Photosensitive Component with Anti-Shake Function, Camera Module and Assembly Method Thereof

Abstract

The present invention relates to a photosensitive component with an anti-shake function, which comprises: a photosensitive chip, a circuit board structure, a driving module base connected to the back of the circuit board structure through a connecting shaft, a plurality of magnets installed on the back of the circuit board structure and surrounding the connecting shaft, a plurality of first driving elements and a plurality of second driving elements installed on the driving module base; wherein each first driving element is arranged below a corresponding magnet, the second driving element comprises a fixed shaft installed on the driving module base and an SMA element with one end installed on the fixed shaft and the other end being a free end, and the free end of each SMA element is arranged on the side of a magnet. The present invention also provides a corresponding method for assembling the photosensitive component, as well as a corresponding camera module and its assembling method. The present invention realizes the anti-shake function of the photosensitive component in multiple directions at a relatively small space cost; and it can also simplify the manufacturing process and contribute to mass production.

Description

[0001] Related Applications

[0002] This application claims the priority of the Chinese patent application No. 202010419327.8, titled "Photosensitive Component with Anti-Shake Function, Camera Module and Its Assembly Method", filed on May 18, 2020, and hereby incorporates by reference the entire content of the above application. Technical Field

[0003] The present invention relates to the technical field of camera modules. Specifically, the present invention relates to periscope continuous optical zoom modules and corresponding multi-camera modules. Background Art

[0004] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have developed rapidly and advanced significantly. In recent years, camera modules have been widely used in many fields such as medical treatment, security, and industrial production. Currently, in the consumer electronics field (such as the mobile phone field), the optical image stabilization function has become one of the common functions of camera modules.

[0005] Image stabilization technology was first applied to cameras. Generally, for standard focal length or wide-angle lenses, due to their short focal lengths and light weights, handheld shooting can meet the shooting requirements. However, during the shooting process of telephoto and macro lenses, with the aperture unchanged, sufficient exposure time is required. If shooting handheld at this time, it is very easy to cause shooting jitter. The aperture of a mobile phone itself is limited, and the light input is worrying. To obtain sufficiently clear pictures, a sufficiently long exposure time is required, and at this time, the addition of image stabilization technology is needed. Specifically, when taking pictures with a handheld smartphone, the shaking of the hand will cause a slight tilt of the camera (generally within + / - 0.5 degrees), and this tilt causes a change in the viewing angle of the lens. Taking the lens as a reference object, it is equivalent to the object being photographed moving. Therefore, the formed image will also shift relative to its original position on the image sensor, resulting in the image always being in an unstable state along with the shaking of the hand. Therefore, the addition of image stabilization technology is needed.

[0006] Currently, image stabilization technology can be divided into optical image stabilization, electronic image stabilization, and body sensor image stabilization. If classified according to the degrees of freedom of movement for image stabilization adjustment, it can also be divided into two-axis, three-axis, four-axis, and five-axis image stabilization. Electronic image stabilization generally does not require additional hardware, but requires the DSP to have the ability to handle a large load. Electronic image stabilization usually analyzes the images on the CCD and then compensates using the edge images. However, this compensation method will lose some pixels at the edges. Currently, the common solution is to use a large wide-angle lens. Electronic image stabilization only performs post-processing on the collected data and does not substantially improve the image quality. Instead, it has a certain degree of damage to the overall image quality.

[0007] Optical image stabilization generally requires hardware support. Optical image stabilization corrects "optical axis deviation" through the floating lens of the lens. The principle is that the gyroscope inside the lens detects minute movements, then transmits the signal to the microprocessor. The processor immediately calculates the displacement amount that needs to be compensated, and then through the compensation lens group, compensates according to the shaking direction and displacement amount of the lens, thus effectively compensating for the image blur caused by the shaking of the camera. This anti-shake technology has relatively high requirements for lens manufacturing (currently, the optical image stabilization applied in mobile phones mainly drives the entire lens to move together), and the cost is also relatively high. The effect of the optical image stabilization function is quite obvious. Generally, when this function is turned on, the shutter speed can be increased by 2 - 3 stops, making handheld shooting without blurring. Especially in cameras with large zoom ratios, the effect is even more obvious, because generally, the larger the zoom ratio, even extremely slight shaking will have a great impact on the imaging quality. Therefore, there is a greater demand for the anti-shake function in the case of long focal lengths. Compared with electronic image stabilization, all the pixels in the full-frame image of optical image stabilization are effective pixel points, with stronger practicability, and the image quality can be substantially improved. However, its disadvantages are high design cost, high component cost, large power consumption, and the need for a certain amount of space, resulting in a relatively large volume required for installation. Due to various limitations of optical image stabilization, currently, mobile phone manufacturers generally apply optical image stabilization technology to their mid-to-high-end models.

[0008] In existing optical image stabilization technologies, there are various design schemes based on different degrees of freedom of movement, including two-axis, three-axis, four-axis, five-axis anti-shake, etc. The biggest difference among these design schemes is the directions in which the lens can move. In the past, most mobile phones used two-axis and three-axis anti-shake, and four-axis anti-shake is a further improvement on three-axis anti-shake in terms of function, simultaneously achieving compensation for shaking in the horizontal, vertical, forward tilt, and side tilt directions. Currently, in some four-axis optical image stabilization schemes, through the gyroscope and acceleration sensor in the mobile phone, the shaking in 8 directions is detected at high speed, the signal is transmitted to the microprocessor to immediately calculate the displacement amount that needs to be compensated, and then the data is transmitted to the micro motor in real time to quickly adjust the attitude of the camera module, thus effectively overcoming the image blur caused by the shaking of the mobile phone.

[0009] Furthermore, analyze the shaking during the daily shooting process. First of all, the human eye itself has an extremely "precision" anti-shake system, and shaking has no impact on the human eye. However, for various daily photo-taking scenarios, shaking is often inevitable. The "shaking" in daily mobile phone shooting scenarios can include: camera shake, motion blur, and rolling shutter effect.

[0010] Among them, camera shake mainly refers to the slight physiological muscle and hand vibrations, which are common in taking photos and recording videos. The main cause of camera shake is hand tremors. Hand tremors are the easiest to overcome among the vibrations. Through certain exercises or some poses with better stability, the anti-shake effect can be improved to a certain extent. In addition, a support can be found for the body during shooting, or the mobile phone or camera can be fixed by relying on external facilities (such as a tripod).

[0011] Motion blur can also be called dynamic blur. Motion blur refers to the obvious blur and dragging traces caused by the rapid movement of the picture. There are mainly two reasons for motion blur. One is that the movement speed is faster than the exposure time. The longer the exposure time, the greater the "jitter" of the motion blur. The other is that the continuous movement makes the lens unable to capture each frame of the picture in detail, thus causing dynamic blur.

[0012] The rolling shutter effect is also known as the jelly effect. The formation of this effect is determined by the characteristics of the CMOS sensor. Since most cameras with CMOS sensors use a rolling shutter, which achieves imaging by exposing line by line. For such CMOS sensors, during the shooting process, the image sensor scans line by line and exposes line by line until all pixel points are exposed, thus obtaining a complete picture. Generally speaking, all actions during the shooting process are completed in a very short time, so generally it will not affect the shooting. However, if the object being photographed moves at a high speed or vibrates rapidly relative to the camera, when shooting with a rolling shutter, the line-by-line scanning speed is insufficient, and the shooting result may show situations such as "tilting", "shaking", or "partial exposure". The above phenomena that occur when shooting high-speed moving or rapidly vibrating target objects with a rolling shutter are defined as the jelly effect or the rolling shutter effect.

[0013] It should be noted that currently, the OIS technology on mobile phone modules only corrects the image offset caused by the camera tilt, and does not handle the image problems caused by the up, down, left, and right translation jitters of the camera (this is different from the public's perception, so it is necessary to explain). When shooting distant scenes, the image offset caused by the camera translation jitter can be considered non-existent, and no compensation from the OIS system is required. The image instability completely comes from the tilt jitter of the camera. However, when shooting macro photos, the influence of the camera translation jitter will gradually become apparent. The current mobile phone OIS camera module chooses to ignore the macro shooting problems caused by the translation jitter in order to avoid an overly complex system architecture. Optical image stabilization has a good shooting effect in some special environments: low-light environments, during zooming, when shooting handheld, when shooting while moving, or when shooting in a bumpy state (at this time, the jitter of the external environment is much greater than the jitter caused by the hand, and OIS can greatly reduce the bumpy feeling).

[0014] In order to effectively cope with various types of jitters during the shooting process, a sensor anti-shake technology has emerged in the current market. Currently, the sensor anti-shake technology is mainly applied in the camera field. The technical principle of sensor anti-shake is to install the image sensor on a freely movable bracket, and at the same time, cooperate with a gyroscope to sense the direction and amplitude of the camera's jitter, and then control the sensor to perform corresponding displacement compensation. The irregularity of various jitters makes the sensor anti-shake technology usually rely on multi-axis movement technology to compensate for jitters in multiple directions simultaneously. However, on the other hand, if multi-axis anti-shake is applied to the image sensor, it may lead to an increase in the module volume. Therefore, how to incorporate the sensor anti-shake technology based on multi-axis anti-shake into the limited space of electronic devices such as mobile phones is a major problem faced in the current market.

[0015] Furthermore, when applied to the field of consumer electronic devices such as mobile phones, the anti-shake design of the camera module also needs to consider issues such as the reliability of the device and the production yield. That is to say, the sensor anti-shake solution not only needs to solve the miniaturization problem but also needs to have good operability in the production process to improve the reliability and yield of assembly. Summary of the Invention

[0016] The object of the present invention is to overcome the deficiencies of the prior art and provide a sensor anti-shake solution that can achieve miniaturization.

[0017] To solve the above technical problems, the present invention provides a photosensitive component with an anti-shake function, which includes: a photosensitive chip having a photosensitive surface; a circuit board structure including a circuit board, and the photosensitive chip is installed on the upper surface of the circuit board; a driving module base located below the circuit board structure, and the circuit board structure is connected to the driving module base through a connecting shaft; a plurality of magnets installed on the back of the circuit board structure and surrounding the connecting shaft; a plurality of first driving elements arranged on the upper surface of the driving module base, the top of each first driving element corresponds to a magnet, and each first driving element includes a coil and a magnetic core. When the coil is energized, the magnetic force of the first driving element acts on the magnet to push the circuit board structure to move; one or more fixed shafts fixed to the driving module base and surrounding the connecting shaft; and a plurality of second driving elements, the second driving elements are SMA elements, one end of the SMA element is fixed to the fixed shaft, and the other end is arranged on the side of the magnet, and there is a gap between the SMA element and the magnet in the natural state. In the energized state, the SMA element extends and pushes the magnet from the side, thereby pushing the circuit board structure to move in the horizontal direction, and the horizontal direction is the direction parallel to the photosensitive surface.

[0018] Among them, the circuit board structure further includes a frame-shaped magnet mounting layer, the magnet mounting layer is located on the back surface of the circuit board, the lower surface of the magnet mounting layer has a plurality of magnet mounting positions, and the magnets are mounted on the magnet mounting positions.

[0019] Among them, the circuit board structure further includes a strengthening layer, the strengthening layer is formed on or attached to the lower surface of the circuit board; the magnet mounting layer is attached to the lower surface of the strengthening layer.

[0020] Among them, the strengthening layer is a metal layer or a metal plate.

[0021] Among them, the magnet mounting layer is a square-shaped metal layer or a square-shaped metal plate.

[0022] Among them, the photosensitive component with an anti-shake function is adapted to adjust the inclination angle of the circuit board structure relative to the driving module base by controlling the direction and magnitude of the current in the coils of the plurality of first driving elements.

[0023] Among them, there are four magnets, and these four magnets are respectively mounted at the central positions of the four sides of the square-shaped magnet mounting layer.

[0024] Among them, the center of the magnet mounting layer coincides with the center of the rigid board of the circuit board.

[0025] Among them, the magnet mounting layer has groove-shaped magnet mounting positions, and the magnets are mounted in the groove-shaped magnet mounting positions.

[0026] Among them, the fixed shaft is cylindrical, a plurality of the SMA elements are fixed to the fixed shaft, and the SMA elements are electrically connected to the driving module base through wires.

[0027] Among them, the circuit board has a functional circuit for supporting the photosensitive chip, the driving module base has a driving circuit for supplying current to the coil and the SMA elements, and the functional circuit and the driving circuit are electrically separated from each other.

[0028] Among them, the bottom surface of the driving module base is adapted to rest on the main board of the electronic device, and the bottom surface of the driving module base has a contact array, and the contact array is adapted to be electrically connected to the main board contact array of the main board.

[0029] Among them, the driving module base includes a bottom plate and a support seat extending upward from the periphery of the bottom plate, the support seat surrounds the circuit board structure, and there is a gap between the support seat and the side surface of the circuit board structure.

[0030] Among them, the support seat is adapted to mount a lens assembly.

[0031] Wherein, the photosensitive component further includes: a metal wire that electrically connects the circuit board and the photosensitive chip based on a wire bonding process; an electronic component that is mounted on the upper surface of the circuit board and is disposed outside the photosensitive chip; a molding base that is formed on the upper surface of the circuit board through a molding process and encapsulates the metal wire and the electronic component therein; and a filter that is mounted on the molding base.

[0032] Wherein, relative to the driving module base, the photosensitive chip, the circuit board structure, the metal wire, the electronic component, the molding base, and the filter are taken as a whole and move integrally under the drive of the first driving element and / or the second driving element.

[0033] According to another aspect of the present application, there is also provided an imaging module, which includes: a lens assembly; and any one of the foregoing photosensitive components, and the lens assembly is mounted on the driving module base of the photosensitive component.

[0034] According to still another aspect of the present application, there is also provided an assembling method for a photosensitive component with an anti-shake function, which includes: Step 1) Prepare a photosensitive module and a driving module that are separated from each other; wherein, the photosensitive module includes a circuit board, a photosensitive chip mounted on the front surface of the circuit board, and a plurality of magnets located on the back surface of the circuit board; the driving module includes a driving module base, a plurality of coils and their axes of rotation mounted on the driving module base, and a connecting shaft, the driving module base includes a bottom plate and a support seat formed by extending upward from the periphery of the bottom plate, the bottom of the connecting shaft is connected to the upper surface of the bottom plate, and the plurality of coils and their axes of rotation are distributed around the connecting shaft; and Step 2) Mount the photosensitive module in the driving module; wherein, align the center of the photosensitive chip with the top of the connecting shaft, then fix the bottom of the photosensitive module to the top of the connecting shaft, and make the top of each coil of the driving module correspond to the bottom of one of the magnets of the photosensitive module respectively.

[0035] Wherein, in the Step 1), the driving module further includes: a fixed shaft and a plurality of SMA elements, the fixed shaft is disposed on the upper surface of the bottom plate, one end of each SMA element is fixed to the fixed shaft, and the other end thereof is a free end; the Step 2) further includes: after mounting the photosensitive module in the driving module, the free end of each SMA element of the driving module is disposed on the side of one of the magnets of the photosensitive module, and there is a gap between the free end of the SMA element and the side of the magnet corresponding thereto in the natural state, and the SMA element extends to contact and push the magnet corresponding thereto when the SMA element is energized.

[0036] Among them, in step 1), the method for preparing the photosensitive module includes the following sub-steps: Step 11) Mount the photosensitive chip on the circuit board to obtain a semi-finished photosensitive module; Step 12) Prepare a frame-shaped magnet mounting member, automatically identify and calibrate the mounting positions of the magnets using machine vision technology, and then mount the multiple magnets on the frame-shaped magnet mounting member to obtain a magnet assembly; and Step 13) Mount the magnet assembly on the back of the semi-finished photosensitive module; wherein, based on machine vision technology, the positions of the photosensitive chip and the frame-shaped magnet mounting member are calibrated to make their centers coincide, and then the installation is carried out to obtain a complete photosensitive module.

[0037] Among them, step 11) further includes: electrically connecting the photosensitive chip and the circuit board through a wire bonding process, and installing electronic components on the circuit board; then forming a molding part on the surface of the circuit board through a molding process, the molding part covering the metal wires and electronic components formed by the wire bonding process, and the molding part contacting and covering the edge area of the photosensitive chip; and then installing a color filter on the molding part to obtain the semi-finished photosensitive module.

[0038] Among them, step 11) further includes: attaching or forming a reinforcing layer on the back of the circuit board for the semi-finished photosensitive module; in step 13), the frame-shaped magnet mounting member of the magnet assembly is mounted on the lower surface of the reinforcing layer.

[0039] Among them, in step 1), the method for preparing the drive module includes the following sub-steps: Step 14) Fabricate the drive module base; wherein, first fabricate a circuit frame for laying the drive circuit, and then wrap the circuit frame with a molding material through a molding process to obtain a molded drive module base with the required outer shape; the back of the drive module base has an exposed contact array; Step 15) Assemble a fixed shaft on the upper surface of the bottom plate of the drive module base; Step 16) Set a coil around the shaft and wind the coil on the shaft on the upper surface of the bottom plate of the drive module base; the coil is electrically connected to the drive circuit of the circuit frame; Step 17) Install a plurality of SMA elements on the fixed shaft, one end of the SMA element is fixed to the fixed shaft, and the other end is a free end; the SMA element is electrically connected to the drive circuit of the circuit frame through a wire; and Step 18) Install a connecting shaft at the center of the bottom plate of the drive module base, and the connecting shaft is an elastic support shaft.

[0040] Among them, step 15) and step 14) are completed synchronously, and the fixed shaft and the drive module base are integrally formed.

[0041] According to another aspect of the present application, there is also provided an assembly method for a camera module, which includes: step a) assembling an image sensor component with an anti-shake function according to the assembly method of any one of the previous image sensor components with an anti-shake function; and step b) installing the lens component on the image sensor component with an anti-shake function, wherein the bottom surface of the lens component is installed on the top surface of the support base.

[0042] Compared with the prior art, the present application has at least one of the following technical effects:

[0043] 1. The present application can achieve the anti-shake function of the image sensor component at a relatively small space cost.

[0044] 2. The present application can achieve the anti-shake function of the image sensor component in multiple directions.

[0045] 3. While achieving the anti-shake function, the image sensor component and the camera module of the present application can also enhance the strength of the circuit board, which is beneficial to preventing the image sensor chip from warping.

[0046] 4. The structure and assembly method of the image sensor component of the present application can simplify the manufacturing process, making the chip anti-shake structure easy to assemble, which is conducive to mass production.

[0047] 5. In some embodiments of the present application, a fast assembly method for the chip anti-shake structure is provided. This method can divide the chip anti-shake structure into an image sensor module and a driving module, prefabricate the image sensor module and the driving module respectively, and then assemble the two. Using this method, the automated assembly of the anti-shake module can be achieved.

[0048] 6. In some embodiments of the present application, an assembly method for a camera module with chip anti-shake is provided. This camera module is mainly composed of a lens module, an image sensor module, and a driving module. The lens module, the image sensor module, and the driving module can be prefabricated respectively, and then the three can be automatically assembled, which can effectively improve the production efficiency of such modules.

[0049] 7. The present application can achieve multi-axis anti-shake of the camera module with a relatively small driving force, which is very beneficial for the camera module to use glass lenses (glass lenses are usually heavier than plastic lenses). BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 A three-dimensional schematic diagram of a camera module with an anti-shake function in an embodiment of the present application is shown;

[0051] Figure 2 A side view schematic diagram of the image sensor module in an embodiment of the present application is shown;

[0052] Figure 3a A schematic diagram of the back surface of the circuit board structure in an embodiment of the present application is shown;

[0053] Figure 3b shows Figure 3a a schematic side sectional view of the circuit board structure shown;

[0054] Figure 4 shows a schematic side view of the driving module in an embodiment of the present application;

[0055] Figure 5 shows a schematic top view of the driving module in an embodiment of the present application;

[0056] Figure 6 shows a schematic side view of the assembled driving module and photosensitive module in an embodiment of the present application. Detailed implementation manners

[0057] To better understand the present application, more detailed descriptions of various aspects of the present application will be made with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application and do not limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0058] It should be noted that in this specification, the expressions such as first, second, etc. are only used to distinguish one feature from another feature and do not represent any limitation on the feature. Therefore, without departing from the teachings of the present application, the first subject discussed below may also be referred to as the second subject.

[0059] In the drawings, for the sake of clarity, the thickness, dimensions and shapes of the objects have been slightly exaggerated. The drawings are only examples and are not drawn to an exact scale.

[0060] It should also be understood that the terms "comprises", "comprising", "has", "including" and / or "including having", when used in this specification, denote the presence of the stated features, wholes, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations. Further, when an expression such as "at least one of..." appears after a list of listed features, it modifies the entire list of listed features rather than individual elements in the list. Further, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application". And the term "exemplary" is intended to refer to an example or illustration.

[0061] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by those of ordinary skill in the art.

[0062] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this article have the same meaning as commonly understood by ordinary technicians in the field to which this application belongs. It should also be understood that terms (such as terms defined in commonly used dictionaries) should be interpreted as having the same meaning as their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0063] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0064] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0065] Figure 1 A three-dimensional schematic diagram of a camera module with an anti-shake function in one embodiment of the present application is shown. Figure 1 In this embodiment, the anti-shake camera module includes a lens module 10 for focusing and transmitting light, a photosensitive module for receiving light and converting it into an electrical signal (the photosensitive module is Figure 1 Its shape and structure can be referenced Figure 2 ), and a driving module 30 for realizing chip movement, a photosensitive module 20 (reference Figure 2 ) is installed in the driving module 30, the lens module 10 and the support base of the driving module 30 are bonded together, and at the same time, the optical axis center of the lens module 10 is aligned with the chip center of the photosensitive module 20 to form a camera module. The lens module 10 of this embodiment can also be called a lens assembly. When the camera module is shooting normally, if jitter occurs, the image sensor (i.e., the photosensitive chip) will receive different information, and it is easy to have unclear shooting. Using the anti-shake camera module provided by this embodiment, when the position sensor detects jitter, it will transmit the jitter information to the microprocessor, and the microprocessor controls the driving module installed under the circuit board to drive, so that the circuit board carries the photosensitive chip (the photosensitive chip and the circuit board are bonded together, and when the circuit board is driven to move, it is actually adjusting the position of the chip) according to the specified direction and angle for corresponding adjustment to compensate for the jitter, thereby improving the imaging quality of the camera module.

[0066] In one embodiment, the lens assembly may include an optical lens and a voice coil motor. When taking a picture, the motor can drive the optical lens to move rapidly along the optical axis of the module, thereby realizing the focusing function. In this embodiment, a threaded structure may be adopted to combine the motor and the optical lens. That is, an external thread is provided on the outer side surface of the lens barrel of the optical lens, and an internal thread is provided on the inner side surface of the carrier of the motor. The external thread of the lens matches the internal thread of the motor to achieve the combination between the motor and the lens. Of course, the carrier of the motor and the lens can also be combined together through a traditional adhesive process, bonding the lens to the carrier of the motor. When the carrier of the motor moves relative to the motor housing, it will also drive the lens to move accordingly to achieve the function of autofocus. In this embodiment, the motor housing can be fixed to the support seat of the drive module.

[0067] In another embodiment, the optical lens can also be used as a lens assembly alone. The optical lens is directly bonded to the support seat of the drive module. At this time, the lens of the camera module may not have the focusing function. Of course, in another embodiment, the lens can also be fixed to the drive module base through a threaded structure. Specifically, when manufacturing the drive module, an internal thread can be directly molded at the position where the drive module matches the lens module, which directly matches the external thread of the lens to achieve the connection between the lens and the drive module. This connection method can also eliminate the motor structure in the lens assembly, thereby reducing the height of the module and the complexity of the design. Regarding the focusing function, in some embodiments of the present application, the provided drive module can adjust the photosensitive chip in the z-axis direction. When focusing is required, the drive module can directly drive the chip to move in the z-axis direction to achieve the focusing function (the z-axis direction is the height direction, which is also the direction of the optical axis of the camera module). Specifically, the drive module can be directly used to drive the photosensitive chip to move so that it moves to the center of the optical axis of the lens to achieve the focusing function during the photographing process. Of course, if a motor (such as a voice coil motor) is provided at the lens, during the focusing process, the lens is driven to move by the motor, and at the same time, it cooperates with the movement of the photosensitive chip to achieve faster focusing. The specific design can be selected according to the actual situation.

[0068] Figure 2 A side view schematic diagram of the photosensitive module in an embodiment of the present application is shown. Refer to Figure 2 , in this embodiment, the photosensitive chip 21 can be directly bonded to the upper surface of the circuit board 22, and the photosensitive chip 21 and the circuit board 22 are electrically connected through a wire bonding process. Further, in this embodiment, the gold wire 25 (i.e., the gold wire in the wire bonding process) and some electronic components (such as resistor and capacitor components, Figure 2It is directly molded in the filter holder 24 (not shown in the figure). The filter 23 can be installed in the filter holder 24. The filter 23 can be, for example, blue glass. The photosensitive module structure of this embodiment can not only protect the gold wire 25, but also effectively reduce the height of the filter holder 24. At the same time, the photosensitive chip 21 is encapsulated in the internal space composed of the circuit board 22, the molding base (i.e., the filter holder 24) and the blue glass (i.e., the filter 23), effectively protecting the photosensitive chip 21 and preventing damage to the photosensitive chip 21 caused by dust deposition on the surface of the photosensitive chip 21 or other factors. It should be noted that the surface of the photosensitive chip 21 is highly sensitive to dust. If dirt or dust deposition occurs during operation, it will seriously affect the imaging quality.

[0069] In the above embodiment, after the photosensitive chip and the circuit board are assembled and fixed, they will not move relative to each other during the operation of the camera module. When the driving module drives the circuit board to move, it actually drives the chip to make corresponding adjustment movements. In this embodiment, the molding process can effectively reduce the overall mass of the circuit board. Only an appropriate amount of driving force is required to ensure the movement of the chip during the adjustment of the chip movement, which is beneficial to simplifying the structural design of the driving module. Traditional anti-shake driving generally uses a motor to drive the lens for anti-shake. However, with the improvement of the imaging quality requirements, glass lenses gradually replace plastic lenses due to their good performance. This change makes the lens heavier and requires a greater driving force, thereby increasing the design difficulty of the lens driving structure. By using the method of this embodiment, regardless of the change in the weight of the lens, since the driving module drives the movement of the photosensitive chip, it will not affect the design of the driving structure. It can be seen that this design structure can effectively solve the problem of the current overweight lens.

[0070] Furthermore, Figure 3a shows a schematic diagram of the back surface of the circuit board structure in an embodiment of the present application. Figure 3b shows Figure 3a a schematic side cross-sectional view of the circuit board structure shown. In this embodiment, in order to adapt to the driving module, the structure of the circuit board has been specially designed. Refer to Figure 3a and Figure 3b, the circuit board structure of this embodiment includes a rigid PCB 22a, a flexible FPC 22b, and a connector 22c. A reinforcing layer 26 can be fixed to the back surface of the rigid PCB 22a, and the reinforcing layer 26 can be a metal layer (such as a steel plate). In this embodiment, the reinforcing layer 26 can be formed by prefabricating a reinforcing plate and then attaching the reinforcing plate to the back surface of the rigid PCB 22a by means of bonding or welding. In another embodiment, the reinforcing layer 26 can also be directly formed on the back surface of the rigid PCB 22a. The reinforcing layer 26 is used to enhance the strength of the circuit board 22 and prevent the photosensitive chip 21 from warping. With the increasing requirements for imaging quality in camera modules, large chips are also a major development trend. In this embodiment, the structure of the reinforcing layer 26 is provided to effectively solve the problem of chip warping. Further, the circuit board structure in this embodiment further includes a square magnet fixing layer 27 (which can also be called a magnet mounting layer), and the magnet fixing layer 27 can be bonded (or attached in other ways) to the back surface of the reinforcing layer 26, and the centers of the magnet fixing layer 27 and the reinforcing layer 26 coincide (i.e., coincide with the center of the rigid PCB 22a of the circuit board 21). On the one hand, the magnet fixing layer 27 can be used to fix the magnet 28 to provide conditions for the movement of the driving module 30 (for example, providing a force-bearing structure at one end of the photosensitive module to receive the driving force provided by the driving module 30). On the other hand, the center position of the magnet fixing layer 27 coincides with the center position of the circuit board 22, and the square magnet fixing layer 27 is located in the area near the edge of the circuit board 22, so as to further reinforce the position near the edge area of the circuit board 22 on the basis of the reinforcing layer 26, making the circuit board 22 and the photosensitive chip 21 less likely to warp. In the circuit board structure of this embodiment, a connecting shaft 31 is further provided in the central area of the back surface of the reinforcing layer 26. One end of the connecting shaft 31 is connected to the reinforcing layer 26 (or directly to the circuit board 22), and the other end is connected to the base of the driving module 30 (i.e., the driving module base 32). The entire circuit board structure and the photosensitive chip 21, the filter 23, the molding base (i.e., the filter holder 24), and other accessory components encapsulated inside the molding base mounted on the surface of the circuit board 22 form a combination, and this combination can be regarded as the photosensitive module 20. In this embodiment, this combination can be used as a whole to move relative to the base of the driving module 30 in multiple degrees of freedom to correct the jitter of the chip.

[0071] When the camera module is working, the driving module receives information from the processor and corrects some jitter situations that occur during the shooting process, so that the information received by the photosensitive chip within a single exposure time during the operation of the module is the same, avoiding the phenomena of blurring or double imaging. The base of the driving module may include a bottom plate and a support seat formed by extending upward from the periphery of the bottom plate, and the support seat can surround the photosensitive module. When the photosensitive module is connected to the internal space of the driving module, there may be a certain gap between it and the support seat of the driving module to ensure that when the photosensitive chip and the circuit board structure move, they will not be restricted by the surrounding components, so as to better realize the function of correcting the position of the chip.

[0072] Further, Figure 4 The side view schematic diagram of the driving module in an embodiment of the present application is shown. Refer to Figure 4, in this embodiment, the photosensitive module 20 is connected to the base of the driving module 30 (i.e., the driving module base 32) through the connecting shaft 31. The bottom of the driving module base 32 can directly rest on the main board of the terminal device, and an array of contacts for conducting the circuit can be provided at the bottom of the driving module. When the contacts of the driving module base 32 match the contacts of the main board of the terminal device, the supply of current to the driving module can be achieved. An opening 33 can also be provided on the side wall of the driving module base 32. This opening 33 can allow the PFC flexible board 22b of the circuit board 22 to pass through. Through the connection strip contacts (or the connector 22c) on the PFC flexible board 22b, the supply of current during the operation of the photosensitive chip can be achieved. During the operation of the camera module, current supplies are respectively realized for the circuit board structure and the driving module 30, enabling the two working modules to operate independently and improving the working efficiency of the entire design structure. Specifically, in this embodiment, the circuit board 22 can be connected to a connector 22c through a flexible connection strip (i.e., the PFC flexible board 22b), and then the connector 22c is plugged into the main board of the electronic device to be powered on, thereby realizing the power supply to the circuit board 22 and the data interaction between the electronic device, the circuit board 22, and the photosensitive chip 21. Among them, the side wall of the driving module base 32 can also have a through hole (i.e., the opening 33) to allow the flexible connection strip to pass through. In this embodiment, the driving module base 32 can include a bottom plate 32a and a support seat 32b formed by extending upward from the periphery of the bottom plate 32a. The side wall of the driving module base 32 is the said support seat 32b. On the other hand, a contact array can be provided on the bottom surface of the driving module base 32. This contact array can directly contact the adapted contact array of the main board of the electronic device, thereby realizing the data interaction between the driving module 30 and the electronic device and the power supply to the driving module. The driving circuit of the driving module can be provided in the driving module base 32, and the width of the circuit in the driving module base 32 can be greater than the width of the circuit in the circuit board 22. This design can facilitate providing a larger working current for the driving module 30, thereby enhancing the driving force of the driving module 30. Moreover, the solution of this embodiment can ensure that the driving circuit and the working circuit for supporting the operation of the photosensitive chip (referring to the working circuit located on the circuit board) are electrically separated and will not affect each other, so that both the driving function and the function of the photosensitive chip can be successfully realized.

[0073] Still referring to Figure 4 , in one embodiment, the driving module further includes a first driving element 34. This first driving element 34 includes a coil 34a and a metal iron core (the metal iron core can be regarded as a winding shaft 34b). When the coil is energized, the first driving element 34 will generate magnetism. A magnet is provided at the top position of the first driving element 34, and this magnet is provided in the circuit board structure (i.e., provided in the photosensitive module 20). Specifically, with reference to Figure 3a and Figure 3b, the magnet 28 can be set at the installation position of the square magnet fixing layer 27 of the circuit board structure. This installation position is opposite to the top of the first driving element. In this embodiment, according to the interaction between magnetic poles, the first driving element 34 connected to the driving module 30 changes the position of the circuit board 22 (the magnet and the circuit board are fixed together), thereby driving the position of the photosensitive chip 21 installed on the circuit board 22 to change. Due to the function of the intermediate connecting shaft 31, the middle position of the circuit board 22 is fixed, so the circuit board 22 will tilt in a certain direction. In this structural design, multiple first driving elements can cooperate with each other, enabling the circuit board to achieve correction of pitching and yawing, and more detailed descriptions will be made in combination with other embodiments hereinafter.

[0074] Furthermore, in another embodiment of the present application, the installation position of the square magnet fixing layer can be groove-shaped, which is convenient for using machine vision technology to accurately assemble multiple magnets onto the magnet mounting member (i.e., the magnet fixing layer). On the other hand, the groove-shaped magnet installation position can also bond or fix the magnet more firmly in other ways.

[0075] Still referring to Figure 4 , in one embodiment, the driving module may further include a second driving element 35. The second driving element 35 may include a fixed shaft 35a and an SMA element 35b (SMA is the English abbreviation for shape memory alloy), and the inside of the fixed shaft 35a may be hollow. The SMA element 35b is connected to a wire, and a fixed block may also be connected to one end (free end) of the SMA element 35b. There is a certain gap between this fixed block and the magnet 28 on the circuit board. When the SMA element 35b is energized, due to the characteristics of the SMA material itself, the SMA element 35b will stretch or contract, thereby driving the fixed block connected to it to move, and this fixed block will in turn push the adjacent magnet (i.e., the magnet 28 fixed to the circuit board) to move, so that the circuit board 22 undergoes planar movement (referring to movement in a plane perpendicular to the optical axis), and further drives the photosensitive chip fixed to the circuit board to correct its position. The fixed shafts 35a of the second driving element 35 can be evenly arranged around the connecting shaft. Specifically, four fixed shafts can be arranged around the connecting shaft as the central position to connect the SMA elements and achieve correction of the chip in the horizontal direction.

[0076] Figure 5 Shows a top view schematic diagram of the driving module in an embodiment of the present application. Referring to Figure 5, in this embodiment, the connecting shaft 31 is located at the center of the driving module base 32, and the connecting shaft 31 can be an elastic element. The connecting shaft 31 can connect the photosensitive module 20 and the driving module 30 together. The central positions of the photosensitive module 20 and the driving module 30 are connected by an elastic element, which can not only ensure correction in different directions centered on the connection point, thereby reducing the driving force when structuring the driving circuit board, but also enable the chip to return to the initial position after shooting. The driving module base 32 can be integrally formed with the driving element mounting position (such as around the shaft 34b) fixed on it, or the driving element mounting position can also be assembled and fixed through later processing (such as assembling and fixing the metal iron core serving as the shaft 34b through later processing). For the fixed shaft 35a of the second driving element 35 that realizes the freedom of movement in the horizontal direction, it can be directly integrally formed with the driving module base 32, or it can be formed first and then installed on the driving module base 32.

[0077] Preferably, the fixed shaft of the second driving element that realizes the movement in the horizontal direction is directly arranged together with the base. There can be multiple fixed shafts, and each fixed shaft can be separately set as a support column to lead out the SMA element. The fixed shaft can also be directly designed as a cylindrical shape, and this cylindrical structure can be integrally formed with the base of the driving module. The lead of the SMA element can be placed inside the cylindrical structure to protect the lead. The SMA element in the lead-out section needs to have greater hardness to better realize the movement in the horizontal direction during the process of pushing the circuit board to move. When the SMA element pushes the circuit board to move according to a preset program, it is actually correcting the position of the photosensitive chip (because the photosensitive chip and the circuit board are directly connected together).

[0078] Furthermore, Figure 6 shows a schematic side view structure diagram after the driving module and the photosensitive module in an embodiment of the present application are assembled. Refer to Figure 6 , in this embodiment, the photosensitive module and the driving module are connected together by an intermediate elastic element. When the imaging module works, the photosensitive chip 21 (which can be combined with reference to Figure 2 ) is provided with working current by the circuit board 22, and the driving parts (including the first driving element 34 and the second driving element 35) are provided with current by the driving module base 32. When the imaging module shakes during the working process, the position detection device (not shown in the figure) will detect the shaking situation of the module and transmit this shaking signal to the microprocessor, and the microprocessor will control the driving module 30 to perform corresponding compensation for this shaking situation, thereby effectively preventing the influence of shaking on imaging. The specific implementation principle is as follows.

[0079] Combined with reference to Figure 6 and Figure 4, when the camera module is working, if jitter occurs and causes the chip to tilt, correction of left - right swing is required. A corresponding current will be passed through the coil 34a of the first driving element 34. At this time, a force with a magnetic property opposite to that of the magnet 28 at the bottom of the circuit board 22 will be generated at the top of the first driving element 34. The first driving element 34 and the magnet 28 of the circuit board 22 attract each other. Since the magnet 28 is fixed on the circuit board base, it will also drive the circuit board to move correspondingly, thereby realizing the left - right swing adjustment of the chip. The principle of pitch - roll adjustment is the same as that of left - right swing adjustment. Just arrange the magnet 28 and the first driving element 34 at positions corresponding to pitch - roll. Refer to Figure 3a , for example, when two magnets 28 are arranged at the first magnet mounting position 28a and the second magnet mounting position 28b, and two corresponding first driving elements are arranged at corresponding positions on the driving module base, left - right swing of the photosensitive module can be realized. When two magnets 28 are arranged at the third magnet mounting position 28c and the second magnet mounting position 28d, and two corresponding first driving elements are arranged at corresponding positions on the driving module base, pitch - roll of the photosensitive module can be realized. Further, using the lifting and driving ability of the first driving element, translation of the circuit board relative to the driving module base along the z - axis can also be realized, where the z - axis is the coordinate axis in the vertical direction, and the vertical direction can be regarded as the optical axis direction of the camera module. Further still, still referring to Figure 6 , in this embodiment, one end of the SMA element in the second driving element is fixed to the fixed shaft, and the other end is a free end. The SMA element is arranged in a horizontal posture and has a certain rigidity itself. Each SMA element can correspond to a magnet (this magnet is the magnet on the back of the circuit board for matching with the first driving element). In the natural state, the free end of the SMA element is arranged on the side of its corresponding magnet, and there is a gap between the free end of the SMA element and the side of the corresponding magnet. In the energized state, the temperature of the SMA element rises. Based on the characteristics of the SMA material itself, the SMA element will expand when heated, so that its free end can contact the side of the magnet, and then push the magnet and the circuit board connected to it to move in the horizontal direction. The four SMA elements cooperate with each other to realize the translation of the circuit board in the x - axis and y - axis directions, that is, to realize the translation of the photosensitive module in the x - axis and y - axis directions, where the x - axis and y - axis are two mutually perpendicular coordinate axes in the horizontal direction, and the horizontal direction can be regarded as the direction parallel to the photosensitive surface of the photosensitive chip. The left - right swing described above is the moving direction of rotation around the x - axis, which can be denoted as the Rx direction, and the pitch - roll described above is the moving direction of rotation around the y - axis, which can be denoted as the Ry direction. To sum up, in the camera module of this embodiment, the photosensitive chip (or photosensitive module) can have five degrees of freedom of movement, namely x - axis translation, y - axis translation, z - axis translation, Rx rotation, and Ry rotation, to achieve anti - shake, so it has a strong compensation ability for the jitter of the camera module.

[0080] In the above embodiments, the photosensitive module and the driving module can jointly form a photosensitive component with an anti-shake function.

[0081] The imaging module provided by the present invention can be applied to electronic terminal devices. In some specific practices, these electronic terminal devices can be smartphones, laptop computers, televisions, vehicle-mounted imaging devices, etc. By applying the imaging module of this embodiment, the electronic terminal device not only has an imaging function but also has focusing and anti-shake functions. In addition, the speed of focusing and optical anti-shake can be increased, effectively improving the imaging quality of the module.

[0082] Furthermore, according to an embodiment of the present application, a method for assembling a photosensitive component with an anti-shake function is also provided. This method can prefabricate each component into a photosensitive module and a driving module, and then assemble these two modules to obtain a photosensitive component with an anti-shake function. The assembly method of this embodiment simplifies the complex assembly process, is very suitable for automated production, and has good application prospects. Specifically, the method for assembling a photosensitive component with an anti-shake function of this embodiment includes the following steps.

[0083] Step S1, prepare a photosensitive module and a driving module separated from each other. Among them, the photosensitive module may include a circuit board, a photosensitive chip, a color filter, and a color filter holder. The photosensitive chip is installed on the upper surface (i.e., the front side) of the circuit board, and the color filter holder is installed or directly formed on the upper surface of the photosensitive chip and surrounds the photosensitive chip. For example, the color filter holder can be directly formed on the upper surface of the circuit board through a molding process. The molding part (or called the molding seat) of the color filter holder can cover the gold wire used to connect the photosensitive chip and the circuit board. The molding part can also cover various electronic components (such as capacitors, resistors, etc.) on the circuit board. The color filter is installed on the color filter holder. The lower surface (i.e., the back side) of the circuit board may have a reinforcing layer, and the reinforcing layer can be a metal layer. A frame-shaped magnet mounting member can be installed on the lower surface of the reinforcing layer, and multiple magnets can be installed on the magnet mounting member. The multiple magnets can surround the center of the circuit board (i.e., the photosensitive chip). The driving module includes a driving module base, multiple coils and their winding shafts mounted on the driving module base, a fixed shaft, a connecting shaft, and multiple SMA elements. Among them, each coil corresponds to a magnet fixed to the bottom of the circuit board and is arranged directly below the magnet. The coil can be wound around the winding shaft, and the bottom end of the winding shaft can be fixed to the driving module base. The multiple coils and their winding shafts can be distributed around the connecting shaft. The fixed shaft is a rigid element. One end of the SMA element can be fixed to the fixed shaft, and the other end is a free end, which is arranged on the side of the magnet fixed to the circuit board. In the natural state, the SMA element can be rigid and arranged horizontally, and in the natural state, there is a gap between the free end of the SMA element and the magnet. In the energized state, the SMA element can extend and contact the side of the magnet, thereby pushing the circuit board structure to move in the horizontal direction, and the horizontal direction is the direction parallel to the photosensitive surface of the photosensitive chip. The driving module base may include a bottom plate and a support seat extending upward from the periphery of the bottom plate. The photosensitive module can be arranged in the support seat and has a certain gap with the inner side surface of the support seat to enable the overall movement of the photosensitive module group to achieve anti-shake. Further, the photosensitive component is suspended in the driving module base under the action of the connecting shaft. The side wall of the support seat may also have a through hole, and the through hole can be used for the flexible connection belt of the circuit board to pass through.

[0084] Step S2, install the photosensitive module in the driving module. Among them, the center of the photosensitive chip can be aligned with the top of the connecting shaft, and then the bottom of the photosensitive module can be fixed to (the top of the connecting shaft. The connecting shaft can be an elastic support shaft, which is suitable for supporting the photosensitive module, and at the same time, its elasticity allows the photosensitive module to move when subjected to the driving force of the driving element.

[0085] In step S1, the photosensitive module and the driving module can be prefabricated (i.e., pre-produced). In one embodiment, the method for prefabricating (or producing) the photosensitive module may include the following sub-steps.

[0086] Step S11, assemble the photosensitive chip, the circuit board, and the color filter together. Specifically, the photosensitive chip can be mounted on (e.g., pasted on) the circuit board, and the photosensitive chip is electrically connected to the circuit board through wire bonding technology. Electronic components can be installed on the circuit board (i.e., can be located outside the photosensitive chip). A molding part is formed on the surface of the circuit board through molding technology. The molding part can cover the gold wires (the gold wires formed by wire bonding technology) and the electronic components, and the molding part can contact and cover the edge area of the photosensitive chip (this edge area is a non-photosensitive area). The molding part can serve as a color filter holder, and the color filter can be installed on (e.g., pasted on) the color filter holder.

[0087] Step S12, manufacture the magnet assembly. Specifically, a frame-shaped magnet mounting member can be prepared, and four magnets are mounted at four (or other numbers) set magnet mounting positions. These four magnet mounting positions can be respectively located at the center positions of the four sides of the frame-shaped magnet mounting member. The frame-shaped magnet mounting member can be used to pre-assemble four magnets (or other numbers of magnets) into an integral assembly. During this assembly process, machine vision technology can be used to automatically identify and calibrate the mounting positions of the magnets, so as to ensure that the accuracy of the mounting positions of multiple magnets reaches the preset standard.

[0088] Step S13, mount the magnet assembly on the back of the circuit board. In one embodiment, the frame-shaped magnet mounting member of the magnet assembly can be directly mounted on (e.g., attached to) the back of the circuit board. During the mounting process, based on machine vision technology, the positions of the photosensitive chip (or the circuit board) and the frame-shaped magnet mounting member can be calibrated to make their centers coincide, and then the mounting is carried out to obtain a complete photosensitive module.

[0089] In another embodiment, in step S11, a reinforcing layer (e.g., a metal layer) can be attached or formed on the back of the circuit board. In step S23, the frame-shaped magnet mounting member of the magnet assembly can be mounted on (e.g., attached to) the lower surface of the reinforcing layer. Similarly, during the mounting process, based on machine vision technology, the positions of the photosensitive chip (or the circuit board) and the frame-shaped magnet mounting member can be calibrated to make their centers coincide, and then the mounting is carried out to obtain a complete photosensitive module.

[0090] Furthermore, in another embodiment, the method for prefabricating (or producing) the driving module may include the following sub-steps.

[0091] Step S14, fabricate the driving module base. The driving module base includes a bottom plate and a support base extending upward from the periphery of the bottom plate. The bottom plate and the support base can be integrally formed, or can be prefabricated separately and then assembled into a whole. In this embodiment, the driving module base can incorporate a driving circuit. Specifically, a circuit frame can be fabricated first, and the driving circuit is arranged in the circuit frame. Then, the circuit frame is wrapped with a molding material through a molding process, and after molding, a molded driving module base with the required shape is obtained. The back of the driving module base can have a contact array exposed outside the molded part, and this contact array is located in the circuit frame or is electrically connected to the circuit frame.

[0092] Step S15, assemble the fixed shaft on the upper surface of the bottom plate of the driving module base.

[0093] Step S16, set a coil around the shaft and wind the coil on the shaft on the upper surface of the bottom plate of the driving module base. The coil is electrically connected to the driving circuit of the circuit frame.

[0094] Step S17, install an SMA element on the fixed shaft. The SMA element is made of SMA material and has a certain rigidity. One end of the SMA element is fixed to the fixed shaft, and the other end can be a free end. A fixing block can also be installed at the free end. The SMA element can be electrically connected to the driving circuit of the circuit frame through a wire.

[0095] Step S18, install a connecting shaft at the center of the bottom plate of the driving module base. The connecting shaft can be an elastic support shaft.

[0096] Further, in another embodiment of the present invention, in the above steps, the fixed shaft can be integrally formed with the driving module base. That is, step S15 can be combined with S14.

[0097] It should be noted that in the above embodiment, the photosensitive chip of the assembled camera module has five degrees of freedom of movement, that is, five-axis anti-shake of the photosensitive chip can be achieved. Generally speaking, the more degrees of freedom of movement, the more complex the design of its driving structure, thus increasing the assembly difficulty. In the assembly solution of the present invention, all the circuit structures and wires for driving the chip to move can be concentrated in the driving module. In this way, for the photosensitive module, only a structural member adapted to the driving module needs to be provided on the back of its circuit board, and there is no need to add additional circuits or wires for realizing the movement of the driving chip. Therefore, when assembling the photosensitive module and the driving module, only mechanical connection between the two is required, and no electrical connection between the two is needed. This design greatly reduces the complexity of the assembly process and helps to improve production efficiency and yield.

[0098] Furthermore, the present invention also provides an assembling method for a camera module. This method can prefabricate each component into a lens module, an image sensor module, and a driving module, and then assemble these three modules to obtain a camera module with an anti-shake function. The assembling method of this embodiment simplifies the complex assembly process, is very suitable for automated production, and has good application prospects. In this embodiment, the assembling method of the image sensor component with an anti-shake function described above can be used to assemble the image sensor component, and then the image sensor component is assembled with the lens module. Among them, the bottom surface of the lens module can be mounted on the top surface of the driving module support. The lens module can be an optical lens without a motor. In another embodiment, the lens module can also include a motor and an optical lens. At this time, the bottom surface of the motor is mounted on the top surface of the support of the image sensor component.

[0099] The above description is only the preferred embodiment of the present application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the technical solutions formed by mutually replacing the above features with the (but not limited to) technical features with similar functions disclosed in the present application.

Claims

1. A photosensitive component with an anti-shake function, characterized in that, it includes: a photosensitive chip having a photosensitive surface; a circuit board structure including a circuit board, and the photosensitive chip is mounted on the upper surface of the circuit board; a driving module, including a driving module base, and the circuit board structure is located in the driving module base, a first driving element, and each first driving element includes a coil and a magnetic core, a magnet provided on the circuit board, wherein the tops of the coils respectively correspond to the bottoms of the magnets, a second driving element including a fixed shaft and an SMA element, the fixed shaft is fixed to the driving module base, the SMA element is arranged in a horizontal posture, one end of the SMA element is fixed to the fixed shaft, and the other end thereof is arranged on the side of the magnet. Wherein, the connecting shaft of the driving module is located at the center of the driving module base, and the center of the photosensitive chip is aligned with the top of the connecting shaft. When the coil is energized, the magnetic force of the first driving element acts on the magnet to push the circuit board structure to move in the horizontal direction, or when energized, the SMA element extends and pushes the magnet from the side, thereby pushing the circuit board structure to move in the horizontal direction, and the horizontal direction is the direction parallel to the photosensitive surface.

2. The photosensitive component with an anti-shake function according to claim 1, characterized in that, the circuit board structure further includes a frame-shaped magnet mounting layer located on the back of the circuit board, the lower surface of the magnet mounting layer has a plurality of magnet mounting positions, and the magnets are mounted on the magnet mounting positions.

3. The photosensitive component with an anti-shake function according to claim 2, characterized in that, the circuit board structure further includes a reinforcing layer formed on or attached to the lower surface of the circuit board; the magnet mounting layer is attached to the lower surface of the reinforcing layer.

4. The photosensitive component with an anti-shake function according to claim 3, characterized in that, the reinforcing layer is a metal layer or a metal plate.

5. The photosensitive component with an anti-shake function according to claim 2, characterized in that, the magnet mounting layer is a square-shaped metal layer or a square-shaped metal plate.

6. The photosensitive component with an anti-shake function according to claim 1, characterized in that, the photosensitive component with an anti-shake function is adapted to adjust the inclination angle of the circuit board structure relative to the driving module base by controlling the direction and magnitude of the current in the coils of the plurality of first driving elements.

7. The photosensitive component with an anti-shake function according to claim 5, characterized in that, there are four magnets, and the four magnets are respectively mounted at the central positions of the four sides of the square-shaped magnet mounting layer.

8. The photosensitive component with an anti-shake function according to claim 5, characterized in that, the center of the magnet mounting layer coincides with the center of the rigid board of the circuit board.

9. The photosensitive component with an anti-shake function according to claim 2, characterized in that, the magnet mounting layer has groove-shaped magnet mounting positions, and the magnets are mounted in the groove-shaped magnet mounting positions.

10. The photosensitive component with an anti-shake function according to claim 1, characterized in that, the fixed shaft is cylindrical, a plurality of the SMA elements are fixed to the fixed shaft, and the SMA elements are electrically connected to the driving module base through wires.

11. The photosensitive component with an anti-shake function according to claim 1, characterized in that, the circuit board has a functional circuit for supporting the photosensitive chip, the driving module base has a driving circuit for supplying current to the coil and the SMA elements, and the functional circuit and the driving circuit are electrically separated from each other.

12. The photosensitive component with an anti-shake function according to claim 1, characterized in that, the bottom surface of the driving module base is adapted to rest on the main board of the electronic device, and the bottom surface of the driving module base has a contact array, and the contact array is adapted to be electrically connected to the main board contact array of the main board.

13. The photosensitive component with an anti-shake function according to claim 1, characterized in that, the driving module base includes a bottom plate and a support seat extending upward from the periphery of the bottom plate, the support seat surrounds the circuit board structure, and there is a gap between the support seat and the side surface of the circuit board structure.

14. The photosensitive component with an anti-shake function according to claim 13, characterized in that, the support seat is adapted to mount the lens module.

15. The photosensitive component with an anti-shake function according to claim 1, characterized in that, the photosensitive component further includes: a metal wire that electrically connects the circuit board and the photosensitive chip based on a wire bonding process; electronic components that are mounted on the upper surface of the circuit board and are disposed outside the photosensitive chip; a molding base that is formed on the upper surface of the circuit board through a molding process and encapsulates the metal wire and the electronic components therein; and a filter that is mounted on the molding base.

16. The photosensitive component with an anti-shake function according to claim 15, characterized in that, relative to the driving module base, the photosensitive chip, the circuit board structure, the metal wire, the electronic components, the molding base and the filter are taken as a whole and move as a whole under the drive of the first driving element and / or the second driving element.

17. An imaging module, characterized in that, comprising: a lens module; the photosensitive component according to any one of claims 1-16, and the lens module is mounted on the driving module base of the photosensitive component.

18. An assembling method of a photosensitive component with an anti-shake function, characterized in that, comprising: Step 1) Prepare a photosensitive module and a driving module separated from each other; wherein, the photosensitive module includes a circuit board, a photosensitive chip mounted on the front surface of the circuit board, and a plurality of magnets located on the back surface of the circuit board; the driving module includes a driving module base, a plurality of coils and their winding shafts mounted on the driving module base, a connecting shaft, a fixed shaft, and a plurality of SMA elements. The driving module base includes a bottom plate and a support seat formed by extending upward from the periphery of the bottom plate. The bottom of the connecting shaft is connected to the upper surface of the bottom plate. The plurality of coils and their winding shafts are distributed around the connecting shaft, wherein the top of each coil corresponds to the bottom of each corresponding magnet. The fixed shaft is disposed on the upper surface of the bottom plate. Each SMA element is arranged in a horizontal posture. One end of each SMA element is fixed to the fixed shaft, and the other end is a free end; and Step 2) Mount the photosensitive module in the driving module; wherein, align the center of the photosensitive chip with the top of the connecting shaft, then fix the bottom of the photosensitive module to the top of the connecting shaft, and make the top of each coil of the driving module correspond to the bottom of a magnet of the photosensitive module respectively. After mounting the photosensitive module in the driving module, the free end of each SMA element of the driving module is disposed on the side of a magnet of the photosensitive module, and there is a gap between the free end of the SMA element and the side of the corresponding magnet in the natural state. When the SMA element is energized, the SMA element extends to contact and push the corresponding magnet, thereby pushing the circuit board to move in the horizontal direction, wherein the horizontal direction is the direction parallel to the photosensitive surface of the photosensitive chip.

19. The assembling method of the photosensitive component with an anti-shake function according to claim 18, characterized in that, in Step 1), the method of preparing the photosensitive module includes the following sub-steps: Step 11) Mount the photosensitive chip on the circuit board to obtain a semi-finished photosensitive module; Step 12) Prepare a frame-shaped magnet mounting member, automatically identify and calibrate the mounting positions of the magnets by using machine vision technology, and then mount the plurality of magnets on the frame-shaped magnet mounting member to obtain a magnet assembly; and Step 13) Mount the magnet assembly on the back surface of the semi-finished photosensitive module; wherein, based on machine vision technology, calibrate the positions of the photosensitive chip and the frame-shaped magnet mounting member to make their centers coincide, and then perform the mounting to obtain a complete photosensitive module.

20. The assembling method of the photosensitive component with an anti-shake function according to claim 19, characterized in that, Step 11) further includes: electrically connecting the photosensitive chip and the circuit board through a wire bonding process, and installing electronic components on the circuit board; then forming a molding part on the surface of the circuit board through a molding process, where the molding part covers the metal wires and electronic components formed by the wire bonding process, and the molding part contacts and covers the edge area of the photosensitive chip; and then installing a color filter on the molding part to obtain the semi-finished photosensitive module.

21. The assembling method of the photosensitive component with an anti-shake function according to claim 19, wherein, Step 11) further includes: for the semi-finished photosensitive module, attaching or forming a reinforcing layer on the back surface of the circuit board; in Step 13), installing the frame-shaped magnet mount of the magnet assembly on the lower surface of the reinforcing layer.

22. The assembling method of the photosensitive component with an anti-shake function according to claim 18, wherein, In Step 1), the method for preparing the driving module includes the following sub-steps: Step 14) fabricating the driving module base; wherein, first fabricating a circuit frame for arranging the driving circuit, and then wrapping the circuit frame with a molding material through a molding process to obtain a molded driving module base with the required outer shape after molding; the back surface of the driving module base has an exposed contact array; Step 15) assembling a fixed shaft on the upper surface of the bottom plate of the driving module base; Step 16) arranging a coil around the shaft and winding the coil on the upper surface of the bottom plate of the driving module base; the coil is electrically connected to the driving circuit of the circuit frame; Step 17) installing a plurality of SMA elements on the fixed shaft, one end of the SMA element is fixed to the fixed shaft, and the other end is a free end; the SMA element is electrically connected to the driving circuit of the circuit frame through a wire; and Step 18) installing a connecting shaft at the center of the bottom plate of the driving module base, and the connecting shaft is an elastic support shaft.

23. The assembling method of the photosensitive component with an anti-shake function according to claim 22, wherein, Step 15) and Step 14) are completed synchronously, and the fixed shaft and the driving module base are integrally formed.

24. An assembling method of a camera module, wherein, it includes: Step a) assembling a photosensitive component with an anti-shake function according to the assembling method of the photosensitive component with an anti-shake function described in any one of claims 18-23; and Step b) installing a lens assembly on the photosensitive component with an anti-shake function, where the bottom surface of the lens assembly is installed on the top surface of the support base.

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