High speed, high density direct mate orthogonal connector

Abstract

Right angle connectors for high density, high speed signals. The connectors can include a right angle leadframe assembly having signal conductive elements and ground shields held by a leadframe housing. High frequency performance can be achieved by a force transmitting member between a connector housing holding the leadframe assembly and a portion of the leadframe housing holding the signal conductive elements and the shields adjacent their mounting ends. A core member can be inserted into the housing and the mating ends of the conductive elements of the ground shields can be adjacent the core member, enabling the electrical and mechanical performance of the mating interface to be defined by the core member. The core member can incorporate insulative and lossy features that can be complex to form as part of the connector housing, but can be easily formed as part of a separate core member.

Description

[0001] Cross-reference to related applications

[0002] This patent application claims priority and benefit to U.S. Provisional Patent Application No. 62 / 966,521, filed January 27, 2020, entitled "HIGH SPEED, HIGH DENSITY DIRECT MATE ORTHOGONAL CONNECTOR," the entire contents of which are incorporated herein by reference. This patent application also claims priority and benefit to U.S. Provisional Patent Application No. 62 / 966,528, filed January 27, 2020, entitled "HIGH SPEED CONNECTOR," the entire contents of which are incorporated herein by reference. This patent application further claims priority and benefit to U.S. Provisional Patent Application No. 63 / 076,692, filed September 10, 2020, entitled "HIGH SPEED CONNECTOR," the entire contents of which are incorporated herein by reference. Technical Field

[0003] This patent application generally relates to interconnection systems for interconnecting electronic components, such as those that include electrical connectors. Background Technology

[0004] Electrical connectors are used in many electronic systems. It is generally easier and more cost-effective to manufacture a system as separate electronic components (such as printed circuit boards (“PCBs”) that can be connected together using electrical connectors. One known arrangement for connecting several PCBs is to use one PCB as a backplane. Other PCBs, referred to as “daughters” or “daughter cards”, can be connected through this backplane.

[0005] One known backplane is a printed circuit board on which numerous connectors are mounted. Conductive traces in the backplane can be electrically connected to signal conductors in the connectors, enabling signal routing between the connectors. Daughter cards can also have connectors mounted on them. Connectors mounted on the daughter cards can be plugged into connectors mounted on the backplane. In this way, signals can be routed between the daughter cards via the backplane. Daughter cards can be plugged into the backplane at right angles. Therefore, connectors for these applications may include right-angle bends and are commonly referred to as "right-angle connectors."

[0006] In other system configurations, signals can be routed between parallel boards stacked on top of each other. Connectors used in these applications are typically referred to as "stack connectors" or "mezzanine connectors." In yet another configuration, orthogonal boards can be aligned edge-to-edge. Connectors used in this configuration are typically referred to as "direct-fit orthogonal connectors."

[0007] Regardless of the specific application, electrical connector design has been adapted to reflect trends in the electronics industry. Electronic systems are generally becoming smaller, faster, and more functionally complex. Due to these changes, the number of circuits in a given area of ​​an electronic system and the frequency of circuit operation have increased significantly in recent years. Current systems transmit more data between printed circuit boards and require electrical connectors that are electrically capable of processing more data at speeds greater than, and even greater than, those used just a few years ago.

[0008] In high-density, high-speed connectors, electrical conductors can be very close to each other, potentially leading to electrical interference between adjacent signal conductors. To reduce interference and to otherwise provide the desired electrical characteristics, shielding is typically placed between or around adjacent signal conductors. Shielding prevents signals carried on one conductor from causing "crosstalk" to another conductor. Shielding can also affect the impedance of each conductor, which can further contribute to the desired electrical characteristics.

[0009] Other techniques can be used to control connector performance. For example, differential signal transmission can also reduce crosstalk. Differential signals are carried on a pair of conductive paths, called a "differential pair." The voltage difference between the conductive paths represents the signal. Typically, differential pairs are designed to have preferential coupling between the pair of conductive paths. For example, the two conductive paths of a differential pair can be arranged to extend closer to each other than adjacent signal paths in the connector. Shielding is not desired between the conductive paths of the pair, but shielding can be used between the differential pairs. Electrical connectors can be designed for both differential and single-ended signals.

[0010] In interconnect systems, connectors are attached to printed circuit boards (PCBs). Typically, PCBs are formed as multilayer assemblies made of stacks of dielectric sheets (sometimes referred to as "prepregs"). Some or all of the dielectric sheets may have conductive films on one or both surfaces. Some of the conductive films may be patterned using lithography or laser printing techniques to form conductive traces used to establish interconnections between PCBs, circuits, and / or circuit elements. Other conductive films may remain substantially intact and may be used as ground or power planes to supply reference potentials. The dielectric sheets can be formed into a single board structure by heating the stacked dielectric sheets and pressing them together.

[0011] To establish an electrical connection to a conductive trace or a ground / power plane, holes can be drilled through the printed circuit board. These holes, or "vias," are filled or plated with metal so that the vias are electrically connected to one or more of the conductive traces or the planes through which the vias pass.

[0012] To attach a connector to a printed circuit board, the contact "tail" from the connector can be inserted into a via or attached to the conductive pads of the via on the surface of the printed circuit board. Summary of the Invention

[0013] An embodiment of a high-speed, high-density interconnect system is described.

[0014] Some embodiments relate to an electrical connector. The electrical connector includes: a plurality of leadframe assemblies, each leadframe assembly including a plurality of conductive elements, each of the plurality of conductive elements including a mating end and a mounting end opposite to the mating end; a housing holding the plurality of leadframe assemblies, the housing including a front shell; and a plurality of core members held by the front shell, the plurality of core members comprising a conductive material. The mating ends of the conductive elements of the leadframes in the plurality of leadframes are disposed on opposite sides of corresponding core members in the plurality of core members. Selected mating ends of the conductive elements of the leadframes on opposite sides of the core members in the plurality of core members are coupled via the conductive material of the core members.

[0015] Some embodiments relate to a leadframe assembly. The leadframe assembly includes: a plurality of conductive elements, each of the plurality of conductive elements including a mating end, a mounting end opposite to the mating end, and an intermediate portion extending between the mating end and the mounting end, the mating ends of the plurality of conductive elements being aligned in a first row, the mounting ends of the plurality of conductive elements being aligned in a second row parallel to the first row, wherein the intermediate portions of the plurality of conductive elements are bent to provide a first segment parallel to the mating end and a second segment parallel to the mounting end; a leadframe housing holding the intermediate portions of the plurality of conductive elements, the leadframe housing including at least one portion holding the second segments of the plurality of conductive elements; and a shielding member separated from the plurality of conductive elements by the leadframe housing, the shielding member including a plurality of mounting ends, the plurality of mounting ends of the grounding shielding member being aligned in a third row parallel to and offset relative to the second row. The at least a portion of the leadframe housing includes a plurality of portions, the plurality of portions including surfaces facing the mounting ends of the shielding member and engaging with an edge of the shielding member.

[0016] Some embodiments relate to a compliant shield for an electrical connector. The electrical connector includes a plurality of mounting terminals for attachment to a printed circuit board. The compliant shield includes: a conductive body made of a foam material adapted to allow a first portion from the mounting terminals of the electrical connector to penetrate and maintain physical contact with the first portion from the mounting terminals of the electrical connector, the first portion from the mounting terminals of the electrical connector being configured for grounding; and a plurality of openings in the conductive body, the multiple openings being sized and positioned such that a second portion from the mounting terminals of the electrical connector passes through them without physical contacting a portion of the mounting terminals of the electrical connector, the second portion of the mounting terminals being configured for signaling.

[0017] Some embodiments relate to an electrical connector. The electrical connector includes: a plurality of leadframe assemblies. Each leadframe assembly includes: a plurality of conductive elements, each conductive element including a mating portion, a mounting portion, and an intermediate portion connecting the mating portion and the mounting portion, wherein the wide side of the mating portion and the wide side of the mounting portion extend in mutually perpendicular planes, and a leadframe housing holding the plurality of conductive elements. The leadframe housing includes: a first portion secured to a portion of the plurality of conductive elements extending parallel to the plane of the mating portion; a second portion secured to a portion of the plurality of conductive elements extending parallel to the plane of the mounting portion; and at least one member extending from the second portion. The electrical connector includes a housing holding the plurality of leadframe assemblies, the housing including a front shell that holds the first portion of the leadframe housing of the plurality of leadframe assemblies in slots separated by spacers. The component of the lead frame housing contacts the corresponding partition of the front housing, such that the force acting on the front housing for mounting the connector to the board is at least partially transferred to the second portion of the lead frame housing.

[0018] Some embodiments relate to a printed circuit board. The printed circuit board includes: a surface; a plurality of signal via differential pairs arranged in a first row; a ground plane at an inner layer of the printed circuit board; and a plurality of ground vias connected to the ground plane, the plurality of ground vias being configured to receive ground mounting terminals of mounting connectors, the plurality of ground vias being arranged in a second row, the second row being offset relative to the first row in a direction perpendicular to the first row and offset relative to the signal via differential pairs in a direction parallel to the first row.

[0019] The foregoing invention is provided by way of example and is not intended to be limiting. Attached Figure Description

[0020] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component illustrated in the various views is indicated by similar reference numerals. For clarity, not every component is labeled in every view. In the accompanying drawings:

[0021] Figure 1 This is a perspective view of an electrical interconnection system according to some embodiments.

[0022] Figure 2A According to some embodiments Figure 1 A perspective view of a right-angle orthogonal connector in an electrical interconnection system, showing the mating interface of the right-angle orthogonal connector.

[0023] Figure 2B According to some embodiments Figure 2A A perspective view of a right-angle orthogonal connector, showing the mounting interface of the right-angle orthogonal connector.

[0024] Figure 2C According to some embodiments Figure 2A Exploded view of a right-angle orthogonal connector.

[0025] Figure 3A According to some embodiments Figure 2A A front view of the core component of a right-angle orthogonal connector.

[0026] Figure 3B According to some embodiments Figure 3A Side view of the core component.

[0027] Figure 3C According to some embodiments Figure 3A The core component along Figure 3A A cross-sectional view of the line marked "XX".

[0028] Figure 3D It is a perspective view of the conductive material with carrier strips attached to the core component before the lossy material and insulating material are molded onto it.

[0029] Figure 3E It shows Figure 3D The conductive material is formed after a lossy material is molded onto it.

[0030] Figure 4A According to some embodiments Figure 2A A perspective view of the lead frame assembly of a right-angle orthogonal connector.

[0031] Figure 4B According to some embodiments Figure 4A A perspective view of the lead frame assembly without grounding shield.

[0032] Figure 4C This is a perspective view of a lead frame assembly configured to be attached to the upper surface of a core component according to some embodiments.

[0033] Figure 5A According to some embodiments Figure 2A A partially cut-out front view of a right-angle orthogonal connector.

[0034] Figure 5B According to some embodiments Figure 5A Right-angle orthogonal connectors in Figure 5A An enlarged view of the portion within the circle marked "A".

[0035] Figure 6 According to some embodiments Figure 2A A perspective view of the front housing of a right-angle orthogonal connector.

[0036] Figure 7A According to some embodiments Figure 2A A perspective view of a portion of a right-angle orthogonal connector, showing the rear housing and mounting interface shield.

[0037] Figure 7B The mounting interface of the right-angle orthogonal connector according to some embodiments is in Figure 2B An enlarged view of a portion within the circle marked "7B".

[0038] Figure 8A According to some embodiments Figure 7A A perspective view of the rear housing, showing the receiving end for the lead frame assembly.

[0039] Figure 8B According to some embodiments Figure 8A A perspective view of the rear housing, showing the mounting end.

[0040] Figure 9A According to some embodiments Figure 7A Top view of the installation interface shielding component.

[0041] Figure 9B According to some embodiments Figure 9A Side view of the installation interface shield.

[0042] Figure 10 According to some embodiments Figure 2B A top view of the footprint of a right-angle orthogonal connector. Detailed Implementation

[0043] The inventors have recognized and understood connector designs that enhance the performance of high-density interconnect systems, particularly those carrying ultra-high frequency signals necessary to support high data rates. Connector designs can provide conductive shielding and loss-dissipating materials to the closely spaced signal conductors of high-density interconnects in locations that offer ideal performance at very high frequencies, including 112 GHz and higher. These designs can also provide a reliable connector that is economically manufactured, even when miniaturized to provide high-density interconnects.

[0044] While traditional designs are effective at certain frequencies, they may fail to deliver the expected performance at very high frequencies, such as 112 GHz or higher. To enable effective isolation of signal conductors at very high frequencies, connectors can include conductive materials selectively molded from lossy materials. The conductive material can provide effective shielding in the mating areas where two connectors mate. When two connectors mate, the mating interface shielding can be positioned between the mating portions of the conductive elements carrying independent signals.

[0045] These technologies can be applied to connectors that support direct-fit orthogonal system configurations. The connector may have rows of conductive elements parallel to the surface of the printed circuit board on which it is mounted, and the connector is configured to mate with a second connector having rows of conductive elements perpendicular to the surface of a second printed circuit board on which it is mounted.

[0046] A direct-fit orthogonal connector can be constructed from a leadframe assembly including a shield for conductive elements passing through the middle portion of the connector. The components of the leadframe assembly can be configured to maintain the positional relationship between the shield and the signal conductive elements when the mounting ends of the conductive elements and the shield are inserted into holes in a printed circuit board, thereby enhancing high-frequency performance. For example, the signal conductor can be held within an insulating housing of the leadframe assembly. The leadframe housing can have features that engage with the leadframe shield and the connector housing. The leadframe housing can transmit the force applied to the connector housing to mount the connector onto the printed circuit board to the conductive elements and the leadframe shield within the leadframe. The relative position of the shield and the conductive elements can be maintained even under the force of inserting the press-fit portions of the shield and the conductive elements into holes in the board for mounting the connector.

[0047] Ideal electrical performance at the mating interface can be provided by using core components comprising conductive and / or dissipative materials. These core components can be integrated into the front portion of the housing for the connector, such that when the leadframe assembly is inserted into the housing, the mating ends of the conductive elements of the leadframe assembly are aligned with the core components.

[0048] The core component can be formed with features that facilitate mating, including protrusions that deflect the mating ends of the conductive elements relative to the second connector to prevent mechanical stubbing of the mating ends of the two connectors. These features can be easily molded into the core component, even if molding similar features as part of the housing would be difficult or prone to manufacturing defects. In addition to improving electrical performance, the conductive material in the core component can also provide mechanical functions, such as increasing the rigidity of the core component and facilitating its integration into the housing.

[0049] Connectors can have features that support desired electrical and / or mechanical performance at the mounting interface. To reduce unwanted emissions at the mounting area where the connector is mounted to a printed circuit board (PCB), the connector can include a compressible shield. The compressible shield can be configured to provide a current path between an internal shield within the connector and a grounding structure in the PCB. These current paths can be routed parallel to the signal conductors from the connector to the PCB. The inventors have discovered that such a compressible shield, while spanning a short distance such as 2 mm or less between the connector and the circuit board, provides a desirable increase in signal integrity, particularly for high-frequency signals.

[0050] Compressible shielding can be simply implemented using conductive foam sheets that can be adhered to the connector's organizer. This organizer can include a support that sets a gap between the connector and the circuit board when the connector is, for example, secured to the circuit board with screws. This configuration eliminates the reaction force caused by compression of the compliant shielding, preventing reliable connection between the connector and the circuit board and ensuring a reliable attachment. The height of the support can provide partial compression of the compliant shielding, ensuring a reliable connection between the internal shielding and the ground plane of the printed circuit board, despite variations in the dimensions of the manufactured components.

[0051] Printed circuit boards equipped with direct-fit orthogonal connectors can also be configured to enhance electrical and mechanical performance. Reliable connector performance can also be enhanced by aligning the crimped portions of the conductors (including signal conductive elements and leadframe shielding) of the leadframe assembly with the middle portions of these conductors. This configuration allows force to be transmitted through the middle portions in the direction aligned with the crimped portions, providing a low-risk crimping fit when mounting the connector to the PCB. Mounting holes on the PCB can be configured to support this configuration. In some embodiments, the connector footprint in the PCB can have rows of positioned pairs of mounting holes to receive the crimped portions of pairs of signal conductive elements in the leadframe assembly.

[0052] The holes in the crimp fittings for receiving the leadframe shield can also be arranged in a row parallel to the rows of holes for the signal conductive elements. The rows of holes in the shield crimp fittings of the leadframe assembly can be offset relative to the rows of holes in the signal crimp fittings for the leadframe in a column direction perpendicular to the row direction. The holes in the shield crimp fittings can be adjacent to each pair of holes in the signal crimp fittings.

[0053] In some embodiments, a shaded via with a diameter smaller than that of the receiving press-fit portion can be grounded and positioned in a row of signal vias, between each pair of signal vias. Optionally or additionally, the shaded via can be positioned between each pair of signal vias in a row and a pair of signal vias in an adjacent parallel row.

[0054] These technologies can be used individually or in combination to provide ideal electrical characteristics to interconnect systems from a circuit board through connectors to other connectors, which can be similarly configured to achieve ideal electrical performance at high frequencies. For example, an example of such an electrical connector is described in common U.S. Application No. 17 / 158,214 entitled “HIGH SPEED CONNECTOR,” the entire contents of which are incorporated herein by reference.

[0055] Figure 1 An exemplary embodiment of this connector is shown, wherein the direct-fit orthogonal connector has a right-angle orthogonal configuration. Figure 1 An electrical interconnect system 100, in the form of an electronic system, is depicted. This example shows a direct-fit orthogonal configuration because printed circuit board 108 is orthogonal to printed circuit board 1000 and is edge-to-edge. The electrical connection between PCBs 108 and 1000 is achieved through two mating connectors, shown here as right-angle orthogonal connector 200 and right-angle connector 102.

[0056] Figure 1 A portion of an electronic system, such as an electronic switch or a router, is shown. Figure 1 Only a portion of each of PCBs 108 and 1000 is shown. For brevity, other portions of the PCBs, including those with additional connectors or other electronic components, are not shown. Furthermore, this system may include more than two printed circuit boards. For example, additional printed circuit boards may be included parallel to PCB 108 or PCB 1000. Regardless of the number of printed circuit boards, Figure 1 The connector shown can be used to establish connections between printed circuit boards that are orthogonal to each other.

[0057] In the illustrated embodiment, the right-angle orthogonal connector 200 is attached to the printed circuit board 1000 at mounting interface 106 and mates with the plug connector 700 at mating interface 104. The right-angle connector 102 can be attached to the printed circuit board 108 at mounting interface 110. At the mounting interfaces, conductive elements within the connector that serve as signal conductors can be connected to signal traces within the corresponding printed circuit board. For connectors including ground conductive elements, those ground conductive elements can be connected to a grounding structure within the printed circuit board.

[0058] To support connector mounting to corresponding printed circuit boards (PCBs), right-angle orthogonal connector 200 may include contact tails configured to attach to PCB 1000. Right-angle connector 102 may include contact tails configured to attach to PCB 108. These contact tails may form one end of a mating connector for conductive elements. When the connector is mounted to the PCB, these contact tails will establish an electrical connection with a conductive structure within the PCB that carries a signal or is connected to a reference potential. In some embodiments, the contact tails may be press-fit eye-on (EON) contacts designed to be pressed into vias in the PCB, which may in turn connect to signal traces, ground planes, or other conductive structures within the PCB. In some embodiments, other forms of contact tails may be used, such as surface mount contacts, BGA attachments, or pressure contacts.

[0059] At the mounting interface, the shielding inside the connector can also be connected to the conductive structure on the printed circuit board. This connection can be made using the same techniques as for signal conductive elements and / or ground conductive elements. Optionally or additionally, the shielding can be connected using compliant members and / or compliant shielding that provide a conductive path from the conductive structure in the connector to a ground plane on the surface of the PCB.

[0060] At the mating interface, the conductive elements in each connector establish mechanical and electrical connections, allowing the conductive traces in printed circuit board 108 to be electrically connected to the conductive traces in printed circuit board 1000 via the mating connectors. Similarly, the conductive elements within each connector that serve as ground conductors can be connected so that the grounding structure in printed circuit board 108 can be electrically connected to the grounding structure in printed circuit board 1000.

[0061] exist Figure 1In one embodiment, each connector has a linear array of mating ends for conductive elements, the linear array of mating ends mating with other conductive elements at the mating interface. When two connectors are mated, each mating end linear array of one connector is aligned with and pressed against the mating ends of the linear array of the other connector. In the illustrated embodiment, the mating ends have wide sides and edges. Each linear array may include mating ends positioned edge-to-edge along the array edge such that the wide side is parallel to the axis of the array. When mated, the wide sides of the two mating ends may press against each other.

[0062] exist Figure 1 In an orthogonal configuration, to achieve alignment of the wide sides of the mating ends of connectors mounted on an orthogonal PCB, arrays of two mating connectors have different orientations relative to the PCB on which the connectors are mounted. In this example, connector 102 has a column of mating ends that extends vertically perpendicular to PCB 108. Connector 200 has a row of mating ends that extends horizontally parallel to PCB 1000.

[0063] exist Figure 1 In the example, connector 102 can be a right-angle connector, such as a right-angle connector for mating with a backplate top or cable connector. Such a connector and its construction techniques are described in common application No. 17 / 158,214 entitled "HIGH SPEED CONNECTOR". Orthogonal connector 200 can be constructed using the same construction techniques and is suitable for direct-fit orthogonal form factors. The construction techniques described more fully in common application No. 17 / 158,214 entitled "HIGH SPEED CONNECTOR" and applied to connector 200 may include the use of injection-molded lead frame assembly (IMLA) and IMLA shielding. These techniques also include the use of a core member containing the mating interface of the connector, which is separately molded from the connector housing to which the IMLA is inserted, but added to the connector housing. Shielding within the core member, incorporating dissipative material at the mating interface, and interconnection between the core shielding and the IMLA shielding may also be applied to connector 200. In addition, organizers and / or compliant shields may be used at the mounting interface. Further details of these technologies applicable to connector 200 are provided below.

[0064] Figure 2A and Figure 2B This is a perspective view of a right-angle orthogonal connector 200 according to some embodiments. Figure 2CThis is an exploded view of a right-angle orthogonal connector 200 according to some embodiments. The right-angle orthogonal connector 200 may include a lead frame assembly 400, a core member 300, a housing 214 retaining the lead frame assembly 400, and a compressible shield 900 at a mounting interface 106. The lead frame assembly 400 may include mating ends (e.g., signal mating ends 202 and ground mating ends 204) and mounting ends (e.g., signal mounting ends 206 and ground mounting ends 208), the mating ends being arranged in rows 210 at the mating interface 104, and the mounting ends being arranged in rows 212 at the mounting interface 106.

[0065] Row 210 may have a row-to-row spacing p1. The row-to-row spacing p1 may be compatible with mating connectors (e.g., right-angle connector 102). Row 212 may be parallel to row 210 and have a row-to-row spacing p2. The row-to-row spacing p2 may be configured to have an appropriate occupancy area on a circuit board (e.g., printed circuit board 1000). In some embodiments, the row-to-row spacing p2 may have the same value as the row-to-row spacing p1. In some embodiments, the row-to-row spacing p2 may have a different value than the row-to-row spacing p1. The inventors have found that this design allows the connector to mate with existing connectors that can have a larger spacing and allows the connector to have an ideal occupancy area with a density that can be higher than that of existing connectors, such that the row spacing p2 can be smaller than the spacing of existing connectors and can be smaller than the row spacing p1.

[0066] At mating interface 104, the mating terminal row 210 may include signal mating terminals shaped and spaced in pairs to provide pairs of differential signal mating terminals (e.g., 216A and 216B) and / or signal mating terminals shaped and spaced in pairs to form single-ended signal mating terminals (e.g., 216C). The signal mating terminals may be separated by corresponding ground mating terminals 204. It should be understood that the grounding conductor does not need to be connected to earth, but is shaped to carry a reference potential, which may include ground, DC voltage, or other suitable reference potential. The "ground" or "reference" conductor may have a different shape than the signal conductor, which is configured to provide suitable signal transmission characteristics for high-frequency signals.

[0067] Accordingly, at the mounting interface 106, the mounting terminal 212 may include a signal mounting terminal 206 and a grounding mounting terminal 208. For example... Figure 2B As shown, the mounting terminals in adjacent rows 212A and 212B can be offset from each other, so that the ground mounting terminal in row 212A can overlap with the signal mounting terminal in row 212B, and reduce crosstalk between rows.

[0068] The housing 214 may include one or more separately formed portions that engage with each other or are otherwise held together in the connector. In the illustrated example, the housing 214 includes a front housing 600 and a rear housing 800. The front housing 600 may include a mating interface of the connector 200. The core member 300 may be held by the front housing 600 and may form part of the mating interface of the connector.

[0069] The rear housing 800 can engage with the front housing 600 and can partially surround the front housing 600. The rear housing 800 may include a mounting interface for the connector 200. In the illustrated example, the rear housing 800 includes a bottom surface through which the mounting end of the conductor within the connector 200 extends. The bottom surface may be insulating and may serve as an organizer for the mounting end to position and / or support the mounting end, such that the mounting end can be pressed into a hole in a PCB on which the connector 200 is mounted. Alternatively or additionally, the base plate of the rear housing 800 may serve as a support member for attaching the compressible shield 900.

[0070] like Figure 2C As shown, in some embodiments, the core member 300 can be inserted into the front housing 600 along the mating direction. The lead frame assembly 400 can be inserted into the front housing 600 from the back side. The rear housing 800 can be inserted from the bottom of the front housing 600, such that the mounting end of the lead frame assembly 400 extends out from the rear housing 800.

[0071] The core member 300 may be adjacent to the mating ends of one or more lead frame assemblies 400. In the illustrated embodiment, the mating ends of the two lead frame assemblies are located on opposite sides of each core member. Figure 3A and Figure 3B A top plan view and a side view of the core component 300 according to some embodiments are depicted. Figure 3C The core member 300 according to some embodiments is depicted along... Figure 3A A cross-sectional view of the line marked "XX". Figure 3D A conductive material 302 is depicted within a core component having a lossy material and an insulating material, which may be molded onto the conductive material 302, but are not shown. Figure 3D The conductive material 302 is shown attached to the carrier strip 350 via a bonding strip 352, which can be formed simultaneously with cutting the conductive material 302 from a larger metal sheet. The carrier strip 350 can be used to manipulate the conductive material 302 during injection molding operations. After the bonding strip 352 is cut and before the core member 300 is inserted into the front housing 600, the core member 300 can be released from the carrier strip 350.

[0072] The core component 300 may include a molded conductive material 302 selectively overlaid with a dissipative material 304 and an insulating material 306. The conductive material 302 may be a metal or any other conductive material and provides suitable mechanical properties for the shielding in the electrical connector. Stainless steel, or phosphor bronze, beryllium copper, and other copper alloys are non-limiting examples of materials that can be used. The conductive material may be a sheet of metal, stamped and formed into the shape illustrated. In some embodiments, the conductive material may have a flat region extending through the interior of the core component. For example, the flat region may be along the centerline of the core component such that it is equidistant from mating ends on opposite sides of the core component. For example, the flat region may be solid and may contain one or more holes and / or slits to allow dissipative or insulating materials to flow through and lock onto the conductive material during injection molding operations. Features may be formed in the conductive material to support other functions. For example, features may be formed around the conductive material to mechanically and / or electrically connect the core component to other structures in the connector, such as the front shell, the housing of the lead frame assembly, and / or the shield of the lead frame assembly.

[0073] The conductive material 302 may include a retaining feature 308 configured to be inserted into a mating receiver in the front housing 600. Here, the retaining feature is configured to be inserted into a slot in a cross piece (e.g., the cross piece 650 of the front housing 600). Figure 6 The barbed protrusion in slot 652) of the front housing. The barbed part 314 may also be formed to engage with the side wall of the front housing.

[0074] The conductive material 302 may include protrusions for contacting other grounding structures within the connector 200. Here, those protrusions are configured as hooks 310, the distal ends of which serve as contact portions 316. The contact portions 316 are positioned to press against the lead frame shield when the core member and lead frame are inserted into the front housing 600. In this example, the hooks 310 are fitted into the opening 604 of the transverse member 650. Figure 6 The contact portion 316 will press against the lead frame shield of one of the lead frame assemblies 402A, 404A, 406A and 408A, with its mating end aligned with the underside of the core component.

[0075] In the illustrated example, the conductive material 302 of the core member 300 includes a retaining feature 308 located in the middle and two hooks 310 located on opposite sides of the retaining feature. In this example, the contact portions 316 of the two hooks 310 are in the same direction to contact the same lead frame shield. However, in other embodiments, the contact portions 316 of the two hooks 310 may be bent in opposite directions, such that one contact portion 316 may contact the grounding structure of the first lead frame assembly 400 at a first side 318A of the core member 300, while the other contact portion 316 may contact the grounding structure of the second lead frame assembly 400 at a second side 318B of the core member 300.

[0076] The dissipative material 304 may be selectively molded onto the conductive material. The dissipative material 304 may form ribs 320, which may be configured to contact a grounding mating terminal, which here extends from the IMLA shield (e.g., grounding mating terminal 208). Figure 3E Conductive material 302 is shown, such as Figure 3D In this process, it is molded using the consumable material 304.

[0077] Any suitable lossy material can be used for lossy material 304 and other “lossy” structures. Materials that are conductive but have some loss, or materials that absorb electromagnetic energy in the relevant frequency range through another physical mechanism, are generally referred to herein as “lossy” materials. Electrically lossy materials can be formed from lossy dielectric and / or poorly conductive and / or lossy magnetic materials. Magnetically lossy materials can be formed from materials, for example, those conventionally considered ferromagnetic materials (e.g., those with a magnetic loss tangent greater than about 0.05 in the relevant frequency range). The “magnetic loss tangent” is the ratio of the imaginary to the real part of the material’s complex permittivity. Practical lossy magnetic materials or mixtures containing lossy magnetic materials can also exhibit a useful amount of dielectric or conductive loss effect in certain portions of the relevant frequency range. Electrically lossy materials can be formed from materials conventionally considered dielectric materials (e.g., those with an electrical loss tangent greater than about 0.05 in the relevant frequency range). The “electrical loss tangent” is the ratio of the imaginary to the real part of the material’s complex permittivity. Electrically dissipative materials can also be formed from materials that are generally considered conductors but are relatively poor conductors in the relevant frequency range, containing conductive particles or regions that are sufficiently dispersed so that they do not provide high conductivity or are otherwise prepared to result in relatively weak bulk conductivity compared to good conductors such as copper in the relevant frequency range.

[0078] Electrically dissipative materials typically have a bulk conductivity of about 1 siemens / meter to about 10,000 siemens / meter, preferably about 1 siemens / meter to about 5,000 siemens / meter. In some embodiments, materials with a bulk conductivity of about 10 siemens / meter to about 200 siemens / meter can be used. As a specific example, a material with a conductivity of about 50 siemens / meter can be used. However, it should be understood that the conductivity of the material can be selected empirically or determined by performing electrical simulations using known simulation tools to provide appropriately low crosstalk and appropriately low signal path attenuation or insertion loss.

[0079] Electrically dissipative materials can be partially conductive materials, such as those with a surface resistivity between 1 ohm / sq. and 100,000 ohm / sq. In some embodiments, the surface resistivity of the electrically dissipative material is between 10 ohm / sq. and 1,000 ohm / sq. As a specific example, the surface resistivity of the material can be between 20 ohm / sq. and 80 ohm / sq.

[0080] In some embodiments, a dissipative material is formed by adding a filler containing conductive particles to a binder. In this embodiment, the dissipative component can be formed by molding or otherwise shaping the binder with filler into the desired form. Examples of conductive particles that can be used as fillers to form the dissipative material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Metals in the form of powders, flakes, fibers, or other particles can also be used to provide suitable dissipative properties. Alternatively, combinations of fillers can be used. For example, metal-plated carbon particles can be used. Silver and nickel are suitable for metal plating fibers. The coated particles can be used alone or in combination with other fillers, such as carbon flakes. The binder or matrix can be any material that will solidify, cure, or can otherwise be used to position the filler material. In some embodiments, the binder can be a thermoplastic material conventionally used in the manufacture of electrical connectors to facilitate molding the dissipative material into the desired shape and into the desired location as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymers (LCPs) and nylon. However, alternative forms of binder materials can also be used. Curable materials (such as epoxy resins) can be used as binders. Alternatively, materials such as thermosetting resins or binders can also be used.

[0081] Furthermore, while the aforementioned binder materials can be used to manufacture electrically dissipative materials by forming a binder around the conductive particle filler, the present invention is not so limited. For example, the conductive particles can be impregnated into a shaped matrix material, or can be coated onto the shaped matrix material, for example, by applying a conductive coating to a plastic or metal part. As used herein, the term "binder" encompasses materials that encapsulate the filler, are impregnated with the filler, or otherwise serve as a matrix for retaining the filler.

[0082] Preferably, the filler will be present in a sufficient volume percentage to allow for the creation of conductive paths from particle to particle. For example, when using metal fibers, the fibers may be present in a volume percentage of approximately 3% to 40%. The amount of filler can affect the electrical conductivity of the material.

[0083] Filler materials can be purchased from the market, for example, by Celanese under the trade name... The materials sold may be filled with carbon fiber or stainless steel wire. Consumable materials may also be used, such as adhesive preforms filled with conductive conductive carbon, for example, those sold by Techfilm, Inc. of Billerica, Massachusetts, USA. Such preforms may include an epoxy resin binder filled with carbon fiber and / or other carbon particles. The binder surrounds the carbon particles, which act as reinforcements for the preform. Such preforms may be inserted into connector wafers to form all or part of a housing. In some embodiments, the preform may be adhered to the preform by a binder that may be cured during heat treatment. In some embodiments, the binder may be in the form of a separate conductive or non-conductive binder layer. In some embodiments, the binder in the preform may optionally or additionally be used to secure one or more conductive elements (e.g., foil strips) to the conductive material.

[0084] Various forms of reinforcing fibers (woven or non-woven, coated or uncoated) can be used. Nonwoven carbon fiber is a suitable material. Other suitable materials (such as custom-blended materials sold by RTP) can also be used, as this application does not limit them in this respect.

[0085] In some embodiments, the consumable portion can be manufactured by stamping a preform or sheet of consumable material. For example, the consumable portion can be formed by stamping an appropriate opening pattern onto a preform as described above. However, other materials can be used instead of such a preform or in addition to such a preform. For example, a sheet of ferromagnetic material can be used.

[0086] However, the dissipative portion can also be formed in other ways. In some embodiments, the dissipative portion can be formed by interlacing layers of a dissipative and conductive material (e.g., metal foil). These layers can be rigidly attached to each other, for example, using epoxy resin or other binders, or held together in any other suitable manner. These layers can have a desired shape before being fixed together, or can be stamped or otherwise shaped after they are held together. As another alternative, the dissipative portion can be formed by coating a plastic or other insulating material with a dissipative coating (e.g., a diffuse reflective metallic coating).

[0087] The insulating material 306 can be molded in a secondary injection after overmolding the dissipative material 304, such that some areas of the dissipative material are covered by the insulating material, and the insulating material 306 provides isolation in selected areas. For example, the insulating material can be molded in areas adjacent to the mating terminals of each core component of the signal conductive element. For example, those areas made of insulating material can include ribs 320 that separate the mating terminals of the signal conductive element from adjacent signal mating terminals and ground mating terminals. For example, ribs 320 can provide isolation between adjacent signal mating terminals held in the space 322 between the ribs 320. Other areas can separate the signal mating terminals from the conductive material and / or the dissipative material.

[0088] The insulating material 306 may also include features that provide mechanical functionality. For example, the insulating material 306 may include a dovetail tenon 312, which can be configured to be inserted into a mating feature (e.g., a recess 670 in the front housing 600). Figure 6 In order to align and maintain.

[0089] The insulating material 306 can be a dielectric material, such as plastic or nylon. Examples of suitable materials include, but are not limited to, liquid crystal polymer (LCP), polyphenylene sulfide (PPS), high-temperature nylon or polyphenylene oxide (PPO) or polypropylene (PP). Other suitable materials may be used, as various aspects of this disclosure are not limited in this respect.

[0090] The mating ends of the two lead frame assemblies (e.g., lead frame assemblies 400 and 450) can be positioned on opposite sides of the core member 300 (e.g., sides 318A and 318B). Figure 2CAs shown, lead frame assemblies can be formed in pairs, each including a lead frame with mating ends aligned with the lower surface of the core member and a lead frame with mating ends aligned with the upper surface of the core member. For example, the core member 300 may have a first lead frame assembly 472A on side 318A and a second lead frame assembly 472B on side 318B. In this example, there are eight rows of mating ends in the mating interface, corresponding to four pairs of lead frames: lead frames 472A and 472B, 474A and 474B, 476A and 476B, and 478A and 478B. In this example, the lead frames have right-angle bends and are nested such that each successive lead frame is larger than the previous one.

[0091] Each pair of lead frames includes an inner lead frame 472A, 474A, 476A, or 478A, wherein the mating end has a downward-facing contact surface adjacent to the lower surface of the corresponding core member 300. Each pair of lead frames includes an outer lead frame 472B, 474B, 476B, or 478B, wherein the mating end has an upward-facing contact surface adjacent to the upper surface of the corresponding core member 300. Similar construction techniques can be applied in other ways to manufacture lead frames.

[0092] Figure 4A A perspective view of a representative leadframe assembly 400 according to some embodiments is depicted. Figure 4B A perspective view of a lead frame assembly 400 according to some embodiments is depicted, wherein the grounding shield 412 is removed. Figure 4C This is a perspective view of a lead frame assembly 450 according to some embodiments. Figure 4A The lead frame assembly has a downward-facing contact surface. Figure 4C The lead frame assembly 450 has an upward-facing contact surface. Each lead frame assembly 472A, 474A, 476A, and 478A can be like... Figure 4A and Figure 4B They are configured with the same mating and mounting interface as in the previous models. The lead frame assemblies 472A, 474A, 476A, and 478A may differ in the length of the horizontal and vertical sections in the middle section. Each section has a continuous, relatively long horizontal and vertical portion, allowing the lead frame assembly to be configured as follows: Figure 2C The nesting is shown. Similarly, each leadframe assembly 472B, 474B, 476B, and 478B can be nested as shown. Figure 4C They all share the same configuration and installation interface. The lead frame assemblies 472B, 474B, 476B, and 478B can differ in the length of the horizontal and vertical sections in the middle section, allowing each middle section to have successively longer horizontal and vertical sections, enabling the lead frame assemblies to be nested. To support... Figure 2CAs shown in the nesting, the horizontal and vertical segments of the middle portion of each of the upper lead frame assemblies 472B, 474B, 476B, and 478B may be longer than the horizontal and vertical segments of the middle portion of the corresponding inner lead frame assemblies 472A, 474A, 476A, or 478A aligned with the same core member 300.

[0093] The leadframe assembly 400 may include a conductive element 402, a leadframe housing 464 holding the conductive element 402, and a grounding shield 412 spaced apart from the intermediate portion of the conductive element 402 by the leadframe housing 464. The conductive element 402 may be made of metal or any other material that is conductive and provides suitable mechanical properties to the conductive element in the electrical connector. Phosphor bronze, beryllium copper, and other copper alloys are non-limiting examples of materials that can be used. The conductive element may be formed from such material in any suitable manner, including by stamping and / or forming.

[0094] Conductive element 402 can be configured to transmit signals. Each conductive element 402 may include a mating end 402A, a mounting end 402B opposite to the mating end, and an intermediate portion extending between the mating end 402A and the mounting end 402B. The mating ends 402A of conductive elements 402 can be aligned in row 210. The mounting ends 402B of conductive elements 402 can be aligned in row 212 parallel to row 210. The row containing the mating ends of all leadframe assemblies can be located in the plane of the mating interface. Similarly, the row containing the mounting ends of all leadframe assemblies can be located in the plane of the mounting interface. The plane of the mating interface can be perpendicular to the plane of the mounting interface.

[0095] The middle portion of each conductive element 402 may include a transition portion 402C, which is bent at a substantially right angle, such that the mating end 402A and the mounting end 402B extend in directions substantially perpendicular to each other. Each conductive element 402 may have a wide side 416 and an edge 418. The wide side of the mating end 402A and the wide side of the mounting end 402B may extend in planes substantially perpendicular to each other.

[0096] The conductive element 402 can be held within the lead frame housing 464. In this example, the lead frame housing is overmolded onto the middle portion so that it can be secured to the middle portion.

[0097] Here, the lead frame housing has two parts 464A and 464B. The first part 464A holds the middle portion of the signal conductor in a first horizontal section, which is vertically aligned with the mating end of the conductive element. The second part 464B holds the middle portion in a second vertical section of the middle portion, which is horizontally aligned with the mounting end of the conductive element. In some embodiments, the conductive element of the lead frame assembly may be stamped from a sheet of metal, such that the conductive element initially typically extends in a plane. While in this state, the two parts of the housing may be molded onto the middle portion. The middle portion may then be bent to form... Figure 4A and Figure 4B The right-angled configuration shown.

[0098] The housing 464B may include an opening 410, which is sized and positioned to expose a transition portion 402C of the conductive element 402. One or more transition portions 402C of the conductive element 402 may be exposed through a single opening 410. The opening 410 may have a width d greater than the combined width ds of the transition portion exposed by the individual openings 410, thereby leaving a gap 420.

[0099] The lead frame grounding shield 412 can be stamped from a metal sheet and may have a right-angle bend. The grounding shield 412 can be attached to housing portions 464A and 464B. For example, the grounding shield 412 can be aligned and attached to the lead frame housing 464B via feature 406. The grounding shield 412 can be attached to the housing portion 464B via hub 430 and member 408.

[0100] The grounding shield 412 may include a body 412C, a grounding mating terminal 412A extending from the body 412C, and a grounding mounting terminal 412B also extending from the body 412C. The body 412C may include a transition portion 412D bent at a right angle, a first portion 424A extending from the transition portion 412D, and a second portion 424B also extending from the transition portion 412D. The first portion 424A and the second portion 424B of the body 412C may extend in planes that are substantially perpendicular to each other.

[0101] The grounding terminal 412A may extend from the first portion 424A of the body 412C. For example, as Figure 4C As shown, the grounding mating terminal 412A can be jogged away from the first portion 424A of the body 412C, allowing the grounding mating terminal 412A to be aligned with the mating terminal 402A of the conductive element 402 in the row 210. This reduces crosstalk between adjacent conductive elements 402. For example, the grounding mating terminal can be spaced apart from each of multiple pairs of signal conductors in the row.

[0102] The inventors have recognized and understood that in conventional connectors, the ground mounting end is jogged to align with the signal mounting end. This jogging lengthens the ground return path between the connector's internal shield and the ground structure in the PCB, thereby increasing the inductance associated with the ground return path. Higher inductance in the ground return path can cause or exacerbate resonance on the ground structure.

[0103] Grounding mounting end 412B can extend from the second portion 424B of the body 412C without bending to align with the mounting end 402B of the conductive element 402. Grounding mounting end 412B can be configured as a row 422 parallel to and offset relative to the row 212 in which the mounting ends 402B of the conductive element 402 are aligned. The inventors have found that this configuration enhances signal integrity associated with bent configurations, believed to be due to the reduced length of the ground return path between the ground shield 412 and the grounding structure in the PCB.

[0104] The grounding shield 412 may include an opening 414, which may be sized and positioned such that a member 408 of the lead frame housing 464 can extend from the opening 414. In the illustrated embodiment, the member 408 is positioned between pairs of signal conductors in a row. As a result, the opening 414 in the shield 412 is between pairs. Therefore, although forming an opening in the shield is generally undesirable, positioning the member 408 in this way does not result in a significant reduction in signal integrity due to the opening 414.

[0105] Figure 4C The lead frame assembly 450 can be formed using a technique similar to that described above for the lead frame assembly 400, except that the contact surfaces 454 of the mating ends of the signal conductive elements and the mating ends 456 of the lead frame shield face upwards.

[0106] One or more features may be used to interconnect the grounding structures of the interconnection system. The contact portion 316 of the hook 310 (which is in turn connected to the conductive material 302 that serves as a shield within the core component) may, for example, contact the grounding shield 412 of the first lead frame assembly 400 at the surface 426A of the grounding shield 412.

[0107] The grounding path between the lead frames on opposite sides of each core component can be formed by the conductive material 302 and / or the dissipative material 304 of the core component 300. For example, the dissipative rib 304 can be connected to the mating end of the lead frame shield. This design enables the connector 200 to operate at high frequencies, even when there is an opening 410 in the lead frame housing 464.

[0108] The inventors have recognized and understood that bending regions in a connector (e.g., transition portions 402C of conductive element 402, transition portions 412D of grounding shield 412) can be deformed by forces generated, for example, when the connector is pressed onto a circuit board. The inventors have recognized and understood connector structures that allow the generated forces to bypass the bending regions.

[0109] In some embodiments, the leadframe housing may include features to maintain the spacing of the leadframe shield relative to the signal conductive element, even under pressure on the signal conductive element and / or shield when the tails of the respective signal conductive element and / or shield are inserted into holes in the printed circuit board. The leadframe housing 464B may include member 408. In the illustrated embodiment, the upper surface of member 408 extends above the upper horizontal surface such that when the leadframe assembly 400 is inserted into the connector housing, the upper surface of member 408 abuts against the connector housing, such that a downward force on the connector housing is converted into a downward force on member 408. As member 408 is coupled to the leadframe housing 464B, thereby holding the conductive element, this force is transferred to the conductive element.

[0110] The housing 464B may also include features that transfer a portion of the downward force on member 408 to the lead frame assembly shield. In this example, member 408 has a downward ledge, thereby forming shoulder 510. Figure 5B The shoulder engages the upper surface of the leadframe assembly shield. The housing 464B also includes hubs 430 that pass through openings in the leadframe assembly shield. The hubs 430 also have downward-facing projections that similarly engage the leadframe assembly shield at the edges of the openings. This configuration transfers force to the shield and conductive elements during connector mounting to the PCB, preventing forces that might otherwise arise during connector mounting from separating the conductive elements from the leadframe assembly shield.

[0111] The connector structure may include component 408 of the lead frame housing 464 and Figure 5A and Figure 5B Additional features are shown to reduce displacement of the signal and ground structures under forces that may occur during the installation of the connector. Figure 5A This is a front view of a right-angle orthogonal connector 200 that has been partially cut out according to some embodiments. Figure 5B The right-angle orthogonal connector 200 according to some embodiments is in Figure 5A A magnified view of the portion within the circle marked "A".

[0112] The horizontal portion 516A of the leadframe assembly 400 can be held in a slot 518 between separators 502 and 506 of the front housing 600. The vertical portion 516B of the leadframe assembly 400 can be held in a slot 520 between separators 512 and 514 of the rear housing 800. The spacing between the multiple portions of the leadframe assembly in slots 518 and 520 can be controlled by the spacing of these slots. In these areas, the spacing between signal conductive elements and their corresponding leadframe shields can be controlled by the thickness of the leadframe housing. Other features may be included to control the spacing between signal conductive elements and their corresponding leadframe shields at the transition between these two sections of the leadframe assembly.

[0113] Member 408 of the lead frame housing 464B may extend from the opening 414 of the ground shield 412 and contact the separator 502 of the front housing 600. Member 408 may include a shoulder 510 extending beyond the second portion 424B of the ground shield 412. Multiple portions of the second portion 424B of the ground shield 412 may be blocked by the shoulder 510 of member 408, preventing movement relative to the signal conductive element, which is also held in place by the lead frame housing portion 464B. Thus, the impedance of the signal conductive element is maintained with high uniformity throughout the middle portion of the signal conductor, even in the transition region between the vertical and horizontal portions. In some embodiments, for example, the impedance may vary by less than 1% or less than 0.5%. For example, the impedance variation of a pair of differential signal conductors may be, for example, less than 1 ohm or less than 0.5 ohms.

[0114] Alternatively or additionally, other features may be included to transfer downward forces on the connector housing to multiple portions of the leadframe housing where the fixed signal conductive elements and leadframe shield are located. For example, the leadframe housing 464B may include a protrusion 504 extending perpendicular to member 408. The protrusion 504 may press against the lower surface of the spacer 506 of the front housing 600. The spacer 512 of the rear housing 800 may include a recess 508 that is sized and positioned to receive the protrusion 504. In this way, the leadframe housing of a leadframe assembly can contact the front housing 600 of the connector at multiple locations. Here, contact is made with the spacers in the front housings that position two adjacent leadframe assemblies. Therefore, the relative positioning of the components of the leadframe assembly can be reliably maintained despite forces applied to the connector during use.

[0115] Figure 5A A connector structure is shown that allows the generated force to bypass bending regions in every other leadframe assembly 400. Some or all of the leadframe assemblies 400 in the connector may have this structure. For example, Figure 5AA cross-section of a portion of a row aligned with members 408 of every other lead frame assembly is shown. For example, this portion may correspond to lead frame assembly 450. Figure 4C Component 408. For example, it can be found from... Figure 4A and Figure 4C As can be seen in the comparison, the position of component 408 can be offset within a row, thereby reflecting the offset of the signal conductor's position between the lead frame assembly with the upward-facing contact surface and the lead frame assembly with the downward-facing contact surface. In this embodiment, with Figure 5A and Figure 5B Other cross sections parallel to the cross section shown can reveal structures that allow the generated forces to bypass the bending areas of the conductors in the lead frame assembly with the contact surface facing downwards.

[0116] In some embodiments, the leadframe assembly in the connector may have Type-A and Type-B (Type-B) configurations corresponding to, for example, leadframe assemblies 472A, 474A, 476A, or 478A and leadframe assemblies 472B, 474B, 476B, or 478B. The ground mating terminal of the Type-A leadframe assembly may be configured to face the signal mating terminal of the Type-B leadframe assembly to reduce crosstalk between rows and lower the assembly error rate. Member 408 may be aligned with the ground mating terminal in a direction perpendicular to row 210. Member 408 of the Type-A leadframe and corresponding structures (e.g., protrusions 504 and recesses 508) may be offset relative to the Type-B leadframe assembly in the row direction. This configuration causes applied forces to bypass bending areas at the offset location and enhances the structural stability of the connector.

[0117] Figure 6 A perspective view of the front housing 600 of a right-angle orthogonal connector 200 according to some embodiments is depicted. The front housing 600 may include a cavity 608 surrounded by a frame 610. The frame 610 may define a mating area of ​​the connector 200 and may receive a second connector (e.g., connector 102). Figure 1 )) of the cooperation area.

[0118] The rear portion of the front housing 600 may be divided into slots (e.g., slot 518) by partitions (e.g., partitions 502 and 506). The partitions may extend rearward from the frame 610. When the assembly is inserted from the rear side of the front housing 600 opposite to the mating interface 104, the slots may align with the horizontal portion of the lead frame assembly 400. The front ends of partitions 502 and 506 may be exposed in the chamber 608 and may be shaped to engage with the core member 300.

[0119] In the illustrated embodiment, pairs of leadframe assemblies (e.g., 472A and 472B, or 474A and 474B, or 476A and 476B, or 478A and 478B) have engagement portions aligned with the same core member 300. Thus, every other separator corresponds to one core member. For example, the leading edge of every other separator (e.g., separator 502) may be formed with a transverse member 650 feature for engagement with the core member.

[0120] The front housing 600 may include a component 602 configured with recesses 670 for receiving dovetail tenons 312 of the core member 300. A barb 314 may engage with the front housing within the recesses 670, thereby confining the core member to prevent it from separating from the front housing 600 after insertion. When the core member is inserted from the front of the front housing 600, component 602 may align the core member with a corresponding separator (e.g., separator 502). The separator 502 aligned with the corresponding core member 300 may include a retaining feature 308 for receiving the core member 300. Furthermore, an opening 604 may be configured to receive a hook 310 such that a contact portion 316 of the hook 310 can contact the surface of a lead frame shield adjacent to the opening 604.

[0121] Adjacent separators can be spaced apart by a distance s1 in a direction perpendicular to the mating direction. This distance s1 can be configured to correspond to the row-to-row spacing p1. Figure 2A Adjacent separators can be offset from each other by a distance s2 in the mating direction. This distance s2 can be configured to correspond to the row-to-row spacing p2. Figure 2B ).

[0122] Figure 7A A perspective view depicting a portion of a right-angle orthogonal connector 200 according to some embodiments is shown, illustrating a rear housing 800 and a compressible shield 900. In the illustrated embodiment, like the front housing 600, the rear housing 800 includes spacers. However, when the first and second housings are engaged, the spacers of the rear housing are perpendicular to the spacers of the front housing. Slots between the spacers of the rear housing similarly position multiple portions of the leadframe assembly. In this example, the spacers of the rear housing facilitate positioning the vertical portions of the leadframe assembly.

[0123] Figure 7B The mounting interface 106 of the right-angle orthogonal connector 200 according to some embodiments is in Figure 2B An enlarged view of a portion within the circle marked "7B". Figure 8A This is a perspective view of a rear cover 800 according to some embodiments, showing a receiving end for a lead frame assembly. Figure 8B This is a perspective view of the rear cover 800 according to some embodiments, showing the mounting end.

[0124] The rear housing 800 may include a body portion 802 and an organizer 804 located at a mounting surface of the rear housing. The body and organizer may be integrally formed, for example, by forming the entire rear housing in a molding operation. The body portion 802 of the rear housing 800 may include an open end 812 configured to be closed by the front housing 600 when the front and rear housings are engaged. The body portion 802 of the rear housing 800 may include slots (e.g., slot 520) divided by spacers (e.g., spacers 512 and 514). The spacers may include recesses 508 that are sized and positioned to form spaces with corresponding spacers of the front housing 600.

[0125] Adjacent separators can be offset relative to each other by a distance m1 in a direction perpendicular to the mating direction. This distance m1 can be configured to correspond to the row-to-row spacing p1. Figure 2A Adjacent separators can be spaced apart from each other by a distance m2 in the joining direction. This distance m2 can be configured to correspond to the row-to-row spacing p2. Figure 2B ).

[0126] Organizer 804 can be configured to receive the mounting ends of the lead frame assembly. Organizer 804 may include a support 814 configured to separate adjacent signal mounting ends and prevent accidental contact between adjacent signal mounting ends.

[0127] In some embodiments, the body portion 802 and the organizer 804 are molded separately and assembled together. In some embodiments, the body portion 802 and the organizer 804 are molded as a single component.

[0128] In some embodiments, the lower surface of the organizer 804 may have a recess 806 that is recessed by a distance g relative to the plane defined by the lowermost surface 808 of the body portion 802 of the rear housing 800. In some embodiments, the shape of the compressible shield 900 may be determined to partially mate with the recessed surface 806. For example, 50-75% of the compressible shield 900 may be fitted within the recess 806. In some embodiments, when the connector 200 is not attached to the circuit board, 20-50% or 30-40% of the compressible shield 900 may extend beyond the lowermost surface 808. When the connector 200 is mounted on the printed circuit board, the extended portion of the compressible shield 900 can be compressed to ensure electrical connection with a conductive surface on the printed circuit board.

[0129] Connector 200 may include, or be used with, features that hold connector 200 against the surface of the circuit board when compressible shield 900 is compressed. Press-fit portions of the signal conductive elements and lead frame shield may provide some retaining force. In other embodiments, the retaining force may be provided or reinforced by fasteners. In some embodiments, the body portion 802 of the rear housing 800 may include a screw receiver 810, which may be configured to be attached to the circuit board by screws (e.g., threaded screws).

[0130] Figure 9A A top plan view of a compressible shield 900 according to some embodiments is depicted. Figure 9B A side view of a compressible shield 900 according to some embodiments is depicted. The compressible shield 900 may include an opening 902 configured to allow a signal mounting end to pass through it. The compressible shield 900 may include a recess 904 configured to allow a signal mounting end to pass through it at both ends of a column.

[0131] In some embodiments, the compliant shield 900 can be made from a sheet of foam material by selectively cutting a sheet or otherwise removing material from the sheet to form openings 902 and recesses 904. Optionally or additionally, the foam can be molded into the desired shape. In some embodiments, the compliant shield 900 may only include openings 902 and recesses 904 configured to allow a signal mating end to pass through. When the compliant shield 900 is assembled to the connector 900, a ground mating end can penetrate the compliant shield 900, which simplifies the manufacturing process of the compliant shield. Optionally or additionally, slits can also be cut into the compliant shield 900 to allow the ground mating end to pass through it. The ground mating end passing through the compliant shield 900 can be electrically connected to it, while the mounting end of the signal conductive element can be electrically insulated from it.

[0132] In its uncompressed state, the compliant shield may have a first thickness t. In some embodiments, the first thickness t may be greater than the recess distance g. In some embodiments, the first thickness may be about 20 mils, or in other embodiments, between 10 mils and 30 mils. In some embodiments, the first thickness t may be greater than the gap between the mounting end of the connector's internal shield and the mounting surface of the PCB. Because the first thickness of the compliant shield is greater than this gap, the compliant conductive member is compressed by a normal force (the normal force of the PCB plane) when the connector is pressed onto the PCB engaging with the contact tail. As used herein, "compression" means a reduction in the size of the material in one or more directions in response to the applied force. In some embodiments, the compression may be in the range of 3% to 40%, or any value or subrange within that range, such as including between 5% to 30%, 5% to 20%, or 10% to 30%. Compression can result in a change in the height (e.g., the first thickness) of the compliant shield in the normal direction of the surface of the printed circuit board.

[0133] Compression of the compliant shield can accommodate non-flat reference pads on the PCB surface. In some embodiments, compression of the compliant shield can result in lateral forces within the compliant shield, causing it to laterally expand and press against the surfaces of the inner shield and / or the ground contact tail. In this way, gaps between the mounting ends of the connector's inner shield and the mounting surface of the PCB can be avoided.

[0134] In some embodiments, the reduction in the size of the compliant shield may be due to material displacement. In some embodiments, a change in height in one dimension may arise, for example, from a reduction in the volume of the compliant shield when it is made of an open-cell foam material, through which air is expelled when force is applied. The pores (cells) 906 of the foam may be side-open (e.g., openings 908) such that the thickness of the foam can be adjusted relative to the gap between the mounting end of the ground shield and the mounting surface of the PCB when the connector is pressed onto the PCB. In some embodiments, the foam material may be formed with pores 906. It should be understood that although a single pore is shown for illustrative purposes, this application is not intended to be limiting in this respect.

[0135] In some embodiments, the compliant shield can be configured to fill the gap with a force between 0.5 gf / mm² and 15 gf / mm² (e.g., 10 gf / mm², 5 gf / mm², or 1.4 gf / mm²). The force required to fill the gap with a compliant shield made of open-cell foam can be lower than that required to fill the gap with a compliant shield made of rubber, for example, by two to four times. In some embodiments, an open-cell foam compliant shield may require a force of 2 pounds per square inch (psi) to exhibit a size reduction substantially similar to that of a rubber compliant shield, which may require a force of 4 psi. Furthermore, unlike a rubber compliant shield, which can decrease in one dimension (e.g., the normal dimension of the PCB plane) but correspondingly increase in other dimensions (e.g., dimensions parallel to the PCB plane), an open-cell foam compliant shield can vary in one dimension (e.g., the normal dimension of the PCB plane) while substantially maintaining its size in other dimensions (e.g., dimensions parallel to the PCB plane). Therefore, open-cell foam compliant shielding can avoid the risk of unintentionally causing short circuits to the tails of adjacent signals.

[0136] Suitable compliant shielding can have a volume resistivity between 0.001 ohm-cm and 0.020 ohm-cm. The Shore A hardness of this material can be in the range of 35 to 90. This material can be a conductive elastomer, such as a silicone elastomer filled with conductive particles (e.g., particles of silver, gold, copper, nickel, aluminum, nickel-coated graphite, or combinations or alloys thereof). Optionally or additionally, this material can also be a conductive open-cell foam, such as polyurethane foam or polyethylene foam coated with a conductive material (e.g., silver, gold, copper, or nickel) inside and / or outside the pores. Non-conductive fillers (e.g., glass fiber) may also be present.

[0137] Optionally or additionally, the compliant shield may be partially conductive or exhibit resistive loss, thus being considered a dissipative material as described herein. This can be achieved by filling all or more portions of an elastomer, open-cell foam, or other binder with different types or quantities of conductive particles to provide the volume resistivity associated with a material described herein as “dissipative.” In some embodiments, the compliant shield may be punched from a sheet of conductive compliant material having appropriate thickness, electrical, and other mechanical properties. In some embodiments, the compliant shield may have an adhesive backing, allowing it to adhere to a plastic organizer. In some embodiments, the compliant shield may be cast in a mold.

[0138] Figure 10A top plan view is depicted on the surface of a printed circuit board 1000 for a right-angle orthogonal connector 200 according to some embodiments. The occupation area 1001 may include columns formed by occupation area patterns 1002, separated by wiring channels 1004. The occupation area patterns 1002 may be configured to receive a mounting structure of a leadframe assembly 400, including vias for receiving mounting ends of signal conductive elements of the leadframe assembly and mounting ends of leadframe shielding.

[0139] The occupied area pattern 1002 may include a signal via 1006 aligned in column 1016 and a ground via 1008 aligned in column 1018. The ground via 1008 may be connected to a ground plane at an inner layer of the printed circuit board 1000. Column 1018 may be offset relative to column 1016 because the ground via 1008 may be configured to receive a ground mating end 412B extending from the ground shield 412 without bending. Figure 4A ).

[0140] Signal via 1006 can be configured to receive a signal mating terminal (e.g., mating terminal 402B). Signal via 1006 can be surrounded by a corresponding anti-pad 1010 formed in the ground plane of the PCB. Each anti-pad 1010 surrounds the corresponding signal via such that it prevents conductive material of the PCB's ground plane from being placed in electrical communication with the conductive surface of the corresponding signal via. In some embodiments, a pair of differential signal conductive elements can share a single anti-pad.

[0141] Via pattern 1002 may include a shadow via 1012 configured to enhance the electrical connection between the connector’s internal shield and the PCB’s ground structure without receiving a ground contact tail. In some embodiments, the shadow via may be pressed against a compliant shield 900 and / or may be connected to the PCB’s surface ground plane.

[0142] In the example shown, the first portion of the shaded via 2010 is aligned in row 1016. Each row 1016 of the signal via 1006 has two rows of shaded vias 1016 on opposite sides. The second portion of the shaded via 2020 is arranged in row 1012. The shaded vias in the second portion are aligned with the corresponding signal vias in a direction perpendicular to the row 1016.

[0143] It should be understood that although some structures are shown for some signal vias 1006, such as isolation pads 1010, interconnects 1014, and shaded vias 1012, this application is not limited in this respect. For example, each signal via may have a corresponding breakout, such as interconnect 1014.

[0144] Although details of the specific configuration of the conductive elements, housing, and shielding members have been described above, it should be understood that such details are provided for illustrative purposes only, as the concepts disclosed herein can be implemented in other ways. In this regard, the various connector designs described herein can be used in any applicable combination, as the aspects of this disclosure are not limited to the specific combinations shown in the figures.

[0145] Although several embodiments have been described herein, it should be understood that various changes, modifications, and improvements can be readily made by those skilled in the art. Such changes, modifications, and improvements are intended to remain within the spirit and scope of this application. Therefore, the foregoing description and drawings are merely illustrative.

[0146] Various changes can be made to the illustrative structures shown and described herein. As specific examples of possible variations, only the dissipative material within the daughter card connector is described. The dissipative material may optionally or additionally be incorporated into either of the pair of mating connectors. This dissipative material may be attached to a ground conductor or shield, such as the shield in backplane connector 104.

[0147] As another example of a variation, the connector can be configured for a frequency range with a stake, which may depend on the operating parameters of the system using such a connector, but can typically have an upper limit between approximately 15 GHz and 224 GHz (e.g., 25 GHz, 30 GHz, 40 GHz, 56 GHz, 112 GHz, or 224 GHz), although higher or lower frequencies may be of interest in some applications. Some connector designs may have a stake frequency range that only spans a portion of this range, such as 1 GHz to 10 GHz, 5 GHz to 35 GHz, or 56 GHz to 112 GHz.

[0148] The operating frequency range of an interconnect system can be determined based on the frequency range through which the interconnect components can achieve acceptable signal integrity. Signal integrity can be measured according to several criteria, which depend on the application for which the interconnect system is designed. Some of these criteria may relate to signal propagation along a single-ended signal path, a differential signal path, a hollow waveguide, or any other type of signal path. Two examples of such criteria are signal attenuation along the signal path or signal reflection from the signal path.

[0149] Other criteria may relate to the interaction of multiple different signal paths. For example, such a criterion could include near-end crosstalk, which is defined as the portion of a signal injected on one signal path at one end of an interconnect system that is measurable at any other signal path at the same end of the interconnect system. Another such criterion could be far-end crosstalk, which is defined as the portion of a signal injected on one signal path at one end of an interconnect system that is measurable at any other signal path at the other end of the interconnect system.

[0150] As a specific example, requirements may include signal path attenuation not exceeding 3dB power loss, a reflection power ratio not exceeding -20dB, and a single signal path contributing no more than -50dB to signal path crosstalk. Since these characteristics are frequency-dependent, the operating range of the interconnect system is defined as the frequency range that meets the specified standards.

[0151] This document describes electrical connector designs that improve signal integrity for high-frequency signals (e.g., at frequencies in the GHz range, including up to about 25 GHz or up to about 40 GHz, up to about 56 GHz or up to about 60 GHz, up to about 75 GHz or up to about 112 GHz or higher) while maintaining high density, such as a spacing of about 3 mm or less between adjacent mating contacts, including, for example, a center-to-center spacing between adjacent contacts in a column between 1 mm and 2.5 mm or 2 mm and 2.5 mm. The spacing between columns of mating contact portions can be similar, although it is not required that the spacing between all mating contacts in the connector be the same.

[0152] Manufacturing techniques can also vary. For example, some embodiments are described in which the rear housing of connector 200 includes an integrally formed surface at the connector's mounting surface, which can serve as an organizer for mounting ends of a plurality of wafers to be inserted into the housing. In some embodiments, the connector's mounting surface can be fully or partially opened. In these embodiments, a separate organizer can be used.

[0153] As another example, an embodiment is shown in which a connection is formed between the conductive material of the core component and a leadframe shield. In other embodiments, a core shield may be connected to the shield of each leadframe assembly aligned with the core component.

[0154] Using specific connector configurations as examples, connector manufacturing techniques are described. For instance, a right-angle connector suitable for mounting on a printed circuit board in an orthogonal system configuration is illustrated. The techniques described herein for forming the mating and mounting interfaces of the connector are applicable to connectors in other configurations, such as backplane connectors, cable connectors, stacked connectors, mezzanine connectors, I / O connectors, chip sockets, etc.

[0155] In some embodiments, the contact tail is described as a press-fit "pinhole" compliant portion designed to fit within a via on a printed circuit board. However, other configurations, such as surface mount elements, solderable pins, etc., may also be used, as various aspects of this disclosure are not limited to using any particular mechanism to connect the connector to the printed circuit board.

[0156] Furthermore, for simplicity, connector features are described as upward or downward. This orientation does not require reference to gravity or other fixed coordinate systems and can indicate relative position or orientation. In some cases, upward or downward may be relative to the connector's mounting surface, which is configured for mounting on a printed circuit board. Similarly, terms such as horizontal or vertical can define relative orientation and, in some cases, can indicate orientation relative to the connector's mounting surface, which is configured for mounting on a printed circuit board. Likewise, some connector features are described as forward or front, etc. Other connector features are described as backward or rear, etc. These terms are also relative terms and are not fixed to any orientation relative to a fixed coordinate system. In some cases, these terms may relate to the connector's mating surface, where the mating surface is located at the front of the connector.

[0157] Furthermore, a linear array of conductive elements extending parallel to the connector and configured to be mounted on a printed circuit board is called a row of the connector. A column is defined as being orthogonal to the direction of the row. In a mounting interface, a linear array of vias extending perpendicular to the edge of the printed circuit board intended for mounting the connector is called a column, while a linear array parallel to the edge is called a row. However, it should be understood that these terms indicate relative orientation and may refer to linear arrays extending in other directions.

[0158] This disclosure is not limited to the structural details or component arrangements set forth in the foregoing specification and / or drawings. Various embodiments are provided for illustrative purposes only, and the concepts described herein can be implemented or performed in other ways. Furthermore, the phrases and terms used herein are for descriptive purposes and should not be considered limiting. The terms “comprising,” “including,” “having,” “containing,” or “involving,” and variations thereof, as used herein, refer to items covered herein and / or listed as appendices (or their equivalents).

Claims

1. An electrical connector comprising: a plurality of leadframe assemblies, each leadframe assembly comprising a plurality of conductive elements, each conductive element of the plurality of conductive elements comprising a mating end and a mounting end opposite the mating end; a housing holding the plurality of leadframe assemblies, the housing comprising a front housing; and a plurality of core members held by the front housing, the plurality of core members comprising an electrically conductive material, wherein: the mating ends of the conductive elements of a leadframe assembly of the plurality of leadframe assemblies are disposed on opposite sides of a respective core member of the plurality of core members, and selected ones of the mating ends of the conductive elements of the leadframe assembly on the opposite sides of the core member are coupled via the electrically conductive material of the core member.

2. The electrical connector of claim 1, wherein: the electrically conductive material of the core member is configured to provide a ground path between the selected ones of the mating ends of the conductive elements on the opposite sides of the core member.

3. The electrical connector of claim 1, wherein: each leadframe assembly of the plurality of leadframe assemblies comprises a shield, and the electrically conductive material of the core member comprises a feature configured to make contact with the shield of the plurality of leadframe assemblies.

4. The electrical connector of claim 3, wherein: the feature configured to make contact with the shield of the plurality of leadframe assemblies is hook-shaped.

5. The electrical connector of claim 4, wherein: the hook-shaped feature comprises a first portion configured to engage the front housing and a second portion configured to make contact with a respective surface of the shield of the plurality of leadframe assemblies.

6. The electrical connector of claim 1, wherein: the electrically conductive material of the core member comprises a feature configured to engage the front housing.

7. The electrical connector of claim 6, wherein: the feature configured to hold to the front housing is stamped out of the electrically conductive material.

8. The electrical connector of any one of claims 1 to 7, wherein: the plurality of mating ends of the leadframe assembly comprise signal mating ends and ground mating ends, and the core member comprises a lossy material selectively molded over the electrically conductive material such that the ground mating ends of the leadframe assembly are coupled to one another by the lossy material.

9. The electrical connector of claim 1, wherein: the plurality of leadframe assemblies each comprise a leadframe housing holding the plurality of conductive elements and a ground shield attached to a first side of the leadframe housing, the leadframe housing comprises an opening configured to expose a plurality of portions of the ground shield, and for at least one of the plurality of leadframe assemblies, the electrically conductive material of the core member makes contact with the exposed plurality of portions of the ground shield from a second side of the leadframe housing opposite the first side.

10. The electrical connector of claim 9, wherein: the mating end of the conductive element comprises a first portion of a plurality of mating ends of individual leadframe assemblies, and the plurality of mating ends extending from the ground shield comprises a second portion of the plurality of mating ends of individual leadframe assemblies.

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