A communication optical module

Through the combined structure of the lower case, optical communication circuit board, fixed stop and glue filling layer, the problem of incomplete sealing of communication optical modules in liquid cooling environments is solved, and the stable operation of optical modules in liquid environments is achieved and the service life of optical modules is extended.

CN115524807BActive Publication Date: 2025-08-19CHINA TELECOM CORP LTD
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Patent Information

Application Number
CN202211201506.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-09-29
Publication Date
2025-08-19
Estimated Expiration
2042-09-29

AI Technical Summary

Technical Problem

The existing communication optical modules are not completely sealed in liquid-cooled environments, resulting in naked components and affecting service life.

Method used

The combined structure of the lower case, optical communication circuit board, fixed stop, glue filling layer and upper case is adopted. The optical device is sealed through the glue filling layer, and the fixed stop and optical communication circuit board form a pressure contact, and the secondary packaging is used to improve sealing.

Benefits of technology

It effectively avoids the liquid-cooled medium at the connection between optical fiber and optical communication circuit board, and improves the sealing and service life of the module.

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Abstract

The present invention discloses a communication optical module. It includes a lower shell, an optical communication circuit board, a fixed block, a glue potting layer and an upper shell. The optical communication circuit board is installed in the lower shell and includes an optical device, an optical fiber interface and an electrical interface. The electrical interface is extended from the inside to the outside of the lower shell. The optical fiber interface is located on the first side of the lower shell and is arranged outward through the first side. The fixed block is installed on the lower shell and forms a pressure contact with the optical communication circuit board. The optical device is located between the first side and the fixed block. The glue potting layer is arranged on the optical communication circuit board between the first side and the fixed block to form a seal for the optical device. The upper shell is fixed on the lower shell and forms a seal for the fixed block and a portion of the glue potting layer. This prevents the connection between the optical fiber and the optical communication circuit board from entering the liquid cooling medium to affect the propagation of the optical signal, and the other parts of the optical communication circuit board are secondary packaged by the fixed block and the upper shell, thereby improving the sealing of the module.
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Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to a communication optical module. Background Art

[0002] Building Baseband Units (BBUs) are characterized by high power consumption, large numbers, dense installation, and difficulty dissipating heat. Existing communications rooms typically utilize contact liquid cooling technology to dissipate heat from BBUs, effectively reducing PUE (Power Usage Effectiveness). However, this type of cooling requires sealing the optical modules to ensure that optical data communications are not affected.

[0003] In the prior art, two packaging shells are generally used to seal the outer surface of the optical module. However, in a long-term liquid environment, if the packaging shells are not completely sealed, some components may be exposed, thereby affecting the service life of the optical module. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide a communication optical module that overcomes the above problems or at least partially solves the above problems.

[0005] The present invention provides a communication optical module, the module comprising:

[0006] lower shell;

[0007] an optical communication circuit board, the optical communication circuit board being mounted in the lower housing and comprising an optical device, an optical fiber interface for connecting to an optical fiber cable, and an electrical interface for connecting to a communication device, wherein the electrical interface extends from the inside to the outside of the lower housing, and the optical fiber interface is located on a first side portion of the lower housing and extends outward through the first side portion;

[0008] a fixed stopper mounted on the lower housing and forming a pressure contact with the optical communication circuit board to seal a portion of the optical communication circuit board near the electrical interface, wherein the optical device is located between the first side portion and the fixed stopper;

[0009] A glue potting layer, the glue potting layer is provided on the optical communication circuit board between the first side portion and the fixed block to form a seal for the optical device;

[0010] The upper shell is fixed on the lower shell and forms a seal with the fixed stopper and a portion of the glue layer.

[0011] Optionally, the glue potting layer is flush with the top of the lower shell.

[0012] Optionally, the module further includes a support plate, and the support plate includes:

[0013] a plug-in portion, the plug-in portion passing through the optical fiber interface and connected to the first side portion, wherein the plug-in portion is further provided with an installation through hole for the optical fiber cable to pass through;

[0014] The support plate portion is perpendicular to the plug-in portion and extends along the central axis of the mounting through hole.

[0015] Optionally, a binding through hole is further provided on the support plate portion.

[0016] Optionally, a transition portion for structural reinforcement is further provided at the connection between the plug-in portion and the support plate portion, and the plug-in portion, the support plate portion and the transition portion are an integrated structure.

[0017] Optionally, the module further includes a fixing member, which is sleeved at a connection between the first side portion and the plug-in portion to seal the connection between the first side portion and the plug-in portion.

[0018] Optionally, a connection plug is provided on an end surface of the plug-in portion close to the first side portion, a connection baffle is provided on the first side portion, and the connection plug and the connection baffle are snap-fitted.

[0019] Optionally, recesses are provided on the second side and the third side of the lower shell, wherein the second side and the third side are opposite to each other and adjacent to the first side, and the recess is located between the fixing member and the upper shell.

[0020] Optionally, the outer surface of the fixing piece is further provided with a plurality of anti-slip edges.

[0021] Optionally, the cross-section of the anti-slip edge is arrow-shaped.

[0022] Compared with the prior art, the present invention includes a lower shell, an optical communication circuit board, a fixed block, a glue potting layer, and an upper shell, wherein the optical communication circuit board is installed in the lower shell and includes an optical device, a fiber optic interface for connecting an optical fiber cable, and an electrical interface for connecting a communication device. The electrical interface extends from the inside to the outside of the lower shell, and the fiber optic interface is located on the first side of the lower shell and extends outward through the first side. The fixed block is installed on the lower shell and forms a pressure contact with the optical communication circuit board to seal the portion of the optical communication circuit board near the electrical interface. The optical device is located between the first side and the fixed block. The glue potting layer is provided on the optical communication circuit board between the first side and the fixed block to form a seal for the optical device. The upper shell is fixed to the lower shell and forms a seal for the fixed block and a portion of the glue potting layer. Therefore, the optical fiber interface and optical devices are completely wrapped by the glue potting layer, which prevents the connection between the optical fiber and the optical communication circuit board from entering the liquid cooling medium and affecting the propagation of the optical signal. In addition, the other parts of the optical communication circuit board are secondary packaged by the fixed block and the upper shell, thereby improving the sealing of the module and ensuring the service life of the optical module in a liquid environment.

[0023] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be construed as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components.

[0025] In the attached figure:

[0026] Figure 1 This is a schematic diagram of the three-dimensional structure of a communication optical module provided by an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the first structural part of a communication optical module provided by an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the second part of the structure of a communication optical module provided by an embodiment of the present invention;

[0029] Figure 4 This is a structural diagram of a communication optical module in a plugged-in state provided by an embodiment of the present invention;

[0030] Figure numerals: 1. lower shell; 101. first side; 1011. connecting baffle; 102. second side; 103. third side; 104. recess; 2. optical communication circuit board; 201. optical fiber interface; 202. electrical interface; 3. fixed block; 4. glue layer; 5. upper shell; 6. support plate; 601. plug-in portion; 6011. connecting plug; 602. mounting through hole; 603. support plate portion; 604. binding through hole; 605. transition portion; 7. fixing part; 701. anti-slip edge; 8. optical fiber cable. DETAILED DESCRIPTION

[0031] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0032] Reference Figure 1-4 The embodiment of the present invention provides a communication optical module, which includes a lower housing 1, an optical communication circuit board 2, a fixed block 3, a glue layer 4 and an upper housing 5, wherein:

[0033] The optical communication circuit board 2 is installed in the lower housing 1 and includes optical devices, an optical fiber interface 201 for connecting to the optical fiber cable 8, and an electrical interface 202 for connecting to the communication device. In one example, the optical device may include an optical transmitting component and an optical receiving component. The optical communication circuit board 2 is used to perform photoelectric and electro-optical conversion. When the optical communication circuit board 2 converts the electrical signal sent by the communication device into an optical signal, it is transmitted through the optical fiber cable 8; after the optical communication circuit board 2 receives the optical signal, it converts the optical signal into an electrical signal and transmits it to the communication device. That is, the optical fiber interface 201 is signal-connected to the optical communication circuit board 2, and the optical communication circuit board 2 is signal-connected to the electrical interface 202, thereby ensuring signal transmission.

[0034] The electrical interface 202 extends from the inside outward from the lower housing 1. The optical fiber interface 201 is located on the first side portion 101 of the lower housing 1 and extends outward through the first side portion 101. The fixed block 3 is mounted on the lower housing 1. For example, the fixed block 3 can be snap-fitted to the lower housing 1 and form a pressure contact with the optical communication circuit board 2 located within the lower housing 1 to seal the portion of the optical communication circuit board 2 near the electrical interface 202.

[0035] The optical device is located between the first side portion 101 and the fixed block 3. The glue potting layer 4 is provided on the optical communication circuit board 2 between the first side portion 101 and the fixed block 3 to form a seal for the optical device. It can also be understood that the glue potting layer 4 is provided on the upper surface of the optical communication circuit board 2 between the optical fiber interface 201 located in the lower housing 1 and the fixed block 3. For example, the glue used in the glue potting layer 4 can be a thermally conductive glue. In this way, the optical fiber interface 201 and the optical device are completely wrapped by the glue potting layer 4, preventing the connection between the optical fiber and the optical communication circuit board 2 from entering the liquid cooling medium and affecting the propagation of the optical signal. At the same time, the optical communication circuit board 2 can also have good dustproof and heat dissipation properties, allowing it to operate stably in a liquid environment for a long time.

[0036] The upper housing 5 is fixed to the lower housing 1 and forms a seal with the fixed block 3 and a portion of the glue layer 4. The fixed block 3 and the upper housing 5 provide a secondary seal for other parts of the optical communication circuit board 2 that are not convenient for glue potting, thereby improving the sealing of the module and ensuring the service life of the optical module in a liquid environment.

[0037] An optional embodiment of the invention, referring to Figure 1 As shown, the glue layer 4 is flush with the top of the lower shell 1. For example, the glue layer 4 can be automatically glued by a machine. When it is flush with the top of the lower shell 1, the glue layer 4 can have a certain thickness to ensure its sealing performance. At the same time, the uncured glue can also generate a stress extending toward the side of the lower shell 1, thereby improving the structural sealing between the glue layer 4 and the side of the lower shell 1. This optimizes the product performance of the present invention.

[0038] An optional embodiment of the invention, referring to Figure 2 、 Figure 3 and Figure 4 As shown, the module may further include a support plate 6, comprising a plug-in portion 601 and a support plate portion 603. The plug-in portion 601 extends through the optical fiber interface 201 and is connected to the first side portion 101. The plug-in portion 601 also defines a mounting hole 602 for inserting an optical fiber cable. The optical fiber cable 8 passes through the mounting hole 602 and the plug-in portion 601, establishing an optical signal connection with the optical fiber interface 201. The mounting hole 602 guides the optical fiber cable 8, allowing the insertion position of the optical fiber cable 8 to be initially determined through the mounting hole 602.

[0039] The support plate portion 603 and the plug portion 601 are arranged perpendicular to each other and extend along the central axis direction of the mounting through hole 602. The support plate portion 603 can protect the connection end of the optical fiber cable 8. Figure 4As shown, when the optical fiber cable 8 is plugged into the optical fiber interface 201, the support plate 603 is located directly below the connection end of the optical fiber cable 8 and supports the optical fiber cable 8. The extended length of the support plate 603 can be used to support the connection end of the optical fiber cable 8, preventing the connection end from being broken or damaged by gravity or pressure from other components, which may affect the stability of signal transmission.

[0040] In an optional embodiment of the invention, the support plate portion 603 is further provided with a binding hole 604. For example, multiple communication optical modules can be bundled and fixed using a wire or binding tape, thereby facilitating the storage of the modules and improving the quality of on-site pigtail wiring, thereby preventing damage to the optical fiber interface 201 due to excessive pulling of the optical fiber or the optical fiber cable 8 from falling off and being exposed to a liquid environment, thereby affecting optical signal propagation.

[0041] An optional embodiment of the invention, referring to Figure 3 As shown, a transition portion 605 for structural reinforcement is further provided at the connection between the plug-in portion 601 and the support plate portion 603, wherein the transition portion 605 is used to improve the structural strength of the plug-in portion 601 and the support plate portion 603. In order to facilitate processing, the plug-in portion 601, the support plate portion 603 and the transition portion 605 are an integrated structure, for example, plastic is used for integral molding during the processing process.

[0042] An optional embodiment of the invention, referring to Figure 3 and Figure 4 As shown, the module may further include a fixing member 7, which is sleeved on the connection between the first side portion 101 and the plug portion 601 to seal the connection between the first side portion 101 and the plug portion 601. This prevents the liquid cooling medium from flowing into the lower housing 1 from the connection between the first side portion 101 and the plug portion 601, thereby reducing the service life of the connection element.

[0043] An optional embodiment of the invention, referring to Figure 2 As shown, a connecting plug 6011 is provided on the end surface of the plug-in portion 601 near the first side portion 101. A connecting baffle 1011 is provided on the first side portion 101, and the connecting plug 6011 and the connecting baffle 1011 form a snap-fit connection. For example, the connecting plug 6011 has a snap-fit hole that matches the cross-sectional shape of the connecting baffle 1011. When the plug-in portion 601 is inserted from the first side portion 101 into the lower housing 1, the connecting plug 6011 is inserted from top to bottom onto the connecting baffle 1011, thereby forming a snap-fit connection. The optical fiber interface 201 can be located in the center of the plug-in portion 601. The plug-in design and snap-fit fixing method improve the ease of assembly and disassembly of the module, and also enhance the neatness and aesthetics of the module.

[0044] In an optional embodiment of the invention, a recess 104 is provided on the second side 102 and the third side 103 of the lower housing 1. The second side 102 and the third side 103 are opposite each other and adjacent to the first side 101. The recess 104 is located between the fixing member 7 and the upper housing 5. When the module is assembled, the recess 104 is exposed between the fixing member 7 and the upper housing 5. When the electrical interface 202 is connected to the communication device, the recess 104 can be held by hand for insertion, thereby improving the smoothness and stability of the electrical interface 202 during insertion.

[0045] In an optional embodiment of the invention, the outer surface of the fixing member 7 is further provided with several anti-slip ridges 701, wherein the cross-sectional shape of each anti-slip ridge 701 is arrow-shaped. For example, the angles of the anti-slip ridges 701 extending outward from the fixing member 7 near the lower housing 1 gradually increase (this can also be understood as the angles of the arrows gradually increasing). When removing the module, the friction force of the anti-slip ridges 701 gradually increases from the direction near the lower housing 1 outward, thereby providing an excellent anti-slip effect.

[0046] In summary, embodiments of the present invention disclose a communication optical module, which may include a lower housing 1, an optical communication circuit board 2, a fixed block 3, a glue potting layer 4, and an upper housing 5. The optical communication circuit board 2 is mounted within the lower housing 1 and includes an optical device, a fiber optic interface 201 for connecting to an optical fiber cable 8, and an electrical interface 202 for connecting to a communication device. The electrical interface 202 extends from the interior of the lower housing 1 toward the exterior of the lower housing 1. The fiber optic interface 201 is located on the first side 101 of the lower housing 1 and extends outward through the first side 101. The fixed block 3 is mounted on the lower housing 1 and forms a pressure contact with the optical communication circuit board 2, thereby sealing the portion of the optical communication circuit board 2 near the electrical interface 202. The optical device is located between the first side 101 and the fixed block 3. The glue potting layer 4 is disposed on the optical communication circuit board 2 between the first side 101 and the fixed block 3 to seal the optical device. The upper housing 5 is fixed to the lower housing 1 and forms a seal with the fixed block 3 and a portion of the glue potting layer 4. Therefore, the optical fiber interface 201 and the optical device are completely wrapped by the glue potting layer 4, which prevents the connection between the optical fiber and the optical communication circuit board 2 from entering the liquid cooling medium and affecting the propagation of the optical signal. In addition, the other parts of the optical communication circuit board 2 are secondary packaged by the fixed block 3 and the upper shell 5, thereby improving the sealing of the module and ensuring the service life of the optical module in a liquid environment.

[0047] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0048] It is easy for those skilled in the art to think that any combination of the above embodiments is feasible, so any combination of the above embodiments is an implementation scheme of the present invention. However, due to space limitations, this specification will not describe them in detail here.

[0049] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0050] Similarly, it should be understood that in order to streamline the invention and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof.

[0051] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of the present invention and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

Claims

1. A communication optical module, characterized in that: The modules include: Lower housing (1); An optical communication circuit board (2), the optical communication circuit board (2) being installed in the lower housing (1) and comprising an optical device, an optical fiber interface (201) for connecting an optical fiber cable (8), and an electrical interface (202) for connecting a communication device, wherein the electrical interface (202) is arranged to extend from the inside to the outside of the lower housing (1), and the optical fiber interface (201) is located on a first side portion (101) of the lower housing (1) and is arranged to extend outward through the first side portion (101); a fixed stopper (3), the fixed stopper (3) being mounted on the lower housing (1) and forming a pressure contact with the optical communication circuit board (2) to seal a portion of the optical communication circuit board (2) close to the electrical interface (202), wherein the optical device is located between the first side portion (101) and the fixed stopper (3); a glue potting layer (4), the glue potting layer (4) being arranged on the optical communication circuit board (2) between the first side portion (101) and the fixed stopper (3) to form a seal for the optical device; An upper shell (5), the upper shell (5) being fixed to the lower shell (1) and forming a seal with the fixed stopper (3) and a portion of the glue potting layer (4); Wherein, the module further comprises a support plate (6), and the support plate (6) comprises: a plug-in portion (601), the plug-in portion (601) passing through the optical fiber interface (201) and connected to the first side portion (101), wherein the plug-in portion (601) is further provided with an installation through hole (602) for the optical fiber cable to pass through; The support plate portion (603) is perpendicular to the plug-in portion (601) and extends along the central axis of the mounting through hole (602).

2. The communication optical module according to claim 1, wherein: The glue potting layer (4) is flush with the top of the lower shell (1).

3. The communication optical module according to claim 1, wherein: The support plate portion (603) is also provided with a binding through hole (604).

4. The communication optical module according to claim 3, wherein: A transition portion (605) for structural reinforcement is further provided at the connection between the plug-in portion (601) and the support plate portion (603); the plug-in portion (601), the support plate portion (603) and the transition portion (605) are an integrated structure.

5. The communication optical module according to claim 1, wherein: The module further comprises a fixing member (7), wherein the fixing member (7) is sleeved on the connection between the first side portion (101) and the plug-in portion (601) to seal the connection between the first side portion (101) and the plug-in portion (601).

6. The communication optical module according to claim 3, wherein: The end surface of the plug-in portion (601) close to the first side portion (101) is provided with a connection plug (6011), and the first side portion (101) is provided with a connection baffle (1011), and the connection plug (6011) and the connection baffle (1011) form a snap connection.

7. The communication optical module according to claim 5, characterized in that A recess (104) is provided on the second side portion (102) and the third side portion (103) of the lower shell (1), wherein the second side portion (102) and the third side portion (103) are opposite to each other and adjacent to the first side portion (101), and the recess (104) is located between the fixing member (7) and the upper shell (5).

8. The communication optical module according to claim 5, wherein: The outer surface of the fixing member (7) is also provided with a plurality of anti-slip edges (701).

9. The communication optical module according to claim 8, characterized in that: The cross-section of the anti-slip edge (701) is arrow-shaped.

Citation Information

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