Camera module and optical device including the camera module

Abstract

The present disclosure provides a camera module and an optical device including the camera module. The camera module includes: a first circuit board; a lens moving unit disposed on the first circuit board; a second circuit board including a connector; a connection board connecting the first circuit board and the second circuit board; and a noise blocking unit disposed on the second circuit board, wherein the second circuit board includes a ground layer, and the noise blocking unit is in contact with the ground layer.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of June 26, 2019, an international application number of PCT / KR2019 / 007728, an invention title of "Camera Module and Optical Device Including the Same", and an application number of 201980055093.9 upon entry into the Chinese national phase. Technical Field

[0002] Embodiments relate to a camera module and an optical device including the camera module. Background Art

[0003] It is difficult to apply a voice coil motor (VCM) technology used in existing general camera modules to a ultra-small low-power camera module, and thus research related thereto has been actively conducted.

[0004] The demand for and production of electronic products (such as smart phones and mobile phones equipped with cameras) have increased. Cameras for mobile phones tend to increase in resolution and miniaturize. Accordingly, actuators have also been miniaturized, increased in diameter, and made multifunctional. To implement a high-resolution camera for a mobile phone, it is necessary to improve the performance of the camera for a mobile phone and its additional functions, such as autofocus, hand shake correction, and zoom. Summary of the Invention

[0005] Technical Problem

[0006] Embodiments provide a camera module and an optical device including the camera module, which can improve the performance of blocking EMI noise and reduce the resistance between a reinforcing member and the ground of a board.

[0007] Technical Solution

[0008] A camera module according to an embodiment includes: a lens moving unit including a lens; a connection board connected to the lens moving unit; and a connector unit connected to the connection board, wherein the connector unit includes: a board including a ground layer formed on its upper surface and a cavity; a noise blocking unit disposed in the cavity of the board to contact the ground layer; and a reinforcing member disposed on the noise blocking unit and above the cavity of the board and on the upper surface of the board, and wherein, when observed in a plan view, the length of one side of the noise blocking unit is less than the length of one side of the cavity of the board.

[0009] The noise blocking unit includes a first part disposed in the cavity of the board and a second part disposed on the connection board, and an end of the first part is disposed in the cavity of the board.

[0010] The length of the short side of the noise blocking unit may be less than the length of the long side of the cavity of the board.

[0011] The area of the ground layer may define the bottom surface of the cavity in the board.

[0012] The length of one long side of the cavity in the board may be greater than the length of the other long side of the cavity in the board.

[0013] The camera module may further include an adhesive disposed between the reinforcement member and the noise blocking unit.

[0014] The cavity in the board may include a first inner surface, and the noise blocking unit may include a first surface facing the first inner surface of the cavity in the board, and the first surface of the noise blocking unit is spaced apart from the first inner surface of the cavity in the board.

[0015] The cavity in the board may include a second inner surface facing the first inner surface and a third inner surface connecting the first inner surface to the second inner surface, and the noise blocking unit may include a second surface facing the second inner surface of the cavity in the board and a third surface facing the third inner surface of the cavity in the board, the second surface of the noise blocking unit is spaced apart from the second inner surface of the cavity in the board, and the third surface of the noise blocking unit is spaced apart from the third inner surface of the cavity in the board.

[0016] A part of the adhesive may be disposed in the cavity in the board.

[0017] The vertical length of the noise blocking unit and the vertical length of the adhesive may be less than the vertical length of the cavity, the vertical direction is perpendicular to the optical axis of the lens moving unit and extends from the first outer surface of the second region to the second outer surface, and the first outer surface and the second outer surface of the second region face each other.

[0018] The adhesive may include conductive particles, and the conductive particles are in contact with the ground layer through the noise blocking unit.

[0019] The resistance value between the reinforcement member and the ground layer may be less than 1 ohm.

[0020] A camera module according to another embodiment includes: a lens moving unit including a lens; a connection board connected to the lens moving unit; and a connector unit connected to the connection board, wherein the connector unit includes: a board including a ground layer formed on its upper surface and a cavity; a noise blocking unit disposed in the cavity in the board to contact the ground layer; and a reinforcement member disposed on the noise blocking unit and disposed above the cavity in the board and on the upper surface of the board, wherein the noise blocking unit includes a first portion disposed in the cavity in the board and a second portion disposed on the connection board, and an end of the first portion is disposed in the cavity in the board.

[0021] A camera module according to an embodiment includes: a first circuit board; a lens moving unit disposed on the first circuit board; a second circuit board including a connector; a connection board connecting the first circuit board and the second circuit board; and a noise blocking unit disposed on the second circuit board, wherein the second circuit board includes a ground layer, and the noise blocking unit is in contact with the ground layer.

[0022] A camera module according to an embodiment includes: a first circuit board; a lens moving unit disposed on the first circuit board; a second circuit board including a connector and a cavity; a connection board connecting the first circuit board and the second circuit board; and a noise blocking unit disposed on the second circuit board, wherein the noise blocking unit includes a first portion disposed in the cavity of the second circuit board.

[0023] Advantageous Effects

[0024] The embodiment can improve the performance of blocking EMI noise and reduce the resistance between the reinforcing member and the ground of the board. Description of the Drawings

[0025] Figure 1 is a cross-sectional view of a camera module according to an embodiment;

[0026] Figures 2a to 2d is a diagram showing a process of coupling a noise blocking unit, an adhesive, and a reinforcing member to a board;

[0027] Figure 3 is along Figure 2d a cross-sectional view taken along line AB in

[0028] Figure 4 is along Figure 2d a cross-sectional view taken along line CD in

[0029] Figure 5 is Figure 1 a cross-sectional view of an embodiment of the board shown in

[0030] Figure 6 is a diagram showing an embodiment of an adhesive;

[0031] Figure 7 is a diagram showing a case where the size of the adhesive and the size of the EMI film are larger than the size of the groove in the board;

[0032] Figure 8 is a perspective view of a camera module according to another embodiment;

[0033] Figure 9 is a perspective view of a portable terminal according to an embodiment; and

[0034] Figure 10 is showingFigure 9 A diagram showing the configuration of a portable terminal; Detailed implementation

[0035] Hereinafter, the embodiments will be clearly elucidated by the description of the embodiments with reference to the accompanying drawings. In the following description of the embodiments, it will be understood that when an element such as a layer (film), region, pattern, or structure is referred to as being "above" or "below" another element, the element may be "directly" above or below the other element, or may be "indirectly" arranged such that there may also be intervening elements. In addition, it will also be understood that the criteria regarding "above" or "below" are determined based on the drawings.

[0036] In the drawings, for clarity and convenience of description, the dimensions of the layers may be enlarged, omitted, or shown schematically. Additionally, the dimensions of the constituent elements may not accurately reflect the actual dimensions of the elements. Throughout the drawings, the same reference numerals will be used as much as possible to refer to the same or similar components.

[0037] Hereinafter, a camera module according to an embodiment will be described with reference to the accompanying drawings. For ease of description, although a rectangular coordinate system (x, y, z) is used to describe the camera module according to the embodiment, some other coordinate systems may also be used to describe the lens moving unit, and the embodiment is not limited thereto. In each figure, the x-axis direction and the y-axis direction refer to the directions perpendicular to the optical axis, i.e., the z-axis. The z-axis direction as the optical axis direction may be referred to as the "first direction", the x-axis direction may be referred to as the "second direction", and the y-axis direction may be referred to as the "third direction".

[0038] The camera module according to an embodiment of the present invention is capable of performing an "autofocus function". Here, the "autofocus function" is used to automatically focus the image of a subject on the surface of an image sensor.

[0039] In addition, the camera module according to the embodiment may perform a function of "handshake correction". Here, the function of "handshake correction" can be used to prevent the contour line of the captured image from being blurred due to the vibration caused by the shaking of the user's hand when capturing a still image.

[0040] Figure 1 is a cross-sectional view of a camera module (200) according to an embodiment.

[0041] Refer to Figure 1, the camera module (200) may include: a board (800); a holder (600) disposed on the board (800); a lens moving unit (100) mounted on the holder (600); a connector (840) disposed on the board (800); a noise blocking unit (70); a reinforcing member (85) disposed on the board (800); and an adhesive (83) inserted between the reinforcing member (85) and the board (800).

[0042] The board (800) may include a plurality of pattern layers, an insulating layer inserted between the plurality of pattern layers, a cover layer disposed on the outermost pattern layer among the plurality of pattern layers for protecting the pattern layers, and contacts (or vias) adapted to conductively connect the pattern layers to each other.

[0043] The board (800) may include a first region (801) where the lens moving unit (100) is disposed, a second region (802) where the connector (840) is disposed, and a third region (803) connecting the first region (801) to the second region (802).

[0044] The first region (801) of the board (800) may alternatively be referred to as the "first board", the second region (802) of the board may alternatively be referred to as the "second board", and the third region (803) of the board (800) may alternatively be referred to as the "connecting board".

[0045] In another embodiment, the first region (801) or the first board of the board (800) may be included in the lens moving unit (100).

[0046] Each of the first region (801) and the second region (802) of the board (800) may include a flexible substrate (800-1) and rigid substrates (800-2, 800-3). The reason is that each of the first region (801) and the second region (802) requires a predetermined strength to be able to support the lens moving unit (100) and the connector (840).

[0047] For example, each of the first region (801) and the second region (802) of the board (800) may include a first rigid substrate (800-2) disposed on the flexible substrate (800-1) and a second rigid substrate (800-3) disposed below the flexible substrate (800-1).

[0048] The third region (802) of the board (800) may include a flexible substrate (800-1). The flexible substrates (800-1) included in the first region (801) to the third region (803) of the board (800) may be integrally formed.

[0049] As described above, although each of the first region (801) and the second region (802) may be a rigid substrate and the third region may be a flexible substrate, the present disclosure is not limited thereto. In another embodiment, at least one of the first region (801) to the third region (803) of the plate (800) may include a rigid substrate, and the remaining regions of the first region (801) to the third region (803) may include a flexible substrate.

[0050] Figure 5 is Figure 1 A cross-sectional view of an embodiment of the plate (800) shown.

[0051] Referring to Figure 5 , the plate (800) may include: a plurality of pattern layers (82-1 to 82-6) arranged to be spaced apart from each other in the optical axis direction or the vertical direction; insulating layers (or insulating barriers or insulating films) (91-1 to 91-5) inserted between the plurality of pattern layers (82-1 to 82-6) to insulate the pattern layers from each other; and covering layers (81a, 81b, 92-1 and 92-2) for protecting the plurality of pattern layers (82-1 to 82-6) from external impacts and the like.

[0052] Referring to Figure 5 , the flexible substrate (800-1) may include: an insulating layer (91-3), a pattern layer (82-3) provided on the insulating layer (91-3), and a pattern layer (82-4) provided below the insulating layer (91-3).

[0053] The first rigid substrate (800-2) may include: pattern layers (82-1, 82-2) provided on the flexible substrate (800-1) (e.g., the pattern layer 82-3), an insulating layer (91-1) inserted between the pattern layer (82-1) and the pattern layer (82-2), and an insulating layer (91-2) inserted between the flexible substrate (800-1) (e.g., the pattern layer 82-3) and the first rigid substrate (800-2) (e.g., the pattern layer 82-2).

[0054] The second rigid substrate (800-3) may include: pattern layers (82-5, 82-6) provided below the flexible substrate (800-1) (e.g., the pattern layer (82-4)), an insulating layer (91-4) inserted between the flexible substrate (800-1) (e.g., the pattern layer (82-4)) and the second rigid substrate (800-3) (e.g., the pattern layer (82-5)), and an insulating layer (91-5) inserted between the pattern layer (82-5) and the pattern layer (82-6).

[0055] The insulating layer (91-3) of the plate (800) may be a flexible insulating layer, for example, a polyimide layer that can be flexibly bent.

[0056] Each of the insulating layers (91-1, 91-2, 91-4, and 91-5) of the board (800) can be a rigid insulating layer or a prepreg layer, which has greater strength or hardness than the flexible insulating layer.

[0057] For example, each of the pattern layers (82-1 to 82-6) can alternatively be referred to as a copper foil, a conductive layer, or a conductive pattern, and each of the insulating layers (91-1 to 91-5) can alternatively be referred to as an insulating barrier or an insulating film.

[0058] Referring to Figure 5 , although the number of pattern layers of the flexible substrate (800-1) is two, and the number of pattern layers of each of the first rigid substrate (800-2) and the second rigid substrate (800-3) is two, the present disclosure is not limited thereto. In another embodiment, the number of pattern layers of the flexible substrate (800-1) and the number of pattern layers of each of the first rigid substrate (800-2) and the second rigid substrate (800-3) can be one or more.

[0059] The cover layer of the board (800) can include: a cover layer (81a) disposed on the pattern layer (82-1) of the first rigid substrate (800-2), a cover layer (81b) disposed on the pattern layer (82-6) of the second rigid substrate (800-3), a cover layer (92-1) disposed on the pattern layer (82-3) of the flexible substrate (800-1) in the third region (803), and a cover layer (92-2) disposed under the pattern layer (82-4) of the flexible substrate (800-1) in the third region (803). Each of the cover layers of the board (800) can be made of an insulating material (e.g., solder resist material).

[0060] In addition, the board (800) can include through holes adapted to electrically connect two of the pattern layers (82-1 to 82-6) of the flexible substrate (800-1) and the first rigid substrate (800-2) and the second rigid substrate (800-3) to each other. Here, the through holes can alternatively be referred to as contacts or contact through holes.

[0061] For example, the board (800) can include: at least one through hole (93-4) adapted to electrically connect the pattern layers (82-1 to 82-6) of the flexible substrate (800-1) to each other; and at least one through hole (93-1 to 93-4) adapted to electrically connect two of the pattern layers (82-1 to 82-6) of the first rigid substrate (800-2) and the second rigid substrate (800-3) to each other.

[0062] The cavity (31) in the plate (800) can expose the pattern layer (82-6) of the plate (800) from the second surface (11b) of the second region (802) of the plate (800). Here, the cavity (31) can alternatively be referred to as a recess.

[0063] The pattern layer (82-6) can include a "ground layer", or can alternatively be referred to as a "ground layer" or a "ground plane".

[0064] The portion of the ground layer (82-6) exposed through the cavity (31) can form the bottom surface of the cavity (31) in the second plate (802).

[0065] The holder (600) can be provided on the first region (801), and the lens moving unit (100) can be provided or mounted on the holder (600), which is provided on the plate (800).

[0066] The connector (840) can be provided on the second region (or "second plate") (802) of the plate (800). For example, the connector (840) can be provided on one surface of the second region (802) of the plate (800). The cavity (31) can be formed at the outer surface of the second region (802) of the plate (800), and can expose the ground layer from the other surface of the second region (802).

[0067] The connector (840), the second region (or second plate) (802) of the plate (800), at least a part of the noise blocking unit (70), and the reinforcing member (85) can together constitute a "connector" unit.

[0068] For example, the holder (600) and the lens moving unit (100) can be provided on the first surface (11a) of the first region (801) of the plate (800), and the connector (840) can be provided on the first surface (11a) of the second region (802) of the plate (800).

[0069] The terminals of the lens moving unit (100) can be conductively connected to at least one of the pattern layers (e.g., 82-1 to 82-6) of the first region (801) of the plate (800), and the terminals of the connector (840) can be conductively connected to at least one of the pattern layers (82-1 to 82-6) of the second region (802) of the plate (800).

[0070] For example, the terminals of the lens moving unit (100) can be conductively connected to the pattern layers (82-3, 82-4) of the flexible substrate (800-1) in the first region (801), and the terminals of the connector (840) can be conductively connected to the pattern layers (82-3, 82-4) of the flexible substrate (800-1) in the second region (802) of the board (800). The terminals of the lens moving unit (100) can be conductively connected to the terminals of the connector (840) via the flexible substrate (800-1).

[0071] The noise blocking unit (70) can be disposed under the second region (802) of the board (800).

[0072] In addition, the noise blocking unit (70) can be disposed at the upper and lower portions of the flexible substrate (800-1) in the third region (803) of the board (800). The noise blocking unit (70) can alternatively be referred to as a noise blocking layer, an "EMI (electromagnetic interference) blocking unit", an EMI shielding unit, an EMI film, or an EMI tape.

[0073] The noise blocking unit (70) can include a first noise blocking portion (71) and a second noise blocking portion (72).

[0074] The first noise blocking portion (71) can be disposed under the second region (802) and the third region (803) of the board (800). For example, the first noise blocking portion can include a first part (or first region) (71a) disposed in a cavity (31) in the second region (802) of the board (800) and a second part (or second region) (71b) disposed under the flexible substrate (800-1) in the third region (803) of the board (800).

[0075] The second noise blocking portion (72) can be disposed on the third region (803) of the board (800).

[0076] The noise blocking unit (70) can also include a portion disposed on the upper surface and / or the lower surface of the first region (803) of the board (800).

[0077] The second part (71b) of the first noise blocking portion (71) can be disposed or formed only on a part of the third region (or connection board) (803).

[0078] The first noise blocking portion (71) can also include a third part (71c) disposed between the first part (71a) and the second part (71b) to connect the first part (71a) to the second part (71b).

[0079] For example, the third part (71c) can be disposed on the lower surface (or the covering layer (81b)) of the second region (802) of the plate (800), which connects the fourth inner surface (31d) of the cavity (31) to the fourth outer surface (5d) of the second region (802) of the plate (800).

[0080] The reinforcing member (85) can be disposed below the second region (or "second plate") (802) of the plate (800).

[0081] For example, the reinforcing member (85) can be disposed below the first part (71a) of the first noise blocking part (71), and the first part (71a) is disposed below the second region (802) of the plate (800).

[0082] For example, the reinforcing member (85) can be disposed above the cavity (31) of the second plate (802) and on the upper surface of the second plate (802).

[0083] The reinforcing member (85) can be made of a conductive material (such as metal) with high thermal conductivity. Although the reinforcing member (85) can be made of, for example, stainless steel, aluminum, etc., the present disclosure is not limited thereto.

[0084] The reinforcing member (85) can be conductively connected to the ground terminal of the plate (300) to be used as a ground to protect the camera module from electrostatic discharge (ESD).

[0085] An adhesive (83) can be disposed between the reinforcing member (85) and the first noise blocking part (71).

[0086] For example, the adhesive (83) can be disposed between the first part (71a) of the first noise blocking part (71) and the reinforcing member (85) to fix or attach the reinforcing member (85) to the second region (802) of the plate (800).

[0087] Refer to Figure 3 , although the upper surface of the reinforcing member (85) can be spaced apart from the lower surface of the second plate (802) (for example, the lower surface of the covering layer (81b)), the present disclosure is not limited thereto. In another embodiment, the upper surface of the reinforcing member (85) can be in contact with the lower surface of the second plate (802) (for example, the lower surface of the covering layer (81b)).

[0088] A part of the adhesive (83) can be disposed in the cavity (31) of the second plate.

[0089] According to an embodiment, the second region (or second plate) (802) of the plate (800) can have a cavity (31) with an inlet, and a part of the pattern layer (such as 82-6, see Figure 5)Exposed through this inlet.

[0090] Here, the area of the pattern layer (82-6) exposed through the cavity (31) can be used as a ground layer for grounding the board (800), or can be conductively connected to the ground of the board (800).

[0091] The area of the pattern layer (82-6) exposed through the cavity (31) can be conductively connected to the terminal of the ground pin or connector (840).

[0092] For example, the cavity (31) can be formed by cutting off a part of the covering layer (81b) of the second area (802) of the board (800), and the lower surface of a part of the pattern layer (such as 82-6, see Figure 5 ) in the second area (802) can be exposed through the cavity (31).

[0093] The first noise blocking part (71) can be arranged in the cavity (31) in the second area (802) of the board (800). At least a part of the periphery of the first noise blocking part (71) can be arranged in the cavity (31).

[0094] For example, the first part (71a) of the first noise blocking part (71) can be arranged in the cavity (31) in the second area (802) of the board (800).

[0095] The adhesive (83) can be arranged on the first noise blocking part (71) arranged in the cavity (31), and the reinforcing member (85) can be arranged on the adhesive (83).

[0096] By arranging the first part (71a) of the first noise blocking part (71) in the cavity (31) of the second area (802) of the board (800), and then arranging the adhesive (83) on the first part (71a) of the first noise blocking part (71) arranged in the cavity (31), this embodiment can block or reduce the noise generated by the camera module, and can reduce the resistance between the reinforcing member (85) and the board (800) (for example, ground (GND)).

[0097] Figures 2a to 2d The process of coupling the noise blocking unit (71), the adhesive (83) and the reinforcing member (85) to the board (800) is shown. Figure 3 is Figure 2d The cross-sectional view taken along the line AB in Figure 4 is Figure 2d The cross-sectional view taken along the line CD in

[0098] Figures 2a to 2d is a bottom view showing the second area (802) and the third area (803) of the board (800).Figure 3 and Figure 4 is a cross-sectional view showing the state rotated by 180 degrees. Figure 2d The cross-sectional view shows the state rotated by 180 degrees.

[0099] Referring to Figure 2a , a cavity (31) is formed in the second surface of the second region (802) of the plate (800) to expose the pattern layer (or ground layer) (82-6) from the second surface. The exposed ground layer is not limited to Figure 2a the shape shown (e.g., "L" shape), and can have any shape among various polygonal shapes (e.g., rectangular shape, triangular shape, etc.) or circular shape.

[0100] Referring to Figure 2a , the lower left end of the pattern layer (82-6) may not be exposed through the cavity (31). The lower left end of the pattern layer (82-6) may be provided with a ground layer (e.g., "first ground layer" or "digital ground layer") exposed through the cavity (31) and another ground layer (e.g., "second ground layer" or "analog ground layer") separated or spaced apart from the first ground layer.

[0101] In another embodiment, the second ground layer may also be exposed through the cavity (31), and the first noise blocking portion (71) and the adhesive (83) may be provided between the exposed ground layer and the reinforcing member (85).

[0102] For example, the cavity (31) may be formed to expose the lower surface of the pattern layer (82-6) by removing a part of the cover layer (81b) of the second region (802) of the plate (800).

[0103] The second region (802) of the plate (800) may have four outer surfaces (5a to 5d).

[0104] For example, the plan view of the second region (802) of the plate (800) may have a rectangular shape having four sides (5a to 5d).

[0105] Each of the distances (d1, d2) between the outer surface (or side) (5a to 5d) of the second region (802) and the cavity (31) may be in the range of 0.3 [mm] to 0.5 [mm].

[0106] The depth (H) of the cavity (31) may be equal to the thickness of the cover layer (81b) of the plate (800). For example, the depth (H) of the cavity (31) may be the length of the lens or the lens barrel (400) of the lens moving unit (100). For example, the depth (H) may be in the range of 21 [μm] to 24 [μm]. For example, the depth (H) may be 23 [μm].

[0107] Referring to Figure 2b, a portion (71a) of the first noise blocking portion (71) is disposed in the cavity (31) of the second region (802) of the plate (800).

[0108] The first noise blocking portion (71) may include a first portion (71a) disposed in the cavity (31) of the second region (802) of the plate (800) and a second portion (71b) disposed below the third region (803) of the plate (800). In addition, the first noise blocking portion (71) may include a third portion connecting the first portion to the second portion.

[0109] For example, the second portion (71b) of the first noise blocking portion (71) may be disposed on the connection plate (803), and the end of the first portion (71a) may be disposed in the cavity (31) of the second plate (802). For example, a portion of the end of the first portion (71a) may be disposed in the cavity (31).

[0110] The first portion (71a) of the first noise blocking portion (71) may be disposed below the pattern layer (82-6) of the second region (802) of the plate (800), and the pattern layer is exposed through the cavity (31).

[0111] The cavity (31) in the plate (800) may include an inner surface (31a to 31d) and a bottom surface. Here, the inner surface of the cavity (31) may alternatively be referred to as a "side wall", "side surface", or "inner wall".

[0112] For example, the first inner surface (31a) and the second inner surface (31b) may face each other, and the third inner surface (31c) and the fourth side surface (31d) may face each other. The third inner surface (31c) may connect one end of the first inner surface (31a) to one end of the second inner surface (31b), and the fourth inner surface (31d) may connect the other end of the first inner surface (31a) to the other end of the second inner surface (31b).

[0113] The bottom surface of the cavity (31) may be a surface (e.g., the lower surface) through which the pattern layer (82-6) of the second region (802) of the plate (800) is exposed. The lower surface of the first portion (71a) of the first noise blocking portion (71) may be in contact with the bottom surface of the cavity (31).

[0114] For example, the first portion (71a) of the first noise blocking portion (71) may include: a first surface (21a) (or "first side surface") facing the first inner surface (31a) of the cavity (31), a second surface (21b) (or "second side surface") facing the second inner surface (31b) of the cavity (31), and a third surface (21c) (or "third side surface") facing the third inner surface (31c) of the cavity (31).

[0115] The side surface of the first part (71a) of the first noise blocking part (71) may be located in the cavity (31) of the second region (802) of the plate (800), and may be spaced apart from the second surface (11b) of the second region (802) of the plate (800).

[0116] For example, the first surface (21a), the second surface (21b), and the third surface (21c) of the first part (71a) of the first noise blocking part (71) may be located in the cavity (31) of the second region (802), and may be spaced apart from the second surface (11b) of the second region (802) of the plate (800).

[0117] The vertical length of the second part (71b) of the first noise blocking part (71) may be greater than the vertical length (L3) of the first part (71a). The reason is to improve the effect of blocking EMI in the third region (803) of the plate (800).

[0118] The length (or width) (L3) of one side of the first noise blocking part (71) may be less than the length (or width) (L1) of one side of the cavity (31) of the second plate (802).

[0119] For example, the length of the first long side located at one side of the cavity (31) of the second plate (802) may be greater than the length of the second long side located at the other side of the cavity (31). For example, the first long side and the second long side may face each other.

[0120] For example, the length of the first short side located at one side of the cavity (31) of the second plate (802) may be greater than the length of the second short side located at the other side of the cavity (31). For example, the first short side and the second short side may face each other.

[0121] For example, the length (L3) of the short side of the first noise blocking part (71) may be less than the length (L1) of the long side of the cavity (31) of the second plate (802).

[0122] The vertical length (L3) of the first part (71a) of the first noise blocking part (71) may be less than the vertical length (L1) of the cavity (31) of the plate (800) (L3 < L1).

[0123] The horizontal length (L4) of the first part (71a) of the first noise blocking part (71) may be less than the horizontal length (L2) of the cavity (31) of the plate (800) (L4 < L2).

[0124] For example, the vertical direction may be Figure 2d the direction of the line AB in Figure 1in the y-axis direction (which is perpendicular to the optical axis direction of the lens moving unit (100)).

[0125] Alternatively, the vertical direction may be a direction perpendicular to the optical axis direction of the lens moving unit (100) (or the axis of the image sensor (810)) and extending from the first outer surface (5a) of the second region (802) of the board (800) to the second outer surface (5b).

[0126] Alternatively, the vertical direction may be a direction perpendicular to the direction extending from the image sensor (810) to the connector (840).

[0127] For example, the horizontal direction may be Figure 2d the direction of line CD in Figure 1 the x-axis direction in (which is perpendicular to the optical axis direction of the lens moving unit (100)).

[0128] For example, the vertical direction may be a direction extending from the first inner surface (31a) of the cavity (31) of the board (800) to the second inner surface (31b), and the horizontal direction may be a direction extending from the third inner surface (31c) of the cavity (31) of the board (800) to the fourth inner surface (31d).

[0129] For example, the area of the lower surface (or upper surface) of the first part (71a) of the first noise blocking portion (71) provided in the cavity (31) of the board (800) may be smaller than the area of the lower surface of the cavity (31) in the board (800) (or the area of the lower surface exposed by the pattern layer (82-6)).

[0130] The distance (d3) between the first surface (21a) of the first part (71a) of the first noise blocking portion (71) and the first outer surface (5a) of the second region (802) of the board (800) or the distance (d3) between the second surface (21b) of the first part (71a) of the first noise blocking portion (71) and the second outer surface (5b) of the second region (802) of the board (800) may be greater than the distance d1 (d3>d1).

[0131] The distance (d4) between the third surface (21c) of the first part (71a) of the first noise blocking portion (71) and the third outer surface (5c) of the second region (802) of the board (800) may be greater than the distance d2 (d4>d2).

[0132] Because the distance d3 is greater than the distance d1 (d3>d1) and the distance d4 is greater than the distance d2 (d4>d2), the first part (71a) of the first noise blocking portion (71) can be disposed in the cavity (31).

[0133] In Figure 2bIn the embodiment, the distance d4 may be greater than the distance d3 (d4>d3). For example, the distance d3 may be in the range of 0.6 [mm] to 0.8 [mm], and the distance d4 may be in the range of 0.9 [mm] to 1.1 [mm]. In another embodiment, the distance d4 may be equal to the distance d3 (d4=d3) or may be less than the distance d3 (d4>d3). <d3)。

[0134] Reference Figure 3 , the first surface to the third surface (21a to 21c) of the first portion (71a) of the first noise blocking portion (71) may be spaced apart from the first inner surface to the third inner surface (31a to 31c) of the cavity (31) of the plate (800).

[0135] For example, the first surface (21a) may be spaced apart from the first inner surface (31a) of the cavity (31), the second surface (21b) may be spaced apart from the second inner surface (31b) of the cavity (31), and the third surface (21c) may be spaced apart from the third inner surface (31c) of the cavity (31).

[0136] The distance between the third surface (21c) of the first noise blocking portion (71) and the third inner surface (31c) of the cavity (31) may be different from the distance between the first surface (21a) of the first noise blocking portion (71) and the first inner surface (31a) of the cavity (31) and / or the distance between the second surface (21b) of the first noise blocking portion (71) and the second inner surface (31b) of the cavity (31).

[0137] For example, the distance between the third surface (21c) of the first noise blocking portion (71) and the third inner surface (31c) of the cavity (31) may be greater than the distance between the first surface (21a) and the first inner surface (31a) of the cavity (31) and / or the distance between the second surface (21b) and the second inner surface (31b) of the cavity (31).

[0138] For example, the distance between the inner surface (31a to 31d) of the cavity (31) and the end surface (e.g., 21a to 21c) of the first noise blocking portion (71) may be greater than the distance between the inner surface (31a to 31d) of the cavity (31) and the end surface of the adhesive (83). The reason for this is to increase the surface area of ​​the adhesive (83) and, in turn, increase the adhesive force between the reinforcing member (85) and the second plate (802).

[0139] For example, although the horizontal (or vertical) distance between the inner surface (31a to 31d) of the cavity (31) and the end surface of the reinforcing member (85) may be greater than the horizontal (or vertical) distance between the inner surface (31a to 31d) of the cavity (31) and the end surface of the first noise blocking portion (71) (e.g., 21a to 21c), the present disclosure is not limited thereto. In another embodiment, the former may be equal to or less than the latter.

[0140] For example, although the horizontal (or vertical) distance between the inner surface (31a to 31d) of the cavity (31) and the end surface of the reinforcing member (85) may be greater than the horizontal (or vertical) distance between the inner surface (31a to 31d) of the cavity (31) and the end surface of the adhesive (83), the present disclosure is not limited thereto. In another embodiment, the former may be equal to or less than the latter.

[0141] Referring to Figure 2c and Figure 2d , the reinforcing member (85) is attached to the first portion (71a) of the first noise blocking portion (71) disposed in the cavity (31) via the adhesive (83).

[0142] For example, the reinforcing member (85) may be fixed or attached to the first portion (71a) of the first noise blocking portion (71) by applying or forming the adhesive (83) onto one surface (e.g., the upper surface) of the reinforcing member (85), and then pressing the reinforcing member (85) having the adhesive (83) thereon onto the first portion (71a) of the first noise blocking portion (71) using hot pressing. By means of the pressing operation, the upper surface of the reinforcing member (85) may contact the second surface (or lower surface) (11b) of the second region (802) of the plate (800).

[0143] The adhesive (83) may be a conductive adhesive or may include a conductive adhesive (e.g., conductive particles). For example, the adhesive (83) may be FGBF-700.

[0144] The side surface of the adhesive (83) may be spaced apart from the second surface (11b) of the second region (802) of the plate (800).

[0145] The vertical length (L5) of the adhesive (83) may be less than the vertical length (L1) of the cavity (31) of the plate (800) (L5 < L1). The horizontal length (L6) of the adhesive (83) may be less than the horizontal length (L2) of the cavity (31) of the plate (800) (L6 < L2).

[0146] The vertical length (L5) of the adhesive (83) may be greater than or equal to the vertical length (L3) of the first portion (71a) of the first noise blocking portion (71).

[0147] The horizontal length (L6) of the adhesive (83) may be greater than or equal to the horizontal length (L4) of the first portion (71a) of the first noise blocking portion (71).

[0148] The distance (d5) between the first side surface of the adhesive (83) and the first outer surface (5a) of the second region (802) of the plate (800) or the distance (d5) between the second side surface of the adhesive (83) and the second outer surface (5b) of the second region (802) of the plate (800) may be greater than the distance d1 (d5 > d1). In another embodiment, the distance d5 may be equal to the distance d1 (d5 = d1).

[0149] The distance (d6) between the third side surface of the adhesive (83) and the third outer surface (5c) of the second region (802) of the plate (800) may be greater than the distance d2 (d6 > d2). In another embodiment, the distance d6 may be equal to the distance d2 (d6 = d2).

[0150] For example, each of the distance d5 and the distance d6 may be in the range of 0.5 [mm] to 0.6 [mm].

[0151] The range of d1:d3 may be from 1:1.2 to 1:2.65, and the range of d2:d4 may be from 1:1.8 to 1:3.65.

[0152] The range of d1:d5 may be from 1:1 to 1:2, and the range of d2:d6 may be from 1:1 to 1:2.

[0153] If d3 / d1 is less than 1.2, since the difference between the horizontal length of the first portion (71a) of the first noise blocking portion (71) and the horizontal length of the cavity (31) is small, the machining allowance required to provide the first portion (71a) of the first noise blocking portion (71) is insufficient, and the first noise blocking portion (71) may escape outward from the cavity (31). As a result, the resistance value between the reinforcing member (85) and the ground of the plate (800) may increase to 1 ohm or higher.

[0154] If d3 / d1 is greater than 2.65, the surface area of the first portion (71a) of the first noise blocking portion (71) may decrease, and thus the ability to block the noise generated by the camera module may decline, thereby reducing the RF sensitivity of the optical device equipped with the camera module.

[0155] If d5 / d1 and / or d6 / d2 is less than 1, the horizontal length of the adhesive (83) can become greater than the horizontal length of the cavity (31), and thus the adhesive (83) can be disposed on the lower surface of the second region (802) outside the cavity (31). As a result, the resistance value between the reinforcing member (85) and the ground of the plate (800) can be increased to 1 ohm or higher.

[0156] If d5 / d1 or d6 / d2 is greater than 2, due to the reduced surface area of the adhesive (83), the adhesion force between the reinforcing member (85) and the plate (800) may decrease, and thus the reinforcing member (85) may be prone to detachment from the plate (800).

[0157] Referring to Figure 2d , the distance (d7) between the first outer surface 5a (or the first outer surface 6b) of the second region (802) of the plate (800) and the first side surface (or the second side surface) of the reinforcing member (85) can be less than the distance d1 (d7 < d1). The distance (d8) between the third outer surface (5c) of the second region (802) of the plate (800) and the third side surface of the reinforcing member (85) can be less than the distance d2 (d8 < d2).

[0158] For example, each of the distances d1 to d8 can be the shortest distance between two planes parallel to the two surfaces in question.

[0159] The thickness of the first noise blocking portion (71) (e.g., the thickness of the first portion (71a)) (T1) can be less than the depth (H) of the cavity (31) of the plate (800) (T1 < H). Here, the thickness of the first noise blocking portion (71) can be the length of the first noise blocking portion (71) in the optical axis direction.

[0160] For example, the thickness of the first noise blocking portion (71) (the thickness of the first portion (71a)) (T1) can be in the range of 12 [μm] to 18 [μm].

[0161] The side surface of the first portion (71a) of the noise blocking portion (71) can be positioned further away from the outer surface (5a to 5c) of the second region (802) of the plate (800) than the inner surface (31a to 31d) of the cavity (31).

[0162] The side surface of the adhesive (83) can be positioned further away from the outer surface (5a to 5c) of the second region (802) of the plate (800) than the inner surface (31a to 31d) of the cavity (31).

[0163] In addition, the outer surface of the reinforcing member (85) can be positioned closer to the outer surface (5a to 5c) of the second region (802) of the plate (800) than the side surfaces (31a to 31d) of the cavity (31) of the plate (300).

[0164] The surface area of the first portion (71a) of the noise blocking portion (71) overlapping with the second region (802) of the plate (800) in the optical axis direction of the lens moving unit (100) can be smaller than the surface area of the bottom surface of the cavity (31).

[0165] In addition, the surface area of the adhesive (83) overlapping with the second region (802) of the plate (800) in the optical axis direction can be smaller than the surface area of the bottom surface of the cavity (31) of the plate (800).

[0166] The adhesive (83) can include an adhesive resin and conductive particles.

[0167] Figure 6 An embodiment of the adhesive (83) is shown.

[0168] Referring to Figure 6 , the adhesive (83) can include a resin (83b) and conductive particles (83a). The conductive particles (83a) of the adhesive (83) are not shown in Figure 3 .

[0169] Although the resin (83b) can be a non-conductive resin layer, the present disclosure is not limited thereto. In another embodiment, the resin (83b) can be a conductive resin layer. For example, the resin (83b) can be FGBF-700.

[0170] For example, the diameter of the conductive particles (83a) can be greater than the thickness of the noise blocking layer (71). Alternatively, the diameter of the conductive particles (83a) can be greater than or equal to the depth (H) of the cavity (31).

[0171] For example, the thickness (T2) of the adhesive (83) can be greater than the thickness (T1) of the first noise blocking portion (71) (T2 > T1). For example, the thickness (T2) of the adhesive (83) can be in the range of 24 [μm] to 26 [μm]. For example, considering the diameter of the conductive particles (83a), the thickness (T2) of the adhesive (83) can be the maximum thickness of the adhesive.

[0172] The conductive particles (83a) of the adhesive (83) can contact the exposed pattern layer (82-6) of the second region (802) of the plate (800) through the first noise blocking portion (71) (e.g., the first portion (71a)).

[0173] The reinforcing member (850) can be electrically connected to the pattern layer (82-6) of the second region (802) of the plate (800).

[0174] The thickness (T3) of the reinforcing member (85) can be less than the overall thickness of the plate (800), but greater than the thickness of the flexible substrate (800-1) and the thickness of the adhesive (83). For example, the thickness of the reinforcing member (85) can be in the range of 90 [μm] to 120 [μm].

[0175] The thickness (T3) of the reinforcing member (85) can be greater than the thickness (T1) of the first noise blocking portion (71) and the thickness (T2) of the adhesive (83) (T3>T1, T2).

[0176] Refer to Figure 3 and Figure 4 , the upper surface of the reinforcing member (85) can be in contact with the second surface (or lower surface) (11b) of the second region (802) of the plate (800). For example, the upper surface of the periphery of the reinforcing member (85) can be in contact with the second surface (or lower surface) (11b) of the second region (802) of the plate (800).

[0177] In another embodiment, the upper surface around the reinforcing member (85) can be spaced apart from the second surface (11b) of the second region (802) of the plate (800).

[0178] Figure 7 Shows the case where the size of the adhesive (30) and the size of the EMI film (20) are larger than the size of the groove (10-1) in the plate (10).

[0179] In this case, since the size of the EMI film (20) and the size of the adhesive (30) are larger than the size of the groove (10-1) in the plate (10) through which the ground pattern layer (10a) of the plate (10) is exposed, when the EMI film (20) is attached to the lower surface of the plate (10) and the reinforcing member (40) with the adhesive (30) applied thereon is attached to the EMI film (20), there may be a gap or a bulging phenomenon between the ground pattern layer (10a) of the plate (10) exposed through the groove (10-1) and the reinforcing member (40), as Figure 7 shown.

[0180] In addition, since a gap is generated between the adhesive (20) and the ground pattern layer (10a), even when hot pressing is used, the conductive particles of the adhesive (30) may be difficult to contact the ground pattern layer (10a) through the EMI film (20), and thus the resistance (e.g., resistance) between the ground of the plate (10) and the reinforcing member (40) may increase. For example, in Figure 7In this case, the resistance between the ground of the board (10) and the reinforcing member (40) can be 1 ohm or higher.

[0181] In contrast, embodiments of the present invention can block or reduce EMI noise generated from the camera module (200) by positioning the first noise blocking portion (71) between the pattern layer (82-6) exposed through the cavity (31) in the second region (802) of the board (800) and the reinforcing member (85). Additionally, since the first noise blocking portion (71) and the adhesive (83) are disposed in the cavity (31), such that the first noise blocking portion (71) and the adhesive (83) are in close contact with the pattern layer (82-6) exposed through the cavity (31), the resistance between the pattern layer (82-6) of the board (800) used as a ground and the reinforcing member (85) can be reduced, and thus the reinforcing member (85) can be used as the ground of the board (800). Specifically, according to an embodiment, the resistance between the pattern layer (82-6) of the board (800) and the reinforcing member (85) can be less than 1 ohm.

[0182] A camera module according to another embodiment may further include a noise blocking portion disposed at least at one of the first surface (11a) and the second surface (11b) of the first region (801) and the first surface (11a) of the second region (802) of the board (800).

[0183] Figure 8 is a perspective view of a camera module according to another embodiment of the present invention.

[0184] Referring to Figure 8 , the camera module (200) may include: a lens or a lens barrel (400), a lens moving unit (100), an adhesive member (612), a filter (610), a holder (600), a board (800), an image sensor (810), a motion sensor (820), a controller (830), a connector (840), a noise blocking unit (70), an adhesive (not shown), and a reinforcing member (85). The same reference numerals as in Figure 1 denote the same components, and the description of the same components will be briefly made or omitted.

[0185] Having referred to Figure 1 the description of the noise blocking unit (70) made with reference to Figure 8 can also be applied to the noise blocking unit (70) shown in Figure 1 the description of the adhesive (83) made with reference to Figure 8 can also be applied to the noise blocking unit (not shown) in Figure 1 and the description of the reinforcing member made with reference toFigure 8 The reinforcing member (85) shown in

[0186] The lens or lens barrel (400) can be mounted on the lens moving unit (100).

[0187] The lens moving unit (100) can be referred to as a "sensing unit", "imaging unit", "VCM (voice coil motor)", or "lens moving device".

[0188] For example, the lens moving unit (100) can be an AF lens moving unit or an OIS lens moving unit. Here, the AF lens moving unit can be a unit that can only perform an autofocus function, and the OIS lens moving unit can be a unit that can perform both an autofocus function and an OIS (optical image stabilizer) function.

[0189] For example, the lens moving unit (100) can be an AF lens moving device. The AF lens moving device can include: a housing; a bobbin disposed in the housing; a coil disposed at the bobbin; a magnet disposed at the housing; at least one elastic member coupled to both the bobbin and the housing; and a base disposed below the bobbin (and / or the housing). The elastic member can include, for example, the upper elastic member and the lower elastic member described above.

[0190] A drive signal (e.g., drive current) can be supplied to the coil, and the bobbin can be moved in the optical axis direction using the electromagnetic force generated by the interaction between the coil and the magnet. In another embodiment, the coil can be disposed at the housing, and the magnet can be disposed at the bobbin.

[0191] For the AF feedback operation, the AF lens moving device can further include: a sensing magnet disposed at the bobbin; an AF position sensor (e.g., Hall sensor) disposed at the housing; and a circuit board at which the AF position sensor is disposed and which is disposed or mounted on the housing and / or the base. In another embodiment, the AF position sensor can be disposed at the bobbin, and the sensing magnet can be disposed at the housing.

[0192] The circuit board can be electrically connected to the coil and the AF position sensor. The drive signal can be supplied to the coil and the AF position sensor via the circuit board, and the output of the AF position sensor can be transmitted to the circuit board.

[0193] A camera module according to another embodiment may include a housing that, instead of the lens moving unit (100), is coupled to the lens or the lens barrel (400) to hold the lens or the lens barrel (400), and the housing may be coupled or attached to the upper surface of the holder (600). The housing attached or fixed to the holder (600) may be stationary and may be held in that position in a state of being attached to the holder (600).

[0194] For example, the lens moving unit (100) may be an OIS lens moving unit.

[0195] The OIS lens moving unit may include: a housing; a bobbin disposed in the housing to mount the lens or the lens barrel (400) thereon; a first coil disposed at the bobbin; a magnet disposed in the housing to face the first coil; at least one upper elastic member coupled to both the upper part of the bobbin and the upper part of the housing; at least one lower elastic member coupled to both the lower part of the bobbin and the lower part of the housing; a second coil disposed below the bobbin (and / or the housing); a circuit board disposed below the second coil; and a base disposed below the circuit board.

[0196] The OIS lens moving unit may further include a cover member coupled to the base to define a space for accommodating components of the lens moving unit therein together with the base.

[0197] The OIS lens moving unit may further include a support member that electrically connects the circuit board to the upper elastic member and supports the housing with respect to the base. Each of the first coil and the second coil may be electrically connected to the circuit board (250) and may receive a driving signal (driving current) from the circuit board.

[0198] For example, the upper elastic member may include a plurality of upper springs, and the support member may include a support member connected to the upper springs. The first coil may be electrically connected to the circuit board via the upper springs and the support member. The circuit board may include a plurality of terminals, and some of the plurality of terminals may be electrically connected to the first coil and / or the second coil.

[0199] By the electromagnetic force generated by the interaction between the first coil and the magnet, the bobbin and the lens or the lens barrel (400) connected to the bobbin may move in the optical axis direction such that the displacement of the bobbin in the optical axis direction is controlled, thereby implementing an AF operation.

[0200] In addition, by the electromagnetic force generated by the interaction between the second coil and the magnet, the housing may move in a direction perpendicular to the optical axis direction, thereby implementing hand shake correction or an OIS operation.

[0201] For the AF feedback operation, the OIS lens moving unit may further include: a sensing magnet disposed at the bobbin, and an AF position sensor (e.g., a Hall sensor) disposed at the housing. The OIS lens moving unit may further include a circuit board (not shown) that is disposed at the housing and / or the base and on which the AF position sensor is disposed or mounted. In another embodiment, the AF position sensor may be disposed at the bobbin, and the sensing magnet may be disposed at the housing. The OIS lens moving unit may further include a balance magnet disposed at the bobbin corresponding to the sensing magnet.

[0202] The AF position sensor may output an output signal corresponding to the result of detecting a change in the magnetic field strength of the sensing magnet due to the movement of the bobbin. The AF position sensor may be conductively connected to the circuit board via an upper elastic member (or a lower elastic member) and / or a support member. The circuit board may provide a driving signal to the AF position sensor, and the output of the AF position sensor may be transmitted to the circuit board. The controller (830) may sense or detect the displacement of the bobbin using the output from the AF position sensor.

[0203] The holder (600) may be disposed below the lens moving unit 100 (e.g., the base). The filter (610) may be mounted on the holder (600), and the holder (600) may include a protrusion (500) on which the filter (610) is to be placed.

[0204] The adhesive member (612) may couple or attach the lens moving unit (100) (e.g., the base) to the holder (600). In addition to the above attachment function, the adhesive member (6120) may be used to prevent contaminants from entering the lens moving unit (100).

[0205] The adhesive member (612) may be a thermosetting adhesive (e.g., thermosetting epoxy resin) or an ultraviolet curable adhesive (e.g., ultraviolet curable epoxy resin).

[0206] The filter (610) may be used to prevent light within a specific frequency band passing through the lens barrel (400) from being introduced into the image sensor (810). The filter (610) may be, for example, an infrared light blocking filter, but is not limited thereto. Here, the filter (610) may be oriented parallel to the x-y plane.

[0207] The area of the holder (600) where the filter (610) is mounted may be provided with holes to allow the light passing through the filter (610) to be introduced into the image sensor (810).

[0208] The board (800) can be disposed below the holder (600), and the image sensor (810) can be mounted on the board (600). The image sensor (810) can be the region on which an image including the light that has passed through the filter (610) and has been introduced into the image sensor (810) is formed.

[0209] The board (800) can include, for example, various circuits, devices, and controllers to convert the image formed on the image sensor (810) into an electrical signal and transmit the electrical signal to an external component.

[0210] The board (800) can be implemented as a board on which the image sensor can be mounted, on which a circuit pattern can be formed, and to which various devices can be coupled. The holder (600) can alternatively be referred to as a "sensor base", and the board (800) can alternatively be referred to as a "circuit board".

[0211] In another embodiment, certain regions of the board (800) can be implemented to be included in or not included in the lens moving unit (100).

[0212] The image sensor (810) can receive an image included in the light introduced through the lens moving unit (100) and can convert the received image into an electrical signal.

[0213] The filter (610) and the image sensor (810) can be arranged to be spaced apart from each other in a state of facing each other in the optical axis direction.

[0214] The motion sensor (820) can be mounted on the board (800) and can be conductively connected to the controller (830) through a circuit pattern formed on the board (800).

[0215] The motion sensor (820) can output the rotational angular velocity caused by the motion of the camera module (200). The motion sensor (820) can be implemented as a biaxial or triaxial gyro sensor or an angular velocity sensor.

[0216] The controller (830) can be mounted on the board (800) and can be conductively connected to the lens moving unit (100). The controller (830) can provide a signal for driving the AF coil, a signal for driving the OIS coil, a signal for driving the AF position sensor, and / or a signal for driving the OIS (Optical Image Stabilization) position sensor to the lens moving unit (100).

[0217] In addition, the controller (830) may receive the output from the AF position sensor and / or the output from the OIS position sensor. In addition, the controller (830) may use the output from the AF position sensor to provide a signal for the AF feedback operation to the AF coil, and may use the output from the OIS position sensor of the lens moving unit (100) to provide a signal for the OIS feedback operation to the OIS coil.

[0218] The connector (840) may be conductively connected to the board (800) and may have ports designed to be conductively connected to external devices.

[0219] The lens moving unit (100) according to an embodiment may be included in an optical instrument that is designed to: form an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc., which are properties of light; extend vision; record an image obtained through a lens or reproduce an image; perform optical measurement; or propagate or transmit an image. For example, although the optical instrument according to an embodiment may be a mobile phone, a cellular phone, a smart phone, a portable smart instrument, a digital camera, a laptop computer, a digital broadcast terminal, a PDA (Personal Digital Assistant), a PMP (Portable Multimedia Player), a navigation device, etc., the present disclosure is not limited thereto. In addition, any device capable of taking an image or a photograph is possible.

[0220] Figure 9 is a perspective view showing a portable terminal (200A) according to an embodiment. Figure 10 is a view showing Figure 9 the configuration of the portable terminal shown in

[0221] Referring to Figure 9 and Figure 10 , the portable terminal (200A) (hereinafter referred to as the "terminal") may include a main body (850), a wireless communication unit (710), an audio / video (A / V) input unit (720), a sensing unit (740), an input / output unit (750), a memory unit (760), an interface unit (770), a controller (780), and a power supply unit (790).

[0222] Figure 9 The main body (850) shown in

[0223] The main body (850) may include a housing (e.g., a case, a shell, or a cover) that defines the appearance of the terminal. For example, the main body (850) may be divided into a front housing (851) and a rear housing (852). Various electronic components of the terminal may be accommodated in a space defined between the front housing (851) and the rear housing (852).

[0224] The wireless communication unit (710) may include one or more modules that enable wireless communication between the terminal (200A) and a wireless communication system or between the terminal (200A) and a network in which the terminal (200A) is located. For example, the wireless communication unit (710) may include a broadcast receiving module (711), a mobile communication module (712), a wireless Internet module (713), a near field communication module (714), and a location information module (715).

[0225] The A / V input unit (720) is used to input an audio signal or a video signal and may include, for example, a camera (721) and a microphone (722).

[0226] The camera (721) may include a camera module (200) according to the embodiments shown in Figure 1 or Figure 8 As described above, since the camera module (200) can improve the EMI noise blocking performance, the RF (radio frequency) sensitivity of the portable terminal (200A) can be improved.

[0227] The sensing unit (740) may sense the current state of the terminal (200A), such as the opening or closing of the terminal (200A), the position of the terminal (200A), the presence of a user's touch, the orientation of the terminal (200A), or the acceleration / deceleration of the terminal (200A), and may generate a sensing signal to control the operation of the terminal (200A). When the terminal (200A) is, for example, a slide-type cellular phone, the sensing unit (740) may sense whether the slide-type cellular phone is open or closed. In addition, the sensing unit (740) may sense the power supply from the power supply unit (790), the coupling of the interface unit (770) to an external device, etc.

[0228] The input / output unit (750) is used to generate, for example, visual, auditory, or tactile input or output. The input / output unit (750) may generate input data to control the operation of the terminal (200A) and may display information processed in the terminal (200A).

[0229] The input / output unit (750) may include a keypad unit (730), a display module (751), a sound output module (752), and a touch screen panel (753). The keypad unit (730) may generate input data in response to an input on the keypad.

[0230] The display module (751) may include a plurality of pixels, and the colors of the plurality of pixels change according to the electrical signals applied thereto. For example, the display module (751) may include at least one of a liquid crystal display, a thin film transistor liquid crystal display, an organic light emitting diode, a flexible display, and a 3D display.

[0231] The sound output module (752) may output audio data received from the wireless communication unit (710) in, for example, a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or may output audio data stored in the memory unit (760).

[0232] The touch screen panel (753) may convert a change in capacitance caused by a user's touch on a specific area of the touch screen into an electrical input signal.

[0233] The memory unit (760) may temporarily store programs for the processing and control of the controller (780) and input / output data (e.g., telephone numbers, messages, audio data, still images, moving images, etc.). For example, the memory unit (760) may store images captured by the camera (721), such as pictures or moving images.

[0234] The interface unit (770) serves as a path for connecting the lens moving unit to an external device connected to the terminal (200A). The interface unit (770) may receive power or data from an external component and may transmit the power or data to each component inside the terminal (200A), or may transmit data inside the terminal (200A) to an external component. For example, the interface unit (770) may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting to a device equipped with an identification module, an audio input / output (I / O) port, a video input / output (I / O) port, a headphone port, etc.

[0235] The controller (780) may control the general operations of the terminal (200A). For example, the controller (780) may perform control and processing related to, for example, voice calls, data communications, and video calls.

[0236] The controller (780) may include a multimedia module (781) for multimedia playback. The multimedia module (781) may be implemented in the controller (780) or may be implemented separately from the controller (780).

[0237] The controller (780) may perform pattern recognition processing that can recognize a writing input or a drawing input performed on the touch screen as a character and an image, respectively.

[0238] The power supply unit (790) can supply the power required to operate each component when receiving external power or internal power under the control of the controller (780).

[0239] The present disclosure may also have the following configurations:

[0240] 1. A camera module, comprising:

[0241] A lens moving unit, which includes a lens;

[0242] A connection plate, which is connected to the lens moving unit; and

[0243] A connector unit, which is connected to the connection plate,

[0244] wherein the connector unit includes:

[0245] A plate, which includes a ground layer formed on its upper surface and a cavity;

[0246] A noise blocking unit, which is disposed in the cavity of the plate to contact the ground layer; and

[0247] A reinforcing member, which is disposed on the noise blocking unit and above the cavity of the plate and on the upper surface of the plate, and

[0248] wherein, when observed in a plan view, the length of one side of the noise blocking unit is less than the length of one side of the cavity in the plate.

[0249] 2. The camera module according to aspect 1, wherein the noise blocking unit includes a first part disposed in the cavity of the plate and a second part disposed on the connection plate, and an end of the first part is disposed in the cavity of the plate.

[0250] 3. The camera module according to aspect 1, wherein the length of the short side of the noise blocking unit is less than the length of the long side of the cavity in the plate.

[0251] 4. The camera module according to aspect 1, wherein the area of the ground layer defines the bottom surface of the cavity in the plate.

[0252] 5. The camera module according to aspect 1, wherein the length of one long side of the cavity in the plate is greater than the length of the other long side of the cavity in the plate.

[0253] 6. The camera module according to aspect 1, further comprising an adhesive disposed between the reinforcing member and the noise blocking unit.

[0254] 7. The camera module according to Solution 1, wherein the cavity in the board includes a first inner surface, and the noise blocking unit includes a first surface facing the first inner surface of the cavity in the board, and the first surface of the noise blocking unit is spaced apart from the first inner surface of the cavity in the board.

[0255] 8. The camera module according to Solution 7, wherein the cavity in the board includes a second inner surface facing the first inner surface and a third inner surface connecting the first inner surface to the second inner surface, and the noise blocking unit includes a second surface facing the second inner surface of the cavity in the board and a third surface facing the third inner surface of the cavity in the board, the second surface of the noise blocking unit is spaced apart from the second inner surface of the cavity in the board, and the third surface of the noise blocking unit is spaced apart from the third inner surface of the cavity in the board.

[0256] 9. The camera module according to Solution 6, wherein a part of the adhesive is disposed in the cavity in the board, and

[0257] wherein the vertical length of the noise blocking unit and the vertical length of the adhesive are less than the vertical length of the cavity, the vertical direction is perpendicular to the optical axis of the lens moving unit and extends from the first outer surface to the second outer surface of the second region of the board, and the first outer surface and the second outer surface of the second region face each other.

[0258] 10. The camera module according to Solution 6, wherein the adhesive includes conductive particles, the conductive particles are in contact with the ground layer through the noise blocking unit, and

[0259] wherein the resistance value between the reinforcing member and the ground layer is less than 1 ohm.

[0260] The features, configurations, effects, etc. described in the above embodiments are included in at least one embodiment, but the present invention is not limited to these embodiments. In addition, the features, configurations, effects, etc. illustrated in each embodiment can be combined with other embodiments or modified by those skilled in the art. Therefore, the content related to these combinations and modifications should be construed as falling within the scope of the present disclosure.

[0261] Industrial Applicability

[0262] The embodiments can be applied to a camera module and an optical device including the camera module, and the camera module and the optical device can improve the performance of blocking EMI noise and can reduce the resistance between the reinforcing member and the ground of the board.

Claims

1. A camera module, comprising: A first circuit board; A lens moving unit disposed on the first circuit board; A second circuit board including a connector; A connection board connecting the first circuit board and the second circuit board; And A noise blocking unit including a first portion disposed on the second circuit board and a second portion disposed on the connection board, Wherein the second circuit board includes a ground layer and a cavity exposing the ground layer, and the first portion is disposed in the cavity and in contact with the ground layer, and Wherein the cavity includes: A first inner surface; A second inner surface opposite the first inner surface; and A third inner surface disposed between the first inner surface and the second inner surface and spaced apart from the noise blocking unit.

2. The camera module according to claim 1, wherein, The cavity includes a fourth inner surface opposite the third inner surface and in contact with the noise blocking unit.

3. The camera module according to claim 1, wherein, When observed in a plan view, the length of one side of the first portion of the noise blocking unit is less than the length of the third inner surface of the cavity of the second circuit board.

4. The camera module according to claim 1, wherein, The first inner surface and the second inner surface of the cavity are spaced apart from the noise blocking unit.

5. The camera module according to claim 4, wherein, The end of the first portion is disposed in the cavity of the second circuit board.

6. The camera module according to claim 1, wherein, The noise blocking unit includes a third portion connecting the first portion and the second portion.

7. The camera module according to claim 1, wherein, The length of the short side of the noise blocking unit is less than the length of the long side of the cavity of the second circuit board.

8. The camera module according to claim 1, wherein, The length of one long side of the cavity of the second circuit board is greater than the length of the other long side of the cavity of the second circuit board.

9. The camera module according to claim 1, further comprising a reinforcing member disposed on the noise blocking unit and above the cavity of the second circuit board.

10. The camera module according to claim 9, further comprising an adhesive disposed between the reinforcing member and the noise blocking unit.

11. The camera module according to claim 10, wherein, The adhesive includes conductive particles that are in contact with the ground layer through the noise blocking unit.

12. The camera module according to claim 9, wherein, The resistance value between the reinforcing member and the ground layer is less than 1 ohm.

13. The camera module according to claim 12, wherein, The reinforcing member is made of conductive metal.

14. The camera module according to claim 11, wherein, The diameter of the conductive particles is greater than the thickness of the noise blocking unit.

15. The camera module according to claim 1, wherein, The connector is disposed on the first surface of the second circuit board, and the cavity is formed in the second surface of the second circuit board, and the second surface is the opposite surface of the first surface.

16. The camera module according to claim 1, wherein The noise blocking unit includes a first surface facing the first inner surface of the cavity of the second circuit board, and Wherein the first surface of the noise blocking unit is spaced apart from the first inner surface of the cavity of the second circuit board.

17. The camera module according to claim 1, wherein, The noise blocking unit includes: A first noise blocking unit disposed below the connection board and the second circuit board; and A second noise blocking unit disposed on the connection board.

18. The camera module according to claim 1, wherein, Each of the first circuit board and the second circuit board includes a first rigid substrate and a first flexible substrate, and the connection board includes a second flexible substrate.

19. A camera module, comprising: A first circuit board; A lens moving unit disposed on the first circuit board; A second circuit board, which includes a ground layer, a connector, and a cavity exposing the ground layer; A connection board, which connects the first circuit board and the second circuit board; And A noise blocking unit, which is disposed on the second circuit board and the connection board, wherein the noise blocking unit includes a first portion disposed in the cavity of the second circuit board and contacting the ground layer, and wherein the cavity includes: An inner surface contacting the noise blocking unit; and Another inner surface spaced apart from the first portion of the noise blocking unit and opposite to the inner surface.

20. An optical device, comprising the camera module according to any one of claims 1 to 19.

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