Radiating structure

Abstract

The present invention provides a radiation structure. The radiation structure may include: a first conductive layer; a second conductive layer; and a barrier layer disposed between the first conductive layer and the second conductive layer. The thickness of the barrier layer is in the range of 0.3 micrometers to 3 micrometers.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more particularly to a radiation structure. Background Art

[0002] In the prior art, copper (Cu) material is used as the antenna layer. However, the exposed Cu surface is easily oxidized and affects the subsequent electrical properties. Therefore, the general practice is to perform metal finish treatment on the Cu layer and form a composite metal layer (such as Cu-Au (gold)) on the Cu surface. However, the Cu-Au composite metal will form a eutectic, which may cause structural embrittlement and easy cracking during thermal cycle testing, and fail to pass the reliability test.

[0003] Therefore, the existing practice is to use the ENIG (Electroless Nickel Immersion Gold) process to form a Cu-Ni (nickel)-Au composite layer, and use the Ni layer as a barrier between the Cu layer and the Au layer to prevent ion diffusion and reduce the eutectic phenomenon. However, the presence of magnetic material Ni in the metal composite layer formed by the metal finishing process will hinder the passage of electrical signals and cause serious insertion loss. Summary of the invention

[0004] In view of the insertion loss problem caused by magnetic materials in the related art, the present invention proposes a radiation structure.

[0005] According to one aspect of the embodiments of the present invention, the radiation structure includes a first conductive layer, a second conductive layer, and a barrier layer disposed between the first conductive layer and the second conductive layer, wherein the thickness of the barrier layer is in the range of 0.3 micrometers to 3 micrometers.

[0006] In the above radiation structure, the conductivity of the second conductive layer is higher than the conductivity of the first conductive layer.

[0007] In the above radiation structure, the material of the first conductive layer is copper, and the material of the second conductive layer is gold.

[0008] In the above radiation structure, the thickness of the second conductive layer is less than 0.1 micrometers, and the thickness of the first conductive layer is in the range of 2 micrometers to 5 micrometers.

[0009] In the above radiation structure, the barrier layer is a magnetic conductive layer.

[0010] In the above radiation structure, the material of the barrier layer is nickel.

[0011] In the above radiation structure, the radiation structure is constructed as a part of a packaging structure, and the second conductive layer is the outermost metal layer of the packaging structure.

[0012] In the above-mentioned radiation structure, the radiation structure is constructed as an antenna layer in an antenna module.

[0013] In the above-mentioned radiation structure, the operating frequency of the radiation structure is in the range of 3.5 GHz to 5 GHz.

[0014] In the above-mentioned radiation structure, the interval value of the radiation structure is maintained at about 0.1 dB / cm.

[0015] According to another aspect of the embodiments of the present invention, the radiating structure may include a composite conductive layer, the operating frequency of the composite conductive layer is in the range of 3.5 GHz to 5 GHz, and the interval value of the composite conductive layer is maintained at about 0.1 dB / cm.

[0016] In the above radiation structure, in an operating frequency range of 3.5 GHz to 5 GHz, the insertion loss of the composite conductive layer is in a range of 0.35 dB to 0.45 dB.

[0017] In the above radiation structure, the composite conductive layer includes a high conductive layer and a low conductive layer.

[0018] In the above radiation structure, the composite conductive layer further includes a barrier layer disposed between the high conductive layer and the low conductive layer.

[0019] In the above radiation structure, the barrier layer is a magnetic conductive layer.

[0020] In the above radiation structure, the material of the barrier layer is nickel.

[0021] In the above radiation structure, the material of the low conductive layer is copper, and the material of the high conductive layer is gold.

[0022] In the above radiation structure, the thickness of the blocking layer is in the range of 0.3 micrometers to 3 micrometers.

[0023] In the above radiation structure, the composite conductive layer is constructed as a part of a packaging structure, and the high conductive layer is the outermost metal layer of the packaging structure.

[0024] In the above-mentioned radiation structure, the composite conductive layer is constructed as an antenna layer in the antenna module. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] When read in conjunction with the accompanying drawings, various aspects of the present invention can be best understood from the following detailed description. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the size of the various components may be arbitrarily increased or reduced for clarity of discussion.

[0026] Figure 1 is a schematic diagram of a radiation structure according to an embodiment of the present invention.

[0027] Figure 2 It is a curve diagram showing the insertion loss of the radiation structure of the prior art and the present invention changing with frequency.

[0028] Figure 3 This is a schematic diagram of the loss changes when designing via the 28G or 64G frequency band.

[0029] Figure 4 is a schematic diagram of an antenna module according to an embodiment of the present invention. Specific embodiments

[0030] The following disclosure provides many different embodiments or examples for realizing different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which an additional component is formed between the first component and the second component so that the first component and the second component may not be in direct contact. Moreover, the present invention may repeatedly refer to numbers and / or letters in various examples. This repetition is only for simplicity and clarity, and does not itself represent the relationship between the various embodiments and / or configurations discussed.

[0031] According to one aspect of the present invention, a radiating structure is provided. Figure 1 Schematic diagram of a radiation structure according to an embodiment of the present invention. Figure 1 As described above, the radiation structure 10 may include a first conductive layer 12, a second conductive layer 16, and a barrier layer 14 disposed between the first conductive layer 12 and the second conductive layer 16. The radiation structure includes multiple conductive layers, so in some embodiments the radiation structure 10 may be referred to as a composite conductive layer. The thickness of the barrier layer 14 is in the range of 0.3 μm to 3 μm.

[0032] In some embodiments, the operating frequency of the radiating structure 10 is in the range of 3.5 GHz to 5 GHz. When in the frequency range of 3.5 GHz to 5 GHz, the interval value of the radiating structure 10 of the present invention can be maintained at about 0.1 dB / cm.

[0033] Figure 2Graph showing the insertion loss of the radiation structure of the prior art and the present invention as a function of frequency. Figure 2 As shown in the curve S1 in Figure 1, for the Cu-Ni-Au composite layer formed by the ENIG process, there will be severe insertion loss in the frequency range of 3.5GHz to 5GHz, causing the insertion loss to drop rapidly from 0.4dB to 0.6dB. If this loss problem cannot be solved, it cannot be applied to the 5G frequency band, and many mobile devices equipped with antennas in the 5G era will not be usable.

[0034] The above technical solution of the present invention can reduce the insertion loss of the prior art in the frequency range of 3.5GHz to 5GHz by reducing the thickness of the barrier layer 14 (reducing the thickness to less than 3μm) while maintaining the function of the barrier layer 14. In addition, considering the Cu migration problem (serious electromigration phenomenon, resulting in an increase in the resistance value of the metal wire), the barrier layer 14 must also maintain a certain thickness (0.3μm or more). Figure 2 As shown in the curve S2 in FIG. 1 , the radiation structure of the present invention can maintain the insertion loss at a loss of about 0.4 dB, so as to meet the requirement that the interval value of the insertion loss in the frequency range of 3.5 GHz to 5 GHz should be maintained within about 0.1 dB / cm. The radiation structure provided by the present invention can prevent the insertion loss generated in 5G products from exceeding expectations.

[0035] In some embodiments, the conductivity of the second conductive layer 16 (also referred to as a high conductive layer) is higher than the conductivity of the first conductive layer 12 (also referred to as a low conductive layer). The material of the first conductive layer 12 may include copper, and the material of the second conductive layer 16 may include gold. In some embodiments, the barrier layer 14 may be a magnetic conductive layer. The material of the barrier layer 14 may include Ni.

[0036] It has been verified by experiments that Figure 3 As shown, regardless of the design of the 28G or 64G frequency band, the insertion loss will decrease as the thickness of the Ni layer decreases. When considering the problem of reducing insertion loss, the thickness of the Ni layer needs to be reduced. The Ni layer is reduced to <3μm to reduce the insertion loss in the frequency range of 3.5GHz to 5GHz. On the other hand, when considering the Cu migration problem, the Ni layer must maintain a certain thickness, so there is a minimum Ni layer thickness of 0.3μm, that is, the Ni layer thickness cannot be less than 0.3μm, so that the insertion loss can be maintained at a loss of about 0.4dB.

[0037] The thickness of the second conductive layer 16 may be less than 0.1 μm. The thickness of the first conductive layer 12 may be in the range of 2 μm to 5 μm. The above materials of the first conductive layer 12, the second conductive layer 16 and the barrier layer 14 and the thicknesses of the first conductive layer 12 and the second conductive layer 16 are only examples, and other suitable materials may also be used for each layer.

[0038] According to an embodiment of the present invention, the radiation structure of the present invention may be constructed as a part of an antenna module. Figure 4 is a schematic diagram of an antenna module according to an embodiment of the present invention. Figure 4 As shown, the antenna module 100 may include a plurality of electronic components 102 such as integrated circuit (IC) chips. The plurality of electronic components 102 may be encapsulated by a molded object 104 to form a package structure. In some embodiments of the present invention, the antenna module 100 may be referred to as a package structure. A connector 106 and an antenna layer 108 are also provided on the surface of the antenna module 100. The antenna layer 108 may be, for example, Figure 1 The radiation structure 10 is shown. In such an embodiment, the second conductive layer 16 of the radiation structure 10 serves as the outermost metal layer of the antenna module 100 .

[0039] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art should understand that the present invention can be easily used as a basis to design or change other processing and structures to achieve the same purpose and / or achieve the same advantages as the embodiments introduced in the present invention. Those skilled in the art should also be aware that these equivalent structures do not deviate from the spirit and scope of the present invention, and can be subjected to various changes, substitutions and changes without departing from the spirit and scope of the present invention.

Claims

1. A radiation structure, characterized in that: include: a first conductive layer; a second conductive layer; a barrier layer, disposed between the first conductive layer and the second conductive layer; The thickness of the barrier layer is in the range of 0.3 microns to 3 microns, the material of the first conductive layer is copper, the material of the second conductive layer is gold, the material of the barrier layer is nickel, the radiation structure is constructed as part of the packaging structure, and the second conductive layer is the outermost metal layer of the packaging structure, the radiation structure is constructed as an antenna layer in the antenna module, and the operating frequency of the radiation structure is in the range of 3.5 GHz to 5 GHz.

2. The radiation structure according to claim 1, characterized in that The conductivity of the second conductive layer is higher than that of the first conductive layer.

3. The radiation structure according to claim 1, characterized in that: The thickness of the second conductive layer is less than 0.1 micrometers, and the thickness of the first conductive layer is in the range of 2 micrometers to 5 micrometers.

4. The radiation structure according to claim 2, characterized in that: The barrier layer is a magnetic conductive layer.

5. The radiation structure according to claim 1, characterized in that: The insertion loss of the radiation structure is maintained at an interval value of 0.1 dB / cm.

Images