Camera module with optical actuator

Abstract

The present invention relates to a camera module with an optical actuator, which includes: an optical lens, an optical actuator and a photosensitive component; the optical actuator includes a movable lens carrier and a static frame; the photosensitive component includes a photosensitive chip, a circuit board and a composite electrical base. The composite electrical base includes: a circuit board base portion, a frame connecting portion and an electrical bracket, and the electrical bracket includes a main bracket and a lower extension section. The optical actuator also includes a position sensor and a position detection magnet arranged on the lens carrier, the position sensor is installed on the top surface of the circuit board base portion and is located directly below the position detection magnet, and the position sensor is electrically connected to the main bracket. The present application can help reduce the volume of the camera module, improve the position sensing accuracy, and make the camera module easy to assemble.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a camera module with an optical actuator. Background Art

[0002] Mobile phone camera modules are one of the important components of smart devices, and their application scope and volume in the market are growing. With the advancement of technology, both work and life are promoting intelligence, and one of the important prerequisites for achieving intelligence is to be able to interact well with the external environment. One of the important ways to achieve good interaction is visual perception, and visual perception mainly relies on camera modules. It can be said that camera modules have transformed from obscure smart device accessories to one of the key components of smart devices.

[0003] In recent years, with the increasing demand of consumers for mobile phone photography, the functions of mobile phone camera modules have become more and more abundant. Functions such as portrait shooting, telephoto shooting, optical zoom, optical image stabilization, etc. are integrated into the camera module with limited volume, and the autofocus and optical image stabilization functions often need to rely on optical actuators (sometimes also called motors) to drive the lens to move. In order to accurately control the movement direction and movement amount of the lens movement, it is usually necessary to set a Hall element in the camera module to sense the actual position of the lens. In some solutions of the prior art, the Hall element is set on the circuit board at the bottom of the camera module, and the detection magnet is set on the lens or the lens carrier. In this way, when the lens or the lens carrier moves relative to the fixed part (such as the circuit board), the Hall element can measure the movement direction and movement amount of the lens or the lens carrier in real time according to the change of the magnetic field, and then adjust the driving signal to accurately control the lens to realize various functions such as autofocus, optical image stabilization, and optical zoom. However, with the improvement of the market's requirements for the performance of camera modules, the detection sensitivity of the Hall element has become increasingly difficult to meet the requirements. One solution is to add a magnetic ring structure to amplify the magnetic field to improve the sensitivity of the Hall element. Obviously, this approach will increase the size and weight of the position sensor module. Mobile phone camera modules are different from ordinary cameras (such as SLR cameras). Their size is limited by the small space in the mobile phone, so a miniaturized and compact design must be implemented. The increase in the size and weight of the position sensor module will not only lead to an increase in the volume it occupies, but also a corresponding increase in the size and weight of the driving element, which is not conducive to the miniaturization of the camera module.

[0004] On the other hand, when setting a position sensor module in a camera module, it is necessary not only to consider its installation position, but also to consider the power supply of the sensor and the output of its sensing signal, that is, the problem of its electrical connection. However, the internal space of the camera module is very small. When the installation position of the position sensor module changes, how to achieve its electrical connection is also a major problem in the design of the position sensor and camera module.

[0005] Furthermore, in the design of the camera module, it is also necessary to consider whether it is easy to assemble so as to make it suitable for automated large-scale mass production.

[0006] In summary, there is an urgent need for a camera module with an optical actuator that can improve position detection accuracy, is miniaturized and easy to assemble. Summary of the invention

[0007] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a camera module solution that can improve position detection accuracy, is miniaturized and easy to assemble.

[0008] In order to solve the above technical problems, the present invention provides a camera module with an optical actuator, which is characterized in that it includes: an optical lens, an optical actuator and a photosensitive component; the optical actuator includes a movable lens carrier and a static frame, the optical lens is installed on the lens carrier and is suitable for moving relative to the static frame under the drive of a driving element; the photosensitive component includes a photosensitive chip, a circuit board and a composite electrical base, and the photosensitive chip is installed on the circuit board. The composite electrical base includes: a circuit board base, at least a portion of which is directly formed on the upper surface of the circuit board and surrounds the photosensitive chip; a frame connection portion, which is arranged on the top surface of the circuit board base and extends upward from the top surface of the circuit board base to be fixed to the static frame; and an electrical bracket, which includes a main bracket and a lower extension section, wherein the main bracket is formed by extending in a direction parallel to the surface of the photosensitive chip; one end of the lower extension section is connected to the main bracket, and the other end thereof passes through the circuit board base or extends downward along the side of the circuit board base and is electrically connected to the circuit board; the main bracket is embedded in the top area of ​​the circuit board base. The optical actuator also includes a position sensor and a position detection magnet arranged on the lens carrier, wherein the position sensor is installed on the top surface of the circuit board base and is located directly below the position detection magnet, and the position sensor is electrically connected to the main bracket.

[0009] Wherein, the circuit board base portion and the frame connection portion are directly manufactured on the upper surface of the circuit board in an integral manner based on a molding process.

[0010] The main support is a conductive metal support, which is embedded in the top area of ​​the circuit board base during the molding process through an embedded molding process.

[0011] Wherein, the main bracket and the lower extension section are both made of conductive metal, the electrical bracket is a prefabricated three-dimensional electrical bracket, and the electrical bracket is integrally embedded in the circuit board base during the molding process of the circuit board base.

[0012] Among them, the lower extension section is an LDS circuit made on the outer surface of the circuit board base based on the LDS process, one end of the LDS circuit is electrically connected to the main bracket, and then extends along the top surface of the circuit board base to the outer side surface of the circuit board base, and then extends downward along the outer side surface of the circuit board base to the circuit board, and is electrically connected to the circuit board.

[0013] The circuit board base portion includes a molded base and an actuator base plate, wherein the molded base is directly formed on the upper surface of the circuit board and surrounds the photosensitive chip, and the actuator base plate is installed on the top surface of the molded base.

[0014] The actuator base plate and the frame connecting portion together form an actuator base, and the actuator base is integrally formed.

[0015] Wherein, the main bracket is embedded in the actuator base plate, and the position sensor is installed on the upper surface of the actuator base plate.

[0016] Wherein, the main bracket is made of conductive metal, the actuator base is made by an embedded injection molding process, and the main bracket is embedded in the actuator base plate when the actuator base is formed.

[0017] The lower extension section is made of conductive metal, the molded base is directly made on the upper surface of the circuit board based on a molding process, and the lower extension section is embedded in the molded base when the molded base is formed.

[0018] Wherein, the bottom surface of the actuator base is mounted on the top surface of the molded base, and the main bracket is electrically connected to the lower extension section.

[0019] Among them, the molded base is directly made on the upper surface of the circuit board based on the molding process, the lower extension section is made on the outer surface of the molded base based on the LDS process, the bottom surface of the actuator base is installed on the top surface of the molded base, and the main bracket is electrically connected to the lower extension section.

[0020] Wherein, the main bracket is embedded in the top area of ​​the molded base, and the position sensor is installed on the upper surface of the molded base.

[0021] Wherein, the main bracket and the lower extension section are both made of conductive metal, the electrical bracket is a prefabricated three-dimensional electrical bracket, and the electrical bracket is integrally embedded in the molded base during the molding process of the molded base.

[0022] Wherein, the main bracket is a conductive metal bracket, and the main bracket is embedded in the top area of ​​the molded base during the molding process of the molded base through an embedded molding process; the lower extension section is an LDS circuit made on the outer surface of the molded base based on the LDS process; wherein one end of the LDS circuit is electrically connected to the main bracket, and then extends along the top surface of the molded base to the outer side surface of the molded base, and then extends downward along the outer side surface of the molded base to the circuit board, and is electrically connected to the circuit board.

[0023] Wherein, the position sensor is a TMR sensor.

[0024] Wherein, an electrode sheet is arranged on the top surface of the circuit board base, and the TMR sensor is electrically connected to the electrical bracket through the electrode sheet.

[0025] The optical actuator further comprises a housing, a suspension system, a driving coil and a driving magnet; the static frame is arranged outside the lens carrier; and the static frame is movably connected to the lens carrier via the suspension system.

[0026] Wherein, the driving coil is installed on the lens carrier, and the driving magnet is installed on the static frame.

[0027] Wherein, the driving coil is installed on the static frame, the driving magnet is installed on the lens carrier, and the driving magnet and the position detection magnet are the same magnet.

[0028] Wherein, the photosensitive component also includes a filter, and the filter is installed on the base of the circuit board.

[0029] Wherein, the suspension system includes a spring sheet, and the spring sheet connects the static frame and the lens carrier.

[0030] Wherein, the photosensitive component also includes an electronic component installed on the upper surface of the circuit board, and the circuit board base covers the electronic component.

[0031] The main bracket is U-shaped and has an electrical connector formed by extending upward. The electrical connector is exposed outside the top surface of the circuit board base, and the driving coil is electrically connected to the electrical connector.

[0032] Compared with the prior art, the present invention has at least one of the following technical effects:

[0033] 1. The present application can help reduce the volume of the camera module by installing the position sensor on the top surface of the circuit board base portion of the composite electrical base, while making the camera module easier to assemble.

[0034] 2. In some embodiments of the present application, the accuracy of position detection can be improved by using a TMR sensor as a position sensor and setting the position sensor on the top surface of the base portion of the circuit board.

[0035] 3. In some embodiments of the present application, an electrical bracket can be embedded in the composite electrical base, which can not only realize the electrical connection between the TMR sensor and the drive coil, but also enhance the structural strength of the composite electrical base, thereby helping to reduce the size of the camera module.

[0036] 4. In some embodiments of the present application, the position of the TMR sensor is calibrated based on the size of the magnetic field sensed by the TMR sensor before assembly, thereby further improving the position sensing accuracy of the final product.

[0037] 5. In some embodiments of the present application, the position of the TMR sensor is calibrated based on the size of the magnetic field sensed by the TMR sensor before assembly, so as to better adapt to the situation where the shape of the detection magnet is irregular.

[0038] 6. In some embodiments of the present application, the electrical bracket is embedded in the composite electrical base in whole or in part through an embedded molding process, which helps to simplify the process and also protects the electrical connection of the module.

[0039] 7. In some embodiments of the present application, a conductive circuit is made on the surface of the molded base through the LDS process to electrically connect the electrical bracket and the circuit board. This solution is more helpful in reducing the module volume than the conventional solution in which the motor pins are welded to the circuit board. At the same time, since the LDS circuit is directly made on the molded base of the photosensitive component, the electrical connection between the circuit board and the electrical bracket can be completed when the photosensitive component is made, thus avoiding the welding between the motor pins and the circuit board during the assembly step of the motor (optical actuator) and the photosensitive component. Avoiding welding between the motor pins and the circuit board can prevent the relative position of the motor and the photosensitive component from being disturbed by the welding step. Since an optical lens is usually installed in the motor, and the photosensitive component has a photosensitive chip, the imaging optical system composed of the optical lens and the photosensitive chip is more sensitive to the relative position change of the motor and the photosensitive component. Therefore, preventing the relative position of the motor and the photosensitive component from being disturbed by the welding step will help improve the optical performance of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1An exploded stereoscopic schematic diagram of a camera module according to an embodiment of the present application is shown;

[0041] Figure 2 A three-dimensional schematic diagram of a photosensitive component in one embodiment of the present application is shown;

[0042] Figure 3a The positional relationship between the electrical bracket and the composite electrical base in one embodiment of the present application is shown;

[0043] Figure 3b The structure of the electrical bracket in one embodiment of the present application is shown;

[0044] Figure 4 A schematic longitudinal cross-sectional view of a photosensitive component according to an embodiment of the present application is shown;

[0045] Figure 5a A first longitudinal cross-sectional schematic diagram of a photosensitive component of another embodiment of the present application is shown;

[0046] Figure 5b A schematic diagram showing the structure of an electrical support in a composite electrical base of a photosensitive component according to another embodiment of the present application is shown;

[0047] Figure 5c A second longitudinal cross-sectional schematic diagram of a photosensitive component of another embodiment of the present application is shown;

[0048] Figure 6 A longitudinal cross-sectional schematic diagram of a photosensitive component with a split composite electrical base in one embodiment of the present application is shown;

[0049] Figure 7 A longitudinal cross-sectional schematic diagram of a photosensitive component with a split composite electrical base in another embodiment of the present application is shown;

[0050] Figure 8 A longitudinal cross-sectional schematic diagram of a photosensitive component with a split composite electrical base in another embodiment of the present application is shown;

[0051] Fig. 9 A schematic longitudinal cross-sectional view of a photosensitive component with a split composite electrical base in yet another embodiment of the present application is shown. DETAILED DESCRIPTION

[0052] In order to better understand the present application, a more detailed description will be made of various aspects of the present application with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0053] It should be noted that in this specification, the expressions of first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teaching of this application, the first subject discussed below can also be referred to as the second subject.

[0054] In the drawings, the thickness, size and shape of objects have been slightly exaggerated for ease of explanation. The drawings are only examples and are not drawn strictly to scale.

[0055] It should also be understood that the terms "comprises", "including", "having", "includes" and / or "comprising", when used in this specification, indicate the presence of the stated features, wholes, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed features rather than modifying the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0056] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by those of ordinary skill in the art.

[0057] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this article have the same meaning as commonly understood by ordinary technicians in the field to which this application belongs. It should also be understood that terms (such as terms defined in commonly used dictionaries) should be interpreted as having the same meaning as their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0058] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0059] Figure 1 The exploded stereoscopic diagram of a camera module according to an embodiment of the present application is shown. The camera module includes an optical lens ( Figure 1The optical lens is not shown in the figure), an optical actuator and a photosensitive component 200. The optical actuator includes a movable lens carrier 110 (the lens carrier can also be called a carrier, which is a dynamic component of the optical actuator), a static frame 120, a housing 130, a suspension system 140, a driving coil 150 and a driving magnet 160. The static frame 120 is arranged outside the lens carrier 110, and the static frame 120 is movably connected to the lens carrier 110 through the suspension system 140. The driving coil 150 and the driving magnet 160 are respectively installed on the lens carrier 110 and the static frame 120. It should be noted that in other embodiments of the present application, the installation positions of the driving coil 150 and the driving magnet 160 can be interchanged, for example, the driving coil 150 can be installed on the static frame 120, and its driving magnet 160 can be installed on the lens carrier 110. The optical lens may be mounted on the lens carrier 110 and is adapted to move relative to the static frame 120 under the drive of a driving element (the driving element includes the driving coil 150 and the driving magnet 160). Further, Figure 2 FIG. 1 is a perspective schematic diagram of a photosensitive component in an embodiment of the present application. Figure 2 In this embodiment, the photosensitive component 200 includes a photosensitive chip 220, a circuit board 230 and a composite electrical base 210 (which can be combined with reference Figure 1 , 2 , 3a, 3b and Figure 6 ), the photosensitive chip 220 is installed on the circuit board 230. The composite electrical base 210 includes a circuit board base portion 211, a frame connecting portion 212 and an electrical bracket 213. The electrical bracket 213 can be combined with reference Figure 3a and Figure 3b , Figure 3a The figure shows the positional relationship between the electrical bracket and the composite electrical base in one embodiment of the present application. Figure 3b The structure of the electrical bracket in one embodiment of the present application is shown. At least a portion of the circuit board base portion 211 is directly formed on the upper surface of the circuit board 230 and surrounds the photosensitive chip 220. In this embodiment, the frame connecting portion 212 is arranged on the top surface of the circuit board base portion 211 and extends upward from the top surface of the circuit board base portion 211 to be fixed to the static frame 120. Figure 3b, the electrical bracket 213 includes a main bracket 214 and a lower extension section 215, the main bracket 214 is formed by extending in a direction parallel to the surface of the photosensitive chip 220; one end of the lower extension section 215 is connected to the main bracket 214, and the other end thereof passes through the circuit board base 211 or extends downward along the side of the circuit board base 211 and is electrically connected to the circuit board 230; the main bracket 214 is embedded in the top area of ​​the circuit board base 211. In this embodiment, the optical actuator also includes a position sensor 216 and a position detection magnet (sometimes also referred to as a detection magnet) provided on the lens carrier 110, the position sensor 216 is installed on the top surface of the circuit board base 211 and is located directly below the position detection magnet, and the position sensor 216 is electrically connected to the main bracket 214. In this embodiment, the composite electrical base 210 can be assembled from a plurality of prefabricated components. As Figure 2 As shown, one of the components constituting the composite electrical base 210 is an actuator base 218, and the other component is a molded base 217 directly formed on the surface of the circuit board. The actuator base 218 can be installed on (for example, attached to) the top surface of the molded base 217. The actuator base 218 can include a base plate 219 and the frame connection part 212. In this embodiment, the frame connection part 212 is four columns arranged in the four corner areas. The frame connection part 212 and the actuator base plate 219 can be integrally formed. For ease of description, the combination of the actuator base plate 219 and the molded base 217 of this embodiment is regarded as the circuit board base part 211. The position sensor 216 can be installed on the upper surface of the actuator base plate 219, and can also be installed on the upper surface of the molded base 217. The various structures of the composite electrical base 210 will be further described below in combination with other embodiments.

[0060] Furthermore, in some embodiments of the present application, the composite electrical base 210 may be integrally formed. Figure 4 A longitudinal cross-sectional schematic diagram of a photosensitive component according to an embodiment of the present application is shown. Figure 4In this embodiment, the circuit board base portion 211 and the frame connection portion 212 are directly made on the upper surface of the circuit board 230 by integral molding based on a molding process. The main bracket 214 is a conductive metal bracket, which is embedded in the top area of ​​the circuit board base portion 211 during the molding process through an embedded molding process. In this embodiment, the optical actuator also includes a position sensor 216 and a position detection magnet disposed on the lens carrier 110, the position sensor 216 is installed on the top surface of the circuit board base portion 211 and is located directly below the position detection magnet, and the position sensor 216 is electrically connected to the main bracket 214. Herein, the position sensor 216 is located directly below the position detection magnet, which can be understood as: in a top-down angle, the central area of ​​the position detection magnet overlaps or substantially overlaps with the central area of ​​the position sensor 216. The magnetic field generated by the position detection magnet provides a changing magnetic signal to the position sensor 216 when the lens carrier (i.e., the dynamic component) moves. The position sensor 216 can sense the magnetic field change of the position detection magnet, and then determine the moving direction and movement amount of the lens carrier according to the magnetic field change. In this embodiment, the position sensor 216 is arranged on the top surface of the circuit board base 211, which can make the position sensor 216 closer to the position detection magnet (relative to the solution in which the position sensor 216 is arranged on the circuit board 230), thereby improving the sensitivity and accuracy of position detection, and it can also be beneficial to reduce the space occupied by the position detection magnet. On the other hand, the position sensor 216 is arranged on the top surface of the circuit board base 211, which can facilitate the automatic assembly of the camera module. Specifically, the top surface of the circuit board base 211 usually has a large flat area, and its surface faces upward, so it is convenient for the automatic capture device (such as a clamp or a nozzle) to move and operate. In actual assembly, the position sensor 216 can be installed on the top surface of the circuit board base 211 first, and then the assembled optical actuator semi-finished product is installed on the frame connection part 212 of the composite electrical base 210. The semi-finished optical actuator may include a lens carrier, a static frame, a housing, a suspension system, a driving coil and a driving magnet. Further, in this embodiment, the height of the camera module can be reduced by directly manufacturing the circuit board base portion 211 and the frame connecting portion 212 on the upper surface of the circuit board 230 in an integral molding process based on a molding process.

[0061] Further, still refer to Figure 4In one embodiment of the present application, for the electrical bracket 213, its main bracket 214 and the lower extension section 215 are both made of conductive metal. The electrical bracket 213 can be a prefabricated three-dimensional electrical bracket, and the electrical bracket 213 is integrally embedded in the circuit board base portion 211 during the molding process of the circuit board base portion 211. That is, the composite electrical base 210 can be directly manufactured on the upper surface of the circuit board 230 using an insert molding process. In this embodiment, the main bracket 214 is formed by extending in a direction parallel to the surface of the photosensitive chip 220, and the main bracket 214 can be U-shaped, which can surround the light-through hole of the composite electrical base 210. In this embodiment, since the electrical bracket 213 embedded in the composite electrical base 210 can play a certain supporting role, the structural strength of the composite electrical base 210 can be improved. Furthermore, since the electrical bracket 213 is embedded in the composite electrical base 210, this part of the circuit does not occupy additional space inside the module, which is beneficial to increase space utilization and reduce the risk of damage to the circuit due to exposure.

[0062] Further, Figure 5a A first longitudinal cross-sectional schematic diagram of a photosensitive component of another embodiment of the present application is shown. Figure 5b A schematic diagram showing the structure of an electrical support in a composite electrical base of a photosensitive component according to another embodiment of the present application is shown. Figure 5c A second longitudinal cross-sectional schematic diagram of a photosensitive component of another embodiment of the present application is shown. The first cross-sectional diagram corresponds to Figure 5b At position A, the second section corresponds to Figure 5b Position B in the reference Figure 5a-5cIn another embodiment of the present application, the main bracket 214 of the electrical bracket 213 can be prefabricated with conductive metal, and the main bracket 214 can be embedded in the top area of ​​the circuit board base 211 based on the insert molding process. The circuit board base 211 and the frame connecting portion 212 can be directly made on the upper surface of the circuit board in an integral manner based on a molding process. In this embodiment, the lower extension section 215 of the electrical bracket 213 is an LDS circuit made on the outer surface of the circuit board base 211 based on the LDS process (LDS can be translated as laser direct molding), one end of the LDS circuit is electrically connected to the main bracket 214, and then extends along the top surface of the circuit board base 211 to the outer side surface of the circuit board base 211, and then extends downward along the outer side surface of the circuit board base 211 to the circuit board, and is electrically connected to the circuit board. Furthermore, in this embodiment, the production of the LDS circuit may include the following steps: first, a LDS plastic is used for injection molding to form a molded base 217 (LDS plastic is a laser-activated plastic of a metal structure composite), and then the outer surface of the molded base 217 is laser-activated to separate the metal structure compound in the plastic containing dopants, and the exposed metal atoms provide a seed layer for the subsequent electroless plating process, which will grow a metal layer with a thickness of 5 to 10 microns in the laser-activated area, and the metal layer can constitute the required LDS circuit. In this embodiment, since the main bracket 214 of the electrical bracket 213 embedded in the composite electrical base 210 can play a certain supporting role, the structural strength of the composite electrical base 210 can be improved. Furthermore, since the main bracket 214 is buried in the interior of the composite electrical base 210, the main bracket 214 can be protected, so that this part of the circuit does not occupy additional internal space of the module, which is conducive to increasing space utilization and reducing the risk of damage to the circuit due to exposure.

[0063] Further, Figure 6 A longitudinal cross-sectional schematic diagram of a photosensitive component with a split composite electrical base in one embodiment of the present application is shown. Figure 6In one embodiment of the present application, the circuit board base portion 211 includes a molded base 217 and an actuator base plate 219, wherein the molded base 217 is directly molded on the upper surface of the circuit board and surrounds the photosensitive chip 220, and the actuator base plate 219 is installed on the top surface of the molded base 217. The actuator base plate 219 and the frame connecting portion 212 together constitute an actuator base 218, and the actuator base 218 can be integrally molded. That is to say, in this embodiment, the actuator base 218 including the actuator base plate 219 and the frame connecting portion 212 can be pre-fabricated, and then the actuator base 218 can be assembled with the module base, so as to obtain the photosensitive component with the composite electrical base 210 required in this embodiment.

[0064] Further, in one embodiment of the present application, the main bracket 214 is a conductive metal bracket, which is embedded in the actuator base plate 219, and the position sensor 216 is installed on the upper surface of the actuator base plate 219. The actuator base 218 is made by an embedded injection molding process, and the main bracket 214 is embedded in the actuator base plate 219 when the actuator base 218 is molded. Further, in this embodiment, the lower extension section 215 is made of conductive metal, the molded base 217 is directly made on the upper surface of the circuit board based on the molding process, and the lower extension section 215 is embedded in the molded base 217 when the molded base 217 is molded. The bottom surface of the actuator base 218 is installed on the top surface of the molded base 217, and the main bracket 214 is electrically connected to the lower extension section 215. In this embodiment, the molded base 217 and the actuator base 218 are each independently molded, and then assembled together to form the composite electrical base 210. In this embodiment, the molded base 217 and the actuator base 218 are each independently molded, so the position sensor (such as a TMR sensor) can be first installed on the actuator base 218, and then the actuator base 218 is assembled with the actuator body and the actuator packaging is completed. Finally, the actuator with the position sensor is installed on the top surface of the molded base 217 of the photosensitive component. In this embodiment, when assembling the actuator base 218 with the actuator body, the center of the TMR sensor can be aligned with the geometric center of the detection magnet by a high-precision centering method, so that the TMR sensor can be in a position where the magnetic field is strong and relatively uniform, thereby improving the sensing accuracy of the TMR sensor.

[0065] Further, Figure 7 A longitudinal cross-sectional schematic diagram of a photosensitive component with a split composite electrical base in another embodiment of the present application is shown. Figure 7In this embodiment, the molded base 217 is directly made on the upper surface of the circuit board based on the molding process, and the lower extension section 215 is made on the outer surface of the molded base 217 based on the LDS process. The main bracket 214 is a conductive metal bracket, which is embedded in the actuator base 219, and the position sensor 216 is installed on the upper surface of the actuator base 219. Among them, the actuator base 218 is made by the insert molding process, and the main bracket 214 is embedded in the actuator base 219 when the actuator base 218 is molded. The bottom surface of the actuator base 218 is installed on the top surface of the molded base 217, and the main bracket 214 is electrically connected to the lower extension section 215. In this embodiment, the lower extension section 215 and the main bracket 214 are separately molded, and this design is conducive to later disassembly and maintenance.

[0066] Further, Figure 8 A longitudinal cross-sectional schematic diagram of a photosensitive component with a split composite electrical base in another embodiment of the present application is shown. Figure 8 In this embodiment, the main bracket 214 is embedded in the top area of ​​the molded base 217, and the position sensor 216 is installed on the upper surface of the molded base 217. The main bracket 214 and the lower extension section 215 are both made of conductive metal, and the electrical bracket 213 is a prefabricated three-dimensional electrical bracket 213, and the electrical bracket 213 is integrally embedded in the molded base 217 during the molding process of the molded base 217. Among them, the main bracket 214 is a conductive metal bracket, and the main bracket 214 is embedded in the top area of ​​the molded base 217 during the molding process of the molded base 217 through an embedded molding process. In this embodiment, the electrical bracket 213 is integrally embedded in the molded base 217, and this one-piece molding manufacturing process simplifies the process flow. In addition, embedding the electrical bracket 213 helps to increase the structural strength of the molded base 217, and then can reduce the volume of the molded base 217 to a certain extent under the premise of ensuring reliability, which helps to miniaturize the camera module.

[0067] Further, Fig. 9 A longitudinal cross-sectional schematic diagram of a photosensitive component with a split composite electrical base in another embodiment of the present application is shown. Fig. 9In this embodiment, the main bracket 214 is embedded in the top area of ​​the mold base 217, and the position sensor 216 is installed on the upper surface of the mold base 217. The lower extension section 215 is an LDS circuit made on the outer surface of the mold base 217 based on the LDS process. One end of the LDS circuit is electrically connected to the main bracket 214, and then extends along the top surface of the mold base 217 to the outer side surface of the mold base 217, and then extends downward along the outer side surface of the mold base 217 to the circuit board, and is electrically connected to the circuit board. In this embodiment, the main bracket 214 is a conductive metal bracket, and the main bracket 214 is embedded in the top area of ​​the mold base 217 during the molding process of the mold base 217 through an embedded molding process. In this embodiment, the lower extension section 215 and the main bracket 214 are formed separately, and this design is conducive to later disassembly, inspection and maintenance.

[0068] In each of the above embodiments, the position sensor 216 may be a TMR sensor. An electrode sheet is provided on the top surface of the circuit board base 211, and the TMR sensor is electrically connected to the electrical bracket 213 through the electrode sheet. In this embodiment, each of the TMR sensors may have four pads, which correspond to the four electrical connection ends of its Wheatstone bridge. The four pads of the TMR sensor may be electrically connected to the four electrode sheets on the top surface of the circuit board base 211 by wire bonding. Compared with the Hall element, the TMR sensor has better temperature stability, higher sensitivity, lower power consumption, better linearity, and does not require an additional magnetic focusing ring structure. The TMR sensor is arranged on the top surface of the composite electrical base 210 and is located directly below the position detection magnet, so that the magnetic field can be better sensed to accurately control the motion accuracy. In other embodiments, the four pads of the TMR sensor may also be electrically connected to the four electrode sheets on the top surface of the circuit board base 211 based on other processes, for example, electrical connection and bonding can be achieved through conductive silver glue.

[0069] Above Figure 8 and Fig. 9In the corresponding embodiment, the position sensors 216 are all installed on the upper surface of the molded base 217. When assembling the camera module, the photosensitive component can also be made and assembled first, and then the position sensor 216 (the position sensor in this paragraph is the TMR sensor, which will not be repeated below) can be calibrated and assembled. Specifically, the position sensor 216 and the actuator main body component containing the detection magnet can be placed above the photosensitive component (for example, by a clamp or a suction cup), and then the position of the position sensor 216 can be fine-tuned on the xoy plane, and the position of the maximum magnetic field can be found and located by the output signal of the position sensor 216 and the position is used as the installation position of the position sensor 216 (referring to the installation position on the xoy plane). After determining the installation position of the position sensor 216, glue (which can be ordinary glue or conductive silver glue) can be arranged on the upper surface of the molded base 217, and then the position sensor 216 can be pasted on the upper surface of the molded base 217. In this embodiment, the calibration assembly is performed based on the size of the magnetic field sensed by the TMR sensor. That is to say, the TMR sensor does not need to be assembled to the geometric center of the detection magnet with high precision alignment, but is assembled in a way of calibrating the magnetic field center. The overall calibration effect of this process is better, and the sensing accuracy of the final product will be higher. In theory, the optimal monitoring position of the sensor is generally at the central position where the detection magnetic field is strong and relatively uniform, so that the sensing center of the TMR is required to overlap with the center of the magnet xoy plane during assembly, but in fact some detection magnets are not so regular, for example, the detection magnet is sometimes irregularly shaped due to space constraints, and the geometric center of the detection magnet is not the position with the strongest and most uniform magnetic field. In some embodiments of the present application, a calibration assembly process is used to determine the installation position of the position sensor 216, which can better adapt to the situation where the detection magnet has an irregular shape, thereby improving the sensing accuracy of the final product. Further, based on the calibration assembly process, during the calibration assembly process of the camera module, it is possible to detect in advance whether the TMR sensor fails, thereby avoiding the risk of scrapping the entire motor (i.e., actuator) due to the failure of the TMR sensor, and reducing the risk of loss.

[0070] Further, in one embodiment of the present application, in the camera module, the driving element of the optical actuator is a voice coil driving element, which includes a driving coil and a driving magnet. The suspension system includes a spring, which connects the static frame and the lens carrier. That is, the lens carrier is suspended on the static frame by the spring. In this embodiment, the driving coil can be installed on the lens carrier, and the driving magnet is installed on the static frame. In the electrical bracket, the main bracket 214 can be U-shaped, and the main bracket 214 has an electrical connector formed by extending upward, and the electrical connector is exposed outside the top surface of the circuit board base 211, and the driving coil is electrically connected to the electrical connector.

[0071] Further, in another embodiment of the present application, in the camera module, the driving element of the optical actuator is a voice coil driving element, which includes a driving coil and a driving magnet. The suspension system includes a spring clip, which connects the static frame and the lens carrier. That is, the lens carrier is suspended on the static frame by the spring clip. In this embodiment, the driving coil can be installed on the static frame, the driving magnet is installed on the lens carrier, and the driving magnet and the position detection magnet are the same magnet. That is to say, the driving magnet and the position detection magnet can share the same magnet, thereby helping to reduce the volume of the camera module.

[0072] Furthermore, combined with reference Figure 4-9 In some embodiments of the present application, the photosensitive component of the camera module may further include a filter 240, and the filter 240 may be installed on the circuit board base 211 (specifically, the inner side of the molded base 217 may have a step, and the filter 240 may be installed on the step). The photosensitive component may also include an electronic component 250 installed on the upper surface of the circuit board 230, and the circuit board base 211 covers the electronic component 250. It should be noted that Figure 1 The filter is not shown.

[0073] Furthermore, combined with reference Figure 3b and Figure 5b In some embodiments of the present application, in the electrical support of the composite module base of the camera module, the main support 214 may have one or more upwardly protruding contacts 214a, and the contacts 214a may be provided on the frame connection portion 212 so that the drive coil is electrically connected to the main support. Specifically, the one or more upwardly protruding contacts 214a may be provided at one or more columns located in the corner area of ​​the frame connection portion 212.

[0074] In this application, LDS is the abbreviation of Laser Direct Structuring, which can be translated as laser direct structuring. The laser direct structuring process was developed by LPKF of Germany. It is a 3D-MID production technology with professional laser processing, injection and electroplating processes. 3D-MID is the abbreviation of Three-dimensional moulded interconnect device. TMR is the abbreviation of Tunnel Magneto-Resistance, and TMR sensor can be translated as tunnel magnetoresistance sensor.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention is described in detail with reference to the embodiments, it should be understood by those skilled in the art that any modification or equivalent replacement of the technical solutions of the present invention does not depart from the spirit and scope of the technical solutions of the present invention and should be included in the scope of the claims of the present invention.

Claims

1. A camera module with an optical actuator, characterized in that: include: An optical lens, an optical actuator and a photosensitive component; the optical actuator comprises a movable lens carrier and a static frame, the optical lens is mounted on the lens carrier and is suitable for moving relative to the static frame under the drive of a driving element; the photosensitive component comprises a photosensitive chip, a circuit board and a composite electrical base, the photosensitive chip is mounted on the circuit board; Wherein, the composite electrical base comprises: A circuit board base portion, at least a portion of which is directly formed on the upper surface of the circuit board and surrounds the photosensitive chip; a frame connecting portion, which is disposed on the top surface of the circuit board base portion and extends upward from the top surface of the circuit board base portion to be fixed to the static frame; and An electrical bracket, comprising a main bracket and a lower extension section, wherein the main bracket is formed by extending in a direction parallel to the surface of the photosensitive chip; one end of the lower extension section is connected to the main bracket, and the other end thereof passes through the circuit board base or extends downward along the side of the circuit board base and is electrically connected to the circuit board; the main bracket is embedded in the top area of ​​the circuit board base; Wherein, the optical actuator also includes a position sensor and a position detection magnet arranged on the lens carrier, the position sensor is installed on the top surface of the circuit board base and is located directly below the position detection magnet, and the position sensor is electrically connected to the main bracket.

2. The camera module according to claim 1, characterized in that: The circuit board base portion and the frame connection portion are directly manufactured on the upper surface of the circuit board in an integral manner based on a molding process.

3. The camera module according to claim 2, characterized in that: The main support is a conductive metal support, which is embedded in the top area of ​​the circuit board base during the molding process through an embedded molding process.

4. The camera module according to claim 3, characterized in that: The main bracket and the lower extension section are both made of conductive metal. The electrical bracket is a prefabricated three-dimensional electrical bracket. The electrical bracket is integrally embedded in the circuit board base during the molding process of the circuit board base.

5. The camera module according to claim 3, characterized in that: The lower extension section is an LDS circuit made on the outer surface of the circuit board base based on the LDS process, one end of the LDS circuit is electrically connected to the main bracket, and then extends along the top surface of the circuit board base to the outer side surface of the circuit board base, and then extends downward along the outer side surface of the circuit board base to the circuit board, and is electrically connected to the circuit board.

6. The camera module according to claim 1, characterized in that: The circuit board base portion includes a molded base and an actuator base plate, wherein the molded base is directly formed on the upper surface of the circuit board and surrounds the photosensitive chip, and the actuator base plate is installed on the top surface of the molded base.

7. The camera module according to claim 6, characterized in that: The actuator base plate and the frame connecting portion together form an actuator base, and the actuator base is integrally formed.

8. The camera module according to claim 6, characterized in that: The main bracket is embedded in the actuator base plate, and the position sensor is installed on the upper surface of the actuator base plate.

9. The camera module according to claim 8, characterized in that: The main bracket is made of conductive metal, the actuator base is made by an embedded injection molding process, and the main bracket is embedded in the actuator base plate when the actuator base is formed.

10. The camera module according to claim 9, characterized in that: The lower extension section is made of conductive metal, the mold base is directly made on the upper surface of the circuit board based on a molding process, and the lower extension section is embedded in the mold base when the mold base is formed.

11. The camera module according to claim 10, characterized in that: The bottom surface of the actuator base is mounted on the top surface of the molded base, and the main bracket is electrically connected to the lower extension section.

12. The camera module according to claim 9, characterized in that: The molded base is directly made on the upper surface of the circuit board based on the molding process, the lower extension section is made on the outer surface of the molded base based on the LDS process, the bottom surface of the actuator base is installed on the top surface of the molded base, and the main bracket is electrically connected to the lower extension section.

13. The camera module according to claim 6, characterized in that: The main support is embedded in the top area of ​​the molded base, and the position sensor is mounted on the upper surface of the molded base.

14. The camera module according to claim 13, characterized in that: The main bracket and the lower extension section are both made of conductive metal. The electrical bracket is a prefabricated three-dimensional electrical bracket. The electrical bracket is integrally embedded in the molded base during the molding process of the molded base.

15. The camera module according to claim 13, characterized in that: The main bracket is a conductive metal bracket, and the main bracket is embedded in the top area of ​​the molded base during the molding process of the molded base through an embedded molding process; The lower extension section is an LDS circuit made on the outer surface of the mold base based on the LDS process; wherein one end of the LDS circuit is electrically connected to the main bracket, and then extends along the top surface of the mold base to the outer side surface of the mold base, and then extends downward along the outer side surface of the mold base to the circuit board, and is electrically connected to the circuit board.

16. The camera module according to any one of claims 1 to 15, characterized in that: The position sensor is a TMR sensor.

17. The camera module according to any one of claim 16, characterized in that: An electrode sheet is disposed on the top surface of the circuit board base portion, and the TMR sensor is electrically connected to the electrical bracket via the electrode sheet.

18. The camera module according to claim 1, characterized in that: The optical actuator further comprises a housing, a suspension system, a driving coil and a driving magnet. The static frame is arranged outside the lens carrier, and the static frame is movably connected to the lens carrier through the suspension system.

19. The camera module according to claim 18, characterized in that: The driving coil is mounted on the lens carrier, and the driving magnet is mounted on the static frame.

20. The camera module according to claim 18, characterized in that: The driving coil is mounted on the static frame, the driving magnet is mounted on the lens carrier, and the driving magnet and the position detection magnet are the same magnet.

21. The camera module according to claim 1, characterized in that: The photosensitive component also includes a filter, and the filter is installed on the base of the circuit board.

22. The camera module according to claim 18, characterized in that: The suspension system includes a spring sheet, which connects the static frame and the lens carrier.

23. The camera module according to claim 18, characterized in that: The photosensitive component also includes an electronic component installed on the upper surface of the circuit board, and the circuit board base covers the electronic component.

24. The camera module according to claim 23, characterized in that: The main support is U-shaped and has an electrical connector formed by extending upward. The electrical connector is exposed outside the top surface of the circuit board base portion, and the driving coil is electrically connected to the electrical connector.

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