An automated test system for testing individual electronic components and a method of testing individual electronic components

Abstract

An automated test system for testing individual electronic components, the system comprising: a manipulator comprising a plurality of manipulator pickers and / or spinner pickers, each manipulator picker and / or each spinner picker being adapted to pick up one electronic component; at least one processing station for processing one of the electronic components; a first carrier; a second carrier; and a test unit for testing a single electronic component located on a carrier. While a plurality of second electronic components on the second carrier are being tested in the test unit and the plurality of second electronic components rest on the second carrier, simultaneously the first carrier is loaded with a plurality of first electronic components by the plurality of manipulator pickers and / or spinner pickers and / or the first carrier is unloaded from the plurality of first electronic components by the plurality of manipulator pickers and / or spinner pickers.

Description

Technical Field

[0001] Embodiments of the present invention relate to an automated test system for testing individual electronic components. Furthermore, embodiments of the present invention relate to a method for testing individual electronic components. Background Technology

[0002] Because the manufacturing process of semiconductor components is highly complex and sensitive, a significant number of semiconductor components will inevitably fail to function. Therefore, most of the time, semiconductor components need to be tested for their intended characteristics. Various machines exist to perform these tests. However, it may be necessary to provide more flexibility in choosing a machine to perform the tests. Summary of the Invention

[0003] Manipulators and automated test systems may be required to provide greater flexibility for semiconductor testing.

[0004] To meet the above requirements, an automated test system and a test method for testing individual electronic components are provided.

[0005] According to an embodiment of the present invention, an automated test system for testing individual electronic components includes:

[0006] The manipulator includes a plurality of manipulator pickers and / or a plurality of rotator pickers, each of the manipulator pickers and / or each of the rotator pickers being adapted to pick up one electronic component at a time.

[0007] At least one processing station for processing an electronic component picked up by one of the plurality of manipulator pickups.

[0008] The system includes a carrier station unit and a first carrier located within the carrier station unit, wherein the first carrier is adapted to carry a plurality of first electronic components to be tested, and each manipulator pickup and / or each rotator pickup in the manipulator pickup and / or each rotator pickup in the rotator pickup is adapted to place one electronic component on the first carrier at a time, and each manipulator pickup and / or each rotator pickup in the manipulator pickup and / or each rotator pickup in the rotator pickup is adapted to pick up one electronic component from the first carrier at a time.

[0009] The second carrier, wherein the second carrier is adapted to support multiple second electronic components to be tested, and

[0010] The test unit is suitable for testing individual electronic components located on a carrier, wherein...

[0011] -When the plurality of second electronic components are tested in the test unit and the plurality of second electronic components are placed on the second carrier during the test.

[0012] Simultaneously, the first carrier is loaded with multiple first electronic components via multiple manipulator pickups and / or rotator pickups, and / or the first carrier is unloaded from multiple first electronic components via multiple manipulator pickups and / or rotator pickups.

[0013] According to an embodiment of the present invention, a method for testing individual electronic components includes:

[0014] A manipulator is provided, comprising: a plurality of manipulator pickups and / or a plurality of rotator pickups, each of the manipulator pickups and / or rotator pickups being adapted to pick up one electronic component at a time; at least one processing station for processing one electronic component picked up by one of the plurality of manipulator pickups; and a carrier station unit and a first carrier located in the carrier station unit, wherein the first carrier is adapted to support the plurality of first electronic components to be tested. The method comprises: a first carrier, wherein each manipulator pickup and / or each rotator pickup in the manipulator pickup and / or each rotator pickup in the rotator pickup is adapted to place one electronic component on the first carrier at a time, and each rotator pickup in the manipulator pickup and / or each rotator pickup is adapted to pick up one electronic component at a time; and a second carrier, wherein the second carrier is adapted to carry a plurality of second electronic components to be tested; and a test unit for testing individual electronic components located on the carrier, wherein the method includes:

[0015] - When the plurality of second electronic components are placed on the second carrier, the plurality of second electronic components on the second carrier are tested in the test unit, and

[0016] Simultaneously, the plurality of first electronic components are loaded onto the first carrier by a plurality of manipulator pickups and / or rotator pickups, and / or the plurality of first electronic components are unloaded from the first carrier by a plurality of manipulator pickups and / or rotator pickups.

[0017] The term "automated test system" can refer to components used in the back end of semiconductor manufacturing, which may include at least a manipulator and a test procedure. An automated test system may also include test instruments for executing the test procedure.

[0018] The term "test" can refer to inspection, detection, or certification. However, the testing or actions accompanying the test can also include movement and marking. Specifically, here, a semiconductor device can be the object of the test, and therefore the semiconductor device is handled (moved) and detected (tested). Particularly in a narrower sense, testing can include "functional testing," which involves detecting the unique or distinctive electronic characteristics of a semiconductor device or electronic component, including electronic data based on unique mechanical processing. Testing performed through a test unit can include testing at least one of the following sensors: (MEMS) microphones, MEMS microspeakers, environmental sensors (e.g., gas sensors), fingerprint sensors, gyroscope sensors, accelerometers, humidity sensors, pressure sensors, optical sensors, and magnetic sensors.

[0019] The term "processing" can refer to at least one of (optical) inspection, flipping, alignment, testing, and marking of an individual electronic component. The term "processing" can also refer to a series of operations, in this context, including the processing of an individual electronic component, which in a narrow sense includes, for example, marking, calibration, and manipulation, particularly positioning and / or alignment. The expression "individual electronic component" can refer to a device that, based on test results, can be assembled on a PCD, etc., for use in an electronic device. The term "manipulator" can refer to a machine that moves an individual electronic component, also known as a "DUT," i.e., the device under test. The term "processing station" can refer to a location suitable for performing a specific processing or procedure on a single electronic component or a location suitable for performing a specific processing or procedure on a single electronic component.

[0020] The term "pickup device" can refer to a tool or small machine used to pick up an electronic component and place a pen component. Specifically, the pickup device can pick up directly from a carrier and can be placed directly onto or onto the carrier. The pickup device can operate using a vacuum suction cup.

[0021] In this context, the term "simultaneously" can mean that at least two (or more) extended or repeated operations overlap in time, meaning that the at least two operations are performed at least partially at the same time.

[0022] The term "carrier" can specifically refer to a test carrier having a receiving portion for supporting multiple electronic components, in most cases one electronic component is located in one receiving portion, wherein the (single) electronic component rests on the carrier during testing. The term "receiving portion" as used is not intended primarily to describe any mechanical boundary, but rather, in most cases, to describe a predetermined or specific location where an electronic component can be placed. Therefore, the receiving portion can be open if the electronic component is held on the carrier.

[0023] The term "carrier station unit" can refer to a location where a carrier is positioned to receive individual electronic components—for example, an electronic component is located in a receiving section. A pickup can access the carrier station unit to place individual electronic components onto the carrier located within the carrier station unit, and the pickup can access the carrier station unit to remove individual electronic components from the carrier. That is, placing an electronic component can be referred to as "loading," and removing an electronic component can be referred to as "unloading."

[0024] The key point is that the manipulator with multiple pickups for processing individual electronic components can also have a carrier station unit, and the multiple pickups can progressively fill test carriers positioned in the carrier station unit. This allows for the use of automated test equipment and / or manipulators to process individual electronic components individually, and also allows for the use of (test) carriers loaded with individual electronic components for testing in test units, thereby testing electronic components arranged on carriers. By progressively loading electronic components one at a time into the receiving section and onto the carrier by a pickup, and progressively unloading resistive components from the carrier by the pickup, this allows for the use of two incompatible methods of processing and testing electronic components and makes the two methods compatible. Even though processing a single electronic component in the processing station may seem to require a completely different time period than testing the carrier in parallel by the test unit, pickup-driven processing and carrier-driven testing can simultaneously require the same amount of time or at least a comparable amount of time, making the overall processing and supply of the automated test equipment efficient.

[0025] According to an exemplary embodiment, when the plurality of second electronic components on the second carrier are tested in a test unit, and simultaneously the first carrier is loaded with the plurality of first electronic components via a plurality of manipulator pickers and / or rotator pickers, or the first carrier is unloaded from the plurality of first electronic components, the automatic test system includes:

[0026] Simultaneously, at least one processing station processes an electronic component picked up by one of the plurality of manipulator pickers.

[0027] In addition to the simultaneous loading / unloading of the carrier and the testing of the electronic components on the carrier, at least one processing station can simultaneously process an electronic component picked up by one of the plurality of manipulator pickers. Therefore, the three sub-processes can operate at least partially simultaneously.

[0028] According to an exemplary implementation of the automated testing system, each pickup and placement of an electronic component via a manipulator pickup and / or a rotator pickup includes:

[0029] - The movement of a manipulator pickup and / or rotator pickup relative to the carrier.

[0030] The term "motion" can refer to movement or motion that may originate from the pickup and / or the carrier. This allows electronic components to be placed into different receiving portions on the carrier. The manipulator, pickup, and / or rotator may have additional internal rotational degrees of freedom.

[0031] According to an exemplary implementation of the automated testing system, each pickup and placement of an electronic component via a pickup unit includes:

[0032] - Movement of the load-bearing component, including linear movement in up to three dimensions, and / or

[0033] - The movement of a pickup, the movement including linear and / or rotational movement of the manipulator pickup and / or rotator pickup in up to 3 dimensions.

[0034] The relative motion of the carrier to the pickup may originate from the linear motion of the carrier in up to three dimensions, and / or from the linear motion of the carrier in up to three dimensions and / or from the internal rotational degrees of freedom to move (or rotate).

[0035] According to an exemplary embodiment of the automatic testing system, the carrier station unit includes a first carrier station and a second carrier station. Each of the first and second carrier stations is adapted to receive, carry, and / or move at least one of the first and second carriers, and is adapted to replace the first carrier with the second carrier.

[0036] The carrier station unit may have a first carrier station for receiving, holding, and / or moving carriers, and the carrier station unit may have a second carrier station for receiving, holding, and / or moving other carriers. The carrier station unit may be adapted to exchange and / or position carriers and other carriers, or first carriers and second carriers, respectively.

[0037] According to an exemplary embodiment, the automated testing system further includes at least one additional carrier adapted to be loaded with and unloaded from the additional carrier by a manipulator pickup and / or a rotator pickup, wherein the additional carrier is adapted to allow the additional electronic components to be tested while resting in a receiving portion of the additional carrier.

[0038] There may be a first carrier, a second carrier, and other carriers located within the automated testing equipment. Specifically, one of the three carriers can be tested in a testing unit, while the other two carriers can be located in carrier station units, or in the first and second carrier stations respectively, to be loaded or unloaded. Two carriers in a carrier station unit can be loaded and unloaded simultaneously. For example, two different manipulator pickers and / or rotator pickers can each first load the first carrier and then unload it, or vice versa.

[0039] When using two carriers, the electronic components being tested can be unloaded from one carrier or untested electronic components can be loaded onto one carrier, while the other carrier can be located in the test unit, allowing the electronic components on the other carrier to be tested. Using two carriers may be appropriate when unloading and loading electronic components is faster than testing the same number of electronic components.

[0040] When using three carriers, an empty carrier can wait in the carrier station to be loaded with untested electronic components, while another carrier can be tested in the test unit, and the tested electronic components can be unloaded from the other carrier.

[0041] According to an exemplary embodiment, the automated testing system further includes at least two processing stations, wherein,

[0042] - At least one of the at least two processing stations is located upstream of the carrier station unit, and at least another of the at least two processing stations is located downstream of the carrier station unit.

[0043] The terms "upstream" and "downstream" can refer to a direction from lower to higher, and more specifically, from an earlier time to a later time. That is, the manipulator pickup successively stops at the first processing station, the carrier station unit, and then the second processing station to serve each. Similarly, the carrier station unit can be arranged between two different processing stations.

[0044] According to an exemplary embodiment of the automated testing system, the manipulator also includes a rotator capable of linear movement and rotation about a rotator axis, wherein the plurality of rotator pickers are arranged to point radially outward from the rotator axis.

[0045] In particular, a rotator can be used if it is necessary to flip the electronic components before or after testing.

[0046] According to an exemplary embodiment of the automated testing system, the manipulator also includes a rotary table, wherein the plurality of pickups are arranged at the distal end of a pickup head that extends from the center of the rotary table.

[0047] The term "rotary stage" can refer to a plate that is horizontally arranged and rotates along an axis perpendicular to the plate. A manipulator including a central rotary stage is also called a "turret manipulator." The phrase "arranged at the distal end of the pickup head" can refer to the location of the pickup. There are pickup heads extending radially outward from the axis of the rotary stage, with a pickup positioned at the distal end of each pickup head, one pickup per head. As the rotary stage rotates, the pickup heads with the pickups located at their ends can rotate progressively. Depending on whether the electrons to be tested are part of a so-called "batch," the rotary stage can rotate forward and / or backward. The rotary stage allows a specific number of electronic components to be loaded from a source in one direction and unloaded back to the source in the opposite direction.

[0048] According to an exemplary embodiment, the automated testing system further includes a robot and / or a carrier exchange section, wherein,

[0049] The robot and / or carrier exchange section is adapted to receive a first carrier having a plurality of first electronic components and to transfer the first carrier to a test unit. After the first carrier is transferred, the robot and / or carrier exchange section is completely removed from the test unit.

[0050] The term "robot" can refer to something that automatically performs complex, frequently repetitive tasks. In this context, a robot can pick up a carrier component and transport or move it to different locations, particularly to a test cell, and if necessary, inside the test cell. The robot can completely remove itself from the test cell after positioning the carrier component inside. The same applies to a "carrier exchange section," where, unlike the robot, the carrier exchange section only allows linear movement of the carrier component. The carrier exchange section can completely remove itself from the test cell after placing the carrier component inside. However, the carrier exchange section can be arranged inside the test cell such that it can be moved from the test position of the carrier component into the manipulator.

[0051] According to an exemplary embodiment of the automated testing system, the testing unit is a microphone testing unit suitable for testing microphones.

[0052] The test unit can be a microphone test unit or include a microphone test unit.

[0053] According to an exemplary embodiment, the automatic testing system further includes at least one of a tester, a soaking station, a dehumidification station, or another testing unit, wherein,

[0054] At least two of the manipulator, test unit, tester, soaking station, dehumidification station, and other test units have different occupied areas.

[0055] The term "occupied area" can refer to the area on the ground (in this case, the test bench) covered by something. For example, both the test unit and other test units can have different occupied areas, and each can have an occupied area different from that of the manipulator on the test bench. Both the test unit and other test units can be almost independent machines with their own power supply, and can be controlled in different ways than the manipulator. Test units, other test units, and other parts of the automated test system, such as testers, soaking stations, dehumidification stations, etc., may include rollers if they have their own occupied areas. The term "roller" can refer to movement on a roller or wheel. That is, the first test unit, the second test unit, the manipulator, and all other parts with their own occupied areas may also have rollers or wheels.

[0056] According to an exemplary embodiment, the method includes: while testing a plurality of second electronic components on a second carrier in a test unit, simultaneously loading a first carrier with the plurality of first electronic components using the plurality of pickups and / or unloading the plurality of first electronic components from the first carrier using the plurality of pickups.

[0057] - Simultaneously, an electronic component picked up by one of a plurality of pickups is processed through at least one processing station.

[0058] According to an exemplary embodiment, the method further includes: picking up an electronic component from the carrier each time via a pickup and placing an electronic component in the carrier, comprising:

[0059] - This causes the pickup and the carrier to move relative to each other.

[0060] According to an exemplary embodiment, the method includes: picking up and placing an electronic component each time via a pickup device, including:

[0061] - To move the carrier, the movement including linear motion in up to three dimensions, and / or

[0062] - To move the pickup, wherein the movement includes linear motion and / or rotational motion of the pickup in up to three dimensions.

[0063] An automated test system for testing individual electronic components includes: a manipulator comprising a plurality of pickups, each pickup adapted to pick up one electronic component; at least one processing station for processing one of the electronic components; a first carrier; a second carrier; and a test unit for testing the individual electronic components located on the carriers. While the plurality of second electronic components on the second carrier are being tested in the test unit and resting on the second carrier, the first carrier is simultaneously loaded with the plurality of first electronic components via the plurality of pickups, and / or the first carrier is unloaded from the plurality of first electronic components via the plurality of pickups.

[0064] The above-defined aspects and other aspects of the invention will become apparent from the examples of embodiments described below, and will be explained with reference to these examples. The invention will be described in more detail below with reference to examples of embodiments, but the invention is not limited thereto. Attached Figure Description

[0065] Figure 1 An implementation of an automated test apparatus for testing different types of electronic components is shown;

[0066] Figure 2 This is a detailed view of the automated testing equipment, which includes a view of the rotary manipulator.

[0067] Figure 3An open microphone test module including an internal chamber and a carrier is shown;

[0068] Figure 4 A closed microphone test module including an internal chamber and a carrier is shown;

[0069] Figures 5a to 5i The process of loading and unloading electronic components is illustrated schematically.

[0070] Figure 6 This is an overview of different implementations of automated testing equipment;

[0071] Figure 7A A manipulator pickup located at the distal end of the pickup head is shown;

[0072] Figure 7B The interaction between the manipulator pickup and the rotator pickup is shown. Detailed Implementation

[0073] The illustrations in the accompanying drawings are schematic. It should be noted that similar or identical elements are given the same reference numerals in different drawings.

[0074] Figure 1 An automated test apparatus 300 for testing different types of electronic components is shown.

[0075] The automated test equipment 300 includes a tester 480 and a manipulator 400, which includes multiple processing stations 430-1 to 430-5, or the multiple processing stations 430-1 to 430-5 are collectively referred to as processing station 430. Specifically, the automated test equipment 300 may provide a microphone test module 100 and two additional test modules 100' and 100'' for testing MEMS devices or other electronic components.

[0076] Manipulator 400 also includes a component loader 310 for loading untested electronic components and a component unloader 390 for unloading tested electronic components, particularly MEMS devices such as MEMS microphones. Loader 310 can load individual electronic components 800u from at least one source such as wafers, trays, tube bowls, etc. Unloader 390 can unload tested electronic components 800u into reels, tubes, and / or bulk components. Manipulator 400 is designed as a turret manipulator, including a rotary table 410 having a specific direction of rotation 501. Different processing stations 430-1 to 430-5 surround the rotary table 410 to provide multiple steps in the back-end processing of the electronic components. Manipulator 400 with rotary table 410 may also be referred to as a "turret manipulator".

[0077] Around and near the rotary table 410, the carrier 400 may include a carrier station unit 550. The manipulator 400 may place individual electronic components on the first carrier 810 and / or the second carrier 820. The carriers 810, 820 may be further transferred to the sound test module 100 in a more known linear manner via the carrier exchange section 250, or the carriers 810, 820 may be transferred from the carrier station unit 550 to the sound test module 100 by the robot 350. Therefore, the robot 350 may include a free and three-dimensionally movable arm 353, which includes a rotatable gripper 355, such that the robot 350 can pick up the carriers 810, 820 at different positions and place them at different positions with different orientations. Robot 350 can position the carriers 810 and 820 inside the sound test module 100 or test module 100″ or on the carrier exchange section 250 of the sound test module 100.

[0078] A gap or air gap 103 may exist between the microphone test module 100 and the carrier exchange section 250 to prevent structurally propagated sound from propagating toward the microphone test module 100. The tester 480 may be connected to the sound test module 100 via a cable 483.

[0079] Test module 100' can be connected to manipulator 400 in different ways, such that there is a tight connection between manipulator and test module 100', and carriers 810, 820 can be supplied directly to test module 100' from carrier station unit 550. Therefore, carrier exchange section 250 can be partially or completely arranged inside test module 100'. However, test module 100' can be a standalone module that can be easily disconnected from manipulator 400 and can, for example, be connected to another manipulator.

[0080] Each of the manipulator 400, robot 350, microphone test module 100, two test modules 100' and 100'', and tester 480 can have its own occupied area on the test bench, so that the manipulator occupied area 402, the robot occupied area 352, the microphone test module occupied area 102, the other two test modules occupied areas 102' and 102'', and the tester occupied area are different from each other. It can be emphasized that the aforementioned components of the automatic test equipment 300 can be easily replaced because each of the mentioned components is an independent device. Furthermore, the microphone test module 100 can be used to perform microphone testing, while suppressing structurally propagated sound through the gap 103 and modifying the test conditions for the microphone test.

[0081] The replaceability of test module 100′ (or 100, 100″) can also be represented by module boundary 492. Furthermore, carrier station unit boundary 491 shows the transition from manipulator 400 to carrier station unit 550, which can also be a replaceable module, depending on the carriers 810, 820 used. These carriers 810, 820 can be changed, for example, if the MEMS chip being tested is a so-called top-port type or bottom-port type, or may have contact portions on both sides.

[0082] Figure 2 It has already been used Figure 1 A more detailed view of the automated testing equipment 300 described herein, with only a few additions primarily used here. Figure 2The automatic testing equipment 300 may additionally include an immersion station 460 for temperature control of the carriers 810, 820 in their respective immersion chambers. The immersion station 460 may have its own separate immersion station area 462, distinct from any other area of ​​the module in the automatic testing equipment 300, making it a separate, independent module that can be replaced for the purpose of temperature control of the carriers 810, 820 or corresponding electronic components on the carriers 810, 820. Similarly, the dehumidification station 470 is a similarly independent and replaceable module with its own separate dehumidification station area 472. Compared to the immersion station 460, the dehumidification station 472 may be located downstream of the processing path of the carriers 810, 820. Within the carrier station unit 550, there may be a first carrier station 551 for receiving the first carrier 810. The second carrier station 552, which is adjacent to the first carrier station 551, may also be part of the carrier station unit 550, and the second carrier station 552 may be adapted to receive the second carrier 820.

[0083] The manipulator 400 includes a plurality of pickup heads 420 extending radially from the rotary table 410, wherein a rotatable pickup 210 is disposed at the distal end of each pickup head 420. The rotatable pickup 210 allows for the precise placement of electronic components onto the carriers 810, 820. The relative movement 555 of the first carrier station 551 and the second carrier station 552 relative to the rotatable pickup 210 allows for the placement of electronic components at any available location on the carriers 810, 820, such that the carriers 810, 820 can be fully filled where appropriate. By rotation 556 of the rotatable pickup and relative movement 555 in the xy directions in the main plane of the carrier station unit 550, electronic components can be placed on and picked up from the carriers 810, 820 in any direction and from any location. However, compared to any other processing station 430 or processing stations 430-1 to 430-4, the first carrier station 551 and the second carrier station 552 may require a larger area, thus omitting areas typically equipped with processing stations 430 on both outer sides of the adjacently arranged first carrier station 551 and second carrier station 552. Otherwise, the first carrier station 551 and the second carrier station 552 may not operate correctly. The two omitted areas may be referred to as or used as the first unused station 441 and the second unused station 442.

[0084] Figure 3 and Figure 4 An embodiment of the microphone testing module 100 is shown, wherein, in Figure 3In this configuration, the microphone testing module 100 is in an open or receiving state to receive the carrier 810, which has an untested microphone 800u located in the receiving portion of the carrier 810. Figure 4 In the diagram, the microphone test module 100 is shown as being in a closed or test state.

[0085] The microphone test module 100 includes an outer chamber 130 having an outer chamber opening 132o through which a carrier 810 carrying a microphone 800u can be inserted via a carrier supply 513. The outer chamber 130 may also include an outer chamber door 132, which can be closed by an external closing movement 152o for testing. When the outer chamber door 132 is closed, the outer chamber 130 can be hermetically sealed. Furthermore, the microphone test module 100 may include an inner chamber 120 located inside the outer chamber 130 and containing a sound chamber 110. The sound chamber 110 may include a first half 111 and a second half 112, thereby providing a sound chamber opening 110o for receiving the carrier 810. In addition, the inner chamber 120 includes an inner chamber opening 122o and is equipped with an inner chamber door 122, which is closed by an inner closing movement 152i to provide an airtight seal during testing.

[0086] The inner chamber 120 is suspended from the inner top of the outer chamber 130 by at least one of a ferromagnetic material 161, a diamagnetic material 162, an electromagnet 163, or an elastic suspension member 165, to prevent structurally propagated sound or any other mechanical vibration from the outer chamber 130 to the inner chamber 120 and thus to the sound chamber 110. However, when using the ferromagnetic material 161, at least one additional suspension member may be required because it may be necessary to control and adjust the total suspension force of the ferromagnetic material 161 on the inner chamber 120. The elastic suspension member 165 may include an elastic rubber cord and any elastic material adapted to elastically suspend the inner chamber 120 and ultimately elastically suspend the first half 111 and the second half 112 of the sound test chamber disposed within the inner chamber 120. The first half 111 of the sound test chamber may be mounted to the inner top of the inner chamber 120. At least one or more suspension hooks 165h at the end of the suspension member 165 can directly support the inner chamber 120 from the outside on the bottom of the inner chamber 120, so that the sound propagating from the structure has to travel a longer distance from the outer chamber 130 to reach the outer bottom of the inner chamber 120, and thus the sound propagating from the structure can be suppressed.

[0087] Both the positioning device 133 and the mating actuator 151f can be supported from the interior bottom of the inner chamber 120. The mating actuator 151f allows the second half 112, i.e., the lower chamber, to be lifted toward the first half (upper chamber) 111, such that the second half 112 and the first half 111 can form a sound chamber 110 when they are brought together by the mating movement 151. Furthermore, the alignment device 113 includes an alignment pin 113p mounted on the first half 111 of the sound chamber and an alignment guide 113g mounted on the second half 112 of the sound chamber, such that the sound chamber 110 is aligned when the first half 111 and the second half 112 are brought together and compressed together or brought toward each other and compressed toward each other.

[0088] Specifically, the actuator 151f can be positioned in the closed position 151g and can support the first half 111 and the second half 112 of the sound chamber pressed together, because the inner chamber 120 is already soundproofed to the outside of the outer chamber 130. The sealing ring 114 can additionally provide an airtight seal between the sound chamber 110 and the internal space of the inner chamber 120. The outer chamber 130 can have a spring-loaded foot 155 or an air-spring type foot to further suppress externally generated airborne sound. However, the supply cable 171 can still pass through the outer chamber 130 at a point 155v, and an airtight seal can also be provided at that point 155v. The supply cable 171 can include internal and / or external loops to the outer chamber 130.

[0089] Now, a vacuum space with a vacuum pressure V is formed between the outer chamber 130 and the inner chamber 120, which makes the sound chamber pressure T more stable because the pressure inside the inner chamber can be close to or correspond to the ambient pressure A.

[0090] Figures 5a to 5i This is an illustrative description of the following method: an untested electronic component 800u is placed on a first carrier 810 at 512, and a tested electronic component 800t is unloaded from the first carrier 810 at 517. Simultaneously, a second carrier 820, carrying the previously loaded untested electronic component 800u, is loaded into test modules 100', 100'' to test the electronic component 800u on the second carrier 820. Figures 5a to 5i The described method includes a complete loop that involves exchanging the first carrier 810 with the second carrier 820 and vice versa.

[0091] Figure 5aA manipulator 400 with two rotatable pickups 210 is shown, with reference to one rotatable pickup 210i for initializing the process and another rotatable pickup 210t for unloading the tested component 800t. The movement of the two rotatable pickups 210i, 210t in the rotation direction 501 can be gradual. Therefore, the rotatable pickups 210i, 210t are generally identical but differ in the aforementioned functions and are substituted for each other sequentially.

[0092] The entire process begins with component placement 512 on the first carrier 810, which is supplied by the rotatable pickup 210i for untested electronic components 800u. Therefore, the rotatable pickup 210i for unloading the untested components can be empty at the very beginning of the process. The first carrier 810 and the second carrier 820 can be positioned on carrier station units, and specifically, the first carrier 810 can be positioned on the first or left carrier station 551, while the second carrier 820 can be positioned on the second or right carrier station 552. The relative movement 555 (in the xy direction) of the first carrier 810 relative to the untested electronic components 800u held by the rotatable pickup 210i allows for the component placement 512 to be repeated stepwise on the first carrier 810. Relative motion 555 can be achieved by moving the first carrier station 551 relative to the rotatable pickup 210i, moving the rotatable pickup 210i relative to the first carrier station 551, or moving both the first carrier station 551 and the rotatable pickup 210i. Furthermore, any of the rotatable pickups 210 can be rotated 556. Movement of the first carrier station 551 can be caused directly or indirectly by the carrier station unit 550.

[0093] Initially, untested electronic components 800u can be used to sequentially fill the empty first carrier 810e until the first carrier is filled to a certain extent by untested components 810fu. Typically, the first carrier 810fu can be gradually filled until it is completely filled. However, the number of untested components can vary, for example, depending on the test run time or the speed at which the untested electronic components 800u are placed 512 on the carriers 810 and 820.

[0094] Subsequently, the filled first carrier 810fu can be loaded 513 into test modules 100, 100'.

[0095] Figure 5bThe second carrier 820 is shown to be moved by a left-right movement 526 to a position for receiving the untested electronic component 800. The left-right movement 526 can be equivalent to movement from the second, right-side carrier station 552 to the first, left-side carrier station 551. The initiation of the first carrier test 514i can be pre-initialized, simultaneously initialized, or subsequently initialized so that the untested electronic component 800u on the first carrier 810 can be tested, which can be abbreviated using the terminology of the first carrier test 514.

[0096] The carrier station unit boundary 491 is marked with a corresponding dashed line, and it can be emphasized that the carrier station unit 550 can be installed to the manipulator 400 and can be easily replaced from the manipulator 400. Similarly, the module boundary 492, marked with a corresponding dashed line, can be emphasized that the test modules 100, 100' can also be replaced.

[0097] Figure 5c The diagram shows a second carrier 820 positioned on the first, left-side carrier portion 551, such that the initially empty second carrier 820 (empty second carrier 820e) is sequentially filled 522 with untested electronic components 800u, and thus the initially empty second carrier 820 becomes a second carrier 820fu filled with untested components. The process shown is similar to... Figure 5a The process is the same, except that the placement 522 of the untested electronic component is on the second carrier 820, and the first carrier test 514 can be run simultaneously. At some point, the second carrier 820fu can be filled to the required level, and the first carrier test 514f can be completed.

[0098] Figure 5d The exchange between the first carrier 810 and the second carrier 820 is illustrated. First, the first carrier 810ft, loaded with the tested electronic component 800t, can be loaded from test modules 100, 100' to carrier station unit 550 and then transferred to the second, right-side carrier station 552. Subsequently, the second carrier 820fu can be loaded into the test modules 100, 100', ready for testing. Since the last untested electronic component 800u has been placed on the second carrier 820, the rotatable pickup 210e is empty.

[0099] Figure 5e and Figure 5fThe central step within the complete procedure is shown because the first carrier 810 is filled with the tested electronic component 800t, and the first carrier 810 is positioned on the first, left-side carrier portion 551. Simultaneously, the second carrier 820 is loaded into the test modules 100, 100', and the second carrier test 524i is initiated and running. This central procedure is related to... Figure 5h and Figure 5i Repeat, wherein only the first carrier 810 and the second carrier 820 are interchanged.

[0100] With the gradual movement 501, the empty rotatable pickup 210e (see...) Figure 5d The work begins by unloading the first tested component 800t from the corresponding position 817t on the first carrier 810ft to the rotatable pickup 210f via unloading 517. Subsequently, the gradual movement 501 can... Figure 5f The central state shown is described.

[0101] exist Figure 5f In this process, the rotatable pickup 210i provides new untested electronic components 800u, while the tested electronic components 800t unloaded from the rotatable pickup 210t will be transferred for further processing within the manipulator 400. That is, the new untested electronic components 800u are placed on the first carrier 810 at position 512 (similar to...). Figure 5a The tested electronic component 800t in position 817t was replaced, and position 817t became the corresponding position 812u on the first carrier 810.

[0102] By sequentially (with intermittent, stepwise movement 501) unloading the tested electronic component 800t from the filling position 817t 517 and then loading the untested electronic component 800u 512 to the same position 812u, the first carrier 810 can be replaced with the untested electronic component 800u, and thus the first carrier 810 is removed from the position as... Figure 5e The first carrier 810ft shown becomes the first carrier 810fu. It may be useful to replace the electronic component 800t with 800u because the first carrier 810 can be placed in the same position relative to the manipulator 400 on the carrier station unit 550, while the new rotatable pickup 210i with 501i movement sequentially provides the untested electronic component 800u.

[0103] During the replacement of this component, the second carrier can be tested 524 until test 524f is completed.

[0104] As already mentioned, Figure 5h and Figure 5i Corresponding to Figure 5e and Figure 5f Only the first carrier 810 and the second carrier 820 are interchanged. (Refer to...) Figure 5e and Figure 5e A similar situation applies to Figure 5g This is because the described sub-steps are related to Figure 5d The sub-steps are the same.

[0105] When the first carrier 810 and the second carrier 820 are exchanged Figure 5g and Figure 5d The only difference is that the rotatable pickup 210t is the same, except that... Figure 5d The middle section can be empty, and the rotatable pickup 210t can be independent of this sub-step because the rotatable pickup 210 has stopped working and will be removed with the subsequent movement 501. Specifically, with... Figure 5e This also applies to Figure 5h .

[0106] Therefore, for Figure 5g , Figure 5h and Figure 5i In other words, refer to respectively Figure 5d , Figure 5e and Figure 5f It should also be noted that the first carrier 810 and the second carrier 820 are interchangeable (as well as all reference numerals related to the first carrier 811 and the second carrier 820).

[0107] It should be noted that other implementations are possible, especially if the two carriers 810 and 820 can be loaded and unloaded simultaneously.

[0108] Figure 6 The different, fundamentally compatible variants marked with Roman numerals I through IX are illustrated schematically.

[0109] I and II

[0110] In particular, variants I and II can represent the stepwise movement 501 of the rotary table 410 already shown (see...). Figure 1 , Figure 2 The embodiments described and replaced with those in Figure 5 are as follows. The progressive movements 501′ and 502″ are shown as linear movements, but are not limited thereto, and the progressive movements in Figure 5 are not necessarily circular movements.

[0111] Ⅰ

[0112] The stepwise motion 501' can be described as the linear motion of the untested electronic component 800u and the tested electronic component 800t, wherein one step is performed after another, with additional intermittent sub-steps of unloading 507 and loading 502 of the carrier 810. Therefore, motion 501' can be similar to Figures 5a to 5i The gradual movement 501.

[0113] II

[0114] The stepwise motion 501″ illustrates the simultaneous movement of the untested electronic component 800u and the tested electronic component 800t. This could be useful if the two carriers 810 and 820 were simultaneously loaded 502 and unloaded 507 from two positions of the carrier station unit 550.

[0115] The boundary 491 of the carrier station unit, marked with the corresponding dashed line, emphasizes that, where appropriate, any step movement 501′, 501″ (and 500) can be replaced by another step movement. In particular, the rotary manipulator 400 can be replaced by another type of manipulator that provides linear step movements (501′, 501″), and vice versa.

[0116] III and IV

[0117] III

[0118] In the sections marked with Roman numeral III, sub-steps can be similar to those marked with Roman numeral III. Figures 5a to 5i The described sub-steps. The carrier 810 can be used with... Figures 5a to 5i The motion of the first carrier 810 described is similar to or the same as motions 555 and 506.

[0119] IV

[0120] Roman numeral IV indicates carrier station unit 550, in which two carriers 810 and 820 are simultaneously loaded 502 and unloaded 507 using untested electronic component 800u and tested electronic component 800t, respectively. Furthermore, the two carriers 810 and 820 themselves can be unloaded and loaded from two separate locations within carrier station unit 550.

[0121] If the loading and unloading of the carrier and other sub-steps are fast, the subroutines provided by IV (compared to III) can be useful, such that the subroutines shown in IV allow for the acceleration of the associated manipulator actions (placement and unloading of untested and tested electronic components, respectively).

[0122] V, VI, VII

[0123] As shown by the corresponding dashed line marking the module boundary 492, any module after the carrier station unit 550 can typically be selected in an optional manner, and the selected module can be easily replaced with another selected module. Furthermore, when starting from the carrier station unit 550, even two or more modules can be used.

[0124] V shows a carrier exchange section 250, which can be used to directly transfer the carrier 810 from the carrier station unit 550 to the test modules 100, 100'. Roman numeral VI shows an immersion station 460, which can be aligned with one or two carrier exchange sections 250 to heat the untested electronic components 800u on the first carrier 810 to a specific temperature. The immersion station 460 can be used independently or can include the exchange section 250 as a component, and can also be a component of the test modules 100, 100'. Typically, the round-trip movement 503, 505 of the first carrier 810 from the carrier station unit 550 can be linear or can be a mechanically predetermined movement. Furthermore, the movement of the first carrier from the carrier exchange section 250 or the immersion station 460 toward the test modules 100, 100″ can be linear and / or in a predetermined manner. The dehumidification station 470, indicated by the Roman numeral VIII, can be used and connected within the automated test system 300 in the same manner as the carrier exchange station 250 and the immersion station 460, the only difference being that if the first carrier 810 is to be temperature-controlled using the immersion station 460, the dehumidification station 470 required for dehumidifying the first carrier 810 (and the tested electronic components 800t) can be located after the immersion station 460.

[0125] VII

[0126] As an alternative and with greater flexibility, robot 350 can serve as a central turntable, allowing for any movement within a specific radius of robot 350. Therefore, robot 350 can replace and extend predetermined movements, and robot 350 can directly target any of the stations and modules already mentioned, such as carrier station unit 550, carrier exchange section 250, soaking station 470, dehumidification station 470, and test modules 100, 100″.

[0127] IX

[0128] Various test modules 100, 100″ can be used to provide a variety of tests 514 for the untested electronic components 800u in the first carrier 810.

[0129] Figure 7AA manipulator pickup 210 is shown located at the distal end of the pickup head 420. The manipulator pickup 210 moves to an area above a carrier station unit 550, which includes a first carrier station 551 and a second carrier station 552, via a linear, stepwise movement 501. A carrier 810 with electronic components 800u / 800t can be located on either the first carrier station 551 or the second carrier station 552. Through vertical and horizontal movements 235, the manipulator pickup 210, carrying one electronic component 800u to be tested at a time, can place the electronic component 800 on an empty receiving portion of the carriers 810, 820, or the manipulator pickup 210 can pick up one electronic component 800t from the carrier 820 at a time.

[0130] Figure 7B The interaction between the manipulator pickup 210 and the rotator 230 is illustrated. The progressive movement 501' of the manipulator pickup 210 can stop above the rotator 230, allowing the rotator 230 to pick up one electronic component 800u at a time using one of the multiple rotator pickups 220. Then, by rotation 236 about the rotator axis 231, the rotator 230 can rotate the electronic component to an inverted position, and vice versa. The electronic component 800u can be placed on the carrier 810 by the vertical and horizontal movements 235 of the rotator 230. Similarly, the rotator 230 picks up one electronic component 800t at a time, twists the electronic component 800t, and transfers it to the manipulator pickup 210. The manipulator pickup 210 can then transfer the electronic component 800t to the next position via a circular movement 501.

[0131] It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Furthermore, elements described in conjunction with different embodiments may be combined. It should also be noted that the reference numerals in the claims should not be construed as limiting the scope of the claims.

Claims

1. An automated test system (300) for testing individual electronic components (800u), the automated test system comprising: A manipulator (400) includes a plurality of pickups, the plurality of pickups including one or both of a manipulator pickup (210) and a rotator pickup (220), each of the plurality of pickups being adapted to pick up one electronic component (800u) at a time. At least one processing station (430) is configured to process the electronic component (800u) before it is transferred to the carrier station unit by one of the plurality of pickups, wherein processing the electronic component (800u) includes at least one of inspecting, flipping, aligning, marking, and testing the electronic component. The carrier station unit (550) is configured to receive the electronic component from the at least one processing station, load the electronic component onto a plurality of carriers, and unload the electronic component from the plurality of carriers, each of the plurality of carriers having a receiving portion for carrying the electronic component. The first carrier of the plurality of carriers is located in the carrier station unit (550), wherein the first carrier (810) is adapted to carry the plurality of first electronic components to be tested, and wherein, Each of the plurality of pickups is adapted to place one electronic component (800u) on the first carrier (810) at a time, and / or Each of the plurality of pickups is adapted to pick up one electronic component (800u) from the first carrier (810) at a time; The second carrier (820) of the plurality of carriers is adapted to carry the plurality of second electronic components to be tested; Test units (100, 100', 100″) are used to test the electronic component (800u) located on a carrier among the plurality of carriers, with each electronic component resting in a receiving portion of the carrier, wherein the second carrier is located in the test unit, and wherein: When the plurality of second electronic components on the second carrier (820) are tested in the test unit (100) and the plurality of second electronic components are placed on the second carrier (820), Simultaneously, 1) the first carrier (810) is loaded with the plurality of first electronic components via the plurality of pickups, and / or 2) the first carrier (810) is unloaded from the plurality of first electronic components via the plurality of pickups, and Simultaneously, the at least one processing station processes the electronic component before it is transmitted to the carrier unit by one of the plurality of pickups.

2. The automatic testing system (300) according to claim 1, in, While the plurality of second electronic components on the second carrier (820) are being tested in the test unit (100), the plurality of first electronic components are simultaneously loaded onto or unloaded from the first carrier by the plurality of pickups. as well as, Meanwhile, the at least one processing station (430) processes an electronic component (800u) delivered by one of the plurality of pickups.

3. The automatic testing system (300) according to claim 1 or 2, in, Each of the plurality of pickups is adapted to place an electronic component and / or pick up an electronic component from the first carrier at a time by means of the following: The movement of the first support member (810) includes linear movement in up to three dimensions, and / or The motion of one of the plurality of pickups includes: linear motion of the pickup in up to three dimensions; and / or rotatable motion of the pickup.

4. The automatic testing system (300) according to claim 1, in, The carrier station unit (550) includes a first carrier station (551) and a second carrier station (552), each of the first carrier station (551) and the second carrier station (552) being adapted to receive, carry and / or move at least one of the first carrier (810) and the second carrier (820), and both being adapted to replace the first carrier (810) with the second carrier (820).

5. The automatic testing system (300) according to claim 1 further includes: At least one additional carrier, said additional carrier being adapted to be loaded with and unloaded from said additional carrier via one or more of said pickups. The additional carrier is adapted to allow multiple additional electronic components to be tested while being placed in the receiving portion of the additional carrier.

6. The automatic testing system (300) according to claim 1 further includes: At least two processing stations (430), At least one of the at least two processing stations (430-1, 430-2) is located upstream of the carrier station unit (550), and at least one of the at least two processing stations (430-3, 430-4) is located downstream of the carrier station unit (550).

7. The automatic testing system (300) according to claim 1, in, The manipulator (400) includes a rotator (230) capable of linear movement and rotation about a rotator axis (231). The rotator pickup (220) is arranged to point radially outward from the rotator axis (231).

8. The automatic testing system (300) according to claim 1, in, The manipulator (400) includes a rotary table (410), and The manipulator pickup (210) is located at the distal end of the pickup head (420), which extends radially from the center of the rotary table (410).

9. The automatic testing system (300) according to claim 1 further includes: A robot (350) and / or a carrier exchange section (250) adapted to receive the first carrier (810) having the plurality of first electronic components and to transfer the first carrier (810) to the test unit (100), wherein, after the first carrier (810) has been transferred, the robot (350) and / or the carrier exchange section (250) are completely removed from the test unit (100).

10. The automatic testing system (300) according to claim 1, in, The test unit (100) is a microphone test unit (100) adapted to test a microphone.

11. A method for testing an individual electronic component (800u), the method comprising: Provide an automated testing system, the automated testing system comprising: The manipulator includes a plurality of pickups, the plurality of pickups including one or both of a manipulator pickup (210) and a rotator pickup (220), each of the plurality of pickups being adapted to pick up one electronic component (800u) at a time. At least one processing station (430) is configured to process the electronic component before it is transferred to the carrier station unit by one of the plurality of pickups, wherein processing the electronic component includes at least one of inspecting, flipping, aligning, marking, and testing the electronic component; and The carrier station unit (550) is configured to receive the electronic component from the at least one processing station, load the electronic component onto a plurality of carriers, and unload the electronic component from the plurality of carriers, each of the plurality of carriers having a receiving portion for carrying the electronic component, and a first carrier of the plurality of carriers being located in the carrier station unit (550). The first carrier (810) is adapted to carry multiple first electronic components to be tested. Each of the plurality of pickups is adapted to place one electronic component (800u) on the first carrier (810) at a time. Each of the plurality of pickups is adapted to pick up one electronic component (800u) at a time; The second carrier (820) of the plurality of carriers is adapted to carry the plurality of second electronic components to be tested; and Test units (100, 100', 100″) are used to test the electronic components (800u) located on the carriers among the plurality of carriers, with each electronic component resting in the receiving portion of the carrier, wherein the second carrier is located in the test unit; When the plurality of second electronic components are placed on the second carrier (820), the plurality of second electronic components of the second carrier (820) are tested in the test unit (100); Simultaneously, the plurality of first electronic components are loaded onto the first carrier (810) via the plurality of pickups, and / or the plurality of first electronic components are unloaded from the first carrier (810) via the plurality of pickups, and Simultaneously, the at least one processing station processes the electronic component before it is transmitted to the carrier unit by one of the plurality of pickups.

12. The method for testing individual electronic components (800u) according to claim 11, wherein, When the plurality of second electronic components on the second carrier (820) are tested in the test unit (100), the plurality of first electronic components are simultaneously loaded onto the first carrier (810) or unloaded from the first carrier (810) by the plurality of pickups. Meanwhile, the at least one processing station (430) processes an electronic component (800u) picked up by one of the plurality of pickups.

13. The method for testing individual electronic components (800u) according to claim 11 or 12, in, Each of the plurality of pickups is adapted to place an electronic component and / or pick up an electronic component from the first carrier at a time by means of the following: One of the plurality of pickups and the carrier are moved relative to each other.

14. The method for testing individual electronic components (800u) according to claim 11, in, Each of the plurality of pickups is adapted to pick up one electronic component at a time by means of the following: To move one of the plurality of carriers in a linear motion in three dimensions, and / or Moving one of the plurality of pickups, wherein the movement of the one of the plurality of pickups includes: linear movement of the one pickup in up to three dimensions; and / or rotational movement of the one pickup.

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