Board-to-board connection structure and method of manufacturing the same

Abstract

A board-to-board connecting structure and a manufacturing method thereof, the board-to-board connecting structure comprising a first circuit board, a second circuit board and a first connector connecting the first circuit board and the second circuit board, the first connector comprising a first connecting part and a second connecting part; the second circuit board comprising a first cavity, a second cavity communicating with the first cavity, a first side wall forming the first cavity and a second side wall forming the second cavity, at least a step part being formed between the first side wall and the second side wall in the second cavity; the first connecting part extending into the second cavity and engaging with the step part, and the second connecting part being connected to the first circuit board. The board-to-board connecting structure provided by the application adopts an insertion connecting mode, is simple and fast, does not need welding, needs small installation space, the size of the connector can be reduced as much as possible, and the space utilization is improved.

Description

Technical Field

[0001] This invention relates to printed circuit board technology, and more particularly to a board-to-board connection structure and its manufacturing method. Background Technology

[0002] With the widespread use of printed circuit boards in the electronics field, in order to realize the multi-functionality of electronic products, an electronic product usually needs to assemble multiple circuit boards with different functions.

[0003] However, currently, when assembling multiple circuit boards in the same electronic product, each circuit board needs to be installed one by one, resulting in low assembly efficiency and low space utilization, which is not conducive to the development of electronic products towards thinner and smaller designs. Summary of the Invention

[0004] In view of this, in order to overcome at least one of the above-mentioned defects, it is necessary to propose a plate-to-plate connection structure.

[0005] In addition, the present invention also provides a method for manufacturing the above-mentioned plate-to-plate connection structure.

[0006] This invention provides a board-to-board connection structure, including a first circuit board, a second circuit board, and a first connector connecting the first circuit board and the second circuit board. The first connector includes a first connecting portion and a second connecting portion connected to the first connecting portion. The second circuit board includes a first surface, a second surface opposite to the first surface, and at least one connecting hole penetrating the first surface and the second surface. Each connecting hole includes a first cavity opening towards the first surface and a second cavity opening towards the second surface. The first cavity and the second cavity communicate with each other. The second circuit board further includes a first sidewall for forming the first cavity and a second sidewall for forming the second cavity. At least one step is formed within the second cavity between the first sidewall and the second sidewall. The second connecting portion is connected to the first circuit board, and the first connecting portion extends into the second cavity and engages with the step.

[0007] In this embodiment of the application, the surface of the stepped portion is provided with a conductive layer, and the first connecting portion is electrically connected to the second circuit board through the conductive layer.

[0008] In this embodiment of the application, along the extension direction of the second circuit board, the cross-sectional dimension of the first connection portion is less than or equal to the cross-sectional dimension of the second cavity, and greater than the cross-sectional dimension of the first cavity.

[0009] In this embodiment of the application, another stepped portion is formed between the first sidewall and the second sidewall within the first cavity, and a communication opening is formed between the two stepped portions. The first connecting portion extends into the second cavity and engages with the stepped portion located within the second cavity.

[0010] In this embodiment, the board-to-board connection structure further includes a third circuit board and a second connector connecting the third circuit board and the first circuit board. The second connector includes a third connecting portion and a fourth connecting portion electrically connected to the third connecting portion; another stepped portion is formed within the first cavity between the first sidewall and the second sidewall, and a communication opening is formed between the two stepped portions. A height difference is formed between the two stepped portions along the thickness direction of the second circuit board. The fourth connecting portion is connected to the third circuit board, and the third connecting portion extends into the first cavity and engages with the stepped portion located within the first cavity, thereby connecting the first connecting portion and the third connecting portion.

[0011] In this embodiment of the application, the first connector is electrically connected to the second connector so that the first circuit board is electrically connected to the third circuit board.

[0012] In this embodiment of the application, at least one of the stepped portions within at least one of the connecting holes is provided with a conductive layer, so that the second circuit board is electrically connected to the first circuit board and the third circuit board.

[0013] In this embodiment of the application, the first connector further includes a first connecting arm disposed between the first connecting portion and the second connecting portion, and the second connector further includes a second connecting arm disposed between the third connecting portion and the fourth connecting portion, wherein at least one of the first connecting arm or the second connecting arm is in the form of a strip structure or a spiral structure.

[0014] The present invention also provides a method for manufacturing a plate-to-plate connection structure, comprising the following steps:

[0015] Provide a first circuit board.

[0016] A first connector is provided, the first connector including a first connecting portion and a second connecting portion electrically connected to the first connecting portion, the second connecting portion being connected to the first circuit board.

[0017] A second circuit board is provided, the second circuit board including a first surface, a second surface disposed opposite to the first surface, and at least one connection hole penetrating the first surface and the second surface, each connection hole including a first cavity opening toward the first surface and a second cavity opening toward the second surface, the first cavity communicating with the second cavity, the second circuit board further including a first sidewall for forming the first cavity and a second sidewall for forming the second cavity, and a step portion is formed at least in the second cavity between the first sidewall and the second sidewall.

[0018] The first connecting portion is inserted into the second cavity and engaged with the stepped portion located within the second cavity to connect the second circuit board and the first circuit board, thereby obtaining the board-to-board connection structure.

[0019] In this embodiment of the application, a conductive layer is provided on the stepped portion to enable the second circuit board to be electrically connected to the first circuit board.

[0020] In this embodiment of the application, along the thickness direction of the second circuit board, the projection of the first cavity is located within the projection of the second cavity, or the projection of the first cavity partially overlaps with the projection of the second cavity.

[0021] In this embodiment of the application, another stepped portion is formed within the first cavity between the first sidewall and the second sidewall, a communication opening is formed between the two stepped portions, and a height difference is formed between the two stepped portions along the thickness direction of the second circuit board. The manufacturing method further includes the following steps:

[0022] A third circuit board is provided.

[0023] A second connector is provided, the second connector including a third connecting portion and a fourth connecting portion electrically connected to the third connecting portion, and the fourth connecting portion is connected to the third circuit board.

[0024] The third connecting portion is inserted into the first cavity and engaged with the stepped portion located within the first cavity, thereby connecting the third connecting portion with the first connecting portion to connect the first circuit board, the second circuit board, and the third circuit board, thus obtaining the board-to-board connection structure.

[0025] In this embodiment of the application, the first connector is electrically connected to the second connector so that the first circuit board is electrically connected to the third circuit board.

[0026] In this embodiment of the application, the second connecting part is electrically connected to the first circuit board via conductive adhesive or solder; the fourth connecting part is electrically connected to the third circuit board via conductive adhesive or solder.

[0027] In this embodiment of the application, at least one of the stepped portions is provided with a conductive layer to electrically connect the first circuit board, the second circuit board, and the third circuit board.

[0028] The board-to-board connection structure provided by this invention achieves board-to-board connection of multiple circuit boards by designing the connection hole of the second circuit board and the connector (first connector or second connector) to adopt an insertion connection method. The connection method is simple and convenient to operate. Moreover, the insertion connection does not require soldering process, requires less installation space, and the size of the connector can be minimized, thereby effectively reducing the connection distance between boards. It also facilitates flexible design of the spatial layout of multiple circuit boards and improves space utilization. In addition, it can be designed according to actual needs whether electrical connection is required between the boards. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a plate-to-plate connection structure provided in an embodiment of the present invention.

[0030] Figure 2 This is a schematic diagram of the structure of a first connector provided in an embodiment of the present invention.

[0031] Figure 3 A schematic diagram of the structure of a first connector provided for another embodiment of the present invention.

[0032] Figure 4 This is a schematic diagram of the structure of a second circuit board provided in an embodiment of the present invention.

[0033] Figure 5 A bottom view of a second circuit board provided in an embodiment of the present invention.

[0034] Figure 6 A schematic diagram of the structure of a second circuit board provided for another embodiment of the present invention.

[0035] Figure 7 A bottom view of a second circuit board provided for another embodiment of the present invention.

[0036] Figure 8 This is a schematic diagram of the structure of a first circuit board provided in an embodiment of the present invention.

[0037] Figure 9 In order to be in Figure 8 A schematic diagram showing the application of the first conductive paste on the first solder pad.

[0038] Figure 10 In order to be in Figure 9A schematic diagram showing the first connector mounted on the first conductive paste.

[0039] Figure 11 This is a schematic diagram of a plate-to-plate connection structure provided in another embodiment of the present invention.

[0040] Figure 12 This is a schematic diagram of a plate-to-plate connection structure provided in another embodiment of the present invention.

[0041] Figure 13 This is a schematic diagram of the structure of a second circuit board provided in another embodiment of the present invention.

[0042] Figure 14 A bottom view of a second circuit board provided in yet another embodiment of the present invention.

[0043] Figure 15 This is a schematic diagram of the structure of a third circuit board provided in an embodiment of the present invention.

[0044] Figure 16 In order to be in Figure 15 A schematic diagram showing the application of a second conductive paste on a second solder pad.

[0045] Figure 17 In order to be in Figure 16 A schematic diagram showing the second connector mounted on the provided second conductive paste.

[0046] Explanation of main component symbols

[0047] Plate-to-plate connection structures 100, 200, 300

[0048] First circuit board 2

[0049] First solder pad 21

[0050] First conductive paste 22

[0051] Second circuit boards 1, 1a, 9

[0052] First surface 11,91

[0053] Second surface 12,92

[0054] Connection hole 13, 93

[0055] First cavity 131,931

[0056] Second cavity 132,932

[0057] First sidewall 14,94

[0058] Second sidewall 15, 95

[0059] Step sections 16, 17, 18, 19, 96, 97

[0060] First connectors 3, 3a, 3b

[0061] First connecting parts 31, 31a, 31b

[0062] Second connecting part 32

[0063] First connecting arm 33

[0064] Conductive layer 4

[0065] Conductive adhesive layer 5

[0066] Third circuit board 6

[0067] Second solder pad 61

[0068] Second conductive paste 62

[0069] Connector 7.98

[0070] Second connector 8

[0071] Third connecting part 81

[0072] Fourth connecting part 82

[0073] Second connecting arm 83

[0074] direction a

[0075] Sizes b, c, d

[0076] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0077] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0078] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0079] Please see Figure 1This invention provides a board-to-board connection structure 100, including a first circuit board 2, a second circuit board 1, and at least one first connector 3 connecting the second circuit board 1 and the first circuit board 2. The first connector 3 includes a first connecting portion 31 and a second connecting portion 32 electrically connected to the first connecting portion 31. The second circuit board 1 includes a first surface 11, a second surface 12 opposite to the first surface 11, and at least one connecting hole 13 penetrating the first surface 11 and the second surface 12. The connecting hole 13 includes a first cavity 131 opening towards the first surface 11 and a second cavity 132 opening towards the second surface 12, with the first cavity 131 communicating with the second cavity 132. The second circuit board 1 also includes a first sidewall 14 for forming the first cavity 131 and a second sidewall 15 for forming the second cavity 132. Along the thickness direction a of the second circuit board 1, the projection of the first cavity 131 is located inside the projection of the second cavity 132, or the projection of the first cavity 131 and the projection of the second cavity 132 partially overlap, such that a step portion 16 is formed at least within the second cavity between the first sidewall 14 and the second sidewall 15. The second connecting portion 32 is electrically connected to the second circuit board 1. The first connecting portion 31 extends through the first cavity 131 into the second cavity 132 and engages with the step portion 16 located within the second cavity 132, thereby connecting the first connecting portion 31 to the second circuit board 1, thus realizing the connection between the first circuit board 2 and the second circuit board 1.

[0080] In this embodiment, along the thickness direction a of the second circuit board 1, the projection of the first cavity 131 is located inside the projection of the second cavity 132. Along the extension direction of the second circuit board 1, the cross-sectional dimension c of the second cavity 132 is larger than the cross-sectional dimension b of the first cavity 131. During the process of the first connecting part 31 extending into the second cavity 132 via the first cavity 131, the first connecting part 31 has two states. In the first state, the first connecting part 31 is located inside the first cavity 131, and the cross-sectional dimension d of the first connecting part 31 is less than or equal to the cross-sectional dimension b of the first cavity 131. In the second state, the first connecting part 31 is located inside the second cavity 132, and the cross-sectional dimension d of the first connecting part 31 is less than or equal to the cross-sectional dimension c of the second cavity 132, and larger than the cross-sectional dimension b of the first cavity 131, so that the first connecting part 31 can engage with the step portion 16. By cooperating the first connecting part 31 with the first cavity 131 and the second cavity 132 with different cross-sectional dimensions, the first connector 3 can be quickly fixed on the second circuit board 1 and connected to the first circuit board 2 without the need for complex processes such as soldering. The process is simple and the cost is low. Different circuit boards can be connected according to actual needs to meet specific spatial layout between circuit boards and improve space utilization.

[0081] Please refer to it again. Figure 1 To facilitate the assembly of the first connecting part 31 and the second circuit board 1, the first connecting part 31 is elastic. When the first connecting part 31 is located inside the first cavity 131, the first connecting part 31 is compressed and deformed, such that the cross-sectional dimension d of the first connecting part 31 is equal to the cross-sectional dimension b of the first cavity 131; when the first connecting part 31 is located inside the second cavity 132, the first connecting part 31 recovers its deformation, such that the cross-sectional dimension d of the first connecting part 31 is greater than the cross-sectional dimension b of the first cavity 131, thereby allowing the first connecting part 31 to engage with the step portion 16 inside the second cavity 132, thus achieving the connection between the second circuit board 1 and the first circuit board 2.

[0082] In this embodiment, the first connector 3 further includes a first connecting arm 33 disposed between the first connecting portion 31 and the second connecting portion 32. The first connecting arm 33 is located within the first cavity 131 and is used to connect the first connecting portion 31 and the second connecting portion 32. The length of the first connecting arm 33 can be designed according to actual requirements. While ensuring that the connection between the first connecting portion 31 and the second circuit board 1 can be completed, the length of the first connecting arm 33 should be shortened as much as possible to reduce the distance between boards and improve space utilization.

[0083] In this embodiment, the first connecting arm 33 can be in the form of a strip. The first connecting arm 33 mainly serves to connect the first connecting part 31 and the second connecting part 32. At the same time, the length of the first connecting arm 33 will also directly affect the distance between the first circuit board 2 and the second circuit board 1. Therefore, within the allowable installation space, the length of the first connecting arm 33 should be minimized as much as possible to reduce the distance between the boards and improve space utilization.

[0084] In another embodiment, the first connecting arm (not shown) can be a helical structure, specifically a spring, by adding a helical first connecting arm between the first connecting portion 31 and the second connecting portion 32. When the second circuit board 1 and the first circuit board 2 undergo relative displacement, the first connecting arm can withstand greater deformation, thereby ensuring that the first connecting portion 31 and the second connecting portion 32 will not misalign, improving the stability of the connection between the first connecting portion 31 and the second circuit board 1, as well as the stability of the connection between the second connecting portion 32 and the first circuit board 2.

[0085] In another implementation, please refer to Figure 2 Combined with reference Figure 1 The first connector 3a includes two first connecting portions 31a, one end of which is connected to the first connecting arm 33. The free end of each first connecting portion 31a extends parallel to the first connecting arm 33 and then bends towards the first connecting arm 33 to form a U-shaped structure. The U-shaped design of the free end allows for better contact between the step portion 16 and the second sidewall 15 after the first connecting portion 31a passes through the first cavity 131 and enters the second cavity 132, achieving a stable connection.

[0086] In another implementation, please refer to Figure 3 Combined with reference Figure 1 The first connector 3b includes two first connecting portions 31b, one end of which is connected to the first connecting arm 33. The first connecting portion 31b is inclined relative to the first connecting arm 33, forming an acute angle with the first connecting arm 33. This design facilitates the passage of the first connecting portion 31b through the first cavity 131. In addition, the free end of the first connecting portion 31b away from the first connecting arm 33 is bent towards the first connecting arm 33, which is beneficial for contact with the step portion 16 and the second sidewall 15, achieving a stable connection.

[0087] See also Figure 1The specific process of connecting the first connecting part 31 to the second circuit board 1 is as follows: The first connecting part 31 is inserted into the first cavity 131 and compressed. The free end of the first connecting part 31 then moves towards the first connecting arm 33, thereby reducing the cross-sectional size of the first connecting part 31 and allowing it to pass smoothly through the smaller cross-sectional area of ​​the first cavity 131. When the first connecting part 31 enters the second cavity 132, the pressure from the first sidewall 14 is released, and the compressed free end of the first connecting part 31 recovers its deformation in the direction of the step 16, thus allowing the first connecting part 31 to engage with the second cavity 132 via the step 16. Alternatively, the first connecting part 31 can also be in a partially compressed state when it is in the second cavity 132. In this case, the elastic restoring force of the first connecting part 31 will cause the spring to abut against the second sidewall 15, making the connection between the first connecting part 31 and the second circuit board 1 more secure and stable.

[0088] Please see Figure 4 and Figure 5 Combined with reference Figure 1 Along the thickness direction a of the second circuit board 1, the projection of the first cavity 131 is located at approximately the center of the projection of the second cavity 132. At this time, the first sidewall 14 and the second sidewall 15 form a stepped portion 16. When the first connecting portion 31 and the stepped portion 16 are engaged, there are no special requirements for the setting direction of the first connecting portion 31, making the connection and assembly process more convenient and eliminating the need to consider the alignment of the first connecting portion 31 and the stepped portion 16.

[0089] In another implementation, please refer to Figure 6 and Figure 7 Combined with reference Figure 1 The projection of the first cavity 131 is located inside the projection of the second cavity 132 and is connected to the edge of the projection of the second cavity 132. At this time, the step portion 17 formed between the first sidewall 14 and the second sidewall 15 is roughly a fan-shaped structure. After the first connecting portion 31 extends into the second cavity 132, it needs to be rotated at a certain angle so that the first connecting portion 31 is engaged with the area with increased surface area of ​​the step portion 17 as much as possible, thereby improving the stability of the connection between the first connecting portion 31 and the step portion 17.

[0090] In this embodiment, the first cavity 131 and the second cavity 132 may also be filled with a fixing adhesive (not shown). By filling with the fixing adhesive, the connection stability between the second circuit board 1 and the first connector 3 can be further improved, and the electrical connection between the two can be effectively improved, avoiding the break in the circuit between the two due to accidental shaking.

[0091] In this embodiment, the cross-section of the first cavity 131 is at least one of a rectangle, a circle, and a trapezoid. The cross-section of the second cavity 132 is at least one of a rectangle, a circle, and a trapezoid.

[0092] In this embodiment, the first circuit board 2 and the second circuit board 1 can be electrically connected through the first connector 3, thereby realizing electrical or signal transmission.

[0093] In this embodiment, the first connector 3 is made of metal.

[0094] In this embodiment, at least one of the stepped portions 16 within the second cavity 132 is provided with a conductive layer 4, and the first connecting portion 31 is electrically connected to the second circuit board 1 through the conductive layer 4, thereby realizing the electrical connection between the first circuit board 2 and the second circuit board 1.

[0095] In this embodiment, the conductive layer 4 extends to the surface of the first sidewall 14 and / or the second sidewall 15, which can further increase the contact area between the first connection portion 31 and the conductive layer 4 and improve the stability of the electrical connection.

[0096] In this embodiment, the conductive layer 4 can be a metal plating layer. The metal can be at least one of copper (Cu), titanium (Ti), nickel (Ni), and gold (Au), preferably copper.

[0097] Please see Figure 4 Combined with reference Figure 1 A conductive adhesive layer 5 is provided between the second sidewall 15 and / or the stepped portion 16 and the first connecting portion 31. By providing the conductive adhesive layer 5, the firmness of the connection between the first connecting portion 31 and the second circuit board 1 and the stability of the electrical connection can be improved.

[0098] Please refer to it again. Figure 1 The first circuit board 2 and the second connecting part 32 are connected by conductive adhesive or solder. Specifically, the first circuit board 2 includes a first solder pad 21. By using surface mount technology, the second connecting part 32 is reflow soldered to the first conductive paste 22 on the first solder pad 21, so that the second connecting part 32 is electrically connected to the first circuit board 2.

[0099] It is understood that in some other embodiments, in the board-to-board connection structure 100 provided by the present invention, the first circuit board 2 and the second circuit board 1 only need to be connected, without electrical connection, thereby meeting the spatial arrangement requirements of the circuit boards and improving space utilization. When the first circuit board 2 and the second circuit board 1 do not need electrical connection, the first connector 3 can also be made of non-metallic materials, such as plastic, and the second connecting part 32 can be bonded to the first circuit board 2 with ordinary adhesive.

[0100] Please see Figures 8 to 10 Combined with reference to Figure 1 and Figure 4 The present invention also provides a method for manufacturing a board-to-board connection structure 100, specifically taking the electrical connection of a first circuit board 2 and a second circuit board 1 as an example, including the following steps:

[0101] Step S11, please refer to Figure 8 and Figure 9 A first circuit board 2 is provided, the first circuit board 2 includes a first solder pad 21, and a first conductive paste 22 is disposed on the first solder pad 21.

[0102] Step S12, please refer to Figure 10 A first connector 3 is provided, the first connector 3 includes a first connecting portion 31 and a second connecting portion 32 electrically connected to the first connecting portion 31, and the second connecting portion 32 is disposed on the first conductive paste 22.

[0103] In this embodiment, surface mount technology is used to connect the second connection portion 32 to the first solder pad 21 of the first circuit board 2.

[0104] Step S13, please refer to the following: Figure 4 A second circuit board 1 is provided. The second circuit board 1 includes a first surface 11, a second surface 12 disposed opposite to the first surface 11, and a connecting hole 13 penetrating the first surface 11 and the second surface 12. The connecting hole 13 includes a first cavity 131 opening toward the first surface 11 and a second cavity 132 opening toward the second surface 12. The first cavity 131 and the second cavity 132 are in communication. The second circuit board 1 also includes a first sidewall 14 for forming the first cavity 131 and a second sidewall 15 for forming the second cavity 132. Along the thickness direction a of the second circuit board 1, the projection of the first cavity 131 is located inside the projection of the second cavity 132 or the projection of the first cavity 131 and the projection of the second cavity 132 partially overlap, such that a step portion 16 is formed at least in the second cavity between the first sidewall 14 and the second sidewall 15.

[0105] In this embodiment, the specific method for forming the connecting hole 13 is as follows: first, a first cavity 131 is formed by laser drilling on the first surface 11 of the second circuit board 1; then, a second cavity 132 is formed by laser drilling on the second surface 12; finally, the first cavity 131 and the second cavity 132 are connected by laser drilling to ultimately form the connecting hole 13. This embodiment forms the connecting hole 13 by drilling on both surfaces of the second circuit board 1, which is more convenient. It is understood that the connecting hole 13 can also be formed by mechanical drilling.

[0106] Step S14, please refer to [link / reference]. Figure 1 The first connecting part 31 is inserted into the second cavity 132 through the first cavity 131, so that the first connecting part 31 is engaged with the step part 16 located in the second cavity 132, so that the first connecting part 31 is electrically connected to the second circuit board 1, thereby realizing the electrical connection between the second circuit board 1 and the first circuit board 2, and thus obtaining the board-to-board connection structure 100.

[0107] This invention employs a first connector 3 to achieve electrical connection between the first circuit board 2 and the second circuit board 1. During the connection process, the first connecting part 31 and the second circuit board 1 do not require a large installation space; as long as the first connecting part 31 can be inserted into the first cavity 131, the first connector 3 and the second circuit board 1 can be connected. Therefore, the length of the first connecting arm 33 can be adjusted to be as short as possible, thereby reducing the distance between the first circuit board 2 and the second circuit board 1, improving space utilization, and reducing transmission loss. Using the first connector 3 only requires the second connecting part 32 to be connected to the first circuit board 2 using surface mount technology, simplifying the connection process. Moreover, subsequent damage detection of the first connector 3 is simple and efficient.

[0108] Please see Figure 11 Another embodiment of the present invention provides a board-to-board connection structure 200. Along the thickness direction a of the second circuit board 1, the projections of the first cavity 131 and the second cavity 132 partially overlap, that is, the first cavity 131 and the second cavity 132 are misaligned. The first sidewall 14 and the second sidewall 15 form a stepped portion 18 and a stepped portion 19 respectively located in the first cavity 131 and the second cavity 132. A communication port 7 is formed between the stepped portion 18 and the stepped portion 19. The first connecting portion 31 enters the second cavity 132 through the first cavity 131 and the communication port 7 and engages between the stepped portion 18 and the stepped portion 19, thereby realizing the connection between the second circuit board 1 and the first circuit board 2. The board-to-board connection structure 200 provided in this embodiment forms two stepped portions (18, 19) by staggering the first cavity 131 and the second cavity 132. The two stepped portions (18, 19) engage with the first connecting portion 31, making it difficult for the first connecting portion 31 to come out of the communication port 7, thereby improving the connection stability between the first connecting portion 31 and the second circuit board 1.

[0109] In this embodiment, the board-to-board connection structure 200 can also realize the electrical connection or simple connection between the first circuit board 2 and the second circuit board 1. It can be rotated according to actual needs. For specific electrical connection methods, please refer to the above embodiment.

[0110] The method for manufacturing the plate-to-plate connection structure 200 provided in this embodiment is largely the same as the method for manufacturing the plate-to-plate connection structure 100.

[0111] Please see Figures 12 to 14 Another embodiment of the present invention provides a board-to-board connection structure 300, which includes a first circuit board 2, a second circuit board 9, and a third circuit board 6. The second circuit board 9 is located between the first circuit board 2 and the third circuit board 6. The second circuit board 9 is connected to the first circuit board 2 through at least one first connector 3, and the third circuit board 6 is connected to the second circuit board 9 through at least one second connector 8. The first connector 3 and the second connector 8 are electrically connected, thereby achieving at least an electrical connection between the first circuit board 2 and the third circuit board 6.

[0112] The second connector 8 includes a third connecting portion 81 and a fourth connecting portion 82 electrically connected to the third connecting portion 81. The second circuit board 9 includes a first surface 91, a second surface 92 disposed opposite to the first surface 91, and at least one connecting hole 93 penetrating the first surface 91 and the second surface 92. The connecting hole 93 includes a first cavity 931 opening towards the first surface 91 and a second cavity 932 opening towards the second surface 92. The first cavity 931 communicates with the second cavity 932. Along the thickness direction a of the second circuit board 9, the projection of the first cavity 931 and the projection of the second cavity 932 partially overlap. The second circuit board 9 further includes a first sidewall 94 for forming the first cavity 931 and a second sidewall 95 for forming the second cavity 932. The first sidewall 94 and the second sidewall 95 form two stepped portions (96, 97) located in the first cavity 931 and the second cavity 932, respectively. A height difference h is formed between the two stepped portions (96, 97) along the thickness direction a of the second circuit board 9, and a communication port 98 is formed between the two stepped portions (96, 97). The second connecting part 32 is electrically connected to the first circuit board 2. The first connecting part 31 extends into the second cavity 932 via the first cavity 931 and the communication port 98 and engages with the step portion 97 located in the second cavity 932. The fourth connecting part 82 is electrically connected to the third circuit board 6. The third connecting part 81 extends into the first cavity 931 via the second cavity 932 and the communication port 98 and engages with the step portion 96 located in the first cavity 931. The first connecting part 31 and the third connecting part 81 are electrically connected, thereby achieving at least an electrical connection between the first circuit board 2 and the third circuit board 6.

[0113] In this embodiment, the first circuit board 2 is connected to the second circuit board 9 via the first connector 3 from one side of the first surface 91, and the third circuit board 6 is connected to the second circuit board 9 via the second connector 8 from one side of the second surface 92, thereby forming a three-layer board-to-board connection structure of the first circuit board 2, the second circuit board 9, and the third circuit board 6, wherein at least the first circuit board 2 and the third circuit board 6 are electrically connected. The board-to-board connection structure 300 provided in this embodiment can realize the board-to-board connection of three circuit boards by setting a certain height difference h between the two stepped portions (96, 97) and combining the first connector 3 and the second connector 8.

[0114] In this embodiment, the structure of the second connector 8 is roughly the same as that of the first connector 3.

[0115] In this embodiment, the second connector 8 further includes a second connecting arm 83 disposed between the third connecting portion 81 and the fourth connecting portion 82. Specifically, the second connecting arm 83 can perform the same function as the first connecting arm 33, which will not be elaborated here.

[0116] In this embodiment, the second circuit board 9 may not be electrically connected to the first circuit board 2 and the third circuit board 6. The first connector 3 is electrically connected to the second connector 8, thereby electrically connecting the first circuit board 2 and the third circuit board 6. Alternatively, in other embodiments, the electrical connection relationship between the three circuit boards can be designed according to actual needs. For example, the second circuit board 1 can be electrically connected to both the first circuit board 2 and the third circuit board 6. This application allows for electrical connections of different circuit boards according to actual needs to meet specific spatial layout requirements and improve space utilization.

[0117] In this embodiment, at least one of the stepped portions 96 and 97 corresponding to the connecting hole 93 is provided with a conductive layer 4, thereby realizing the electrical connection between the second circuit board 9 and the first circuit board 2 and the third circuit board 6.

[0118] In this embodiment, the conductive layer 4 can also extend to the first sidewall 94 and the second sidewall 95 to improve the stability of the electrical connection.

[0119] In this embodiment, both the first connector 3 and the second connector 8 are made of metal.

[0120] Please see Figures 15 to 17 Combined with reference Figures 8 to 10 , Figure 12 as well as Figure 13 The present invention also provides a method for manufacturing the above-mentioned board-to-board connection structure 300, specifically taking the electrical connection of at least the first circuit board 2 and the third circuit board 6 as an example, including the following steps:

[0121] Step S21, please refer to Figure 15 and Figure 16 Combined with reference Figure 8 and Figure 9 A first circuit board 2 and a third circuit board 6 are provided. The first circuit board 2 includes a first solder pad 21, and the third circuit board 6 includes a second solder pad 61. A first conductive paste 22 is disposed on the first solder pad 21, and a second conductive paste 62 is disposed on the second solder pad 61.

[0122] Step S22, please refer to Figure 17 Combined with reference Figure 10 A first connector 3 and a second connector 8 are provided. The first connector 3 includes a first connecting portion 31 and a second connecting portion 32 electrically connected to the first connecting portion 31. The second connector 8 includes a third connecting portion 81 and a fourth connecting portion 82 electrically connected to the third connecting portion 81. The second connecting portion 32 is disposed on the first conductive paste 22 so that the second connecting portion 32 is electrically connected to the first circuit board 2. The fourth connecting portion 82 is disposed on the second conductive paste 62 so that the fourth connecting portion 82 is electrically connected to the third circuit board 6.

[0123] In this embodiment, surface mount technology is used to connect the second connection portion 32 to the first solder pad 21 of the first circuit board 2. Surface mount technology is also used to connect the fourth connection portion 82 to the second solder pad 61 of the third circuit board 6.

[0124] Step S23, please refer to [link / reference]. Figure 13 A second circuit board 9 is provided. The second circuit board 9 includes a first surface 91, a second surface 92 disposed opposite to the first surface 91, and at least one connecting hole 93 penetrating the first surface 91 and the second surface 92. Each connecting hole 93 includes a first cavity 931 opening towards the first surface 91 and a second cavity 932 opening towards the second surface 92. The first cavity 931 communicates with the second cavity 932. The second circuit board 9 also includes a first sidewall 94 for forming the first cavity 931 and a second sidewall 95 for forming the second cavity 932. Along the thickness direction a of the second circuit board 9, the projection of the first cavity 931 and the projection of the second cavity 932 partially overlap. The first sidewall 94 and the second sidewall 95 form a stepped portion 96 and a stepped portion 97 respectively located in the first cavity 931 and the second cavity 932. Along the thickness direction a, there is a height difference h between the stepped portion 96 and the stepped portion 97. A communication port 98 is formed between the two stepped portions (96, 97).

[0125] In this embodiment, the connecting hole 93 is formed using a molding method similar to that used for the connecting hole 13.

[0126] Step S24, please refer to [link / reference]. Figure 12 The first connecting part 31 is inserted into the second cavity 932 via the first cavity 931 and the connecting port 98, so that the first connecting part 31 is engaged with the step part 97 located in the second cavity 932. The third connecting part 81 is inserted into the first cavity 931 via the second cavity 932 and the connecting port 98 and is engaged with the step part 96 located in the first cavity 931. The first connecting part 31 and the third connecting part 81 are electrically connected to achieve an electrical connection between at least the first circuit board 2 and the third circuit board 6, thereby obtaining the board-to-board connection structure 300.

[0127] It is understandable that the first circuit board 2, the second circuit board 9, and the third circuit board 6 can be simply connected via the first connector 3 and the second connector 8, without electrical connection, thereby meeting the spatial arrangement requirements of the circuit boards and improving space utilization. In this case, the first connector 3 and the second connector 8 can be made of non-metallic materials, such as plastic. The second connecting part 32 can be bonded to the first circuit board 2 with ordinary adhesive, and the fourth connecting part 82 can also be bonded to the third circuit board 6 with ordinary adhesive.

[0128] The board-to-board connection structure provided by this invention achieves board-to-board connection of multiple circuit boards by designing the connection hole of the second circuit board and the connector (first connector or second connector) in an insertion connection method. The connection method is simple and convenient to operate. Moreover, the insertion connection eliminates the need for soldering, requires less installation space, and the size of the connector can be minimized, thereby effectively reducing the connection distance between boards. It also facilitates flexible design of the spatial layout of multiple circuit boards and improves space utilization. In addition, it can be designed to determine whether electrical connection is required between the boards according to actual needs.

Claims

1. A board-to-board connection structure characterized by comprising: The board-to-board connection structure comprises a first circuit board, a second circuit board, and a first connector connecting the first circuit board and the second circuit board, The first connector comprises a first connecting part and a second connecting part connected with the first connecting part; The second circuit board comprises a first surface, a second surface arranged opposite to the first surface, and at least one connecting hole penetrating through the first surface and the second surface, each of the connecting holes comprises a first cavity with an opening facing the first surface and a second cavity with an opening facing the second surface, the first cavity and the second cavity are in communication, the second circuit board further comprises a first side wall for forming the first cavity and a second side wall for forming the second cavity, the projection of the first cavity and the projection of the second cavity partially overlap in the thickness direction of the second circuit board, the first cavity and the second cavity are arranged staggered, the first side wall and the second side wall form two step parts respectively located in the first cavity and the second cavity, a communication port is formed between the two step parts, and a height difference is formed between the two step parts in the thickness direction of the second circuit board; The second connecting part is connected to the first circuit board, and the first connecting part extends into the second cavity and is clamped to the step part located in the second cavity, The board-to-board connection structure further comprises a third circuit board and a second connector connecting the third circuit board and the first circuit board, the second connector comprises a third connecting part and a fourth connecting part electrically connected with the third connecting part; the fourth connecting part is connected to the third circuit board, and the third connecting part extends into the first cavity and is clamped to the step part located in the first cavity, so that the first connecting part and the third connecting part are connected.

2. The board-to-board connection structure according to claim 1, wherein The surface of the step part is provided with a conductive layer, and the first connecting part is electrically connected with the second circuit board through the conductive layer.

3. The board-to-board connection structure according to claim 1, wherein The first connector and the second connector are electrically connected to electrically connect the first circuit board and the third circuit board.

4. The board-to-board connection structure according to claim 3, wherein At least one of the step parts in at least one of the connecting holes is provided with a conductive layer to electrically connect the second circuit board with the first circuit board and the third circuit board.

5. The board-to-board connection structure according to Claim 1, wherein The first connector further comprises a first connecting arm arranged between the first connecting part and the second connecting part, the second connector further comprises a second connecting arm arranged between the third connecting part and the fourth connecting part, and at least one of the first connecting arm or the second connecting arm is in a strip structure or a spiral structure.

6. A method of manufacturing a board-to-board connection structure, characterized by The method comprises the steps of: providing a first circuit board; providing a first connector comprising a first connecting part and a second connecting part electrically connected with the first connecting part, and connecting the second connecting part to the first circuit board; The second circuit board comprises a first surface, a second surface arranged opposite to the first surface, and at least one connecting hole penetrating through the first surface and the second surface, each of the connecting holes comprises a first cavity with an opening facing the first surface and a second cavity with an opening facing the second surface, the first cavity and the second cavity are communicated, the second circuit board further comprises a first sidewall for forming the first cavity and a second sidewall for forming the second cavity, the projection of the first cavity and the projection of the second cavity partially overlap in the thickness direction of the second circuit board, the first cavity and the second cavity are arranged staggered, the first sidewall and the second sidewall form two step portions respectively located in the first cavity and the second cavity, a communication port is formed between the two step portions, and a height difference is formed between the two step portions in the thickness direction of the second circuit board. The first connecting portion is inserted into the second cavity and clamped on the step portion to connect the second circuit board and the first circuit board. A third circuit board is provided. A second connector is provided, the second connector comprises a third connecting portion and a fourth connecting portion electrically connected with the third connecting portion, the fourth connecting portion is connected on the third circuit board; and The third connecting portion is inserted into the first cavity and clamped on the step portion located in the first cavity to connect the third connecting portion with the first connecting portion, so as to connect the first circuit board, the second circuit board and the third circuit board, thereby obtaining the board-to-board connection structure.

7. The method of producing a board-to-board connecting structure according to Claim 6, wherein The step portion is provided with a conductive layer to electrically connect the second circuit board with the first circuit board.

8. The method of producing a board-to-board connecting structure according to Claim 6, wherein The first connector and the second connector are electrically connected to electrically connect the first circuit board with the third circuit board.

9. The method of producing a board-to-board connecting structure according to Claim 8, wherein The second connecting portion is electrically connected with the first circuit board through conductive glue or soldering tin. The fourth connecting portion is electrically connected with the third circuit board through conductive glue or soldering tin.

10. The method of producing a board-to-board connecting structure according to Claim 9, wherein At least one of the step portions is provided with a conductive layer to electrically connect the first circuit board, the second circuit board and the third circuit board.

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