Sub-display panel assembly and preparation method thereof, and spliced ​​display device

Abstract

The embodiments of the present disclosure provide a sub-display panel assembly and a preparation method thereof, and a spliced ​​display device. The sub-display panel assembly includes: a display substrate, the display substrate having a first surface and a second surface arranged opposite to each other; a support layer, located on the first surface, including a plurality of convex portions, each of the plurality of convex portions having a contact surface away from the display substrate, and the distance between the contact surface of each convex portion and the second surface is equal.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a sub-display panel assembly and a preparation method thereof, and a spliced ​​display device. Background Art

[0002] With the rapid development of display technology, splicing display devices have been increasingly widely used in large venues such as shopping malls, cinemas, and stadiums. It not only solves the technical problems of high cost and difficult maintenance of a single large screen, but also has extremely high scalability and can be used for the display of images of various sizes.

[0003] The spliced ​​display device is formed by splicing multiple sub-display panel assemblies. In the related art, the display substrates in the multiple sub-display panel assemblies are supported by brackets to control the installation tolerance of the sub-display panel assemblies in the thickness direction to ensure the flatness of the entire spliced ​​display device. Summary of the invention

[0004] Embodiments of the present disclosure provide a sub-display panel assembly and a method for preparing the same, and a spliced ​​display device.

[0005] In a first aspect, an embodiment of the present disclosure provides a sub-display panel assembly, including:

[0006] A display substrate, the display substrate having a first surface and a second surface arranged opposite to each other;

[0007] The support layer is located on the first surface and includes a plurality of convex portions, each of the plurality of convex portions has a contact surface away from the display substrate, and the distance between the contact surface of each convex portion and the second surface is equal.

[0008] In some embodiments, the protrusion includes an adhesive layer and a lamination layer that are stacked, and the adhesive layer is located between the lamination layer and the display substrate.

[0009] In some embodiments, the material of the bonding layer includes: curing glue.

[0010] In some embodiments, the curing adhesive includes: conductive adhesive.

[0011] In some embodiments, the material of the lamination layer includes a metal material.

[0012] In some embodiments, the sub-display panel assembly further comprises:

[0013] The first magnetic component is located on the first surface, and the distance between a side surface of the first magnetic component away from the display panel and the second surface is smaller than the distance between the contact surface of the protrusion and the second surface.

[0014] In some embodiments, a plurality of conductive terminals are further disposed on the first surface, and the conductive terminals are configured to conduct static electricity generated on the display substrate.

[0015] In some embodiments, the height of the protrusion is between 0.28-0.65 mm.

[0016] In some embodiments, the plurality of protrusions are evenly distributed on an edge of the first surface.

[0017] In a second aspect, an embodiment of the present disclosure provides a method for preparing a sub-display panel assembly, comprising:

[0018] Providing a display substrate, wherein the display substrate has a first surface and a second surface arranged opposite to each other;

[0019] A support layer is formed on the first surface, wherein the support layer includes a plurality of protrusions, each of the plurality of protrusions has a contact surface away from the display substrate, and a distance between the contact surface of each protrusion and the second surface is equal.

[0020] In some embodiments, the step of forming a support layer comprises:

[0021] Placing the display substrate in a receiving groove of a receiving jig, wherein the receiving jig comprises: a bottom plate and a side wall located on the bottom plate, wherein the side wall and the bottom plate enclose the receiving groove, and the second surface of the display substrate contacts the bottom plate;

[0022] A bonding layer and a laminating layer are formed on the first surface, wherein the laminating layer is located on a side of the adhesive layer away from the first surface, and a distance from a side surface of the laminating layer away from the bottom plate to the bottom plate is greater than a distance from a side surface of the side wall away from the bottom plate to the bottom plate;

[0023] The pressing layer is pressed toward one side of the bottom plate by using a pressing jig until the pressing jig contacts a surface of the side wall away from the bottom plate, and the adhesive layer is deformed to obtain a plurality of protrusions.

[0024] In some embodiments, the sub-display panel assembly is the sub-display panel assembly as claimed in claim 6;

[0025] A plurality of second magnetic components are disposed on the bottom plate, and the second magnetic components are magnetically matched with the corresponding first magnetic components to fix the display substrate.

[0026] In a third aspect, an embodiment of the present disclosure provides a spliced ​​display device, comprising a plurality of sub-display panel assemblies and a box for assembling the sub-display panel assemblies, wherein at least one of the sub-display panel assemblies adopts the sub-display panel assembly described in the first aspect.

[0027] In some embodiments, the box includes: a supporting surface for supporting the sub-display panel assembly, a plurality of third magnetic components are arranged on the supporting surface, and the third magnetic components are magnetically matched with the corresponding first magnetic components to adsorb and fix the sub-display panel assembly.

[0028] In some embodiments, the box body includes: a supporting surface for supporting the sub-display panel assembly, a plurality of conductive posts are disposed on the supporting surface, and the conductive posts are configured to contact the conductive terminals. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0030] Figure 1 It is a schematic diagram of the structure of multiple sub-display panel assemblies provided in the related art.

[0031] Figure 2a A schematic structural diagram of a sub-display panel assembly provided in an embodiment of the present disclosure.

[0032] Figure 2b An exploded view of a display substrate provided in an embodiment of the present disclosure.

[0033] Figure 3 A schematic diagram of the planar structure of a first surface of a display substrate provided in an embodiment of the present disclosure.

[0034] Figure 4 A schematic flow chart of a method for preparing a sub-display panel assembly provided in an embodiment of the present disclosure.

[0035] Figure 5 A schematic flow chart of another method for preparing a sub-display panel assembly provided in an embodiment of the present disclosure.

[0036] Figure 6 A schematic diagram of the structure of a containing fixture provided in an embodiment of the present disclosure.

[0037] Figure 7 It is a schematic diagram showing a substrate being pressed by a pressing jig in a receiving jig according to an embodiment of the present disclosure.

[0038] Figure 8 A schematic diagram of the structure of a spliced ​​display device provided in an embodiment of the present disclosure.

[0039] Description of reference numerals:

[0040] Sub-display panel assembly 100, box body 200, bracket 300;

[0041] Display substrate 1: first surface 1a, second surface 1b; light-emitting substrate 10, substrate 11, light-emitting device 12, protective film 13;

[0042] Support layer 2: convex portion 20, contact surface 2a, adhesive layer 21, pressing layer 22;

[0043] A first magnetic component 3, a conductive terminal 4;

[0044] The receiving fixture 5 includes a bottom plate 5a, a side wall 5b, a third surface 5c, and a second magnetic component 51;

[0045] Press-fitting jig 6 and connector terminal 7. DETAILED DESCRIPTION

[0046] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0047] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0048] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, "including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0049] Mini LED refers to a light-emitting device with a chip size between 100-300μm, and Micro-LED refers to a light-emitting device with a chip size below 100μm. Micro-light-emitting diodes (Mini-LED / Micro-LED, MLED) can be used as self-luminous LEDs for display. They have the advantages of high brightness, high contrast, fast response and low power consumption. Therefore, MLED-based display technology has been increasingly widely used in the display field. Specifically, by integrating a high-density array of light-emitting devices on a substrate, the MLED display panel can be made thinner, smaller and matrix-like.

[0050] With the rapid development of display technology, the splicing display device based on MLED has been more and more widely used in large-size display fields such as command and monitoring centers, business centers, high-end conferences, and private theaters, and has broad application prospects. It not only solves the technical problems of high cost and difficult maintenance of a single large screen, but also has extremely high scalability and can be applied to the display of images of various sizes.

[0051] The spliced ​​display device is formed by splicing a plurality of sub-display panel assemblies, wherein the sub-display panel assembly includes a display substrate and a bracket for supporting the display substrate. Figure 1 It is a schematic diagram of the structure of multiple sub-display panel components provided in the related art, such as Figure 1 As shown, in the related art, the display substrate 1 is supported and fixed by a bracket 300 to control the installation tolerance of the sub-display panel assembly 100 in the thickness direction. The display substrate 1 includes a light-emitting substrate 10 and a protective film 13 located on the light-emitting side of the light-emitting substrate, and the light-emitting substrate 10 includes a plurality of light-emitting devices. The protective film 13 covers a portion of the surface of the plurality of light-emitting devices (Mini-LED / Micro-LED) and fills the gap area between the plurality of light-emitting devices.

[0052] Specifically, on the one hand, the thickness tolerance of the bracket 300 can be controlled within ±0.05mm through fine processing, and on the other hand, the thickness tolerance of the display substrate 1 is within the range of ±0.02mm. The sub-display panel assembly 100 formed by assembling the bracket 300 and the display substrate 1 can have an installation tolerance in the thickness direction that can be controlled within ±0.1mm, thereby ensuring the flatness of the spliced ​​display device after multiple sub-display panel assemblies 100 and the box are spliced ​​and installed.

[0053] In the above solution, although the bracket can ensure the flatness of the spliced ​​display device, the introduction of the bracket increases the manufacturing cost on the one hand, and the matching structure for assembling the bracket and the display substrate is complicated on the other hand, which increases the difficulty of design and installation.

[0054] In order to solve at least one of the above technical problems, an embodiment of the present disclosure provides a sub-display panel assembly, which controls the thickness of the sub-display panel assembly without involving a bracket to ensure the flatness of a spliced ​​display device formed by multiple sub-display panel assemblies and improve product yield.

[0055] Figure 2a A schematic diagram of the structure of a sub-display panel assembly provided in an embodiment of the present disclosure is shown in FIG. Figure 2a As shown, the sub-display panel assembly includes a display substrate and a supporting layer 2, wherein the display substrate has a first surface 1a and a second surface 1b arranged opposite to each other; the supporting layer 2 is located on the first surface 1a, and includes a plurality of protrusions 20, each of the plurality of protrusions 20 has a contact surface 2a away from the display substrate, and the distance between the contact surface 2a of each protrusion 20 and the second surface 1b is equal.

[0056] The sub-display panel assembly provided by the embodiment of the present disclosure has a support layer 2 disposed on the first surface 1a of the display substrate, and the contact surface 2a of the plurality of protrusions 20 in the support layer 2 is set to be equal to the distance between the second surface 1b of the display substrate to control the thickness tolerance of the sub-display panel assembly; for different sub-display panel assemblies, when there is a difference in thickness of the display substrate, the overall thickness (the distance between the contact surface of the protrusion in the sub-display panel assembly and the second surface of the display substrate) of the different sub-display panel assemblies can be improved by adjusting the height of the protrusion on the first surface 1a of the display substrate; when these sub-display panel assemblies with consistent thickness are assembled on the box body, the second surface of the display substrate in each sub-display panel assembly can be in the same plane or substantially in the same plane, that is, each sub-display panel assembly has a better flatness, which is conducive to improving the display effect and the splicing assembly yield. At the same time, compared with the method of adjusting the thickness of the sub-display panel assembly by a bracket in the related art, the manufacturing cost is reduced and the manufacturing / installation process is simplified.

[0057] It should be noted that the first surface 1a of the display substrate can be a non-light emitting surface, and the second surface 1b can be a light emitting surface. Providing the support layer 2 on the non-light emitting surface, i.e., the first surface 1a, will not affect the light emitting of the display substrate.

[0058] Figure 2b An exploded view of a display substrate provided in an embodiment of the present disclosure, Figure 3 A schematic diagram of a planar structure of a first surface of a display substrate provided in an embodiment of the present disclosure. In some embodiments, as Figure 3 As shown, a plurality of convex portions 20 are evenly distributed on the edge of the first surface 1a. For example, the convex portions 20 may be distributed at the four corners of the first surface 1a and at the midpoint of each edge. By providing a support layer 2 including a plurality of convex portions 20, the thickness tolerance of the sub-display panel assembly is adjusted, and after the plurality of sub-display panel assemblies are spliced, the flatness of the spliced ​​display device is ensured.

[0059] In some embodiments, Figure 2a As shown, the convex portion 20 includes a stacked adhesive layer 21 and a laminating layer 22, wherein the adhesive layer 21 is located between the laminating layer 22 and the display substrate. The adhesive layer 21 and the laminating layer 22 are supported by different materials, wherein the rigidity of the adhesive layer 21 material is less than that of the laminating layer 22 material, so that the laminating layer 22 can be pressed by a pressing jig to deform the adhesive layer 21, so as to adjust the height of the convex portion 20, thereby ensuring that the distance between the contact surface 2a of each convex portion 20 and the second surface 1b of the display substrate is equal.

[0060] In some embodiments, the material of the bonding layer 21 includes a curing adhesive; the material of the lamination layer 22 includes a metal material, such as copper, aluminum, alloy material, etc., which is not specifically limited in the embodiments of the present disclosure.

[0061] In some embodiments, the curing glue can be a thermoplastic or a conductive glue with conductive properties. As long as the curing glue can be deformed when the lamination jig applies force to the lamination layer 22 and maintain a certain thickness after curing, the present disclosure does not limit the specific material of the curing glue.

[0062] It should be noted that when the material of the adhesive layer 21 is conductive glue, the protrusion 20 has a conductive function and can conduct static electricity generated on the display substrate.

[0063] In some embodiments, Figure 3 As shown, a plurality of conductive terminals 4 are also provided on the first surface 1a, and the conductive terminals 4 are configured to conduct static electricity generated on the display substrate. The conductive terminals 4 can be used together with the protrusions 20 containing conductive adhesive material as conductive components to prevent the display substrate from being affected by electrostatic discharge (ESD); or, when the adhesive layer material is a curing adhesive, the ESD protection effect on the display substrate can be ensured by only providing the conductive terminals 4.

[0064] In some embodiments, Figure 2b , Figure 3 As shown, the sub-display panel assembly also includes a first magnetic component 3 located on the first surface 1a, and the distance between the side surface of the first magnetic component away from the display panel and the second surface 1b is smaller than the distance between the contact surface 2a of the protrusion 20 and the second surface 1b.

[0065] It should be understood that before the material of the adhesive layer is solidified, the display substrate is placed in a receiving jig, and the pressing jig presses the pressing layer 22, causing the adhesive layer 21 to deform and the material to solidify, thereby forming a plurality of protrusions 20 in the support layer 2. The first magnetic component 3 can then be magnetically matched with the second magnetic component on the receiving jig to fix the display substrate in the receiving jig. At the same time, in order to prevent the first magnetic component 3 from exerting a force in the opposite direction on it during the pressing process of the pressing jig, thereby affecting the pressing effect, the height of the first magnetic component 3 is set to be smaller than the height of the protrusion 20, that is, the distance between the side surface of the first magnetic component away from the display panel and the second surface 1b is smaller than the distance between the contact surface 2a of the protrusion 20 and the second surface 1b.

[0066] In addition, the spliced ​​display device includes multiple sub-display panel assemblies and a box, wherein the box is used to carry the multiple sub-display panel assemblies, and the first magnetic component 3 can also be magnetically matched with the third magnetic component on the box to fix the sub-display panel assembly.

[0067] In some embodiments, Figure 2a , Figure 2b As shown, the display substrate includes a light-emitting substrate 10 and a protective film 13 sequentially arranged in a direction away from the support layer 2 . The light-emitting substrate 10 is located between the protective film 13 and the support layer 2 , and includes a substrate 11 and a light-emitting device 12 arranged on the substrate 11 .

[0068] In some embodiments, the protective film 13 is disposed on the light-emitting side of the light-emitting device 12, which covers part of the surface of the plurality of light-emitting devices and fills the gap area of ​​the plurality of light-emitting devices. In one example, the protective film 13 includes a transparent material, and the protective film can cover the surface of the light-emitting device 12 away from the substrate 11. In another example, the protective film 13 can also be a material such as black silicone or black resin. In this case, a plurality of hollow portions are disposed on the protective film 13, and the light-emitting area of ​​the light-emitting device 12 is exposed in the hollow portions, that is, the protective film 13 does not affect the light emission of the light-emitting device 12. By providing the protective film 13, the plurality of light-emitting devices 12 can be protected to prevent the light-emitting devices 12 from being damaged during the process of manufacturing; in addition, the display contrast of the sub-display panel assembly in scenes with strong ambient light such as outdoors can also be improved.

[0069] It should be understood that in the manufacturing process of the sub-display panel assembly, the thickness consistency of the protective film 13 is good, and the thickness tolerance of the light-emitting substrate 10 composed of the substrate 11 and the light-emitting device 12 is within the range of ±0.15mm, and the limit tolerance of the entire display substrate is 0.3mm. The light-emitting device 12 in the display substrate is an MLED, and the maximum chip size of the MLED will not exceed 0.3mm, so the tolerance on the display substrate will cause dark seams to appear in the display screen of the display substrate.

[0070] Based on this, a support layer 2 is set on the first surface 1a of the display substrate, and the support layer 2 includes a plurality of protrusions 20. Each protrusion 20 includes an adhesive layer and a pressing layer 22, wherein the adhesive layer adopts a curing adhesive material, and based on the fluidity of the curing adhesive material, the thickness difference on the display substrate is compensated.

[0071] In some embodiments, the thickness of the light-emitting substrate composed of the substrate 11 and the light-emitting device 12 is 2±0.15 mm, the thickness of the protective film 13 is 0.363 mm, and the thickness of the display substrate is 2±0.15+0.363 mm, that is, between 2.213-2.513 mm. At the same time, considering the thickness tolerance of the receiving jig and the pressing jig, the height of the protrusion 20 is set between 0.28-0.65 mm, so that the distance between the contact surface 2a of each protrusion 20 and the second surface 1b of the display substrate is equal, thereby improving the thickness uniformity of the sub-display panel assembly.

[0072] The material of the laminated layer 22 in the protrusion 20 is a metal material with relatively high rigidity and good thickness uniformity. In one example, the thickness of the laminated layer 22 is 0.2 mm.

[0073] It should be understood that the height of the above-mentioned protrusion 20 refers to the distance between the contact surface 2a of the protrusion 20 and the first surface 1a of the display substrate after the adhesive layer 21 material of the protrusion 20 is fixed; the height of the protrusion 20 may also be the overall thickness of the cured adhesive layer 21 and the pressing layer 22.

[0074] Figure 4 A schematic flow chart of a method for preparing a sub-display panel assembly provided in an embodiment of the present disclosure is shown in FIG. Figure 4 As shown, the preparation method can be used to prepare the sub-display panel assembly provided in any of the previous embodiments, and the preparation method includes:

[0075] S1, providing a display substrate, wherein the display substrate has a first surface 1a and a second surface 1b which are oppositely arranged.

[0076] S2, forming a support layer 2 on the first surface 1a, the support layer 2 comprising a plurality of protrusions 20, each of the plurality of protrusions 20 having a contact surface 2a away from the display substrate, and the distance between the contact surface 2a of each protrusion 20 and the second surface 1b is equal.

[0077] The method for preparing a sub-display panel assembly provided in an embodiment of the present disclosure prepares a support layer 2 having a plurality of protrusions 20 on a first surface 1a of a display substrate, and compensates for the thickness tolerance on the display substrate by adjusting the height of the protrusions 20, thereby improving the thickness uniformity of the sub-display panel assembly, thereby ensuring the flatness between the plurality of sub-display panel assemblies in a spliced ​​display device, and improving the display effect and the splicing assembly yield.

[0078] Figure 5 A schematic flow chart of another method for preparing a sub-display panel assembly provided in an embodiment of the present disclosure, Figure 6 A schematic diagram of a structure of a receiving fixture provided in an embodiment of the present disclosure is shown in FIG. Figure 7 It is a schematic diagram showing a substrate being pressed by a pressing jig in a receiving jig according to an embodiment of the present disclosure.

[0079] In some embodiments, Figure 5 As shown, step S2 specifically includes steps S21-S23, wherein:

[0080] S21, placing the display substrate in the receiving groove of the receiving fixture 5, such as Figure 6 As shown, the receiving fixture 5 includes: a bottom plate 5a and a side wall 5b located on the bottom plate 5a, the side wall 5b and the bottom plate 5a form a receiving groove, and the second surface 1b of the display substrate is in contact with the bottom plate 5a.

[0081] Specifically, the above embodiment has shown that the thickness range of the display substrate is between 2.213-2.513 mm, then the groove depth of the receiving groove is at least greater than 2.513 mm, and a pressing space for the protrusion 20 must be reserved. Therefore, the groove depth of the receiving groove can be set to 2.83 mm, and a receiving fixture is formed by a computerized numerical control machine (Computerised Numerical Control Machine, CNC) to control the tolerance of the actual groove depth to within 0.03 mm, thereby ensuring the thickness consistency of the receiving fixture.

[0082] The depth of the above-mentioned receiving groove can also be set to other values, for example, 2.64mm, 2.73mm, 2.89mm, 2.92mm, etc., as long as it can be ensured to be greater than the thickness of the display substrate and to leave enough space for pressing the protrusion 20 in the subsequent steps. The embodiment of the present disclosure is not limited to this.

[0083] In some embodiments, Figure 6 As shown, a plurality of second magnetic components 51 are arranged on the bottom plate 5a of the receiving fixture 5, and the second magnetic components 51 are magnetically matched with the corresponding first magnetic components 3 to fix the display substrate. It should be noted that the first magnetic component 3 is arranged on the first surface 1a of the display substrate, and when the display substrate is placed in the receiving fixture 5, the second surface 1b is in contact with the bottom plate 5a, so the display substrate is separated between the first magnetic component 3 and the second magnetic component 51, and the two are not in direct contact, but this does not affect the magnetic matching between the two.

[0084] It should be noted that Figure 6 The positions of the plurality of second magnetic components 51 shown in the fixture 5 are accommodated in the fixture 5, and Figure 3 The positions of the plurality of first magnetic components 3 shown on the first surface of the display substrate are basically corresponding, that is, Figure 6 The receiving jig 5 shown in the figure can only accommodate one display substrate. However, considering the issues of simplifying the manufacturing process and the manufacturing efficiency of the sub-display panel assembly, a large-sized receiving jig and a corresponding-sized pressing jig can be processed to press multiple display substrates at the same time, which is not limited in the embodiments of the present disclosure.

[0085] S22, forming an adhesive layer 21 and a laminating layer 22 on the first surface 1a, the laminating layer 22 is located on the side of the adhesive layer away from the first surface 1a, and the distance from the surface of the side of the laminating layer 22 away from the bottom plate 5a to the bottom plate 5a is greater than the distance from the surface of the side of the side wall 5b away from the bottom plate 5a to the bottom plate 5a.

[0086] S23, such as Figure 7 As shown, the laminating jig 6 is used to press the laminating layer 22 toward one side of the bottom plate 5a until the laminating jig 6 contacts the third surface 5c, and the adhesive layer 21 is deformed to obtain a plurality of protrusions 20, wherein the third surface 5c is a surface of the side wall 5b away from the bottom plate 5a.

[0087] It should be understood that when the display substrate is placed in the receiving groove of the receiving jig 5 for pressing, the first magnetic component 3 and the second magnetic component 51 are magnetically attracted to each other to fix the position of the display substrate. After the pressing is completed, other adsorption devices can be used to directly contact the first magnetic component 3 on the first surface 1a side of the display substrate to adsorb the display substrate to separate the display substrate from the receiving jig 5.

[0088] In the method for preparing the sub-display panel assembly provided by the embodiment of the present disclosure, before the material of the adhesive layer is solidified, the display substrate is placed in the receiving jig 5, and the pressing jig 6 presses the pressing layer 22, so that the adhesive layer 21 is deformed and the material is solidified, and then a plurality of convex portions 20 are formed in the supporting layer 2. Based on the material properties of the adhesive layer 21, a plurality of convex portions 20 with different heights are formed (but the surfaces of the convex portions 20 away from the display substrate are in the same plane), thereby compensating for the tolerance of the display substrate and forming a sub-display panel assembly with uniform thickness.

[0089] In addition, when the sub-display panel assembly is prepared based on the same receiving jig 5 and pressing jig 6, the overall thickness of the prepared different sub-display panel assemblies (the distance between the contact surface of the protrusion in the sub-display panel assembly and the second surface of the display substrate) is also kept consistent.

[0090] Figure 8 A schematic diagram of a spliced ​​display device provided in an embodiment of the present disclosure is shown in FIG. Figure 8As shown, the spliced ​​display device includes a plurality of sub-display panel assemblies 100 and a box 200 for assembling the sub-display panel assemblies. At least one sub-display panel assembly can adopt the sub-display panel assembly provided in the previous embodiment. For the detailed description of the sub-display panel assembly, please refer to the content of the previous embodiment, which will not be repeated here.

[0091] In some embodiments, the box includes: a supporting surface for supporting the sub-display panel assembly, on which a plurality of third magnetic components (not shown) are arranged, and the third magnetic components are magnetically matched with the corresponding first magnetic components 3 to adsorb and fix the sub-display panel assembly.

[0092] It should be understood that during the assembly process of the box body and the sub-display panel assembly, the support surface of the box body is a finely machined surface with good flatness. The sub-display panel assembly does not need to be completely in contact with the support surface of the box body on all sides. It is only necessary to make the contact surfaces 2a of the multiple protrusions 20 in the supporting layer of the sub-display panel assembly contact with the support surface of the box body. At the same time, the third magnetic component on the box body and the first magnetic component 3 in the sub-display panel assembly are magnetically matched to provide sufficient adsorption force to achieve a stable connection between the sub-display panel assembly and the box body.

[0093] It should be noted that the first magnetic component 3 and the third magnetic component may be in contact or not in contact. Based on the magnetic attraction characteristics of the magnetic components, even if the two are not in contact, it will not affect the magnetic attraction cooperation with each other, thereby avoiding the magnetic components from affecting the height of the sub-display panel assembly and ensuring the flatness of the spliced ​​display device.

[0094] In some embodiments, a plurality of conductive posts (not shown in the figure) are further provided on the support surface, and the conductive posts are configured to contact the conductive terminals 4. The conductive terminals 4 are provided on the first surface 1a of the display substrate, and the static electricity derived through the conductive terminals 4 can be further released through the conductive posts on the box body to ensure the ESD protection effect of the spliced ​​display device.

[0095] In another example, Figure 3 As shown, there is a copper leakage area on the first surface 1a of the display substrate. It should be understood that the sub-display panel assembly also includes a driving structure for driving the light-emitting device in the display substrate, the driving structure is arranged on the first surface 1a of the display substrate, and the driving structure and the display substrate are connected by copper wires. The above-mentioned copper leakage area refers to an area where the pattern area with copper on the first surface 1a of the display substrate is not covered by the insulating protective layer, so that the copper is exposed.

[0096] In addition, if Figure 3 As shown, a connector terminal 7 may also be provided on the first surface 1a of the display substrate. The driving structure may include a flexible circuit board and a driving circuit board, and the connector terminal 7 is configured to connect the flexible circuit board and the driving circuit board.

[0097] Based on this, the conductive pillars on the supporting surface of the box can contact the copper leakage area to discharge the static electricity generated on the display substrate and ensure the ESD protection effect of the spliced ​​display device. It should be noted that in order to prevent the conductive pillars from affecting the height of the sub-display panel assembly, the conductive pillars can be set to be adjustable in the thickness direction of the box to ensure the flatness of the spliced ​​display device.

[0098] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A sub-display panel assembly, characterized in that: include: A display substrate, the display substrate having a first surface and a second surface arranged opposite to each other; A support layer is located on the first surface, and the orthographic projection of the support layer on the display substrate does not cover the entire first surface; the support layer includes a plurality of convex portions, and the plurality of convex portions are evenly distributed on the edge of the first surface; each of the plurality of convex portions has a contact surface away from the display substrate, and the distance between the contact surface of each convex portion and the second surface is equal; the convex portion includes a stacked adhesive layer and a laminating layer, the adhesive layer is located between the laminating layer and the display substrate, and the orthographic projection of the adhesive layer on the display substrate covers the orthographic projection of the laminating layer on the display substrate; different laminating layers face different adhesive layers; the material of the adhesive layer is different from the material of the laminating layer, and the stiffness of the adhesive layer material is less than the stiffness of the laminating layer material; The first magnetic component is located on the first surface, and the distance between a side surface of the first magnetic component away from the display substrate and the second surface is smaller than the distance between the contact surface of the protrusion and the second surface.

2. The sub-display panel assembly according to claim 1, characterized in that: The material of the bonding layer includes: curing glue.

3. The sub-display panel assembly according to claim 2, characterized in that: The curing glue includes: conductive glue.

4. The sub-display panel assembly according to claim 1, characterized in that: The material of the lamination layer includes metal material.

5. The sub-display panel assembly according to claim 1, characterized in that: A plurality of conductive terminals are also disposed on the first surface, and the conductive terminals are configured to conduct static electricity generated on the display substrate.

6. The sub-display panel assembly according to claim 1, characterized in that: The height of the protrusion is between 0.28-0.65 mm.

7. A method for preparing a sub-display panel assembly as claimed in any one of claims 1 to 6, characterized in that: include: Providing a display substrate, wherein the display substrate has a first surface and a second surface arranged opposite to each other; A support layer is formed on the first surface, wherein the orthographic projection of the support layer on the display substrate does not cover the entire first surface; the support layer comprises a plurality of convex portions, and the plurality of convex portions are evenly distributed on the edge of the first surface; each of the plurality of convex portions has a contact surface away from the display substrate, and the distance between the contact surface of each convex portion and the second surface is equal; the convex portion comprises a bonding layer and a laminating layer which are stacked, wherein the bonding layer is located between the laminating layer and the display substrate, and the orthographic projection of the bonding layer on the display substrate covers the orthographic projection of the laminating layer on the display substrate; different laminating layers face different bonding layers; the material of the bonding layer is different from the material of the laminating layer, wherein the stiffness of the bonding layer material is less than the stiffness of the laminating layer material; A first magnetic component is formed on the first surface, and a distance between a surface of the first magnetic component that is away from the display substrate and the second surface is smaller than a distance between a contact surface of the protrusion and the second surface.

8. The method for preparing a sub-display panel assembly according to claim 7, characterized in that: The step of forming the support layer comprises: Placing the display substrate in a receiving groove of a receiving jig, wherein the receiving jig comprises: a bottom plate and a side wall located on the bottom plate, wherein the side wall and the bottom plate enclose the receiving groove, and the second surface of the display substrate contacts the bottom plate; forming an adhesive layer and a laminating layer on the first surface, wherein the laminating layer is located on a side of the adhesive layer away from the first surface, and a distance from a side surface of the laminating layer away from the bottom plate to the bottom plate is greater than a distance from a side surface of the side wall away from the bottom plate to the bottom plate; The pressing layer is pressed toward one side of the bottom plate by using a pressing jig until the pressing jig contacts a surface of the side wall away from the bottom plate, and the adhesive layer is deformed to obtain a plurality of protrusions.

9. The method for preparing a sub-display panel assembly according to claim 8, characterized in that: A plurality of second magnetic components are disposed on the bottom plate, and the second magnetic components are magnetically matched with the corresponding first magnetic components to fix the display substrate.

10. A splicing display device, characterized in that: It comprises a plurality of sub-display panel assemblies and a box body for assembling the sub-display panel assemblies, and at least one of the sub-display panel assemblies adopts the sub-display panel assembly described in any one of claims 1-7.

11. The splicing display device according to claim 10, characterized in that: The box body comprises: a supporting surface for supporting the sub-display panel assembly, a plurality of third magnetic components are arranged on the supporting surface, and the third magnetic components are magnetically matched with the corresponding first magnetic components to adsorb and fix the sub-display panel assembly.

12. The splicing display device according to claim 10, characterized in that: The sub-display panel assembly is the sub-display panel assembly described in claim 5; The box body comprises: a supporting surface for supporting the sub-display panel assembly, a plurality of conductive posts are arranged on the supporting surface, and the conductive posts are configured to contact the conductive terminals.

Images