Manufacturing Method of Embedded Component Circuit Board and Circuit Board

Abstract

This application relates to the technical field of circuit boards, and specifically discloses a manufacturing method and a circuit board for an embedded component circuit board. Among them, the manufacturing method of the embedded component circuit board includes: providing a frame, the frame is provided with at least one groove; wherein, the depth of the groove is less than the thickness of the frame; filling a first semi-cured slurry in the groove; placing the embedded component in the groove and contacting it with the first semi-cured slurry; wherein, at least one side of the embedded component is spaced from the groove wall of the groove; curing the first semi-cured slurry to fix the embedded component. By the above method, the manufacturing method of the embedded component circuit board in this application can effectively avoid the offset problem of the embedded component in the subsequent processing process, so as to improve the product yield and reduce the production cost.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and particularly to a manufacturing method and a circuit board for an embedded component circuit board. Background Art

[0002] With the development trend of high-density miniaturization of electronic hardware, the surface area of printed circuit boards (PCBs) has been increasingly reduced. However, the number of components surface-mounted on the circuit board has not decreased but increased. Among them, circuit devices (such as capacitors, inductors, resistors, etc.) account for 70%-90% of the number of components in the circuit board and 70%-80% of the substrate area. To meet the increasing density of such mounted components and the requirements for high performance of electronic products, various circuit devices including mounted components can be buried inside the circuit board to further significantly reduce the product size. Summary of the Invention

[0003] The present application provides a manufacturing method and a circuit board for an embedded component circuit board to solve the problems in the prior art that the embedded components are prone to shift during lamination and the manufacturing cost is high.

[0004] On the one hand, the present application provides a manufacturing method for an embedded component circuit board. The manufacturing method for the embedded component circuit board includes: providing a frame with at least one groove; wherein the depth of the groove is less than the thickness of the frame; filling a first semi-cured paste into the groove; placing the embedded component in the groove and contacting it with the first semi-cured paste; wherein at least one side of the embedded component is spaced from the groove wall of the groove; curing the first semi-cured paste to fix the embedded component.

[0005] On the other hand, the present application provides a circuit board. The circuit board includes: a frame with at least one blind groove; an embedded component disposed in the blind groove, and a cured semi-cured paste is filled between at least one side of the embedded component and the groove wall of the blind groove and between the bottom of the embedded component and the bottom of the blind groove; a laminate covering the side of the blind groove opening of the frame.

[0006] The beneficial effect of the present application is: Different from the prior art, the present application fills a first semi-cured paste into the groove of the frame to place the embedded component on the first semi-cured paste, and then the embedded component can be fixed in the frame provided with the groove by curing the first semi-cured paste, thereby effectively avoiding the offset problem of the embedded component in the subsequent processing process, improving the product yield, and reducing the production cost. Description of the Drawings

[0007] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings. Among them:

[0008] Figure 1a is a schematic flowchart of the first embodiment of the manufacturing method of the embedded component circuit board of the present application;

[0009] Figures 1b - 1d is Figure 1a a schematic flowchart of an implementation manner corresponding to S11 - S14 in;

[0010] Figure 2a is a schematic flowchart of the second embodiment of the manufacturing method of the embedded component circuit board of the present application;

[0011] Figure 2b is Figure 2a a schematic structural diagram of an implementation manner corresponding to S25 - S26 in;

[0012] Figure 3a is a schematic flowchart of the second embodiment of the manufacturing method of the embedded component circuit board of the present application;

[0013] Figures 3b - 3f is Figure 3a a schematic structural diagram of an implementation manner corresponding to S35 - S37 in;

[0014] Figure 4 is a schematic structural diagram of an embodiment of the circuit board of the present application. Specific Embodiments

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0016] At present, in embedded component circuit boards, the embedded components are basically fixed inside the circuit board to prevent them from shaking. The corresponding main manufacturing process is as follows: (1) pre-process; (2) etch the single-sided copper of the frame; (3) mill through slots on the frame that can accommodate the embedded components; (4) attach the embedded components to a carrier board through tape; (5) attach the frame with through slots to the carrier board, and place the embedded components in the through slots of the frame; (6) heat and press to make the semi-cured sheet in the frame and / or the semi-cured sheet laminated on one side of the frame corresponding to the opening of the through slot melt and fill the slot of the frame to fix the embedded components; (7) tear off the tape; (6) post-process. However, when using this method, during the lamination of the frame, the embedded components are prone to shift, and the manufacturing cost is high.

[0017] Please refer to Figures 1a - 1d , wherein, Figure 1a is a schematic flow chart of the first embodiment of the manufacturing method of the embedded component circuit board of the present application, Figures 1b - 1d is Figure 1a a schematic flow chart of an implementation manner corresponding to S11 - S14 in

[0018] S11: Provide a frame with at least one slot.

[0019] Specifically, as Figure 1b shown, provide a frame 100 with at least one slot 101. Among them, the frame 100 may specifically include at least one layer of sub-body, or may include at least two layers of sub-bodies. And the through slots 101 are opened at the same position in at least two layers of sub-bodies, and at least one layer of sub-body is not penetrated. And each sub-body can be a copper-clad core board or other materials that can be used to manufacture circuit boards.

[0020] Among them, the depth of the slot 101 is less than the thickness of the frame 100, that is, the slot 101 opened on the frame 100 is a depth-controlled blind slot.

[0021] For convenience of description, in this embodiment, the case where the frame 100 has two slots 101 is taken as an example for description. In other embodiments, only 1, or 3, or 5, etc. any reasonable number of slots 101 may be opened on the frame 100, and the present application does not limit this.

[0022] S12: Fill the first semi-cured slurry into the slot.

[0023] Further, as Figure 1c shown, use the first semi-cured slurry 110 to fill each slot 101 of the frame 100, and according to actual needs, make the filling reach the set filling thickness this time.

[0024] It is understandable that the first semi-cured paste 110 specifically refers to any reasonable paste in a semi-cured state at room temperature, so as to be able to flow into the groove 101 of the frame 100 for filling it.

[0025] Optionally, the first semi-cured paste 110 is a high thermal conductivity paste or a low coefficient of thermal expansion paste, and specifically can be one or a combination of resin paste, polypropylene paste, and hot melt adhesive; or, the first semi-cured paste 110 can be one or any combination of heat dissipation resin paste and low coefficient of thermal expansion resin paste, so as to be in a fluid state at room temperature and solidify after being heated and baked or irradiated by ultraviolet light.

[0026] S13: Place the embedded component in the groove and make it contact with the first semi-cured paste.

[0027] Furthermore, as Figure 1d shown, corresponding to the number of grooves 101 in the frame 100, at least one embedded component 120 is respectively placed in the groove 101 of the frame 100 and makes contact with the first semi-cured paste 110, and at least one side of each embedded component 120 is spaced from the groove wall of its corresponding groove 101.

[0028] It is understandable that corresponding to multiple grooves 101, the number of corresponding embedded components 120 can also include multiple, and the types of the multiple embedded components 120 can be the same or different, and the present application does not make any limitation thereto.

[0029] Optionally, the thickness of the embedded component 120 is less than the depth of the groove 101. In other embodiments, the thickness of the embedded component 120 can also be equal to or greater than the thickness of the frame 100, and the present application does not make any limitation thereto.

[0030] Optionally, when the first semi-cured paste 110 filled in each groove 101 is in the process of pasting the embedded component 120 on one side of the first semi-cured paste 110, due to being squeezed, the embedded component 120 can be partially or wholly embedded in the first semi-cured paste 110, that is, after the embedded component 120 is set, the first semi-cured paste 110 may not fill the interval between the embedded component 120 and the groove wall of the groove 101, or may fill the interval between the embedded component 120 and the groove wall of the groove 101, or may overflow the interval, and the present application does not make any limitation thereto.

[0031] Optionally, the embedded component 120 is at least one of any reasonable embedded components 120 such as chips, capacitor components, inductor components, resistor components, power devices, magnetic cores, and ferrites, and the present application does not make any limitation thereto.

[0032] Taking the embedded component 120 as an inductive component as an example, the steps of arranging the embedded component 120 in the groove 101 may specifically include: embedding the inductive component onto an inductive framework to form an inductive assembly. The inductive framework is used to assist the inductive component to maintain an upright state during the process of the framework 100 sleeving the inductive component with the groove 101, so that the inductive component always maintains a preset distance from the side wall of the groove 101.

[0033] Place the inductive assembly into the groove 101 of the framework 100, and bond the inductive assembly to the bottom of the groove 101 with the first semi-cured paste 110. The purpose of bonding the inductive assembly to the bottom of the groove 101 is to prevent the inductive assembly from tipping over and keep the inductive assembly in an upright state all the time. The inductive assembly can stand on the upper surface of the first semi-cured paste 110 at the bottom of the groove 101, or can be partially immersed in the first semi-cured paste 110, or can be completely buried in the first semi-cured paste 110.

[0034] S14: Cure the first semi-cured paste to fix the embedded component.

[0035] Furthermore, as Figure 1d shown, after the embedded component 120 is attached to one side of the first semi-cured paste 110 and partially or wholly embedded in the first semi-cured paste 110, cure the first semi-cured paste 110. For example, heat the first semi-cured paste 110 for baking and curing, or irradiate with a set line to cure the semi-cured paste 110, so as to further fix the embedded component 120.

[0036] Optionally, the framework 100 is a single-layer copper clad laminate, and the thickness of the corresponding embedded component 120 is not greater than 0.5 mm, and the thickness of the cured first semi-cured paste 110 is not greater than the depth of the groove 101 of the framework 100.

[0037] Optionally, the framework 100 specifically includes a multi-layer copper clad laminate, and a semi-cured sheet is laminated between every two adjacent copper clad laminates of the multi-layer copper clad laminate.

[0038] It can be understood that when the first semi-cured paste 110 is heated and baked for curing, the semi-cured sheet in the framework 100 can also melt and partially flow into the groove 101 to be mixed with the first semi-cured paste 110 to fill the gap between the embedded component 120 and the groove wall of the groove 101.

[0039] Optionally, the first semi-cured paste 110 can be made of the same material as the semi-cured sheet or different materials, and the present application does not limit this.

[0040] Further, in one embodiment, step S14 of the method for manufacturing the embedded component circuit board of the present application further specifically includes: heating the first semi-cured paste 110 to a first set temperature and maintaining it for a first set time, then raising it to a second set temperature and maintaining it for a second set time to cure the first semi-cured paste 110, thereby fixing the embedded component 120.

[0041] Among them, the first semi-cured paste 110 can specifically be one of the pastes that is fluid at room temperature and can be cured after being heated. When the first semi-cured paste 110, the frame 100, and the embedded component 120 are placed in an oven, the first semi-cured paste 110 is heated to the first set temperature and maintained for the first set time, then the temperature in the oven is raised to the second set temperature, and after maintaining it for the second set time, it is taken out. The first semi-cured paste 110 can be cured to fix the embedded component 120.

[0042] Optionally, the first set temperature is 105°C - 115°C, the first set time is 55 - 65 minutes; and the second set temperature is 145°C - 155°C, the second set time is 25 - 35 minutes.

[0043] Further, in one embodiment, step S14 of the method for manufacturing the embedded component circuit board of the present application can further specifically include: irradiating the first semi-cured paste 110 with ultraviolet light to cure the first semi-cured paste 110, thereby fixing the embedded component 120.

[0044] It can be understood that the first semi-cured paste 110 can specifically be one of the pastes that is fluid at room temperature and can be cured after being irradiated by UV (ultraviolet light). When irradiating the first semi-cured paste 110 with ultraviolet light, the first semi-cured paste 110 can be cured to fix the embedded component 120.

[0045] Please refer to Figures 2a - 2b , where Figure 2a is a flowchart of the second embodiment of the method for manufacturing the embedded component circuit board of the present application, Figure 2b and Figure 2a is a schematic structural diagram of an implementation manner corresponding to S25 - S26 in Figure 1a . The method for manufacturing the embedded component circuit board in this embodiment is a flowchart of a refined embodiment of the method for manufacturing the embedded component circuit board in

[0046] S21: Provide a frame with at least one groove.

[0047] S22: Fill the first semi-cured paste in the groove body.

[0048] S23: Place the embedded component in the groove body and make it contact with the first semi-cured paste.

[0049] S24: Cure the first semi-cured paste to fix the embedded component.

[0050] Among them, S21, S22, S23 and S24 are respectively the same as Figure 1a S11, S12, S13 and S14 in, for specific details, please refer to S11, S12, S13 and S14 and their related text descriptions, which will not be elaborated here.

[0051] S25: Fill the second semi-cured paste in the gap and make the second semi-cured paste fill the groove body.

[0052] Specifically, as Figure 2b shown, after curing the first semi-cured paste 210 to fix the embedded component 220, further fill the second semi-cured paste 230 in the gap between the embedded component 220 and the groove wall of the groove body in the frame 200, and make the second semi-cured paste 230 fill the groove body.

[0053] Optionally, the second semi-cured paste 230 is the same as the first semi-cured paste 210, and can be filled into the groove body of the frame 200 in two separate times by the same semi-cured paste to fill the groove body. In other embodiments, the second semi-cured paste 230 can also be different from the first semi-cured paste 210, and the present application does not make any limitation thereto.

[0054] It can be understood that the frame 200, the first semi-cured paste 210 and the embedded component 220 in this embodiment are respectively the same as the frame 100, the first semi-cured paste 110 and the embedded component 120 in the first embodiment of the present application. For specific details, please refer to Figures 1b - 1d and the related text description, which will not be elaborated here.

[0055] S26: Cure the second semi-cured paste.

[0056] Furthermore, as Figure 2b shown, after filling the gap between the embedded component 220 and the groove wall of the groove body with the second semi-cured paste 230, cure the second semi-cured paste 230 to fix the embedded component 220 again.

[0057] Optionally, in one embodiment, the operation of curing the first prepreg 210 in S24 can be placed after S25, that is, finally, the first prepreg 210 and the second prepreg 230 are cured together.

[0058] It can be understood that, in order to control the prepreg filled in the groove of the frame 200 so that it will not overflow too much outside the groove or leave too much gap between the embedded component 220 and the groove wall of the groove after the embedded component 220 is placed in the groove, the prepreg can be specifically divided into a first prepreg 210 and a second prepreg 230, and filled in two times.

[0059] Specifically, after the embedded component 220 is attached to one side of the first prepreg 210, the second prepreg 230 is continuously filled into the gap between the embedded component 220 and the groove wall of the groove and fills the gap. And the second prepreg 230 can be baked and cured in the oven together with the first prepreg 210 to fix the embedded component 220, instead of curing in two times.

[0060] Please refer to Figures 3a - 3e , wherein, Figure 3a is a schematic flowchart of the second embodiment of the manufacturing method of the embedded component circuit board of the present application, Figures 3b - 3e is Figure 3a a schematic structural diagram of an implementation manner corresponding to S35 - S37 in Figure 1a The manufacturing method of the embedded component circuit board in this embodiment is a schematic flowchart of a refined embodiment of the manufacturing method of the embedded component circuit board in

[0061] S31: Provide a frame, and the frame is provided with at least one groove.

[0062] S32: Fill the first prepreg in the groove.

[0063] S33: Place the embedded component in the groove and contact it with the first prepreg.

[0064] S34: Cure the first prepreg to fix the embedded component.

[0065] Among them, S31, S32, S33 and S34 are respectively the same as S11, S12, S13 and S14 in Figure 1a , and for details, please refer to S11, S12, S13 and S14 and their related text descriptions, which will not be repeated here.

[0066] S35: Stack prepreg on one side of the frame with the embedded component fixed corresponding to the opening of the groove.

[0067] Specifically, as Figure 3b shown, after curing the first semi-cured paste 310 to fix the embedded component 320, a semi-cured sheet 330 is further laminated on one side of the frame 300 where the embedded component 320 is fixed and corresponding to the opening of the slot body.

[0068] It can be understood that the frame 300, the first semi-cured paste 310, and the embedded component 320 in this embodiment are the same as the frame 100, the first semi-cured paste 110, and the embedded component 120 in the first embodiment of the present application. For specific details, please refer to Figures 1b - 1d and the relevant text descriptions, which will not be elaborated here.

[0069] S36: A copper clad laminate is laminated on the side of the semi-cured sheet facing away from the frame.

[0070] Further, as Figure 3c shown, a copper clad laminate 340 is further laminated on the side of the semi-cured sheet 330 facing away from the frame 300.

[0071] S37: The frame with the embedded component, the semi-cured sheet, and the copper clad laminate are laminated to obtain an embedded component circuit board.

[0072] Still further, as Figure 3d shown, after the semi-cured sheet 330 and the copper clad laminate 340 are sequentially laminated on one side of the frame 300 where the embedded component 320 is fixed and corresponding to the opening of the slot body, the frame 300, the semi-cured sheet 330, and the copper clad laminate 340 are laminated so that when the interval between the embedded component 320 and the slot wall of the slot body is not filled with the first semi-cured paste 310, it is filled with the melted semi-cured sheet 330 during this lamination process, thereby obtaining an embedded component circuit board.

[0073] In an optional embodiment, the frame 300 specifically includes multiple layers of copper clad laminates 340, and a semi-cured sheet 330 is laminated between every two adjacent layers of the multiple layers of copper clad laminates 340, and the thickness of the corresponding embedded component 320 is 0.5 - 6 millimeters.

[0074] At this time, the thickness of the cured first semi-cured paste 310 filled in the slot body is less than the depth of the slot body and does not exceed 50 micrometers, that is, the maximum distance between the cured first semi-cured paste 310 and the side surface of the frame 300 corresponding to the opening of the slot body is not greater than 50 micrometers; or, the thickness of the first semi-cured paste 310 filled in the slot body is greater than the depth of the slot body and does not exceed 10 micrometers, that is, the thickness of the first semi-cured paste 310 overflowing outside the slot body is not greater than 10 micrometers.

[0075] In an optional embodiment, as Figure 3e and3f As shown, the depth of the slot of the frame 300 is less than the thickness of the embedded component 320, and vias or grooves are correspondingly formed at the positions of the prepreg 330, or the prepreg 330 and the copper clad laminate 340 that are sequentially laminated on the frame 300 and face the slot, and the cross-sectional dimension of the slot is less than the cross-sectional dimensions of the vias and grooves, so that the slot can be located within the corresponding range of the vias or grooves.

[0076] Furthermore, the side surface of the cured first prepreg paste 310 away from the bottom of the slot is not higher than the height of the side surface of the frame 300 corresponding to the opening direction of the slot; and the maximum distance between the cured first prepreg paste 310 and the side surface of the frame 300 corresponding to the opening of the slot is not greater than 50 microns.

[0077] It can be understood that after sequentially laminating the prepreg 330 and the copper clad laminate 340 on the frame 300, at least one layer of prepreg 330 and copper clad laminate 340 can be further laminated on the copper clad laminate 340, and each adjacent two copper clad laminates 340 are separated by prepreg 330, so as to be further laminated together with the frame 300, the first prepreg paste 310 and the embedded component 320 to obtain the corresponding embedded component circuit board. In other embodiments, the copper clad laminate 340 can also be one of a copper block, copper foil or other materials that can be used to manufacture a circuit board, and the present application does not limit this.

[0078] Based on the overall inventive concept, the present application also provides a circuit board. Please refer to Figure 4 , Figure 4 which is a schematic structural diagram of an embodiment of the circuit board of the present application. The circuit board 4 in this embodiment includes: a frame 41, an embedded component 42, and a laminate 44.

[0079] Among them, the frame 31 is provided with at least one blind slot, and corresponding to the accommodating space of each slot, a corresponding number of embedded components 42 are also provided in the frame 41, and between at least one side of each embedded component 42 and the slot wall of the corresponding blind slot, and between the bottom of the embedded component 42 and the bottom of the blind slot, a cured prepreg paste 43 is filled.

[0080] And the laminate 44 further covers one side of the opening of the blind slot of the frame 41.

[0081] Among them, the laminate 44 specifically includes a filling layer 441 and a copper clad laminate 442, and when the embedded component 42 and the prepreg paste 43 are spaced from the slot wall of the blind slot, the filling layer 441 fills the gap.

[0082] It is understandable that the filling layer 441 is specifically obtained by laminating prepregs (not shown in the figure) provided on the frame 41 and / or prepregs included in the frame 41 (not shown in the figure), melting them during lamination, and then cooling and solidifying them.

[0083] In another embodiment, the laminate 44 may further include a plurality of layers of first copper clad laminates (not shown in the figure) and a plurality of layers of first prepregs (not shown in the figure) that are laminated, and a prepreg is provided between every two adjacent first copper clad laminates, and one of the first prepregs is laminated on the side of the copper clad laminate 442 away from the filling layer 441.

[0084] Specifically, the filling layer 441 is obtained by melting at least one prepreg in the frame 41 and / or at least one first prepreg in the laminate 44 during lamination, and then cooling and solidifying them.

[0085] Optionally, the number of the slots in the frame 41 may specifically be any reasonable number such as 1, 2, or 3, and the present application does not limit this.

[0086] Optionally, the embedded component 42 is at least one of any reasonable embedded components 32 such as a chip, a capacitor component, an inductor component, a resistor component, a power device, a magnetic core, and a ferrite, and the present application does not limit this.

[0087] Optionally, the semi-cured paste 43 may be one or a combination of resin paste, polypropylene paste, and hot melt adhesive; or, the semi-cured paste 43 may be one or any combination of heat-dissipating resin paste and low coefficient of thermal expansion resin paste, so as to be in a semi-cured state at normal temperature and solidify after heating, baking, and cooling.

[0088] Optionally, the frame 41 is a single-layer copper clad laminate, the thickness of the embedded component 42 is not greater than 0.5 mm, and the thickness of the semi-cured paste 43 after curing is not greater than the depth of the slot in the frame 41.

[0089] Optionally, the frame 41 specifically includes a plurality of layers of second copper clad laminates (not shown in the figure), and a prepreg is laminated between every two adjacent layers of the plurality of layers of second copper clad laminates.

[0090] The beneficial effect of the present application is: Different from the prior art, the present application fills the first semi-cured paste in the slot of the frame to place the embedded component on the first semi-cured paste, and then can fix the embedded component in the frame provided with the slot by baking the first semi-cured paste, thereby effectively avoiding the offset problem of the embedded component in the subsequent processing process, improving the product yield, and reducing the production cost.

[0091] The above are only the implementation manners of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present application.

Claims

1. A method for manufacturing an embedded component circuit board, It is characterized in that The method for manufacturing the embedded component circuit board comprises: A frame is provided, wherein the frame is provided with at least one groove body; wherein the depth of the groove body is less than the thickness of the frame; wherein the frame is a single-layer copper-clad laminate, or the frame comprises multiple layers of copper-clad laminates, and a semi-cured sheet is laminated between each two adjacent layers of the copper-clad laminates in the multiple layers of copper-clad laminates; Filling the tank with a first semi-cured slurry; Placing an embedded component in the tank body and contacting the first semi-cured slurry; wherein at least one side of the embedded component is spaced from the tank wall of the tank body, and part or all of the embedded component is embedded in the first semi-cured slurry; The first semi-cured slurry is cured to fix the embedded component.

2. The method for manufacturing an embedded component circuit board according to claim 1, It is characterized in that The filling thickness of the first semi-cured slurry is less than the depth of the slot body and not greater than half of the thickness of the embedded component. After the step of placing the embedded component in the slot body and contacting the embedded component with the first semi-cured slurry and before the step of curing the first semi-cured slurry to fix the embedded component, the method further includes: Filling the gap with a second semi-cured slurry, and allowing the second semi-cured slurry to fill the tank body; The step of curing the first semi-cured slurry to fix the embedded component includes: The first semi-cured paste and the second semi-cured paste are cured to fix the embedded component.

3. The method for manufacturing an embedded component circuit board according to claim 1, It is characterized in that The filling thickness of the first semi-cured slurry is less than the depth of the slot body and is not greater than half of the thickness of the embedded component. After the step of curing the first semi-cured slurry to fix the embedded component, the method further includes: Filling the gap with a second semi-cured slurry, and allowing the second semi-cured slurry to fill the tank body; The second semi-cured slurry is cured.

4. The method for manufacturing an embedded component circuit board according to claim 1, It is characterized in that After the step of curing the first semi-cured slurry to fix the embedded component, the method further includes: A prepreg is laminated on a side surface of the frame to which the embedded element is fixed corresponding to the opening of the slot body; A copper clad plate is laminated on the side of the prepreg facing away from the frame; The frame with the embedded component fixed thereon, the prepreg, and the copper-clad laminate are laminated to obtain the embedded component circuit board.

5. The method for manufacturing an embedded component circuit board according to claim 4, It is characterized in that The thickness of the embedded component is 0.5-6 mm, and the thickness of the first semi-cured slurry filled in the groove after curing is less than the depth of the groove and does not exceed 50 microns, or the thickness of the first semi-cured slurry filled in the groove is greater than the depth of the groove and does not exceed 10 microns.

6. The manufacturing method of the embedded component circuit board according to claim 4, characterized in that, the depth of the groove body is less than the thickness of the embedded component, through holes are formed at the positions of the prepreg and the copper clad laminate facing the groove body, and the cross-sectional dimension of the groove body is less than the cross-sectional dimension of the through holes, and the distance between the cured first half-cured slurry and the hole wall of the through holes is not less than 10 microns.

7. The manufacturing method of the embedded component circuit board according to claim 1, characterized in that, when the frame is a single-layer copper clad laminate, the thickness of the embedded component is not greater than 0.5 mm, and the thickness of the cured first half-cured slurry is not greater than the depth of the groove body.

8. The manufacturing method of the embedded component circuit board according to claim 1, characterized in that, the step of curing the first half-cured slurry to fix the embedded component includes: heating the first half-cured slurry to a first set temperature and maintaining it for a first set time, then raising it to a second set temperature and maintaining it for a second set time to cure the first half-cured slurry, thereby fixing the embedded component.

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