Display substrate, display device and method for preparing display substrate

Abstract

The present disclosure provides a display substrate, a display device and a method for preparing a display substrate, which belongs to the field of display technology and can solve the problem of short circuit between adjacent metal traces in existing display substrates. The display substrate disclosed in the present disclosure has a display area and a peripheral area surrounding the display area, wherein the display substrate includes: a substrate, a first conductive layer and a second conductive layer located on the substrate and arranged in sequence along a direction away from the substrate, and a first organic insulating layer located between the first conductive layer and the second conductive layer; the first conductive layer includes: a plurality of first metal traces extending along the first direction; the second conductive layer includes: a plurality of second metal traces extending along the first direction; in the peripheral area, the first organic insulating layer is disconnected, and its edge extends along the second direction and forms a first step; the second direction intersects with the first direction; the first step includes: at least one protruding structure and at least one recessed structure located between adjacent second metal traces.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display substrate, a display device, and a method for preparing the display substrate. Background Art

[0002] During the preparation process of the organic light-emitting diode (OLED) display substrate, multiple layers of organic insulating layers are required to flatten the structure therein. Due to the relatively thick thickness of the organic insulating layer and the structural requirements of binding and bending in the peripheral area of ​​the OLED display substrate, multiple layers of organic insulating layers will be stacked at the edge of the OLED display substrate, forming a relatively thick step.

[0003] At the bottom of the step, underexposure is prone to occur, resulting in metal residue between adjacent metal traces when metal traces are formed on the organic insulating layer, causing a short circuit between adjacent metal traces and damaging the circuit structure, thereby affecting the display effect of the OLED substrate. Summary of the invention

[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provides a display substrate, a display device and a method for preparing the display substrate.

[0005] In a first aspect, an embodiment of the present disclosure provides a display substrate having a display area and a peripheral area surrounding the display area, wherein the display substrate comprises: a substrate, a first conductive layer and a second conductive layer located on the substrate and sequentially arranged in a direction away from the substrate, and a first organic insulating layer located between the first conductive layer and the second conductive layer; the first conductive layer comprises: a plurality of first metal traces extending in a first direction; the second conductive layer comprises: a plurality of second metal traces extending in the first direction;

[0006] In the peripheral area, the first organic insulating layer is disconnected, and its edge extends along a second direction and forms a first step; the second direction intersects with the first direction;

[0007] The first step includes: at least one protruding structure and at least one recessed structure located between adjacent second metal wirings.

[0008] Optionally, the second metal wiring is electrically connected to the first metal wiring at the first step.

[0009] Optionally, the display substrate further comprises: a third conductive layer located on a side of the second conductive layer away from the base, and a second organic insulating layer located between the second conductive layer and the third conductive layer; the third conductive layer comprises: a plurality of third metal traces extending along the first direction;

[0010] In the peripheral area, the second organic insulating layer is disconnected, and its edge extends along the second direction to form a second step;

[0011] The second step includes: at least one protruding structure and at least one recessed structure located between adjacent third metal wirings.

[0012] Optionally, the third metal wiring is electrically connected to the second metal wiring at the second step.

[0013] Optionally, an orthographic projection of the second step on the substrate coincides with an orthographic projection of the first step on the substrate.

[0014] Optionally, the display substrate further includes: a fourth conductive layer located between the first conductive layer and the base and insulated from the first conductive layer; the fourth conductive layer includes: a plurality of fourth metal traces extending along the second direction;

[0015] In the peripheral area, the first organic insulating layer is disconnected, and its edge extends along the first direction to form a third step;

[0016] The third step includes: at least one protruding structure and at least one recessed structure located between adjacent fourth metal wirings.

[0017] Optionally, the first organic insulating layer forms a first water and oxygen blocking groove at the third step.

[0018] Optionally, in the peripheral area, the second organic insulating layer is disconnected, and an edge thereof extends along the first direction to form a fourth step;

[0019] The fourth step includes: at least one protruding structure and at least one recessed structure located between adjacent fourth metal wirings.

[0020] Optionally, the second organic insulating layer forms a second water and oxygen blocking groove at the fourth step.

[0021] Optionally, an orthographic projection of the fourth step on the substrate coincides with an orthographic projection of the third step on the substrate.

[0022] Optionally, the display substrate further comprises: a third organic insulating layer located on a side of the third conductive layer away from the base;

[0023] The third organic insulating layer covers the first step and the second step, and is disconnected at the first water and oxygen blocking groove and the second water and oxygen blocking groove.

[0024] Optionally, the groove structure has a shape of at least one of a semicircle, a triangle, and a square.

[0025] In a second aspect, an embodiment of the present disclosure provides a display device, wherein the display device includes a display substrate as provided above.

[0026] In a third aspect, an embodiment of the present disclosure provides a method for preparing a display substrate, wherein the display substrate has a display area and a peripheral area surrounding the display area, wherein the method for preparing the display substrate comprises:

[0027] Forming a first conductive layer on the substrate, and using a patterning process to form a plurality of first metal traces extending along a first direction;

[0028] forming a first organic insulating layer on the first conductive layer, and patterning the first organic insulating layer so that the first organic insulating layer is disconnected in the peripheral area, and an edge of the first organic insulating layer extends along a second direction to form a first step; wherein the first step includes: at least one protruding structure and at least one recessed structure;

[0029] A second conductive layer is formed on the first organic insulating layer, and a plurality of second metal wirings extending along a first direction are formed by a patterning process, so that at least one protruding structure and at least one recessed structure are provided between adjacent second metal wirings.

[0030] Optionally, a second conductive layer is formed on the first organic insulating layer, and a plurality of second metal traces extending along the first direction are formed by a patterning process, and then the method further includes:

[0031] forming a second organic insulating layer on the second conductive layer, and patterning the second organic insulating layer so that the second organic insulating layer is disconnected in the peripheral area, and an edge of the second organic insulating layer extends along a second direction to form a second step; wherein the second step includes: at least one protruding structure and at least one recessed structure;

[0032] A third conductive layer is formed on the second organic insulating layer, and a plurality of third metal wirings extending along a first direction are formed by a patterning process, so that at least one protruding structure and at least one recessed structure are provided between adjacent third metal wirings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the structure of an exemplary display substrate.

[0034] Figure 2 for Figure 1 The cross-sectional structure diagram of the display substrate along the AA' direction is shown.

[0035] Figure 3 A schematic structural diagram of a display substrate provided in an embodiment of the present disclosure.

[0036] Figure 4 for Figure 3 The figure shows a schematic cross-sectional structure of a display substrate along the BB' direction.

[0037] Figure 5 for Figure 4 A schematic diagram of a top view structure of a display substrate is shown.

[0038] Figure 6 for Figure 3 The figure shows a schematic cross-sectional structure of a display substrate along the CC' direction.

[0039] Figure 7 for Figure 6 A schematic diagram of a top view structure of a display substrate is shown.

[0040] Figure 8 for Figure 4 Another schematic diagram of the top view structure of the display substrate is shown.

[0041] Fig. 9 for Figure 4 Another schematic diagram of the top view structure of the display substrate is shown.

[0042] Fig.10 for Figure 6 Another schematic diagram of the top view structure of the display substrate is shown.

[0043] Fig.11 for Figure 6 Another schematic diagram of the top view structure of the display substrate is shown.

[0044] Fig.12 A schematic flow chart of a method for preparing a display substrate provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the present disclosure is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0046] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] Figure 1 is a schematic diagram of the structure of an exemplary display substrate, such as Figure 1 As shown, the display substrate has a display area and a peripheral area surrounding the display area. Figure 2 for Figure 1 The cross-sectional structure diagram of the display substrate along the AA' direction is shown in FIG. Figure 2 As shown, the display substrate includes: a substrate 100, and multiple conductive layers located on the substrate 100, for example, a first conductive layer 101, a second conductive layer 102, and a third conductive layer 103. Organic insulating layers are arranged between adjacent conductive layers, for example, a first organic insulating layer 201 is arranged between the first conductive layer 101 and the second conductive layer 102, a second organic insulating layer 202 is arranged between the second conductive layer 102 and the third conductive layer 103, and a third organic insulating layer 203 is arranged on the third conductive layer 103.

[0048] The first conductive layer 101 may specifically include a plurality of first metal traces 1011 extending in the first direction, the second conductive layer 102 may specifically include a plurality of second metal traces 1021 extending in the first direction, and the third conductive layer 103 may specifically include a plurality of third metal traces 1031 extending in the first direction. The first organic insulating layer 201, the second organic insulating layer 202, and the third organic insulating layer 203 may not only prevent short circuits between adjacent conductive layers, but also planarize the surfaces of the metal traces in the conductive layers covered thereby to form a relatively flat surface, thereby ensuring adhesion with other film layers.

[0049] The display substrate is also provided with a plurality of signal lines, for example, data lines, scan lines, power signal lines, initialization signal lines, reset signal lines, etc. In order to reduce the resistance of the signal lines in the display substrate, the signal lines are generally formed with a structure of multiple conductive layers. For example, the data lines may be formed with a three-layer structure of a first metal wiring 1011, a second metal wiring 1021, and a third metal wiring 1031. In the peripheral area, the first metal wiring 1011, the second metal wiring 1021, and the third metal wiring 1031 may be electrically connected.

[0050] In order to increase the flatness, the thickness of each organic insulating layer in the display substrate is generally made thicker. For example, the thickness of a single organic insulating layer can reach 1.5 microns to 3 microns, and the thickness of a three-layer organic insulating layer can reach nearly 10 microns. The cross-section of a thicker organic insulating layer has a larger step difference, which is easy to form a higher step. When a conductive layer is formed on it and patterned to form a metal trace, the bottom of the step is prone to insufficient light during exposure, and photoresist residues often appear, resulting in metal residues. There is a risk of short circuits between adjacent metal traces across the cross-section.

[0051] In order to solve at least one of the above-mentioned technical problems, the embodiments of the present disclosure provide a display substrate, a display device and a method for preparing the display substrate. The display substrate, the display device and the method for preparing the display substrate provided by the embodiments of the present disclosure will be further described in detail below in combination with the accompanying drawings and specific implementation methods.

[0052] In a first aspect, an embodiment of the present disclosure provides a display substrate. Figure 3 A schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure is shown in FIG. Figure 3 As shown, the display substrate has a display area and a peripheral area surrounding the display area. Figure 4 for Figure 3 A schematic diagram of a cross-sectional structure of a display substrate along the BB' direction is shown. Figure 5 for Figure 4 A schematic diagram of a top view structure of a display substrate is shown in FIG. Figure 4 and Figure 5As shown, the display substrate includes: a substrate 100, a first conductive layer 101 and a second conductive layer 102 located on the substrate 100 and arranged in sequence along a direction away from the substrate 100, and a first organic insulating layer 201 located between the first conductive layer 101 and the second conductive layer 102; the first conductive layer 101 includes: a plurality of first metal traces 1011 extending along the first direction; the second conductive layer 102 includes: a plurality of second metal traces 1021 extending along the first direction; in the peripheral area, the first organic insulating layer 201 is disconnected, and its edge extends along the second direction and forms a first step 301; the second direction intersects with the first direction; the first step 301 includes: at least one protruding structure a and at least one recessed structure b located between adjacent second metal traces 1021.

[0053] The substrate 100 can be made of a rigid material such as glass, which can improve the bearing capacity of the substrate 100 for other film layers thereon. Of course, the substrate 100 can also be made of a flexible material such as polyimide (PI), which can improve the bending and stretching resistance of the overall display substrate, and avoid the stress generated during bending, stretching, and twisting to cause the substrate 100 to break and cause a short circuit. In practical applications, the material of the substrate 100 can be reasonably selected according to actual needs to ensure that the display substrate has good performance.

[0054] The first conductive layer 101 and the second conductive layer 102 may be made of the same conductive material, for example, one of metal materials such as aluminum, titanium, copper, and molybdenum. The first conductive layer 101 may include: a plurality of first metal traces 1011 extending along the first direction; the second conductive layer 102 may include: a plurality of second metal traces 1021 extending along the first direction. The first metal traces 1011 and the second metal traces 1021 may extend from the display area of ​​the display substrate to the peripheral area. Specifically, the first metal traces 1011 and the second metal traces 1021 may form a film layer of a thin film transistor in the display area, or may form a signal line for transmitting a signal, such as a data line. In the display area, the first metal traces 1011 and the second metal traces 1021 are insulated by a first insulating layer 201, and in the peripheral area, the first metal traces 1011 and the second metal traces 1021 overlap each other to transmit the same data signal.

[0055] In the peripheral area, since the first organic insulating layer 201 is provided in some areas and not provided in some areas, the first organic insulating layer 201 is disconnected, and its edge extends along the second direction to form a first step 301, and the second direction intersects with the first direction, that is, the extension direction of the first step 301 intersects with the extension direction of the first metal wiring 1011 (or the second metal wiring 1021).

[0056] The first step 301 includes at least one protruding structure a and at least one recessed structure b located between adjacent second metal traces 1021. The protruding structure a and the recessed structure b can change the side surface of the first step 301 from an original flat straight-edge section to an uneven curved section.

[0057] In the display substrate provided by the embodiment of the present disclosure, a plurality of first metal wirings 1011 and a plurality of second metal wirings 1021 extend from the display area to the peripheral area in the same direction, and a thicker first organic insulating layer 201 is arranged between the two. In the peripheral area, the first organic insulating layer 201 is arranged to be disconnected, and at the disconnected position, the edge of the first organic insulating layer 201 extends along the second direction and forms a first step 301, and the side of the first step 301 has a convex structure a and a concave structure b, and at least one convex structure a and one concave structure b are arranged between adjacent second metal wirings 1021. When performing the photolithography process, the light receiving area of ​​the photoresist coated at the convex structure a will be greatly increased and can be completely removed. Even if part of the photoresist coated at the concave structure b remains, no continuous residual metal will be formed at the bottom of the entire first step 301, thereby avoiding short circuits between adjacent first metal wirings 1011 and adjacent second metal wirings 1021, thereby improving the display effect of the display substrate.

[0058] In some embodiments, the second metal trace 1021 is electrically connected to the first metal trace 1011 at the first step 301 .

[0059] The second metal wiring 1021 is electrically connected to the first metal wiring 1011 at the first step 301 to form a double-layer signal line, such as a double-layer data line. The double-layer structure can increase the thickness of the signal line, thereby reducing the resistance of the signal line, improving the signal transmission efficiency, and further improving the display effect of the display substrate.

[0060] In some embodiments, Figure 4 and Figure 5 As shown, the display substrate also includes: a third conductive layer 103 located on the side of the second conductive layer 102 away from the substrate 100, and a second organic insulating layer 202 located between the second conductive layer 102 and the third conductive layer 103; the third conductive layer 103 includes: a plurality of third metal wirings 1031 extending along the first direction; in the peripheral area, the second organic insulating layer 202 is disconnected, and its edge extends along the second direction to form a second step 302; the second step 302 includes: at least one protruding structure a and at least one recessed structure b located between adjacent third metal wirings 1031.

[0061] The third conductive layer 102 can be made of the same conductive material as the first conductive layer 101 and the second conductive layer 102, for example, one of the metal materials such as aluminum, titanium, copper, molybdenum, etc. The third conductive layer 103 may include: a plurality of third metal traces 1031 extending along the first direction. Similarly, the third metal traces 1031 may extend from the display area of ​​the display substrate to the peripheral area. Specifically, the third metal traces 1031 may also form a film layer of a thin film transistor in the display area, and may also form a signal line for transmitting signals, such as a data line. In the display area, the third metal traces 1031 and the second metal traces 1021 are insulated by a second insulating layer 202. In the peripheral area, the third metal traces 1031 and the second metal traces 1021 are overlapped with each other to transmit the same data signal.

[0062] In the peripheral area, the second organic insulating layer 202 is disconnected. At the disconnected position, the edge of the second organic insulating layer 202 extends along the second direction and forms a second step 302. The side of the second step 302 has a convex structure a and a concave structure b. At least one convex structure a and one concave structure b are provided between adjacent third metal wirings 1031. When performing the photolithography process, the light receiving area of ​​the photoresist coated at the convex structure a will be greatly increased and can be completely removed. Even if part of the photoresist coated at the concave structure b remains, no continuous residual metal will be formed at the bottom of the entire second step 302, thereby avoiding short circuits between adjacent third metal wirings 1011, thereby improving the display effect of the display substrate.

[0063] In some embodiments, the third metal trace 1031 is electrically connected to the second metal trace 1021 at the second step 302 .

[0064] The third metal wiring 1031 is electrically connected to the second metal wiring 1021 at the second step 302, and can form a signal line with a double-layer structure or even a triple-layer structure, such as a data line with a double-layer structure or a triple-layer structure, which can increase the thickness of the signal line, thereby reducing the resistance of the signal line, improving the signal transmission efficiency, and further improving the display effect of the display substrate.

[0065] In some embodiments, the orthographic projection of the second step 302 on the substrate 100 coincides with the orthographic projection of the first step 301 on the substrate 100 .

[0066] The first step 301 and the second step 302 have the same shape and can be made of the same mask plate during the preparation process, which can reduce the number of mask plates and save preparation costs. At the same time, the first step 301 and the second step 302 completely overlap, which can ensure the stability of the overlap between the first metal wiring 1011, the second metal wiring 1021 and the third metal wiring 1031, and avoid the occurrence of loose overlap and increased contact resistance.

[0067] It should be noted that the first conductive layer 101, the second conductive layer 102 and the third conductive layer 103 mentioned above can all be source-drain conductive layers in the display substrate. For example, the first conductive layer 101 can be specifically a first source-drain conductive layer, which can form the source-drain electrodes of the thin film transistor in the display area, and can also form signal lines such as data lines, the second conductive layer 102 can be specifically a second source-drain conductive layer, and the third conductive layer 103 can be specifically a third source-drain conductive layer, which can form a switching electrode between the drain electrode of the thin film transistor in the display area and the anode of the light-emitting device, and can also form signals such as data lines. It can be understood that in the display substrate, generally, the source-drain conductive layer in the display substrate is set to three layers to achieve the corresponding effect of reducing resistance. Of course, the source-drain conductive layer in the display substrate can also be set to two layers or other numbers. For example, only the first conductive layer 101 (first source-drain conductive layer) and the second conductive layer 102 (second source-drain conductive layer) are provided in the display substrate.

[0068] Figure 6 for Figure 3 A schematic diagram of a cross-sectional structure of a display substrate along the CC' direction is shown. Figure 7 for Figure 6 A schematic diagram of a top view structure of a display substrate is shown in FIG. Figure 6 and Figure 7 As shown, the display substrate also includes: a fourth conductive layer 104 located between the first conductive layer 101 and the base 100 and insulated from the first conductive layer 101; the fourth conductive layer 104 includes: a plurality of fourth metal wirings 1041 extending along the second direction; in the peripheral area, the first organic insulating layer 201 is disconnected, and its edge extends along the first direction to form a third step 303; the third step 303 includes: at least one protruding structure a and at least one recessed structure b located between adjacent fourth metal wirings 1041.

[0069] The fourth conductive layer 104 may specifically be a gate conductive layer, which may be made of one or more metal materials such as gold, silver, aluminum, titanium, copper, molybdenum, etc. An inorganic insulating layer may be provided between the fourth conductive layer 104 and the first conductive layer 101, so that the insulating layer therebetween is formed of one or more of silicon nitride, silicon oxide, and silicon oxynitride. The fourth conductive layer 104 may include: a plurality of fourth metal traces 1041 extending along the second direction, and the fourth metal traces 1041 may extend from the display area of ​​the display substrate to the peripheral area. Specifically, the fourth metal traces 1041 may be scan lines that may transmit gate scan signals.

[0070] In the peripheral area, the first insulating layer 201 can be disconnected. At the disconnected position, the edge of the first organic insulating layer 201 extends along the first direction and forms a third step 303. The side of the third step 303 can have a convex structure a and a concave structure b. At least one convex structure a and a concave structure b are provided between adjacent fourth metal wirings 1041. When performing the photolithography process, the light receiving area of ​​the photoresist coated at the convex structure a will be greatly increased and can be completely removed. Even if part of the photoresist coated at the concave structure b remains, no continuous residual metal (the residual metal is the metal of the second conductive layer 102) will be formed at the bottom of the entire third step 303, thereby avoiding short circuits between adjacent fourth metal wirings 1041, thereby improving the display effect of the display substrate.

[0071] In some embodiments, the first organic insulating layer 101 forms a first water and oxygen blocking groove V1 at the third step 303 .

[0072] The first water and oxygen blocking groove V1 can disconnect the first organic insulating layer 201 to prevent water and oxygen from penetrating from the peripheral area of ​​the display substrate to the display area, thereby preventing water and oxygen from damaging the light-emitting device in the display area. It should be noted that since the inorganic insulating layer is relatively thin and does not conduct water and oxygen, the inorganic insulating layer does not need to be disconnected, so that the first conductive layer 101 will not remain due to the step structure during the preparation process. Figure 6 and Figure 7 The structures of the first conductive layer 101 and the inorganic insulating layer are not shown.

[0073] In some embodiments, in the peripheral region, the second organic insulating layer 202 is disconnected, and its edge extends along the first direction to form a fourth step 304 ; the fourth step 304 includes: at least one protruding structure a and at least one recessed structure b located between adjacent fourth metal traces 1041 .

[0074] In the peripheral area, the second insulating layer 202 can be disconnected. At the disconnected position, the edge of the second organic insulating layer 202 extends along the first direction and forms a fourth step 304. The side of the third step 304 can have a convex structure a and a concave structure b. At least one convex structure a and a concave structure b are provided between adjacent fourth metal wirings 1041. When performing the photolithography process, the light receiving area of ​​the photoresist coated at the convex structure a will be greatly increased and can be completely removed. Even if part of the photoresist coated at the concave structure b remains, no continuous residual metal (the residual metal is the metal of the third conductive layer 103) will be formed at the bottom of the entire third step 303, thereby avoiding short circuits between adjacent fourth metal wirings 1041, thereby improving the display effect of the display substrate.

[0075] In some embodiments, the second organic insulating layer 202 forms a second water and oxygen blocking groove V2 at the fourth step 304 .

[0076] The second water-oxygen blocking groove V2 can disconnect the second organic insulating layer 202, prevent water and oxygen from penetrating from the peripheral area of ​​the display substrate to the display area, and prevent water and oxygen from damaging the light-emitting device in the display area. In practical applications, the fourth step 304 and the third step 303 need to completely overlap, which can reduce the number of mask plates and save preparation costs on the one hand, and on the other hand, the overlap of the two can make the formed first water-oxygen blocking groove V1 and the second water-oxygen blocking groove V2 completely overlap, ensuring that the first organic insulating layer 201 and the second insulating layer 202 are disconnected at the same position to prevent water and oxygen from invading.

[0077] In some embodiments, the display substrate further includes: a third organic insulating layer 203 located on the side of the third conductive layer 103 away from the substrate 100; the third organic insulating layer 203 covers the first step 301 and the second step 302, and is disconnected at the first water and oxygen blocking groove V1 and the second water and oxygen blocking groove V2.

[0078] The third organic insulating layer 203 can further planarize the first step 301 and the second step 302 to ensure adhesion with other film layers. The third organic insulating layer 203 can be disconnected from the first organic insulating layer 201 and the second organic insulating layer 202 at the same position to prevent water and oxygen from invading.

[0079] In some embodiments, Figure 8 for Figure 4 Another schematic diagram of the top view of the display substrate is shown in FIG. Fig. 9 for Figure 4 Another schematic diagram of a top view of a display substrate is shown in FIG. Fig.10 for Figure 6 Another schematic diagram of the top view of the display substrate is shown in FIG. Fig.11 for Figure 6 Another schematic diagram of a top view of the display substrate is shown in FIG. Figures 8 to 11 As shown, the shape of the groove structure b is at least one of a semicircle, a triangle, and a square.

[0080] The shape of the groove structure b can be at least one of a semicircle, a triangle, and a square, so that the side of the step structure formed at the edge of the organic insulating layer can be changed from the original flat straight-edge section to an uneven curved section, which can avoid the formation of continuous residual metal when forming a conductive layer on the organic insulating layer. This can prevent the risk of short circuit between adjacent metal traces across the section, thereby improving the display effect of the display substrate.

[0081] In the second aspect, the embodiments of the present disclosure provide a display device, which includes a display substrate as provided in any of the above embodiments. The display device includes a display substrate as provided in any of the above embodiments. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, etc. The embodiments of the present disclosure do not limit this. Its implementation principle and technical effect are the same as those of the display substrate provided in any of the above embodiments, and will not be repeated here.

[0082] In a third aspect, the present disclosure provides a method for preparing a display substrate. Fig.12 A schematic diagram of a method for preparing a display substrate provided in an embodiment of the present disclosure is shown in FIG. Fig.12 As shown, the method for preparing the display substrate includes the following steps S101 to S103.

[0083] S101, forming a first conductive layer on a substrate, and using a patterning process to form a plurality of first metal traces extending along a first direction.

[0084] S102, forming a first organic insulating layer on the first conductive layer, and patterning the first organic insulating layer so that the first organic insulating layer is disconnected in the peripheral area, and the edge of the first organic insulating layer extends along the second direction to form a first step; wherein the first step includes: at least one protruding structure and at least one recessed structure.

[0085] S103, forming a second conductive layer on the first organic insulating layer, and forming a plurality of second metal wirings extending along the first direction by a patterning process, so that there is at least one protruding structure and at least one recessed structure between adjacent second metal wirings.

[0086] In the preparation method of the display substrate provided by the embodiment of the present disclosure, the multiple first metal wirings and the multiple second metal wirings formed all extend from the display area to the peripheral area along the same direction, and a thicker first organic insulating layer is arranged between the two. In the peripheral area, the first organic insulating layer is arranged to be disconnected, and at the disconnected position, the edge of the first organic insulating layer extends along the second direction and forms a first step, and the side of the first step has a convex structure and a concave structure, and at least one convex structure and one concave structure are arranged between adjacent second metal wirings. When performing the photolithography process, the light receiving area of ​​the photoresist coated at the convex structure will be greatly increased and can be completely removed. Even if part of the photoresist coated at the concave structure remains, no continuous residual metal will be formed at the bottom of the entire first step, thereby avoiding short circuits between adjacent first metal wirings and adjacent second metal wirings, and further improving the display effect of the display substrate.

[0087] In some embodiments, Fig.12 As shown, the method for preparing the display substrate further includes the following steps S104 to S105.

[0088] S104, forming a second organic insulating layer on the second conductive layer, and patterning the second organic insulating layer so that the second organic insulating layer is disconnected in the peripheral area, and the edge of the second organic insulating layer extends along the second direction to form a second step; wherein the second step includes: at least one protruding structure and at least one recessed structure.

[0089] S105, forming a third conductive layer on the second organic insulating layer, and forming a plurality of third metal wirings extending along the first direction by a patterning process, so that there is at least one protruding structure and at least one recessed structure between adjacent third metal wirings.

[0090] In the peripheral area, the formed second organic insulating layer is disconnected, and at the disconnected position, the edge of the second organic insulating layer extends along the second direction and forms a second step, and the side of the second step has a convex structure and a concave structure, and at least one convex structure and one concave structure are arranged between adjacent third metal wirings. When performing the photolithography process, the light receiving area of ​​the photoresist coated at the convex structure will be greatly increased and can be completely removed, and even if part of the photoresist coated at the concave structure remains, no continuous residual metal will be formed at the bottom of the entire second step, thereby avoiding short circuits between adjacent third metal wirings, and further improving the display effect of the display substrate.

[0091] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display substrate, comprising a display area and a peripheral area surrounding the display area, wherein: The display substrate comprises: a base, a first conductive layer and a second conductive layer located on the base and arranged in sequence along a direction away from the base, and a first organic insulating layer located between the first conductive layer and the second conductive layer; the first conductive layer comprises: a plurality of first metal traces extending along a first direction; the second conductive layer comprises: a plurality of second metal traces extending along the first direction; In the peripheral area, the first organic insulating layer is disconnected, and its edge extends along a second direction and forms a first step; the second direction intersects with the first direction; The first step includes: at least one protruding structure and at least one recessed structure located between adjacent second metal traces; The display substrate further comprises: a third conductive layer located on a side of the second conductive layer away from the substrate, and a second organic insulating layer located between the second conductive layer and the third conductive layer; the third conductive layer comprises: a plurality of third metal traces extending along the first direction; In the peripheral area, the second organic insulating layer is disconnected, and its edge extends along the second direction to form a second step; The second step includes: at least one protruding structure and at least one recessed structure located between adjacent third metal traces; The orthographic projection of the second step on the substrate coincides with the orthographic projection of the first step on the substrate, and the orthographic projections of the convex structure and the concave structure of the second step on the substrate coincide with the orthographic projections of the convex structure and the concave structure of the first step on the substrate, respectively.

2. The display substrate according to claim 1, wherein: The second metal wiring is electrically connected to the first metal wiring at the first step.

3. The display substrate according to claim 1, wherein: The third metal wiring is electrically connected to the second metal wiring at the second step.

4. The display substrate according to claim 1, wherein: The display substrate further includes: a fourth conductive layer located between the first conductive layer and the base and insulated from the first conductive layer; the fourth conductive layer includes: a plurality of fourth metal traces extending along the second direction; In the peripheral area, the first organic insulating layer is disconnected, and its edge extends along the first direction to form a third step; The third step includes: at least one protruding structure and at least one recessed structure located between adjacent fourth metal wirings.

5. The display substrate according to claim 4, wherein: The first organic insulating layer forms a first water and oxygen blocking groove at the third step.

6. The display substrate according to claim 5, wherein: In the peripheral area, the second organic insulating layer is disconnected, and its edge extends along the first direction to form a fourth step; The fourth step includes: at least one protruding structure and at least one recessed structure located between adjacent fourth metal wirings.

7. The display substrate according to claim 6, wherein: The second organic insulating layer forms a second water and oxygen blocking groove at the fourth step.

8. The display substrate according to claim 7, wherein: The orthographic projection of the fourth step on the base coincides with the orthographic projection of the third step on the base.

9. The display substrate according to claim 8, wherein: The display substrate further comprises: a third organic insulating layer located on a side of the third conductive layer away from the substrate; The third organic insulating layer covers the first step and the second step, and is disconnected at the first water and oxygen blocking groove and the second water and oxygen blocking groove.

10. The display substrate according to any one of claims 1, 4 and 6, wherein: The shape of the concave structure is at least one of a semicircle, a triangle, and a square.

11. A display device, wherein: The display device comprises the display substrate according to any one of claims 1 to 10.

12. A method for preparing a display substrate, the display substrate having a display area and a peripheral area surrounding the display area, wherein: The method for preparing the display substrate comprises: Forming a first conductive layer on the substrate, and using a patterning process to form a plurality of first metal traces extending along a first direction; forming a first organic insulating layer on the first conductive layer, and patterning the first organic insulating layer so that the first organic insulating layer is disconnected in the peripheral area, and an edge of the first organic insulating layer extends along a second direction to form a first step; wherein the first step includes: at least one protruding structure and at least one recessed structure; Forming a second conductive layer on the first organic insulating layer, and forming a plurality of second metal wirings extending along a first direction by a patterning process, so that there is at least one protruding structure and at least one recessed structure between adjacent second metal wirings; forming a second organic insulating layer on the second conductive layer, and patterning the second organic insulating layer so that the second organic insulating layer is disconnected in the peripheral area, and an edge of the second organic insulating layer extends along a second direction to form a second step; wherein the second step includes: at least one protruding structure and at least one recessed structure; Forming a third conductive layer on the second organic insulating layer, and forming a plurality of third metal wirings extending along the first direction by a patterning process, so that there is at least one protruding structure and at least one recessed structure between adjacent third metal wirings; The orthographic projection of the second step on the substrate coincides with the orthographic projection of the first step on the substrate, and the orthographic projections of the convex structure and the concave structure of the second step on the substrate coincide with the orthographic projections of the convex structure and the concave structure of the first step on the substrate, respectively.

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