Read head having one or more antiferromagnetic layers beneath a soft bias side shield and related methods

Abstract

The present disclosure relates to a read head apparatus for a magnetic storage device, such as a tape drive (e.g., a tape deck), and a method of forming the read head apparatus. In one embodiment, a read head for a magnetic storage device includes a lower shield, an upper shield, one or more lower leads, and a plurality of upper leads. The read head includes a plurality of read sensors, each of the plurality of read sensors including a first antiferromagnetic (AFM) layer. The read head includes a plurality of soft bias side shields disposed between and outside the plurality of read sensors. The read head includes a plurality of second AFM layers disposed below the plurality of soft bias side shields along a downtrack direction.

Description

Technical Field

[0001] The present disclosure relates to a read head apparatus for a magnetic storage device such as a magnetic tape drive (eg, a tape deck), and a method of forming the read head apparatus. Background Art

[0002] A magnetic tape data storage device is a system for storing digital information on magnetic tape using digital recording. Magnetic tape storage media is typically packaged in cartridges or cassettes. A tape drive writes or reads data from the cartridges or cassettes. A common tape cartridge format is LTO, which comes in various densities.

[0003] A tape drive operates by recording and reading back information from a magnetic tape using a tape head through a magnetic process. The tape head may have servo elements and data elements arranged in an array sometimes referred to as a tape head array.

[0004] Hard bias elements adjacent to sensors in tape drives can have high coercivity, which can hinder device performance. Soft bias elements have lower coercivity but are unstable and may even move during tape drive operation. Soft bias elements can also cause signal shunting, hindering device performance.

[0005] Therefore, there is a need in the art for a tape drive having a soft biasing element that facilitates low coercivity, stability of the soft biasing element, reduced signal shunting, and enhanced device performance. Summary of the Invention

[0006] The present disclosure relates to a read head apparatus for a magnetic storage device, such as a tape drive (e.g., a tape deck), and a method of forming the read head apparatus. In one embodiment, a read head for a magnetic storage device includes a lower shield, an upper shield, one or more lower leads, and a plurality of upper leads. The read head includes a plurality of read sensors, each of the plurality of read sensors including a first antiferromagnetic (AFM) layer. The read head includes a plurality of soft bias side shields disposed between the plurality of read sensors and outside the plurality of read sensors. The read head includes a plurality of second AFM layers disposed below the plurality of soft bias side shields along a downtrack direction.

[0007] In one embodiment, a read head for a magnetic storage device includes a lower shield, an upper shield, and one or more lower leads disposed between the lower shield and the upper shield. The read head includes a plurality of upper leads disposed above the one or more lower leads along a downtrack direction. Each of the plurality of upper leads and each of the one or more lower leads is non-magnetic and conductive. The read head includes a plurality of read sensors disposed between the one or more lower leads and the plurality of upper leads. Each of the plurality of read sensors includes a multilayer structure, and the multilayer structure includes a first antiferromagnetic (AFM) layer and a free layer. The read head includes a plurality of soft bias side shields disposed between and outside the plurality of read sensors, and a plurality of second AFM layers disposed between the lower shield and the plurality of soft bias side shields.

[0008] In one embodiment, a read head for a magnetic storage device includes a lower shield, an upper shield, and one or more lower leads disposed between the lower shield and the upper shield. The read head includes a plurality of upper leads disposed above the one or more lower leads along a downtrack direction. Each of the one or more lower leads and each of the plurality of upper leads is conductive. The read head includes a plurality of read sensors disposed between the one or more lower leads and the plurality of upper leads. Each of the plurality of read sensors includes a multilayer structure, and the multilayer structure includes a first antiferromagnetic (AFM) layer and a free layer. The read head includes a plurality of soft bias side shields disposed among the plurality of read sensors, and a plurality of second AFM layers disposed between the one or more lower leads and the plurality of soft bias side shields.

[0009] In one embodiment, a method of forming a read head for a magnetic storage device includes forming a lower shield; forming a lower lead layer above the lower shield; and forming a multilayer structure above the lower lead layer, the multilayer structure including a first antiferromagnetic (AFM) layer and a free layer. The method includes removing sections of the multilayer structure to form a plurality of read sensors; forming a plurality of first insulating layers between and outside the plurality of read sensors; and forming a plurality of second AFM layers above the plurality of first insulating layers. The method includes forming a plurality of soft-bias side shields above the plurality of second AFM layers; and forming one or more upper leads. Each of the lower lead layer and the one or more upper leads is non-magnetic and conductive. The method includes forming an upper shield. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order that the manner in which the above-described features of the present disclosure may be understood in detail, a more particular description of the disclosure, briefly summarized above, may be made by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only typical embodiments of the disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.

[0011] Figure 1 is a schematic perspective exploded view of a storage device according to one embodiment.

[0012] Figure 2 According to an embodiment Figure 1 Schematic top view of the tape drive described in .

[0013] Figure 3 According to an embodiment Figure 1 Schematic side profile view of the tape drive illustrated in .

[0014] Figure 4 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0015] Figure 5 is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0016] Figure 6 is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0017] Figure 7 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0018] Figure 8 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0019] Figure 9 According to an embodiment Figure 4 Schematic cross-sectional view of the read head shown in FIG. 9 along section 9 - 9 .

[0020] Figure 10 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0021] Figure 11 is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0022] Figure 12is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0023] Figure 13 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0024] Figure 14 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0025] Figure 15 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0026] Figure 16 is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0027] Figure 17 is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0028] Figure 18 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0029] Figure 19 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0030] Figure 20 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0031] Figure 21 is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0032] Figure 22 is a schematic partially exploded isometric media facing surface (MFS) view of a read head according to one embodiment.

[0033] Figure 23 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0034] Figure 24 is a schematic isometric media facing surface (MFS) view of a read head according to one embodiment.

[0035] Figures 25A to 25F A schematic process flow is illustrated for a method of forming at least a portion of a read head according to one embodiment.

[0036] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized in other embodiments without specific recitation. DETAILED DESCRIPTION

[0037] Hereinafter, reference is made to embodiments of the present disclosure. However, it should be understood that the present disclosure is not limited to the specific described embodiments. In fact, any combination of the following features and elements (whether or not related to different embodiments) is encompassed to implement and practice the present disclosure. In addition, although the embodiments of the present disclosure can achieve advantages over other possible solutions and / or advantages over the prior art, whether a particular advantage is achieved by a given embodiment does not limit the present disclosure. Therefore, the following aspects, features, embodiments and advantages are merely illustrative and are not considered to be elements or limitations of the appended claims unless expressly stated in the claims. Similarly, reference to "the present disclosure" should not be interpreted as a generalization of any inventive subject matter disclosed herein, and should not be considered to be elements or limitations of the appended claims unless expressly stated in the claims.

[0038] The present disclosure relates to a read head apparatus for a magnetic storage device, such as a tape drive (e.g., a tape deck), and a method of forming the read head apparatus. In one embodiment, a read head for a magnetic storage device includes a lower shield, an upper shield, one or more lower leads, and a plurality of upper leads. The read head includes a plurality of read sensors, each of the plurality of read sensors including a first antiferromagnetic (AFM) layer. The read head includes a plurality of soft bias side shields disposed between the plurality of read sensors and outside the plurality of read sensors. The read head includes a plurality of second AFM layers disposed below the plurality of soft bias side shields along a downtrack direction.

[0039] Figure 1 is a schematic perspective exploded view of a storage device 100 according to one embodiment. Storage device 100 is a magnetic media drive, specifically a tape drive. Storage device 100 will be referred to as tape drive 100 hereinafter. It should be noted that while the tape drive is shown with an embedded magnetic tape for illustrative purposes, embodiments of the present invention are applicable to various forms of tape drives, including drives in which tape media can be inserted, for example, into a media bay. An example is a tape drive and media compliant with the LTO standard, and the various drive illustrations shown will resemble such a drive when the media is fully inserted and engageable for data access.

[0040] Figure 2 According to an embodiment Figure 1 Schematic top view of the tape drive 100 illustrated in FIG.

[0041] Figure 3According to an embodiment Figure 1 Schematic side profile view of the tape drive 100 illustrated in FIG.

[0042] focus on Figure 2 For example, the tape drive 100 includes a housing including a casing 105; one or more tape reels 110; one or more rotors (e.g., a stepper motor 120 (also known as a stepper motor), a voice coil motor (VCM) 125); a head assembly 130 having one or more read heads and one or more write heads; and tape guides / rollers 135a, 135b. Figure 3 For example, the tape drive 100 further includes a printed circuit board assembly 155 (PCBA). In one embodiment that may be combined with other embodiments, most components are within the interior cavity of the housing 105, except for the PCBA 155 mounted on the outer surface of the housing 105. Figure 1 The same components are illustrated in the perspective diagram in .

[0043] In the illustrated embodiment, two tape reels 110 are placed in the interior cavity of the housing 105, with the center of each of the two tape reels 110 being at the same level in the cavity. Figure 1 and 2 As shown in FIG, a head assembly 130 is located between and below the two tape reels 110. A tape reel motor located in the spindle of the tape reel 110 is operable to wind the tape medium 115 onto and unwind it from the tape reel 110. Each tape reel 110 may also incorporate a tape folder to help neatly wind the tape medium 115 onto the corresponding tape reel 110. The tape medium 115 may be manufactured using a sputtering process to provide improved surface density. The tape medium 115 includes two surfaces, an oxide side and a substrate side. The oxide side is the surface that can be magnetically controlled (written to or read from) by one or more read / write heads. The substrate side of the tape medium 115 helps to increase the strength and flexibility of the tape medium 115.

[0044] The tape media 115 from the tape reel 110 is biased against guides / rollers 135a, 135b (collectively referred to as guides / rollers 135) and is transferred along the movement of the head assembly 130 by the movement of the reel. The illustrated embodiment shows four guides / rollers 135a, 135b, with the two guides / rollers 135a being farthest from the head assembly 130 for changing the direction of the tape media 115 and the two guides / rollers 135b being closest to the head assembly 130 for pressing the tape media 115 against the head assembly 130.

[0045] In one embodiment, which may be combined with other embodiments, the guide / roller 135 utilizes the same structure, such as Figure 1 In one embodiment, which may be combined with other embodiments, the guides / rollers 135 may have more specific shapes and differ from each other based on function, such as Figure 2 As shown in . A smaller or larger number of rollers can be used. For example, the two functional rollers can be cylindrical in shape, while the two functional guides can be flat-sided (e.g., rectangular prisms) or in the shape of a clamp with two prongs and a film moving between the prongs of the clamp.

[0046] The voice coil motor 125 and the stepper motor 120 can variably position the tape head laterally relative to the width of the recording tape (e.g., the tape medium 115). The stepper motor 120 can provide coarse movement, while the voice coil motor 125 can provide finer actuation of the head of the head assembly 130. In one embodiment, which can be combined with other embodiments, servo data can be written to the tape medium 115 to help more accurately position the head along the tape medium 115.

[0047] like Figure 1 As described in

[0045] , the housing 105 includes one or more particle filters 141 and / or desiccant 142 to help maintain the environment within the housing 105. For example, if the housing 105 is not airtight, the particle filter 141 can be placed in a location where airflow is desired. The particle filter 141 and / or desiccant 142 can be placed in one or more corners or any other convenient location away from moving internal components. For example, the moving tape reel 110 can generate an internal airflow when the tape media 115 is wound / unwound, and the particle filter 141 can be placed within the airflow.

[0048] There are various possible placements of the internal components of the tape drive 100 within the housing 105. Specifically, in some instances, when the head assembly 130 is inside the housing 105, the tape media 115 may not be exposed to the exterior of the housing 105. Thus, the tape media 115 need not be routed along the edge of the housing 105 and may be freely routed within the housing 105 in a more compact and / or otherwise efficient manner. Similarly, the head and tape reel 110 may be placed in a variety of locations to achieve a more efficient layout because there is no design requirement to provide external access to these components.

[0049] like Figure 3As illustrated in FIG, housing 105 includes a cover 150 and a base 145. A PCBA 155 is attached to the outer surface of housing 105, at a bottom portion opposite cover 150. Base 145 includes three walls, and cover 150 includes a fourth wall, forming four of the multiple walls of housing 105 contained within the outer shell of tape drive 100. Because PCBA 155 is made of electronics, environmental concerns are less of a concern, and therefore, it does not need to be placed inside housing 105. This leaves space inside housing 105 for other components that would benefit from a more protected environment, particularly moving components and tape media 115.

[0050] In one embodiment that can be combined with other embodiments, the tape drive 100 is sealed. Sealing can mean that the tape drive 100 is hermetically sealed or simply enclosed, and is not necessarily airtight. A sealed drive can be beneficial to tape film winding stability, tape film reliability, and tape head reliability. A desiccant can be used to limit the humidity inside the housing 105.

[0051] In one embodiment, which may be combined with other embodiments, the cover 150 is used to hermetically seal the tape drive 100. For example, the tape drive 100 may be hermetically sealed for environmental control by attaching (e.g., laser welding, adhering with an adhesive, etc.) the cover 150 to the base 145. The tape drive 100 may be filled with helium, nitrogen, hydrogen, or any other typical inert gas.

[0052] In one embodiment that may be combined with other embodiments, other components may be added to the tape drive 100. For example, a preamplifier for the magnetic head of the head assembly 130 may be added to the tape drive 100. The preamplifier may be located on the PCBA 155, in the head assembly 130, or in another location. Generally speaking, placing the preamplifier closer to the magnetic head may have a greater impact on the signal-to-noise ratio (SNR) of the read and write signals. In one embodiment that may be combined with other embodiments, some components may be omitted. For example, the particle filter 141 and / or the desiccant 142 may be omitted.

[0053] Figure 4 is a schematic isometric medium facing surface (MFS) view of a read head 400 according to one embodiment. The read head 400 may be used as Figure 1 A portion of the tape drive 100 (magnetic storage device) shown in FIG. The read head 400 includes a lower shield 401, an upper shield 403, and one or more lower leads 405 ( Figure 4(a lower lead 405 is shown in FIG. 1 ). The read head 400 includes a plurality of upper leads 407 disposed above the one or more lower leads 405 along a downtrack direction DT1. Each of the plurality of upper leads 407 and each of the one or more lower leads 405 is non-magnetic and conductive.

[0054] A plurality of read sensors 410 are disposed between one or more lower leads 405 and a plurality of upper leads 407. Each of the plurality of read sensors 410 comprises a multilayer structure. The multilayer structure of each read sensor 410 includes a buffer layer 411 disposed on the lower leads 405, a first antiferromagnetic (AFM) layer 412 disposed on the buffer layer 411, and a free layer 413 disposed on the first AFM layer 412. Each read sensor 410 includes a cap layer 418 disposed on the free layer 413. The buffer layer 411 is disposed between the corresponding first AFM layer 412 and the one or more lower leads 405. The cap layer 418 is non-ferromagnetic. The read head 400 includes a plurality of soft bias side shields 420 disposed among the plurality of read sensors 410. The plurality of soft bias side shields 420 are disposed between the plurality of read sensors 410 and outside the plurality of read sensors 410. The read head 400 includes a plurality of second AFM layers 425 disposed between a lower shield 401 and a plurality of soft-bias side shields 420. The second AFM layers 425 are disposed below the plurality of soft-bias side shields 420 along a downtrack direction DT1. Each of the soft-bias side shields 420 and the second AFM layers 425 is magnetic and electrically conductive. The plurality of second AFM layers 425 are disposed between the plurality of soft-bias side shields 420 and one or more lower leads 405. The soft-bias side shields 420 are formed of nickel iron (NiFe).

[0055] The free layer 413 of each read sensor 410 includes multiple layers 414-417. The free layer 413 is ferromagnetic. It includes two layers 414 and 416 separated by a spacer layer 415. Each of the two layers 414 and 416 is formed from one or more of cobalt (Co), iron (Fe), and / or boron (B). The spacer layer 415 is formed from magnesium oxide (MgO) and has a length in the downtrack direction DT1 ranging from 5 angstroms to 200 angstroms, for example, 20 angstroms. A layer 417 between layer 416 and the cap layer 418 is formed from nickel iron (NiFe).

[0056] The soft bias side shields 420 help bias the magnetic read field of the read sensor 410 during a magnetic read operation. The soft bias side shields 420 promote a magnetic field in the cross-track direction CT1 during a magnetic read operation. The second AFM layer 425 helps stabilize the soft bias side shields 420 during a magnetic read operation. The stabilization promoted by the second AFM layer 425 helps prevent the soft bias side shields 420 from moving (e.g., moving along the stripe height direction SH1) during a magnetic read operation.

[0057] The second AFM layer 425 is formed of iridium manganese (IrMn). The first AFM layer 412 is formed of iridium manganese (IrMn). Each of the second AFM layers 425 has a trapezoidal cross-section in a plane defined by the cross-track direction CT1 and the down-track direction DT1. The bottom surface of each second AFM layer 425 has a profile parallel to the top surface of the first AFM layer 412 of each read sensor 410.

[0058] The buffer layer 411 of each read sensor 410 is positioned at a first distance D1 relative to the lower shield 401. The cap layer 418 of each read sensor 410 is positioned at a second distance D2 relative to the upper shield 403. The second distance D2 is substantially equal to the first distance D1. In one embodiment that may be combined with other embodiments, the second distance D2 is substantially equal to the first distance D1, such that the difference between the second distance D2 and the first distance D1 is 1 nm or less. Depending on the configuration, the difference between the second distance D2 and the first distance D1 may be different. In one embodiment that may be combined with other embodiments, the difference between the second distance D2 and the first distance D1 is 50 nm or less. The second distance D2 being substantially equal to the first distance D1 helps stabilize the read sensor 410 and enhance the magnetic reading operation.

[0059] The read head 400 includes a plurality of first insulating layers 441 disposed between and outside the read sensors 410, a plurality of second insulating layers 442 disposed between and outside the upper leads 407, and a third insulating layer 443 disposed between the upper leads 407 and the upper shield 403. The first insulating layer 441 is disposed between the one or more lower leads 405 and the soft bias side shield 420. The first insulating layer 441 is disposed between the plurality of second AFM layers 425 and the one or more lower leads 405, and between the first AFM layer 412 of the read sensor 410 and the plurality of soft bias side shields 420. The first insulating layer 441 has a thickness (along the down-track direction DT1) of 3 nm or greater.

[0060] The present disclosure contemplates that second insulating layer 442 may be integrated into a single insulating layer, and that upper lead 407 may be positioned within a recess formed in the single insulating layer. The first AFM layer 412 of each read sensor 410 has a first width W1 along the cross-track direction CT1, and each lower lead 405 has a second width W2 that is greater than the first width W1. The first width W1 of each first AFM layer 412 is taken along the underside (the lower portion along the down-track direction DT1) of the corresponding first AFM layer 412. Upper lead 407, using insulating layers 441, 442, and 443, serves as a single lead for multiple read sensors 410. Lower lead 405 is a common lead across multiple read sensors 410. The present disclosure contemplates that multiple lower leads may be used in place of lower lead 405, for example, by using multiple insulating layers positioned between and outside the multiple lower leads.

[0061] The read head 400 includes a first stripe side 451 and a second stripe side 452. The first stripe side 451 and the second stripe side 452 are opposite to each other along the stripe height direction SH1. The first stripe side 451 is a medium facing surface (MFS), such as an air bearing surface (ABS).

[0062] exist Figure 4 In the embodiment shown in , the vertical section 490 and the angled section 491 of the first insulating layer 441 contact the soft bias side shield 420 .

[0063] Figure 5 is a schematic partially exploded isometric media facing surface (MFS) view of a read head 500 according to one embodiment. The read head 500 is similar to Figure 4 , and including one or more of its aspects, features, components, and / or characteristics.

[0064] exist Figure 5 In the embodiment shown in FIG, portions of each of the plurality of read sensors 510 and portions of one or more lower leads 505 on the second strip side 452 are removed (e.g., milled), and a plurality of fourth insulating layers 544 are formed on the second strip side 452. The read sensors 510 are similar to Figure 4, and including one or more aspects, features, components, and / or characteristics thereof. A fourth insulating layer 544 is formed behind the read sensor 510 and partially behind one or more lower leads 505 along the stripe height direction SH1. The fourth insulating layer 544 is positioned between the second insulating layer 442 and the lower shield 401. The lower surface of each fourth insulating layer 544 has a width W3 (along the cross-track direction CT1) that is greater than the first width W1 of the first AFM layer 512. Each of the second AFM layers 425 has a height H1 (along the stripe height direction SH1) that is greater than the height H2 of each of the first AFM layers 512.

[0065] Each of the fourth insulating layers 544 is formed behind the buffer layer 511 , the first AFM layer 512 , the free layer 513 , and the cap layer 518 of the corresponding read sensor 510 (along the stripe height direction SH1 ).

[0066] Figure 6 is a schematic partially exploded isometric media facing surface (MFS) view of a read head 600 according to one embodiment. The read head 600 is similar to Figure 4 , and including one or more of its aspects, features, components, and / or characteristics.

[0067] exist Figure 6 In the embodiment shown in FIG, a portion of each of the plurality of read sensors 610 on the second strip side 452 is removed (e.g., milled), and a plurality of fourth insulating layers 644 are formed on the second strip side 452. The read sensors 610 are similar to Figure 4 , and including one or more of its aspects, features, components, and / or characteristics. A fourth insulating layer 644 is formed behind a portion of the read sensor 610 along the stripe height direction SH1. The fourth insulating layer 644 is disposed between the layer 414 and the upper lead 407.

[0068] Each of fourth insulating layers 644 is formed behind spacer layer 615 , layer 616 , layer 617 , and cap layer 618 of free layer 613 of each corresponding read sensor 610 (along stripe height direction SH1 ).

[0069] Figure 7 is a schematic isometric media facing surface (MFS) view of a read head 700 according to one embodiment. The read head 700 is similar to Figure 4 , and includes one or more of its aspects, features, components, and / or characteristics. Figure 5, and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 700 combines the configuration of read sensor 510 with the configuration of insulating layers 442, 443.

[0070] exist Figure 7 In the embodiment shown in FIG, portions of the plurality of read sensors 510, portions of the plurality of soft bias side shields 720, portions of the plurality of first insulating layers 741, portions of the plurality of second AFM layers 725, and portions of the one or more lower leads 505 on the second strip side 452 are removed (e.g., milled). Recesses 727 are formed on the second strip side 452, and a fourth insulating layer 744 is formed in the recesses 727 on the second strip side 452. The fourth insulating layer 744 is formed behind the read sensors 510 along the strip height direction SH1.

[0071] A fourth insulating layer 744 is formed behind the read sensor 510, the soft bias side shields 720, the first insulating layer 741, and the second AFM layer 725 (along the stripe height direction SH1). The fourth insulating layer 744 has a width along the cross-track direction CT1 that spans the one or more lower leads 505 and the multiple soft bias side shields 720.

[0072] The fourth insulating layer 744 has a length L1 along the down-track direction DT1 that is substantially equal to or greater than a length L2 of the read sensor 510. In one embodiment, which may be combined with other embodiments, the length L1 is substantially equal to the length L2, such that a difference between the lengths L1 and L2 is 1 nm or less.

[0073] Figure 8 is a schematic isometric media facing surface (MFS) view of a read head 800 according to one embodiment. The read head 800 is similar to Figure 4 , and includes one or more of its aspects, features, components, and / or characteristics. Figure 6 6 and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 800 combines the configuration of read sensor 610 with the configuration of insulating layers 441 , 442 , 443 .

[0074] exist Figure 8In the embodiment shown in FIG, portions of the spacer layer 615, layers 616, 617, cap layer 618, and the plurality of soft bias side shields 820 are removed (e.g., milled). A recess 827 is formed on the second strip side 452, and a fourth insulating layer 844 is formed in the recess 827 on the second strip side 452. The fourth insulating layer 844 is formed behind the spacer layer 615, layers 616, 617, and cap layer 618 along the strip height direction SH1. The fourth insulating layer 844 is formed behind portions of the soft bias side shields 820 (along the strip height direction SH1). The fourth insulating layer 844 includes a width along the cross-track direction CT1 that spans the one or more lower leads 405 and the plurality of soft bias side shields 820.

[0075] The fourth insulating layer 844 has a length L3 along the down-track direction DT1 , which is smaller than a length L2 of the read sensor 610 .

[0076] Figure 9 According to an embodiment Figure 4 9 along section 9-9 of the read head 400 shown in FIG. During a magnetic read operation, a magnetic tape medium 910 moves past the read sensor 410 in the down-track direction DT1. A portion 911 of the magnetic tape medium 910 aligned with the read sensor 410 along the stripe height direction SH1 is subjected to a first magnetic force F1. A portion 912 of the magnetic tape medium 910 aligned outside of the read sensor 410 along the stripe height direction SH1 is subjected to a second magnetic force F2 that is opposite in direction to or in the same direction as the first magnetic force F1.

[0077] Figure 10 is a schematic isometric media facing surface (MFS) view of a read head 1000 according to one embodiment. The read head 1000 is similar to Figure 4 , and including one or more of its aspects, features, components, and / or characteristics.

[0078] The read head 1000 includes a plurality of soft-bias side shields 1020 disposed between and outside the read sensors 410. A plurality of buffer layers 1060 are disposed on the first insulating layer 441. A second plurality of AFM layers 1025 are formed on the buffer layer 1060 and disposed between the buffer layer 1060 and the soft-bias side shields 1020. Each of the buffer layers 411 and 1060 is non-magnetic. The buffer layer 1060 is disposed between the second plurality of AFM layers 1025 and the first insulating layer 441, and the first plurality of insulating layers 441 are disposed between the plurality of buffer layers 1060 and one or more lower leads 405. The first insulating layer 441 is disposed between the first AFM layer 412 of the read sensor 410 and the plurality of buffer layers 1060. Each buffer layer 411 and each buffer layer 1060 is non-magnetic and formed from one or more of nickel-chromium (NiCr), ruthenium (Ru), and / or tantalum (Ta).

[0079] The plurality of buffer layers 1060 helps to Figure 10 The second AFM layer 1025 of the embodiment is raised to Figure 4 Above the second AFM layer 425 in the embodiment (along the down-track direction DT1).

[0080] Figure 11 is a schematic partially exploded isometric view of a read head 1100 according to one embodiment. The read head 1100 is similar to Figure 5 The read head 500 shown in FIG. 1 is similar to the read head 500 shown in FIG. 1 and includes one or more aspects, features, components and / or characteristics thereof. Figure 10 , and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 1100 combines the configuration of read sensor 510 with the configuration of soft bias side shields 1020 and buffer layer 1060.

[0081] Each of the second AFM layers 1025 has a height H1 (along the stripe height direction SH1 ) that is greater than a height H2 of each of the first AFM layers 512 .

[0082] Figure 12 is a schematic partially exploded isometric view of a media facing surface (MFS) of a read head 1200 according to one embodiment. The read head 1200 is similar to Figure 6 The read head 600 shown in FIG. 1 is similar to the read head 600 shown in FIG. 1 and includes one or more of its aspects, features, components and / or characteristics. Figure 1010. The embodiment of the present invention is similar to the read head 1000 shown in FIG. 10 and includes one or more of its aspects, features, components, and / or characteristics. As an example, the read head 1200 combines the configuration of the read sensor 610 with the configuration of the soft bias side shield 1020 and the buffer layer 1060.

[0083] Figure 13 is a schematic isometric media facing surface (MFS) view of a read head 1300 according to one embodiment. The read head 1300 is similar to Figure 7 , and includes one or more of its aspects, features, components, and / or characteristics. Figure 10 1 and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 1300 combines the configuration of insulating layers 442, 443 with the configuration of insulating layer 741.

[0084] A fourth insulating layer 744 is formed behind (along the stripe height direction SH1) the read sensor 510, the plurality of soft bias side shields 1320, the plurality of first insulating layers 741, the second AFM layer 1325, and the plurality of buffer layers 1360. The buffer layers 1060, 1360 are non-magnetic.

[0085] Figure 14 is a schematic isometric media facing surface (MFS) view of a read head 1400 according to one embodiment. The read head 1400 is similar to Figure 8 , and including one or more of its aspects, features, components, and / or characteristics. Figure 10 The read head 1000 shown in FIG. 1 is similar to the read head 1000 shown in FIG. 1 and includes one or more aspects, features, components, and / or characteristics thereof. Figure 13 , and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 1400 combines the configuration of buffer layer 1060 with the configuration of soft bias side shields 1320 and second AFM layer 1325.

[0086] The read head 1400 includes a fourth insulating layer 1444. The fourth insulating layer 1444 is similar to Figure 8 , and including one or more of its aspects, features, components, and / or characteristics. The fourth insulating layer 1444 is formed behind the spacer layer 615, layers 616, 617, the cap layer 618, the second AFM layer 1325, and the soft bias side shield 1320 along the strip height direction SH1.

[0087] The fourth insulating layer 1444 has a length L4 along the down-track direction DT1 , which is smaller than a length L2 of the read sensor 610 .

[0088] Figure 15 is a schematic isometric media facing surface (MFS) view of a read head 1500 according to one embodiment. The read head 1500 is similar to Figure 4 The read head 400 shown in FIG. 1 and including one or more of its aspects, features, components, and / or characteristics. The read head 1500 includes a plurality of read sensors 1510. The first AFM layer of each read sensor 1510 is part of a common AFM layer 1512 across the plurality of read sensors 1510. The buffer layer of each read sensor 1510 is part of a common buffer layer 1511 across the plurality of read sensors 1510. Figure 4 In the embodiment shown in Figure 15 Compared to the common buffer layer 1511 , the common AFM layer 1512 , and the free layer 1513 of the embodiment shown in , more of the buffer layer 411 , the first AFM layer 412 , and the free layer 413 are milled along the cross-track direction CT1 .

[0089] The read head 1500 includes a common bottom lead 1505 spanning a plurality of read sensors 1510, and a plurality of first insulating layers 1541 disposed between a plurality of second AFM layers 1525 and the common bottom lead 1505. The second AFM layers 1525 are disposed between the first insulating layers 1541. The read head 1500 includes a plurality of soft-bias side shields 1520. The free layer 1513 of each read sensor 1510 includes two layers 1514, 1516 separated by a spacer layer 1515.

[0090] The common AFM layer 1512 has a first width W4 along the cross-track direction CT1, and the common lower lead 1505 has a second width W5 substantially equal to the first width W4. In one embodiment, which may be combined with other embodiments, the first width W4 is substantially equal to the second width W5, such that the difference between the first width W4 and the second width W5 is 1 nm or less.

[0091] Figure 16 is a schematic partially exploded isometric media facing surface (MFS) view of a read head 1600 according to one embodiment. The read head 1600 is similar to Figure 15 and including one or more of its aspects, features, components and / or characteristics.

[0092] exist Figure 16In the embodiment shown in FIG, a portion of each of the plurality of read sensors 1610 (including the common AFM layer 1512 and the common buffer layer 1511) on the second stripe side 452 is removed (e.g., milled), and one or more fourth insulating layers 1644 ( Figure 16 One is shown in FIG. 4 ) formed on the second strip side 452. The read sensor 1610 is similar to Figure 4 The read sensor 410 shown in FIG. 4 and including one or more of its aspects, features, components and / or characteristics. One or more fourth insulating layers 1644 are formed behind the read sensor 1610 along the strip height direction SH1. Figure 16 In the embodiment shown in , a single fourth insulating layer 1644 spans the common AFM layer 1512 .

[0093] Each of the second AFM layers 1525 has a height H1 (along the stripe height direction SH1) that is greater than the height H2 of the common AFM layer 1512. Each of the fourth insulating layers 544 is formed behind the buffer layer 511, the first AFM layer 512, the free layer 513, and the cap layer 518 of the corresponding read sensor 510 (along the stripe height direction SH1). The free layer 1613 of each read sensor 1610 is similar to Figure 15 and includes one or more of its aspects, features, components and / or characteristics.

[0094] The free layer 1613 of each read sensor 1610 comprises two layers 1614, 1616 separated by a spacer layer 1615. Each read sensor 1610 comprises a layer 1617 and a cap layer 1618.

[0095] Figure 17 is a schematic partially exploded isometric view of a read head 1700 according to one embodiment. The read head 1700 is similar to Figure 15 The read head 1500 shown in FIG. 1 is similar to the read head 1500 shown in FIG. 1 and includes one or more of its aspects, features, components and / or characteristics. Figure 16 and including one or more of its aspects, features, components and / or characteristics.

[0096] As an example, read head 1700 combines the configuration of common AFM layer 1512 and layer 1514 with the configuration of spacer layer 1615 , layers 1616 , 1617 , and cap layer 1618 .

[0097] exist Figure 17In the embodiment shown in FIG, a portion of each of the plurality of read sensors 1710 on the second strip side 452 is removed (e.g., milled), and a plurality of fourth insulating layers 1744 are formed on the second strip side 452. The read sensors 1710 are similar to Figure 4 , and includes one or more of its aspects, features, components, and / or characteristics.

[0098] Each of fourth insulating layers 1744 is formed behind spacer layer 1615 , layer 1616 , layer 1617 , and cap layer 1618 of free layer 1613 of each corresponding read sensor 1610 (along stripe height direction SH1 ).

[0099] Figure 18 is a schematic isometric media facing surface (MFS) view of a read head 1800 according to one embodiment. The read head 1800 is similar to Figure 15 The read head 1500 shown in FIG. 1 is similar to the read head 1500 shown in FIG. 1 and includes one or more aspects, features, components, and / or characteristics thereof. Figure 16 , and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 1800 combines the configuration of common buffer layer 1511 and common AFM layer 1512 with the configuration of read sensor 1610.

[0100] exist Figure 18 In the embodiment shown in FIG, portions of the plurality of read sensors 1610, portions of the plurality of soft bias side shields 1820, portions of the plurality of first insulating layers 1841, and portions of the plurality of second AFM layers 1825 are removed (e.g., milled). A recess 1827 is formed on the second strip side 452, and a fourth insulating layer 1844 is formed in the recess 1827 on the second strip side 452. The fourth insulating layer 1844 is formed behind the read sensor 1610 along the strip height direction SH1. The fourth insulating layer 1844 is similar to Figure 7 and includes one or more of its aspects, features, components and / or characteristics.

[0101] The fourth insulating layer 1844 is formed behind the soft bias side shield 1820 , the first insulating layer 1841 , and the second AFM layer 1825 (along the stripe height direction SH1 ).

[0102] Figure 19 is a schematic isometric media facing surface (MFS) view of a read head 1900 according to one embodiment. The read head 1900 is similar to Figure 15The read head 1500 shown in FIG. 1 is similar to the read head 1500 shown in FIG. 1 and includes one or more aspects, features, components, and / or characteristics thereof. Figure 17 1700 and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 1900 combines the configuration of common buffer layer 1511 and common AFM layer 1512 with the configuration of read sensor 1710.

[0103] exist Figure 19 In the embodiment shown in FIG, portions of the plurality of soft bias side shields 1920 are removed (e.g., milled). A notch 1927 is formed on the second stripe side 452, and a fourth insulating layer 1944 is formed in the notch 1927 on the second stripe side 452. The fourth insulating layer 1944 is formed behind the spacer layer 1615, layers 1616, 1617, and the cap layer 1618 along the stripe height direction SH1. The fourth insulating layer 1944 is formed behind portions of the soft bias side shields 1920 (along the stripe height direction SH1). The fourth insulating layer 1944 has a width along the cross-track direction CT1 that spans the common lower lead 1505 and the plurality of soft bias side shields 1920.

[0104] The fourth insulating layer 1944 is similar to Figure 8 and includes one or more of its aspects, features, components and / or characteristics.

[0105] Figure 20 is a schematic isometric media facing surface (MFS) view of a read head 2000 according to one embodiment. The read head 2000 is similar to Figure 15 and including one or more of its aspects, features, components and / or characteristics.

[0106] The read head 2000 includes a plurality of soft bias side shields 2020 disposed between and outside the read sensors 1510. A plurality of buffer layers 2060 are disposed on the first insulating layer 1541. A second plurality of AFM layers 2025 are disposed between the buffer layers 2060 and the soft bias side shields 2020.

[0107] Figure 21 is a schematic partially exploded isometric media facing surface (MFS) view of a read head 2100 according to one embodiment. The read head 2100 is similar to Figure 16 The read head 1600 shown in FIG. 1 is similar to the read head 1600 shown in FIG. 1 and includes one or more aspects, features, components and / or characteristics thereof. Figure 20, and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 2100 combines the configuration of soft bias side shields 2020, second plurality of AFM layers 2025, and buffer layer 2060 with the configuration of read sensor 1610.

[0108] Figure 22 is a schematic partially exploded isometric media facing surface (MFS) view of a read head 2200 according to one embodiment. The read head 2200 is similar to Figure 17 The read head 1700 shown in FIG. 1 is similar to the read head 1700 shown in FIG. 1 and includes one or more of its aspects, features, components and / or characteristics. Figure 20 , and includes one or more of its aspects, features, components, and / or characteristics. As an example, the read head 2200 combines the configuration of the soft bias side shields 2020, the second plurality of AFM layers 2025, and the buffer layer 2060 with the configuration of the read sensor 1710.

[0109] Figure 23 is a schematic isometric media facing surface (MFS) view of a read head 2300 according to one embodiment. The read head 2300 is similar to Figure 18 The read head 1800 shown in FIG. 1 is similar to the read head 1800 shown in FIG. 1 and includes one or more aspects, features, components and / or characteristics thereof. Figure 20 , and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 2300 combines the configuration of first and fourth insulating layers 1841 and 1844 with the configuration of second and third insulating layers 442 and 443.

[0110] exist Figure 23 In the embodiment shown in , the fourth insulating layer 1844 is disposed behind (along the stripe height direction SH1) the plurality of buffer layers 2360, the plurality of second AFM layers 2325, and the plurality of soft bias side shields 2320. The buffer layers 2360, 2360 may be non-magnetic and conductive.

[0111] Figure 24 is a schematic isometric media facing surface (MFS) view of a read head 2400 according to one embodiment. The read head 2400 is similar to Figure 20 The read head 2000 shown in FIG. 1 and including one or more of its aspects, features, components and / or characteristics. The read head 2400 is similar to Figure 22, and includes one or more of its aspects, features, components, and / or characteristics. As an example, read head 2400 combines the configuration of second plurality of AFM layers 2025 and buffer layer 2060 with the configuration of read sensor 1710.

[0112] The read head 2400 includes a fourth insulating layer 2444. The fourth insulating layer 2444 is similar to Figure 14 , and includes one or more aspects, features, components, and / or characteristics thereof. The fourth insulating layer 2444 is formed behind the plurality of soft-bias side shields 2420 and a portion of the read sensor 1710 along the strip height direction SH1. The fourth insulating layer 2444 is formed in the recess 2427.

[0113] Figures 25A to 25F A schematic process flow diagram illustrating a method 2500 for forming at least a portion of a read head according to one embodiment. For example, the method 2500 may be used to form Figure 4 At least a portion of the read head 400 shown in FIG.

[0114] Figure 25A The lower shield 401 and lower leads 2505 are shown formed over the lower shield 401 .

[0115] Figure 25B A multilayer structure 2530 is shown formed over the lower lead layer 2505. The multilayer structure 2530 includes a first antiferromagnetic (AFM) layer 2512 and a free layer 2513.

[0116] Figure 25C A photoresist layer 2531 is shown formed on the multilayer structure 2530.

[0117] Figure 25D Sections of the multilayer structure 2530 are shown removed (eg, milled) to form a plurality of read sensors 410. Figure 25D The portion of the lower lead layer 2505 is removed to form one or more lower leads 405. Figure 25D In the embodiment, at least a portion of each segment of the multilayer structure 2530 is removed in a length L2 extending along the up-track direction UT1 to the plurality of lower leads 405, so that the first AFM layer 412 of each read sensor 410 has a first width W1 along the cross-track direction CT1, which is smaller than a second width W2 of each lower lead 405.

[0118] Figure 25E The formation of a first insulating layer 441 and a plurality of second AFM layers 2525 is shown.

[0119] Figure 25FThe angled section 2590 and the vertical section 2591 of the second AFM layer 2525 are shown removed (eg, milled) to form the second AFM layer 425 .

[0120] The upper leads 407 , the second insulating layer 442 , the third insulating layer 443 , and the upper shield 403 may then be formed.

[0121] Benefits of the present disclosure include using soft bias side shields in tape drives to promote low coercivity, enhanced magnetic read operations (eg, higher read density), stability of the soft bias elements, reduced signal shunting, and enhanced device performance.

[0122] It is contemplated that one or more aspects disclosed herein may be combined. As an example, the present disclosure contemplates that aspects of storage device 100, read head 400, read head 500, read head 600, read head 700, read head 800, read head 1000, read head 1100, read head 1200, read head 1300, read head 1400, read head 1500, read head 1600, read head 1700, read head 1800, read head 1900, read head 2000, read head 2100, read head 2200, read head 2300, read head 2400, and / or method 2500 may be combined. Furthermore, it is contemplated that one or more aspects disclosed herein may include some or all of the aforementioned benefits.

[0123] For illustrative purposes, two read sensors are shown for each of the read heads in the figures. The present disclosure contemplates that the read heads may include additional read sensors. For example, the read heads may each include sixteen read sensors. Figure 4 In the embodiment shown in FIG, as an example, the read head 400 is shown as having two read sensors 410. The present disclosure contemplates that the read head 400 may include additional read sensors 410. For example, the read head 400 may be located at Figure 4 Sixteen read sensors 410 are included in the configuration shown in FIG.

[0124] In one embodiment, a read head for a magnetic storage device includes a lower shield, an upper shield, and one or more lower leads disposed between the lower shield and the upper shield. The read head includes a plurality of upper leads disposed above the one or more lower leads along a downtrack direction. Each of the plurality of upper leads and each of the one or more lower leads is non-magnetic and conductive. The read head includes a plurality of read sensors disposed between the one or more lower leads and the plurality of upper leads. Each of the plurality of read sensors includes a multilayer structure, and the multilayer structure includes a first antiferromagnetic (AFM) layer and a free layer. The read head includes a plurality of soft bias side shields disposed between the plurality of read sensors and outside the plurality of read sensors, and a plurality of second AFM layers disposed between the lower shield and the plurality of soft bias side shields. The plurality of second AFM layers are formed of iridium manganese (IrMn). The plurality of second AFM layers are disposed between the plurality of soft bias side shields and the one or more lower leads. The buffer layer of each read sensor is positioned at a first distance relative to the lower shield, and the cap layer of each read sensor is positioned at a second distance relative to the upper shield, the second distance being substantially equal to the first distance. In one example, the first AFM layer of each read sensor is part of a common AFM layer spanning multiple read sensors, the one or more lower leads comprise the common lower lead spanning multiple read sensors, and the buffer layer of each read sensor is part of the common buffer layer spanning multiple read sensors. In one example, the read head includes multiple first insulating layers positioned between the second AFM layer and the common lower lead. In one example, the common AFM layer has a first width along the cross-track direction, and the common lower lead has a second width substantially equal to the first width. Vertical sections and angled sections of the multiple first insulating layers contact multiple soft bias side shields. In one example, the read head includes multiple first insulating layers positioned between the multiple second AFM layers and the one or more lower leads, and the multiple first insulating layers are positioned between the first AFM layer of the read sensor and the multiple soft bias side shields. In one example, the first AFM layer of each read sensor has a first width along the cross-track direction, and each of the one or more lower leads has a second width greater than the first width. A magnetic storage device including a read head is also disclosed.

[0125] In one embodiment, a read head for a magnetic storage device includes a lower shield, an upper shield, and one or more lower leads disposed between the lower shield and the upper shield. The read head includes a plurality of upper leads disposed above the one or more lower leads along a downtrack direction. Each of the one or more lower leads and each of the plurality of upper leads is conductive. The read head includes a plurality of read sensors disposed between the one or more lower leads and the plurality of upper leads. Each of the plurality of read sensors includes a multilayer structure, and the multilayer structure includes a first antiferromagnetic (AFM) layer and a free layer. The read head includes a plurality of soft bias side shields disposed among the plurality of read sensors, and a plurality of second AFM layers disposed between the one or more lower leads and the plurality of soft bias side shields. The multilayer structure includes a buffer layer disposed between the first AFM layer and the one or more lower leads. In one example, the first AFM layer of each read sensor is part of a common AFM layer across multiple read sensors, the buffer layer of each read sensor is part of a common buffer layer across multiple read sensors, and the one or more lower leads comprise the common lower lead across multiple read sensors. In one example, each of the plurality of second AFM layers is formed on a buffer layer among the plurality of buffer layers disposed between the plurality of second AFM layers and the plurality of first insulating layers, and the plurality of first insulating layers are disposed between the plurality of buffer layers and the common lower lead. In one example, each of the plurality of second AFM layers is formed on a buffer layer among the plurality of buffer layers disposed between the plurality of second AFM layers and the plurality of first insulating layers, and the plurality of first insulating layers are disposed between the plurality of buffer layers and the one or more lower leads. The plurality of first insulating layers are disposed between the first AFM layers of the plurality of read sensors and the plurality of buffer layers. A read head comprises a plurality of second insulating layers disposed between and outside the plurality of upper leads, and a third insulating layer disposed between the plurality of upper leads and an upper shield. A magnetic storage device including a read head is also disclosed.

[0126] In one embodiment, a method for forming a read head for a magnetic storage device includes: forming a lower shield; forming a lower lead layer above the lower shield; and forming a multilayer structure above the lower lead layer, the multilayer structure including a first antiferromagnetic (AFM) layer and a free layer. The method includes: removing sections of the multilayer structure to form a plurality of read sensors; forming a plurality of first insulating layers between and outside the plurality of read sensors; and forming a plurality of second AFM layers above the plurality of first insulating layers. The method includes forming a plurality of soft-bias side shields above the plurality of second AFM layers; and forming one or more upper leads. Each of the lower lead layer and the one or more upper leads is non-magnetic and conductive. The method includes forming an upper shield. The one or more upper leads include a plurality of upper leads. The method includes forming a plurality of second insulating layers between and outside the plurality of upper leads, and forming a third insulating layer above the plurality of upper leads and the plurality of second insulating layers. In one example, removing segments of a multilayer structure to form a plurality of read sensors includes removing at least a portion of each segment of the multilayer structure in a length extending along an up-track direction to a lower lead layer, such that a first AFM layer of each read sensor has a first width along a cross-track direction, the first width being less than a second width of the lower lead layer.

[0127] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is to be determined by the claims that follow.

Claims

1. A read head for a magnetic storage device, comprising: lower shield; upper shield; one or more lower leads disposed between the lower shield and the upper shield; a plurality of upper leads disposed above the one or more lower leads in a downtrack direction, wherein each of the plurality of upper leads and each of the one or more lower leads is non-magnetic and electrically conductive; a plurality of read sensors disposed between the one or more lower leads and the plurality of upper leads, wherein The buffer layer of each read sensor is positioned at a first distance relative to the lower shield; the cap layer of each read sensor is positioned at a second distance relative to the upper shield, the second distance being substantially equal to the first distance, and each read sensor of the plurality of read sensors comprises a multi-layer structure comprising: a first antiferromagnetic layer, i.e., a first AFM layer, and Free layer; a plurality of soft-biased side shields positioned between and outside of the plurality of read sensors; and A plurality of second AFM layers are disposed between the lower shield and the plurality of soft-biased side shields. 2 . The read head according to claim 1 , wherein the plurality of second AFM layers are formed of iridium manganese (IrMn). 3 . The read head of claim 2 , wherein the plurality of second AFM layers are disposed between the plurality of soft bias side shields and the one or more lower leads.

4. The read head according to claim 3, wherein: The first AFM layer of each read sensor is part of a common AFM layer across the plurality of read sensors; The one or more lower leads include a common lower lead spanning the plurality of read sensors; and The buffer layer of each read sensor is part of a common buffer layer across the plurality of read sensors. 5 . The read head of claim 4 , further comprising a plurality of first insulating layers disposed between the second AFM layer and the common lower lead. 6 . The read head of claim 5 , wherein the common AFM layer has a first width along a cross-track direction, and the common lower lead has a second width substantially equal to the first width. 7 . The read head of claim 5 , wherein the plurality of vertical segments and the angled segments of the first insulating layer contact the plurality of soft-bias side shields.

8. The read head of claim 1 , further comprising a plurality of first insulating layers disposed between the plurality of second AFM layers and the one or more lower leads, wherein the plurality of first insulating layers are disposed between the first AFM layers of the plurality of read sensors and the plurality of soft bias side shields. 9 . The read head of claim 8 , wherein the first AFM layer of each read sensor has a first width along a cross-track direction, and each of the one or more lower leads has a second width greater than the first width. 10 . A magnetic storage device comprising the read head according to claim 1 .

11. A read head for a magnetic storage device, comprising: lower shield; upper shield; one or more lower leads disposed between the lower shield and the upper shield; a plurality of upper leads disposed above the one or more lower leads in a downtrack direction, wherein each of the one or more lower leads and each of the plurality of upper leads are conductive; a plurality of read sensors disposed between the one or more lower leads and the plurality of upper leads, each of the plurality of read sensors comprising a multi-layer structure comprising: The first antiferromagnetic layer is the first AFM layer. Free Tier; and a buffer layer disposed between the first AFM layer and the one or more lower leads; a plurality of soft-biased side shields positioned between the plurality of read sensors; and A plurality of second AFM layers are disposed between the one or more lower leads and the plurality of soft-biased side shields.

12. The read head of claim 11, wherein: The first AFM layer of each read sensor is part of a common AFM layer across the plurality of read sensors; the buffer layer of each read sensor is part of a common buffer layer across the plurality of read sensors; and The one or more lower leads include a common lower lead spanning the plurality of read sensors.

13. The read head of claim 12, wherein each of the plurality of second AFM layers is formed on a buffer layer among a plurality of buffer layers disposed between the plurality of second AFM layers and a plurality of first insulating layers, wherein the plurality of first insulating layers are disposed between the plurality of buffer layers and the common lower lead.

14. The read head of claim 11 , wherein each of the plurality of second AFM layers is formed on a buffer layer among a plurality of buffer layers disposed between the plurality of second AFM layers and a plurality of first insulating layers, wherein the plurality of first insulating layers are disposed between the plurality of buffer layers and the one or more lower leads, and the plurality of first insulating layers are disposed between the first AFM layer of the read sensor and the plurality of buffer layers.

15. The read head of claim 14, further comprising: a plurality of second insulating layers disposed between the plurality of upper leads and outside the plurality of upper leads; as well as A third insulating layer is disposed between the plurality of upper leads and the upper shield. 16 . A magnetic storage device comprising the read head according to claim 11 .

17. A method of forming a read head for a magnetic storage device, comprising: forming a lower shield; forming one or more lower leads above the lower shield; forming a multilayer structure above the one or more lower lead layers, the multilayer structure comprising: The first antiferromagnetic layer is the first AFM layer. Free Tier; and a buffer layer disposed between the first AFM layer and the one or more lower leads; removing sections of the multilayer structure to form a plurality of read sensors, each read sensor comprising the multilayer structure; forming a plurality of first insulating layers between the plurality of read sensors and outside the plurality of read sensors; forming a plurality of second AFM layers over the plurality of first insulating layers; forming a plurality of soft bias side shields between the plurality of read sensors and over the plurality of second AFM layers, wherein the plurality of second AFM layers are disposed between the one or more lower leads and the plurality of soft bias side shields; forming a plurality of upper leads over the one or more lower leads in a downtrack direction, wherein each of the one or more lower leads and the plurality of upper leads is conductive, wherein the plurality of read sensors are disposed between the one or more lower leads and the plurality of upper leads; and An upper shield is formed, wherein the one or more lower leads are positioned between the lower shield and the upper shield.

18. The method according to claim 17, wherein the method further comprises: forming a plurality of second insulating layers between the plurality of upper leads and outside the plurality of upper leads; forming a third insulating layer over the plurality of upper leads and the plurality of second insulating layers; as well as Wherein, removing the segments of the multilayer structure to form the plurality of read sensors includes removing at least a portion of each segment of the multilayer structure in a length extending along the up-track direction to the one or more lower leads, so that the first AFM layer of each read sensor has a first width along the cross-track direction, and the first width is smaller than a second width of the one or more lower leads.

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