A capacitor

Abstract

The application relates to the technical field of capacitors, in particular to a capacitor which comprises a dielectric main body, a plurality of inner electrodes and an outer electrode, the dielectric main body has a plurality of dielectric layers which are stacked in a first direction; the plurality of inner electrodes are arranged in the dielectric main body and are spaced by the dielectric layers, the inner electrodes comprise a first conductive sheet and a second conductive sheet; the first conductive sheet has a first end and a second end which are opposite in a second direction, the second conductive sheet is connected to the first end along one side which is parallel to a third direction, and a side of the second conductive sheet which is away from the first end is exposed through a surface of the dielectric main body; the outer electrode is arranged at an end of the dielectric main body in the second direction, and the outer electrode is connected to the second conductive sheet. The capacitor of the embodiment of the application is characterized in that the inner electrodes are spaced from the two end surfaces of the dielectric main body, the influence on the connection strength of the outer electrode and the dielectric main body is reduced, the connection reliability of the outer electrode is enhanced, and the overlapping area of the two adjacent inner electrodes can be increased to increase the capacity of the capacitor.

Description

Technical Field

[0001] This invention relates to the field of capacitor technology, and more particularly to a capacitor. Background Technology

[0002] Multilayer ceramic capacitors (MLCCs) are among the most widely used components in various electronic devices and equipment. They are mainly used for DC blocking, coupling, bypassing, filtering, tuning circuits, energy conversion, and control circuits. They are the most basic energy storage components and are widely used in aerospace, military weapons and equipment, various consumer electronics products, and communications.

[0003] Multilayer ceramic capacitors consist of stacked inner electrodes and dielectric layers, as well as outer electrodes connecting the inner electrodes. The inner electrodes and dielectric layers are stacked and sintered to form a chip. The inner electrodes are alternately exposed from both ends of the chip along the stacking direction, and the outer electrodes are bonded to both ends of the chip and connected to the exposed inner electrodes. Because adjacent inner electrodes are staggered along the length of the chip, the steps formed by the stagger are filled by the dielectric layer. When the stagger is small, the steps are also small, and the dielectric layer filling within the steps is prone to detachment or difficult to fill through the dielectric layer's compression. The connection force between the outer electrode and the chip comes from the adhesive force between the outer electrode and the dielectric layer, and has a direct connection with the dielectric layer within the steps. Therefore, the stagger of adjacent inner electrodes should not be too small, i.e., the overlap should not be too large, to ensure the connection strength between the outer electrode and the chip. However, if the stagger of adjacent inner electrodes is too large, it will reduce the overlap area and decrease the capacitor's capacitance. Summary of the Invention

[0004] The main technical problem solved by the embodiments of the present invention is to provide a capacitor that can improve the connection strength between the inner electrode and the outer electrode and the dielectric layer.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in the embodiments of the present invention is as follows: a capacitor is provided, the capacitor including a dielectric body, a plurality of inner electrodes and an outer electrode, the dielectric body having a plurality of dielectric layers stacked therein along a first direction; the plurality of inner electrodes are disposed within the dielectric body, the plurality of inner electrodes being spaced apart by the dielectric layers, the inner electrode including a first conductive sheet and a second conductive sheet; the first conductive sheet has a first end and a second end opposite to each other along a second direction, the second conductive sheet being connected to the first end on a side parallel to a third direction, and the side of the second conductive sheet opposite to the first end being exposed through the surface of the dielectric body; the width of the second conductive sheet along the second direction is smaller than the width of the inner electrode along the third direction; the outer electrode is disposed at the end of the dielectric body along the second direction, the outer electrode being connected to the second conductive sheet; the first direction, the second direction and the third direction are perpendicular to each other.

[0006] In some embodiments, along the first direction, the first conductive sheets of the plurality of internal electrodes overlap each other.

[0007] In some embodiments, when viewed along the first direction, the first conductive sheet is located within the dielectric layer.

[0008] In some embodiments, the width of the dielectric layer protruding from the inner electrode along the second direction is smaller than the width of the dielectric layer protruding from the inner electrode along the third direction.

[0009] In some embodiments, the stepped structure formed by the inner electrode and the adjacent dielectric layer is filled with filler.

[0010] In some embodiments, the internal electrode includes two second conductive sheets, which are connected to the first conductive sheet on both sides parallel to a third direction.

[0011] In some embodiments, the second conductive sheet is flush with the first conductive sheet along the second direction.

[0012] In some embodiments, along the second direction, the width of the second conductive sheet is 0.01% to 10.00% of the chip width.

[0013] In some embodiments, the second conductive sheet extends from the first conductive sheet.

[0014] In some embodiments, the capacitor includes two external electrodes, which are respectively disposed at both ends of the dielectric body; the internal electrode is connected to the external electrode at the first end adjacent to itself.

[0015] Unlike related technologies, the capacitor in this embodiment of the invention features a second conductive sheet exposed from the dielectric body along a third direction. This allows the inner electrode to be spaced apart from the two end faces of the dielectric body, and the outer electrode to be disposed at the end of the dielectric body. This design reduces the influence of the inner electrode on the connection strength between the outer electrode and the dielectric body, enhancing the reliability of the connection. Since the inner electrode has little impact on the connection strength of the outer electrode, the overlap of the inner electrodes can be increased, increasing the overlap area between adjacent inner electrodes and thus increasing the capacitor's capacity. Furthermore, the width of the second conductive sheet along the second direction is smaller than the width of the inner electrode along the third direction, shortening the exposed portion of the inner electrode and reducing the probability of plating solution penetrating into the dielectric body. This mitigates the risk of cracks caused by hydrogen or reducing gas generated by the plating solution within the dielectric body, improving the capacitor's high-temperature and moisture resistance reliability. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0017] Figure 1 This is a schematic diagram of the structure of the capacitor according to an embodiment of the present invention;

[0018] Figure 2 This is a half-sectional view of the capacitor according to an embodiment of the present invention;

[0019] Figure 3 This is a cross-sectional view of a capacitor according to an embodiment of the present invention;

[0020] Figure 4 yes Figure 2 A schematic diagram of the structure in which adjacent dielectric layers and inner electrodes are coupled;

[0021] Figure 5 This is a schematic diagram of the structure of the dielectric body and the inner electrode in an embodiment of the present invention.

[0022] The reference numerals in the detailed embodiments are as follows:

[0023] 100. Capacitor;

[0024] 1. Dielectric body; 11. Dielectric layer; 111. Filler; 12. Covering layer;

[0025] 2. Inner electrode; 21. First conductive sheet; 211. First end; 212. Second end; 22. Second conductive sheet;

[0026] 3. External electrode. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention. It should be noted that, unless otherwise specified, the various features in the embodiments of this invention can be combined with each other, all of which are within the protection scope of this invention. Furthermore, although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed with a different module division or in a different order than that shown in the device schematic diagram or the flowchart.

[0028] In the description of this invention, it should be noted that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" are generally based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0029] In the description of this invention, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0030] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0031] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0032] To solve the above technical problems, such as Figure 1 and Figure 2As shown, an embodiment of the present invention provides a capacitor 100, which includes a dielectric body 1, a plurality of inner electrodes 2, and two outer electrodes 3. The dielectric body 1 provides insulation. The plurality of inner electrodes 2 are spaced apart within the dielectric body 1 along a first direction. The inner electrodes 2 are exposed through the surface of the dielectric body 1, and one exposed end of each inner electrode 2 is connected to the outer electrode 3. The plurality of inner electrodes 2 are alternately connected to two of the outer electrodes 3 along the first direction to form a multilayer capacitor. Optionally, the dielectric body 1 is made of ceramic, and the inner electrodes 2 and the outer electrodes 3 are both made of conductive metal.

[0033] Next, the specific structures of the dielectric body 1, inner electrode 2, and outer electrode 3 will be described in turn.

[0034] For the aforementioned dielectric body 1, such as Figure 1 and Figure 2 As shown, the dielectric body 1 has a plurality of dielectric layers 11 stacked therein along a first direction. The dielectric body 1 is formed by sintering the plurality of dielectric layers 11. The dielectric layers 11 are used to space adjacent inner electrodes 2. A cover layer 12 is provided on the outermost side of the stacked inner electrodes 2 to isolate the inner electrodes 2 from the outside. Along the first direction, the thickness of the cover layer 12 is greater than the thickness of the dielectric layers 11, and the cover layer 12 is made of the same material as the dielectric layers. The two sides of the dielectric body 1 along the second direction are used to connect with the outer electrode 3; the two sides of the dielectric body 1 along the third direction are used to expose the inner electrodes 2 to facilitate connection with the outer electrode 3. Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

[0035] For the aforementioned internal electrode 2, as Figure 3 and Figure 4As shown, the inner electrode 2 includes a first conductive sheet 21 and a second conductive sheet 22; the first conductive sheet 21 has a first end 211 and a second end 212 opposite to each other along a second direction, and the second conductive sheet 22 is connected to the first end 211 on a side parallel to a third direction; the side of the second conductive sheet 22 away from the first end 211 is exposed through the surface of the dielectric body 1, so the inner electrode 2 is exposed from the dielectric body 1 on the side along the third direction. That is, the two end faces of the inner electrode 2 are spaced apart from the dielectric body 1, and the connection strength between the outer electrode 3 and the dielectric body 1 is not easily affected by the inner electrode 2, thereby enhancing the connection reliability between the outer electrode 3 and the dielectric body 1; moreover, since the inner electrode 2 has little impact on the connection strength of the outer electrode 3, the overlap of the inner electrodes 2 can be increased to increase the overlap area of ​​two adjacent inner electrodes 2, increase the effective area for storing charge, and thus increase the capacity of the capacitor 100. Optionally, the second conductive sheet 22 extends from the first conductive sheet 21, meaning the first conductive sheet 21 and the second conductive sheet 22 are integrally manufactured, resulting in good connection, high strength, and enhanced electrical performance. Optionally, an arc-shaped chamfer is provided at the connection point between the second conductive sheet 22 and the first conductive sheet 21. Optionally, the second conductive sheet 22 is formed by punching the inner electrode 2, simplifying the manufacturing process. Optionally, the first conductive sheet 21 is rectangular, and the second conductive sheet 22 is rectangular or right-angled rectangular.

[0036] like Figure 3 As shown, the placement directions of two adjacent inner electrodes 2 along the second direction are opposite, and the inner electrode 2 is connected to the outer electrode 3 of the first end 211 adjacent to itself, so that the inner electrode 2 is alternately connected to the two outer electrodes 3 along the first direction.

[0037] For the first conductive sheet 21 mentioned above, as Figures 2 to 4 As shown, along the first direction, the first conductive sheets 21 of the plurality of inner electrodes 2 overlap each other, and the area of ​​the first conductive sheet 21 is the area of ​​the overlapping region of the inner electrodes 2, that is, the effective area for storing charge, making full use of the space inside the capacitor 100 and increasing the capacity of the capacitor 100.

[0038] like Figures 2 to 4As shown, viewed along the first direction, the first conductive sheet 21 is located within the dielectric layer 11, so that during the sintering process, the first conductive sheet 21 between two adjacent dielectric layers 11 can be enclosed. Furthermore, the width 'a' of the dielectric layer 11 protruding from the inner electrode 2 along the second direction is smaller than the width 'b' of the dielectric layer 11 protruding from the inner electrode 2 along the third direction, to further increase the area ratio of the inner electrode 2 to the dielectric layer 11, increasing the capacitance of the unit volume capacitor 100. Since the two ends of the dielectric layer 11 along the second direction are connected to the outer electrode 3, the two ends of the dielectric body 1 along the second direction are also less prone to breakage. Optionally, the width 'a' is greater than 1 micrometer, and the width 'b' is 10 to 300 micrometers. Further, as... Figure 3 As shown, the stepped structure formed by the inner electrode 2 and the adjacent dielectric layer 11 is filled with filler 111. The filler 111 is made of the same material as the dielectric layer 11. This can improve the problem that the dielectric layer 11 cannot wrap the inner electrode 2 because the distance from the inner electrode 2 is too small. As a result, the area ratio of the inner electrode 2 to the dielectric layer 11 can be further increased.

[0039] For the second conductive sheet 22 mentioned above, as Figure 5 As shown, along the second direction, the second conductive plates 22 of adjacent inner electrodes 2 are spaced apart, thereby facilitating connection to the two outer electrodes 3 respectively. Specifically, as... Figure 4 As shown, the widths of the first end 211 and the second end 212 along the second direction are equal, the width c of the second conductive sheet 22 along the second direction is less than the width d of the first end 211 along the second direction, and the second conductive sheet 22 is disposed adjacent to the end of the inner electrode 2 along the second direction, thus the second conductive sheets 22 of two adjacent inner electrodes 2 are spaced apart along the second direction. Further, as... Figure 4 As shown, along the second direction, the second conductive sheet 22 is flush with the first conductive sheet 21. The second conductive sheet 22 is sufficiently close to the outer electrode 3, reducing the distance of the outer electrode 3 extending towards the center of the dielectric body 1 in a direction parallel to the second direction, reducing the volume of the outer electrode 3, and increasing the spacing between the two outer electrodes 3.

[0040] like Figure 4As shown, the width c of the second conductive sheet 22 along the second direction is smaller than the width e of the inner electrode 2 along the third direction. Therefore, by setting the second conductive sheet 22, the width of the exposed portion of the inner electrode 2 can be shortened, reducing the frequency of delamination and cracks between the dielectric body 1 and the inner electrode 2. This reduces the probability of plating solution penetrating into the dielectric body 1, thereby improving the problem of reduced insulation resistance of the capacitor 100, mitigating the situation where plating solution generates hydrogen or reducing gas within the dielectric body 1, and improving the high-temperature and moisture resistance reliability of the capacitor 100. Optionally, along the second direction, the width c of the second conductive sheet 22 is 0.01% to 10.00% of the chip width f, ensuring the connection effect between the second conductive sheet 22 and the first conductive sheet 21 and the outer electrode 3. The chip includes the plurality of dielectric layers 11 and the plurality of inner electrodes 2. The chip is a whole formed by sintering the dielectric layers 11 and the inner electrodes 2, and the width f of the chip along the second direction is equal to the width f of the dielectric layers 11 along the second direction.

[0041] like Figure 4 As shown, the inner electrode 2 includes two second conductive sheets 22, which are connected to the first conductive sheet 21 on both sides parallel to a third direction. The inner electrode 2 is connected to the outer electrode 3 through the two second conductive sheets 22, enhancing the connection effect. Furthermore, when delamination or cracks occur between one second conductive sheet 22 and the dielectric body 1, they are less likely to spread to the vicinity of the other second conductive sheet 22, further reducing the frequency of delamination and cracks between the dielectric body 1 and the inner electrode 2.

[0042] For the aforementioned external electrode 3, as Figures 1 to 3 As shown, the two external electrodes 3 are disposed at both ends of the dielectric body 1 along the second direction. The two external electrodes 3 extend close to each other along the surface of the dielectric body 1, that is, they approach each other along the middle of the dielectric body 1 parallel to the second direction to form a groove. The bottom of the groove of the external electrode 3 is connected to the end face of the dielectric body 1 along the second direction. The sidewall of the groove is connected to the second conductive sheet 22 to connect the external electrode 3 to the second conductive sheet 22. The sidewall of the groove is also connected to the two side walls of the dielectric body 1 opposite to each other along the first direction, and the two side walls along the third direction, further enhancing the stability of the connection between the external electrode 3 and the dielectric body 1. Furthermore, the sidewall of the groove completely covers the exposed part of the second conductive sheet 22, enhancing the sealing effect of the capacitor 100. Optionally, the side of the external electrode 3 facing away from the dielectric body 1 is curved.

[0043] In this embodiment of the capacitor 100, a second conductive sheet 22 is provided, which is exposed from the dielectric body 1 along a third direction, so that the inner electrode 2 is spaced apart from the two end faces of the dielectric body 1, and the outer electrode 3 is disposed at the end of the dielectric body 1. This makes the connection strength between the outer electrode 3 and the dielectric body 1 less susceptible to the influence of the inner electrode 2, thus enhancing the connection reliability between the outer electrode 3 and the dielectric body 1. Since the inner electrode 2 has little impact on the connection strength of the outer electrode 3, the overlap of the inner electrodes 2 can be increased to increase the overlap area of ​​adjacent inner electrodes 2, thereby increasing the capacitance of the capacitor 100. The inner electrode 2 and the adjacent dielectric body 1... The stepped structure formed by layer 11 is filled with filler, which can improve the problem that the dielectric layer 11 cannot wrap the inner electrode 2 because the distance of the dielectric layer 11 protruding from the inner electrode 2 is too small. As a result, the area ratio of the inner electrode 2 to the dielectric layer 11 can be further increased, thereby further increasing the capacitance of the capacitor 100. In addition, along the second direction, the width of the second conductive sheet 22 is smaller than the width of the first end 211, which can shorten the width of the exposed part of the inner electrode 2, reduce the probability of the plating solution penetrating into the dielectric body 1, improve the situation where the plating solution generates hydrogen or reducing gas in the dielectric body 1 and causes cracks, and improve the high temperature resistance and moisture resistance reliability of the capacitor 100.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; under the concept of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the present invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A capacitor, characterized in that, include: A dielectric body having multiple dielectric layers stacked therein along a first direction; Multiple internal electrodes are disposed within the dielectric body, the multiple internal electrodes being spaced apart by the dielectric layer. Each internal electrode includes a first conductive sheet and a second conductive sheet; the first conductive sheet has a first end and a second end opposite each other along a second direction, the second conductive sheet is connected to the first end on a side parallel to a third direction, and the side of the second conductive sheet opposite to the first end is exposed through the surface of the dielectric body; the width of the second conductive sheet along the second direction is smaller than the width of the internal electrode along the third direction; the internal electrodes are spaced apart from the two end faces of the dielectric body along the second direction; viewed along the first direction, the first conductive sheet is located within the dielectric layer; the width of the dielectric layer protruding from the internal electrode along the second direction is smaller than the width of the dielectric layer protruding from the internal electrode along the third direction; the stepped structure formed by the internal electrode and the adjacent dielectric layer is filled with filler; and An external electrode is disposed at the end of the dielectric body along the second direction. The external electrode has a groove, the bottom of which is connected to the end face of the dielectric body along the second direction, and the sidewall of which is connected to the second conductive sheet. Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

2. The capacitor according to claim 1, characterized in that, Along the first direction, the first conductive sheets of the plurality of internal electrodes overlap each other.

3. The capacitor according to claim 1, characterized in that, The internal electrode includes two second conductive sheets, which are connected to the first conductive sheet on both sides parallel to a third direction.

4. The capacitor according to claim 1, characterized in that, Along the second direction, the second conductive sheet is flush with the first conductive sheet.

5. The capacitor according to claim 1, characterized in that, Along the second direction, the width of the second conductive sheet is 0.01% to 10.00% of the chip width.

6. The capacitor according to claim 1, characterized in that, The second conductive sheet extends from the first conductive sheet.

7. The capacitor according to any one of claims 1 to 6, characterized in that, The capacitor includes two external electrodes, which are respectively disposed at both ends of the dielectric body; the internal electrode is connected to the external electrode at the first end adjacent to itself.

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