A particulate matter capture sensor metal probe device

By using lead-wire limiting connectors in the particulate matter capture sensor, the risks of short circuits and open circuits are eliminated, and stable connections are achieved under high temperature and vibration conditions, ensuring the accuracy and reliability of measurements.

CN115541465BActive Publication Date: 2025-11-28TONGJI UNIV
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Patent Information

Application Number
CN202211204870.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-09-29
Publication Date
2025-11-28
Estimated Expiration
2042-09-29

AI Technical Summary

Technical Problem

Existing particulate matter capture sensors are at risk of short circuits or open circuits, especially under high temperature and vibration conditions, where solder can easily melt, causing signal connection failure and affecting measurement accuracy.

Method used

The lead wire limiting connector is used. By setting connection grooves and soldering grooves in the housing, the wires and chip leads are separated. When the solder melts at high temperature, it is sealed in the soldering groove to prevent the solder from flowing out and ensure a stable connection.

Benefits of technology

This effectively avoids short circuits and open circuits, ensuring reliable connection of the sensor under high temperature and vibration conditions, and improving the accuracy and stability of measurements.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a kind of particulate matter trapping sensor metal probe device, including shell, respectively on the upper and lower ends of shell external lead and particulate matter collector, be arranged in shell and respectively with external lead, particulate matter collector electric connection acquisition chip, and for connecting acquisition chip and external lead lead limiting connection block;Wherein lead limiting connection block includes at least 2 mutually butted limit blocks, the connecting groove of the upper edge and the lower edge of the limit block is opened on the butt joint surface of adjacent limit block, the lead of the external lead, the lead of acquisition chip is embedded and mutually welded in connecting groove.Compared with prior art, the device in the present application can effectively solve short circuit or open circuit problem, and measurement is accurate.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of automobile sensors, and relates to a novel metal probe device of a particulate matter capturing sensor. BACKGROUND

[0002] In order to cope with increasingly stringent requirements for exhaust emission of diesel vehicles, a diesel particulate filter is widely used in diesel vehicles. The diesel particulate filter is mainly installed in an exhaust emission treatment system of a diesel vehicle, and can filter most of the particulate matter (PM) in engine exhaust, so as to make the exhaust emission comply with the regulations.

[0003] For ordinary small diesel vehicles, an electronic control unit (ECU) of the diesel vehicle continuously monitors the exhaust pressure difference between the inlet and outlet of the diesel particulate filter, and uses the monitored exhaust pressure difference to evaluate the amount of soot particles that have been captured in the diesel particulate filter in real time. When the amount of soot particles exceeds a critical value, the ECU instructs the fuel injector in the diesel engine to increase the fuel injection amount, so that more hydrocarbons (HC) are contained in the exhaust gas discharged at the outlet of the engine. The exhaust gas reacts in the oxidation catalyst, so that the exhaust temperature at the outlet of the oxidation catalyst increases, so that the soot particles that have been captured in the diesel particulate filter are burned to regenerate.

[0004] For medium or heavy load diesel vehicles with large engine displacement, it is difficult to accurately deduce the amount of soot particles that have been captured in the diesel particulate filter through the exhaust pressure difference in most cases. Therefore, more and more particulate matter capturing sensors are used to directly and reliably measure the amount of soot in the engine exhaust, and determine the amount of soot accumulated in the diesel particulate filter, so as to provide accurate basis for the regeneration of the diesel particulate filter.

[0005] The existing particulate matter capturing sensor fixes a particulate matter collecting chip in a metal sleeve. One end of the particulate matter collecting chip is arranged at the head of the metal sleeve, and the other end has four signal leads. The four signal leads of the chip are respectively welded to the four leads of the external lead wire, so as to realize the extraction of the collected signals. In actual welding, the signal leads and the external lead wire leads are in contact and then soldered. Since the distance between the adjacent signal leads is close, there is a risk of short circuit during actual assembly. In addition, when the sensor works, the high temperature outside can be transmitted to the welding point under high temperature. Under the working condition for a long time, the soldering tin may be melted. The vibration of the composite product may cause the tin to fall off, so that the connection between the signal leads and the external lead wire leads is disconnected, so that the product cannot work and the product fails.

[0006] Therefore, it is an urgent problem for those skilled in the art to design a novel particulate matter capturing sensor metal probe device which can effectively solve the short circuit or open circuit problem and accurately measure. SUMMARY

[0007] The present application aims to provide a particulate matter capture sensor metal probe device.

[0008] The present application aims to provide a particulate matter capture sensor metal probe device.

[0009] A particulate matter capture sensor metal probe device, comprising a shell, an external lead and a particulate matter collector respectively arranged at the upper and lower ends of the shell, a collection chip arranged in the shell and electrically connected with the external lead and the particulate matter collector, and a lead limiting connecting block for connecting the collection chip and the external lead;

[0010] The lead limiting connecting block comprises at least two limiting blocks arranged opposite to each other, and a connecting groove is arranged on the abutting surface of the adjacent limiting blocks and communicates with the upper edge and the lower edge of the limiting block.

[0011] Further, the connecting groove comprises a welding groove arranged on the abutting surface, and an upper limiting groove communicating with the welding groove and the upper edge of the limiting block, and a lower limiting groove communicating with the welding groove and the lower edge of the limiting block.

[0012] The upper limiting groove and the lower limiting groove opposite to each other respectively form a lead containing hole, which is matched with the lead of the external lead and the lead of the collection chip, so that the lead is sealingly clamped in the lead containing hole.

[0013] Further, the welding grooves opposite to each other form a welding cavity, the extension height of the lead of the external lead and the lead of the collection chip in the welding cavity is not less than half of the extension height of the welding cavity, and the lead of the external lead and the lead of the collection chip are electrically connected by tin soldering, and the amount of solder used is not less than half of the volume of the welding cavity.

[0014] Further, the upper limiting groove and the lower limiting groove are both bent and extended on the abutting surface.

[0015] Further, the shell comprises a probe protection cover, a probe base and a first sleeve connected in sequence from bottom to top, the external lead is fixedly connected with the upper end of the first sleeve, the probe protection cover is open at the bottom end, and the particulate matter collector is arranged in the probe protection cover.

[0016] Further, the external lead and the first sleeve are filled with lead sealing glue between the upper end and the opening.

[0017] Further, the second sleeve for fixing the collection chip is arranged in the probe base.

[0018] Further, the outer sealing glue is filled between the probe base and the second sleeve, and the inner sealing glue is filled between the second sleeve and the collection chip.

[0019] Further, the second sleeve is externally provided with a hexagonal base, and the hexagonal base is externally provided with external threads.

[0020] Further, the probe protective cover comprises an outer probe protective cover and an inner probe protective cover; the outer probe protective cover is connected with the probe base at the upper end and is open at the lower end; the inner probe protective cover is outwardly extended at the outer edge of the upper end and is embedded in the outer probe protective cover, and is open at the lower end and extends out of the lower end opening of the outer probe protective cover.

[0021] The particulate matter collector is arranged in the inner probe protective cover.

[0022] Compared with the prior art, the present application has the following characteristics:

[0023] 1) In the present application, the wire lead and the chip lead are connected in the welding groove of the ceramic sleeve, and the adjacent wire lead and the adjacent chip lead are spaced apart to avoid short circuit caused by mutual contact;

[0024] 2) Since the wire lead and the chip lead block the upper and lower limiting grooves, even if the tin at the connection of the wire lead and the chip lead melts due to high temperature from the outside, the tin will not flow out of the welding groove, and when the temperature cools down, the tin will remain in the welding groove to connect the wire lead and the chip lead, and will not cause the wire lead and the chip lead to be disconnected. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a structural schematic view of a particulate matter capturing sensor metal probe device in the present application;

[0026] Figure 2 It is a three-dimensional structural schematic view of a limiting block;

[0027] Figure 3 It is a front view structural schematic view of a limiting block;

[0028] Figure 4 It is Figure 3 A-A sectional view in the present application;

[0029] MARK DESCRIPTION IN THE DRAWINGS:

[0030] 1-probe base;

[0031] 2-capturing chip;

[0032] 21-chip lead; 22-particulate matter sensitive area;

[0033] 3-probe protective cover;

[0034] 31-inner probe protective cover; 32-outer probe protective cover;

[0035] 4-First sleeve;

[0036] 5-External wires;

[0037] 51-Wire lead;

[0038] 6-Limit block;

[0039] 61-Connecting slot;

[0040] 611 - Upper limit groove; 612 - Welding groove; 613 - Lower limit groove;

[0041] 7-Hexagonal base; 8-Second sleeve; 9-Outer sealant; 10-Inner sealant; 11-Wire sealant. Detailed Implementation

[0042] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0043] Example 1:

[0044] like Figure 1 The particulate matter capture sensor metal probe device shown includes a housing, external wires 5 respectively disposed at the upper and lower ends of the housing and a particulate matter collector 22, a collection chip 2 disposed inside the housing and electrically connected to the external wires 5 and the particulate matter collector 22 respectively, and a lead wire limiting connection block for connecting the collection chip 2 and the external wires 5.

[0045] The lead wire limiting connection block includes at least two mutually mating limiting blocks 6, such as... Figures 2-4 As shown, a connecting groove 61 is provided on the mating surface of the adjacent limiting block 6 to connect the upper edge and the lower edge of the limiting block 6. The lead wire of the external wire 5 and the lead wire of the acquisition chip 2 are embedded and soldered to each other in the connecting groove 61.

[0046] By fixing and limiting the leads and the soldering points between the leads through the connecting groove 61, short circuits and open circuits caused by disconnection or incorrect pin connection are effectively avoided.

[0047] Specifically, the connecting groove 61 includes a welding groove 612 opened on the abutting surface, and an upper limiting groove 611 communicating the welding groove 612 with the upper edge of the limiting block 6, and a lower limiting groove 613 communicating the welding groove 612 with the lower edge of the limiting block 6; the mutually abutting upper limiting grooves 611 and the mutually abutting lower limiting grooves 613 respectively form a lead receiving hole, which is adapted to the lead of the external lead wire 5 and the lead of the collection chip 2, so that the lead is sealingly clamped in the lead receiving hole. At the same time, the mutually abutting welding grooves 612 form a welding cavity, the extension height of the lead of the external lead wire 5 or the lead of the collection chip 2 in the welding cavity is not less than half of the extension height of the welding cavity, and the lead of the external lead wire 5 and the lead of the collection chip 2 are electrically connected by soldering, and the amount of solder used is not less than half of the volume of the welding cavity.

[0048] When the high temperature of the external environment causes the tin at the connection between the lead wire lead and the chip lead to melt, the sealing clamping action between the lead receiving hole and the lead is utilized, so that the solder does not flow out of the welding cavity, and at the same time, since the extension height of the lead wire lead 51 or the chip lead 21 is not less than half of the extension height of the welding cavity, and the amount of solder used is not less than half of the volume of the welding cavity, the molten solder can still ensure the effective electrical connection of the lead wire lead 51 and the chip lead 21. When the temperature cools down, the solder will still remain in the welding groove, re-solidifying the connection of the lead wire lead 51 and the chip lead 21, and will not cause the lead wire lead 51 and the chip lead 21 to be disconnected.

[0049] During installation, the lead wire lead 51 and the chip lead 21 can be abutted in the welding groove 612 of a single limiting block 6, and molten solder can be filled therein until it cools and solidifies, at which point it is substantially flush with the abutting surface, after which a plurality of limiting blocks 6 are combined and abutted and installed in the housing.

[0050] To further enhance the fixing and limiting effect of the upper limiting groove 611 and the lower limiting groove 613 on the lead wire lead 51 and the chip lead 21, the upper limiting groove 611 and the lower limiting groove 613 are designed to be grooves extending in a bent manner on the abutting surface, and the grooves are bent at least twice to avoid the lead wire from being pulled out.

[0051] In some preferred embodiments, the housing includes a probe protection cover 3, a probe base 1, and a first sleeve 4 connected in sequence from bottom to top; and the external lead wire 5 is sealingly and fixedly connected to the upper end of the first sleeve 4 by a lead wire sealing glue 11.

[0052] To ensure the sealing effect and prevent particulate matter from entering the device and damaging the chip, a second sleeve 8 for fixing the collection chip 2 is further provided in the probe base 1, and an external sealing glue 9 is filled between the probe base 1 and the second sleeve 8, and an internal sealing glue 10 is filled between the second sleeve 8 and the collection chip 2.

[0053] To improve the ease of installation on other components of this device, a hexagonal base 7 with threads on its outer wall is also provided on the outside of the second sleeve 8.

[0054] To fully protect the particulate matter collector 22 and facilitate sufficient contact between the particulate matter and the particulate matter collector 22, this embodiment designs the probe protective cover 3 as a double-layer protective structure, specifically including an outer probe protective cover 32 and an inner probe protective cover 31; wherein the upper end of the outer probe protective cover 32 is connected to the probe base 1, and the lower end is open; the upper outer edge of the inner probe protective cover 31 extends outward and is embedded in the outer probe protective cover 32, and the lower end is open and extends out of the lower opening of the outer probe protective cover 32; the particulate matter collector 22 is located inside the inner probe protective cover 31.

[0055] After the exhaust gas is emitted, it passes through the outer protective cover 32 of the probe and enters the inner protective cover 31 of the probe. The particulate matter collector 22 and the collection chip 2 capture and collect the particulate matter in the exhaust gas, and convert it into an electrical signal and output it to the outside through the external wire 5.

[0056] Example 2:

[0057] like Figure 1 The novel particulate matter capture sensor metal probe device shown includes:

[0058] The probe base 1 is hollow inside and has open ends;

[0059] The acquisition chip 2 is located inside the probe base 1. One end of the acquisition chip 2 is provided with a chip lead 21, and the other end is provided with a particulate matter sensitive area, which also serves as a particulate matter collector 22.

[0060] The probe protective cover 3 is fixed to the bottom of the probe base 1, and the particulate matter collector 22 of the acquisition chip 2 is placed inside the probe protective cover 3. The particulate matter collector 22 is connected to the outside of the probe protective cover 3.

[0061] The first sleeve 4 is hollow inside and is fixed to the top of the probe base 1; the chip lead 21 of the acquisition chip 2 is placed inside the first sleeve 4.

[0062] An external wire 5 is placed inside the first sleeve 4, and one end of the external wire 5 is connected to the acquisition chip 2 via a wire lead 51, which is connected to the chip lead 21; the first sleeve 4 has an outlet at the end away from the probe base 1 for the external wire 5 to pass through.

[0063] like Figures 2-4As shown, the limiting block 6 is fixed in the interior of the first sleeve 4, and four connecting grooves 61 are spaced apart in the interior of the limiting block 6; the wire lead 51 is inserted from the top of the connecting groove 61, the chip lead 21 is inserted from the bottom of the connecting groove 61, and the wire lead 51 and the chip lead 21 are welded in the connecting groove 61. The device is applied in the automobile exhaust emission system, can directly and reliably measure the amount of soot in the engine exhaust, and determine the amount of soot accumulated in the diesel particulate filter accordingly, and welding the wire lead 51 and the chip lead 21 in the welding groove 612 can effectively solve the potential short circuit and open circuit problems of the existing products. The wire lead 51 and the chip lead 21 are both provided with four, and correspond to the four connecting grooves 61, and each wire lead 51 and chip lead 21 are connected in the connecting groove 61.

[0064] The beneficial effects of the above technical scheme are that the chip lead 21 and the wire lead 51 are placed in the corresponding connecting groove 61 for welding, the adjacent chip lead 21 and the adjacent wire lead 51 can be separated, and the short circuit phenomenon caused by mutual contact during use can be avoided.

[0065] In order to further optimize the above technical scheme, the connecting groove 61 comprises: an upper limiting groove 611, a welding groove 612 and a lower limiting groove 613; the upper limiting groove 611, the welding groove 612 and the lower limiting groove 613 are sequentially communicated from top to bottom; the wire lead 51 is placed in the upper limiting groove 611 and extends into the welding groove 612; the chip lead 21 is placed in the lower limiting groove 613 and extends into the welding groove 612; the wire lead 51 and the chip lead 21 are welded in the welding groove 612. The connecting ends of the wire lead 51 and the chip lead 21 are welded in the welding groove 612, even if the high temperature of the outside world causes the tin to melt, since the wire lead 51 and the chip lead 21 block the upper limiting groove 611 and the lower limiting groove 613, the tin will not flow out and will remain in the welding groove 612, when the temperature cools down, the tin will remain in the welding groove 612, connecting the wire lead 51 and the chip lead 21, and will not cause the wire lead 51 and the chip lead 21 to be disconnected.

[0066] In order to further optimize the above technical scheme, the upper limiting groove 611, the welding groove 612 and the lower limiting groove 613 are all circular grooves, and the inner diameter of the upper limiting groove 611 and the lower limiting groove 613 is smaller than the inner diameter of the welding groove 612. The wire lead 51 and the chip lead 21 block the ports connecting the upper limiting groove 611, the lower limiting groove 613 and the welding groove 612 respectively, to ensure more accurate connection of the wire lead 51 and the chip lead 21 in the welding groove 612, avoiding disconnection or short circuit problems.

[0067] In order to further optimize the above technical solution, the distance of the wire lead 51 extending into the welding groove 612 is 6-10 mm; the distance of the chip lead 21 extending into the welding groove 612 is 6-10 mm. It can be ensured that the chip lead 21 and the wire lead 51 can be accurately welded in the welding groove 612.

[0068] In order to further optimize the above technical solution, the probe protection cover 3 comprises: a probe inner protection cover 31 and a probe outer protection cover 32; the probe outer protection cover 32 is hollow inside and has open ends, and is fixed to the bottom of the probe base 1; the probe inner protection cover 31 is hollow inside and has open ends, and is fixed to the inside of the probe outer protection cover 32, and the end of the probe inner protection cover 31 away from the probe base 1 extends to the outside of the probe outer protection cover 32; the particulate matter collector 22 is arranged inside the probe inner protection cover 31. After the tail gas is discharged, it enters the inside of the probe through the probe inner protection cover 31 and the probe outer protection cover 32. When the carbon deposit particulate matter adheres to the particulate matter collector 22 of the collection chip 2, the impedance between the electrodes will change. The higher the carbon deposit concentration, the smaller the impedance. The impedance value between the electrodes is collected and calculated, and then the concentration of the particulate matter is deduced. The collection signal is output to the sensor controller through the external lead 5, and the controller performs subsequent signal analysis and processing.

[0069] In order to further optimize the above technical solution, the outside of the probe base 1 is fixed with a hexagonal base 7, and the outer surface of the hexagonal base 7 is provided with threads. In this way, the hexagonal base 7 can be conveniently installed on the pipeline. In addition, in the embodiment, the probe base 1 is welded to the hexagonal base 7, the first sleeve 4, the probe inner protection cover 31 and the probe outer protection cover 32.

[0070] In order to further optimize the above technical solution, the inside of the probe base 1 is fixed with a second sleeve 8, and the outer wall of the second sleeve 8 and the inner wall of the probe base 1 are provided with an external sealant 9. In order to further optimize the above technical solution, the collection chip 2 is arranged inside the second sleeve 8, and the inside of the second sleeve 8 is filled with an internal sealant 10. The arrangement of the external sealant 9 and the internal sealant 10 can ensure that external gas does not enter the inner cavity of the device, and the welding of the wire lead 51 is not corroded.

[0071] In order to further optimize the above technical solution, the external lead 5 is filled with a wire sealant 11 at the outlet of the first sleeve 4. The wire sealant 11 is used to ensure that external gas does not enter the inner cavity of the device from the gap between the external lead 5 and the first sleeve 4.

[0072] In order to further optimize the above technical solution, the first sleeve 4 is selected to be a metal sleeve, and the second sleeve 8 is selected to be a ceramic sleeve. The ceramic sleeve is made of insulating ceramic material, which can reduce the risk of short circuit of adjacent wire leads or chip leads.

[0073] The foregoing description of the embodiments has been presented for the purpose of illustration and description. It is not intended to be exhaustive or to limit the application to the precise form disclosed. Modifications and variations are possible in light of the above teachings or can be acquired from practice of the application. As well, the description is presented in the context of the preferred embodiments as a number of alternatives. It is not intended to limit the application to the precise form described.

Claims

1. A metal probe device for a particulate matter capture sensor, characterized in that, The device includes a housing, external wires (5) and a particulate matter collector (22) respectively located at the upper and lower ends of the housing, a collection chip (2) located inside the housing and electrically connected to the external wires (5) and the particulate matter collector (22), and a lead wire limiting connection block for connecting the collection chip (2) and the external wires (5); The lead wire limiting connection block includes at least two mutually mating limiting blocks (6), and a connecting groove (61) connecting the upper and lower edges of the limiting blocks (6) is opened on the mating surface of the adjacent limiting blocks (6). The lead wires of the external wire (5) and the lead wires of the acquisition chip (2) are embedded and welded to each other in the connecting groove (61). The connecting groove (61) includes a welding groove (612) formed on the mating surface, an upper limit groove (611) connecting the welding groove (612) and the upper edge of the limiting block (6), and a lower limit groove (613) connecting the welding groove (612) and the lower edge of the limiting block (6). The upper limit slot (611) and the lower limit slot (613) that are connected to each other constitute lead wire receiving holes. The lead wire receiving holes are adapted to the lead wires of the corresponding external wires (5) and the lead wires of the acquisition chip (2), so that the lead wires are sealed and snapped into the lead wire receiving holes. The interlocking welding grooves (612) form a welding cavity. The extension height of the lead wire of the external wire (5) or the lead wire of the acquisition chip (2) in the welding cavity is not less than half of the extension height of the welding cavity. The lead wire of the external wire (5) and the lead wire of the acquisition chip (2) are electrically connected by soldering, and the amount of solder is not less than half of the volume of the welding cavity.

2. The metal probe device for a particulate matter capture sensor according to claim 1, characterized in that, The upper limit groove (611) and lower limit groove (613) are both bent and extended on the mating surface.

3. The metal probe device for a particulate matter capture sensor according to claim 1, characterized in that, The housing includes a probe protective cover (3), a probe base (1), and a first sleeve (4) connected sequentially from bottom to top; the external wire (5) is fixedly connected to the upper end of the first sleeve (4); the bottom end of the probe protective cover (3) is open; and the particulate matter collector (22) is located inside the probe protective cover (3).

4. The metal probe device for a particulate matter capture sensor according to claim 3, characterized in that, The space between the external wire (5) and the upper opening of the first sleeve (4) is filled with wire sealant (11).

5. The metal probe device for a particulate matter capture sensor according to claim 3, characterized in that, The probe base (1) is provided with a second sleeve (8) for fixing the acquisition chip (2).

6. The metal probe device for a particulate matter capture sensor according to claim 3, characterized in that, The probe base (1) and the second sleeve (8) are filled with an outer sealant (9), and the second sleeve (8) and the acquisition chip (2) are filled with an inner sealant (10).

7. The metal probe device for a particulate matter capture sensor according to claim 3, characterized in that, The second sleeve (8) is provided with a hexagonal base (7), and the hexagonal base (7) is provided with external threads.

8. The metal probe device for a particulate matter capture sensor according to claim 3, characterized in that, The probe protective cover (3) includes an outer probe protective cover (32) and an inner probe protective cover (31); the upper end of the outer probe protective cover (32) is connected to the probe base (1), and the lower end is open; the upper outer edge of the inner probe protective cover (31) extends outward and is embedded in the outer probe protective cover (32), and the lower end is open and extends out of the lower opening of the outer probe protective cover (32); The particulate matter collector (22) is located inside the protective cover (31) of the probe.

Citation Information

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