called the distance T gap , and the distance in the thickness direction between the outer surface of the connection terminal 21 opposite to the connection terminal 22 and the outer surface of the connection terminal 22 opposite to the connection terminal 21 is referred to as the distance T co . Distance T gap and distance T co Designed so that the distance T gap The minimum value is equal to or greater than the distance T co The maximum value of .

[0073] like Figure 15 As shown, in the connection structure, a portion of the resin molded part 19 or a portion of the insulating paper 23 is located on a straight line connecting any point of the external terminal 15b or the connection terminal 21 on the positive electrode side and any point of the connection terminal 16 or the connection terminal 22 on the negative electrode side. Specifically, in the space defined between the connection terminals 21 and 22 and the protrusion 19a, the insulating paper 23 is arranged between the external terminal 15b and the connection terminal 16. In addition, the corner of the protrusion 19a is arranged between the base of the external terminal 15b and the base of the connection terminal 16.

[0074] As described above, in the semiconductor module 6 of the present embodiment, the connection terminals 15 and 16 each have a plate-like shape. The connection terminals 15 and 16 are arranged one on top of the other, that is, arranged to overlap each other. The connection terminal 16 protrudes to the outside of the resin mold 19, and the internal terminal 15a of the connection terminal 15 is exposed from a surface of the protrusion 19a of the resin mold 19 that is different from the surface from which the connection terminal 16 protrudes. The surface of the protrusion 19a of the resin mold 19 from which the internal terminal 15a is exposed will also be referred to as the bottom surface or first surface. The surface of the protrusion 19a of the resin mold 19 from which the connection terminal 16 protrudes will also be referred to as the tip surface or second surface.

[0075] Since the connection terminals 15 and 16 overlap in this manner, it is possible to reduce wiring inductance by magnetic cancellation. In addition, since the internal terminal 15a is exposed from a surface of the resin mold 19 that is different from the surface from which the connection terminal 16 protrudes, it is easy to ensure the insulation distance between the internal terminal 15a and the connection terminal 16, for example, compared to a configuration in which the internal terminal 15a and the connection terminal 16 protrude from the same surface.

[0076] In the capacitor module 7 of this embodiment, the connection terminals 21 and 22 each have a plate-like shape. The connection terminals 21 and 22 are arranged one on top of the other and protrude from the housing 20 in an overlapping state. The connection terminal 21 has a bolt 21a formed on the surface opposite to the connection terminal 22. The connection terminal 22 has a bolt 22a formed on the surface opposite to the connection terminal 21.

[0077] Since connection terminals 21 and 22 have this overlapping structure, wiring inductance can be reduced through magnetic cancellation. Furthermore, since connection terminals 21 and 22 have bolts 21a and 22a as described above, semiconductor module 6 and capacitor module 7 can be connected simply by sliding connection terminals 15 and 16 relative to connection terminals 21 and 22. This makes it easy to connect semiconductor module 6 and capacitor module 7, and also makes it easy to ensure insulation.

[0078] According to the above-described embodiment, the following effects are achieved.

[0079] (1) The connection terminals 15 and 16 are covered with the protrusion 19a of the resin mold 19, and overlap each other at the portion covered by the protrusion 19a. In addition, the connection terminal 16 protrudes from the surface of the protrusion 19a to the outside of the resin mold 19. The internal terminal 15a of the connection terminal 15 is exposed from the protrusion 19a through an opening formed on a surface of the protrusion 19a different from the surface from which the connection terminal 16 protrudes.

[0080] By exposing the internal terminal 15a of the connection terminal 15 through the opening of the protrusion 19a as described above, the insulation distance can be more easily ensured. In the case where the protrusion 19a is provided with the protrusion 19b or the rough portion 19c on its bottom surface, the insulation distance can be more easily ensured.

[0081] When the surface of the resin molded part 19 is covered with a mold release component, the degradation of the mechanical and electrical properties caused by moisture absorption and dirt adhesion can be reduced. This can suppress the degradation of creepage insulation performance. For example, when the resin molded part 19 is formed by transfer molding, the surface of the resin molded part 19 is covered with a mold release component. In this case, the above-mentioned effect can be achieved without performing steps such as surface treatment of the protrusion 19a. This can suppress the increase in manufacturing costs of the semiconductor module 6.

[0082] (2) The external terminal 15b is connected to the internal terminal 15a at the opening of the protrusion 19a. Furthermore, the external terminal 15b has the same planar shape as the connection terminal 16. That is, the surface of the external terminal 15b perpendicular to the overlapping direction has the same shape as the surface of the connection terminal 16 perpendicular to the overlapping direction. In other words, the external terminal 15b and the connection terminal 16 have the same protruding length relative to the end face of the protrusion 19a. With this configuration, the length of the connection structure between the semiconductor module 6 and the capacitor module 7 can be shortened compared to a case where the terminals have different protruding lengths. Furthermore, insulation can be easily ensured.

[0083] (3) The internal terminals 15a are arranged to overlap at the portion covered with the resin mold 19 on the lead frame 12 connected to the connection terminals 16. In this case, the wiring inductance can be reduced and the thickness dimension of the semiconductor module 6 can be reduced.

[0084] (4) The semiconductor module 6 includes six semiconductor chips 10, two connection terminals 15, and two connection terminals 16. The six semiconductor chips 10 are arranged in three rows, and the connection terminals 15 and 16 are arranged to sandwich the semiconductor chips 103 and 104 arranged in the middle row of the three rows.

[0085] (5) Since the connection terminals 15 and 16 are drawn out, i.e., extended in parallel, the wiring inductance can be reduced. Three or more sets of connection terminals can be drawn out in parallel. The greater the number of sets of drawn out connection terminals, the greater the effect of reducing the wiring inductance. However, when the number of drawn out connection terminals is two, the wiring inductance can be reduced and the size increase of the semiconductor module 6 can be suppressed.

[0086] (6) The surface of the connection terminal 21 facing the connection terminal 22 and the surface of the connection terminal 22 facing the connection terminal 21 are covered with insulating paper 23. In this configuration, since the electrical insulation of the connection terminals 21 and 22 is ensured by the creepage distance of the insulating paper 23, the length of the connection structure between the semiconductor module 6 and the capacitor module 7 can be shortened.

[0087] (7) In the connection structure between the semiconductor module 6 and the capacitor module 7, the connection terminals 15, 16, 21, and 22 are arranged one on top of the other. In this arrangement, the load generated when the bolts are tightened is received by the four terminals, thereby suppressing deformation of the terminals and poor contact.

[0088] (8) A portion of the resin molded part 19 or a portion of the insulating paper 23 is arranged on a straight line connecting a point on the connection terminal 15 or the connection terminal 21 on the positive electrode side and a point on the connection terminal 16 or the connection terminal 22 on the negative electrode side. In such a configuration, the size of the connection structure is kept small, and insulation can be easily ensured.

[0089] (9) The external terminal 15b and the connection terminal 16 are connected to the connection terminal 21 and the connection terminal 22 by bolts 21a and 22a made of conductive metal and nuts 26 and 27, respectively. By using the bolts 21a, 22a and nuts 26, 27 made of metal, strong connection and pressure welding are possible, and the connection between the terminals becomes stable.

[0090] (Other embodiments)

[0091] The present disclosure is not limited to the above-mentioned embodiments and may be modified in various other ways. The various components or features of the above-mentioned embodiments are not necessarily necessary, unless it is clearly stated in the previous description that these components or features are necessary, or unless these components or features are obviously necessary in principle. The numerical values ​​such as the numerical values ​​of the quantity, the value of the number, the quantity, the range, etc. of the components mentioned in the above-mentioned embodiments are not limited to specific numbers, unless they need to be specifically specified, clearly limited to a specific number in principle, etc. The shapes, positional relationships, etc. of the components mentioned in the above-mentioned embodiments are not limited to those mentioned, and in principle are not limited to specific shapes, positional relationships, etc. unless otherwise specified.

[0092] The present disclosure can be applied to semiconductor modules constituting any circuit other than a three-phase inverter circuit. In addition, the present disclosure can be applied to electrical components other than capacitor modules.

[0093] The connection terminals 15 can be connected to the semiconductor chips 102, 104, 106 of the lower arm, and the connection terminals 16 can be connected to the semiconductor chips 101, 103, 105 of the upper arm. In this case, for example, the semiconductor chips 101, 103, 105 of the upper arm are mounted on the rear surface of the lead frame 12, and the semiconductor chips 102, 104, 106 of the lower arm are mounted on the front surface of the lead frame 11. In addition, the connection terminals 16 can be arranged so as to overlap with the lead frame 11 connected to the connection terminals 15 at the portion covered with the resin mold 19.

Claims

1. A semiconductor module, comprising: Resin molded parts that encapsulate semiconductor chips; a first terminal having a plate-like shape; and A second terminal having a plate-like shape, wherein The first terminal and the second terminal are arranged to overlap each other in a thickness direction of the first terminal and the second terminal, The first terminal is exposed from the first surface of the resin mold, and The second terminal protrudes to the outside of the resin mold from a second surface of the resin mold, the second surface being different from the first surface from which the first terminal is exposed.

2. The semiconductor module according to claim 1, wherein The resin molded part has a protrusion, The first terminal and the second terminal are covered with the protrusion and overlap each other inside the protrusion, the second surface from which the second terminal protrudes is included in the protrusion, The first surface from which the first terminal is exposed is included in the protrusion, and The first surface has an opening, and the first terminal is exposed on the first surface through the opening.

3. The semiconductor module according to claim 2, wherein The first terminal includes an internal terminal and an external terminal, the internal terminal is covered with the resin mold and exposed on the first surface through the opening, The external terminal is joined to the internal terminal through the opening on the first surface, and The external terminal has a surface having the same shape as that of the second terminal, and the surface of the external terminal and the surface of the second terminal are orthogonal to a thickness direction of the first terminal and the second terminal.

4. The semiconductor module according to claim 1 , wherein The second terminal is connected to the lead frame inside the resin molded part, and The first terminal overlaps the lead frame in a region covered with the resin mold.

5. The semiconductor module according to claim 1, wherein The first terminal is connected to a lead frame inside the resin molded part, and The second terminal overlaps the lead frame in a region covered with the resin mold.

6. The semiconductor module according to any one of claims 1 to 3, wherein The first terminal is one of the two first terminals, and The second terminal is one of the two second terminals.

7. The semiconductor module according to claim 6, wherein The semiconductor chip is one of six semiconductor chips, The six semiconductor chips are arranged in three rows, the three rows including a first row, a second row, and a middle row located between the first row and the second row, The two first terminals are arranged on opposite sides of the semiconductor chip on the middle row, and The two second terminals are arranged on opposite sides of the semiconductor chip on the middle row.

8. An electrical component comprising: case; a third terminal having a plate-like shape; and A fourth terminal having a plate-like shape, wherein The third terminal and the fourth terminal are arranged to overlap each other in a thickness direction of the third terminal and the fourth terminal and protrude from the housing in an overlapping state, The third terminal has a first bolt formed on a surface opposite to the fourth terminal, The fourth terminal has a second bolt formed on a surface opposite to the third terminal, The first bolt protrudes on the side opposite to the fourth terminal, and The second bolt protrudes on a side opposite to the third terminal.

9. The electrical component according to claim 8, further comprising: an insulating layer disposed between the third terminal and the fourth terminal, and A surface of the third terminal facing the fourth terminal and a surface of the fourth terminal facing the third terminal are covered with the insulating layer.

10. A connection structure comprising: The semiconductor module according to any one of claims 1 to 7, and The electrical component according to claim 8 or 9, wherein The first terminal, the second terminal, the third terminal, and the fourth terminal are arranged one on top of another in a thickness direction.

11. The connection structure according to claim 10, wherein the first terminal is connected to the third terminal, The second terminal is connected to the fourth terminal, and A portion of the resin molded part is arranged on a straight line connecting a point on the first terminal or the third terminal and a point on the second terminal or the fourth terminal.

12. The connection structure according to claim 10, wherein The first and second terminals of the semiconductor module are connected to the third and fourth terminals of the electrical component using the first and second bolts made of conductive metal and nuts, respectively.

13. A connection structure comprising: The semiconductor module according to any one of claims 1 to 7, and The electrical component according to claim 9, wherein The first terminal, the second terminal, the third terminal and the fourth terminal are arranged one on top of another in the thickness direction, wherein the first terminal is connected to the third terminal, The second terminal is connected to the fourth terminal, and A portion of the insulating layer is arranged on a straight line connecting a point on the first terminal or the third terminal and a point on the second terminal or the fourth terminal.

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