Cooling device for controller and controller

Abstract

This invention discloses a cooling device and a controller for a controller. The cooling device for the controller includes a housing and a flow control structure. The housing defines a cooling channel. The flow control structure is disposed within the cooling channel and includes multiple partition plates. The partition plates divide the cooling channel into multiple liquid flow spaces in the direction of liquid flow within the cooling channel. Multiple through holes are formed on the partition plates, connecting two adjacent liquid flow spaces. In the direction of liquid flow within the cooling channel, the flow area of ​​the multiple through holes on the upstream partition plate is smaller than that on the downstream partition plate. This results in a more consistent overall heat dissipation effect, a more balanced overall temperature, and better cooling performance, making the controller safer to operate and extending its service life.

Description

Technical Field

[0001] This invention relates to the field of vehicle technology, and more particularly, to a cooling device and a controller for a controller. Background Technology

[0002] In the prior art, due to the series arrangement of cooling channels in the cooling device within the controller, the temperature of the cooling liquid gradually increases with heat exchange. During the flow of the cooling liquid, pressure loss along the flow path and local pressure loss occur, which causes the liquid pressure to decrease. Consequently, the liquid temperature is high and the flow rate is slow at the downstream end of the channel, resulting in poor heat dissipation at the downstream end of the cooling device and uneven overall temperature. This affects the operational safety and service life of the controller, and there is room for improvement. Summary of the Invention

[0003] In view of this, the present invention aims to provide a cooling device for a controller, which has a more consistent overall heat dissipation effect, a more balanced overall temperature, and a better cooling effect, thereby making the controller safer to operate and longer in service life.

[0004] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0005] A cooling device for a controller includes: a housing defining a cooling channel; and a flow control structure disposed within the cooling channel, the flow control structure including a plurality of partition plates that divide the cooling channel into a plurality of liquid flow spaces in the direction of liquid flow within the cooling channel. The partition plates have a plurality of through holes that connect adjacent liquid flow spaces. In the direction of liquid flow within the cooling channel, the flow area of ​​the through holes on the upstream partition plate is smaller than the flow area of ​​the through holes on the downstream partition plate.

[0006] Furthermore, the area of ​​each of the through holes on the plurality of partition plates is the same, and in the direction of liquid flow in the cooling channel, the number of through holes on the partition plate located on the upstream side is less than the number of through holes on the partition plate located on the downstream side.

[0007] Furthermore, in the direction of liquid flow within the cooling channel, the spacing between two adjacent partition plates on the upstream side is greater than the spacing between two adjacent partition plates on the downstream side.

[0008] Furthermore, the flow control structure also includes a connecting plate, which is connected to both ends of the plurality of partition plates.

[0009] Furthermore, the cooling device for the controller also includes a power module, the power module including a base plate, the base plate including a plate body and multiple heat dissipation structures, the plate body being fixedly connected to the housing, and the multiple heat dissipation structures being disposed on the plate body and extending into the cooling channel.

[0010] Furthermore, the partition plate and the heat dissipation structure are staggered in the horizontal direction.

[0011] Furthermore, the liquid flow direction in the cooling channel is the length direction, and the direction perpendicular to the length direction in the horizontal direction is the width direction. The width of the cooling channel is greater than the width of the flow control structure, and the width difference is greater than 0 and less than or equal to 1 mm; and / or, the length of the cooling channel is greater than the length of the flow control structure, and the length difference is greater than 0 and less than or equal to 2 mm.

[0012] Furthermore, the flow area of ​​the through holes at both ends of the partition plate is smaller than the flow area of ​​the through hole located in the middle of the partition plate.

[0013] Furthermore, the through hole is formed as an arched hole.

[0014] Compared with the prior art, the cooling device for the controller described in this invention has the following advantages:

[0015] The cooling device for the controller described in this invention has a more consistent overall heat dissipation effect, a more balanced overall temperature, and a better cooling effect, which makes the controller safer to operate and has a longer service life.

[0016] Another object of the present invention is to provide a controller that includes the above-described cooling device for the controller, which has a better cooling effect. Attached Figure Description

[0017] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0018] Figure 1 This is a partial structural schematic diagram of a cooling device according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the flow control structure according to an embodiment of the present invention;

[0020] Figure 3 This is a partial structural schematic diagram of a cooling device according to an embodiment of the present invention;

[0021] Figure 4 This is a partial structural schematic diagram of a cooling device according to an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0023] Figure 6 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0026] Figure 9 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0027] Figure 10 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0028] Figure 11 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0029] Figure 12 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0030] Figure 13 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0031] Figure 14 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0032] Figure 15 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0033] Figure 16 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0034] Figure 17 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0035] Figure 18 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0036] Figure 19 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0037] Figure 20 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0038] Figure 21 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0039] Figure 22 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0040] Figure 23 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention;

[0041] Figure 24 This is a schematic diagram of the structure of the partition plate according to an embodiment of the present invention.

[0042] Explanation of reference numerals in the attached figures:

[0043] 1-Shell, 11-Cooling channel, 111-Liquid flow space, 2-Flow control structure, 21-Divider plate, 211-Through hole, 22-Connecting plate, 31-Base plate, 311-Plate body, 312-Heat dissipation structure. Detailed Implementation

[0044] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0045] In the prior art, due to the series arrangement of cooling channels in the cooling device within the controller, the temperature of the cooling liquid gradually increases with heat exchange. During the flow of the cooling liquid, pressure loss along the flow path and local pressure loss occur, which causes the liquid pressure to decrease. Consequently, the liquid temperature is high and the flow rate is slow at the downstream end of the channel, resulting in poor heat dissipation at the downstream end of the cooling device, uneven overall temperature, and affecting the operational safety and service life of the controller.

[0046] Therefore, this invention provides a cooling device with a flow control structure 2 that controls the liquid flow direction, where the upstream liquid flow rate is slow and the downstream liquid flow rate is faster. This makes the overall heat dissipation effect of the cooling device more consistent, the overall temperature more even, and the cooling effect of the cooling device better, making the controller safer to operate and its service life longer.

[0047] The following is for reference. Figures 1-5 A cooling device for a controller according to an embodiment of the present invention is described.

[0048] The cooling device for the controller according to an embodiment of the present invention may include: a housing 1 and a flow control structure 2.

[0049] The housing 1 defines a cooling channel 11 through which cooling liquid can flow. The cooling liquid flows from one end of the cooling channel 11 to the other end. A flow control structure 2 is installed in the cooling channel 11 to control the flow rate of the cooling liquid during its flow within the cooling channel 11 of the housing 1, thereby making the overall heat dissipation effect of the cooling device more consistent and improving the cooling effect of the cooling device.

[0050] Furthermore, the flow control structure 2 includes multiple partition plates 21, which divide the cooling channel 11 into multiple liquid flow spaces 111 in the direction of liquid flow within the cooling channel 11, thereby dividing the cooling channel 11 into multiple flow segments. Multiple through holes 211 are provided on the partition plates 21, which connect two adjacent liquid flow spaces 111. By controlling the flow area of ​​the multiple through holes 211 provided on the partition plates 21, the flow rate of the cooling liquid in different flow segments can be controlled.

[0051] In the direction of liquid flow within the cooling channel 11, the flow area of ​​the multiple through holes 211 on the upstream partition plate 21 is smaller than the flow area of ​​the multiple through holes 211 on the downstream partition plate 21. In other words, the sum of the areas of the multiple through holes 211 on the upstream partition plate 21 is less than the sum of the areas of the multiple through holes 211 on the downstream partition plate 21.

[0052] Because the flow area of ​​the multiple through holes 211 on the upstream partition plate 21 is small, the flow velocity of the cooling liquid in the upstream section of the cooling channel 11 is relatively slow. However, the flow area of ​​the multiple through holes 211 on the downstream partition plate 21 is large, which allows the cooling liquid to flow faster. This can compensate for the pressure loss along the flow path and the local pressure loss generated during the flow of the cooling liquid. It can also make the overall heat dissipation effect of the cooling device more consistent, the overall temperature more balanced, and the cooling effect of the cooling device better. This makes the operation of the controller safer and the service life longer.

[0053] According to the embodiments of the present invention, the cooling device for the controller has a more consistent overall heat dissipation effect, a more balanced overall temperature, and a better cooling effect, which makes the controller safer to operate and has a longer service life.

[0054] In other embodiments, the cooling medium in the cooling device can be a cooling gas, and the flow control structure 2 can control the flow rate of the gas, thereby making the overall heat dissipation effect of the cooling device more consistent, the overall temperature more balanced, and the cooling effect better.

[0055] like Figure 2As shown, in some embodiments, the area of ​​each through hole 211 on the multiple partition plates 21 is the same to facilitate the processing of the flow control structure 2. In this case, in the direction of liquid flow in the cooling channel 11, in order to make the flow area of ​​the multiple through holes 211 on the upstream partition plate 21 smaller than that on the downstream partition plate 21, the number of through holes 211 on the upstream partition plate 21 can be less than that on the downstream partition plate 21. This allows the flow speed of the cooling liquid in the upstream section to be slower, and the flow speed of the cooling liquid in the downstream section to be faster. As a result, the overall heat dissipation effect of the cooling device becomes more consistent, the overall temperature is balanced, and the cooling effect is better.

[0056] In other embodiments, the number of through holes 211 on the multiple partition plates 21 is the same. In this case, by controlling the area of ​​the through holes 211 on the upstream partition plate 21 to be smaller than the area of ​​the through holes 211 on the downstream partition plate 21, the flow rate of the cooling liquid in the upstream section can be slower, and the flow rate of the cooling liquid in the downstream section can be faster. This makes the overall heat dissipation effect of the cooling device more consistent, the overall temperature more balanced, and the cooling effect better.

[0057] Of course, the number and area of ​​the through holes 211 on the multiple partition plates 21 can be different. As long as the sum of the areas of the through holes 211 on the upstream partition plate 21 is less than the sum of the areas of the through holes 211 on the downstream partition plate 21, the flow rate of the cooling liquid in the upstream section will be slower, and the flow rate of the cooling liquid in the downstream section will be faster. This will make the overall heat dissipation effect of the cooling device more consistent, the overall temperature more balanced, and the cooling effect better.

[0058] Reference Figure 1 , Figure 2 and Figure 3 In the direction of liquid flow within the cooling channel 11, the distance between two adjacent partition plates 21 on the upstream side is greater than the distance between two adjacent partition plates 21 on the downstream side. As a result, on the upstream side, the cooling liquid passes through fewer partition plates 21, the acceleration effect of the partition plates 21 on the cooling liquid is poor, and the flow rate of the cooling liquid is slower. On the downstream side, the cooling liquid passes through more partition plates 21, the partition plates 21 accelerate the cooling liquid, making the flow rate of the cooling liquid faster. This makes the overall heat dissipation effect of the cooling device more consistent, the overall temperature more balanced, and the cooling effect better.

[0059] Combination Figure 1 , Figure 2 and Figure 3In the embodiment shown, the flow control structure 2 further includes a connecting plate 22, which is connected to both ends of the plurality of partition plates 21 so that when each flow control structure 2 is set in the cooling channel 11, the distance between each partition plate 21 is stable, thus ensuring the stability of the partition plate 21.

[0060] like Figure 4 As shown, the cooling device for the controller also includes a power module. The housing 1 is disposed on one side of the power module, and the cooling liquid inside the housing 1 can cool the power module to ensure the stable operation of the power module.

[0061] Furthermore, the power module includes a base plate 31, which supports the electrical components on the power module at the bottom. The housing 1 is fixed to the base plate 31 so that the cooling liquid inside the housing 1 can cool the electrical components inside the power module through the base plate 31.

[0062] The base plate 31 includes a plate body 311 and multiple heat dissipation structures 312. The plate body 311 is fixedly connected to the housing 1. The plate body 311 and the housing 1 together define a cooling channel 11 so that the cooling liquid can pass through the cooling channel 11 to cool the power module. The multiple heat dissipation structures 312 are disposed on the plate body 311 and extend into the cooling channel 11. The heat dissipation structures 312 can increase the heat dissipation area of ​​the base plate 31, so that the cooling liquid in the cooling channel 11 can fully exchange heat with the base plate 31, ensuring the cooling efficiency of the cooling device.

[0063] The heat dissipation structure 312 can be a cylindrical, prismatic, elliptical, or irregularly shaped structure, and there is no limitation on it.

[0064] like Figure 4 As shown, the partition plate 21 and the heat dissipation structure 312 are staggered in the horizontal direction. Thus, the heat dissipation structure 312 can limit the flow control structure 2, ensuring that the flow control structure 2 is stably installed in the cooling channel 11, preventing the flow control structure 2 from moving in the horizontal direction, and preventing the cooling device from emitting noise.

[0065] like Figure 1 and Figure 3 As shown, the liquid flow direction within the cooling channel 11 is along its length (e.g., ...). Figure 1 (A-B direction), the direction perpendicular to the length direction in the horizontal direction is the width direction (e.g., AB direction). Figure 1 CD direction).

[0066] The width of the cooling channel 11 is greater than the width of the flow control structure 2, and the width difference is greater than 0 and less than or equal to 1 mm. In other words, when the flow control structure 2 is set in the cooling channel 11, there is a certain gap between the flow control structure 2 and the side wall of the cooling channel 11, which makes it easier to set the flow control structure 2 in the cooling channel 11.

[0067] The length of the cooling channel 11 is greater than the length of the flow control structure 2, and the length difference is greater than 0 and less than or equal to 2mm. Therefore, the flow control structure 2 has a certain amount of room to move in the length direction. During the installation process, the flow control structure 2 can be reasonably arranged according to the gap of the heat dissipation structure 312, so that the partition plate 21 of the flow control structure 2 can be located exactly between the gaps of the heat dissipation structure 312.

[0068] Furthermore, the height of the cooling channel 11 is the same as the height of the flow control structure 2 to prevent the flow control structure 2 from swaying within the cooling channel 11 and to prevent the cooling device from making noise.

[0069] Specifically, during the installation of the cooling device, the flow control structure 2 is first installed within the cooling channel 11. Since the cooling channel 11 has sufficient length and width relative to the flow control structure 2, the flow control structure 2 can be easily installed within it. Next, the user fixes the power module onto the housing 1. By controlling the flow control structure 2 to move longitudinally, the heat dissipation structure 312 on the base plate 31 is inserted into the cooling channel 11 and horizontally staggered with the partition plate 21. This avoids interference between the partition plate 21 and the heat dissipation structure 312, preventing interference with the installation of the base plate 31. Finally, the power module is fixed onto the housing 1 using screws.

[0070] In some embodiments, refer to Figure 5 The flow area of ​​the through holes 211 at both ends of the partition plate 21 is smaller than that of the through hole 211 in the middle of the partition plate 21. In other words, the partition plate 21 can control the flow speed of the cooling liquid in the center to be faster and the flow speed of the cooling liquid on both sides to be slower. As a result, the cooling liquid in the cooling channel 11 corresponding to the part of the power module that dissipates more heat in the center flows faster and the heat dissipation effect is better. Meanwhile, the cooling liquid in the cooling channel 11 corresponding to the part of the power module that dissipates less heat on both sides flows slower, so that the overall temperature of the power module is more balanced and the cooling effect is better.

[0071] In some embodiments, the opening of the through hole 211 on the partition plate 21 can be set according to the temperature distribution on the power module, controlling the cooling liquid flow rate in the cooling channel 11 corresponding to the higher temperature position to be faster, and controlling the cooling liquid flow rate in the cooling channel 11 corresponding to the lower temperature position to be slower, thereby making the overall temperature of the power module more balanced and the cooling effect better.

[0072] In some embodiments, such as Figure 5 and Figure 6 As shown, the through hole 211 is formed as an arched hole to facilitate the processing of the flow control structure 2.

[0073] In other embodiments, reference is made to Figure 7 The through hole 211 is formed as a triangular hole, such as... Figure 8 As shown, the through hole 211 is formed as an isosceles trapezoidal hole, as referenced. Figure 9 The through hole 211 is formed as a right-angled trapezoidal hole, such as... Figure 10 As shown, the through hole 211 is formed as a rectangular hole, as referenced. Figures 11-13 The through hole 211 is formed into a shape that combines a rectangle and a semicircle, such as... Figure 14 As shown, the through hole 211 is formed into a hole with a shape combining an isosceles trapezoid and a rectangle, as shown in the reference. Figures 15-16 The through hole 211 is formed into a shape that combines a rectangle and a crescent shape, such as... Figure 17 As shown, the through hole 211 is formed as a cross-shaped hole, as referenced. Figure 18 Through hole 211 is formed into a heptagonal hole, such as Figures 19-21 As shown, the through hole 211 is formed into a hole of multiple rectangular shapes, as shown in the figure. Figures 22-24 The through hole 211 is formed as an inclined rectangular hole or a hole formed by combining multiple inclined rectangles.

[0074] Furthermore, the shape of the through hole 211 can be set as needed, and is not limited here.

[0075] According to another embodiment of the present invention, the controller includes the cooling device for the controller described in the above embodiments.

[0076] In some embodiments, the cooling device of the present invention can be applied to the power module of a vehicle controller. Since the ambient temperature of the vehicle controller is high, the cooling efficiency of the cooling device is required to be high. Therefore, the cooling device dissipates heat through liquid cooling. The cooling device can use 50% ethylene glycol as the liquid cooling medium, control the liquid flow rate at the inlet of the cooling device to be 8 l / min, and control the temperature of the liquid cooling medium at the inlet of the cooling device to be 65°C.

[0077] By employing the aforementioned cooling device, the controller achieves better cooling performance. Other aspects of the controller's construction are already known to those skilled in the art and will not be described in detail here.

[0078] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cooling device for a controller, characterized in that, include: Housing (1), the housing (1) defines a cooling channel (11); A flow control structure (2) is disposed within the cooling channel (11). The flow control structure (2) includes multiple partition plates (21). The multiple partition plates (21) divide the cooling channel (11) into multiple liquid flow spaces (111) in the direction of liquid flow within the cooling channel (11). Multiple through holes (211) are provided on the partition plates (21), and the through holes (211) connect two adjacent liquid flow spaces (111). In the liquid flow direction within the cooling channel (11), the flow area of ​​the plurality of through holes (211) on the upstream partition plate (21) is smaller than the flow area of ​​the plurality of through holes (211) on the downstream partition plate (21), and the distance between two adjacent partition plates (21) on the upstream side is greater than the distance between two adjacent partition plates (21) on the downstream side in the liquid flow direction within the cooling channel (11). The cooling device also includes: A connecting plate (22) is connected to both ends of the plurality of partition plates (21); The power module includes a base plate (31), which includes a plate body (311) and multiple heat dissipation structures (312). The plate body (311) is fixedly connected to the housing (1). The multiple heat dissipation structures (312) are disposed on the plate body (311) and extend into the cooling channel (11). The partition plate (21) and the heat dissipation structures (312) are staggered in the horizontal direction.

2. The cooling device for a controller according to claim 1, characterized in that, The through holes (211) on the plurality of partition plates (21) have the same area. In the direction of liquid flow in the cooling channel (11), the number of through holes (211) on the partition plate (21) located upstream is less than the number of through holes (211) on the partition plate (21) located downstream.

3. The cooling device for a controller according to claim 1, characterized in that, The liquid flow direction in the cooling channel (11) is the length direction, and the direction perpendicular to the length direction in the horizontal direction is the width direction. The width of the cooling channel (11) is greater than the width of the flow control structure (2), and the width difference is greater than 0 and less than or equal to 1 mm; and / or, the length of the cooling channel (11) is greater than the length of the flow control structure (2), and the length difference is greater than 0 and less than or equal to 2 mm.

4. The cooling device for a controller according to claim 1, characterized in that, The flow area of ​​the through holes (211) at both ends of the partition plate (21) is smaller than the flow area of ​​the through hole (211) located in the middle of the partition plate (21).

5. The cooling device for a controller according to claim 1, characterized in that, The through hole (211) is formed as an arched hole.

6. A controller, characterized in that, Includes a cooling device for the controller according to any one of claims 1-5.

Images