Three-dimensional packaging structure and three-dimensional packaging structure manufacturing method

Abstract

The present disclosure provides a three-dimensional packaging structure and a method for fabricating the same, relating to the field of semiconductor packaging technology. The three-dimensional packaging structure comprises a substrate, a wing chip, and a stacked chip. The wing chip comprises a bottom wall and sidewalls connected to the bottom wall. The bottom wall is provided with first and second metal pillars of varying lengths, and the sidewalls are attached to the substrate. The stacked chip is disposed on the substrate or the wing chip. One of the first and second metal pillars is electrically connected to the substrate, and the other is electrically connected to the stacked chip. This facilitates improving chip integration and reducing package volume.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging technology, and in particular to a three-dimensional packaging structure and a method for manufacturing the three-dimensional packaging structure. Background Art

[0002] With the rapid development of the semiconductor industry, in order to improve the integration of packaged products, it is necessary to package chips with different functions together to form a heterogeneous integrated chip packaging structure. Due to the large number of chips, this packaging structure is large in size after packaging, which is not conducive to product miniaturization design. Summary of the Invention

[0003] The objectives of the present invention include, for example, providing a three-dimensional packaging structure and a method for manufacturing the three-dimensional packaging structure, which can improve chip integration and reduce packaging volume.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a three-dimensional packaging structure, comprising:

[0006] substrate;

[0007] A wing chip, the wing chip comprising a bottom wall and a side wall connected to the bottom wall, the bottom wall being provided with a first metal column and a second metal column of different lengths, and the side wall being attached to the substrate;

[0008] a stacked chip, the stacked chip being disposed on the substrate or the wing chip;

[0009] One of the first metal pillar and the second metal pillar is electrically connected to the substrate, and the other is electrically connected to the stacked chip.

[0010] In an optional embodiment, the length of the first metal pillar is greater than the length of the second metal pillar; the stacked chip includes a horizontally mounted chip, and the wing chip includes a first wing chip and a second wing chip;

[0011] The sidewalls of the first wing chip and the second wing chip are respectively mounted on the substrate, the longer first metal pillar is close to the substrate, and the shorter second metal pillar is far away from the substrate;

[0012] The horizontal chip is arranged between the first wing chip and the second wing chip, or is arranged at an end of the first wing chip and the second wing chip away from the substrate.

[0013] In an optional embodiment, one end of the horizontally mounted chip is arranged at an end of the first wing chip away from the substrate, and the other end is arranged at an end of the second wing chip away from the substrate;

[0014] The horizontally mounted chip is connected to the second metal pillar with a shorter length on the first wing chip by wire bonding, the horizontally mounted chip is connected to the second metal pillar with a shorter length on the second wing chip by wire bonding, the first metal pillar with a longer length on the first wing chip is connected to the substrate by wire bonding, and the first metal pillar with a longer length on the second wing chip is connected to the substrate by wire bonding.

[0015] In an optional embodiment, the horizontal chip includes a first front chip and a second front chip, wherein the first front chip is provided on the substrate and located between the first wing chip and the second wing chip;

[0016] The second front-mounted chip is stacked on a side of the first front-mounted chip away from the substrate;

[0017] The first front chip is connected to the second metal pillars of the first wing chip and the second wing chip respectively by wire bonding, and the second front chip is connected to the first metal pillars of the first wing chip and the second wing chip respectively by wire bonding;

[0018] The first metal pillars of the first wing chip and the second wing chip are respectively connected to the substrate by wire bonding.

[0019] In an optional embodiment, the horizontally mounted chip includes multiple layers of stacked upright chips, and the multiple layers of upright chips are arranged between the first wing chip and the second wing chip;

[0020] The first wing chip and the second wing chip are mounted back to back;

[0021] The first wing chip and the second wing chip are respectively provided with a plurality of metal pillars of unequal lengths, wherein the lengths of the plurality of metal pillars decrease in sequence from the substrate to a direction away from the substrate;

[0022] The bottom face-up chip close to the substrate is connected to the metal pillar with the shortest length by wire bonding, the top face-up chip far from the substrate is connected to the metal pillar with the longest length by wire bonding, and the middle face-up chip is connected to the metal pillar of the middle layer by wire bonding;

[0023] The number of layers of the front-mounted chip is equal to the number of metal pillars on the first wing chip or the second wing chip.

[0024] In an optional embodiment, if the first wing chip and the second wing chip are mounted face to face, the bottom face chip close to the substrate is connected to the bottom metal column with the longest length by wire bonding, the top face chip away from the substrate is connected to the top metal column with the shortest length by wire bonding, and the middle layer face chip is connected to the corresponding metal column of the middle layer by wire bonding.

[0025] In an optional embodiment, the first wing chip and the second wing chip are mounted back to back; the horizontally mounted chip includes multiple layers of stacked front-mounted chips, and the multiple layers of the front-mounted chips are arranged between the first wing chip and the second wing chip;

[0026] The substrate is provided with multiple steps, and the multiple steps are provided between the first wing chip and the second wing chip and are located outside the multiple layers of the front-mounted chips;

[0027] The first wing chip and the second wing chip respectively include a chip 1 and a plurality of chips 2, wherein the chip 1 is mounted vertically on the substrate, and the plurality of chips 2 are arranged one by one on the multiple steps, and the number of the chips 2 is equal to the number of the steps; the number of the multiple layers of the front-mounted chips is equal to the number of the steps;

[0028] Each of the second chips is provided with a third metal pillar; the third metal pillar of the second chip on the Nth step is higher than the side of the second chip on the N-1th step away from the step;

[0029] The bottom-level front-mounted chip is connected to the third metal column of chip 2 on the top step by wire bonding, and the top-level front-mounted chip is connected to the third metal column of chip 2 on the bottom step by wire bonding; the Nth-level front-mounted chip is connected to the third metal column of chip 2 on the Nth-to-last step by wire bonding;

[0030] The first metal column of chip one is electrically connected to the substrate, the second metal column of chip one is wire-bonded to the third metal column of chip two on the bottom step, and multiple third metal columns of chip two are wire-bonded in sequence.

[0031] In an optional embodiment, the wing chip includes a first chip, and the stacked chip includes a second chip and a third chip;

[0032] The sidewall of the first chip is mounted on the substrate, the second metal pillar on the first chip is electrically connected to the substrate, and the length of the first metal pillar on the first chip is greater than that of the second metal pillar;

[0033] The second chip is mounted face-to-face with the first chip, and the second chip is provided with a fourth metal column, and the fourth metal column is electrically connected to the first metal column;

[0034] The third chip is arranged on a side of the first chip away from the second chip and is arranged face to face with the second chip. The third chip is provided with a fifth metal column, and the fifth metal column is electrically connected to the fourth metal column.

[0035] In an optional embodiment, the stacked chip further includes a fourth chip;

[0036] The fourth chip is disposed on a side of the second chip away from the first chip and is arranged face to face with the third chip. The fourth chip is provided with a sixth metal column, and the sixth metal column is electrically connected to the fifth metal column.

[0037] In an optional embodiment, the fourth metal pillar is electrically connected to the first metal pillar using conductive glue, the fifth metal pillar is electrically connected to the fourth metal pillar using conductive glue, and the sixth metal pillar is electrically connected to the fifth metal pillar using conductive glue.

[0038] In an optional embodiment, the fourth metal pillar is flush with the end surface of the first chip away from the substrate, the fifth metal pillar is flush with the end surface of the second chip away from the substrate, and the sixth metal pillar is flush with the end surface of the third chip away from the substrate.

[0039] In an optional embodiment, a spacer is provided on the substrate, and the spacer is used to mount the stacked chip.

[0040] In a second aspect, the present invention provides a method for manufacturing a three-dimensional packaging structure, comprising:

[0041] providing a substrate;

[0042] Mounting a wing chip on the substrate; wherein the wing chip includes a bottom wall and a side wall connected to the bottom wall, the bottom wall is protruded with a first metal column and a second metal column of different lengths, and the side wall is attached to the substrate;

[0043] A stacked chip is mounted on the substrate or the wing chip; wherein one of the first metal pillar and the second metal pillar is electrically connected to the substrate, and the other is electrically connected to the stacked chip.

[0044] In an optional embodiment, the step of mounting the stacked chip on the substrate or the wing chip includes:

[0045] Mounting a stacked chip on the substrate; wherein the stacked chip includes a plurality of stacked front chips, and the wing chips are located on both sides of the front chips; and a plurality of metal pillars are provided on the wing chips;

[0046] Each of the metal pillars is connected to one of the front-mounted chips by wire bonding.

[0047] In an optional embodiment, the step of mounting the stacked chip on the substrate or the wing chip includes:

[0048] The wing chip includes a first chip, the stacked chip includes a plurality of side-mounted chips, and the plurality of side-mounted chips include a second chip and a third chip;

[0049] mounting the first chip on the substrate;

[0050] Mounting the second chip on the substrate; wherein the second chip is mounted face-to-face with the first chip, and the second chip is provided with a fourth metal column, and the fourth metal column is electrically connected to the first metal column;

[0051] The third chip is mounted on the substrate; wherein the third chip is arranged on a side of the first chip away from the second chip and is arranged face to face with the second chip, and the third chip is provided with a fifth metal column, and the fifth metal column is electrically connected to the fourth metal column.

[0052] In an optional embodiment, the step of mounting the stacked chip on the substrate or the wing chip includes:

[0053] A fourth chip is mounted on the substrate; wherein the fourth chip is arranged on a side of the second chip away from the first chip and is arranged face to face with the third chip, and the fourth chip is provided with a sixth metal column, and the sixth metal column is electrically connected to the fifth metal column.

[0054] The beneficial effects of the embodiments of the present invention include, for example:

[0055] In the three-dimensional packaging structure provided by the embodiments of the present invention, the wing chips are mounted vertically, reducing their size. Furthermore, the wing chips are provided with multiple metal pillars of varying lengths, facilitating electrical connections with stacked chips at different locations. This compact structure helps improve chip integration and reduce package size.

[0056] The present invention provides a method for fabricating a three-dimensional package structure. This method sequentially mounts a wing chip and a stacked chip on a substrate. The wing chip is mounted vertically, and the stacked chip is positioned on the substrate or the wing chip. This simple mounting method results in a compact structure, saving chip space on the substrate, improving integration, and reducing package size. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0058] Figure 1 A schematic structural diagram of a three-dimensional packaging structure provided by the first embodiment of the present invention;

[0059] Figure 2A schematic structural diagram of a wing chip in a three-dimensional packaging structure provided by the first embodiment of the present invention;

[0060] Figure 3 A schematic structural diagram of a three-dimensional packaging structure provided by a second embodiment of the present invention;

[0061] Figure 4 Another structural schematic diagram of the three-dimensional packaging structure provided by the second embodiment of the present invention;

[0062] Figure 5 A schematic diagram of another structure of the three-dimensional packaging structure provided by the second embodiment of the present invention;

[0063] Figure 6 A schematic structural diagram of a three-dimensional packaging structure provided by a third embodiment of the present invention;

[0064] Figure 7 A schematic structural diagram of a three-dimensional packaging structure provided by a fourth embodiment of the present invention;

[0065] Figure 8 and Figure 9 A schematic diagram of a manufacturing process of a three-dimensional packaging structure provided by a fourth embodiment of the present invention.

[0066] Icons: 100-3D packaging structure; 110-substrate; 111-connection pad; 113-plastic package; 115-solder ball; 120-wing chip; 121-bottom wall; 123-side wall; 125-first metal pillar; 127-second metal pillar; 130-first wing chip; 131-chip one; 133-chip two; 135-third metal pillar; 140-second wing chip; 141-chip three; 143-chip four; 150-horizontal chip; 151-first upright chip; 153- Second upright chip; 160-upright chip; 161-first layer upright chip; 163-second layer upright chip; 165-third layer upright chip; 170-step; 171-first layer step; 173-second layer step; 175-third layer step; 181-first chip; 183-second chip; 185-third chip; 187-fourth chip; 191-fourth metal pillar; 193-fifth metal pillar; 195-sixth metal pillar; 200-pad; 201-conductive glue; 210-glue layer. DETAILED DESCRIPTION

[0067] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0068] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0069] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0070] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0071] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0072] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0073] Please refer to Figure 1 and Figure 2 This embodiment provides a three-dimensional package structure 100, comprising a substrate 110, a wing chip 120, and a stacked chip. The wing chip 120 includes a bottom wall 121 and a sidewall 123 connected to the bottom wall 121. The bottom wall 121 is provided with a plurality of metal pillars of varying lengths, including at least a first metal pillar 125 and a second metal pillar 127. The sidewall 123 is attached to the substrate 110. The stacked chip is disposed on the substrate 110 or the wing chip 120. One of the first metal pillar 125 and the second metal pillar 127 is electrically connected to the substrate 110, while the other is electrically connected to the stacked chip. This facilitates improving chip integration and reducing package volume.

[0074] It will be appreciated that the plurality of metal pillars includes at least two, namely, a first metal pillar 125 and a second metal pillar 127. The first metal pillar 125 and the second metal pillar 127 are disposed on the same side of the wing chip 120. The length of the first metal pillar 125 is greater than the length of the second metal pillar 127. In this embodiment, the wing chip 120 is mounted vertically, i.e., the sidewall 123 of the wing chip 120 is fixed to the substrate 110. Thus, the first metal pillar 125 and the second metal pillar 127 are parallel to the substrate 110. The longer first metal pillar 125 is closer to the substrate 110, while the shorter second metal pillar 127 is farther away from the substrate 110.

[0075] As will be readily understood, substrate 110 is provided with connection pads 111, and first metal pillars 125 are positioned above connection pads 111. They may be spaced apart or disposed in contact with connection pads 111. First metal pillars 125 are electrically connected to connection pads 111. For example, the electrical connection may be achieved by welding, wire bonding, or by filling with conductive adhesive 201.

[0076] First embodiment

[0077] The stacked chip includes a horizontally mounted chip 150, and the wing chips 120 include a first wing chip 130 and a second wing chip 140. The sidewalls 123 of the first and second wing chips 130, 140 are attached to the substrate 110, and each of the first and second wing chips 130, 140 is provided with a plurality of metal pillars. Furthermore, the longer first metal pillars 125 are closer to the substrate 110, while the shorter second metal pillars 127 are farther away from the substrate 110.

[0078] The horizontal chip 150 is disposed between the first and second wing chips 130, 140, or at the ends of the first and second wing chips 130, 140 away from the substrate 110. Specifically, the horizontal chip 150 can be disposed on the substrate 110 or above the wing chips 120. In this embodiment, one end of the horizontal chip 150 is disposed at the end of the first wing chip 130 away from the substrate 110, and the other end is disposed at the end of the second wing chip 140 away from the substrate 110. The horizontal chip 150 utilizes an upright chip 160, which is wire-bonded to the first and second wing chips 130, 140, respectively.

[0079] Specifically, horizontally mounted chip 150 is wire-bonded to the shorter second metal pillars 127 on first wing chip 130, and to the shorter second metal pillars 127 on second wing chip 140. Longer first metal pillars 125 on first wing chip 130 are wire-bonded to substrate 110, and longer first metal pillars 125 on second wing chip 140 are wire-bonded to substrate 110. It should be noted that horizontally mounted chip 150 may also be flip-chip mounted, with the flip-chips being soldered to the second metal pillars 127 of first wing chip 130 and second wing chip 140, respectively.

[0080] Optionally, the first wing chip 130 and the second wing chip 140 can be mounted back-to-back. The first wing chip 130 and the second wing chip 140 can be spaced apart or placed in contact with each other without a gap, which helps improve integration and reduce package size. Alternatively, the first wing chip 130 and the second wing chip 140 can be mounted face-to-face, with the metal posts on the first wing chip 130 facing the second wing chip 140, and the metal posts on the second wing chip 140 facing the first wing chip 130.

[0081] Optionally, the first wing chip 130 and the second wing chip 140 can be respectively bonded to the substrate 110 via adhesive layers 210 . The horizontally mounted chip 150 is bonded to the first wing chip 130 and the second wing chip 140 via adhesive layers 210 .

[0082] Figure 1 The figure shows only one horizontally mounted chip 150. Of course, multiple horizontally mounted chips 150 can be stacked. The upper horizontally mounted chip 150 is smaller than the lower horizontally mounted chip 150 to expose the wire bonding pads of the lower horizontally mounted chip 150. Multiple horizontally mounted chips 150 can be connected via wire bonding. Alternatively, the number of metal pillars on the flanking chip 120 increases accordingly as the number of horizontally mounted chips 150 increases, so that each horizontally mounted chip 150 is electrically connected to a corresponding metal pillar.

[0083] The three-dimensional package structure 100 also includes a plastic encapsulation body 113 and solder balls 115. The plastic encapsulation body 113 is disposed on the substrate 110, covering and protecting the first wing chip 130, the second wing chip 140, and the horizontally mounted chip 150. The solder balls 115 are disposed on the side of the substrate 110 away from the plastic encapsulation body 113 to electrically connect the substrate 110 to other external devices.

[0084] In the three-dimensional packaging structure 100 provided in this embodiment, the first wing chip 130 and the second wing chip 140 are mounted vertically, and the horizontally mounted chip 150 is stacked above the first wing chip 130 and the second wing chip 140. The first wing chip 130 and the second wing chip 140 are respectively connected to the substrate 110 by wire bonding, and the first wing chip 130 and the second wing chip 140 are respectively connected to the horizontally mounted chip 150 by wire bonding. Because the longer first metal pillar 125 is closer to the substrate 110 and the shorter second metal pillar 127 is located in the upper layer, this provides more bonding space for the lower bonding structure near the substrate 110, preventing the bonding structure from touching the upper metal pillars, making the bonding operation more convenient.

[0085] Second embodiment

[0086] Combine Figure 3 In this embodiment, the horizontally mounted chip 150 is disposed on the substrate 110 and between the first wing chip 130 and the second wing chip 140. The number of horizontally mounted chips 150 can be one or multiple stacked. This embodiment uses two stacked horizontally mounted chips 150 as an example for description.

[0087] The horizontal chip 150 includes a first upright chip 151 and a second upright chip 153. The first upright chip 151 is disposed on the substrate 110 and is located between the first wing chip 130 and the second wing chip 140. The second upright chip 153 is stacked on the side of the first upright chip 151 away from the substrate 110. The size of the second upright chip 153 is smaller than that of the first upright chip 151. The second upright chip 153 is disposed in the middle of the first upright chip 151 to expose the wire bonding pads on the first upright chip 151. Optionally, the first upright chip 151 is fixed to the substrate 110 via an adhesive layer 210, and the second upright chip 153 is fixed to the first upright chip 151 via an adhesive layer 210.

[0088] The first and second flanking chips 130 and 140 are each provided with a first metal pillar 125 and a second metal pillar 127. The length of the first metal pillar 125 is greater than that of the second metal pillar 127, and the first metal pillar 125 is located close to the substrate 110. The first front-mounted chip 151 is wire-bonded to the second metal pillars 127 of the first and second flanking chips 130 and 140, respectively. The second front-mounted chip 153 is wire-bonded to the first metal pillars 125 of the first and second flanking chips 130 and 140, respectively. The first metal pillars 125 of the first and second flanking chips 130 and 140 are each wire-bonded to the substrate 110.

[0089] It should be understood that the horizontal chip 150 includes multiple layers of stacked upright chips 160, and the multiple layers of upright chips 160 are arranged between the first wing chip 130 and the second wing chip 140. The multiple layers of stacked upright chips 160 are in a pyramid structure, and the farther the upright chip 160 is from the substrate 110, the smaller its size. The first wing chip 130 and the second wing chip 140 are mounted back to back. The first wing chip 130 and the second wing chip 140 are respectively provided with a plurality of metal pillars of unequal lengths, and the lengths of the plurality of metal pillars decrease successively from the substrate 110 to the direction away from the substrate 110. The bottom upright chip 160 close to the substrate 110 is connected to the shortest metal pillar by wire bonding, the top upright chip 160 away from the substrate 110 is connected to the longest metal pillar by wire bonding, and the middle upright chip 160 is connected to the metal pillars of the middle layer by wire bonding. The number of layers of the front-mounted chip 160 is equal to the number of metal pillars on the first wing chip 130 or the second wing chip 140 .

[0090] Combine Figure 4 Optionally, the number of stacking layers of the horizontally mounted chip 150 is four, which are the first, second, third and fourth layers of chips from bottom to top. The first, second, third and fourth metal pillars are arranged in sequence from bottom to top along the height direction on the wing chip 120, and the length of the metal pillars decreases from bottom to top. The wiring method of the wing chip 120 and the horizontally mounted chip 150 is: the first layer chip is connected to the fourth metal pillar, the second layer chip is connected to the third metal pillar, the third layer chip is connected to the second metal pillar, and the fourth layer chip is connected to the first metal pillar. In this way, interference between mutual wiring can be prevented, wiring space can be avoided, wiring space is more sufficient, and wiring operation is more convenient.

[0091] Of course, the number of stacked layers of horizontally mounted chips 150 can be one, three, five, six, or more layers, which is not specifically limited here. Optionally, the stacking height of the plurality of horizontally mounted chips 150 is substantially equal to the height of the first wing chip 130 or the second wing chip 140 when vertically mounted.

[0092] It should be noted that, in this embodiment, the first wing chip 130 and the second wing chip 140 can also be mounted face to face. Figure 5Optionally, if the first wing chip 130 and the second wing chip 140 are mounted face to face, the bottom upright chip 160 close to the substrate 110 is wire-connected to the longest bottom metal pillar, the top upright chip 160 away from the substrate 110 is wire-connected to the shortest top metal pillar, and the middle upright chip 160 is wire-connected to the corresponding metal pillars of the middle layer. For example, the first-layer upright chip 160 is wire-bonded to the longest metal pillar at the bottom (first layer); the second-layer upright chip 160 is wire-bonded to the metal pillars of the second layer; the third-layer upright chip 160 is wire-bonded to the metal pillars of the third layer; the fourth-layer upright chip 160 is wire-bonded to the metal pillars of the fourth layer; and so on. In this way, it is easy to avoid the wiring space, the wiring operation is more convenient, and it can also prevent the wiring structure from interfering with the upper-layer metal pillars.

[0093] In this embodiment, the remaining contents not mentioned are similar to those described in the first embodiment and will not be repeated here.

[0094] Third embodiment

[0095] Combine Figure 6 In this embodiment, the first wing chip 130 and the second wing chip 140 are mounted back to back; the horizontal chip 150 includes multiple layers of stacked upright chips 160, the multiple layers of upright chips 160 are arranged between the first wing chip 130 and the second wing chip 140, and the bottom layer of upright chips 160 is arranged on the substrate 110. Among the multiple upright chips 160, the size of the upper layer upright chip 160 is smaller than the size of the lower layer upright chip 160, so as to expose the wire bonding pads on the lower layer upright chip 160. For example, taking the three-layer upright chip 160 as an example, the first layer upright chip 161 is arranged on the substrate 110, and the second layer upright chip 163 is arranged on the first layer upright chip 161 and is smaller than the size of the first layer upright chip 161. The third layer upright chip 165 is arranged on the second layer upright chip 163 and is smaller than the size of the second layer upright chip 163. Optionally, the first layer of front-mounted chips 161 is fixed on the substrate 110 through the adhesive layer 210 , the second layer of front-mounted chips 163 is fixed on the first layer of front-mounted chips 161 through the adhesive layer 210 , and the third layer of front-mounted chips 165 is fixed on the second layer of front-mounted chips 163 through the adhesive layer 210 .

[0096] Multiple layers of steps 170 are provided on substrate 110. These layers are located between first wing chip 130 and second wing chip 140 and outside of the multi-layer upright chip 160. Optionally, the height of steps 170 increases from the outside inward, i.e., from wing chip 120 toward upright chip 150. First wing chip 130 and second wing chip 140 include chip 1 131 and multiple chips 2 133, respectively. In this embodiment, the mounting and bonding methods for first wing chip 130 and second wing chip 140 are identical, and only the first wing chip 130 will be described here.

[0097] In the first wing chip 130, chip 1 131 is vertically mounted on the substrate 110 and can be fixed to the substrate 110 via an adhesive layer 210. Multiple chips 133 are arranged one-to-one on the multi-layer steps 170, and the number of chips 133 equals the number of steps 170. The number of layers of the multi-layer front chip 160 equals the number of layers of the steps 170. The third metal pillar 135 of chip 2 133 on the Nth layer of step 170 is higher than the side of chip 2 133 on the N-1th layer of step 170 away from the step 170. The bottom layer of the front chip 160 is wire-bonded to the third metal pillar 135 of chip 2 133 on the top layer of step 170, and the top layer of the front chip 160 is wire-bonded to the third metal pillar 135 of chip 2 133 on the bottom layer of step 170. The top layer of the front chip 160 is wire-bonded to the third metal pillar 135 of chip 2 133 on the Nth layer of step 170. The first metal pillar 125 of chip 131 is electrically connected to substrate 110. The second metal pillar 127 of chip 131 is wire-bonded to the third metal pillar 135 of chip 2 133 on the bottom step 170. The third metal pillars 135 of multiple chips 133 are wire-bonded in sequence. N represents the number of steps 170, the number of chips 133, and the number of middle mounted chips 160.

[0098] Optionally, Figure 6 Three chips 133 are shown, each with a third metal pillar 135. Chip 1 131 is provided with a first metal pillar 125 and a second metal pillar 127. First metal pillar 125 is longer and positioned closer to substrate 110 to provide more space for bonding wires, making bonding easier. The first chip 133 is positioned on the first step 171, on the side of chip 1 131 closest to the facing chip 160. Third metal pillar 135 is oriented in the same direction as second metal pillar 127, meaning it is located on the side of chip 2 133 closest to chip 1 131.

[0099] The second chip 133 is disposed on the second step 173 and on a side of the first chip 133 closer to the mounting chip 160. The third metal pillar 135 of the second chip 133 is located on a side of the second chip 133 closer to the first chip 131.

[0100] The third chip 133 is disposed on the third step 175 and on a side of the second chip 133 close to the mounting chip 160. The third metal pillar 135 of the third chip 133 is located on a side of the second chip 133 close to the first chip 131.

[0101] Optionally, each second chip 133 is fixed to the step 170 via an adhesive layer 210. The lengths of the third metal pillars 135 on each second chip 133 may be equal or unequal. To facilitate bonding, the extended length of the third metal pillars 135 of the second chip 133 on the second step 173 does not exceed the end face of the third metal pillars 135 of the second chip 133 on the first step 171 that is away from the second chip 133.

[0102] Of course, the number of chips 133 is not limited to three, but can also be one, two, four, five, six, seven, or more; the number of middle front chips 160 can also be adaptively increased or decreased. The first wing chips 130 and the second wing chips 140 are not limited to being stacked on both sides of the middle front chip 160, but can be arranged in various positions in the front, back, left, right, and circumferential directions. The number can be flexibly set according to actual conditions and is not specifically limited here. The first wing chips 130 and the second wing chips 140 can be distributed symmetrically or asymmetrically. They can be mounted back to back or face to face.

[0103] The second wing chip 140 of this embodiment includes chip three 141 and chip four 143, wherein chip three 141 is mounted in the same manner as chip one 131, and the number of chip four 143 can be one or more. The mounting method of chip four 143 is consistent with that of chip two 133, and will not be repeated here.

[0104] In this embodiment, other contents not mentioned are similar to those described in the first and second embodiments and will not be described in detail here.

[0105] Fourth embodiment

[0106] Combine Figure 7In this embodiment, the wing chip 120 includes a first chip 181, and the stacked chip includes a second chip 183 and a third chip 185. The sidewall 123 of the first chip 181 is mounted on the substrate 110, that is, vertical mounting is adopted. The second metal pillar 127 on the first chip 181 is electrically connected to the substrate 110, and the length of the first metal pillar 125 on the first chip 181 is greater than the length of the second metal pillar 127. Optionally, the second metal pillar 127 and the substrate 110 are electrically connected using a conductive adhesive 201, or the electrical connection between the two is achieved by applying a conductive film. Of course, in other methods, wire bonding or welding can also be used to achieve electrical connection.

[0107] The second chip 183 is mounted on the substrate 110 in a vertical manner. The second chip 183 is mounted face to face with the first chip 181. The second chip 183 is provided with a fourth metal pillar 191, and the fourth metal pillar 191 is electrically connected to the first metal pillar 125. In this embodiment, the fourth metal pillar 191 is electrically connected to the first metal pillar 125 using a conductive adhesive 201, and the fourth metal pillar 191 is flush with the end face of the first chip 181 away from the substrate 110. Optionally, a pad 200 can be provided on the substrate 110 or the height of the second chip 183 can be adjusted so that the surface of the fourth metal pillar 191 is flush with the end face of the first chip 181 away from the substrate 110. By using the conductive adhesive 201, the electrical connection is stable and reliable, the dispensing operation is convenient, and the resistance of the electrical connection is smaller, the conductive loss is reduced, and the signal transmission is faster. At the same time, the conductive adhesive 201 can also play a role in buffering and heat dissipation.

[0108] The third chip 185 is mounted on the substrate 110 using a vertical mounting method. The third chip 185 is located on the side of the first chip 181 away from the second chip 183, facing the second chip 183. The third chip 185 is provided with a fifth metal pillar 193, which is electrically connected to the fourth metal pillar 191. The fifth metal pillar 193 and the fourth metal pillar 191 are electrically connected using a conductive adhesive 201. The fifth metal pillar 193 is flush with the end surface of the second chip 183 away from the substrate 110.

[0109] Optionally, the stacked chips further include a fourth chip 187. Fourth chip 187 is mounted on substrate 110 using a vertical mounting method. Fourth chip 187 is located on the side of second chip 183 away from first chip 181, and is positioned face-to-face with third chip 185. Fourth chip 187 is provided with a sixth metal pillar 195, which is electrically connected to fifth metal pillar 193. Sixth metal pillar 195 and fifth metal pillar 193 are electrically connected using conductive adhesive 201. Sixth metal pillar 195 is flush with the end surface of third chip 185 away from substrate 110.

[0110] In this embodiment, a spacer 200 is provided on substrate 110. Spacer 200 is used to mount stacked chips, specifically, second chip 183, third chip 185, and fourth chip 187. Spacer 200 can adjust the height of the stacked chips so that the metal pillars on the chips are flush with the top surfaces of the opposing chips. This arrangement results in a more compact structure, improving integration and reducing package height. It also facilitates the application of conductive adhesive 201 between the metal pillars, resulting in a more stable and reliable electrical connection.

[0111] It is easy to understand that the number of stacked chips is not limited to two or three, but can also be four, five, six, seven or more, and is not specifically limited here. As the number of stacked chips increases, the pad 200 can be set in a stepped shape, and the farther away from the first chip 181, the higher the height of the pad 200. In this way, an inverted pyramid packaging structure can be stacked. It can be understood that in this stacking method, the first chip 181 in the middle is mounted first, and then the second chip 183, the third chip 185 and the fourth chip 187 are alternately mounted on both sides. The metal pillars on the chips mounted later are getting longer and longer. In the entire packaging structure, the metal pillars are shorter the closer to the substrate 110 from bottom to top, and the longer the metal pillars farther away from the substrate 110, forming an inverted pyramid structure. In addition, the metal pillars and the conductive adhesive 201 can play a role in lateral heat dissipation (in the axial direction of the metal pillars), and the heat dissipation area increases from bottom to top, with good heat dissipation performance.

[0112] Combine Figure 8 and Figure 9 The embodiment of the present invention provides a method for manufacturing a three-dimensional packaging structure 100. Taking the inverted pyramid packaging structure in the third embodiment as an example, the method includes:

[0113] Step S100: providing a substrate 110, wherein the substrate 110 is provided with connection pads 111. The substrate 110 is provided with spacers 200, which can be flexibly arranged according to the number of stacked chips and can be designed in a stepped shape.

[0114] Step S200: Mounting the wing chip 120 on the substrate 110. The wing chip 120 includes a bottom wall 121 and sidewalls 123 connected to the bottom wall 121. The bottom wall 121 is provided with first and second metal pillars 125 and 127 of varying lengths. The sidewalls 123 are mounted on the substrate 110, securing the wing chip 120 to the substrate 110 using a vertical mounting method. The first and second metal pillars 125 and 127 can be formed by wire bonding or electroplating.

[0115] A stacked chip is mounted on a substrate 110 or a wing chip 120; one of the first metal pillar 125 and the second metal pillar 127 is electrically connected to the substrate 110, and the other is electrically connected to the stacked chip. Alternatively, the stacked chip is mounted on the substrate 110. The stacked chip includes multiple stacked front chips 160, with the wing chips 120 located on either side of the front chips 160. Multiple metal pillars are provided on the wing chips 120; each metal pillar is wire-bonded to a front chip 160.

[0116] The wing chip 120 includes a first chip 181 , and the stacked chip includes a plurality of side-mounted chips, which include a second chip 183 , a third chip 185 , and a fourth chip 187 .

[0117] A first chip 181 is mounted on substrate 110. The sidewalls 123 of first chip 181 are secured to substrate 110 via adhesive layer 210, which utilizes non-conductive adhesive 201. First chip 181 is mounted vertically. First chip 181 is provided with first and second metal pillars 125, 127 of varying lengths, with first metal pillars 125 being longer than second metal pillars 127. Second metal pillars 127 are positioned adjacent to substrate 110 and electrically connected to connection pads 111 on substrate 110 via conductive adhesive 201.

[0118] Optionally, the adhesive layer 210 and the conductive adhesive 201 are baked and cured to improve structural stability.

[0119] A second chip 183 is mounted on substrate 110; second chip 183 is mounted vertically. Second chip 183 is mounted face-to-face with first chip 181 and is provided with a fourth metal pillar 191, which is electrically connected to first metal pillar 125. Optionally, second chip 183 is mounted on a pad 200 on substrate 110 so that fourth metal pillar 191 is flush with the top surface of first chip 181. This facilitates filling conductive adhesive 201 between fourth metal pillar 191 and first metal pillar 125 to achieve electrical connection. This arrangement provides a more compact structure, reduces package volume, and improves chip package integration.

[0120] A third chip 185 is mounted on substrate 110 and fixed to pad 200 using a vertical mounting method. Third chip 185 is located on the side of first chip 181 away from second chip 183, facing second chip 183. Third chip 185 is provided with a fifth metal pillar 193, which is flush with the top surface of second chip 183. Fifth metal pillar 193 is electrically connected to fourth metal pillar 191 using conductive adhesive 201.

[0121] Optionally, a fourth chip 187 is mounted on the substrate 110; the fourth chip 187 is fixed to the spacer 200 using a vertical mounting method. The fourth chip 187 is disposed on the side of the second chip 183 away from the first chip 181 and faces the third chip 185. The fourth chip 187 is provided with a sixth metal pillar 195, which is flush with the upper surface of the third chip 185. The sixth metal pillar 195 is electrically connected to the fifth metal pillar 193 using a conductive adhesive 201.

[0122] According to actual needs, the number of stacked chips can be flexibly increased to make the packaging structure take the shape of an inverted pyramid, which is stable and reliable, small in size and highly integrated.

[0123] Finally, the chip on the substrate 110 is plastic-encapsulated, and solder balls 115 are placed on the substrate 110 , and then the chip is cut and separated into individual products.

[0124] It should be noted that the metal pillars mentioned in this embodiment can be formed by wire bonding or electroplating. The chip is mounted vertically, and the axis of the metal pillar is parallel to the substrate 110, which is conducive to achieving heat dissipation in the horizontal direction (axis direction of the metal pillar) of the packaging structure.

[0125] In this embodiment, other parts not mentioned are similar to those described in the first embodiment, the second embodiment and the third embodiment, and are not described again here.

[0126] In summary, the beneficial effects of the embodiments of the present invention include, for example:

[0127] In the three-dimensional package structure 100 provided by the embodiment of the present invention, the wing chip 120 is mounted vertically, reducing its size. Furthermore, the wing chip 120 is provided with multiple metal pillars of varying lengths, facilitating electrical connection with stacked chips at different locations. This compact structure helps improve chip integration and reduce package size.

[0128] In a method for fabricating a three-dimensional package structure 100 provided in an embodiment of the present invention, a wing chip 120 and a stacked chip are sequentially mounted on a substrate 110. The wing chip 120 is mounted vertically, and the stacked chip is disposed on the substrate 110 or the wing chip 120. The stacked chip can be mounted horizontally or vertically. This flexible and simple mounting method provides a compact structure, conserves chip space on the substrate 110, improves integration, and reduces package volume.

[0129] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A three-dimensional packaging structure, characterized in that: include: substrate; A wing chip, the wing chip comprising a bottom wall and a side wall connected to the bottom wall, the bottom wall being provided with a first metal column and a second metal column of different lengths, and the side wall being attached to the substrate; a stacked chip, the stacked chip being disposed on the substrate or the wing chip; One of the first metal pillar and the second metal pillar is electrically connected to the substrate, and the other is electrically connected to the stacked chip.

2. The three-dimensional packaging structure according to claim 1, characterized in that: The length of the first metal column is greater than the length of the second metal column; the stacked chip includes a horizontal chip, and the wing chip includes a first wing chip and a second wing chip; The sidewalls of the first wing chip and the second wing chip are respectively mounted on the substrate, the longer first metal pillar is close to the substrate, and the shorter second metal pillar is far away from the substrate; The horizontal chip is arranged between the first wing chip and the second wing chip, or is arranged at an end of the first wing chip and the second wing chip away from the substrate.

3. The three-dimensional packaging structure according to claim 2, characterized in that: One end of the horizontally mounted chip is arranged at one end of the first wing chip away from the substrate, and the other end is arranged at one end of the second wing chip away from the substrate; The horizontally mounted chip is connected to the second metal pillar with a shorter length on the first wing chip by wire bonding, the horizontally mounted chip is connected to the second metal pillar with a shorter length on the second wing chip by wire bonding, the first metal pillar with a longer length on the first wing chip is connected to the substrate by wire bonding, and the first metal pillar with a longer length on the second wing chip is connected to the substrate by wire bonding.

4. The three-dimensional packaging structure according to claim 2, characterized in that: The horizontal chip includes a first front chip and a second front chip, wherein the first front chip is provided on the substrate and is located between the first wing chip and the second wing chip; The second front-mounted chip is stacked on a side of the first front-mounted chip away from the substrate; The first front chip is connected to the second metal pillars of the first wing chip and the second wing chip respectively by wire bonding, and the second front chip is connected to the first metal pillars of the first wing chip and the second wing chip respectively by wire bonding; The first metal pillars of the first wing chip and the first metal pillars of the second wing chip are respectively connected to the substrate by wire bonding.

5. The three-dimensional packaging structure according to claim 2, characterized in that: The horizontal chip includes multiple layers of stacked front-mounted chips, and the multiple layers of front-mounted chips are arranged between the first wing chip and the second wing chip; The first wing chip and the second wing chip are mounted back to back; The first wing chip and the second wing chip are respectively provided with a plurality of metal pillars of unequal lengths, wherein the lengths of the plurality of metal pillars decrease in sequence from the substrate to a direction away from the substrate; The bottom face-up chip close to the substrate is connected to the metal pillar with the shortest length by wire bonding, the top face-up chip far from the substrate is connected to the metal pillar with the longest length by wire bonding, and the middle face-up chip is connected to the metal pillar of the middle layer by wire bonding; The number of layers of the front-mounted chip is equal to the number of metal pillars on the first wing chip or the second wing chip.

6. The three-dimensional packaging structure according to claim 5, characterized in that: If the first wing chip and the second wing chip are mounted face to face, the bottom-layer front-mounted chip close to the substrate is connected to the bottom-layer metal pillar with the longest length by wire bonding, the top-layer front-mounted chip far from the substrate is connected to the top-layer metal pillar with the shortest length by wire bonding, and the middle-layer front-mounted chip is connected to the corresponding metal pillars in the middle layer by wire bonding.

7. The three-dimensional packaging structure according to claim 2, characterized in that: The first wing chip and the second wing chip are mounted back to back; the horizontal chip includes multiple layers of stacked front-mounted chips, and the multiple layers of front-mounted chips are arranged between the first wing chip and the second wing chip; The substrate is provided with multiple steps, and the multiple steps are provided between the first wing chip and the second wing chip and are located outside the multiple layers of the front-mounted chips; The first wing chip and the second wing chip respectively include a chip 1 and a plurality of chips 2, wherein the chip 1 is mounted vertically on the substrate, and the plurality of chips 2 are arranged one by one on the multiple steps, and the number of the chips 2 is equal to the number of the steps; the number of the multiple layers of the front-mounted chips is equal to the number of the steps; Each of the second chips is provided with a third metal pillar; the third metal pillar of the second chip on the Nth step is higher than the side of the second chip on the N-1th step away from the step; The bottom-level front-mounted chip is connected to the third metal column of chip 2 on the top step by wire bonding, and the top-level front-mounted chip is connected to the third metal column of chip 2 on the bottom step by wire bonding; the Nth-level front-mounted chip is connected to the third metal column of chip 2 on the Nth-to-last step by wire bonding; The first metal column of chip one is electrically connected to the substrate, the second metal column of chip one is wire-bonded to the third metal column of chip two on the bottom step, and multiple third metal columns of chip two are wire-bonded in sequence.

8. The three-dimensional packaging structure according to claim 1, wherein: The wing chip includes a first chip, and the stacked chip includes a second chip and a third chip; The sidewall of the first chip is mounted on the substrate, the second metal pillar on the first chip is electrically connected to the substrate, and the length of the first metal pillar on the first chip is greater than that of the second metal pillar; The second chip is mounted face-to-face with the first chip, and the second chip is provided with a fourth metal column, and the fourth metal column is electrically connected to the first metal column; The third chip is arranged on a side of the first chip away from the second chip and is arranged face to face with the second chip. The third chip is provided with a fifth metal column, and the fifth metal column is electrically connected to the fourth metal column.

9. The three-dimensional packaging structure according to claim 8, characterized in that: The stacked chip further includes a fourth chip; The fourth chip is disposed on a side of the second chip away from the first chip and is arranged face to face with the third chip. The fourth chip is provided with a sixth metal column, and the sixth metal column is electrically connected to the fifth metal column.

10. The three-dimensional packaging structure according to claim 9, characterized in that: The fourth metal pillar is electrically connected to the first metal pillar using conductive glue, the fifth metal pillar is electrically connected to the fourth metal pillar using conductive glue, and the sixth metal pillar is electrically connected to the fifth metal pillar using conductive glue.

11. The three-dimensional packaging structure according to claim 9, characterized in that: The fourth metal pillar is flush with an end surface of the first chip away from the substrate, the fifth metal pillar is flush with an end surface of the second chip away from the substrate, and the sixth metal pillar is flush with an end surface of the third chip away from the substrate.

12. The three-dimensional packaging structure according to any one of claims 8 to 11, characterized in that: A pad is provided on the substrate, and the pad is used for mounting the stacked chip.

13. A method for manufacturing a three-dimensional packaging structure, characterized in that: include: providing a substrate; Mounting a wing chip on the substrate; wherein the wing chip includes a bottom wall and a side wall connected to the bottom wall, the bottom wall is protruded with a first metal column and a second metal column of different lengths, and the side wall is attached to the substrate; A stacked chip is mounted on the substrate or the wing chip; wherein one of the first metal pillar and the second metal pillar is electrically connected to the substrate, and the other is electrically connected to the stacked chip.

14. The method for manufacturing a three-dimensional packaging structure according to claim 13, wherein: The step of mounting the stacked chip on the substrate or the wing chip comprises: Mounting a stacked chip on the substrate; wherein the stacked chip includes a plurality of stacked front chips, and the wing chips are located on both sides of the front chips; and a plurality of metal pillars are provided on the wing chips; Each of the metal pillars is connected to one of the front-mounted chips by wire bonding.

15. The method for manufacturing a three-dimensional packaging structure according to claim 13, wherein: The step of mounting the stacked chip on the substrate or the wing chip comprises: The wing chip includes a first chip, the stacked chip includes a plurality of side-mounted chips, and the plurality of side-mounted chips include a second chip and a third chip; mounting the first chip on the substrate; Mounting the second chip on the substrate; wherein the second chip is mounted face-to-face with the first chip, and the second chip is provided with a fourth metal column, and the fourth metal column is electrically connected to the first metal column; The third chip is mounted on the substrate; wherein the third chip is arranged on a side of the first chip away from the second chip and is arranged face to face with the second chip, and the third chip is provided with a fifth metal column, and the fifth metal column is electrically connected to the fourth metal column.

16. The method for manufacturing a three-dimensional packaging structure according to claim 15, wherein: The step of mounting the stacked chip on the substrate or the wing chip comprises: A fourth chip is mounted on the substrate; wherein the fourth chip is arranged on a side of the second chip away from the first chip and is arranged face to face with the third chip, and the fourth chip is provided with a sixth metal column, and the sixth metal column is electrically connected to the fifth metal column.

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