A control method for a temperature control device

Abstract

The application provides a control method of a temperature adjusting device for adjusting the temperature of an electronic product, which comprises a base for placing the electronic product, at least one temperature adjusting area formed on the base, and a temperature adjusting component arranged below each temperature adjusting area. The control method comprises the following steps: determining the temperature adjusting area covered by the electronic product as a target temperature adjusting area; starting the temperature adjusting component below the target temperature adjusting area; detecting the initial temperature of the electronic product; determining the temperature adjusting mode of the temperature adjusting component below the target temperature adjusting area according to the initial temperature; and controlling the temperature adjusting component below the target temperature adjusting area to operate according to the temperature adjusting mode. The application has the advantage of reasonably utilizing each temperature adjusting component and reducing the energy waste of the temperature adjusting device.

Description

Technical Field

[0001] This invention relates to the field of temperature regulation technology, and in particular to a control method for a temperature regulating device. Background Technology

[0002] With the rapid development of technology, various electronic products have emerged, especially mobile phones and tablets, which have become indispensable for work and entertainment. In the hot summer, prolonged use of mobile phones and tablets often leads to overheating and lag, while in the cold winter, they may enter a shutdown protection mode due to low temperatures, severely impacting the user experience. Commercially available cooling pads have simple structures and are generally only suitable for laptops, not for mobile phones, tablets, or other electronic products. Furthermore, cooling pads lack heating functions, failing to assist some mobile phones and tablets in quickly booting up during winter's low-temperature protection mode. Summary of the Invention

[0003] One object of the present invention is to overcome at least one technical defect in the prior art and provide a control method for a temperature regulating device.

[0004] A further objective of this invention is to make rational use of the temperature control component.

[0005] Another further objective of this invention is to improve the power-on speed of electronic products during low-temperature protection.

[0006] Specifically, according to a first aspect of the present invention, the present invention provides a control method for a temperature-regulating device. The temperature-regulating device is used to regulate the temperature of an electronic product and includes a base for placing the electronic product. At least one temperature-regulating zone is formed on the base, and a temperature-regulating component is correspondingly disposed below each temperature-regulating zone. The control method includes:

[0007] Identify the temperature control zone covered by the electronic product and use it as the target temperature control zone;

[0008] Activate the temperature control component below the target temperature control zone;

[0009] Detecting the initial temperature of electronic products;

[0010] The temperature control mode of the temperature control component below the target temperature control zone is determined based on the initial temperature.

[0011] The temperature control components below the target temperature control zone operate according to the temperature control mode.

[0012] Optionally, the base is equipped with multiple pressure detection devices, and the steps for determining the temperature control zone covered by the electronic product include:

[0013] Obtain the pressure detection results from each pressure detection device;

[0014] The temperature control zone covered by the electronic product was determined based on the pressure test results.

[0015] Optionally, a temperature detection device is installed in each placement area, and the step of detecting the initial temperature of the electronic product includes:

[0016] Obtain the temperature detection results of each temperature detection device within the target temperature control zone;

[0017] The initial temperature of the electronic product is determined based on the temperature detection results.

[0018] Optionally, the temperature control mode includes a slow cooling mode, a fast cooling mode, and an ultra-fast cooling mode, and the step of determining the temperature control mode of the temperature control component below the target temperature control zone based on the initial temperature includes:

[0019] When the initial temperature is in the first temperature range, the temperature control mode of the temperature control component below the target temperature control zone is slow cooling mode;

[0020] When the initial temperature is in the second temperature range, the temperature control mode of the temperature control component below the target temperature control zone is rapid cooling mode;

[0021] When the initial temperature is in the third temperature range, the temperature control mode of the temperature control component below the target temperature control zone is the rapid cooling mode.

[0022] Optionally, the first temperature range, the second temperature range, and the third temperature range are continuous ranges, and the first temperature range is smaller than the second temperature range, which is smaller than the third temperature range.

[0023] Optionally, in slow cooling mode, the current connected to the temperature control component is set to a first current value;

[0024] In rapid cooling mode, the current connected to the temperature control component is set to the second current value;

[0025] In rapid cooling mode, the current connected to the temperature control component is set to the third current value; and

[0026] The first current value is less than the second current value, which is less than the third current value.

[0027] Optionally, the temperature control mode also includes a heating mode, and the step of determining the temperature control mode of the temperature control component below the target temperature control zone based on the initial temperature further includes:

[0028] When the initial temperature is in the fourth temperature range, the temperature control mode of the temperature control component below the target temperature control zone is the heating mode.

[0029] Optionally, the current direction of the temperature control component in heating mode is opposite to the current direction of the temperature control component in slow cooling mode, fast cooling mode, or ultra-fast cooling mode.

[0030] Optionally, the temperature control device also includes a fan, and the control method further includes:

[0031] When the temperature control component is in slow cooling mode, fast cooling mode, or ultra-fast cooling mode, the fan is turned on to dissipate heat from the temperature control component.

[0032] Optionally, in slow cooling mode, the fan speed is set to a first speed value;

[0033] In rapid cooling mode, set the fan speed to the second speed value;

[0034] In rapid cooling mode, set the fan speed to the third speed setting; and

[0035] The first speed value is less than the second speed value, which is less than the third speed value.

[0036] The control method of the temperature control device of the present invention first takes the temperature control area covered by the electronic product as the target temperature control area, and only activates the temperature control component below the target temperature control area. Then, the initial temperature of the electronic product is detected, and the temperature control mode of the temperature control component is determined according to the initial temperature. Then, the temperature control component below the target temperature control area is controlled to operate according to the temperature control mode. This can make more reasonable use of each temperature control component and reduce energy waste of the temperature control device.

[0037] Furthermore, the control method of the temperature regulating device of the present invention also includes a heating mode in which the temperature regulating component has a heating mode. When the electronic product enters a low temperature protection state after being frozen, the electronic product can be placed on the base to heat the electronic product using the temperature regulating component, thereby improving the startup speed of the electronic product.

[0038] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0039] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0040] Figure 1 This is a schematic diagram of the structure of a temperature control device according to an embodiment of the present invention;

[0041] Figure 2 This is a schematic diagram of the internal structure of the base according to an embodiment of the present invention;

[0042] Figure 3This is a schematic diagram of the bottom structure of a temperature control device according to an embodiment of the present invention;

[0043] Figure 4 This is a flowchart of a control method for a temperature-regulating device according to an embodiment of the present invention. Detailed Implementation

[0044] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0045] Figure 1 This is a schematic diagram of the structure of a temperature control device 10 according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the internal structure of the base 100 according to an embodiment of the present invention. Figure 3 This is a schematic diagram of the bottom structure of a temperature control device 10 according to an embodiment of the present invention, with reference to... Figures 1 to 3 The temperature control device 10 generally includes a base 100, on which at least one temperature control zone 110 is formed. Each temperature control zone 110 is provided with a temperature control component 200 below it. Each temperature control component 200 can work independently to adjust the temperature of electronic products placed in the corresponding temperature control zone 110.

[0046] The base 100 has an internal cavity in which each temperature regulating component 200 can be disposed. The temperature regulating zone 110 can be formed by the top surface of the base 100 recessed towards the interior of the base 100, so that electronic products can be stably placed on the base 100.

[0047] In an optional embodiment of the present invention, there may be two temperature-regulating zones 110, which are arranged adjacent to each other on the top surface of the base 100. The outline of one temperature-regulating zone 110 may be configured to fit the shape of a mobile phone, and the shape of the other temperature-regulating zone 110 may be configured to fit the shape of a tablet. In addition, the outer periphery of the top surface of the base 100 may also be configured to fit the shape of a computer (laptop).

[0048] To make the description clearer and more accurate, we can define the temperature adjustment area 110 that is adapted to the shape of a mobile phone as the first temperature adjustment area, and the temperature adjustment area 110 that is adapted to the shape of a tablet as the second temperature adjustment area.

[0049] In practical applications, when adjusting the temperature of a mobile phone, place the phone in the first temperature adjustment zone and use it as the target temperature adjustment zone. Only activate the temperature adjustment component 200 located below the first temperature adjustment zone. When adjusting the temperature of a tablet, place the phone in the second temperature adjustment zone and use it as the target temperature adjustment zone. Only activate the temperature adjustment component 200 located below the second temperature adjustment zone to adjust the phone's temperature. When adjusting the temperature of a computer, place the computer on top of the stand 100. The computer will then completely cover both the first and second temperature adjustment zones. Both zones are target temperature adjustment zones, and the temperature adjustment components 200 located below both zones can be activated simultaneously.

[0050] Furthermore, the base 100 is provided with multiple pressure detection devices 120, which can be pressure sensors. These devices are mainly used to determine the target temperature control zone covered by the electronic product. The temperature control device 10 only uses the temperature control component 200 below the target temperature control zone to adjust the temperature of the electronic product. Specifically, there can be three pressure detection devices 120. One pressure detection device 120 is located in the first temperature control zone, another pressure detection device 120 is located in the second temperature control zone, and yet another pressure detection device 120 is located on the top surface of the base 100 and is located outside the first and second temperature control zones.

[0051] In practical applications, when a signal is detected by the pressure detection device 120 in the first temperature control zone, it indicates that a mobile phone is placed in the first temperature control zone, and the first temperature control zone is then designated as the target temperature control zone. When a signal is detected by the pressure detection device 120 in the second temperature control zone, it indicates that a tablet is placed in the second temperature control zone, and the second temperature control zone is then designated as the target temperature control zone. When a signal is detected by the pressure detection device 120 on the top surface of the base 100, it indicates that a computer is placed on the base 100, and both the first and second temperature control zones are then designated as target temperature control zones.

[0052] In this embodiment, the temperature control component 200 can be a semiconductor temperature control plate. By adjusting the direction of the current connected to the semiconductor temperature control plate, the semiconductor temperature control plate can be controlled to cool or heat the electronic product. In the cooling state, the cooling speed of the semiconductor temperature control plate can also be controlled by adjusting the magnitude of the current connected to the semiconductor temperature control plate.

[0053] The temperature control device 10 may further include a fan 300, which can be disposed below the base 100 and fixed to the lower surface of the bottom wall of the base 100. The bottom wall of the base 100 has through-hole grilles. When the temperature control component 200 is in a cooling state, the fan 300 can blow air through the grilles to the bottom of the temperature control component 200, thereby dissipating heat from the temperature control component 200.

[0054] Furthermore, temperature detection devices 130 are also provided in the first and second temperature control zones. The detection devices can be temperature sensors, which are mainly used to detect the initial temperature of the electronic product so as to set the temperature control mode of the temperature control component 200 according to the initial temperature of the electronic product. The temperature control mode can include slow cooling mode, fast cooling mode, rapid cooling mode and heating mode.

[0055] In practical applications, when a mobile phone is placed in the first temperature control zone, the temperature detection value of the temperature detection device 130 in the first temperature control zone is the initial temperature of the mobile phone. When a tablet is placed in the second temperature control zone, the temperature detection value of the temperature detection device 130 in the second temperature control zone is the initial temperature of the tablet. When a computer is placed on the top surface of the base 100, the detection values ​​of the temperature detection devices 130 in the first and second temperature control zones can be compared, and the larger detection value can be used as the initial temperature of the computer.

[0056] The following section provides a detailed explanation of how the temperature control mode of the temperature control component 200 is set according to the initial temperature of the electronic product, using specific examples.

[0057] Example 1: With a mobile phone placed in the first temperature control zone, the initial temperature of the phone is detected using the temperature detection device 130 within the zone. When the initial temperature is 0℃≤T2<15℃, it indicates the phone is in a low-temperature state and may not even function properly. In this case, the temperature control component 200 is set to heating mode. When the initial temperature is 15℃≤T2<25℃, it indicates the phone is in optimal operating condition, and the temperature control component 200 can be turned off. When the initial temperature is 25℃≤T2<35℃, it indicates the phone is in a busy state. In this case, the current connected to the temperature control component 200 is reduced, and the component is set to slow cooling mode. When the initial temperature is 35℃≤T2<45℃, it indicates the phone is in an even busier state. In this case, the current connected to the temperature control component 200 is increased, and the component is set to rapid cooling mode, with the fan 300 turned on at a low speed. When the initial temperature of the mobile phone is 45℃≤T2, it means that the mobile phone is in full-speed working state. At this time, the current connected to the temperature control component 200 is adjusted to the maximum, the temperature control component 200 is set to the rapid cooling mode, and the fan 300 is turned on to the high speed.

[0058] Example 2: When a plate is placed in the second temperature control zone, the initial temperature of the plate is detected using the temperature detection device 130 within the second temperature control zone. When the initial temperature of the plate is 0℃≤T3<15℃, it indicates that the plate is in a low-temperature state, or even unable to work normally. In this case, the temperature control component 200 is set to heating mode. When the initial temperature of the plate is 15℃≤T3<30℃, it indicates that the plate is in optimal operating condition. In this case, the temperature control component 200 can be turned off. When the initial temperature of the plate is 30℃≤T3<40℃, it indicates that the plate is in a busy state. In this case, the current connected to the temperature control component 200 is reduced, and the temperature control component 200 is set to slow cooling mode. When the initial temperature of the plate is 40℃≤T3<50℃, it indicates that the plate is in an even busier state. In this case, the current connected to the temperature control component 200 is increased, and the temperature control component 200 is set to rapid cooling mode. The fan 300 is then turned on to a low speed. When the initial temperature of the tablet is 50℃≤T3, it means that the tablet is in full-speed operation. At this time, the current connected to the temperature control component 200 is adjusted to the maximum, the temperature control component 200 is set to the rapid cooling mode, and the fan 300 is turned on to the high speed.

[0059] Example 3: With a computer placed on top of the base 100, the temperature detection devices 130 in both the first and second temperature control zones simultaneously detect the computer's temperature to determine its initial temperature. When the initial temperature is 30℃≤T1<50℃, it indicates that the CPU is relatively idle. In this case, the current connected to the temperature control component 200 is reduced, and the component is set to slow cooling mode. When the initial temperature is 50℃≤T1<70℃, it indicates that the CPU is busy. In this case, the current connected to the temperature control component 200 is increased, and the component is set to fast cooling mode, with the fan 300 turned on at low speed. When the initial temperature is 70℃≤T1, it indicates that the CPU is working at full speed. In this case, the current connected to the temperature control component 200 is increased to maximum, and the component is set to rapid cooling mode, with the fan 300 turned on at high speed.

[0060] It is understandable that in Example 1, the temperature control mode setting only applies to the temperature control component 200 below the first temperature control zone. In Example 2, the temperature control mode setting only applies to the temperature control component 200 below the second temperature control zone. In Example 3, the temperature control mode setting applies to the temperature control components 200 below both the first and second temperature control zones.

[0061] Figure 4 This is a schematic diagram of a control method for a temperature regulating device 10 according to an embodiment of the present invention, with reference to... Figure 4 The control method of the temperature regulating device 10 includes at least the following steps S402 to S410.

[0062] Step S402: Determine the temperature control zone 110 covered by the electronic product and designate it as the target temperature control zone.

[0063] Step S404: Activate the temperature control component 200 below the target temperature control zone.

[0064] Step S406: Detect the initial temperature of the electronic product.

[0065] Step S408: Determine the temperature control mode of the temperature control component 200 below the target temperature control zone based on the initial temperature.

[0066] Step S410: Control the temperature control component 200 below the target temperature control zone to operate in the temperature control mode.

[0067] The control method of the temperature control device 10 in this embodiment of the invention first takes the temperature control area 110 covered by the electronic product as the target temperature control area, and only activates the temperature control component 200 below the target temperature control area. Then, the initial temperature of the electronic product is detected, and the temperature control mode of the temperature control component 200 is determined according to the initial temperature. Then, the temperature control component 200 below the target temperature control area is controlled to operate according to the temperature control mode. In this way, each temperature control component 200 can be used more rationally to reduce the energy waste of the temperature control device 10.

[0068] In step S402 above, the step of determining the temperature control zone 110 covered by the electronic product can be to obtain the pressure detection results of each pressure detection device 120, and then determine the temperature control zone 110 covered by the electronic product based on the pressure detection results, so that when the temperature control device 10 is working, only the temperature control component 200 below the temperature control zone 110 covered by the electronic product is activated.

[0069] In one optional embodiment, the base 100 may have two temperature-regulating zones 110, one of which is a first temperature-regulating zone for placing a mobile phone, and the other is a second temperature-regulating zone for placing a tablet. Three pressure detection devices 120 may be provided, respectively located within the first temperature-regulating zone, the second temperature-regulating zone, and on the top surface of the base 100 (outside the first and second temperature-regulating zones).

[0070] When determining the temperature control zone 110 covered by the electronic product, the pressure detection results of each pressure detection device 120 can be obtained. When the pressure detection device 120 in the first temperature control zone has a signal input, it indicates that a mobile phone is placed in the first temperature control zone, and the first temperature control zone is taken as the target temperature control zone. When the pressure detection device 120 in the second temperature control zone has a signal input, it indicates that a tablet is placed in the second temperature control zone, and the second temperature control zone is taken as the target temperature control zone. When the pressure detection device 120 on the top surface of the base 100 has a signal input, it indicates that a computer is placed on the base 100, and both the first and second temperature control zones are taken as target temperature control zones.

[0071] In step S406 above, the step of detecting the initial temperature of the electronic product can be to obtain the temperature detection results of each temperature detection device 130 in the target temperature control zone, and then determine the initial temperature of the electronic product based on the temperature detection results, so as to reasonably determine the temperature control mode of the temperature control component 200 below the target temperature control zone based on the initial temperature.

[0072] In one optional embodiment, a temperature detection device 130 is provided in both the first and second temperature control zones. When the first temperature control zone is determined to be the target temperature control zone, it means that the electronic product only covers the first temperature control zone. In this case, only the temperature detection results within the first temperature control zone are needed to determine the initial temperature of the electronic product. When the second temperature control zone is determined to be the target temperature control zone, it means that the electronic product only covers the second temperature control zone. In this case, only the temperature detection results within the second temperature control zone are needed to determine the initial temperature of the electronic product. When both the first and second temperature control zones are determined to be target temperature control zones, it means that the electronic product covers both the first and second temperature control zones. In this case, it is necessary to obtain the detection results of the temperature detection devices 130 in the first and second temperature control zones respectively, and take the larger detection value as the initial temperature of the electronic product.

[0073] In step S408 above, the temperature control mode may include a slow cooling mode, a fast cooling mode, and a rapid cooling mode. The step of determining the temperature control mode of the temperature control component 200 below the target temperature control zone based on the initial temperature may include: when the initial temperature is in a first temperature range, setting the temperature control mode of the temperature control component 200 below the target temperature control zone to a slow cooling mode; when the initial temperature is in a second temperature range, setting the temperature control mode of the temperature control component 200 below the target temperature control zone to a fast cooling mode; and when the initial temperature is in a third temperature range, setting the temperature control mode of the temperature control component 200 below the target temperature control zone to a rapid cooling mode.

[0074] Specifically, the temperature range data for the first, second, and third temperature ranges can be pre-stored. After obtaining the initial temperature of the electronic product, the initial temperature is directly compared with the first, second, and third temperature ranges to determine the range in which the initial temperature falls. The first, second, and third temperature ranges can be continuous ranges to prevent the initial temperature from falling outside these ranges when the electronic product needs cooling. The first temperature range should be smaller than the second temperature range, and the second temperature range should be smaller than the third temperature range. The specific ranges of the first, second, and third temperature ranges are not limited in this embodiment and can be configured according to the actual usage of different electronic products.

[0075] In slow cooling mode, the current connected to the temperature regulating component 200 can be set to a first current value. In fast cooling mode, the current connected to the temperature regulating component 200 can be set to a second current value. In ultra-fast cooling mode, the current connected to the temperature regulating component 200 can be set to a third current value, and the first current value is less than the second current value, which is less than the third current value. Since the temperature regulating component 200 in this embodiment is a semiconductor temperature regulating plate, the switching between slow cooling mode, fast cooling mode, and ultra-fast cooling mode can be achieved by adjusting the current value; that is, the higher the current value, the faster the cooling speed.

[0076] In an optional embodiment of the present invention, the step of determining the temperature regulation mode of the temperature regulation component 200 below the target temperature regulation zone based on the initial temperature may further include: when the initial temperature of the electronic product is in the fourth temperature range, setting the temperature regulation mode of the temperature regulation component 200 below the target temperature regulation zone to a heating mode. It is understood that heating of the electronic product is only necessary when the electronic product's temperature is low and it enters a low-temperature protection mode.

[0077] Since the temperature control component 200 in this embodiment is a semiconductor temperature control plate, the switching between the heating mode and various cooling modes of the temperature control component 200 can be achieved by changing the direction of the current connected to the temperature control component 200. That is, in any cooling mode, adjusting the direction of the current connected to the temperature control component 200 to the opposite direction will switch the temperature control component 200 to the heating mode.

[0078] In an optional embodiment of the present invention, when the temperature regulating component 200 is in slow cooling mode, fast cooling mode, or ultra-fast cooling mode, the fan 300 can also be activated to dissipate heat from the temperature regulating component 200. It is understood that when the temperature regulating component 200 is in cooling mode, the heat absorbed by the side of the temperature regulating component 200 adjacent to the electronic product will be transferred to the side farther away from the electronic product. Dissipating heat from the side of the temperature regulating component 200 away from the electronic product by the fan 300 can ensure the cooling effect of the temperature regulating component 200.

[0079] In slow cooling mode, the fan speed of 300 can be set to the first speed value. In fast cooling mode, the fan speed of 300 can be set to the second speed value. In ultra-fast cooling mode, the fan speed of 300 can be set to the third speed value, where the first speed value is less than the second speed value, and the third speed value is less than the third speed value. Since the faster the temperature control component 200 cools, the more heat is generated on the side furthest from the electronic product, resulting in a greater heat dissipation demand, the fan speed of 300 can be adjusted accordingly to meet the heat dissipation requirements of the temperature control component 200. It should be noted that whether or not to activate the fan 300 should be determined based on the actual situation. For example, in some cases, when the temperature control component 200 is in slow cooling mode, natural cooling is sufficient to meet its heat dissipation needs, and it is not necessary to activate the fan 300.

[0080] According to any optional embodiment or a combination of multiple optional embodiments described above, the embodiments of the present invention can achieve the following beneficial effects:

[0081] The control method of the temperature regulating device 10 of the present invention first takes the temperature regulating area 110 covered by the electronic product as the target temperature regulating area, and only activates the temperature regulating component 200 below the target temperature regulating area. Then, the initial temperature of the electronic product is detected, and the temperature regulating mode of the temperature regulating component 200 is determined according to the initial temperature. Then, the temperature regulating component 200 below the target temperature regulating area is controlled to operate according to the temperature regulating mode. This method can make more reasonable use of each temperature regulating component 200 and reduce the energy waste of the temperature regulating device 10.

[0082] Furthermore, in the control method of the temperature regulating device 10 of the present invention, the temperature regulating component 200 also has a heating mode. When the electronic product enters a low temperature protection state after being frozen, the electronic product can be placed on the base 100 so that the temperature regulating component 200 can heat the electronic product, thereby improving the startup speed of the electronic product.

[0083] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A control method of a temperature adjustment device for adjusting temperature of an electronic product, the temperature adjustment device comprising a base for placing the electronic product, the base having at least one temperature adjustment area formed thereon, and a temperature adjustment component corresponding to each temperature adjustment area, the control method comprising: determining a temperature adjustment area covered by the electronic product as a target temperature adjustment area; starting the temperature adjustment component under the target temperature adjustment area; detecting an initial temperature of the electronic product; determining a temperature adjustment mode of the temperature adjustment component under the target temperature adjustment area according to the initial temperature; and controlling the temperature adjustment component under the target temperature adjustment area to operate according to the temperature adjustment mode; wherein the temperature adjustment area comprises a first temperature adjustment area configured to match a shape of a mobile phone and a second temperature adjustment area configured to match a shape of a tablet, a top surface of the base is further configured to match a shape of a notebook computer, and when the electronic product is the notebook computer, the first temperature adjustment area and the second temperature adjustment area are both the target temperature adjustment area. The base is provided with a plurality of pressure detection devices, and the step of determining the temperature adjustment area covered by the electronic product comprises: obtaining pressure detection results of the pressure detection devices; and determining the temperature adjustment area covered by the electronic product according to the pressure detection results. Each placing area is provided with a temperature detection device, and the step of detecting the initial temperature of the electronic product comprises: obtaining temperature detection results of the temperature detection devices in the target temperature adjustment area; and determining the initial temperature of the electronic product according to the temperature detection results. The temperature adjustment mode comprises a slow cooling mode, a fast cooling mode and an ultra-fast cooling mode, and the step of determining the temperature adjustment mode of the temperature adjustment component under the target temperature adjustment area according to the initial temperature comprises: when the initial temperature is in a first temperature interval, the temperature adjustment mode of the temperature adjustment component under the target temperature adjustment area is the slow cooling mode; when the initial temperature is in a second temperature interval, the temperature adjustment mode of the temperature adjustment component under the target temperature adjustment area is the fast cooling mode; and when the initial temperature is in a third temperature interval, the temperature adjustment mode of the temperature adjustment component under the target temperature adjustment area is the ultra-fast cooling mode. The first temperature interval, the second temperature interval and the third temperature interval are continuous intervals, and the first temperature interval is smaller than the second temperature interval which is smaller than the third temperature interval. 6.The control method of claim 4, wherein: in the slow cooling mode, a current supplied to the temperature adjustment component is set to a first current value; in the fast cooling mode, the current supplied to the temperature adjustment component is set to a second current value; in the ultra-fast cooling mode, the current supplied to the temperature adjustment component is set to a third current value; and the first current value is smaller than the second current value which is smaller than the third current value. 7.The control method of claim 4, wherein:

2. The control method according to claim 1, wherein ​ ​ ​ 3. The control method according to claim 1, wherein ​ ​ ​ 4. The control method according to claim 1, wherein ​ ​ ​ ​ 5. The control method according to claim 4, wherein ​ ​ ​ ​ ​ ​ ​ The temperature adjustment mode further comprises a heating mode, and the step of determining the temperature adjustment mode of the temperature adjustment component under the target temperature adjustment area according to the initial temperature further comprises: When the initial temperature is in a fourth temperature interval, the temperature adjustment mode of the temperature adjustment component under the target temperature adjustment area is a heating mode.

8. The control method according to claim 7, wherein, The current direction of the temperature adjustment component in the heating mode is opposite to the current direction of the temperature adjustment component in the slow cooling mode or the fast cooling mode or the super-fast cooling mode.

9. The control method according to claim 4, wherein The temperature adjustment device further comprises a fan, and the control method further comprises: When the temperature adjustment component is in the slow cooling mode or the fast cooling mode or the super-fast cooling mode, the fan is started to dissipate heat for the temperature adjustment component.

10. The control method according to claim 9, wherein, In the slow cooling mode, the rotating speed of the fan is set as a first rotating speed value; In the fast cooling mode, the rotating speed of the fan is set as a second rotating speed value; In the super-fast cooling mode, the rotating speed of the fan is set as a third rotating speed value; And The first rotating speed value is less than the second rotating speed value which is less than the third rotating speed value.

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