Methods and systems for monitoring the film formation quality in inkjet printing manufacturing of novel display devices

Abstract

This invention belongs to the field of inkjet printing manufacturing technology, specifically relating to a method and system for monitoring the film formation quality in the inkjet printing manufacturing of novel display devices. The method includes: configuring a cavity space other than the inkjet printing cavity and the leveling and curing cavity on the inkjet printing system; in this cavity space, for the substrate after inkjet printing and leveling curing, calculating the coordinates of each sampling point of the test pattern; sequentially using a non-contact white light vertical scanning interferometry sensor to perform two-dimensional edge data measurement at each sampling point to determine whether the edge straightness at each sampling point meets the standard; calculating the coordinates of each sampling point in the leveling area of ​​the panel under test, and sequentially using the aforementioned sensor to perform online three-dimensional edge data measurement at each sampling point to determine whether the edge profile contour at each sampling point meets the standard. This invention is a non-contact online detection scheme for thin film edge contours, which, combined with online film thickness measurement, can meet the needs of large-scale, industrialized development in inkjet printing.

Description

Technical Field

[0001] This invention belongs to the field of inkjet printing manufacturing technology, and more specifically, relates to a method and system for monitoring the film formation quality in the inkjet printing manufacturing of novel display devices. Background Technology

[0002] With the development of inkjet printing manufacturing technology and the demand for large-scale, industrialized production, achieving online and efficient detection of film quality in the thin-film printing process is crucial in the manufacturing of new display devices. The uniformity of the thickness within the printed film and the quality of the film's edge contour directly affect the quality of the screen's manufacturing process, the uniformity of light emission when the screen is finally lit, and even the screen's lifespan.

[0003] Currently, online inspection is generally only used to check the consistency of film thickness. However, the edge morphology of the film is also a key indicator for evaluating the inkjet printing film process level and film quality. As display panels develop towards higher quality and more demanding processes, the requirements for inkjet printing technology and film quality will become increasingly stringent. Therefore, improving the efficiency and quality of film edge morphology inspection is extremely important for the production and manufacturing of display panels.

[0004] Currently, the contour detection of film edges is still in the offline detection stage, and offline detection usually uses a profilometer. However, profilometers measure the edge profile contour, which can damage the film under test and can only be used for a very small number of samples. This is not conducive to the online and rapid measurement of the edge contour of inkjet-printed films. Therefore, there is an urgent need for a non-contact online method for film edge contour detection that can maintain the integrity of the sample and meet the high-efficiency development requirements of inkjet printing. Summary of the Invention

[0005] To address the shortcomings and improvement needs of existing technologies, this invention provides a novel method and system for monitoring the film formation quality in inkjet printing manufacturing of display devices. The purpose is to propose a non-contact online detection scheme for film edge contours, which can be combined with online measurement of film thickness to meet the needs of large-scale, industrialized development in inkjet printing.

[0006] To achieve the above objectives, according to one aspect of the present invention, a novel method for monitoring the film formation quality in the inkjet printing manufacturing of display devices is provided, comprising:

[0007] A separate cavity space, other than the thin-film inkjet printing cavity and the leveling and curing cavity, is configured on the inkjet printing system; a single substrate to be tested, after inkjet printing and leveling and curing, is transferred to the cavity space; the following steps are performed in the cavity space to achieve thin-film quality monitoring in the inkjet printing manufacturing of novel display devices:

[0008] Calculate the initial sampling point coordinates (x0, y0) of each test pattern in the detection area of ​​the current substrate to be tested; adjust the distance l of the initial sampling point of each test pattern from the edge of the test pattern in the X and Y directions. x and l y And the number of sampling points m in the X direction and the number of sampling points n in the Y direction are used to calculate the coordinates (x0, y0) of each sampling point of the test pattern. j ) and (x i Based on the coordinates of each sampling point, a non-contact white light vertical scanning interferometric sensor is used to measure the two-dimensional edge data of each sampling point in sequence, and to determine whether the edge straightness at each sampling point meets the standard.

[0009] Calculate the coordinates (X0, Y0) and (X1, Y1) of the diagonal points on each panel under test in the current substrate under test, and use them as the initial sampling point coordinates; adjust the distance l of the initial sampling point from Dam in the X and Y directions for each panel under test. x and l y And the number of sampling points m in the X direction and n in the Y direction, so that each sampling point falls on the area corresponding to the straight line Dam, calculate the coordinates (X0, y0, y0) of each sampling point in the leveling area of ​​the edge of the panel to be tested. j (X1,y) j ), (x i ,Y0),(x i Based on the coordinates of each sampling point, a non-contact white light vertical scanning interferometric sensor is used to perform online measurement of the edge three-dimensional data of each sampling point, and to determine whether the edge profile at each sampling point meets the standard.

[0010] Furthermore, the steps performed within the cavity space also include: online monitoring of the uniformity of the film thickness of a single substrate under test;

[0011] When the dot film thickness of the luminescent area is detected and the pixel pit spacing is known, the implementation method is as follows:

[0012] Determine the initial sampling point coordinates (x0, y0) of each panel light-emitting area on the current substrate under test;

[0013] Determine the distance l from the edge of the initial sampling point in the X and Y directions of each panel to be tested. x and l y Given the number of sampling points m in the X direction and n in the Y direction, calculate the coordinates (x, y, y) of each sampling point in the panel's luminous area. i ,y j The calculation method is as follows: Among them, l x ly The values ​​of m and n must satisfy: D x d is a positive integer multiple x D y d is a positive integer multiple y This ensures that the sampling points of the panel's luminous area fall within a relatively flat interval region outside the pixel pits; where D x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; d x d represents the pixel pit spacing in the X direction; y L is the pixel block spacing in the Y direction; x L y , respectively, are the dimensions of the emitting area in the X and Y directions, which are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling points to the edge of the luminous area in the X and Y directions, respectively, and are the amounts to be adjusted; a l b These are the lengths of the thin film leveling regions at the edges of the luminescent areas in the X and Y directions, respectively, and are known quantities.

[0014] A thin film thickness measurement sensor is used to sequentially collect the film thickness at the coordinates of each sampling point in the light-emitting area of ​​each panel under test, and the film thickness data matrix corresponding to the current substrate under test is obtained.

[0015] Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

[0016] Furthermore, when performing dot film thickness detection on the luminescent area and the pixel pit spacing is unknown or the pixel pit arrangement is irregular, the implementation method is as follows:

[0017] Determine the initial sampling point coordinates (x0, y0) of each panel light-emitting area on the current substrate under test;

[0018] Determine the distance l from the edge of the initial sampling point in the X and Y directions of each panel to be tested. x and l y And the number of sampling points m in the X direction and the number of sampling points n in the Y direction, calculate the coordinates (x, y, y) of each sampling point in the luminous area of ​​the panel under test. i ,y j The calculation method is as follows: Among them, lx l y The values ​​of m and n must satisfy: In the formula, D x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x L y , respectively, are the dimensions of the emitting area in the X and Y directions, which are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling points to the edge of the luminous area in the X and Y directions, respectively, and are the amounts to be adjusted; a l b These are the lengths of the thin film leveling regions at the edges of the luminescent areas in the X and Y directions, respectively, and are known quantities.

[0019] A thin-film dot film thickness measurement sensor is used to sequentially collect the dot film thickness at the coordinates of each sampling point in the light-emitting area of ​​each panel; the average dot film thickness at each sampling point is calculated, and the dot film thickness data that are less than the average value are retained to form the dot film thickness matrix data corresponding to the current substrate under test.

[0020] Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

[0021] Furthermore, when performing spot film thickness detection on a dedicated detection area reserved on the side of the substrate, the implementation method is as follows:

[0022] Determine the initial sampling point coordinates (x0, y0) of each test pattern in the dedicated detection area of ​​the substrate to be tested;

[0023] Determine the distance l from the edge of the initial sampling point in the X and Y directions for each test pattern. x and l y Given the number of sampling points m in the X direction and n in the Y direction, calculate the coordinates (x, y, y) of each sampling point in the test pattern. i ,y j The calculation method is as follows: Among them, l x l y The values ​​of m and n must satisfy: This ensures that the sampling points of the test pattern fall within the relatively flat area of ​​the film's edges; where D... x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x Ly The test pattern dimensions are measured in the X and Y directions, respectively, and are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling points to the edge of the test pattern in the X and Y directions, respectively, and are the amounts to be adjusted; a l b The lengths of the test pattern edges for the film leveling region in the X and Y directions are known quantities.

[0024] A thin film thickness measurement sensor is used to sequentially collect the film thickness at the coordinates of each sampling point of each test pattern to obtain the film thickness data matrix of the current substrate to be tested.

[0025] Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

[0026] Furthermore, the method also includes:

[0027] Online detection of film thickness uniformity was performed on multiple substrates after inkjet printing and leveling curing to determine the substrates with acceptable film thickness uniformity and their corresponding point film thickness data matrix.

[0028] All point film thickness data matrices that meet the film thickness uniformity standard are merged into a point film thickness set. The difference between the maximum and minimum values ​​in the point film thickness set is calculated, and the difference is compared with the average value of the data in the point film thickness set to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity among multiple substrates is determined to meet the standard; otherwise, the film thickness uniformity among multiple substrates is determined to be unacceptable.

[0029] Furthermore, in the online detection of edge linearity, x i and y j The specific calculation formula is as follows: In the formula, D x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x L y The dimensions of the test pattern are known quantities, measured in the X and Y directions respectively.

[0030] A non-contact white light vertical scanning interferometer sensor is used to sequentially acquire two-dimensional topographic images of the area surrounding each sampling point of each test pattern; sampling points in the X direction (x i The coordinates of the intersection point (x, y0) of the line perpendicular to the X direction and the thin film edge line on the two-dimensional topography diagram are (x, y0).i y′ 0i ), and the sampled points (x0, y) marked in the Y direction. j The coordinates (x′) of the intersection point of the line perpendicular to the Y direction and the edge line of the thin film on the two-dimensional topography diagram. 0j y j );

[0031] According to the Y-direction of each test pattern's corresponding mark (x 0j ′,y j ),calculate In the formula, For all x 0j The arithmetic mean of '′'; ξ is the correlation coefficient, determined according to the required accuracy; n is the number of sampling points in the Y direction; if ΔL is less than the straightness measurement index, then the straightness of the test pattern in the Y direction is judged to meet the requirements, otherwise it is not; according to the marked X direction of each test pattern (x i y 0i '),calculate In the formula, For all y 0i ΔL is the arithmetic mean of ΔL'; ξ is the correlation coefficient, determined according to the required accuracy; m is the number of sampling points in the X direction; if ΔL is less than the straightness measurement index, then the straightness of the test pattern in the X direction is judged to meet the requirements, otherwise it is not.

[0032] Furthermore, in the online detection of the edge profile, x i and y j The specific calculation formula is as follows: Among them, l x l y m and n must satisfy: To ensure that the sampling point falls within the region corresponding to the linear Dam; where D x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x L y Let be the dimensions of the Dam graphic on the Panel in the X and Y directions, respectively, which are known quantities; l x l y , respectively, are the distances from the initial sampling point to Dam in the X and Y directions, which are the quantities to be adjusted; r is the radius of the arc-shaped Dam at the apex of the luminous area, which is a known quantity;

[0033] A non-contact white light vertical scanning interferometer is used to sequentially collect the three-dimensional topography data of the area surrounding each sampling point in the leveling area of ​​the edge of each panel under test, and save the height data of the profile along the vertical direction of the Dam line around each sampling point.

[0034] Based on the height data of each panel to be measured, calculate the climbing length L and In the formula, h is the film thickness and Δh is the protrusion height; if L is less than its measurement threshold and ΔH is less than its measurement threshold, then the inkjet printing film quality of the panel to be tested is determined to meet the standard.

[0035] Furthermore, within the same cavity space, online monitoring of the film thickness consistency and edge morphology of the substrate under test is performed to facilitate overall online adjustment of inkjet printing process parameters. The adjustment method is as follows:

[0036] If the film thickness consistency assessment of a single substrate printing fails, then the sampling point location coordinates (x i y j )and The value of h is used to adjust printing process parameters, including print pattern compensation for the corresponding printhead, print spacing adjustment, and path optimization. i,j For sampling point (x) i y j The film thickness at the point is [missing information]. This represents the average point film thickness at all sampling points.

[0037] If the edge straightness assessment of the thin film sample in the test area is unqualified, the printing process parameters are adjusted according to the sampling point location coordinates, the serial number of the test pattern, and the edge straightness assessment parameter values. This includes testing the printing point accuracy of the corresponding nozzle, observing the droplet volume, and optimizing the path.

[0038] If the edge profile of the thin film sample in the luminescent area is not qualified, the printing process parameters are adjusted according to the coordinates of the sampling point, the number of the panel in which the luminescent area is located, and the value of the edge profile evaluation parameters. This includes adjusting the edge printing spacing, observing the ink droplet volume, and optimizing the printing path.

[0039] If the film thickness consistency assessment of multiple substrates fails, then according to The position coordinates of the sampling point (x i y j )and The values ​​are used to adjust printing process parameters, including print pattern compensation for the corresponding printhead, print spacing adjustment, and path optimization. The data set is the collection of film thickness data at all sampling points in the substrate under test where the film thickness uniformity meets the standard; σ is the standard deviation of the elements in this data set.

[0040] If the above-mentioned items pass the evaluation, continue printing while maintaining the printing parameters.

[0041] This invention also provides a novel thin film formation quality monitoring system for inkjet printing manufacturing of display devices, comprising: a thin film inkjet printing chamber, a leveling and curing chamber, an online quality monitoring chamber, a substrate transfer module, and a main control processor; the online quality monitoring chamber is equipped with a substrate adsorption motion module, an inkjet film thickness detection module, and an inkjet film edge morphology detection module.

[0042] The main control processor is used to control the substrate transfer module to transfer the substrate under test between the various cavities, control the substrate adsorption motion module to adsorb the substrate under test transferred by the substrate transfer module, and cooperate with the inkjet film internal dot film thickness detection module and inkjet film edge morphology detection module to perform online detection of film thickness consistency and / or edge straightness and edge profile of inkjet film in the film formation quality monitoring method in inkjet manufacturing of a novel display device as described above, to determine whether the film thickness consistency, edge straightness and edge profile of the inkjet film meet the standards, and is also used to adjust or maintain the printing process parameters based on the judgment results and online detection data;

[0043] The printing film internal dot thickness detection module uses a film dot thickness measurement sensor to measure the dot thickness; the printing film edge morphology detection module uses a non-contact white light vertical scanning interferometer sensor to measure the two-dimensional and three-dimensional morphology of the edge.

[0044] Furthermore, the internal dot film thickness detection module for the inkjet-printed film includes: a first motion component with Y1 and Z1 degrees of freedom, a dot film thickness measurement sensor fixed on the first motion component, a first control and analysis component for the dot film thickness measurement sensor, and a first control component for the first motion component; the measuring end of the dot film thickness measurement sensor is spatially oriented downwards; the first control component controls the movement of the first motion component to drive the dot film thickness measurement sensor to move in the Y and Z directions; the first control and analysis component is connected to the dot film thickness measurement sensor through a signal transmission line, controls the dot film thickness measurement sensor to collect the thickness of the inkjet-printed film according to a trigger signal, analyzes and processes the collected signal and inputs it to the main control processor, wherein the dot film thickness measurement sensor is a thin film dot film thickness measurement sensor;

[0045] The inkjet film edge morphology detection module includes: a second motion component with Y2 and Z2 degrees of freedom, a non-contact white light vertical scanning interferometer sensor fixed on the second motion component, a second control and analysis component for the non-contact white light vertical scanning interferometer sensor, and a second control component for the second motion component; the measuring end of the non-contact white light vertical scanning interferometer sensor is arranged downwards in space; the second control component controls the movement of the second motion component to drive the non-contact white light vertical scanning interferometer sensor to move in the Y and Z directions; the second control and analysis component is connected to the non-contact white light vertical scanning interferometer sensor through a signal transmission line, controls the non-contact white light vertical scanning interferometer sensor to collect the morphology of the inkjet film edge according to the trigger signal, and analyzes and processes the collected signal and inputs it to the main control processor;

[0046] The substrate adsorption motion module includes: a displacement component with X-degree of freedom, a substrate adsorption platform, and a third control component; the displacement component carries the substrate adsorption platform and drives the substrate adsorption platform to move in the X direction; the substrate adsorption platform is used to adsorb and fix the substrate to be tested with a printed inkjet film; the third control component is used to control the movement and adsorption action of the displacement component and the substrate adsorption platform.

[0047] The substrate adsorption motion module works in conjunction with the dot film thickness detection module inside the inkjet film or the edge morphology detection module of the inkjet film to move the dot film thickness measurement sensor or the non-contact white light vertical scanning interferometer sensor to the space above the designated position of the substrate to be tested on which the inkjet film is printed and to perform the detection operation.

[0048] In summary, the above-described technical solutions conceived in this invention can achieve the following beneficial effects:

[0049] This invention adds an additional cavity space to the existing inkjet printing manufacturing system, distinct from the thin-film inkjet printing cavity and the leveling and curing cavity. This cavity space houses an internal film thickness detection module and an edge morphology detection module for the inkjet film. This cavity space does not interfere with the printing operation of the original inkjet printing manufacturing system and allows for expansion of detection configurations or functions. Secondly, the internal film thickness detection module uses a white light spectral thin-film interferometer or a spectral focusing sensor to measure the film thickness. Compared to an ellipsometer, the white light spectral thin-film interferometer or spectral focusing sensor offers higher cost-effectiveness and smaller size, facilitating integration with existing systems and enabling rapid, online measurement of the inkjet film. The edge morphology detection module uses a non-contact white light vertical scanning interferometer to measure the two-dimensional and three-dimensional edge morphology, enabling non-contact and non-destructive scanning measurement of the inkjet film's edge morphology and online monitoring of the inkjet film's edge contour quality. Furthermore, while retaining the function of detecting printed film samples in the reserved detection area on the side of the substrate, this invention adds the detection of the film thickness and the assessment of film thickness consistency in the light-emitting area, making the online monitoring method more universal. Therefore, the method of this invention can monitor multiple test items online under various test conditions, and can realize full closed-loop monitoring and process control of the printed film formation. This is of great significance for improving the film formation quality of the thin film printing process and realizing the large-scale industrial production of thin film printing. Attached Figure Description

[0050] Figure 1 This is a flowchart of the overall method for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device provided in this embodiment of the invention;

[0051] Figure 2 This is a schematic diagram of the detection process provided in an embodiment of the present invention;

[0052] Figure 3 This is a schematic flowchart of a method for obtaining and analyzing a series of point film thickness data of a thin film sample in the light-emitting area or test area on a single substrate, as provided in an embodiment of the present invention.

[0053] Figure 4 This is a schematic diagram of a mode for detecting a series of dots in the light-emitting area with known film thickness and pixel pit spacing, provided in an embodiment of the present invention.

[0054] Figure 5 This is a schematic diagram of a mode for detecting the thickness of a series of dots in the light-emitting area but with unknown pixel pit spacing, provided in an embodiment of the present invention.

[0055] Figure 6 This is a schematic diagram illustrating the pattern of a series of point film thicknesses in a dedicated detection area reserved on the side of the substrate, as provided in an embodiment of the present invention.

[0056] Figure 7This is a schematic diagram of edge linearity monitoring provided in an embodiment of the present invention;

[0057] Figure 8 This is a schematic diagram of a panel provided in an embodiment of the present invention;

[0058] Figure 9 This is a schematic diagram of edge cross-sectional profile monitoring provided in an embodiment of the present invention;

[0059] Figure 10 This is a schematic diagram of the overall system composition for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device, as provided in an embodiment of the present invention.

[0060] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0061] 11 is the thin film inkjet printing chamber, 12 is the control component of the thin film inkjet printing chamber, 21 is the leveling and curing chamber, 22 is the control component of the leveling and curing chamber, 31 is the mechanical motion component, 32 is the substrate transfer and transmission control component, 41 is the first motion component, 42 is the probe of the spot film thickness measurement sensor, 43 is the first control and analysis component, 44 is the first control component, 51 is the second motion component, 52 is the non-contact white light vertical scanning interferometer sensor, 53 is the second control and analysis component, 54 is the second control component, 61 is the displacement component, 62 is the substrate adsorption platform, 63 is the substrate to be tested, 64 is the thin film to be tested, 65 is the third control component, and 7 is the main control processor. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0063] Example 1

[0064] A novel method for monitoring the film formation quality in inkjet printing manufacturing of display devices, such as... Figure 1 As shown, it includes:

[0065] A separate cavity space, other than the thin-film inkjet printing cavity and the leveling and curing cavity, is configured on the inkjet printing system; a single substrate to be tested, after inkjet printing and leveling and curing, is transferred to the cavity space; the following steps are performed in the cavity space to achieve thin-film quality monitoring in the inkjet printing manufacturing of novel display devices:

[0066] Calculate the initial sampling point coordinates (x0, y0) of each test pattern in the detection area of ​​the current substrate to be tested; adjust the distance l of the initial sampling point of each test pattern from the edge of the test pattern in the X and Y directions. x and l y And the number of sampling points m in the X direction and the number of sampling points n in the Y direction are used to calculate the coordinates (x0, y0) of each sampling point of the test pattern. j ) and (x i Based on the coordinates of each sampling point, a non-contact white light vertical scanning interferometric sensor is used to measure the two-dimensional edge data at each sampling point in sequence, and to determine whether the edge straightness at each sampling point meets the standard.

[0067] Calculate the coordinates (X0, Y0) and (X1, Y1) of the diagonal points on each panel under test in the current substrate under test, and use them as the initial sampling point coordinates; adjust the distance l of the initial sampling point from Dam in the X and Y directions for each panel under test. x and l y And the number of sampling points m in the X direction and n in the Y direction, so that each sampling point falls on the area corresponding to the straight line Dam, calculate the coordinates (X0, y0, y0) of each sampling point in the leveling area of ​​the edge of the panel to be tested. j (X1,y) j ), (x i ,Y0),(x i Based on the coordinates of each sampling point, a non-contact white light vertical scanning interferometric sensor is used to perform online measurement of the edge three-dimensional data at each sampling point, and to determine whether the edge profile at each sampling point meets the standard.

[0068] In the monitoring of thin film formation quality during the inkjet printing manufacturing of novel display devices, an existing online measurement method for assessing the film thickness consistency within the printed film is to use an ellipsometer. However, ellipsometers are expensive and bulky, making them unsuitable for integration into the overall inkjet printing manufacturing system. Furthermore, existing online film thickness measurement methods only measure the detection area outside the light-emitting region of the display device, evaluating the consistency of the printed film thickness in the light-emitting area across the entire substrate, without actually detecting the film thickness consistency in the light-emitting region itself. In reality, even on the same substrate, the films printed in the light-emitting and detection areas differ in printing time, space, and substrate structure; therefore, the accuracy of online internal film thickness detection methods needs improvement. Simultaneously, online detection of the film thickness at the central point and the film edge morphology is necessary. Since the detection function of a separately defined detection chamber can be expanded, it can be considered a preferred solution. The steps performed within the aforementioned chamber space can also include: online monitoring of the film thickness consistency at a single substrate under test.

[0069] The specific online monitoring process can be as follows: After the substrate has completed film printing, and after leveling and curing, it enters the same cavity space where the film thickness detection module, the film edge morphology detection module, and the substrate adsorption and movement module are located. For example... Figure 2 As shown, the following steps are performed sequentially: acquiring and analyzing the film thickness data of the light-emitting area or test area thin film sample on a single substrate; acquiring and analyzing the edge straightness of the thin film sample in the test area; and acquiring and analyzing the edge cross-sectional profile of the thin film sample at the panel. After multiple substrates have undergone the above detection steps, the series of film thickness data of the light-emitting area or test area thin film sample on multiple substrates can be acquired and analyzed.

[0070] This embodiment proposes three monitoring modes: the first mode detects the light-emitting area where the pixel pit spacing is known; the second mode detects the light-emitting area but the pixel pit spacing is unknown; the third mode detects a dedicated detection area reserved on the side of the substrate, such as... Figure 3 As shown. The above thin film point thickness measurement sensor can be a white light spectral thin film interferometer sensor or a spectral confocal sensor.

[0071] The first mode can be considered a preferred option, such as... Figure 4 As shown, when the luminescent area is detected and the pixel pit spacing is known, the implementation method of online detection of film thickness consistency of the inkjet film using a dot film thickness detection module inside the inkjet film (excluding the edge leveling area) is as follows:

[0072] Determine the initial sampling point coordinates (x0, y0) of each panel light-emitting area on the current substrate under test;

[0073] Determine the distance l from the edge of the initial sampling point in the X and Y directions of each panel to be tested. x and l y Given the number of sampling points m in the X direction and n in the Y direction, calculate the coordinates (x, y, y) of each sampling point in the panel's luminous area. i ,y j The calculation method is as follows: Among them, under the condition that m and n meet the requirements of detection efficiency and the number of sampling points for film thickness consistency assessment, l x l y The values ​​of m and n must satisfy: D x d is a positive integer multiple x D y d is a positive integer multiple y This ensures that the sampling points of the panel's luminous area fall within a relatively flat interval region outside the pixel pits; where D x D yThese represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; d x d represents the pixel pit spacing in the X direction; y L is the pixel block spacing in the Y direction; x L y , respectively, are the dimensions of the emitting area in the X and Y directions, which are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling points to the edge of the luminous area in the X and Y directions, respectively, and are the amounts to be adjusted; a l b These are the lengths of the thin film leveling regions at the edges of the luminescent areas in the X and Y directions, respectively, and are known quantities.

[0074] A thin-film thickness measurement sensor was used to sequentially collect the film thickness at the coordinates of each sampling point in the light-emitting area of ​​each panel under test, resulting in the film thickness data matrix corresponding to the current substrate under test, as follows:

[0075]

[0076] Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

[0077] The second mode can be considered a preferred option, such as... Figure 5 As shown, when detecting the luminescent area and the pixel pit spacing is unknown or the pixel pit arrangement is irregular, the implementation method of online detection of the film thickness consistency of the inkjet film using the inkjet film internal dot film thickness detection module is as follows:

[0078] Determine the initial sampling point coordinates (x0, y0) of each panel light-emitting area on the current substrate under test;

[0079] Determine the distance l from the edge of the initial sampling point in the X and Y directions of each panel to be tested. x and l y And the number of sampling points m in the X direction and the number of sampling points n in the Y direction, calculate the coordinates (x, y, y) of each sampling point in the luminous area of ​​the panel under test. i ,y j The calculation method is as follows: Among them, under the condition that m and n meet the requirements of detection efficiency and the number of sampling points for film thickness consistency assessment, l x l y The values ​​of m and n must satisfy: In the formula, D x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x L y , respectively, are the dimensions of the emitting area in the X and Y directions, which are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling points to the edge of the luminous area in the X and Y directions, respectively, and are the amounts to be adjusted; a l b These are the lengths of the thin film leveling regions at the edges of the luminescent areas in the X and Y directions, respectively, and are known quantities.

[0080] A thin-film dot thickness measurement sensor is used to sequentially collect the dot film thickness at the coordinates of each sampling point in the light-emitting area of ​​each panel; the average dot film thickness at each sampling point is calculated, and the dot film thickness data that are less than the average value are retained to form the dot film thickness matrix data corresponding to the current substrate under test.

[0081] Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

[0082] The third mode can be considered a preferred option, such as... Figure 6 As shown, when inspecting the reserved inspection area on the side of the substrate, the method for online inspection of the film thickness consistency of the printed film using the internal dot film thickness inspection module is as follows:

[0083] Determine the initial sampling point coordinates (x0, y0) of each test pattern in the dedicated detection area of ​​the substrate to be tested;

[0084] Determine the distance l from the edge of the initial sampling point in the X and Y directions for each test pattern. x and l y Given the number of sampling points m in the X direction and n in the Y direction, calculate the coordinates (x, y, y) of each sampling point in the test pattern. i ,y j The calculation method is as follows: Among them, under the condition that m and n meet the requirements of detection efficiency and the number of sampling points for film thickness consistency assessment, l x l y The values ​​of m and n must satisfy: This ensures that the sampling points of the test pattern fall within the relatively flat area of ​​the film's edges; where D... x Dy These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x L y The test pattern dimensions are measured in the X and Y directions, respectively, and are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling points to the edge of the test pattern in the X and Y directions, respectively, and are the amounts to be adjusted; a l b The lengths of the test pattern edges for the film leveling region in the X and Y directions are known quantities.

[0085] A thin film thickness measurement sensor is used to sequentially collect the film thickness at the coordinates of each sampling point of each test pattern to obtain the film thickness data matrix of the current substrate to be tested.

[0086] Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

[0087] This can be considered a preferred solution, such as... Figure 7 As shown, the implementation method of online detection of the edge straightness of the inkjet film using the inkjet film edge morphology detection module is as follows:

[0088] Determine the initial sampling point coordinates (x0, y0) for each test pattern on the current substrate to be tested;

[0089] Determine the distance l from the edge of the initial sampling point in the X and Y directions for each test pattern. x and l y Given the number of sampling points m in the X direction and n in the Y direction, calculate the coordinates (x0, y0) of each sampling point in the test pattern. j ) and (x i The calculation method is as follows: ,y0) In the formula D x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x L y The test pattern dimensions are measured in the X and Y directions, respectively, and are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling points to the edge of the test pattern in the X and Y directions, respectively.

[0090] A non-contact white light vertical scanning interferometer sensor is used to sequentially acquire two-dimensional topographic images of the area surrounding each sampling point of each test pattern; sampling points in the X direction (x i The coordinates of the intersection point (x, y0) of the line perpendicular to the X direction and the thin film edge line on the two-dimensional topography diagram are (x, y0). i y′ 0i ), and the sampled points (x0, y) marked in the Y direction. j The coordinates (x′) of the intersection point of the line perpendicular to the Y direction and the edge line of the thin film on the two-dimensional topography diagram. 0j y j );

[0091] According to the Y-direction of each test pattern's corresponding mark (x 0j ′,y j ),calculate In the formula, For all x 0j The arithmetic mean of '′'; ξ is the correlation coefficient, determined according to the required accuracy; n is the number of sampling points in the Y direction; if ΔL is less than the straightness measurement index, then the straightness of the test pattern in the Y direction is judged to meet the requirements, otherwise it is not; according to the marked X direction of each test pattern (x i y 0i '),calculate In the formula, For all y 0i ΔL is the arithmetic mean of ΔL'; ξ is the correlation coefficient, determined according to the required accuracy; m is the number of sampling points in the X direction; if ΔL is less than the straightness measurement index, then the straightness of the test pattern in the X direction is judged to meet the requirements, otherwise it is not.

[0092] Monitoring edge straightness can determine the accuracy of ink droplet landing and the uniformity of ink droplet volume, serving as an evaluation indicator of the current printing status. Furthermore, when straightness monitoring reveals substandard substrates, the number of edge morphology detection panels on subsequent substrates should be appropriately increased.

[0093] This can be considered a preferred solution, such as... Figure 8 , Figure 9 As shown, the implementation method of online detection of the edge profile of the inkjet-printed film using the inkjet-printed film edge morphology detection module is as follows:

[0094] Determine the coordinates (X0, Y0) and (X1, Y1) of the diagonal points of each panel under test on the current substrate under test;

[0095] Determine the distance l of the initial sampling point from Dam in the X and Y directions for each Panel under test. x and l yGiven the number of sampling points m in the X direction and n in the Y direction, calculate the coordinates (X0, y0, y0) of each sampling point in the leveling area of ​​the panel edge to be tested. j (X1,y) j ), (x i ,Y0),(x i Y1), the calculation method is as follows: Among them, l x l y m and n must satisfy: To ensure that the sampling point falls within the region corresponding to the linear Dam; where D x D y These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively; L x L y , respectively, are the dimensions of the panel's emitting area in the X and Y directions, which are known quantities; m is the number of sampling points in the X direction, and n is the number of sampling points in the Y direction, which are quantities to be adjusted; l x l y These represent the distances from the initial sampling point to Dam in the X and Y directions, respectively, and are the amounts to be adjusted; x l y , respectively, are the distances from the initial sampling points to the edge of the test pattern in the X and Y directions, which are the amounts to be adjusted; r is the radius of the arc Dam at the apex of the luminous area, which is a known amount;

[0096] A non-contact white light vertical scanning interferometer is used to sequentially collect the three-dimensional topography data of the area surrounding each sampling point in the leveling area of ​​the edge of each panel under test, and save the height data of the profile along the vertical direction of the Dam line around each sampling point.

[0097] Based on the height data of each panel to be measured, calculate the climbing length L and In the formula, h is the film thickness and Δh is the protrusion height; if L is less than its measurement threshold and ΔH is less than its measurement threshold, then the inkjet printing film quality of the panel to be tested is determined to meet the standard.

[0098] For monitoring multiple substrates, a preferred approach includes the following methods:

[0099] Online detection of film thickness uniformity was performed on multiple substrates after inkjet printing and leveling curing to determine the substrates with acceptable film thickness uniformity and their corresponding point film thickness data matrix.

[0100] All point film thickness data matrices that meet the film thickness uniformity standard are merged into a point film thickness set. The difference between the maximum and minimum values ​​in the point film thickness set is calculated, and the difference is compared with the average value of the data in the point film thickness set to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity among multiple substrates is determined to meet the standard; otherwise, the film thickness uniformity among multiple substrates is determined to be unacceptable.

[0101] After completing the above steps, the measured data is used to evaluate and provide feedback on the film formation quality: if the film thickness consistency of a single substrate fails the evaluation, then the returned position coordinates (x...) are used to... i y j )and The values ​​are then used to redo the corresponding printhead pattern compensation, print spacing adjustment, path optimization, and other printing parameter adjustments; if the edge straightness evaluation of the film sample fails, the values ​​are then used based on the returned position coordinates, the sequence number of the test pattern, and... The values ​​are then used to redo the corresponding printhead printing point accuracy test, path optimization, and adjustments to other printing parameters; if the edge cross-sectional contour evaluation of the thin film sample is unqualified, the edge printing spacing and printing path are adjusted and optimized based on the returned position coordinates, the panel number, and the values ​​of L and ΔH; if the film thickness consistency evaluation of multiple substrates is unqualified, the values ​​are then used to adjust the edge printing spacing and optimize the printing path based on the returned position coordinates (x... i y j )and The values ​​are then used to redo the printhead pattern compensation, print spacing adjustment, path optimization, and other printing parameter adjustments. If the above measured items pass the evaluation, the printing parameters are maintained and printing continues. This achieves online monitoring of the film formation quality of the inkjet-printed film and forms a closed-loop feedback control.

[0102] As a preferred embodiment, online monitoring of film thickness consistency and edge morphology of the substrate film can be performed within the same cavity space. This is used for overall online adjustment of inkjet printing process parameters, improving the overall quality of the film. The adjustment method is as follows:

[0103] If the film thickness consistency assessment of a single substrate printing fails, then the sampling point location coordinates (x i y j )and The value of h is used to adjust printing process parameters, including print pattern compensation for the corresponding printhead, print spacing adjustment, and path optimization. i,j For sampling point (x) i y j The film thickness at the point is [missing information]. This represents the average point film thickness at all sampling points.

[0104] If the edge straightness assessment of the thin film sample in the test area is unqualified, the printing process parameters will be adjusted according to the sampling point location coordinates, the serial number of the test pattern, and the edge straightness assessment parameter values, including the corresponding nozzle printing point accuracy test and path optimization.

[0105] If the edge profile of the thin film sample in the light-emitting area is not qualified, the printing process parameters are adjusted according to the coordinates of the sampling point, the number of the panel in which the light-emitting area is located, and the value of the edge profile evaluation parameters, including the adjustment of the edge printing spacing and the optimization of the printing path.

[0106] If the film thickness consistency assessment of multiple substrates fails, then according to The position coordinates of the sampling point (x i y j )and The values ​​are used to adjust printing process parameters, including print pattern compensation for the corresponding printhead, print spacing adjustment, and path optimization. The data set is the collection of film thickness data at all sampling points in the substrate under test where the film thickness uniformity meets the standard; σ is the standard deviation of the elements in this data set.

[0107] If the above-mentioned items pass the evaluation, continue printing while maintaining the printing parameters.

[0108] In summary, the method in this embodiment uses a thin film thickness measurement sensor and a non-contact three-dimensional topography measurement sensor to perform online detection of the consistency of the printed film thickness, the straightness of the edges, and the contour of the edge cross section. It determines whether the consistency of the printed film thickness, the straightness of the edges, and the contour of the edge cross section meet the standards and adjusts or maintains the printing process parameters accordingly.

[0109] Example 2

[0110] A novel thin-film deposition quality monitoring system for inkjet printing manufacturing of display devices, such as Figure 10 As shown, it includes: a thin film inkjet printing chamber, a leveling and curing chamber, an online quality monitoring chamber, a substrate transfer module, and a main control processor; the online quality monitoring chamber is equipped with a substrate adsorption motion module, an internal dot film thickness detection module for the inkjet film, and an edge morphology detection module for the inkjet film.

[0111] The main control processor controls the substrate transfer module to transfer the substrate under test between the various cavities, controls the substrate adsorption motion module to adsorb the substrate under test transferred by the substrate transfer module, and cooperates with the inkjet film internal dot thickness detection module and the inkjet film edge morphology detection module to perform online detection of film thickness consistency and edge straightness and edge profile of the inkjet film in the novel display device inkjet manufacturing film quality monitoring method described in Example 1. It determines whether the inkjet film thickness consistency, edge straightness and edge profile of the inkjet film meet the standards, and also adjusts or maintains the printing process parameters based on the judgment results and online detection data. Among them, the inkjet film internal dot thickness detection module uses a film dot thickness measurement sensor to realize dot thickness measurement; the inkjet film edge morphology detection module uses a non-contact white light vertical scanning interferometer sensor to realize two-dimensional and three-dimensional edge morphology measurement.

[0112] Specifically, the inkjet printing chamber module includes: a thin-film inkjet printing chamber 11 and a thin-film inkjet printing chamber control component 12. The thin-film inkjet printing chamber control component controls the printing action and process parameters of the thin-film inkjet printing chamber. The substrate is inkjet printed inside the thin-film inkjet printing chamber to form a printed thin film.

[0113] The leveling and curing chamber module includes a leveling and curing chamber 21 and a control component 22 for the leveling and curing chamber. The control component 22 controls the process and parameters of the leveling and curing chamber 21. The thin film substrate formed in the inkjet printing chamber is transferred to the leveling and curing chamber module for leveling and curing.

[0114] The substrate transfer module includes a mechanical motion component 31 and a substrate transfer control component 32. The mechanical motion component 31 is used for the transfer and transfer of the substrate between various modules during the thin-film inkjet printing process. The substrate transfer control component 32 is used to control the movement of the mechanical motion component 31.

[0115] As a preferred embodiment, the film thickness detection module inside the inkjet-printed film includes: a first motion component 41 with Y1 and Z1 degrees of freedom, a film thickness measurement sensor probe 42 (white light spectral thin-film interferometer) fixed to the first motion component, a first control and analysis component 43 for the film thickness measurement sensor, and a first control component 44 for the first motion component. The white light spectral thin-film interferometer is fixed to the first motion component 41, and the measuring end of the sensor is positioned downwards in space. The first motion component 41 can drive the film thickness measurement sensor probe 42 to move in the Y and Z directions. The first control and analysis component 43 is connected to the film thickness measurement sensor probe 42 via a signal transmission line. The first control and analysis component controls the film thickness measurement sensor probe to collect the thickness of the inkjet-printed film according to a trigger signal, and analyzes and processes the collected signal to output subsequent data to the main control processor 7. The first control component 44 is used to control the movement of the first motion component 41.

[0116] The inkjet film edge morphology detection module includes: a second motion component 51 with Y2 and Z2 degrees of freedom, a non-contact white light vertical scanning interferometer sensor 52 fixed to the second motion component, a second control and analysis component 53 for the non-contact white light vertical scanning interferometer sensor, and a second control component 54 for the second motion component. The non-contact white light vertical scanning interferometer sensor 52 is fixed to the second motion component 51, with its measuring end facing downwards in space. The second motion component 51 can drive the non-contact white light vertical scanning interferometer sensor 52 to move in the Y and Z directions. The second control and analysis component 53 is connected to the non-contact white light vertical scanning interferometer sensor 52 via a signal transmission line. The second control and analysis component controls the non-contact white light vertical scanning interferometer sensor to acquire the morphology of the inkjet film edge according to a trigger signal, and analyzes and processes the acquired signals to output subsequent data to the main control processor 7. The second control component 54 is used to control the movement of the second motion component.

[0117] The substrate adsorption motion module includes: a displacement component 61 with X-degree of freedom, a substrate adsorption platform 62 disposed on the displacement platform, a substrate to be tested 63 adsorbed on the upper surface of the substrate adsorption platform, a test film 64 printed with inkjet ink on the upper surface of the test substrate, and a third control component 65 for the substrate adsorption motion module. The displacement component 61 can support the substrate adsorption platform 62 and drive the adsorption platform to move in the X direction. The substrate adsorption platform 62 is used to adsorb and fix the test substrate with the inkjet ink film printed on it. The third control component 65 of the substrate adsorption motion module is used to control the movement and adsorption action of the displacement component 61 and the substrate adsorption platform 62.

[0118] The film thickness detection module inside the inkjet-printed film, the edge morphology detection module, and the substrate adsorption and motion module are all located in the same cavity space, which is different from the inkjet printing cavity and the leveling and curing cavity. The substrate adsorption and motion module works in conjunction with the film thickness detection module inside the inkjet-printed film or the edge morphology detection module to move the film thickness measurement sensor or the white light vertical scanning interferometer sensor to the space above a designated position on the substrate with the inkjet-printed film and perform the detection operation.

[0119] The main control processor 7 coordinates and controls the actions and processes of each module through the control component 12 of the thin film inkjet printing chamber, the control component 22 of the leveling and curing chamber, the substrate transfer and transmission control component 32, the first control and analysis component 43, the first control component 44, the second control and analysis component 53, the second control component 54, and the third control component 65 to complete the entire inkjet printing film formation and quality monitoring process.

[0120] The aforementioned inkjet printing film quality monitoring system can perform online detection and film quality assessment of the film thickness consistency of a single substrate, the film thickness consistency of multiple substrates, the straightness of the inkjet printing film edge, and the cross-sectional profile of the inkjet printing film edge during the inkjet printing manufacturing process, providing closed-loop feedback for the inkjet printing process.

[0121] For obtaining a series of dot film thickness data for a single substrate's light-emitting or test area film sample using an internal dot film thickness detection module and a substrate adsorption motion module, a single sample is provided. This sample has the test film 64 printed on the substrate by the inkjet printing chamber 11 and then leveled and cured in the leveling and curing chamber 21. During this process, the sample is transferred from the inkjet printing chamber 11 to the leveling and curing chamber 21 via a substrate transfer module, and then to the substrate adsorption motion module (the substrate adsorption platform). The substrate adsorption platform 62 adsorbs the test substrate 63 and moves it to a designated position below the internal dot film thickness detection module. Then, the main control processor 7 performs the detection operation.

[0122] To obtain the edge straightness of the test area film sample by using a printing film edge morphology detection module and a substrate adsorption motion module, a printing film edge morphology detection module and a substrate adsorption displacement module are provided. A single sample is provided, which has been printed with the film to be tested in the test area of ​​the substrate by the film inkjet printing cavity 11 and has been leveled and cured in the leveling and curing cavity 21. After measuring and analyzing a series of point film thickness data of the film sample in the light-emitting area or test area on the single substrate, the substrate adsorption platform 62 adsorbs the substrate to be tested 63 and moves it to a designated position in the space below the printing film edge morphology detection module, and then the detection operation is performed.

[0123] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A novel method for monitoring the film formation quality in inkjet printing manufacturing of display devices, characterized in that, include: In addition to the thin-film inkjet printing chamber and the leveling and curing chamber, another cavity space is configured on the inkjet printing system; After inkjet printing and leveling curing, a single substrate to be tested is transferred to the cavity space; the following steps are performed in the cavity space to achieve thin film formation quality monitoring in the inkjet printing manufacturing of novel display devices: Calculate the initial sampling point coordinates of each test pattern in the detection area of ​​the substrate to be tested. ; Adjust the distance between the initial sampling point and the edge of the test pattern in both the X and Y directions for each test pattern. and And the number of sampling points m in the X direction and the number of sampling points in the Y direction The coordinates of each sampling point of the test pattern were calculated. )and( Based on the coordinates of each sampling point, a non-contact white light vertical scanning interferometric sensor is used to measure the two-dimensional edge data at each sampling point in sequence, and to determine whether the edge straightness at each sampling point meets the standard. Calculate the coordinates of the diagonal points on each panel under test in the current substrate under test. , Used as the initial sampling point coordinates; adjust the distance of each panel under test from the initial sampling point in the X and Y directions to Dam. and And the number of sampling points m in the X direction and the number of sampling points in the Y direction This ensures that each sampling point falls within the area corresponding to the straight line Dam, and calculates the coordinates of each sampling point in the leveling area of ​​the panel edge to be tested. ), ( ), ( ), ( Based on the coordinates of each sampling point, a non-contact white light vertical scanning interferometric sensor is used to perform online measurement of the edge three-dimensional data at each sampling point, and to determine whether the edge profile at each sampling point meets the standard. In the online detection of edge straightness, and The specific calculation formula is as follows: ; In the formula, These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively. The dimensions of the test pattern are known quantities, measured in the X and Y directions respectively. A non-contact white light vertical scanning interferometer sensor is used to sequentially acquire two-dimensional topographic images of the area surrounding each sampling point of each test pattern; sampling points in the X direction are marked. The coordinates of the intersection point of the line perpendicular to the X direction and the edge line of the thin film on the two-dimensional topography image. and the sampling points marked in the Y direction The coordinates of the intersection point of the line perpendicular to the Y direction and the edge line of the thin film on the two-dimensional topography image. ; According to the Y-direction of each test pattern's corresponding mark ,calculate In the formula, For all The arithmetic mean; The correlation coefficient is determined based on the required precision. The number of sampling points in the Y direction; if If the straightness is less than the straightness measurement index, then the straightness of the test pattern in the Y direction is considered to meet the requirements; otherwise, it is not. Based on the marked X direction values ​​for each test pattern... ,calculate In the formula, For all The arithmetic mean; The correlation coefficient is determined based on the required precision. The number of sampling points in the X direction; if If the straightness is less than the straightness measurement index, then the straightness of the test pattern in the X direction is deemed to meet the requirements; otherwise, it is deemed not to meet the requirements.

2. The method for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device according to claim 1, characterized in that, The steps performed within the cavity space also include: online monitoring of the uniformity of spot film thickness on a single substrate under test; When the dot film thickness of the luminescent area is detected and the pixel pit spacing is known, the implementation method is as follows: Determine the initial sampling point coordinates of each panel emission region on the current substrate under test. ; Determine the distance from the edge of the initial sampling point in the X and Y directions for each panel to be tested. and And the number of sampling points m in the X direction and the number of sampling points in the Y direction Calculate the coordinates of each sampling point in the luminous area of ​​the panel. The calculation method is as follows: ; ;in, , The values ​​of m and n must satisfy: , Multiples of positive integers , Multiples of positive integers This ensures that the sampling points of the panel's luminous area fall within a relatively flat interval region outside the pixel pits; where, These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively. The pixel pit spacing in the X direction; The pixel block spacing in the Y direction; These are the dimensions of the emitting regions in the X and Y directions, respectively, and are known quantities; The number of sampling points in the X direction. The number of sampling points in the Y direction is the amount to be adjusted; , These are the distances from the initial sampling point to the edge of the luminous area in the X and Y directions, respectively, and are the amounts to be adjusted. , These are the lengths of the thin film leveling regions at the edges of the luminescent areas in the X and Y directions, respectively, and are known quantities. A thin film thickness measurement sensor is used to sequentially collect the film thickness at the coordinates of each sampling point in the light-emitting area of ​​each panel under test, and the film thickness data matrix corresponding to the current substrate under test is obtained. Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

3. The method for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device according to claim 2, characterized in that, When performing dot film thickness detection on the luminescent area and the pixel pit spacing is unknown or the pixel pit arrangement is irregular, the implementation method is as follows: Determine the initial sampling point coordinates of each panel emission region on the current substrate under test. ; Determine the distance from the edge of the initial sampling point in the X and Y directions for each panel to be tested. and And the number of sampling points m in the X direction and the number of sampling points in the Y direction Calculate the coordinates of each sampling point in the luminous area of ​​the panel under test. The calculation method is as follows: ; ;in, , The values ​​of m and n must satisfy: In the formula, These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively. These are the dimensions of the emitting regions in the X and Y directions, respectively, and are known quantities; The number of sampling points in the X direction. The number of sampling points in the Y direction is the amount to be adjusted; , These are the distances from the initial sampling point to the edge of the luminous area in the X and Y directions, respectively, and are the amounts to be adjusted. , These are the lengths of the thin film leveling regions at the edges of the luminescent areas in the X and Y directions, respectively, and are known quantities. A thin-film dot film thickness measurement sensor is used to sequentially collect the dot film thickness at the coordinates of each sampling point in the light-emitting area of ​​each panel; the average dot film thickness at each sampling point is calculated, and the dot film thickness data that are less than the average value are retained to form the dot film thickness matrix data corresponding to the current substrate under test. Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

4. The method for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device according to claim 2, characterized in that, When performing spot film thickness detection on a dedicated detection area reserved on the side of the substrate, the implementation method is as follows: Determine the initial sampling point coordinates of each test pattern in the dedicated testing area of ​​the substrate to be tested. ; Determine the distances from the initial sampling points of each test pattern to the edge of the test pattern in both the X and Y directions. and And the number of sampling points m in the X direction and the number of sampling points in the Y direction Calculate the coordinates of each sampling point of the test pattern. The calculation method is as follows: ; ;in, , The values ​​of m and n must satisfy: This ensures that the sampling points of the test pattern fall within a relatively flat area of ​​the film; where, These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively. The dimensions of the test pattern are known quantities, measured in the X and Y directions respectively. The number of sampling points in the X direction. The number of sampling points in the Y direction is the amount to be adjusted; , These are the distances from the initial sampling points to the edge of the test pattern in the X and Y directions, respectively, and are the amounts to be adjusted. , The lengths of the test pattern edges for the film leveling region in the X and Y directions are known quantities. A thin film thickness measurement sensor is used to sequentially collect the film thickness at the coordinates of each sampling point of each test pattern to obtain the film thickness data matrix of the current substrate to be tested. Calculate the difference between the maximum and minimum values ​​in the point film thickness data matrix, and then compare this difference with the average value of the data in the point film thickness data matrix to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity of the current substrate under test is determined to meet the standard; otherwise, it is determined to fail to meet the standard.

5. A method for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device according to any one of claims 2 to 4, characterized in that, The method also includes: Online detection of film thickness uniformity is performed on multiple substrates to be tested after inkjet printing and leveling and curing to determine the substrates to be tested with film thickness uniformity that meet the standard and their corresponding point film thickness data matrix. All point film thickness data matrices that meet the film thickness uniformity standard are merged into a point film thickness set. The difference between the maximum and minimum values ​​in the point film thickness set is calculated, and the difference is compared with the average value of the data in the point film thickness set to obtain a percentage. If the percentage is not greater than the threshold, the film thickness uniformity among multiple substrates is determined to meet the standard; otherwise, the film thickness uniformity among multiple substrates is determined to be unacceptable.

6. The method for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device according to claim 1, characterized in that, In the online detection of the edge profile, and The specific calculation formula is as follows: ; ;in, , m and n must satisfy: So that the sampling point falls within the region corresponding to the linear Dam; where, These represent the spacing between every two adjacent sampling points in the X and Y directions, respectively. The dimensions of the Dam graphic on the Panel in the X and Y directions are known quantities. , These are the distances from the initial sampling point to Dam in the X and Y directions, respectively, and are the amounts to be adjusted. Let be the radius of the arc Dam at the apex of the luminous region, which is a known quantity; A non-contact white light vertical scanning interferometer is used to sequentially collect the three-dimensional topography data of the area surrounding each sampling point in the leveling area of ​​the edge of each panel under test, and save the height data of the profile along the vertical direction of the Dam line around each sampling point. Based on the height data of each panel to be measured, calculate the climbing length L and In the formula, h is the film thickness. The height of the protrusion; if L is less than its measurement threshold and If the quality of the inkjet-printed film of the panel is less than the threshold value of its measurement index, it is determined that the quality meets the standard.

7. A method for monitoring the film formation quality in the inkjet printing manufacturing of a novel display device according to claim 2, characterized in that, Within the same cavity space, online monitoring of the substrate film thickness consistency and edge morphology is performed for overall online adjustment of inkjet printing process parameters. The adjustment method is as follows: If the film thickness consistency assessment of a single substrate printing fails, then the sampling point location coordinates will be used as a basis. , )and The values ​​are used to adjust printing process parameters, including print pattern compensation for the corresponding printhead, print spacing adjustment, and path optimization. For sampling points ( , The film thickness at the point is [missing information]. This represents the average point film thickness at all sampling points. If the edge straightness assessment of the thin film sample in the test area is unqualified, the printing process parameters are adjusted according to the sampling point location coordinates, the serial number of the test pattern, and the edge straightness assessment parameter values. This includes testing the printing point accuracy of the corresponding nozzle, observing the droplet volume, and optimizing the path. If the edge profile of the thin film sample in the luminescent area is not qualified, the printing process parameters are adjusted according to the coordinates of the sampling point, the number of the panel in which the luminescent area is located, and the value of the edge profile evaluation parameters. This includes adjusting the edge printing spacing, observing the ink droplet volume, and optimizing the printing path. If the film thickness consistency assessment of multiple substrates fails, then according to The location coordinates of the sampling point ( , )and The values ​​are used to adjust printing process parameters, including print pattern compensation for the corresponding printhead, print spacing adjustment, and path optimization. This is a collection of point film thickness data from all sampling points in the substrate under test, ensuring that the film thickness uniformity meets the standards. Let be the standard deviation of the elements in the film thickness data set at that point; If the above-mentioned items pass the evaluation, continue printing while maintaining the printing parameters.

8. A novel thin-film formation quality monitoring system for inkjet printing manufacturing of display devices, characterized in that, include: Thin film inkjet printing chamber, leveling and curing chamber, online quality monitoring chamber, substrate transfer module and main control processor; The online quality monitoring chamber is equipped with a substrate adsorption motion module, a film thickness detection module for the inside of the inkjet film, and a film edge morphology detection module for the inkjet film. The main control processor is used to control the substrate transfer module to transfer the substrate under test between the various cavities, control the substrate adsorption motion module to adsorb the substrate under test transferred by the substrate transfer module, and cooperate with the inkjet film thickness detection module and the inkjet film edge morphology detection module to perform online detection of film thickness consistency and / or edge straightness and edge profile of the inkjet film in the inkjet manufacturing of a novel display device as described in any one of claims 1 to 7, determine whether the inkjet film thickness consistency, edge straightness and edge profile of the inkjet film meet the standards, and also to adjust or maintain the printing process parameters based on the determination results and online detection data; The printing film internal dot thickness detection module uses a film dot thickness measurement sensor to measure the dot thickness; the printing film edge morphology detection module uses a non-contact white light vertical scanning interferometer sensor to measure the two-dimensional and three-dimensional morphology of the edge.

9. A novel thin-film formation quality monitoring system for inkjet printing manufacturing of display devices according to claim 8, characterized in that, The internal dot film thickness detection module for the inkjet-printed film includes: a first motion component with Y1 and Z1 degrees of freedom, a dot film thickness measurement sensor fixed on the first motion component, a first control and analysis component for the dot film thickness measurement sensor, and a first control component for the first motion component; the measuring end of the dot film thickness measurement sensor is spatially downward; the first control component controls the movement of the first motion component to drive the dot film thickness measurement sensor to move in the Y and Z directions; the first control and analysis component is connected to the dot film thickness measurement sensor through a signal transmission line, controls the dot film thickness measurement sensor to collect the thickness of the inkjet-printed film according to a trigger signal, analyzes and processes the collected signal and inputs it to the main control processor, wherein the dot film thickness measurement sensor is a thin film dot film thickness measurement sensor; The inkjet film edge morphology detection module includes: a second motion component with Y2 and Z2 degrees of freedom, a non-contact white light vertical scanning interferometer sensor fixed on the second motion component, a second control and analysis component for the non-contact white light vertical scanning interferometer sensor, and a second control component for the second motion component; the measuring end of the non-contact white light vertical scanning interferometer sensor is arranged downwards in space; the second control component controls the movement of the second motion component to drive the non-contact white light vertical scanning interferometer sensor to move in the Y and Z directions; the second control and analysis component is connected to the non-contact white light vertical scanning interferometer sensor through a signal transmission line, controls the non-contact white light vertical scanning interferometer sensor to collect the morphology of the inkjet film edge according to the trigger signal, and analyzes and processes the collected signal and inputs it to the main control processor; The substrate adsorption motion module includes: a displacement component with X-degree of freedom, a substrate adsorption platform, and a third control component; the displacement component carries the substrate adsorption platform and drives the substrate adsorption platform to move in the X direction; the substrate adsorption platform is used to adsorb and fix the substrate to be tested with a printed inkjet film; the third control component is used to control the movement and adsorption action of the displacement component and the substrate adsorption platform. The substrate adsorption motion module works in conjunction with the dot film thickness detection module inside the inkjet film or the edge morphology detection module of the inkjet film to move the dot film thickness measurement sensor or the non-contact white light vertical scanning interferometer sensor to the space above the designated position of the substrate to be tested on which the inkjet film is printed and to perform the detection operation.

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