Liquid cooling heat dissipation module, optical module assembly and communication equipment

Abstract

The utility model discloses a liquid cooling heat dissipation module, an optical module assembly and communication equipment, and relates to the technical field of optical module communication. The tolerance heat conduction structure is arranged on one side surface of the liquid cooling plate; the floating structure is arranged on the side, away from the liquid cooling plate, of the tolerance heat conduction structure in a floating mode and used for installing a heating element, and the tolerance heat conduction structure has the trend of driving the floating structure to move away from the liquid cooling plate; the heating element abuts against the side face, away from the tolerance heat conduction structure, of the floating structure, so that the floating structure moves towards the liquid cooling plate to be matched with the liquid cooling plate to clamp the tolerance heat conduction structure. According to the technical scheme, the heat dissipation effect of an existing liquid cooling heat dissipation structure is improved.

Description

Technical Field

[0001] This application relates to the field of optical module communication technology, and in particular to a liquid cooling heat dissipation module, an optical module assembly, and a communication device. Background Technology

[0002] With the rapid development of optical communication technology, optical modules are increasingly widely used in data centers, communication equipment, and other fields. During operation, optical modules generate a significant amount of heat due to power loss. If this heat cannot be dissipated in time, the module's temperature will rise, affecting its performance and lifespan. Currently, heat dissipation measures are commonly used to control the temperature of optical modules. Liquid cooling, due to its advantages of high efficiency, energy saving, and quiet operation, is gradually becoming the mainstream heat dissipation method for optical modules. However, the heat dissipation effect of existing liquid cooling structures is not ideal, adversely affecting the normal operation of optical modules. Utility Model Content

[0003] The main purpose of this application is to provide a liquid cooling heat dissipation module, an optical module assembly, and a communication device, which aims to improve the heat dissipation effect of existing liquid cooling heat dissipation structures.

[0004] To achieve the above objectives, this application provides a liquid cooling heat dissipation module, which includes:

[0005] Liquid cooling plate;

[0006] A tolerance-controlled thermal structure is disposed on one side of the liquid cooling plate; and

[0007] The floating structure is mounted on the side of the tolerance heat-conducting structure away from the liquid cooling plate. It is used to install the heating element. The tolerance heat-conducting structure has a tendency to drive the floating structure to move away from the liquid cooling plate. The heating element abuts against the side of the floating structure away from the tolerance heat-conducting structure, so that the floating structure moves toward the liquid cooling plate to cooperate with the liquid cooling plate to clamp the tolerance heat-conducting structure.

[0008] To achieve the above objectives, this application provides an optical module assembly, which includes an optical module and the liquid cooling heat dissipation module described above, wherein the heat-generating element is configured as the optical module.

[0009] To achieve the above objectives, this application provides a communication device, which includes the optical module assembly described above.

[0010] The technical solution of this application, through the setting of a tolerance-based heat-conducting structure and a floating structure, can automatically adjust within a predetermined range, compensating for manufacturing tolerances or assembly errors, ensuring good contact between the optical module and the liquid cooling plate, thereby guaranteeing a good heat conduction path and improving heat dissipation. It is understood that because the tolerance-based heat-conducting structure has a tendency to drive the floating structure away from the liquid cooling plate, when heat-generating components such as the optical module are assembled and come into contact with the floating structure, the tolerance-based heat-conducting structure will be compressed and deformed, thereby achieving good contact between the heat-generating components such as the optical module and the floating structure, and between the floating structure and the liquid cooling plate, improving heat dissipation efficiency. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of an embodiment of the optical module component of this application;

[0013] Figure 2 This is a schematic diagram of another embodiment of the optical module component of this application;

[0014] Figure 3 This is a side view of an embodiment of the optical module component of this application;

[0015] Figure 4 for Figure 3 A schematic diagram of the AA cross-sectional structure;

[0016] Figure 5 This is a side view of the structure of an embodiment of the optical module component of this application from another angle;

[0017] Figure 6 This is a partial structural schematic diagram of an embodiment of the optical module component of this application;

[0018] Figure 7 for Figure 6 A schematic diagram of the exploded structure;

[0019] Figure 8 This is a side view of another embodiment of the optical module component of this application.

[0020] Explanation of icon numbers:

[0021] 100. Liquid cooling heat dissipation module; 110. Liquid cooling plate; 111. First cold plate; 112. Second cold plate; 120. Tolerance-controlled heat conduction structure; 130. Floating structure; 131. Elastic element; 132. Floating platform; 1321. Mounting groove; 133. Assembly parts; 134. Flexible heat conduction layer; 140. Anti-deformation structure; 141. Side panel; 142. Pressure plate; 150. Distributor; 160. First branch pipe; 161. First liquid inlet branch; 162. First liquid outlet branch; 170. Second branch pipe; 171. Second liquid inlet branch; 172. Second liquid outlet branch; 180. Connecting column; 200. Heating element; 300. Squirrel cage; 310. Insertion cavity; 400. Circuit board; 500. Mounting tray; 600. Support structure.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0025] Furthermore, in the embodiments of this application, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the embodiments of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0027] Furthermore, the technical solutions of the various embodiments of this application can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the embodiments of this application.

[0028] During operation, optical modules generate a significant amount of heat due to power loss. If this heat cannot be dissipated in a timely manner, the module's temperature will rise, affecting its performance and lifespan. Currently, heat dissipation measures are commonly used to control the temperature of optical modules, with liquid cooling gradually becoming the mainstream method due to its advantages such as high efficiency, energy saving, and quiet operation.

[0029] However, existing liquid cooling structures have the following problems:

[0030] Poor contact between the optical module and the liquid cooling plate can lead to increased thermal resistance, which in turn affects the heat dissipation effect. In addition, due to manufacturing tolerances and assembly errors, it is difficult to ensure that each optical module can fit tightly with the liquid cooling plate. There are tiny gaps between the optical module and the liquid cooling plate, which hinders heat transfer and results in unsatisfactory heat dissipation.

[0031] In view of this, the present application provides a liquid cooling heat dissipation module, which can automatically adjust within a predetermined range through the set tolerance heat conduction structure and floating structure, which can compensate for manufacturing tolerances or assembly errors, ensure good contact between the optical module and the liquid cooling plate, thereby ensuring a good heat conduction path and improving heat dissipation effect.

[0032] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0033] like Figure 1 , Figure 3 , Figure 4 as well as Figure 6 As shown in the figure, this application embodiment proposes a liquid cooling heat dissipation module, the liquid cooling heat dissipation module 100 includes:

[0034] Liquid cooling plate 110, it can be understood, is fixedly installed;

[0035] A tolerance-based thermally conductive structure 120 is disposed on one side of the liquid cooling plate 110. Optionally, the tolerance-based thermally conductive structure 120 is elastic and compressible to provide tolerance. Specifically, the tolerance-based thermally conductive structure 120 is made of an interface material with high thermal conductivity and high compressibility, such as a graphene thermal pad, with a compressibility of up to 50%, which can better provide tolerance. In one embodiment, the tolerance-based thermally conductive structure 120 can be directly clamped between the liquid cooling plate 110 and the floating structure 130. Alternatively, it can be bonded to the liquid cooling plate 110 using thermally conductive adhesive.

[0036] A floating structure 130 is floatingly disposed on the side of the tolerance heat-conducting structure 120 away from the liquid cooling plate 110, for mounting the heating element 200. The tolerance heat-conducting structure 120 has a tendency to drive the floating structure 130 to move away from the liquid cooling plate 110. That is, the floating structure 130 can still compress the tolerance heat-conducting structure 120 in the initial state. Therefore, the tolerance heat-conducting structure 120 will generate a reaction force on the floating structure 130, but cannot drive the floating structure 130 to move. The heating element 200 abuts against the side of the floating structure 130 away from the tolerance heat-conducting structure 120, causing the floating structure 130 to move towards the liquid cooling plate 110 to cooperate with the liquid cooling plate 110 to clamp the tolerance heat-conducting structure 120. Optionally, the floating structure 130 is made of a metal material with good thermal conductivity. In one embodiment, the floating structure 130 is floatingly connected to the cage 300. When the heating element 200 is inserted into the cage 300, the heating element 200 abuts against the surface of the floating structure 130 away from the tolerance heat-conducting structure 120, lifting the floating structure 130 so that it moves toward the liquid cooling plate 110. Since the tolerance heat-conducting structure 120 has a tendency to drive the floating structure 130 to move away from the liquid cooling plate 110, that is, the floating structure 130 will provide downward pressure on the heating elements 200 such as the optical module, thereby limiting the optical module. The optical module, the floating structure 130, the tolerance heat-conducting structure 120, and the liquid cooling plate 110 are tightly fitted together. Optionally, the floating structure 130 and the cage 300 are separate units. This means the floating structure 130 is assembled onto the cage 300. Compared to an integrated unit, if the floating structure 130 is damaged or needs upgrading, it can be replaced individually without replacing the entire cage 300, making maintenance and replacement more convenient. Furthermore, the separate unit design allows the cage 300 to be adapted to different floating structures 130, increasing the equipment's applicability and flexibility. Additionally, the floating structure 130 can also be assembled onto other fixed components as needed, reducing installation difficulty and adapting to different installation scenarios.

[0037] In this embodiment, the tolerance-controlled heat-conducting structure 120 and the floating structure 130 can automatically adjust within a predetermined range, compensating for manufacturing tolerances or assembly errors. This ensures good contact between the optical module and the liquid cooling plate 110, thereby guaranteeing a good heat conduction path and improving heat dissipation. It is understood that because the tolerance-controlled heat-conducting structure 120 tends to drive the floating structure 130 away from the liquid cooling plate 110, when the optical module or other heat-generating components 200 are assembled and abut against the floating structure 130, the tolerance-controlled heat-conducting structure 120 will be compressed and deformed. This achieves good contact between the optical module / other heat-generating components 200, the floating structure 130, and the liquid cooling plate 110, improving heat dissipation efficiency. When the optical module / other heat-generating components 200 detach from the floating structure 130, the floating structure 130 springs back to its original position. Since the tolerance heat-conducting structure 120 is always in a compressed state, the risk of mechanical stress causing the tolerance heat-conducting structure 120 to detach from the floating structure 130 and the liquid cooling plate 110 can be reduced, thereby improving the reliability of long-term use.

[0038] In the embodiments of this application, reference is made to Figure 5 and Figure 6 The floating structure 130 includes an elastic element 131 and a floating platform 132. One end of the elastic element 131 is fixedly disposed, and the other end of the elastic element 131 is connected to the floating platform 132. The elastic element 131 can deform in the arrangement direction of the liquid cooling plate 110 and the tolerance heat-conducting structure 120. It can be understood that the floating platform 132 is connected to the tolerance heat-conducting structure 120, and the elastic element 131 and the floating platform 132 are floatingly connected. When the optical module is inserted into the cage 300, the optical module abuts against the surface of the floating platform 132 away from the tolerance heat-conducting structure 120, which can lift the floating platform 132, causing the floating platform 132 to move towards the liquid cooling plate 110, thereby further compressing the tolerance heat-conducting structure 120. The fit between the optical module and other heat-generating components 200, the floating structure 130 and the liquid cooling plate 110 is better, which is more conducive to heat dissipation. Optionally, the elastic element 131 is a metal spring. In one embodiment, the floating stage 132 is made of copper alloy, which has a high thermal conductivity. Compared with stainless steel, the temperature gain is about 1.5℃ when the power consumption of the optical module is 30W.

[0039] In the embodiments of this application, reference is made to Figure 6 The surface of the floating platform 132 is provided with a mounting groove 1321, and a portion of the tolerance heat-conducting structure 120 is disposed in the mounting groove 1321 and abuts against the liquid cooling plate 110. Thus, the mounting groove 1321 can limit the position of the tolerance heat-conducting structure 120. Specifically, the thickness of the tolerance heat-conducting structure 120 is greater than the depth of the mounting groove 1321, thereby ensuring that the tolerance heat-conducting structure 120 can be compressed.

[0040] In the embodiments of this application, reference is made to Figure 6 and Figure 7 The floating structure 130 also includes an assembly 133, which is located at one end of the elastic element 131 and is used to detachably mount the elastic element 131 onto the fixed component. It is understood that the heating element 200, such as the optical module, is mounted on the fixed component, which can be a cage 300. Mounting the floating structure 130 onto the cage 300 via the assembly 133 makes assembly and disassembly more convenient and adaptable to different cages 300, resulting in better versatility. In other words, compared to a one-piece setup, the floating structure 130 is easier to maintain and replace, allowing the cage 300 to adapt to different floating structures 130, increasing the applicability and flexibility of the equipment. It can also be assembled onto other fixed components as needed, reducing installation difficulty and adapting to different installation scenarios. Optionally, the assembly 133 is configured as a snap-fit ​​structure, meaning the elastic element 131 is snapped into the cage 300 via a snap-fit ​​structure. Of course, in other embodiments, bolted connections are also possible and are not limited here; and / or, the tolerance thermal conductive structure 120 is an elastic thermal conductive pad. It is understood that the elastic thermal conductive pad is made of an interface material with high thermal conductivity and high compressibility, and can be a graphene thermal conductive pad.

[0041] In the embodiments of this application, reference is made to Figure 5 A flexible thermally conductive layer 134 is provided on the surface of the floating stage 132 facing the heating element 200. Compared with hard contact, it can better fill the space between the optical module and the floating stage 132, effectively reducing thermal resistance and achieving efficient heat dissipation.

[0042] In the embodiments of this application, the flexible thermally conductive layer 134 includes a metal film and a phase change medium encapsulated inside the metal film. It is understood that the edge of the metal film is bonded to the floating platform 132, and a deformable medium fills the space between the metal film and the floating platform 132. Under the rebound force of the tolerance-conducting thermal structure 120, the phase change medium can better fill the space between the floating platform 132 and the optical module (i.e., the heat-generating element 200), achieving efficient heat transfer between the floating platform 132 and the optical module, thereby improving the heat dissipation efficiency of the heat-generating element 200 such as the optical module.

[0043] In the embodiments of this application, reference is made to Figure 2The liquid cooling module 100 also includes an anti-deformation structure 140, which is connected to the liquid cooling plate 110 to limit the thermal deformation of the liquid cooling plate 110. After the heat-generating components 200, such as the optical module, are assembled, they abut against the surface of the floating structure 130. The floating structure 130 further compresses the tolerance heat-conducting structure 120, which exerts a reaction force on the liquid cooling plate 110. This can easily cause some parts of the liquid cooling plate 110 to arch and deform, increasing the risk of gaps appearing between the tolerance heat-conducting structure 120 and the liquid cooling plate 110. Therefore, this embodiment provides an anti-deformation structure 140, which can press against the surface of the liquid cooling plate 110 to prevent the liquid cooling plate 110 from deforming under the reaction force of the tolerance heat-conducting structure 120, improve the fit between the tolerance heat-conducting structure 120 and the liquid cooling plate 110, improve heat transfer efficiency, and thus enhance the heat dissipation effect.

[0044] In the embodiments of this application, reference is made to Figure 2 and Figure 8 The anti-deformation structure 140 includes at least one of a side panel 141 and a pressure plate 142; wherein the side panel 141 is disposed on the side of the liquid cooling plate 110, and the pressure plate 142 is disposed on the surface of the liquid cooling plate 110 opposite to the heating element 200. It is understood that the side panel 141 can be used to connect and fix the side of the liquid cooling plate 110 to prevent deformation. The pressure plate 142 can abut against the surface of the liquid cooling plate 110 opposite to the tolerance heat-conducting structure 120, that is, the tolerance heat-conducting structure 120 and the pressure plate 142 abut against the two opposite surfaces of the liquid cooling plate 110, thereby preventing deformation of the liquid cooling plate 110. Optionally, multiple pressure plates 142 can be provided, with the multiple pressure plates 142 spaced apart, thus providing pressure at multiple different locations. In one embodiment, the side panel 141 and the side of the liquid cooling plate 110 are connected by bolts.

[0045] In the embodiments of this application, reference is made to Figure 3 The liquid cooling plate 110 includes a first cold plate 111 and a second cold plate 112 spaced apart. Heating elements 200 are provided on the side of the first cold plate 111 facing away from the second cold plate 112 and between the first cold plate 111 and the second cold plate 112. A tolerance-based thermal conductive structure 120 and a floating structure 130 are provided between the first cold plate 111 and the corresponding heating element 200, and between the second cold plate 112 and the corresponding heating element 200. It can be understood that the liquid cooling plate 110 is a double-layer heat dissipation structure, thus enabling simultaneous heat dissipation of multiple heating elements 200.

[0046] In the embodiments of this application, reference is made to Figure 2The liquid cooling module 100 also includes a distributor 150 and a first branch pipe 160 and a second branch pipe 170 detachably connected to the distributor 150. The first branch pipe 160 connects the distributor 150 and the first cold plate 111, and the second branch pipe 170 connects the distributor 150 and the second cold plate 112. In this way, the distributor 150 can divide the externally drawn coolant into two parts, providing coolant to the first cold plate 111 and the second cold plate 112 respectively. The coolant in the first cold plate 111 and the second cold plate 112 exchanges heat and then merges back into the distributor 150, finally flowing back to the external liquid cooling system, thus forming a coolant circulation path. Furthermore, it decouples the liquid cooling plate 110 from the external liquid cooling system, facilitating the independent installation and subsequent maintenance of the liquid cooling plate 110.

[0047] In the embodiments of this application, the liquid cooling heat dissipation module 100 further includes a main pipeline, which connects the distributor 150 and an external cold source, so that the coolant from the external cold source can be delivered to the distributor 150.

[0048] And / or, the first branch line 160 is connected to the dispenser 150 via a quick-connect plug, thus enabling quick assembly and disassembly of the first branch line 160 and the dispenser 150.

[0049] And / or, the second branch line 170 is connected to the distributor 150 via a quick-connect fitting, thus enabling quick assembly and disassembly of the second branch line 170 and the distributor 150.

[0050] And / or, refer to Figure 2 The first branch pipe 160 includes a first inlet branch 161 and a first outlet branch 162. It can be understood that the first inlet branch 161 connects the first cold plate 111 and the distributor 150, and the first outlet branch 162 connects the first cold plate 111 and the distributor 150. The coolant flows into the first cold plate 111 from the first inlet branch 161 and then flows out of the first cold plate 111 through the first outlet branch 162, thus realizing the circulation path of the coolant.

[0051] And / or, refer to Figure 2 The second branch pipe 170 includes a second liquid inlet branch 171 and a second liquid outlet branch 172. It can be understood that the second liquid inlet branch 171 connects the second cold plate 112 and the distributor 150, and the second liquid outlet branch 172 connects the second cold plate 112 and the distributor 150. The coolant flows into the second cold plate 112 from the second liquid inlet branch 171 and then flows out of the second cold plate 112 through the second liquid outlet branch 172, thus realizing the circulation path of the coolant.

[0052] And / or, refer to Figure 5The first cold plate 111 and the second cold plate 112 are connected by a connecting post 180. At this time, the tolerance heat conduction structure 120 between the first cold plate 111 and the second cold plate 112 is in a compressed state. Optionally, the connecting post 180 can be integrally set with the second cold plate 112 or it can be set separately. There is no limitation here.

[0053] This application also proposes an optical module component, as shown in the embodiments below. Figure 1 The optical module assembly includes an optical module and the liquid cooling heat dissipation module 100 described above, with the heat-generating element 200 configured as an optical module. Specifically, the specific structure of the liquid cooling heat dissipation module 100 refers to the above embodiments. Since this optical module assembly adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0054] In the embodiments of this application, reference is made to Figure 6 The optical module assembly also includes a cage 300, which has a insertion cavity 310 and an opening communicating with the insertion cavity 310. A floating structure 130 is correspondingly positioned at the opening. It is understood that after the optical module is inserted into the insertion cavity 310, it abuts against the floating structure 130, causing the floating structure 130 to rise and float towards the liquid cooling plate 110. The tolerance-based heat-conducting structure 120 is compressed under the cooperation of the floating structure 130 and the liquid cooling plate 110, improving the tightness of the fit between the components and increasing the heat conduction efficiency, thereby improving the heat dissipation effect. Specifically, the cage 300 has multiple insertion cavities 310. Through the cooperation of the floating structure 130 and the tolerance-based heat-conducting structure 120, multiple optical modules can achieve common substrate heat dissipation, improving the efficiency of heat transfer from the optical modules to the liquid cooling plate 110. In other embodiments, the first cold plate 111 and the second cold plate 112 correspond to multiple cages 300 respectively.

[0055] Optionally, the floating structure 130 and the cage 300 are floatingly connected. It is understood that the floating platform 132 is correspondingly positioned at the opening, and the elastic element 131 connects the cage 300 and the floating platform 132. The elastic element 131 allows the floating platform 132 to move in the direction towards the liquid cooling plate 110. The distance between the surface of the floating platform 132 facing away from the liquid cooling plate 110 and the surface of the protruding rib of the insertion cavity 310 of the cage 300 is less than the height of the optical module. This ensures that after the optical module is inserted into the insertion cavity 310, the floating platform 132 is lifted, further compressing the tolerance heat-conducting structure 120. The rebound force of the tolerance heat-conducting structure 120 achieves good contact between the optical module and the floating platform 132. In one embodiment, the sum of the compression of the tolerance heat-conducting structure 120 caused by the optical module lifting the floating stage 132, the pre-compression of the tolerance heat-conducting structure 120 when the floating stage 132 is in its initial state, and the tolerance range of the optical module is less than or equal to 50% of the thickness of the tolerance heat-conducting structure. Otherwise, after the optical module is inserted, the compression rate of the tolerance heat-conducting structure may exceed 50%, which will affect the performance of the tolerance heat-conducting structure in the long term. In another embodiment, to ensure the performance and strength of the tolerance heat-conducting structure 120, the maximum compression of the tolerance heat-conducting structure 120 is 50%, and the tolerance requirements of the optical module can be met within the compression range of the tolerance heat-conducting structure 120. Therefore, the thickness of the tolerance heat-conducting structure 120 needs to be greater than twice the tolerance value of the optical module.

[0056] In the embodiments of this application, the cage 300 is configured as a U-shaped cage 300. It can be understood that the cage 300 is a double-layer cage 300, wherein the first layer of the U-shaped cage 300 is provided with a first cold plate 111, and the second layer of the U-shaped cage 300 is provided with a second cold plate 112. That is, the first cold plate 111 can simultaneously dissipate heat for the optical modules in all the insertion cavities 310 in the first layer of the cage 300, and the second cold plate 112 can simultaneously dissipate heat for the optical modules in all the insertion cavities 310 in the second layer of the cage 300, achieving efficient heat dissipation for multiple optical modules simultaneously.

[0057] In the embodiments of this application, reference is made to Figure 1 , Figure 3 as well as Figure 8 The optical module assembly also includes a circuit board 400, with a cage 300 mounted on the circuit board 400. It is understood that the cage 300 is fixed to the circuit board 400, enabling communication between the optical module and the circuit board 400. Optionally, one end of the pressure plate 142 is fixedly connected to the circuit board 400, and the other end of the pressure plate 142 presses against the surface of the liquid cooling plate 110 facing away from the tolerance-conducting heat structure 120, thus preventing deformation of the liquid cooling plate 110.

[0058] In the embodiments of this application, reference is made to Figure 1 , Figure 3 as well as Figure 8The optical module assembly also includes a mounting bracket 500, on which a circuit board 400 is mounted. The liquid cooling plate 110 is connected to the mounting bracket 500 via a support structure 600. Optionally, the mounting bracket 500 and the circuit board 400 are connected by bolts. The mounting bracket 500 can provide mounting and support for other components. The support structure 600 can be a support rod, connecting the second cold plate 112 in the liquid cooling plate 110 to the mounting bracket 500, and enabling the second cold plate 112 to pre-compress the lower tolerance heat-conducting structure 120.

[0059] This application also proposes a communication device, which includes the optical module assembly described above. Specifically, the specific structure of the optical module assembly refers to the above embodiments. Since this communication device adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. Optionally, the communication device can be a data center switch or a router, which is not limited here.

[0060] The above description is merely an exemplary implementation of this application and does not limit the patent scope of the embodiments of this application. Any equivalent structural transformations made based on the technical concept of the embodiments of this application and the contents of the specification and drawings of the embodiments of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the embodiments of this application.

Claims

1. A liquid-cooled heat dissipation module, characterized in that, The liquid cooling heat dissipation module includes: Liquid cooling plate; A tolerance-controlled thermally conductive structure is disposed on one side of the liquid cooling plate; and A floating structure is floatingly disposed on the side of the tolerance heat-conducting structure away from the liquid cooling plate for mounting a heating element. The tolerance heat-conducting structure has a tendency to drive the floating structure to move away from the liquid cooling plate. The heating element abuts against the side of the floating structure away from the tolerance heat-conducting structure, causing the floating structure to move toward the liquid cooling plate to cooperate with the liquid cooling plate to clamp the tolerance heat-conducting structure.

2. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The floating structure includes an elastic element and a floating platform. One end of the elastic element is fixedly disposed, and the other end of the elastic element is connected to the floating platform. The elastic element can deform in the arrangement direction of the liquid cooling plate and the tolerance heat conduction structure.

3. The liquid cooling heat dissipation module as described in claim 2, characterized in that, The surface of the floating platform is provided with a mounting groove, and the tolerance heat-conducting structure is located in the mounting groove and abuts against the liquid cooling plate.

4. The liquid-cooled heat dissipation module as described in claim 2, characterized in that, The floating structure also includes an assembly located at one end of the elastic member for detachably mounting the elastic member onto the fixed member.

5. The liquid-cooled heat dissipation module as described in claim 4, characterized in that, The assembly is configured as a snap-fit ​​structure; and / or the tolerance-conducting thermal structure is an elastic thermal pad.

6. The liquid-cooled heat dissipation module as described in claim 2, characterized in that, The floating platform has a flexible heat-conducting layer on its surface facing the heating element.

7. The liquid-cooled heat dissipation module as described in claim 6, characterized in that, The flexible thermally conductive layer includes a metal film and a phase change medium encapsulated inside the metal film.

8. The liquid-cooled heat dissipation module as described in claim 1, characterized in that, The liquid cooling heat dissipation module also includes a deformation prevention structure, which is connected to the liquid cooling plate to limit the thermal deformation of the liquid cooling plate.

9. The liquid-cooled heat dissipation module as described in claim 8, characterized in that, The anti-deformation structure includes at least one of a side panel and a pressure plate; wherein the side panel is disposed on the side of the liquid cooling plate, and the pressure plate is disposed on the surface of the liquid cooling plate opposite to the heating element.

10. The liquid-cooled heat dissipation module as described in any one of claims 1 to 9, characterized in that, The liquid cooling plate includes a first cold plate and a second cold plate spaced apart. The heating element is provided on the side of the first cold plate facing away from the second cold plate and between the first cold plate and the second cold plate. The tolerance heat conduction structure and the floating structure are provided between the first cold plate and the corresponding heating element, and between the second cold plate and the corresponding heating element.

11. The liquid-cooled heat dissipation module as described in claim 10, characterized in that, The liquid cooling heat dissipation module also includes a liquid distributor and a first branch pipe and a second branch pipe detachably connected to the liquid distributor. The first branch pipe connects the liquid distributor and the first cold plate, and the second branch pipe connects the liquid distributor and the second cold plate.

12. The liquid-cooled heat dissipation module as described in claim 11, characterized in that, The liquid cooling heat dissipation module also includes a main pipeline, which connects the liquid distributor to an external cold source; And / or, the first branch line is connected to the dispenser via a quick-connect plug; And / or, the second branch line is connected to the distributor via a quick-connect fitting; And / or, the first branch pipeline includes a first inlet branch and a first outlet branch; And / or, the second branch pipeline includes a second inlet branch and a second outlet branch; And / or, the first cold plate and the second cold plate are connected by a connecting column.

13. An optical module assembly, characterized in that, The optical module assembly includes an optical module and a liquid-cooled heat dissipation module as described in any one of claims 1 to 12, wherein the heat-generating element is configured as the optical module.

14. The optical module assembly as described in claim 13, characterized in that, The optical module assembly also includes a cage, which has a plug-in cavity and an opening communicating with the plug-in cavity, and the floating structure is provided corresponding to the opening.

15. The optical module assembly as described in claim 14, characterized in that, The rat cage is configured as a U-shaped rat cage.

16. The optical module assembly as described in claim 14, characterized in that, The optical module assembly also includes a circuit board, and the mouse cage is disposed on the circuit board.

17. The optical module assembly as described in claim 16, characterized in that, The optical module assembly also includes a mounting plate, on which the circuit board is mounted, and the liquid cooling plate is connected to the mounting plate via a support structure.

18. A communication device, characterized in that, The communication device includes the optical module assembly as described in any one of claims 13 to 17.

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