Micro-led product and preparation method thereof

Abstract

The application provides a Micro-LED product and a preparation method thereof. The Micro-LED product and a Micro-LED display chip are provided with an adapter plate on one side of the Micro-LED display chip, and a flexible circuit board is provided on the side of the adapter plate far from the Micro-LED display chip, and the Micro-LED display chip is electrically connected with the flexible circuit board through the adapter plate. The Micro-LED product and the preparation method thereof can solve the problem of low space utilization of the existing Micro-LED product packaging.

Description

Technical Field

[0001] This invention relates to the field of loudspeaker technology, and more specifically, to a Micro-LED product and its manufacturing method. Background Technology

[0002] Micro-LED (micro-light-emitting diode) products are made by thinning, miniaturizing, and arraying LED structures, reducing their size to about 1-10μm, transferring them to a substrate in batches, and then encapsulating them to complete the display of micro-LEDs.

[0003] Micro LED display technology refers to a display technology that uses self-emissive, micrometer-sized LEDs as light-emitting pixel units, assembling them onto a driving panel to form a high-density LED array. Due to the small size, high integration, and self-emissive nature of micro LED chips, they have significant advantages over LCD and OLED displays in terms of brightness, resolution, contrast ratio, energy consumption, lifespan, response speed, and thermal stability.

[0004] Currently, in existing Micro-LED product structures, the Micro-LED chip 1' is electrically connected to the printed circuit board 5' or flexible circuit board 6' via pads and wire bonding. The specific structure is as follows: Figure 1 As shown, pads 2' need to be set on the Micro-LED chip 1' and the printed circuit board 5'. Then, the pads on the Micro-LED chip and the pads on the printed circuit board are connected by bonding wires 3'. In order to prevent other external devices from causing electrical interference to the entire structure, a layer of protective adhesive 4' needs to be set around the bonding wires and pads to isolate the bonding wires and pads from the outside world.

[0005] However, while this existing Micro-LED product structure can protect the bonding wires, the large space required for the bonding wires and protective adhesive (especially the protective adhesive) prevents further miniaturization of the Micro-LED product structure, severely impacting the utilization rate of the Micro-LED product packaging space.

[0006] Based on the above technical requirements, there is an urgent need for a structure that can significantly improve the utilization rate of Micro-LED product packaging space. Summary of the Invention

[0007] In view of the above problems, the purpose of this invention is to provide a Micro-LED product and its preparation method to solve the problem of low space utilization in existing Micro-LED products.

[0008] The Micro-LED product provided by the present invention includes a Micro-LED display chip; an adapter board is disposed on one side of the Micro-LED display chip, and a flexible circuit board is disposed on the side of the adapter board away from the Micro-LED display chip, wherein the Micro-LED display chip is electrically connected to the flexible circuit board through the adapter board.

[0009] Furthermore, a preferred embodiment is that a bump is provided on the Micro-LED display chip, and the Micro-LED display chip is electrically connected to the adapter board through the bump.

[0010] In addition, a preferred embodiment is to provide an anisotropic conductive adhesive film between the flexible circuit board and the adapter board, and the flexible circuit board and the adapter board are electrically connected through the anisotropic conductive adhesive film.

[0011] In addition, a preferred option is to provide a protective adhesive around the bump.

[0012] In addition, a preferred embodiment is that a heat sink is provided on the side of the Micro-LED display chip away from the adapter plate, and the Micro-LED display chip is bonded and fixed to the heat sink by adhesive.

[0013] In addition, a preferred embodiment is to provide a light-transmitting sheet on one side of the Micro-LED display chip, which corresponds to the position of the display area on the Micro-LED display chip.

[0014] Furthermore, in a preferred embodiment, the adapter plate and the light-transmitting sheet are located on the same side of the Micro-LED display chip; and a first through slot corresponding to the position of the display area is formed on the adapter plate, and the light-transmitting sheet is disposed in the first through slot.

[0015] In addition, a preferred embodiment is that the edge of the light-transmitting sheet is fixedly connected to the adapter plate by adhesive.

[0016] Furthermore, a preferred embodiment is that a second through slot corresponding to the position of the display area is formed on the flexible circuit board; and the inner diameter of the second through slot is greater than or equal to the inner diameter of the first through slot.

[0017] On the other hand, the present invention also provides a method for preparing a Micro-LED product as described above, the method comprising:

[0018] The Micro-LED display chip is fixed to the heat sink using adhesive.

[0019] An adapter board is electrically connected to the Micro-LED display chip via a bump circuit.

[0020] The flexible circuit board is electrically connected to the side of the adapter board away from the Micro-LED display chip via an anisotropic conductive adhesive film.

[0021] Compared with the prior art, the Micro-LED product according to the present invention has the following advantages:

[0022] The Micro-LED product provided by this invention redesigns the Micro-LED structure and its manufacturing process. Instead of the original method of connecting the Micro-LED display chip and the circuit board by wire bonding, an adapter board is used to connect the chip via a bump, and then an anisotropic conductive adhesive film is used to connect the flexible circuit board. This structure can effectively solve the problem that the product space is small but the space required for wire bonding and protective adhesive is large, thereby increasing the utilization rate of packaging space.

[0023] To achieve the foregoing and related objectives, one or more aspects of the invention include the features that will be described in detail below and particularly pointed out in the claims. The following description and accompanying drawings illustrate certain exemplary aspects of the invention. However, these aspects indicate only a few of the various ways in which the principles of the invention can be used. Furthermore, the invention is intended to include all such aspects and their equivalents. Attached Figure Description

[0024] Other objects and results of the invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings and the contents of the claims, and with a more complete understanding of the invention. In the drawings:

[0025] Figure 1 Here is a structural diagram of an existing Micro-LED product;

[0026] Figure 2 This is a front cross-sectional view of the Micro-LED product provided by the present invention;

[0027] Figure 3 A top view of the Micro-LED product provided by this invention;

[0028] Figure reference numerals: Micro-LED chip 1', pad 2', wire bonding 3', protective adhesive 4', printed circuit board 5', flexible circuit board 6', Micro-LED display chip 1, adapter board 2, bump 3, anisotropic conductive adhesive film 4, flexible circuit board 5, light-transmitting sheet 6, adhesive 7, heat dissipation adhesive 8, heat sink 9, display area 10.

[0029] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0030] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0031] Figure 2 The front cross-sectional structure of the Micro-LED product provided by the present invention is shown. Figure 3 The diagram shows a top view of the Micro-LED product provided by this invention.

[0032] Combination Figure 2 and Figure 3 As shown, the Micro-LED product provided by this invention includes a Micro-LED display chip 1 as the central device. An adapter board 2 is disposed on one side of the Micro-LED display chip 1 (preferably on the upper side of the Micro-LED display chip 1, away from the heat sink). A flexible circuit board 5 is disposed on the side of the adapter board 2 away from the Micro-LED display chip 1. The Micro-LED display chip 1 is electrically connected to the flexible circuit board 5 through the adapter board 2. This design changes the original method of connecting the display chip and the circuit board via wire bonding to an electrical connection between the display chip and the flexible circuit board 5 using the adapter board 2. This eliminates the need for wire bonding, pads, and protective adhesive (wire bonding adhesive), effectively solving the problem of limited product space but large space requirements for wire bonding and protective adhesive, and increasing the utilization rate of the packaging space.

[0033] It should be noted that the adapter board 2 is essentially a cable board, and there is an electrical connection between its upper and lower sides. Therefore, by electrically connecting the lower side of the adapter board 2 to the display chip and the upper side of the adapter board 2 to the flexible circuit board 5, the electrical connection between the display chip and the flexible circuit board 5 can be achieved.

[0034] Furthermore, to achieve both electrical and fixed connection between the Micro-LED display chip 1 and the adapter board 2, a Bump 3 (solder ball) is provided on the Micro-LED display chip 1. The Micro-LED display chip 1 is electrically connected to the adapter board 2 through the Bump 3. It should be noted that solder is a material used for soldering circuit boards, and the solder ball is the solidified product of solder melting and connecting components. While electrically connecting the Micro-LED display chip 1 and the adapter board 2 through the solder ball, the solder ball also serves to fix the Micro-LED display chip 1 and the adapter board 2 together. Of course, other electrical connection methods can also be used between the Micro-LED display chip 1 and the adapter board 2, such as gold wire connection, etc. The specific settings for other connection methods will not be elaborated here.

[0035] Of course, since Bump 3 is also a conductive material, in order to prevent external devices from causing electrical interference to it, a protective adhesive layer can be placed around Bump 3 to isolate Bump 3 from the outside and prevent external devices from causing electrical interference to it.

[0036] Furthermore, to achieve electrical connection between the flexible circuit board 5 and the adapter board 2, an anisotropic conductive adhesive film 4 can be provided between the flexible circuit board 5 and the adapter board 2. The flexible circuit board 5 and the adapter board 2 are electrically connected through the anisotropic conductive adhesive film 4. It should be noted that anisotropic conductive adhesive is a special coating material that is applied and bonded between substrate a and substrate b, limiting the current flow only in the vertical z-direction between substrates a and b. It has both unidirectional conductivity and adhesive fixing functions, which can solve some fine wire connection problems that traditional connectors cannot handle. Thus, by using anisotropic conductive adhesive, not only can electrical connection between the flexible circuit board 5 and the adapter board 2 be achieved, but also fixation between the flexible circuit board 5 and the adapter board 2 can be achieved. Of course, the flexible circuit board 5 and the adapter board 2 can also be electrically connected using solder balls or other methods, as long as the electrical connection relationship between the two can be satisfied, which will not be elaborated here.

[0037] In addition, to achieve heat dissipation of the Micro-LED display chip 1, a heat sink 9 is provided on the side of the Micro-LED display chip 1 away from the adapter plate 2. The Micro-LED display chip 1 is directly bonded and fixed to the heat sink 9 by adhesive 7 (or heat dissipation adhesive 8) to improve the heat dissipation effect of the Micro-LED display chip 1.

[0038] In a specific embodiment of the present invention, a light-transmitting sheet 6 corresponding to the position of the display area 10 on the Micro-LED display chip 1 is provided on one side of the Micro-LED display chip 1. By providing the light-transmitting sheet 6, not only can the display area 10 on the Micro-LED display chip 1 be protected, but also the light of the display area 10 can be ensured to pass through the light-transmitting sheet 6 to realize the display function of the entire product.

[0039] It should be noted that the adapter plate 2 and the light-transmitting sheet 6 need to be on the same side of the Micro-LED display chip 1; and a first through slot corresponding to the position of the display area 10 is formed on the adapter plate 2, the light-transmitting sheet 6 is placed in the first through slot, and the edge of the light-transmitting sheet 6 is fixedly connected to the adapter plate 2 by adhesive 7. With this arrangement, the light-transmitting sheet 6 can be placed inside the adapter plate 2, which can both achieve the fixed installation of the light-transmitting sheet 6 and provide a certain degree of protection for the light-transmitting sheet 6.

[0040] Of course, to ensure that all the light emitted by the display chip can pass through the light-transmitting sheet 6 and enter the outside world, a second through slot corresponding to the position of the display area 10 needs to be opened on the flexible circuit board. The light emitted by the display chip passes through the light-transmitting sheet 6 (located in the first through slot) and the second through slot in sequence to enter the outside world. Furthermore, to prevent light blockage in the second through slot, the inner diameter of the second through slot needs to be greater than or equal to the inner diameter of the first through slot.

[0041] To further illustrate the Micro-LED product provided by this invention, this invention also provides a method for preparing the Micro-LED product as described above, the method comprising:

[0042] The Micro-LED display chip is fixed to the heat sink using adhesive (or thermal adhesive);

[0043] An adapter board located above the Micro-LED display chip is electrically connected to the Micro-LED display chip via Bumps (solder balls);

[0044] The flexible circuit board is electrically connected to the side of the adapter board away from the Micro-LED display chip via an anisotropic conductive adhesive film, thereby realizing the electrical connection between the Micro-LED display chip and the flexible circuit board.

[0045] As can be seen from the above specific embodiments, the Micro-LED product and its preparation method provided by the present invention redesigns a Micro-LED structure and its preparation process. Instead of the original method of connecting the Micro-LED display chip and the circuit board by wire bonding, an adapter board is used to connect the chip via a bump, and then an anisotropic conductive adhesive film is used to connect the flexible circuit board. This structure can effectively solve the problem that the product space is small but the space required for wire bonding and protective adhesive is large, and can increase the utilization rate of packaging space.

[0046] As per the above reference Figure 2 and Figure 3 The Micro-LED products and their preparation methods according to the present invention are described by way of example. However, those skilled in the art should understand that various modifications can be made to the Micro-LED products and their preparation methods according to the present invention without departing from the scope of the invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A Micro-LED product, comprising a Micro-LED display chip; characterized in that, An adapter board is disposed on one side of the Micro-LED display chip, and a flexible circuit board is disposed on the side of the adapter board away from the Micro-LED display chip. The Micro-LED display chip is electrically connected to the flexible circuit board through the adapter board; wherein, The adapter board is a cable board. A bump is provided on the Micro-LED display chip. The Micro-LED display chip is electrically connected to the adapter board through the bump. A light-transmitting sheet corresponding to the display area position on the Micro-LED display chip is provided on one side of the Micro-LED display chip. The adapter board and the light-transmitting sheet are located on the same side of the Micro-LED display chip. Furthermore, a first through slot corresponding to the display area position is formed on the adapter board, and the light-transmitting sheet is disposed in the first through slot.

2. The Micro-LED product as described in claim 1, characterized in that, An anisotropic conductive adhesive film is disposed between the flexible circuit board and the adapter board, and the flexible circuit board and the adapter board are electrically connected through the anisotropic conductive adhesive film.

3. The Micro-LED product as described in claim 2, characterized in that, A protective adhesive is applied to the outer periphery of the bump.

4. The Micro-LED product as described in claim 1, characterized in that, A heat sink is provided on the side of the Micro-LED display chip away from the adapter plate, and the Micro-LED display chip is bonded and fixed to the heat sink with adhesive.

5. The Micro-LED product as described in claim 1, characterized in that, The edge of the light-transmitting sheet is fixedly connected to the adapter plate with adhesive.

6. The Micro-LED product as described in claim 1, characterized in that, A second through slot is formed on the flexible circuit board, corresponding to the position of the display area; and the inner diameter of the second through slot is greater than or equal to the inner diameter of the first through slot.

7. A method for preparing a Micro-LED product as described in any one of claims 1 to 6, characterized in that, The method includes: The Micro-LED display chip is fixed to the heat sink using adhesive. An adapter board is electrically connected to the Micro-LED display chip via a bump circuit. The flexible circuit board is electrically connected to the side of the adapter board away from the Micro-LED display chip via an anisotropic conductive adhesive film.

Images