A prosthesis having different stiffness in multiple composite regions and a method of making the same

Abstract

The present application discloses a prosthesis with different stiffness in multiple composite regions and a manufacturing method thereof. The prosthesis comprises a composite and a base. The composite comprises a porous surface structure and an intermediate body which are connected in advance or integrally formed. The base is used to form a main body of the prosthesis, and at least part of the surface of the base is used as a connecting region. The composite comprises a first composite region corresponding to a first stiffness. The remaining composite regions of the composite except the first composite region comprise at least a second composite region corresponding to a second stiffness. The first stiffness is less than the second stiffness. The first and second composite regions are connected to the base at the connecting region respectively. The present application can tightly adhere and tightly connect the composite and the base, ensure that the artificial implanted prosthesis has excellent bone ingrowth performance, and make the strength of the base not be substantially affected.

Description

[0001] This application is a divisional application

[0002] The original application name: Porous surface structure and substrate connection structure and its preparation method and prosthesis The original application number: 202010922145.2

[0003] The original application date: September 4, 2020 TECHNICAL FIELD

[0004] The present application relates to the connection technology of mechanical structure, in particular to medical devices, and provides a kind of porous surface structure and substrate connection structure and its preparation method and prosthesis, especially in multiple composite area with different rigidity prosthesis and its manufacturing method. BACKGROUND

[0005] Engineering applications often have different requirements for the overall performance and surface performance of mechanical structures. For example, the acetabular cup and femoral stem of the artificial hip joint, the overall performance (such as fatigue strength) of which must meet the anti-fatigue requirements under the dynamic load when the prosthesis is implanted in the body for decades, an average of 1 to 2 million times a year when walking, and the prosthesis surface has specific performance needs to meet the firm combination of the prosthesis surface and the patient's bone tissue to ensure that the prosthesis does not loosen; otherwise the patient will have pain, and the prosthesis must be removed, so that the patient must undergo another revision surgery and implant a new prosthesis. Other orthopedic implants (such as the spine) also have similar situations and needs. In fact, in other fields, there are also cases where the substrate and surface have different performance needs and need to be reliably and effectively connected.

[0006] The artificial material commonly used in joint prostheses is titanium alloy / cobalt-chromium-molybdenum alloy, etc., which cannot form effective biological or chemical combination with bones. The interface between the prosthesis and the bone is generally mainly through physical / mechanical combination. For example, the highly polished prosthesis surface cannot form effective binding force with the bone tissue, so it is necessary to increase the bone conduction, bone induction, and bone regeneration to accelerate or strengthen the combination of the bone tissue and the prosthesis surface, and further improve the performance of bone growth or bone ingrowth. Sometimes titanium wires or titanium beads, etc. can be used to form a porous coating on the surface of the prosthesis (such as the acetabular cup / femoral stem) by sintering or diffusion welding, etc. Alternatively, a thin sheet with a porous structure is pre-prepared by using a metal 3D printing additive manufacturing process, a vapor deposition process, etc., and then the sheet is combined with the solid base of the prosthesis by diffusion welding. These methods provide a porous surface for the prosthesis, and the bone tissue in contact with the prosthesis can regenerate, and the new bone tissue fills in the interconnected porous structure, achieving the effect of "bone ingrowth" into the prosthesis. However, these processes have an unavoidable consequence that the mechanical strength of the base will be greatly reduced, thereby increasing the risk of prosthesis fracture, especially when the prosthesis (such as the femoral stem) is subjected to bending torque or tensile stress, which is prone to fracture. Therefore, how to reliably and firmly combine a porous structure with its base while ensuring that the mechanical properties of the base are not significantly affected becomes a design / technological difficulty.

[0007] Compared with other methods, the laser welding process has a lower impact on the mechanical properties of the base. However, when the porosity of the porous structure is very high (> 50%), the proportion of interconnected struts is low, and the struts are weak; a large number of pores are formed between the struts. Such a high-porosity structure, whether realized by a metal 3D printing additive manufacturing process or by sintering, etc., when directly connecting the porous structure and the base by laser welding, as long as the effective diameter of the laser beam is close to or even larger than the width of the struts, the laser energy may directly break the strut structure and penetrate the porous structure, and it is impossible to effectively weld the struts of the porous structure and the base struts. Alternatively, when using penetration welding to connect the porous structure and the base, the strength of the base structure will be greatly reduced under high temperature and high pressure conditions.

[0008] To avoid the defects of the above laser welding and penetration welding processes, a resistance welding method can be used to connect the porous structure and the substrate by pressing the two welded workpieces between two electrodes and generating contact surface resistance heat through the current flowing through the contact surface and the adjacent area between the two workpieces to form an effective bond between the metal workpiece surfaces. However, for high porosity structures, when the porous structure and the substrate are directly connected by resistance welding, the bonding efficiency is low, resulting in insufficient welding bonding strength or the need for too high a current to achieve sufficient welding strength, which results in too high heat generated by the contact between the upper electrode and the upper surface of the porous structure, causing excessive damage to the surface of the porous structure, including the sinking of the pore structure. The prior art has many problems as described above, which need to be solved. SUMMARY

[0009] The purpose of the present application is to provide a connection structure of a porous surface structure and a substrate and a preparation method and a prosthesis, which can form multiple composite regions with different stiffness; the present application solves the problem that the stiffness of the composite containing the porous surface structure is too high, resulting in insufficient adhesion of the composite to the substrate, affecting the welding effect between the two, and can achieve close bonding of the composite and the substrate, improve the bonding efficiency, welding strength and overall strength of the composite and the substrate.

[0010] Examples of the present application can achieve secure connection of the porous surface structure, the intermediate body and the substrate, and maintain the mechanical properties of the substrate; examples of the present application can ensure the overall strength of the composite and the substrate, and avoid the adhesion of the composite and the substrate from being reduced due to the excessively high stiffness by designing the intermediate body structure with a hollow or special-shaped structure to achieve efficient welding; based on the surface of the porous structure of the present application, the artificial implant prosthesis can have excellent bone ingrowth performance, and the strength of the substrate is not substantially affected.

[0011] To achieve the above purpose, the present application realizes the following technical solutions:

[0012] A connection structure of a porous surface structure and a substrate, comprising: a composite body comprising a porous surface structure and an intermediate body connected in advance or integrally formed; a substrate connected with the intermediate body and / or the porous surface structure to realize the connection of the composite body and the substrate; the composite body comprises a first composite region corresponding to a first stiffness; the remaining composite regions of the composite body except the first composite region comprise at least a second composite region corresponding to a second stiffness; the first stiffness is less than the second stiffness.

[0013] Optionally, the thickness of the composite body at the first composite region is less than the thickness of the composite body at the second composite region.

[0014] Optionally, the connecting structure comprises any one or any combination of a-c: a: the thickness of the porous surface structure at the first composite region is less than the thickness of the porous surface structure at the second composite region; b: the thickness of the intermediate body of the intermediate body at the first composite region is less than the thickness of the intermediate body of the intermediate body at the second composite region; c: the gap between the substrate and the substrate-facing side of the intermediate body of the intermediate body at the first composite region is greater than the gap between the substrate and the substrate-facing side of the intermediate body of the intermediate body at the second composite region; the gap is free of the porous surface structure; wherein the intermediate body of the intermediate body is the portion between the porous surface structure and the substrate.

[0015] Optionally, the thickness of the intermediate body of the intermediate body at the first composite region is 0; the first composite region is free of the intermediate body of the intermediate body, forming a hollow structure.

[0016] Optionally, the gap between the substrate and the substrate-facing side of the intermediate body of the intermediate body at the first composite region forms a pocket structure between the intermediate body and the substrate.

[0017] Optionally, the substrate is connected to the intermediate body and / or the porous surface structure by laser welding and / or resistance welding.

[0018] Optionally, the substrate, the porous surface structure, and the intermediate body are made of conductive material.

[0019] Optionally, the porous surface structure in the composite is referred to as a first porous structure; the intermediate body is a solid structure, or the intermediate body is a second porous structure and the density of at least a portion of the second porous structure is higher than the density of the first porous structure.

[0020] Optionally, the intermediate body further comprises: an insertion portion located within the porous surface structure, and / or a protruding structure formed on the side of the composite close to the substrate; the density of one or more of the intermediate body, the insertion portion, and the protruding structure is higher than the density of the porous surface structure.

[0021] Optionally, the insertion portion comprises a support column.

[0022] Optionally, the intermediate body comprises an intermediate plate structure, and a plurality of protruding structures are arranged on the intermediate plate structure, the protruding structures are arranged on the side of the intermediate plate structure close to the substrate, and the protruding structures are in contact with and fixedly connected to the substrate.

[0023] Optionally, the intermediate body is the second porous structure, and the second porous structure comprises a plurality of protruding structures formed on the second porous structure near the side of the substrate, and the protruding structures are in contact with the substrate.

[0024] Optionally, the first composite region comprises a plurality of dispersed composite regions, and each of the dispersed composite regions is located between a plurality of adjacent protruding structures or a plurality of adjacent insertion portions.

[0025] Optionally, all or at least part of the insertion portion is located in the porous surface structure, and the insertion portion is arranged in correspondence with and in contact with the protruding structure, or the insertion portion is distributed in a staggered manner and is not in direct contact with the protruding structure.

[0026] Optionally, the surface of the insertion portion away from the substrate is higher than the surface of the porous surface structure, or the surface of the insertion portion away from the substrate is lower than the surface of the porous surface structure, or the surface of the insertion portion away from the substrate is flush with the surface of the porous surface structure.

[0027] Optionally, the protruding structure is located on the intermediate body near the contact position of the porous surface structure and the intermediate body.

[0028] Optionally, the substrate is a solid structure, or the substrate is a third porous structure and the porosity of the third porous structure is less than the porosity of the porous surface structure.

[0029] Optionally, the porous surface structure, the intermediate body, and the insertion portion are integrally formed.

[0030] Optionally, the first composite region of the composite body is machined.

[0031] Optionally, the substrate comprises a surface connecting layer, and the surface connecting layer is pre-connected or integrally formed with the substrate body, and the surface connecting layer is located between the intermediate body of the composite body and the substrate body, or the surface connecting layer is located between the porous surface structure of the composite body and the substrate body; the surface connecting layer comprises a substrate protruding structure, and the protruding structure of the surface connecting layer is in contact with and fixedly connected to the intermediate body and / or the porous surface structure of the composite body; or the side surface of the substrate near the composite body is provided with a substrate protruding structure, and the substrate protruding structure protrudes towards the composite body, and the protruding structure of the substrate protruding structure is in contact with and fixedly connected to the intermediate body and / or the porous surface structure of the composite body.

[0032] Optionally, the surface connecting layer of the substrate is pre-welded to the substrate body.

[0033] Optionally, the side of the intermediate body body close to the substrate is planar, or the protruding structure arranged on the side of the intermediate body body close to the substrate is staggered with the substrate protruding structure of the surface connecting layer; the intermediate body body is the part between the porous surface structure and the substrate.

[0034] The application provides a method for preparing the connecting structure of any one of the porous surface structure and the substrate, which comprises the following processes:

[0035] The porous surface structure and the intermediate body are pre-connected or integrally formed to form a composite;

[0036] The intermediate body and / or the porous surface structure are contacted with the substrate;

[0037] The first polarity electrode is in conductive contact with the porous surface structure and / or the intermediate body in the composite; the substrate is in conductive contact with the second polarity electrode to form a current loop;

[0038] The composite comprises a first composite area corresponding to a first stiffness, and the remaining composite area in the composite except the first composite area at least comprises a second composite area corresponding to a second stiffness; the first stiffness is smaller than the second stiffness;

[0039] The first composite area and the second composite area of the composite are respectively resistance-welded with the substrate to realize the connection of the composite and the substrate.

[0040] Optionally, when the resistance welding is projection welding type resistance welding, the first polarity electrode is a continuous planar electrode or a plurality of segmented electrode monomers, and the second polarity electrode is a continuous planar electrode or a plurality of segmented electrode monomers; when the resistance welding is spot welding type resistance welding, the first polarity electrode and / or the second polarity electrode is a plurality of segmented electrode monomers.

[0041] Optionally, when the spot welding type resistance welding is used, any one or more of the following components is moved: the first polarity electrode, the second polarity electrode, and the intermediate body and substrate combination on which welding has been completed at at least one contact position, so as to move from the current welding position to the next welding position.

[0042] Optionally, when the first polarity electrode is divided into a plurality of electrode monomers, the electrode monomers are inserted into the prefabricated gap in the porous surface structure, and the electrode monomers are close to the intermediate body, so that the inserted electrode monomers are in conductive contact with the intermediate body or so that the inserted electrode monomers are in conductive contact with the intermediate body through the porous surface structure.

[0043] Optionally, the electrode monomer penetrates through the surface of the porous surface structure until reaching the surface of the intermediate body or the interior of the intermediate body, so that the electrode monomer after insertion is in conductive contact with the intermediate body.

[0044] Optionally, the electrode monomer and the porous surface structure are in lateral gap fit, so that the electrode monomer and the porous surface structure are completely not in contact.

[0045] Optionally, the plurality of electrode monomers are connected in parallel to another planar electrode, and the other planar electrode is connected to a power terminal, or the plurality of electrode monomers are connected in parallel and directly to a power terminal.

[0046] Optionally, the first polarity electrode is a flexible electrode, and under the action of pressure, the flexible electrode is deformed to match the surface of the porous surface structure, thereby increasing the contact area between the flexible electrode and the surface of the porous surface structure.

[0047] Optionally, the first polarity electrode and the second polarity electrode are made of conductive material; the substrate is made of conductive material, the porous surface structure is made of conductive material, and the intermediate body contains conductive material.

[0048] Optionally, when the surface of the insertion portion on the side away from the substrate exceeds the surface of the porous surface structure, the portion of the insertion portion that exceeds the porous surface structure is cut after the resistance welding is completed.

[0049] Optionally, when the surface of the insertion portion on the side away from the substrate exceeds the surface of the porous surface structure: the insertion portion is a multi-segment structure, at least including a first segment portion that exceeds the porous surface structure and a remaining second segment portion; the first segment portion is a porous structure; the second segment portion is a porous structure or a solid structure, and the surface of the second segment portion on the side away from the substrate is flush with the surface of the porous surface structure, so that the first segment portion sinks to the surface of the second segment portion on the side away from the substrate due to heat generated by contact with the first polarity electrode.

[0050] Optionally, at least part of the pores in the porous surface structure are filled with conductive material. Optionally, at least part of the pores in the porous surface structure are filled with powder-shaped conductive material, wire-shaped conductive material, or mesh-shaped conductive material.

[0051] Optionally, a solid thin film deformable conductive medium is laid on at least part of the surface of the porous surface structure, the deformable conductive medium is between the first polarity electrode and the porous surface structure; and / or, a conductive medium is sprayed between the surface of at least part of the porous surface structure and the first polarity electrode.

[0052] Optionally, a molten conductive medium is injected into at least part of the pores of the porous surface structure, and / or, a conductive medium is placed into at least part of the pores of the porous surface structure and is made molten by high temperature; the melting point of the conductive medium is lower than the melting point of the substrate and / or the melting point of the porous surface structure.

[0053] Optionally, the substrate is made by forging or casting or machining or powder metallurgy or metal injection molding process. Optionally, the porous surface structure and the intermediate of the composite are made by 3D printing additive manufacturing process or vapor deposition process.

[0054] Optionally, the first polarity electrode is in conductive contact with at least part of the side surface of the composite.

[0055] Optionally, the first polarity electrode is in conductive contact with one or more of the side surface of the porous surface structure, the side surface of the inserted part of the intermediate, the side surface of the main body of the intermediate.

[0056] Optionally, the intermediate comprises a plurality of inserted parts, all or at least part of the inserted parts are located in the porous surface structure, the inserted parts are in conductive connection with the accessory structure, and the accessory structure is in conductive connection with the porous surface structure, the accessory structure is located in the porous surface structure, or between the porous surface structure and the intermediate, or between the porous surface structure and the substrate.

[0057] Optionally, the accessory structure is a solid structure or a fourth porous structure of a good conductor.

[0058] Optionally, the density of the fourth porous structure is lower than the density of the inserted part.

[0059] Optionally, the main body of the intermediate is the part between the porous surface structure and the substrate, the accessory structure is connected to the main body of the intermediate, or the accessory structure is not connected to the main body of the intermediate.

[0060] Optionally, each accessory structure in conductive connection with the plurality of inserted parts of the intermediate is the same or different. Optionally, the accessory structure in conductive connection with any inserted part is a character, or the plurality of accessory structures in conductive connection with any inserted part forms a cross.

[0061] Optionally, the substrate and the composite are arranged between a first polarity electrode and a second polarity electrode, the first polarity electrode is in electrically conductive contact with the porous surface structure and / or the intermediate body, and the substrate is in electrically conductive contact with the second polarity electrode, forming a current loop, so that the intermediate body and the substrate are resistance-welded to achieve the connection between the composite and the substrate; one or more insertion portions are in electrically conductive connection with the corresponding accessory structure, so that the current of the current loop is increased.

[0062] Optionally, the substrate, the porous surface structure, the intermediate body, and the accessory structure are made of electrically conductive materials.

[0063] Optionally, the porous surface structure, the intermediate body, the insertion portion, and the accessory structure are integrally formed.

[0064] The present application also provides a connection structure of a porous surface structure and a substrate, comprising a plurality of composites in any one of the connection structures described above, and the plurality of composites are respectively connected to different parts of the substrate.

[0065] Optionally, the plurality of composites comprises at least a first composite and a second composite, the intermediate body in the first composite is in contact with and fixedly connected to a part of the substrate, the intermediate body in the second composite is in contact with and fixedly connected to another part of the substrate, to achieve the connection between the composite and the substrate; the part of the substrate and the other part of the substrate are respectively located on opposite sides of the substrate.

[0066] Optionally, the first composite and the second composite have the same structure; or, the first composite and the second composite have different structures.

[0067] The present application provides a prosthesis, which is provided with a connection structure described in any one of the above, and the connection structure comprises:

[0068] a composite, comprising a porous surface structure and an intermediate body which are pre-connected or integrally formed; the composite comprises a first composite region corresponding to a first stiffness; the remaining composite region of the composite except the first composite region comprises at least a second composite region corresponding to a second stiffness; the first stiffness is smaller than the second stiffness;

[0069] a substrate for forming a prosthesis body, at least part of a surface of the prosthesis body serving as a connection region for connecting with the composite, the intermediate body and / or the porous surface structure being connected to the connection region of the prosthesis body, so that the porous surface structure is located at the connection region of the prosthesis body.

[0070] Optionally, the prosthesis is a joint prosthesis.

[0071] Optionally, the composite forms a shell that covers the connecting region of the prosthesis body; the outer layer of the shell comprises the porous surface structure; the inner layer of the shell comprises the intermediate body that is connected to the connecting region of the prosthesis body.

[0072] Optionally, the shell formed by the composite is a whole; or the shell formed by the composite comprises a plurality of shell pieces; wherein the plurality of shell pieces are independent of each other, or adjacent shell pieces are connected at at least one side of the adjacent edges.

[0073] Optionally, the prosthesis comprises a femoral stem of a hip joint, the femoral stem comprises a stem body that forms a base; the connecting region is located on the surface of the upper part of the stem body.

[0074] Optionally, the surface of the lower part of the stem body is a smooth surface, a plurality of longitudinal grooves are formed on the lower part of the stem body, and the lower part of the stem body is inserted into the medullary cavity of the femur.

[0075] Optionally, the composite forms a shell that covers the connecting region of the stem body; the composite comprises a plurality of shell pieces.

[0076] Optionally, the prosthesis comprises an acetabular cup of a hip joint, the acetabular cup comprises an inner cup body that forms a base; the connecting region is located on the outer peripheral surface of the acetabular cup.

[0077] Optionally, the prosthesis comprises a tibial platform, the tibial platform comprises a tibial tray that forms a base; the connecting region is located on the surface of the distal end of the tibial tray.

[0078] Optionally, the prosthesis comprises a femoral condyle, the femoral condyle comprises a condylar fixation surface that forms a base; the connecting region is located on the condylar fixation surface.

[0079] Optionally, the prosthesis is any one or more of the following: patella, spinal fusion cage, intervertebral facet joint of the spine, ankle joint, shoulder joint, elbow joint, finger joint, toe joint, artificial intervertebral disc, mandibular joint, wrist joint.

[0080] Compared with the prior art, the present application has the following beneficial effects:

[0081] (1) The example of the present application provides a method for preparing a connecting structure of a porous surface structure and a substrate, a composite including a porous surface structure and an intermediate body (for example, a low-porosity porous structure or a solid plate) with higher density relative to the porous surface structure is manufactured by 3D printing or other processes, and the example of the present application effectively combines the composite and the substrate by resistance welding (for example, projection resistance welding or spot resistance welding, etc.), which can avoid the situation that the laser energy directly breaks the support structure in the laser welding method, so that the support of the porous structure and the support of the substrate cannot be welded and connected; in addition, the projection resistance welding method uses contact resistance to generate a local heat source to achieve welding, which greatly reduces or avoids the problem that the mechanical properties of the substrate are greatly reduced due to the hot pressing process (such as the infiltration welding process); the present application can also use projection resistance welding and spot resistance welding in combination to strengthen the welding strength between the intermediate body and the substrate and reduce the surface damage of the porous surface structure.

[0082] (2) The example of the present application manufactures a solid (high-density) substrate by forging, casting or machining processes, or the substrate can be a porous structure, but the density of the porous surface structure is lower than that of the substrate; the density of the intermediate body of the example can be between the porous surface structure and the substrate.

[0083] (3) The example of the present application provides a solid structure or a high-density support column (with a higher density than the porous surface structure) in the porous surface structure, which ensures that the height of the surface of the porous surface structure after resistance welding can reach a preset height, and avoids excessive compression of the porous surface structure; when the support column is a good conductive material, most of the current output by the electrode is preferentially passed through the support column to the substrate, which can not only ensure the welding strength between the intermediate body and the substrate, but also reduce the damage to the surface of the porous surface structure. The example of the present application combines the support column with the projection structure below it, and the projection structure can be in direct contact with the substrate, which can also meet the requirements of the welding strength between the intermediate body and the substrate and reduce the damage to the surface of the porous surface structure.

[0084] (4) The example of the present application reduces the thickness of the corresponding composite area of the composite formed by the porous surface structure and the intermediate body (for example, the intermediate body of the composite uses a non-porous bottom plate with a hollow design), so that the stiffness value of the composite area is smaller, which can not only ensure the strength of the entire connecting structure, but also enable the projection structure used for welding and the substrate to be in close contact, so as to improve the welding efficiency between the non-porous bottom plate and the substrate; the example of the present application can also reserve a certain gap between the non-porous bottom plate and the substrate to form a pocket structure, which is beneficial to expand the use of the connecting structure.

[0085] (5) The example of the present application improves the problem of uneven welding caused by uneven substrate thickness by controlling the size of each support column and / or protruding structure on the intermediate body to be different; and also by providing an electrically conductive auxiliary structure on each support column of the intermediate body, so that most of the current flowing out of the electrode is preferentially passed through the well-conductive support column with the auxiliary structure, greatly reducing the surface damage caused by the resistance heat of the porous surface structure, and enhancing the current conduction effect to ensure sufficient welding strength, without causing unnecessary indentation or excessive rigidity caused by increasing the number or diameter of the support columns; the structure, number and size of the corresponding auxiliary structure on each support column can be designed according to the specific circumstances of each support column, to ensure the uniformity of the welding strength between each support column and the substrate and the rationality of the welding strength.

[0086] (6) The processing operation of the present application is simplified, the manufacturing cost is reduced, and time is saved.

[0087] (7) The present application uses the connection structure and method of the porous surface structure and the substrate to manufacture various artificial implantable prostheses, especially orthopedic prostheses, such as femoral stem, acetabular cup, tibial plateau, femoral condyle, etc., so that the prosthesis body is easy to process and has high strength, and the performance of bone ingrowth is optimized through the effective combination of the porous surface structure, and the cross-section of the prosthesis (such as femoral stem) can be minimized. BRIEF DESCRIPTION OF DRAWINGS

[0088] Figure 1 The connection structure of the porous surface structure and the substrate of Example One of the present application is shown in the figure;

[0089] Figure 2 The connection structure of the porous surface structure and the substrate of Example Two of the present application is shown in the figure (the lower surface of the low porosity area has protrusions);

[0090] Figure 3 The connection structure of the porous surface structure and the substrate of Example Four of the present application is shown in the figure;

[0091] Figure 4 The partial connection structure of the porous surface structure and the non-porous bottom plate of Example Five of the present application is shown in the figure;

[0092] Figure 5 The connection structure of the porous surface structure and the substrate of Example Six of the present application is shown in the figure;

[0093] Figure 6 The connection structure of the porous surface structure and the substrate of Example Nine of the present application is shown in the figure;

[0094] Figures 7-8 The connection structure of the porous surface structure and the substrate of Example Ten of the present application is shown in the figure;

[0095] Figure 9Schematic view of the connection structure of the porous surface structure and the substrate of Example 11;

[0096] Figures 10-12 Schematic view of the connection structure of the porous surface structure and the substrate of Example 12;

[0097] Figure 13 Schematic view of the connection structure of the porous surface structure and the substrate of Example 13;

[0098] Figures 14-15 Schematic view of the principle of a related variation of the connection structure of Example 14;

[0099] Figure 16 Schematic view of the connection structure of the porous surface structure and the substrate of Example 15;

[0100] Figures 17-18 Schematic view of the connection structure of the porous surface structure and the substrate of Example 16;

[0101] Figure 19 Schematic view of the connection structure of the porous surface structure and the substrate of Example 18;

[0102] Figure 20 Schematic view of the connection structure of the porous surface structure and the substrate of Example 19;

[0103] Figure 21 Schematic view of the connection structure of the porous surface structure and the substrate of Example 21;

[0104] Figures 22-24 Schematic view of the structure of the non-porous bottom plate of Example 21;

[0105] Figures 25-26 Schematic view of the simple complete and incomplete hollow structure of Example 21, respectively;

[0106] Figure 27 Schematic view of the structure of the non-porous bottom plate of the pocket structure of Example 21;

[0107] Figure 28 Schematic view of the structure of the support column with an accessory structure of Example 22;

[0108] Figure 29 Schematic view of the principle of a related variation of the connection structure of Example 24;

[0109] Figure 30 Schematic view of the principle of another variation of the connection structure of Example 24;

[0110] Figure 31 Schematic view of the femoral condyle of an artificial prosthesis of Example 28;

[0111] Figure 32 schematic view of a femoral stem of an artificial prosthesis of example twenty-five;

[0112] Figure 33 schematic view of a cross-section of a hip cup of an artificial prosthesis of the present invention; Figure 32

[0113] Figure 34 schematic view of a cross-section of a partial tibial platform of an artificial prosthesis of example twenty-seven.

[0114] Figure 35 schematic view of a cross-section of a partial tibial platform of an artificial prosthesis of example twenty-seven. DETAILED DESCRIPTION

[0115] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0116] Embodiment one:

[0117] As shown in Figure 1 , the present application provides a connecting structure, comprising a substrate 23, an intermediate body, and a porous surface structure 21. The porous structure of the porous surface structure 21 comprises a plurality of crisscrossed supports (or beams), and some multidirectional through holes with regular or irregular shapes are formed between the supports (or beams).

[0118] Optionally, the intermediate body is a non-porous bottom plate 22, i.e., a solid bottom plate, which is located between the porous surface structure 21 and the substrate 23. The porous surface structure 21 and the intermediate body are both made of conductive materials (such as metal materials). The porous surface structure 21 and the intermediate body are integrally formed, for example, by a 3D printing additive manufacturing process or a vapor deposition process. For example, the substrate 23 is solid, which is conducive to the overall strength of the connecting structure. The substrate 23 can be made of conductive materials (such as metal materials) and formed by various methods such as forging and casting, and various mechanical processing can be performed on it.

[0119] In this embodiment, the porous surface structure 21 and the intermediate body are pre-connected to form a composite body 2A, and the intermediate body (non-porous bottom plate 22) and the substrate 23 are effectively combined by resistance welding, so that the composite body 2A and the substrate 23 are connected. The resistance welding includes spot welding and / or projection welding, etc. The following embodiments will be described by way of example of projection welding.​

[0120] Specifically, at least a portion of the top of the porous surface structure 21 is in contact with the positive electrode 24. The porous surface structure 21 is pre-connected with the non-porous base plate 22, i.e. at least a portion of the bottom of the porous surface structure 21 is in contact with the top of the non-porous base plate 22. The bottom of the non-porous base plate 22 is pre-fabricated with a plurality of protruding structures 221 (protruding towards the side of the substrate 23), which are in contact with (there is a contact resistance) the top of the substrate 23; the bottom of the substrate 23 is in contact with the negative electrode 25. Preferably, the plurality of protruding structures 221 are fabricated at positions corresponding to the positions where the bottom of the porous surface structure 21 is in contact with the top of the non-porous base plate 22 and the adjacent areas thereof. Among them, Figure 1 The positive direction of the X-axis shown in the middle of the embodiment represents right, the negative direction of the X-axis represents left, the positive direction of the Y-axis represents top, and the negative direction of the Y-axis represents bottom. The orientation of the subsequent embodiments is the same as that of this embodiment, which is used to more clearly describe the technical solutions of the present application. The above orientation is only used for representation and does not affect the orientation in actual application.

[0121] The composite 2A formed by the porous surface structure 21 and the intermediate body, and the substrate 23 are compressed between the positive electrode 24 and the negative electrode 25. When an electric current is passed, the electric current flows through the porous surface structure 21, the non-porous base plate 22, and reaches the contact surface and the adjacent area of the top of the protruding structure 221 and the substrate 23, and a resistance heat is generated due to the contact resistance, which heats the top of the protruding structure 221 and the substrate 23 to a molten or plastic state, so that the protruding structure 221 and the top of the substrate 23 form a metal bond, and finally realize the solid connection between the intermediate body and the substrate 23, so that the composite 2A formed by the porous surface structure 21 and the intermediate body is tightly combined with the substrate 23.

[0122] Among them, the contact resistance refers to the resistance generated by the current when two independent workpieces are in contact, and the resistance heat Q is proportional to IR 2 , R is the contact resistance, and I is the current passing through the workpiece, i.e. the greater the current, the greater the contact resistance, and the greater the value of the resistance heat, and vice versa, the smaller the value of the resistance heat.

[0123] Based on the above, the non-porous base plate 22 of the present example increases the contact resistance between the protruding structure (such as the bump) and the substrate 23, generates sufficient resistance heat, and then the protruding structure 221 and the substrate 23 have sufficient welding strength (the contact points of the two form welding points). For example, the substrate 23 and the intermediate body are made of materials with the same melting point or similar melting points, and the present application does not limit the materials of the substrate 23 and the intermediate body; preferably made of titanium alloy or cobalt-chromium-molybdenum alloy.

[0124] Optionally, the shape of the protruding structure 221 of the intermediate body can be spherical, arcuate, annular, strip-shaped, or the like. The present embodiment does not make a specific limitation on this, nor does it make a limitation in other examples. The intermediate body can have various protrusions or textures to reduce the contact area and increase the contact resistance, so as to correspondingly increase the bonding efficiency between the intermediate body and the base and improve the welding strength between the intermediate body and the base. The protruding structure in the present embodiment can be a solid body, and can also be a high-density porous structure (for example, higher in density than the porous surface structure). This expansion mode is also applicable to subsequent embodiments, and the present application does not make a redundant description on this. The protruding structure and the main body of the intermediate body can be separately provided or simultaneously provided. The main body and the protruding structure of the intermediate body are separately provided and combined together in advance. If the main body and the protruding structure of the intermediate body are simultaneously provided, the protruding structure can be formed on the bottom surface of the main body of the intermediate body and face the porous surface structure.

[0125] For example, the positive electrode 24 and the negative electrode 25 are made of a conductive material (such as a metal material). The top of the negative electrode 25 is in close contact with the bottom of the base 23, and the bottom of the positive electrode 24 is in close contact with the top of the porous surface structure 21. The contact surface in contact with each other can be a plane, an arc surface, or a curved surface, and the present application does not make a specific limitation on the shape and size of the contact surface. The shape and size of the contact surface can be designed according to the actual application. The polarity of the positive electrode 24 and the negative electrode 25 in the present embodiment can also be interchanged. This expansion mode is also applicable to subsequent embodiments, and the present application does not make a redundant description on this.

[0126] Therefore, by adding the intermediate body described above between the porous surface structure and the base, and using the resistance welding method (for example, the projection welding type) to weld and combine the composite of the intermediate body and the porous surface structure and the base, a high bonding efficiency (for example, 70% to 80%) can be ensured when the porosity of the porous structure is very high (> 50%).

[0127] Embodiment Two

[0128] Unlike the intermediate body in Embodiment One which is a solid plate (non-porous bottom plate), the intermediate body in Embodiment Two is a low-porosity porous structure. The connecting structure in the present embodiment Two includes a first porous structure 41 of a high-porosity region, a second porous structure 42 (as an intermediate body) of a low-porosity region, and a base 43. For reference, see Figure 2 、 Figure 16 The second porous structure 42 is located between the first porous structure 41 and the base 23.

[0129] For example, the porous structure of the first porous structure 41 and the second porous structure 42 both comprise a plurality of crisscrossed supports (or beams) between which a plurality of multidirectional through holes of regular or irregular shape are formed. The porosity of the first porous structure 41 is denoted as a%, and the porosity of the second porous structure 42 is denoted as b%, where a%>b%. When the value of b% is equal to 0, the second porous structure 42 herein is equivalent to the intermediate body of the solid structure described in Embodiment 1. Therefore, compared with the first porous structure 41 constituting the porous surface structure, the second porous structure 42 has a higher density, which is manifested as thicker supports (beams) and / or lower porosity in the second porous structure 42.

[0130] In this embodiment, the first porous structure 41 and the second porous structure 42 are both made of conductive material (such as metal material). The first porous structure 41 and the second porous structure 42 are integrally formed structures, which are realized by, for example, 3D printing additive manufacturing process, or vapor deposition process, etc.

[0131] The first porous structure 41 and the second porous structure 42 form a composite, and the second porous structure 42 and the substrate 43 are effectively combined by resistance welding (for example, projection welding resistance welding), that is, at least a portion of the top of the first porous structure 41 is in contact with and tightly attached to the positive electrode 44, and the bottom of the substrate 43 is in contact with and tightly attached to the negative electrode 45; at least a portion of the supports (or beams) of the bottom of the second porous structure 42 is in contact with the top of the substrate 43 (the contact position can be seen in FIG. 2B). The positive electrode is in a form different from that of this embodiment, which will be described in detail below), and the contact resistance generates resistance heat, which heats the contact parts of the two to a molten or plastic state, so that the second porous structure 42 and the top of the substrate 43 form a metal combination, and the composite and the substrate 43 are connected. Figure 16

[0132] Embodiment 2 replaces the intermediate body of the solid structure described in Embodiment 1 with the second porous structure 42 of low porosity area. The intermediate body of Embodiment 2 is a porous structure, but due to its low porosity and within a certain range of values, it can ensure that the second porous structure 42 and the substrate 43 maintain a certain contact area, thereby ensuring a certain combination efficiency; the final combination efficiency is also related to the specific arrangement of the crisscrossed supports (or beams) inside the porous structure, which can be designed according to the actual application.

[0133] The lower surface of the second porous structure 42 described above can also have a projection 421, as shown in FIG. 2B. Figure 2 ​As shown. When current is applied, the current flows through the first porous structure 41 and the second porous structure 42, and the contact between the protrusions 421 of the second porous structure 42 and the top of the substrate 43 generates resistance heat, thereby forming a metal bond between the bottom of the second porous structure 42 and the top of the substrate 23, so that the composite 4A formed by the first porous structure 41 and the second porous structure 42 is tightly bonded to the substrate 43.

[0134] Embodiment three:

[0135] Based on the above embodiment one, the intermediate of this embodiment not only includes a non-porous bottom plate (or a low-porosity porous structure), but also includes an insertion part, wherein the non-porous bottom plate is arranged between the porous surface structure and the substrate; the bottom surface of the non-porous bottom plate is pre-manufactured with a plurality of protrusions, which are in contact with the top of the substrate. Optionally, the insertion part includes a plurality of support columns arranged on the surface of the non-porous bottom plate near the side close to the porous surface structure; the support columns are between the non-porous bottom plate and the positive electrode. The top of the negative electrode is tightly attached to the bottom of the substrate.

[0136] For example, the support columns are located inside the porous surface structure, and the top ends of the support columns are substantially flush with the top ends of the porous surface structure. The height of the support columns is substantially equal to the height of the porous surface structure. Here, the height direction is not necessarily the orientation in actual application, and the subsequent related embodiments are consistent with this.

[0137] For example, each support column is directly opposite to each protrusion thereunder, so that the area covered by the support column at least partially overlaps with the contact part between the protrusion and the substrate, and the size of the support column matches the protrusion.

[0138] Although the surface of the porous surface structure still has partial contact with the positive electrode thereon in this example, since the support columns are solid structures with good electrical conductivity, and the porous surface structure has pores, most of the current flowing out of the electrode preferentially passes through the support columns, greatly reducing the surface damage of the porous surface structure due to resistance heat. It also enhances the current conduction effect, increases the welding bonding efficiency between the non-porous bottom plate and the substrate, and ensures sufficient welding strength.

[0139] The structure of the insertion part of this embodiment is not limited to the above support columns, and any structure that can achieve the corresponding technical effects of this embodiment is within the protection scope of the present application; and the support columns in this embodiment are not limited to solid bodies, but can also be high-density porous structures (for example, higher density than the porous surface structure). This expansion is also applicable to subsequent embodiments, and the present application does not repeat it. The non-porous bottom plate, the porous surface structure, and the support columns are integrally formed structures, which are realized by, for example, 3D printing additive manufacturing process, or vapor deposition process, etc.

[0140] Embodiment Four

[0141] As a variation of Embodiment Three, in order to completely avoid the contact between the porous surface structure and the positive electrode above it to generate resistance heat and cause damage to the surface of the porous surface structure, as shown in Figure 3 Embodiment Four, the top end of all the support columns 816b is higher than the top surface of the porous surface structure, and the height of each support column 816b is higher than the height of the corresponding adjacent part of the porous surface structure, so that the positive electrode will first contact the support column 816b at a higher position, thereby avoiding the contact between the positive electrode and the porous surface structure 811 at a lower position.

[0142] In order to ensure the basic function of the entire connecting structure, after welding is completed, the part of the support column 816b that is higher than the porous surface structure 811 can be removed through machining or other processes to ensure the flatness of the surface. The positive electrode can not only be a continuous large-area positive electrode (see also the positive electrode 1114 in Figure 10 ), but also can be a segmented positive electrode monomer 814b Figure 3 ), each segmented positive electrode monomer 814b is pressed against the top end of the corresponding support column 816b, and the positive electrode monomer 814b can be connected in parallel to a large-area electrode or directly connected to the positive terminal of the power supply.

[0143] Embodiment Five

[0144] Based on Embodiments Three and Four above, Embodiment Five further expands: the top end of each support column is lower than the top surface of the corresponding part of the porous surface structure, and the height of the support column is lower than the height of the porous surface structure, and the support column is hidden inside the porous surface structure, i.e., the support column is above the porous structure (see also Figure 21 ). In this way, the positive electrode will contact the upper surface of the porous surface structure below it, and the top surface of the porous surface structure will sink slightly due to the contact resistance heat, until it sinks to the top end position of the support column (the maximum sinking degree can only sink to the top end position of the support column, and when the sinking degree is not large, the sinking position is higher than the top end position of the support column), because the support column is a solid structure, the support column functions as a limit to ensure that the height of the final surface of the porous surface structure reaches the height position of the support column, thereby avoiding excessive compression of the porous surface structure. Alternatively, the structure above the support column can also be a recessed structure, so that the top end of the support column is lower than the top surface of the corresponding part of the porous surface structure, and the support column also functions as a limit. The principles of the support column functioning as a limit in the following embodiments are consistent with this, and will not be repeated here.

[0145] In this embodiment, the top surface of the porous surface structure is in contact with the positive electrode above it, but the porous surface structure 811 has pores, so most of the current selectively flows through the support pillars 816c (solid structure of good conductor) to reach the protruding structure and the base 813, ensuring the welding strength and reducing the damage to the surface of the porous surface structure to some extent. Although it still causes some damage to the surface of the porous surface structure, the top end of the support pillar is always lower than the surface of the porous surface structure, which ultimately does not affect the basic function of the connecting structure in the corresponding field.

[0146] In another example (not shown), a certain height position is selected on the support pillar that is originally higher than the surface of the porous surface structure, and the position above it is designed as a pore structure. At this time, the positive electrode first contacts the top pore structure of the higher position, and the top pore structure of the support pillar is pressed and slightly sinks due to the heat generated by the contact resistance, until the above-mentioned set position of the support pillar, so that the support pillar is basically flush with the porous structure next to it (the maximum sinking degree can only sink to the set position, and when the sinking degree is not large, the sinking position is higher than the set position). In this case, the contact between the porous surface structure and the positive electrode above it can completely avoid the generation of resistance heat and the resulting damage to the surface of the porous surface structure, and there is no need for additional processing to remove the excess part of the support pillar above the porous surface structure.

[0147] Figure 4 In the example, a plurality of support pillars are arranged in the porous surface structure, and the top end of each support pillar is lower than the top surface of the corresponding part of the porous surface structure, and the support pillars are hidden inside the porous surface structure 811. For example, based on the aforementioned one-piece forming process, part or all of the non-porous bottom plate 812 can be formed inside the porous surface structure 811; most of the porous surface structure 811 is located above the non-porous bottom plate 812, and a small part of the porous surface structure 811 is located below the non-porous bottom plate 812. The design principle of part or all of the non-porous bottom plate in this example formed inside the porous surface structure is not limited to Figure 4 , but also applicable to embodiments in which the composite has a non-porous bottom plate and a porous surface structure, which will not be described here.

[0148] Embodiment six:

[0149] The main difference from embodiment three is that, as Figure 5As shown, the bottom surface of the non-porous substrate 912a between the porous surface structure 911 and the base 913 in this embodiment six is not provided with the protruding structure (such as bumps) described above, and a plurality of good conductive support columns 916a are provided on the non-porous substrate 912a near the side surface of the porous surface structure. The support columns 916a are between the non-porous substrate 912a and the positive electrode 914. The top of the negative electrode 915 is in close contact with the bottom of the base 913. The bottom surface of the non-porous substrate 912a is almost in plane contact with the base 813.

[0150] For example, the support columns 916a are located inside the porous surface structure 911, and the height of the support columns 916a is substantially the same as the top surface of the porous surface structure. The height of the support columns 916a is substantially equal to the height of the porous surface structure. Although the surface of the porous surface structure still has partial contact with the positive electrode 914 above it, most of the current flowing out of the electrode will preferentially pass through the good conductive solid structure of the support columns 916a and pass through the non-porous substrate 912a to the base 913 due to the presence of pores in the porous surface structure 911. Even though the bottom end of the non-porous substrate 912a is not provided with a protruding structure, the embodiment six has provided a plurality of good conductive support columns 916a, which still have sufficient current and resistance heat to make the non-porous substrate 912a and the base 913 have sufficient welding strength, and can also reduce the damage to the surface of the porous surface structure to a certain extent.

[0151] Embodiment seven:

[0152] In addition to the features of the non-porous substrate (or low-porosity porous structure) without protruding structures in embodiment six, as a variation of embodiment six, in order to completely avoid the surface damage of the porous surface structure caused by contact resistance heat generation, the top end of all the support columns in this embodiment seven is higher than the top surface of the porous surface structure, and the height of each support column is higher than the corresponding adjacent part of the porous surface structure. In this example, the positive electrode will first contact the support columns disposed at a higher position, thereby avoiding contact between the positive electrode and the porous surface structure at a lower position. In addition, due to the height of the support columns exceeding the porous surface structure, in order to ensure the basic function of the overall connection structure, after the welding is completed, the part of the support columns that is higher than the porous surface structure can be removed through machining or other processes to ensure the surface flatness. Further, the positive electrode can not only be a continuous large planar positive electrode, but also can be a plurality of positive electrode monomers segmented, each positive electrode monomer is pressed on the upper end of the corresponding support column, and the positive electrode monomers can be connected in parallel to a large planar electrode or directly connected to the positive terminal of the power supply.

[0153] Embodiment eight:

[0154] Unlike the large planar electrode attached to the porous surface structure in Example One, the positive electrode in this Example Eight is divided into multiple positive electrode monomers and inserted into the voids in the porous surface structure along the vertical direction (see also Figure 13 , but the structure of the intermediate is slightly different from this example, which will be described in detail below), and the positive electrode monomers are placed on the top of the non-porous base plate (or low-porosity porous structure). For example, multiple positive electrode monomers are connected in parallel and all connected to a large planar electrode or directly connected to the positive terminal of the power supply, and the negative electrode is connected to the negative terminal of the power supply.

[0155] The voids in the porous surface structure (preformed pores) serve as insertion spaces for the corresponding positive electrode monomers. In this example, the bottom of the positive electrode does not contact the top of the porous surface structure, avoiding damage to the surface of the porous surface structure due to resistance heat. Among them, the voids are laterally matched with the positive electrode monomers, for example, gap matching, that is, the voids need to be spaced apart from the adjacent part of the porous surface structure by a gap or an insulator after the positive electrode monomers are inserted, to avoid the part of the porous surface structure from being damaged by resistance heat.

[0156] The bottom of the non-porous base plate in this example is not provided with a protruding structure, but since the positive electrode itself is in direct contact with the non-porous base plate, and each positive electrode monomer is connected to the power supply, the current directly flows out from the positive electrode monomers and passes through the non-porous base plate and the substrate (without passing through the porous surface structure), that is, it still can ensure sufficient current and resistance heat, so that the non-porous base plate and the substrate have sufficient welding strength.

[0157] Example Nine:

[0158] As a variation of Example Eight, this Example Nine provides a number of solid support structures 10b with good electrical conductivity on the top surface of the non-porous base plate 1012b (or low-porosity porous structure), which are placed in the preformed pores inside the porous surface structure 1011, as shown in Figure 6 The support structures 10b are respectively used to place and support each positive electrode monomer 001 in the positive electrode 1014a, which is located in the groove of the support structure 10b and cooperates with the groove to ensure good contact between all positive electrode monomers 001 and the corresponding support structures 10b.

[0159] For example, the non-porous base plate 1012b, the porous surface structure 1011, and the support structure 10b are integrally formed structures, which are realized by 3D printing additive manufacturing process or vapor deposition process, etc.

[0160] Optionally, the top end of the support structure 10b is substantially flush with the top end of the porous surface structure 1011, and the height of the support structure 10b is substantially equal to the height of the porous surface structure 1011; or, the top end of the support structure 10b is lower than the top end of the porous surface structure 1011; or, the top end of the support structure 10b is higher than the top end of the porous surface structure 1011, and with the help of subsequent cutting processes, the top end of the final support structure 10b is flush with the top end of the porous surface structure 1011; the present invention does not limit the choice of which height design method to use. Even though the bottom of the non-porous base plate 1012b does not have a protruding structure, the positive electrode 1014a is electrically connected to the non-porous base plate 1012b through the support structure 10b with good conductivity solid structure. Moreover, each positive electrode unit 001 is connected to the power source, and the current flows directly from the positive electrode unit 001 and through the non-porous base plate 1012b and the substrate 1013 (without passing through the porous surface structure 1011). This ensures sufficient current and resistance heat, giving the non-porous base plate 1012b and the substrate 1013 sufficient welding strength.

[0161] Example 10:

[0162] like Figure 7 As shown, in Embodiment 10, based on Embodiment 1, several support pillars 1216 are further provided between the non-porous base plate 1212 (or a low-porosity porous structure) and the positive electrode 1214. The support pillars 1216 are placed on the surface of the non-porous base plate 1212 near the porous surface structure 1211. Optionally, the top surface of the support pillar 1216 is lower than the top surface of the corresponding portion of the porous surface structure, and the height of the support pillar 1216 is lower than the height of the porous surface structure. The support pillar 1216 is hidden inside the porous surface structure 1211. The support pillar 1216 is a solid structure, which serves as a limiting function to prevent the porous surface structure from being excessively compressed.

[0163] The bottom end of the non-porous bottom plate 1212 is pre-fabricated with a plurality of protruding structures 12a, which are in contact with the top of the base 1213. For example, the support columns 1216 can be distributed in alignment with or staggered with respect to the corresponding protruding structures 12a below them; meanwhile, whether the material of the support columns 1216 in the present embodiment is a conductive material or a non-conductive material, the present application does not make any limitation thereon, as long as the limiting function of the support columns 1216 can be ultimately met, so as to avoid excessive compression of the porous surface structure. When the support columns 1216 are made of a conductive material, the current is preferably selected to pass through the support columns 1216, and then pass through the porous surface structure near the support columns 1216, and then reach the corresponding protruding structure 12a, so as to improve the damage problem of the surface of the porous surface structure caused by the contact resistance heat. When the support columns 1216 are made of a non-conductive material, the current reaches the porous surface structure 1211 from the positive electrode 1214 until the protruding structure 12a. In the above case of the present embodiment, although it still causes a certain degree of damage to the surface of the porous surface structure, since the support columns 1216 are always lower than the surface of the porous surface structure 1212, it ultimately does not affect the basic function of the entire connecting structure applied to the related field.

[0164] As a variation of the tenth embodiment, the variation idea is that:

[0165] As shown in Figure 8 , the intermediate body in the composite not only includes a non-porous bottom plate 1212a (or a low-porosity porous structure), but also includes an insertion part, which is arranged at any position in the porous surface structure 1211a. Among them, the non-porous bottom plate 1212a is arranged between the porous surface structure 1211a and the base 1213a, and the bottom surface of the non-porous bottom plate 1212a is pre-fabricated with a plurality of protruding structures 12-1a, which are in contact with the top of the base 1212a.

[0166] Optionally, the insertion part includes a solid structure and a good conductive support column 1216a, the bottom end of the support column 1216a is not in direct contact with the top end of the base 1213a, and a part of the porous surface structure 1217a is distributed between the bottom end of the support column 1216a and the top end of the base 1213a. The top of the negative electrode 1215a is in close contact with the bottom of the base 1213a, and the bottom of the positive electrode 1214a is in close contact with the top of the porous surface structure 1211a. Among them, the top end of the support column 1216a can be lower than, equal to, or higher than the top end of the porous surface structure 1211a, and the present application does not make any limitation thereon, and specific reference is made to the above, which will not be repeated here.

[0167] The example can avoid excessive compression of the porous surface structure by the limiting effect of the support column 1116a. Since the support column is a solid structure with good electrical conductivity, the example can make the current flow preferably through the support column 1216a, then through a portion of the porous surface structure 1217a below the support column 1216a, and finally to the base 1213a. This can also improve the damage to the surface of the porous surface structure caused by contact resistance heating and enhance the current conduction effect. The welding bond efficiency between the portion of the porous surface structure 1217 below the support column 1216a and the base 1213a is increased, ensuring sufficient welding strength. The structure of the insertion portion of the example is not limited to the support column described above. Any structure that can achieve the corresponding technical effects of the embodiment is within the scope of the present application.

[0168] Embodiment eleven:

[0169] Unlike the non-porous bottom plate between the porous surface structure and the base described in embodiment five, embodiment eleven does not have a non-porous bottom plate. As shown in Figure 9 the bottom of at least a portion of the porous surface structure 1111 is connected to a convex structure 1112a (such as a bump) of a solid structure with good electrical conductivity. The convex structure 1112a is in contact with the top of the base 1113. Meanwhile, a support column 1116a of a solid structure with good electrical conductivity can be provided at any position within the porous surface structure 1111. The support column 1116a and the convex structure 1112a in this example can be distributed in a staggered manner.

[0170] For example, the porous surface structure 1111, the convex structure 1112a, and the support column 1116a are integrally formed structures, which can be achieved by 3D printing additive manufacturing process, or vapor deposition process, etc. Alternatively, the support column 1116a is hidden inside the porous surface structure 1111, the top end of the support column 1116a is lower than the top end of the porous surface structure 1111, and the bottom end of the support column 1116a is higher than the bottom end of the porous surface structure 1111.

[0171] In this example, the limiting effect of the support column 1116a can be used to prevent the porous surface structure 1111 from being compressed too much. In addition, the solid structure of the support column 1116a has good electrical conductivity, so the current is preferably selected to pass through the support column 1116a, then pass through the porous surface structure near the support column 1116a, and then reach the protruding structure 1112a. In this way, the damage to the surface of the porous surface structure caused by contact resistance heating can be improved. Furthermore, in this example, the protruding structure 1112a is further used to increase the contact resistance with the substrate 1113 to generate sufficient resistance heat, so that the protruding structure 1112a and the substrate 1113 have sufficient welding strength. The protruding structure of this embodiment can be a solid body, or a high-density porous structure (e.g., higher density than the porous surface structure). This expansion is also applicable to the corresponding embodiments, and the present application will not be repeated here.

[0172] Embodiment Twelve

[0173] As a variation of embodiment eleven, in this embodiment twelve, the protruding structure and the support column above it are designed to be directly opposite and at least partially coincide (e.g., partially coincide or completely coincide). The welding efficiency of this embodiment twelve is better than that of embodiment eleven, because the protruding structure and the support column are directly opposite, and the current flows through the support column and then directly through the protruding structure. In embodiment eleven, the current flows through the support column 1116a and then flows through the porous surface structure before flowing through the protruding structure 1112a.

[0174] As shown in Figure 10 As a variation of embodiment twelve, the height of the support column is lower than the porous surface structure, which is changed to: the support column 1116c is located inside the porous surface structure 111, and the top end of the support column 1116c is substantially flush with the top end of the porous surface structure. The height of the support column 1116c is substantially equal to the height of the porous surface structure. At this time, the protruding structure 1112c is also directly opposite the support column 1116c above it, and the two at least partially coincide (e.g., partially coincide or completely coincide).

[0175] Similarly, as another variation of embodiment twelve, the height of the support column is lower than the porous surface structure, which is changed to: the top surface of all support columns is set to be higher than the top surface of the porous surface structure (not shown), and the height of each support column is higher than the height of the corresponding adjacent part of the porous surface structure. At this time, the protruding structure is also directly opposite the support column above it, and the two at least partially coincide (e.g., partially coincide or completely coincide). The other contents in the implementation of this variation can be referred to the above embodiment four and the above embodiment twelve, and will not be repeated here.

[0176] The intermediate of the present application does not comprise the non-porous bottom plate, in addition to the above-mentioned embodiment eleven and embodiment twelve, and comprises the following examples:

[0177] (1) In one example, as shown in Figure 11 , the non-porous bottom plate is not arranged between the porous surface structure 1111e and the base 1113e, and the intermediate only comprises an inserted part which is arranged at any position inside the porous surface structure 1111e. Preferably, the inserted part comprises a solid structure and a well-conductive support column 1116e, the bottom end of the support column 1116e is not in direct contact with the top of the base, and a part of the porous surface structure 1117e is distributed between the bottom end of the support column 1116e and the top end of the base 1113e, the top of the negative electrode 1115e is in close contact with the bottom of the base 1113e, and the bottom of the positive electrode 1114e is in close contact with the top of the porous surface structure 1111e. Wherein, the top end of the support column 1116e can be lower than, equal to, or higher than the top end of the porous surface structure 1111e, and the present application does not limit this, and the specific content is referred to the above, and will not be repeated here. The side of the support column 1116e close to the base 1113e is not provided with a protruding structure, and the bottom end of the support column 1116e is higher than the bottom end of the porous surface structure.

[0178] This example can avoid excessive compression of the porous surface structure by the limiting effect of the support column 1116e. In addition, since the support column is a well-conductive solid structure, the current is preferably selected to pass through the support column 1116e, and then pass through a part of the porous surface structure 1117e below the support column 1116e, and finally flow to the base 1113e, at this time, the damage problem of the surface of the porous surface structure caused by the contact resistance heat can also be improved, and the current conduction effect can also be enhanced, the welding bonding efficiency between a part of the porous surface structure 1117e below the support column 1116e and the base 1113e is increased, and sufficient welding strength is ensured; the structure of the inserted part of this example is not limited to the above-mentioned support column, and any structure form which can achieve the corresponding technical effect of this embodiment is also included in the protection scope of the present application.

[0179] (2) In another example, as shown in Figure 12As shown, no non-porous underplate is arranged between the porous surface structure 1111f and the substrate 1113f, and the intermediate body only comprises an inserted part arranged at any position inside the porous surface structure 1111f. Preferably, the inserted part comprises a solid structure and a well-conductive supporting column 1116f, one side of the supporting column 1116f close to the substrate 1113f is not provided with a protruding structure, and the bottom end of the supporting column 1116f is in direct contact with the top end of the substrate 1113f. The top of the negative electrode 1115f is in close contact with the bottom of the substrate 1113f, and the bottom of the positive electrode 1114f is in close contact with the top of the porous surface structure 1111f. Wherein, the top end of the supporting column 1116f can be lower than, equal to, or higher than the top end of the porous surface structure 1111f, and the present application does not make any limitation thereon, and the specific content is referred to the above, which will not be repeated here.

[0180] The present example can also utilize the limiting effect of the supporting column 1116f to avoid excessive compression of the porous surface structure 1111f, which is specifically described above; although no protruding structure is arranged between the porous surface structure 1111f and the substrate 1113f, because the supporting column 1116f is a well-conductive solid structure, the current is mostly preferably selected to pass through the supporting column, and the amount of current passing through the porous surface structure adjacent to the bottom of the supporting column 1116f through the supporting column 1116f is large, and there is still enough resistance heat to ensure that the composite and the substrate 1113f have sufficient welding strength, and the damage to the surface of the porous surface structure can also be reduced to a certain extent.

[0181] It is worth noting that in the above-mentioned embodiments three to twelve, the supporting column is defined as a part of the intermediate body, which is only one concept of division method, but is not limited thereto. Since the non-porous underplate, the porous surface structure and the supporting column are integrally formed, the supporting column in the above-mentioned embodiments three to twelve can also be defined as a part of the porous surface structure, which also belongs to the protection scope of the present application, and the specific content is referred to the above, which will not be repeated here.

[0182] Embodiment thirteen:

[0183] For the above-mentioned embodiment one, as Figure 2As shown, the top of the negative electrode 25 is in close contact with the bottom of the substrate 23, and the bottom of the positive electrode 24 is in close contact with the top of the porous surface structure 21. Optionally, the positive electrode 24 and the negative electrode 25 are large planar electrodes, with the positive electrode 24 covering the top of the porous surface structure 21 and the negative electrode 25 covering the bottom of the substrate 23. Because the large planar positive electrode 24 in Embodiment 1 presses against the top of the porous surface structure 21, the large planar positive electrode 24 contacts and compresses the surface of the porous surface structure 21, causing damage to the surface of the porous surface structure 21. For example, it may cause indentation due to pressure, or blackening, indentation, and reduction of pore space due to heat generated by contact resistance.

[0184] To protect the surface of porous surface structures, such as Figure 13 As shown, in this embodiment thirteen, the positive electrode is divided into multiple positive electrode units 541, and the positive electrode units 541 are inserted vertically into the gaps 5a within the porous surface structure 51. Furthermore, the positive electrode units 541 are placed at the top of the non-porous base plate 52 (as an intermediate). In this example, the porous surface structure 51 and the non-porous base plate 52 are integrally formed, for example, through 3D printing additive manufacturing or vapor deposition processes. The materials and manufacturing processes of the substrate 53, the non-porous base plate 52, and the porous surface structure 51 in this embodiment can be found in Embodiment 1, and will not be repeated here.

[0185] In this embodiment, each positive electrode cell 541 is connected in parallel and is connected to the positive terminal of the power supply, while the negative electrode 55 is connected to the negative terminal of the power supply. For example... Figure 13 As shown, a plurality of protrusions 521 are pre-fabricated on the bottom of the non-porous substrate 52. These protrusions 521 contact the top of the substrate 53, and the bottom of the substrate 53 contacts the negative electrode 55. Optionally, the gaps 5a in the porous surface structure 51 serve as insertion spaces for the corresponding positive electrode unit 541. These gaps 5a are pre-fabricated pore portions that extend from the surface of the porous surface structure 51, through the porous surface structure 51, and up to the top of the non-porous substrate 52, so that the top of the non-porous substrate 52 is exposed within the gaps 5a, allowing the bottom of the inserted positive electrode unit 541 to contact the top of the non-porous substrate 52.

[0186] The positive electrode 54 of the thirteenth embodiment does not contact the surface of the porous surface structure 51, which solves the problem of damage caused by the resistance heat generated by the contact resistance between the surface of the porous surface structure and the positive electrode. For example, the gap 5a is laterally fitted with the positive electrode monomer 541, such as a clearance fit, that is, the gap 5a needs to be ensured to be spaced apart from the adjacent part of the porous surface structure by a gap or an insulator after being inserted into the positive electrode monomer 541, so as to avoid the surface of the part of the porous surface structure from being damaged by the resistance heat, thereby protecting the surface of the porous surface structure. Alternatively, the positive electrode monomer 541 is a columnar structure or other shaped structure, which is not limited in the present example and is not limited in other related examples.

[0187] For example, the plurality of protruding structures at the bottom of the non-porous bottom plate can correspond to the positions of the respective positive electrode monomers, for example, the contact position between the positive electrode monomer and the top of the non-porous bottom plate is directly above the protruding structure or in the adjacent part of the protruding structure, so as to ensure that the current is smoothly conducted to the non-porous bottom plate until the contact surface of the protruding structure and the top of the base and the adjacent area, to generate resistance heat and thereby form a combination of the protruding structure and the top of the base. The shape of the protruding structure 521 of the present embodiment can be referred to in Embodiment One, which will not be repeated here. The improvement point of the thirteenth embodiment is applicable not only to Embodiment One but also to any one of the above embodiments and variants, which will not be repeated here.

[0188] It is worth noting that the division of the positive electrode into a plurality of positive electrode monomers and the insertion of the positive electrode monomers into the gap of the porous surface structure along the vertical direction in the thirteenth embodiment is also applicable to Embodiment Two in which the intermediate body is a second porous structure (with a lower porosity than the first porous structure), that is, the positive electrode 44 in Embodiment Two is replaced by a plurality of positive electrode monomers, and each positive electrode monomer is inserted into the gap (not shown) of the porous surface structure 41 along the vertical direction. At this time, the pre-prepared gap starts from the surface of the first porous structure, passes through the first porous structure and reaches above or inside the second porous structure, so that part of the second porous structure is exposed in the gap, and the bottom of the inserted positive electrode monomer contacts part of the second porous structure. Similarly, the gap is laterally fitted with the positive electrode monomer, such as a clearance fit, that is, the gap needs to be ensured to be spaced apart from the adjacent part of the porous surface structure after being inserted into the positive electrode monomer, so as to avoid the surface of the part of the porous surface structure from being damaged by the resistance heat, thereby protecting the surface of the porous surface structure. Other specific structures and processes are the same as those of the thirteenth embodiment, which will not be repeated here.

[0189] Embodiment Fourteen:

[0190] Based on Example 1, the positive electrode morphology is changed: In Example 14, a flexible positive electrode is used (the flexible positive electrode and its position relative to the porous surface can be found in [reference]). Figure 16 (The intermediate structure is slightly different, as detailed below); the flexible positive electrode covers the top of the porous surface structure, the negative electrode is attached to the bottom of the substrate, and the non-porous base plate is located between the porous surface structure and the substrate. The materials and manufacturing processes of the substrate, non-porous base plate, and porous surface structure in this embodiment can be found in Embodiment 1, and will not be repeated here.

[0191] In this fourteenth embodiment, since the flexible positive electrode covers the top surface of the porous surface structure, it exerts a certain pressure on the surface of the porous surface structure. At this time, the flexible positive electrode undergoes a certain flexible deformation under the interaction of pressure, which increases the contact area between it and the top of the porous surface structure (compared to the contact area between the rigid positive electrode and the top of the porous surface structure under the same conditions). This not only reduces the contact resistance between the positive electrode and the porous surface structure, improves or avoids surface damage caused by resistive heat (such as depressions, blackening, and reduced pore space), and protects the surface of the porous surface structure, but also enhances current conduction, increases the welding bonding efficiency between the non-porous base plate and the substrate, and increases the welding strength.

[0192] For example, the flexible material is a conductive material, such as copper foil or tin foil. This embodiment does not limit this, nor is it limited to other related examples. It can be designed according to the actual application. The improvements of this embodiment fourteen are not only applicable to embodiment one, but also to any of the above embodiments and variations, which will not be elaborated here.

[0193] As a variation of Example Fourteen, the following is provided:

[0194] like Figure 14As shown, a deformable conductive medium 606 is added between the bottom of the positive electrode 604 and the top of the porous surface structure 601, and the deformable conductive medium 606 covers the top surface of the porous surface structure 601. Optionally, the deformable conductive medium 606 is a continuous solid film, such as copper foil. Similarly, the intermediate body 602 is located between the porous surface structure 601 and the substrate 603, and the top of the negative electrode 605 is in close contact with the bottom of the substrate 603. The positive electrode 604 is a large planar electrode and covers the top surface of the deformable conductive medium 606. Because the deformable conductive medium 606 is easily deformable, the contact area between it and the porous surface structure 601 is increased. This not only reduces the contact resistance between the porous surface structure 601 and the positive electrode 604 above it, reducing resistive heat and surface damage to the porous surface structure 601, but also increases current conduction, thereby increasing the welding strength between the intermediate body 602 and the substrate 603.

[0195] Based on the above transformation methods, further extensions can be made, as follows:

[0196] like Figure 15 As shown, the pores between the bottom of the positive electrode 6004 and the top of the porous surface structure 6001 are filled with a highly conductive material powder 6006 (or a highly conductive wire or mesh of highly conductive material). This reduces the contact resistance between the positive electrode 6004 and the surface of the porous surface structure 6001, thereby reducing surface damage to the porous surface structure 6001. It also increases current conduction and improves the welding efficiency between the intermediate 6002 and the substrate 6003. Preferably, the material of the highly conductive material powder 6006 (or the highly conductive wire) is the same as the material of the porous surface structure 6001, for example, titanium powder (or titanium wire). Similarly, as... Figure 15 The intermediate 6002 is located between the porous surface structure 6001 and the substrate 6003, and the top of the negative electrode 6005 is in close contact with the bottom of the substrate 6003. In another different example, by spraying a conductive material onto the surface of the porous surface structure, the contact resistance between the electrode and the porous surface structure can also be reduced, thereby reducing surface damage to the porous surface structure; however, this will not be elaborated upon in this invention.

[0197] Regardless of the aforementioned easily deformable conductive dielectric 606, conductive material powder 6006 (or conductive wire), sprayed conductive material, or liquid conductive agent, all of them need to be appropriately removed after the porous surface structure and the substrate are welded together to ensure that the pores of the porous surface structure are open.

[0198] It is worth noting that after the porous surface structure is connected to the substrate in any of the above embodiments, a layer of hydroxyapatite (HA) coating can be separately sprayed onto the surface of the porous surface structure. This HA coating has good bioactivity and biocompatibility, which is beneficial to the subsequent bone ingrowth process. Alternatively, a coating containing antibacterial agents (such as a coating containing silver ions) or other coatings containing cell growth factors can be separately sprayed onto the surface of the porous surface structure.

[0199] Based on the above, the present invention also provides a modified example, as follows:

[0200] To avoid or improve surface damage caused by resistance heat in porous surface structures, it is necessary to maximize the conductivity of the porous surface structure to reduce the contact resistance between it and the electrode. In this modified example, a molten material (a material with good conductivity) is infiltrated into the porous surface structure. The molten material almost completely fills the pores in the selected portion (the portion above the spacer layer) of the porous surface structure. At this point, it is necessary not only to limit the melting point of the molten material with good conductivity to a low value, but also to provide a spacer layer within the porous surface structure. The spacer layer is preferably made of a conductive material to prevent the molten material from penetrating downwards and flowing onto the intermediate body below, thus avoiding affecting the resistance welding effect. After the resistance welding process is completed, the bonded assembly is placed in a high-temperature environment. Since the melting point of the specific conductive medium is lower than that of the porous surface structure and the substrate (such as a titanium alloy), the high-temperature environment has little impact on the substrate. However, the low-melting-point conductive medium will melt, and this added low-melting-point conductive medium can be removed using some physical or chemical processes in the prior art.

[0201] Example 15:

[0202] Based on the above-described Embodiment 2, the morphology of the positive electrode is changed: the positive electrode in Embodiment 15 is a flexible positive electrode 74 made of a flexible material, such as... Figure 16 As shown, a flexible positive electrode 74 covers the top of the first porous structure 71 in the high-porosity region, and a negative electrode 75 is attached to the bottom of the substrate 73. A second porous structure 72 in the low-porosity region is located between the first porous structure 71 in the high-porosity region and the substrate 73. The materials and manufacturing processes of the substrate 73, the second porous structure 72, and the first porous structure 71 in this embodiment can be found in Embodiment 2, and will not be repeated here.

[0203] The flexible deformation principle of the flexible positive electrode 74 and examples of flexible materials in this embodiment can be found in the description in Embodiment Fourteen. Similar to Embodiment Two, the lower surface of the low-porosity base plate 72 may have protrusions (not shown) to increase resistance welding efficiency. The improvements in Embodiment Fifteen are not only applicable to Embodiment Two, but also to any of the above embodiments and variations, and will not be elaborated here.

[0204] Example 16:

[0205] The porous surface structure and the substrate of this invention are joined together by resistance welding (e.g., projection welding). When the area of ​​the workpiece to be welded is too large, a greater number of protrusions are required. Once the protrusions are determined, in order to ensure the welding strength between each protrusion and the substrate, the total current of the electrodes needs to be increased, which may lead to increased power supply equipment costs, electrode damage, and increased surface damage to the porous surface structure. In this case, the workpiece can be welded in sections and batches.

[0206] In this sixteenth embodiment, the porous surface structure 1311 is divided into regions and resistively welded to the substrate 1313 in batches, such as... Figure 17 As shown, a first positive electrode 1314-1 is connected above the porous surface structure 1311-1 corresponding to the first region, and a second positive electrode 1314-2 is connected above the porous surface structure 1311-2 corresponding to the second region. The top of the negative electrode 1315 is in close contact with the bottom of the substrate 1313. A non-porous base plate 1312 (or a low-porosity porous structure) is provided between the porous surface structure 1311 and the substrate 1313, and multiple protrusions are pre-fabricated on the bottom surface of the non-porous base plate 1312, with the protrusions contacting the top of the substrate 1313.

[0207] In this embodiment, the porous surface structure 1311 is subjected to resistance welding in sections. However, during the section welding, the positive electrode corresponding to each section may not be able to completely cover the corresponding porous surface structure. For example, the edge of the adjacent side of any two adjacent sections may not be completely covered. In this case, the edge of each section may be slightly higher than the other covered parts (i.e., convex edge), which will affect the surface flatness of the porous surface structure 1311 and may even affect the basic function of the connection structure in related fields (such as bone ingrowth).

[0208] To overcome the aforementioned defects, the porous surface structure 1311 of this embodiment is provided with grooves 13a, dividing the top of the porous surface structure 1311 into multiple regions, such as the porous surface structure 1311-1 in the first region and the porous surface structure 1311-2 in the second region shown in the figure. The groove 13a is elongated, with the porous surface structure 1311-1 in the first region and the porous surface structure 1311-2 in the second region located on opposite sides of the elongated groove 13a. The top of the groove 13a is lower than the top of the porous surface structure 1311. The height of the groove 13a is less than the height of the porous surface structure 1311.

[0209] For example, the main body of the non-porous bottom plate 1312, the groove 13a, and the porous surface structure 1311 are integrally formed, for example, by a 3D printing additive manufacturing process or a vapor deposition process, etc. The groove 13a can also be formed by machining.

[0210] Figure 17 As shown, there is a gap between the first positive electrode 1314-1 and the second positive electrode 1314-2, and the first positive electrode 1314-1 and the second positive electrode 1314-2 can be in a sequential order, that is, Figure 17 Only represents a position indication, or the first positive electrode 1314-1 and the second positive electrode 1314-2 are not in a sequential order, and can be pressed on the porous surface structure of the corresponding area at the same time; the coverage area of the positive electrode corresponding to each divided area is greater than the surface area of the porous surface structure 1311-1 of the corresponding area.

[0211] Since the groove 13a is designed in the embodiment, the side of the groove 13a close to the first positive electrode 1314-1 is recorded as the first side, and the other side of the groove 13a close to the second positive electrode 1314-2 is recorded as the second side.

[0212] In the embodiment, the porous surface structure 1311-1 of the first area is first connected with the base 1313 by resistance welding: the bottom surface of the first positive electrode 1314-1 covers the porous surface structure 1311-1 of the corresponding area, and the part of the first positive electrode 1314-1 beyond the connection area does not exceed the edge of the second side of the groove 13a, and the contact resistance between the first positive electrode 1314-1 and the porous surface structure 1311-1 of the first area causes heat generation, which causes the surface of the porous surface structure 1311-1 of the first area to sink slightly but not form a convex edge; then the resistance welding of the porous surface structure 1311-2 of the second area and the base 1313 is continued: the second positive electrode 1314-2 covers the surface of the porous surface structure 1311-2 of the corresponding area, and the part of the second positive electrode 1314-2 beyond the connection area does not exceed the edge of the first positive electrode 1314-1 close to the second positive electrode 1314-2, and the contact resistance between the second positive electrode 1314-2 and the porous surface structure 1311-2 of the second area causes heat generation, which causes the surface of the porous surface structure 1311-2 of the second area to sink slightly but not form a convex edge. When the first positive electrode 1314-1 and the second positive electrode 1314-2 are in a sequential order, the first positive electrode 1314-1 and the second positive electrode 1314-2 can be the same electrode.

[0213] Alternatively, the first positive electrode 1314-1 and the second positive electrode 1314-2 are not in sequence, but are pressed on the porous surface structure of the corresponding region at the same time, so that the porous surface structure 1311-1 of the first region and the porous surface structure 1311-2 of the second region are simultaneously completed with the base by resistance welding, wherein the bottom surface of the first positive electrode 1314-1 covers the porous surface structure 1311-1 of the corresponding region, and the part of the first positive electrode 1314-1 beyond the connection region does not exceed the edge of the second side of the groove 13a; and the second positive electrode 1314-2 covers the surface of the porous surface structure 1311-2 of the corresponding region and contacts, and the part of the second positive electrode 1314-2 beyond the connection region does not exceed the edge of the first side of the groove 13a.

[0214] This method solves the problem of edge bulging caused by sub-regional welding. The process needs to control the position of the sinking of the porous surface structure to be higher than the top end of the groove 13a.

[0215] As a variation of this embodiment sixteen, as follows:

[0216] As shown in Figure 18 The first positive electrode 1414-1 is connected above the porous surface structure 1411-1 corresponding to the first region, and the second positive electrode 1414-2 is connected above the porous surface structure 1411-2 corresponding to the second region. The top of the negative electrode 1415 is in close contact with the bottom of the base 1413, and the non-porous bottom plate 1412 (or low-porosity porous structure) is arranged between the porous surface structure 1411 and the base 1413, and a plurality of protruding structures are pre-manufactured on the bottom surface of the non-porous bottom plate 1412, which are in contact with the top of the base 1413.

[0217] The porous surface structure 1411 is provided with a groove 14a, which divides the top of the porous surface structure 1411 into a plurality of regions, such as the porous surface structure 1411-1 of the first region and the porous surface structure 1411-2 of the second region in the figure. The groove 14a is long strip-shaped, and the porous surface structure 1411-1 of the first region and the porous surface structure 1411-2 of the second region are respectively located on both sides of the long strip-shaped groove 14a. The top end of the groove 14a is lower than the top end of the porous surface structure 1411. The height of the groove 14a is less than the height of the porous surface structure 1411. Due to the design of the groove 14a in this embodiment, the side of the groove 14a close to the first positive electrode 1414-1 is recorded as the first side, and the other side of the groove 14a close to the second positive electrode 1414-2 is recorded as the second side.

[0218] As shown in Figure 18As shown, the first positive electrode 1414-1 and the second positive electrode 1414-2 have overlapping portions (the first positive electrode 1414-1 and the second positive electrode 1414-2 are in the order of first then second, Figure 18 As shown, the first positive electrode 1414-1 and the second positive electrode 1414-2 have overlapping portions (the first positive electrode 1414-1 and the second positive electrode 1414-2 are in the order of first then second,

[0219] As shown, the first positive electrode 1414-1 and the second positive electrode 1414-2 have overlapping portions (the first positive electrode 1414-1 and the second positive electrode 1414-2 are in the order of first then second,

[0220] Example 17:

[0221] Similar to Embodiment Sixteen, Embodiment Seventeen also employs regional resistance welding. However, unlike Embodiment Sixteen, to address the issue of indentation and raised edges caused by regional welding, the porous surface structure in Embodiment Seventeen (not shown) does not use a groove design. In this example, when adjacent regional porous surface structures are resist-welded sequentially, a raised edge appears on the edge of the first region after the first regional resistance welding because the coverage area of ​​the first positive electrode is smaller than the area of ​​the corresponding region (here, "raised" refers to a relative height relationship, meaning the edge portion that has not been recessed is higher than other recessed portions). At this point, it is necessary to ensure that the second positive electrode, used in the next resistance welding, can cover the edge portion of the previously raised first region. During the second resistance welding process, the porous surface structure of the raised edge portion will be recessed, thus avoiding the problem of edge indentation and raised edges caused by regional welding.

[0222] Example 18:

[0223] like Figure 19 As shown, in this embodiment, a limiting structure 15a is provided at the top of the non-porous base plate 1512. The limiting structure 15a is elongated and can serve as a reference for region division. The limiting structure 15a is located at the edge of adjacent sides of any two adjacent regions. The top of the limiting structure 15a is lower than the top of the porous surface structure 1511, and the height of the limiting structure 15a is less than the height of the porous surface structure 1511. For example, the main body of the non-porous base plate 1512, the limiting structure 15a, and the porous surface structure 1511 are integrally formed structures, for example, through 3D printing additive manufacturing processes or vapor deposition processes. In this embodiment, the limiting structure 15a is a solid structure or a porous structure with a lower porosity than the porous surface structures 1311-1 and 1311-2.

[0224] The positive electrode in this embodiment eighteen can be Figure 19 The image shows a large planar electrode 1514 with a porous surface structure covering multiple regions; it could also be... Figure 17 The first positive electrode 1314-1 and the second positive electrode 1314-2 with a gap exist in the middle, or Figure 18 The first positive electrode 1414-1 and the second positive electrode 1414-2 at least partially overlap. At this point, after the composite formed by the porous surface structure 1511 and the non-porous base plate 1512 is joined to the substrate 1513 by resistance welding, although the surface of the porous surface structure 1511 in each region experiences slight subsidence, no convex edges are formed, and the subsidence is limited by the limiting structure 15a. This method not only solves the problem of convex edges caused by regional welding but also limits the position of subsidence of the porous surface structure caused by the welding process.

[0225] Example 19:

[0226] Based on Embodiment 5, this Embodiment 19 is modified as follows:

[0227] like Figure 20 As shown, a non-porous base plate 1912 is disposed between the porous surface structure 1911 and the substrate 1913. Multiple protrusions 19a are pre-fabricated on the bottom surface of the non-porous base plate 1912, and these protrusions 19a contact the top of the substrate 1913. Support pillars 1916 are disposed at any position within the porous surface structure 1911. The top of the support pillar 1916 is lower than the top surface of the corresponding portion of the porous surface structure, and the height of the support pillar 1916 is lower than the height of the porous surface structure; that is, the support pillar 1916 is hidden inside the porous surface structure 1911. The top of the negative electrode 1915 is also in close contact with the bottom of the substrate 1913. Specifically, in this embodiment nineteen, the positive electrode 1914 is not in contact with the upper surface of the porous surface structure 1911. The upper surface of the porous surface structure 1911 is in contact with a pressure head 1917, which provides pressure to press the porous surface structure 1911 and the substrate 1913 together. This is beneficial to the welding effect between the raised structure of the non-porous base plate 1912 and the substrate 1913.

[0228] In one example, the positive electrode 1914 is in contact with the side of the porous surface structure 1911. When current is applied, the current flowing from the positive electrode 1914 first flows through the porous surface structure 1911. Since the support column 1916 is a solid structure with good conductivity, most of the current preferentially flows through the support column 1916 and then flows to the contact surface and adjacent area between the protrusion structure 19a of the non-porous base plate 1912 and the top of the substrate 1913, so that the protrusion structure 19a and the top of the substrate 1913 are welded and fixed together.

[0229] In another example, the positive electrode 1914 is in contact with the side of the support column 1916. When current is applied, the current flowing from the positive electrode 1914 first flows through the support column 1916, and then flows to the contact surface and adjacent area of ​​the protrusion structure 19a of the non-porous base plate 1912 and the top of the substrate 1913, so that the protrusion structure 19a and the top of the substrate 1913 are welded and fixed together.

[0230] In another example, the positive electrode 1914 is in contact with the side of the non-porous base plate 1912. When current is applied, the current flowing from the positive electrode 1914 flows through the non-porous base plate 1912 and reaches the contact surface and adjacent area between the protrusion structure 19a of the non-porous base plate 1912 and the top of the substrate 1913, so that the protrusion structure 19a and the top of the substrate 1913 are welded and fixed together.

[0231] In another example, the positive electrode 1914 is in contact with two or three of the side of the porous surface structure 1911, the side of the support column 1916, and the side of the non-porous bottom plate 1912. The current flowing out of the positive electrode 1914 flows to the contact surface and the adjacent area of the protruding structure 19a of the non-porous bottom plate 1912 and the top end of the substrate 1913, so that the protruding structure 19a and the top of the substrate 1913 are welded and fixed.

[0232] Based on the above examples, since the positive electrode 1914 is in contact with the side of the composite and does not contact the upper surface of the porous surface structure 1911, damage to the surface of the porous surface structure 1911 caused by resistance heat can be avoided.

[0233] The method of the present embodiment nineteen for applying electricity to the composite by connecting the positive electrode from the side is applicable not only to the examples in which the support column is provided in the porous surface structure, such as embodiments three to seven and embodiments nine to twelve, but also to other examples in which the support column is not provided in the porous surface structure, such as embodiments one to two, embodiment eight, and embodiment thirteen. The present application does not make any further description here. In addition, when the positive electrode is connected to the composite from the side in the method of the present embodiment nineteen, the following situations exist: (a) the upper surface of the porous surface structure 1911 is not connected to any positive electrode, which is described in detail with reference to the corresponding examples above; and (b) part or all of the upper surface of the porous surface structure 1911 is in contact with a positive electrode, which is described in detail with reference to the corresponding examples above, and each positive electrode is connected in parallel and connected to the positive terminal of the power supply. The above situations are all included in the protection scope of the present application.

[0234] Embodiment twenty:

[0235] It is worth noting that the present application is not limited to the use of the projection welding resistance welding method alone in any of the above examples, but can also use the spot welding resistance welding method alone or use the projection welding resistance welding method and the spot welding resistance welding method in combination to combine the intermediate body and the substrate. Specifically, the spot welding resistance welding method is different from the projection welding resistance welding method by providing a protruding structure. In the spot welding resistance welding method, the intermediate body is not provided with a protruding structure. In one welding cycle, a welding spot is welded by a single electrode and each time the welded workpiece (such as the composite and the substrate) is moved or by a single electrode and each time the electrode is moved, until a set number of welding spots are completed, to ensure that the intermediate body and the substrate have sufficient welding strength. In addition, the present application can also use the projection welding resistance welding method and the spot welding resistance welding method in combination, for example, after the projection welding resistance welding method in any of the above examples is completed, the spot welding resistance welding method is further used to operate to strengthen the welding strength between the intermediate body and the substrate.

[0236] The projection welding resistance welding method can simultaneously weld multiple welding points in one welding cycle, has high production efficiency, and has no shunt effect. Meanwhile, since the current density is concentrated in the projection, the current density is large, so a smaller current can be used for welding, and a smaller nugget can be reliably formed, overcoming the nugget deviation phenomenon of spot welding resistance welding. The projection position of the projection welding resistance welding method is accurate and has consistent size, and the strength of each point is relatively uniform, so for a given welding strength, the size of a single projection welding point can be smaller than that of spot welding. In addition, since a large planar electrode is used and the projection is arranged on the intermediate body, the indentation on the exposed surface of the base can be minimized. Meanwhile, the current density of the large planar electrode is small and the heat dissipation is good, and the wear of the electrode is much smaller than that of spot welding, thereby greatly reducing the maintenance and repair cost of the electrode.

[0237] In the projection welding resistance welding process in any of the above embodiments, since the projection structure is mainly the projection of the middle part, the projection is subjected to a large pressure from the upper electrode and generates resistance heat through contact with the base to be combined, and the side part of the projection structure is not in full contact with the base, resulting in failure to be welded and combined. In order to improve the welding strength between the projection structure of the intermediate body and the base, any one or more of the electrode, the base, and the intermediate body is rotated to weld the intermediate body multiple times and from multiple directions, so as to ensure that the projection structure is welded with the base in all directions.

[0238] In addition, as an extension of the above embodiment, it specifically includes that since the porous surface structure of some of the above embodiments is in contact with the large planar positive electrode above it, the surface of the porous surface structure may be damaged (depressed, blackened) due to contact resistance heat generation. In order to overcome this defect and protect the surface of the porous surface structure, an insulating piece is covered on the porous surface structure, and a plurality of holes are formed on the insulating piece at the corresponding positions to put the positive electrode or the electrically conductive support column, etc., so that the porous surface structure below the non-holed position of the insulating piece is not damaged. The thickness of the insulating piece is moderate, because it is necessary to ensure the complete conduction of the current loop, so that the welding process can be carried out in sequence.

[0239] Embodiment twenty-one:

[0240] In the above embodiment five, when the rigidity of the non-porous bottom plate 812 in the composite body is too large, it may cause difficulty in bonding the projection structure and the base, thereby affecting the welding effect between the non-porous bottom plate and the base. Therefore, the present application needs to ensure that the entire connecting structure has a suitable size of rigidity, so as to not only ensure the basic strength of the connecting structure, but also enable the intermediate body and the base to be in close contact, thereby improving the welding efficiency between the non-porous bottom plate and the base.

[0241] As Figure 21 , Figures 22-24 and Figures 25-26As shown, in this embodiment twenty-one, based on embodiment five, the stiffness value of a certain composite region in the composite containing the porous surface structure 1611 and the intermediate body 1612 is reduced. For example, the thickness of the composite region is reduced. Here, the composite region refers to at least a portion of the region occupied by the composite containing the non-porous base plate and the porous surface structure. The thickness of the composite can be reduced by: (a) reducing the thickness of the non-porous base plate 1612 in the intermediate body at the corresponding position; (b) reducing the thickness of the porous surface structure at the corresponding position. In addition, in this embodiment twenty-one, the non-porous base plate in embodiment five can also be designed as a hollow non-porous base plate 1612 to achieve a reduction in the stiffness value of the corresponding composite region.

[0242] like Figure 21 As shown, in this embodiment, the non-porous base plate 1612 is disposed between the porous surface structure 1611 and the substrate 1613. Multiple protrusions 16a are pre-fabricated on the bottom of the non-porous base plate 1612, and these protrusions 16a contact the top of the substrate 1613. Several support pillars 1616a are disposed on the surface of the non-porous base plate 1612 near the porous surface structure 1611, and these support pillars 1616a are located between the non-porous base plate 1612 and the positive electrode 1614. For example, the support pillars 1616a are located inside the porous surface structure 1611, and the top of the negative electrode 1615 is also in close contact with the bottom of the substrate 1613. This embodiment is applicable not only to solid non-porous base plates as intermediates but also to high-density porous structures as intermediates. For ease of description, this example mainly focuses on the solid non-porous base plate 1612.

[0243] (a) Reduce the thickness of the non-porous substrate 1612:

[0244] In one example, the thickness of the non-porous base plate 1612 in region P is reduced to zero, meaning there is no intermediate body in region P, forming a hollow structure, such as... Figure 25 As shown.

[0245] In another example, the thickness of the non-porous substrate 1612 in region Q is smaller than that in other regions (e.g., regions Q1 and Q2). For instance, compared to the non-porous substrates in regions Q1 and Q2, the upper or lower part of the non-porous substrate 1612 in region Q is thinned, but the reduced thickness is still greater than zero, meaning there is still an intermediate body in region Q. Figure 26 As shown.

[0246] (ii) Reducing the thickness of the porous surface structure 1611:

[0247] like Figure 27As shown, the thickness of the non-porous base plate 1612 in region 7a remains unchanged, but the position of the non-porous base plate 12-1 in region 7a is raised upwards, that is, the bottom end of the non-porous base plate 12-1 moves away from the substrate. The position of the bottom end of the porous surface structure 11-1 corresponding to region 7a is also raised upwards, that is, the thickness of the porous surface structure 11-1 is reduced. As a result, the stiffness of the composite formed by the non-porous base plate 12-1 and the porous surface structure 11-1 in region 7a is reduced, which improves the welding efficiency between the non-porous base plate and the substrate. At the same time, the gap distance between the bottom end of the non-porous base plate 12-1 in region 7a and the substrate is increased. Finally, the non-porous base plate 12-1 in this region, the adjacent two side support columns 6-1 and 6-2 of the non-porous base plate 12-1, and the substrate work together to form a pocket structure, which is beneficial to expanding the application of this connection structure.

[0248] The above example describes the case where the thickness of the non-porous base plate 1612 in region 7a remains unchanged, that is, only the thickness of the porous surface structure 11-1 corresponding to region 7a is reduced. However, the present invention can also reduce the thickness of the porous surface structure 11-1 in the region while reducing the thickness of the non-porous base plate 1612, so that the stiffness of the composite in the region is reduced by a greater extent.

[0249] The thickness reduction of the composite in this embodiment can be achieved by any one or a combination of the following methods: (1) obtained by machining operations: for example, by hollowing out a uniform thin plate with a pre-fabricated protrusion structure to obtain a non-porous base plate with reduced plate thickness or a plate with cutouts; (2) achieved by integral molding of a non-porous base plate and a porous surface structure: for example, by 3D printing additive manufacturing process or vapor deposition process to obtain a composite with reduced thickness.

[0250] like Figure 23 As shown, the non-porous base plate 1612 in this embodiment is divided into a raised structure 16a, a stiffness-reduced region B1, and a stiffness-unchanged region A1. The present invention does not limit the shape of the stiffness-reduced region B1 of the non-porous base plate, as long as it includes a portion of the stiffness-reduced region. The stiffness-reduced region B1 comprises multiple dispersed local regions.

[0251] When the rigidity of all regions of the composite in the entire connecting structure is reduced compared with the embodiment five, and the thickness of the intermediate body corresponding to all regions of the composite is reduced to zero, the intermediate body is only left with the protruding structure 16a, that is, the embodiment twenty-one becomes the case in the above-mentioned embodiment twelve. The non-porous bottom plate in the embodiment is not only applicable to the embodiment five, but also applicable to the embodiments three to four and the embodiments six to twelve, and also applicable to the embodiments three to twelve and any other modified embodiments, which will not be described herein. In addition, the embodiment is not only applicable to the above-mentioned embodiments in which the composite comprises the support column or the protruding structure, but also applicable to other embodiments in which the composite does not comprise the support column and / or the protruding structure, and also applicable to any other modified embodiments, as long as the thickness of the corresponding composite region of the composite can be reduced to reduce the rigidity to ensure the basic strength of the connecting structure and to enable the intermediate body and the substrate to be tightly welded, which will not be limited herein.

[0252] The intermediate body in the embodiment is not only limited to the above-mentioned solid structure, but also can be a porous structure. When the intermediate body is a high-density porous structure, and the thickness of the intermediate body in any local region in the above-mentioned rigidity-reduced region B1 is reduced to zero, the porosity of the porous structure as the intermediate body should be smaller than the size of the gap after the local region is milled.

[0253] In summary, the present application not only can ensure the strength of the entire connecting structure, but also can avoid the problem that the protruding structure and the substrate are not in good contact due to too large rigidity, thereby improving the welding efficiency between the non-porous bottom plate and the substrate.

[0254] It is worth mentioning that the size and shape of the gap between the non-porous bottom plate corresponding to the pocket structure and the substrate below in the embodiment can be designed according to the actual application, for example, adjusted according to the shape of the substrate or adjusted according to the specific application of the entire connecting structure, which will not be limited herein. It is worth mentioning that the pocket structure design in the embodiment is not only applicable to the embodiments three, four, five and ten with the support column and the protruding structure, but also applicable to other embodiments without the support column or the protruding structure, as long as a gap is left between the non-porous bottom plate (or the porous intermediate body) and the substrate to form a pocket, which will not be described herein. Of course, the pocket structure design in the embodiment is also applicable to any other modified embodiments of the embodiments with the non-porous bottom plate (or the porous intermediate body), which will not be described herein.

[0255] Embodiment twenty-two:

[0256] With reference to the above-mentioned Embodiment Three, Embodiment Four, Embodiment Five and Embodiment Ten, the present application not only sets a non-porous bottom plate between the porous surface structure and the substrate, and pre-manufactures a plurality of protruding structures on the bottom surface of the non-porous bottom plate, which are in contact with the top of the substrate, but also sets a plurality of support columns (for example, the support column 816b in Figure 3 Figure 7

[0257] If the number of support columns is too large, although the conduction current is increased, there are still some problems: (1) The support column generally corresponds to a protruding structure, and the number of support columns is increased, and the number of protruding structures is also increased, and if the number of protruding structures is too large, the welding uniformity and the bonding strength between the non-porous bottom plate and the substrate will be affected; (2) If the number of support columns is too large, it will also affect the appearance of the non-porous bottom plate after welding, because even if there is a porous surface structure above, but the porous surface structure has a certain thickness and has pores, the traces of the plurality of support columns can still be vaguely seen; therefore, the present application should not design too many support columns. In addition, increasing the diameter of the support column at a certain position can increase the current passing through, thereby increasing the welding strength, but the diameter of the support column cannot be increased blindly, because this will cause the indentation of the support column after welding to be more obvious, and at the same time, it will also make the rigidity of the entire structure too large, and the rigidity of the entire structure of the present application should not be too large.

[0258] Based on the above reasons, Embodiment Twenty-Two sets an auxiliary structure 2019 on the support column 2017 at the upper end of the non-porous bottom plate, as shown in Figure 28 The auxiliary structure 2019 is in conductive connection with the outer side of the support column 2017, so that most of the current flowing out of the electrode passes through the support column 2017 with the auxiliary structure 2019 in good electrical connection, which greatly reduces the surface damage of the porous surface structure due to resistance heat, and can enhance the current conduction effect, ensure sufficient welding strength, and at the same time, will not cause unnecessary indentation problems due to the increase in the number of support columns.

[0259] ​​For example, the support column 2017 is a solid structure. Alternatively, the auxiliary structure 2019 is a solid structure of a good conductor or a porous structure with high density; when the auxiliary structure 2019 is a porous structure, the density thereof is higher than that of the porous surface structure. In this embodiment, one or more auxiliary structures 2019 are arranged on each support column 2017.

[0260] As shown in Figure 28 , the auxiliary structure 2019 is a linear structure (e.g., a long strip or a round rod), and four linear auxiliary structures 2019 can form a cross shape. The auxiliary structure 2019 can also be a bent structure or a curved surface structure, and the present application does not limit the shape of the auxiliary structure 2019. The auxiliary structure 2019 can be arranged at any height position on the support column 2017, and the auxiliary structure 2019 can be arranged at any position on the lateral surface of the support column 2017. The auxiliary structure of the present application is applicable to any embodiment with a support column as described above, and the auxiliary structure can be located in the porous surface structure, between the porous surface structure and the non-porous bottom plate, or between the porous surface structure and the substrate. The present application does not limit the location of the auxiliary structure. Alternatively, based on embodiment twenty-one, the auxiliary structure 2019 is staggered with the reduced rigidity region B1 of the composite, that is, the auxiliary structure 2019 corresponds to the unchanged rigidity region A1 of the composite, as shown in Figure 28 .

[0261] As can be seen from the above, the auxiliary structure made of a conductive material is electrically connected with the support column to enhance the current conduction effect. The auxiliary structure 2019 can be connected with or disconnected from the non-porous bottom plate, and the auxiliary structure 2019 is connected with the porous surface structure. The non-porous bottom plate in this embodiment can be a non-hollow structure (the thickness of the composite does not change) in embodiments three, four, five, ten, etc., or a hollow structure (the thickness of the composite changes) or a pocket structure in embodiment twenty-one. The present application does not limit the design according to the actual application.

[0262] Preferably, the non-porous bottom plate, the porous surface structure, the support column, and the auxiliary structure are integrally formed, for example, by a 3D printing additive manufacturing process or a vapor deposition process.

[0263] In one example, in order to ensure the uniformity of welding between each support column on the non-porous bottom plate and the substrate, the auxiliary structures with the same structure shape and number are uniformly arranged on all the support columns on the non-porous bottom plate. This design has the best welding uniformity effect when the structure type, shape, and size of each support column are consistent.

[0264] In another example, in order to ensure the uniformity of the welding between each support column on the non-porous base plate and the base, but the structure type, shape and size of each support column of the non-porous base plate are not equal, the structure, number and size of the corresponding auxiliary structure of each support column are designed according to the specific circumstances of each support column, so as to finally ensure the consistency of the welding strength between each support column and the base and the rationality of the welding strength.

[0265] In summary, in the twenty-second embodiment, by additionally designing the conductive auxiliary structure on the support column, most of the current flowing out of the electrode is preferentially passed through the good conductive support column with the auxiliary structure, greatly reducing the surface damage caused by resistance heat of the porous surface structure, and enhancing the current conduction effect to ensure sufficient welding strength, and unnecessary indentation or excessive rigidity caused by increasing the number or diameter of the support column will not occur. The present application is not only applicable to the non-porous base plate (or porous structure) and the welding method between the base in the third embodiment to the twenty-second embodiment, but also applicable to other embodiments provided with support columns, and any deformation implementation manner thereof, and the present application does not make redundant description here.

[0266] Embodiment twenty-three:

[0267] The welding method between the non-porous base plate (or porous structure) in the third embodiment to the twenty-second embodiment and the base in the above-mentioned twenty-second embodiment is mainly resistance welding method, but the hollow design of the non-porous base plate of the present application is not limited to resistance welding method, but also can be applied to the laser welding method in the twenty-third embodiment to realize the firm connection between the porous surface structure, the intermediate body (i.e. the non-porous base plate) and the base. Specifically, the porous surface structure and the non-porous base plate form a composite body, and the composite body and the base are connected by laser welding connection between the non-porous base plate and the base. Among them, there are multiple welding points between the non-porous base plate and the base, and the position of the welding point is freely selected according to the application needs.

[0268] When the non-porous base plate in the present embodiment adopts the hollow structure design in the twenty-first embodiment, the non-porous base plate is divided into a welding point part, a solid area and a hollow area, and the solid area serves as a connecting structure of each laser welding area. The specific content of the solid area and the hollow area in the present embodiment can be referred to the twenty-first embodiment, which will not be repeated here. The present application does not make specific limitation on the position, welding position, shape (such as changing to curved surface, arc surface, etc.), size, etc. of the contact surface between the non-porous base plate and the base, which can be designed according to the actual application situation.

[0269] Embodiment twenty-four:

[0270] As Figure 29As shown, based on the first / second embodiment, the following improvement can also be made: the protrusions of the non-porous or low porosity area in the first and second embodiments are removed and transformed into a non-protrusion structure (non-porous or low porosity) intermediate plate structure 272, and the base 273 is changed into a base complex of a base body 273 and another base protrusion structure 272A with protrusions on the top surface of the base body 273, which is pre-connected (such as resistance welding / laser welding) with the base body 273, and the protrusions of the base protrusion structure 272A are towards the side of the intermediate plate structure 272, that is, the protrusions of the base protrusion structure 272A are in contact with the bottom surface of the intermediate plate structure 272 in the complex. The surface complex formed by the porous surface structure 271 and the intermediate plate structure 272, and the base complex formed by the base protrusion structure 272A and the base body 273, are compressed between the positive electrode 274 and the negative electrode 275. When current is passed, the current flows through the porous surface structure 271, the intermediate plate structure 272, and the protrusions of the base protrusion structure 272A, and resistance heat is generated due to the contact resistance to heat the protrusions of the base protrusion structure 272A and the bottom of the intermediate plate structure 272 to a molten or plastic state, and finally achieve the solidification effect between the intermediate plate structure 272 and the base protrusion structure 272A, so that the surface complex and the base complex are tightly combined together, and the number 27a in the figure represents the welding point. The base body 273 and the base protrusion structure 272A can be provided separately or simultaneously; when the base body 273 and the base protrusion structure 272A are provided separately, they are pre-connected together; when the base body 273 and the base protrusion structure 272A are provided simultaneously, the base protrusion structure 272A can be formed on the top surface of the base body 273 towards the side of the intermediate plate structure 272. In another example, the surface complex still adopts the structure 272 with protrusions in the first and second embodiments, the protrusion structure of which is towards the side of the base body 273, and the protrusion structure (not shown, refer to the above embodiment) of the intermediate plate structure 272 is arranged staggered with the protrusions of the base protrusion structure 272A above the base, and finally the surface complex and the base complex can also be tightly combined together. The above improvement of this embodiment is not only limited to the basis of the first embodiment, but also applicable to any of the above embodiments, and the present application will not be repeated here. The base protrusion structure of this embodiment twenty-four is not only limited to contact with the intermediate body of the complex (such as the intermediate plate of the first embodiment), but also can contact with the porous surface structure of the complex, for example, when applied to the eleventh embodiment, the protrusions of the base protrusion structure 272A are arranged staggered with the protrusion structure 1112a of the complex, and the protrusions of the base protrusion structure 272A can be in contact with the porous surface structure 1111 of the complex or the protrusions of the base protrusion structure 272A are in contact with the support column 1116a of the complex, and other contents refer to this embodiment, which will not be repeated here.The substrate protrusion structure of the present application is arranged on a substrate surface connecting layer combined with the substrate body, or the substrate protrusion structure is directly arranged as a substrate body surface structure (such as by traditional machining or precision casting / precision forging), and the substrate surface connecting layer can be omitted.

[0271] As shown in Figure 30 the same as the first embodiment, a first composite formed by pre-connection of the first porous surface structure 281-1 and the first non-porous bottom plate 282-1 is arranged on one side of the top of the substrate 283, the first composite is arranged between the positive electrode 24 and the top surface of the substrate 283, and at least a portion of the top of the first porous surface structure 281-1 is in contact with the positive electrode 24; a plurality of first protrusion structures are pre-manufactured at the bottom of the first non-porous bottom plate 282-1, and the first protrusion structures are in contact with the top of the substrate 283. In addition, a second composite formed by pre-connection of the second porous surface structure 281-2 and the second non-porous bottom plate 282-2 is arranged on one side of the bottom of the substrate 283, the second composite is arranged between the bottom surface of the substrate 283 and the negative electrode 285, and at least a portion of the bottom of the second porous surface structure 281-2 is in contact with the negative electrode 285. The second composite has the same structure as the first composite and is axially symmetrical about the substrate 283. According to the principle of the first embodiment, the first composite and the second composite are simultaneously resistance-welded to the upper and lower surfaces of the substrate 283, respectively, to realize the connection of the first composite, the second composite, and the substrate; or, according to the principle of the first embodiment, the first composite is resistance-welded to the upper surface of the substrate first, and then the second composite is resistance-welded to the lower surface of the substrate on which the first composite is already welded, to finally realize the complete connection of the first composite, the second composite, and the substrate; or, according to the principle of the first embodiment, the second composite is resistance-welded to the lower surface of the substrate first, and then the first composite is resistance-welded to the upper surface of the substrate on which the second composite is already welded, to finally realize the complete connection of the first composite, the second composite, and the substrate. This deformation is also applicable to any one of the above-mentioned embodiments one to twenty-three and their deformations, and the present application does not repeat the description here.

[0272] Embodiment twenty-five:

[0273] As shown in Figures 32-33In combination with the above, the present embodiment provides an artificial implant prosthesis, preferably an orthopedic prosthesis; any one or more of the connection structures and methods in Embodiments 1 to 24 and their respective variant examples can be used. The prosthesis body corresponds to the base in the connection structure, and at least part of the surface of the prosthesis body serves as the connection area, which is connected to the composite 2 comprising the intermediate body and the porous surface structure, and the connection between the intermediate body and the base (projection welding resistance welding and / or spot welding resistance welding) achieves the connection between the porous surface structure and the base, forming a surface covering of the connection area on the prosthesis.

[0274] In combination with the structures and methods of Embodiments 1 to 24 or their variant examples, a prosthesis shell is provided, the outer layer is a porous surface structure, and the inner layer is an intermediate body, which is in contact with and fixed to the connection area of the prosthesis body by resistance welding, achieving the connection between the porous surface structure and the prosthesis body, forming a surface covering of the connection area on the prosthesis body, thereby applying to various artificial implant prostheses such as other types of orthopedic prostheses, artificial joints, etc., such as femoral stem, acetabular cup, femoral condyle, tibial plateau, etc., as described in subsequent Embodiments 25 to 28.

[0275] Taking an artificial hip joint as an example. The artificial hip joint comprises a femoral stem, a femoral ball head (not shown in the figure), an acetabular cup, and a liner (not shown in the figure), all of which are prostheses made of implantable medical materials, such as titanium alloy, cobalt-chromium-molybdenum alloy, stainless steel, polymer such as ultra-high molecular weight polyethylene, ceramic, etc., and not limited thereto.

[0276] As shown in Figure 32 , the femoral stem 3 comprises a head 301, a neck 302, and a stem body 303, which can be integral or assembled. The lower part of the stem body 303 is inserted into the femoral medullary cavity. The surface of the stem body 303, preferably the surface of the upper part of the stem body 303, is a porous structure; the lower part of the stem body 303 can have a smooth surface. For example, the acetabular cup is a partial spherical (such as a hemispherical) dome shape, which is fixedly connected with the acetabular fossa. The outer peripheral surface of the acetabular cup preferably uses a porous structure.

[0277] Based on the structures and methods of Embodiments 1 to 24 or their variant examples, the stem body 303 of the femoral stem 3 corresponds to the base in the connection structure; the composite comprising the intermediate body (such as a non-porous bottom plate, or a porous structure with a low porosity area, etc., which needs to be determined according to different embodiments) and the porous surface structure forms a stem body shell 2, which covers the connection area of the stem body 303a (upper part) and is combined with the base and covers the connection area by welding, achieving the combination of the porous surface structure 201 and the base and the covering of the connection area, obtaining the porous structure on the stem body 303 of the femoral stem.

[0278] As shown in Figure 33As shown, the inner handle body 303 corresponds to the base of the connecting structure, the outer porous structure 2201 corresponds to the porous surface structure of the connecting structure, and the intermediate body (for example, the non-porous bottom plate 2202 of the hollow design as described in Embodiment Twenty-One) is arranged between the porous structure 2201 and the handle body 303. The porous structure 2201 and the non-porous bottom plate 2202 form a composite, and the handle body 303 is compressed between the positive electrode 2204 and the negative electrode 2205. When an electric current is passed, the electric current flows through the porous structure 2201, the non-porous bottom plate 2202, and the contact surface and adjacent area on the outer side of the handle body 303, generating resistance heat to heat the handle body 303 to a molten or plastic state, so that the non-porous bottom plate 2202 and the handle body 303 form a combined body, achieving the solid connection between the non-porous bottom plate 2202 and the handle body 303, and tightly combining the composite and the handle body 303 together. Among them, the non-porous bottom plate 2202 between the handle body 303 and the porous structure 2201 is hollow, and a plurality of protruding structures 2202-1 are pre-manufactured at the bottom of the non-porous bottom plate 2202 and in contact with the handle body 303. A plurality of support columns (not shown in the figure) can be arranged on the surface of the non-porous bottom plate 2202 near the side of the porous structure 2201, and the support columns are arranged between the non-porous bottom plate 2202 and the positive electrode. The other contents of the femoral stem suitable for Embodiment Twenty-One are not repeated here.

[0279] In this example, the connecting region of the femoral stem 3 includes the inner, rear, outer, and front surfaces of the upper part of the handle body 303a. By way of example, the handle body shell 2 can include two shell pieces, one shell piece corresponding to a part of the inner surface, the rear surface, and a part of the outer surface of the upper part of the handle body 303a, and the other shell piece corresponding to the remaining part of the inner surface, the front surface, and the remaining part of the outer surface of the upper part of the handle body 303a. After the two shell pieces are folded, they are respectively in contact with and welded to the corresponding positions of the connecting region of the upper part of the handle body. The inner layer of each shell piece is an intermediate body, and the outer layer is all or most of the porous surface structure.

[0280] Embodiment Twenty-Six:

[0281] In this embodiment, the porous structure of the outer periphery of the acetabular cup 300a can be similarly implemented using the structures and methods of Embodiments One to Twenty-Four or their variant examples. As shown in the figure, the acetabular cup 300a is a hollow structure, and the porous structure of the outer periphery of the acetabular cup 300a is arranged on the outer surface of the acetabular cup 300a. The acetabular cup 300a is arranged in the acetabular cavity of the hip joint, and the porous structure of the outer periphery of the acetabular cup 300a is in contact with the acetabular cavity of the hip joint. The acetabular cup 300a is arranged in the acetabular cavity of the hip joint, and the porous structure of the outer periphery of the acetabular cup 300a is in contact with the acetabular cavity of the hip joint. Figure 34As shown, the outer shell of the acetabular cup is provided with an inner cup body corresponding to the base 2403 of the connecting structure, and the outer porous structure 2401 corresponds to the porous surface structure of the connecting structure. An intermediate body (such as the non-porous bottom plate 2402 of the hollow design described in Embodiment Twenty-one) is arranged between the porous structure 2401 and the base 2403. Due to the composite formed by the porous structure 2401 and the non-porous bottom plate 2402 (which is formed on the outer side of the cup body and covers the connecting area of the cup body), and the base 2403 is compressed between the positive electrode 2404 and the negative electrode 2405. When the current is passed, the current flows through the porous structure 2401, the non-porous bottom plate 2402, and the contact surface and adjacent area on the outer side of the base 2403, generating resistance heat to heat it to a molten or plastic state, so that the non-porous bottom plate 2402 and the base 2403 form a combination, achieving the solid connection between the non-porous bottom plate 2402 and the base 2403, and the composite and the base 2403 are tightly combined together, thus forming a cover for the connecting area of the cup body, and obtaining the porous structure on the outer peripheral surface of the acetabular cup (outer shell). Among them, the non-porous bottom plate 2402 is hollow between the base 2403 and the porous structure 2401, and a plurality of protruding structures are pre-manufactured at the bottom of the non-porous bottom plate 2402, which are in contact with the cup body. A plurality of support columns 2407 are arranged on the surface of the non-porous bottom plate 2402 close to the side of the porous structure 2401, and the support columns 2407 are arranged between the non-porous bottom plate 2402 and the positive electrode 2404. The cup body of the acetabular cup of the application and the composite (or the intermediate body contained therein) are adapted at the contact and connecting parts. The other contents of the acetabular cup suitable for Embodiment Twenty-one are not repeated here, and the specific contents of the acetabular cup suitable for other embodiments are not repeated here.

[0282] In some examples, the cup body of the acetabular cup is made by forging, casting or machining, etc., preferably in a solid structure, which is easy to process and has high strength; or the cup body can also be a high-density porous structure; the intermediate body can be solid or a porous structure with higher density than the porous surface structure; when the cup body and the intermediate body both use porous structures, the density of the intermediate body is between the density of the cup body and the density of the porous surface structure. The intermediate body and the porous surface structure are preferably realized by 3D printing additive manufacturing process, which can well control the porosity, etc. to meet the design requirements. The cup body and the intermediate body are effectively connected by resistance welding method, which avoids the problem of significant decrease in overall strength caused by current hot pressing process (such as infiltration welding process) and the like.

[0283] In a specific example, the entire outer surface of the cup body can be taken as one connection area, and a whole composite is arranged to be in contact with the connection area and welded through the contained intermediate body. Alternatively, the entire outer surface of the cup body can be divided into multiple independent connection areas; multiple composites (each can be in the form of a sheet or other shapes, which are adapted to the dome-shaped outer shell) are arranged to be in contact with the connection areas respectively and welded through the respective intermediate bodies. The inner layer of each composite is the intermediate body, and the outer layer is all or mostly the porous surface structure.

[0284] Embodiment twenty-seven:

[0285] The proximal end of the tibia and the distal end of the femur form the knee joint, and the surface where the tibia and the distal end of the femur contact is the tibial plateau. The tibial plateau is an important load-bearing structure of the knee joint. In the implantation of a prosthesis, the component used to replace the bone on the femoral side is called the femoral condyle, and the component used to replace the bone on the tibial side is called the tibial plateau. There is a polyethylene spacer between the femoral condyle and the tibial plateau, which serves to reduce wear and restore the function of the knee joint.

[0286] As shown in Figure 35 , the tibial plateau is in the form of a T-shaped structure, including an upper tibial tray 300-1 and a lower support portion 300-2. The lower surface of the tibial plateau 300b uses a porous structure, which can be similarly implemented using the structures and methods of embodiments one to twenty-four or their variant examples.

[0287] The lower surface of the tibial tray 300-1 corresponds to the porous surface structure 2501 of the connecting structure, the upper end of the tibial tray 300-1 corresponds to the base 2503 of the inner side of the connecting structure; the intermediate body (for example, the non-porous bottom plate 2502 of the hollow design described in Embodiment Twenty-one) is arranged between the porous structure 2501 and the base 2503. Due to the composite of the porous structure 2501 and the non-porous bottom plate 2502, and the base 2503 is compressed between the positive electrode 2504 and the negative electrode 2505. When the current is passed, the current flows through the porous structure 2501, the non-porous bottom plate 2502 to the contact surface and the adjacent area at the distal end of the base 2503, generates resistance heat and heats it to a molten or plastic state, so that the non-porous bottom plate 2502 and the base 2503 form a combination, realize the solid connection between the non-porous bottom plate 2502 and the base 2503, and make the composite and the base 2503 tightly combined together. Among them, the non-porous bottom plate 2502 is hollow between the base 2503 and the porous structure 2501, and a plurality of protruding structures are pre-manufactured at the bottom of the non-porous bottom plate 2502, the protruding structures are in contact with the base 2503, and a plurality of support columns 2507 are arranged on the surface of the non-porous bottom plate 2502 close to the side of the porous structure 2501, the support columns 2507 are between the non-porous bottom plate 2502 and the positive electrode 2504. The composite of the porous surface structure and the intermediate body in the present example is formed at the lower end of the tibial tray and covers the connecting area of the tibial tray. The other contents of the tibial platform applicable to Embodiment Twenty-one are not repeated here. The specific contents of the tibial platform applicable to other embodiments are not repeated here.

[0288] Embodiment Twenty-eight:

[0289] The artificial knee joint prosthesis includes a femoral condyle, a tibial tray, and a spacer arranged between the two, and a patellar prosthesis. The femoral condyle is connected to the distal end of the femur, and the tibial tray is connected to the proximal end of the tibia. The spacer component is connected with the tibial tray component, and the femoral condyle is in contact with the spacer. The lower part of the spacer is in contact with the upper surface of the tibial platform, and the outer convex surface of the femoral condyle is in contact with the upper part of the spacer and the articular surface of the patellar prosthesis, which can realize flexion, sliding, rotation and other activities within a specified range.

[0290] Among them, the outer convex surface of the femoral condyle body is usually very smooth to reduce the wear between it and the spacer; while the inner concave surface of the femoral condyle body matches and contacts the bone cutting section surface formed by the distal end of the femur, and thus it is preferred to form a porous structure on the inner concave surface (such as the inner condyle fixing surface) of the femoral condyle body, which helps bone ingrowth and realizes the close combination of the prosthesis and the bone tissue, and reduces the risk of joint replacement surgery failure caused by postoperative loosening of the prosthesis. The porous structure of the inner surface of the femoral condyle can be similarly implemented using the structures and methods of Embodiments One to Twenty-four or their variant examples.

[0291] In one example, such as Figure 31 In the inner surface of the femoral condyle (partially shown), from the outside to the inside, there is a porous structure 2601, an intermediate body (e.g., a non-porous base plate 2602 with a hollow design as described in Embodiment 21), and a base 2603, which are connected in sequence. The medial condyle of the femoral condyle corresponds to the base 2603 of the connecting structure, and the fixation surface of the medial condyle of the femoral condyle uses the porous surface structure 2601. The composite formed by the porous structure 2601 and the non-porous base plate 2602, as well as the base 2603, are pressed between the positive and negative electrodes. When an electric current is applied, it flows through the porous structure 2601, the non-porous base plate 2602, and up to the contact surface and adjacent area with the outer side of the base 2603, generating resistance heat to heat it to a melting or plastic state. This causes the non-porous base plate 2602 and the base 2603 to form a composite, achieving a solid connection between them and ensuring a tight bond between the composite and the base 2603. The non-porous base plate 2602 is perforated between the base 2603 and the porous structure 2601. Multiple protrusions are pre-fabricated on the bottom of this perforated non-porous base plate 2602, contacting the base 2603. Several support pillars 2607 are provided on the surface of the non-porous base plate 2602 near the porous structure 2601. In this example, the composite formed by the porous surface structure and the intermediate body is formed on the concave surface of the femoral condyle and covers the connection area of ​​the femoral condyle. Further details regarding the applicability of the femoral condyle to Embodiment 21 are omitted here. Specific details regarding the applicability of the femoral condyle to other embodiments are also omitted here. Similarly, the patellar prosthesis can also utilize the structure and method of any of the above embodiments or their variations, with the addition of a porous structure to its surface in contact with the bone.

[0292] The embodiments 1 to 24 or their variations are not limited to the above-mentioned prosthesis examples, but can also be applied to such as spinal prostheses, ankle joints, shoulder joints, elbow joints, finger joints, toe joints, facet joints, temporomandibular joints, wrist joints, artificial tooth roots (e.g., artificial tooth roots are implanted into the alveolar bone, and then porcelain teeth are installed on top of the artificial tooth roots), etc. The specific structures and principles are as described above, and will not be repeated here.

[0293] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A prosthesis, characterized in that, Include: A composite comprising a pre-connected or integrally formed porous surface structure and an intermediate; the porous surface structure is designed to contact bone tissue. A substrate for forming the prosthesis body, wherein at least a portion of the surface of the prosthesis body serves as a connection area for connection with the composite. The composite body includes a first composite region corresponding to a first stiffness; the remaining composite regions in the composite body other than the first composite region include at least a second composite region corresponding to a second stiffness. The first stiffness is less than the second stiffness; The substrate at the connection area is connected to the intermediate body and / or porous surface structure at the first composite area and the intermediate body and / or porous surface structure at the second composite area, respectively; the composite body is made into close contact with the substrate by setting a composite area with reduced stiffness value; The first composite region has a porous surface structure and no intermediate body, forming a hollow structure; the second composite region has a porous surface structure and an intermediate body. Alternatively, both the first composite region and the second composite region are provided with porous surface structures and intermediate bodies, and the thickness of the intermediate body in the first composite region is less than the thickness of the intermediate body in the second composite region. Alternatively, both the first composite region and the second composite region are provided with porous surface structures and intermediate bodies. A pocket structure is formed based on the gap between the side of the intermediate body facing the substrate in the first composite region and the substrate, and the thickness of the porous surface structure in the first composite region is less than the thickness of the porous surface structure in the second composite region; there is no porous surface structure in the gap. The intermediate body is the part of the intermediate located between the porous surface structure and the substrate.

2. The prosthesis as described in claim 1, characterized in that, The thickness of the composite in the first composite region is less than the thickness of the composite in the second composite region.

3. The prosthesis as described in claim 1, characterized in that, The porous surface structure in the composite is referred to as the first porous structure; The intermediate is a solid structure, or the intermediate is a second porous structure and at least a portion of the second porous structure has a higher density than the first porous structure.

4. The prosthesis as described in claim 1, characterized in that, The substrate at the connection area includes a surface connection layer, which is pre-connected to or integrally formed with the substrate body; the surface connection layer is located between the composite and the substrate body; the surface connection layer includes a substrate protrusion structure, the protrusions of which contact and are fixedly connected with the intermediate body and / or porous surface structure at the first composite area and the intermediate body and / or porous surface structure at the second composite area. Alternatively, the substrate at the connection area may have a substrate protrusion structure on the surface near the composite, and the protrusions of the substrate protrusion structure may contact and be fixedly connected with the intermediate body and / or porous surface structure at the first composite area and the intermediate body and / or porous surface structure at the second composite area.

5. The prosthesis as described in any one of claims 1 to 4, characterized in that, When the base at the connection area is connected to the intermediate body at the first composite area and / or the intermediate body at the second composite area, the side of the intermediate body body near the base is a plane, an arc, or a curved surface, or a protruding structure is provided on the side of the intermediate body body near the base.

6. The prosthesis according to any one of claims 1 to 4, characterized in that, The prosthesis includes any of the following: The femoral stem of the hip joint, the acetabular cup of the hip joint, the tibial plateau of the knee joint, the femoral condyle of the knee joint, the patella, the spinal fusion device, the small plane joint of the vertebral intervertebral disc, the ankle joint, the shoulder joint, the elbow joint, the finger joint, the toe joint, the artificial intervertebral disc, the temporomandibular joint, and the wrist joint.

7. The prosthesis as described in claim 1, characterized in that, The substrate is connected to the intermediate and / or porous surface structure in the first composite region and the intermediate and / or porous surface structure in the second composite region by laser welding and / or resistance welding.

8. A method for manufacturing a prosthesis, used to fabricate a connecting structure comprising a porous surface structure and a substrate in the prosthesis according to any one of claims 1 to 6, characterized in that, This method includes the following procedures: Substrates and composites are provided separately; The porous surface structure is pre-connected to or integrally formed with an intermediate to form the composite; the porous surface structure is used to contact bone tissue; the composite includes a first composite region corresponding to a first stiffness, and the remaining composite regions in the composite, excluding the first composite region, include at least a second composite region corresponding to a second stiffness; the first stiffness is less than the second stiffness. The substrate is used to form the prosthesis body, and at least a portion of the surface of the prosthesis body serves as a connection area for connection with the composite. The substrate at the connection area is in contact with the intermediate and / or porous surface structure at the first composite area and the intermediate and / or porous surface structure at the second composite area, respectively. The first polarity electrode is in conductive contact with the composite; the substrate is in conductive contact with the second polarity electrode, forming a current loop; The first composite region and the second composite region of the composite are respectively resistively welded to the substrate of the connecting region to achieve the connection between the composite and the substrate; the composite is made to be in close contact with the substrate by setting a composite region with reduced stiffness value. The first composite region has a porous surface structure and no intermediate body, forming a hollow structure; the second composite region has a porous surface structure and an intermediate body. Alternatively, both the first composite region and the second composite region are provided with porous surface structures and intermediate bodies, and the thickness of the intermediate body in the first composite region is less than the thickness of the intermediate body in the second composite region. Alternatively, both the first composite region and the second composite region are provided with porous surface structures and intermediate bodies, and the gap between the side of the intermediate body facing the substrate in the first composite region and the substrate forms a pocket structure between the intermediate body and the substrate, and the thickness of the porous surface structure in the first composite region is less than the thickness of the porous surface structure in the second composite region; there is no porous surface structure in the gap.

9. The method as described in claim 8, characterized in that, When the resistance welding is projection welding, the first polar electrode is an electrode with a continuous plane, arc or curved surface on the contact surface, or multiple electrode units. The second polarity electrode is an electrode with a continuous planar, arc-shaped, or curved surface on the contact surface, or multiple electrode units; When the resistance welding is spot welding, the first polarity electrode and / or the second polarity electrode are multiple electrode units; The welding position is moved from the current welding position to the next welding position by moving any one or more of the following components: a first polarity electrode, a second polarity electrode, and a composite and substrate that have been welded at at least one contact position. When the first polar electrode comes into contact with the composite, it is in conductive contact with the porous surface structure and / or intermediate.

10. The method as described in claim 9, characterized in that, When the first polar electrode is divided into multiple electrode units, the electrode units are inserted into pre-made gaps in the porous surface structure, and the electrode units are close to the intermediate body, so that the inserted electrode units make conductive contact with the intermediate body or make the inserted electrode units make conductive contact with the intermediate body through the porous surface structure.

11. The method as described in claim 10, characterized in that, The multiple electrode units of the first polarity electrode are connected in parallel to the connection terminal of the power supply, including: one end of the multiple electrode units is connected in parallel to the same planar electrode, and the planar electrode is connected to the power supply terminal; or, one end of the multiple electrode units is directly connected in parallel to the power supply terminal. The other end of the plurality of electrode units passes through the surface of the porous surface structure and penetrates into the surface of the intermediate or the interior of the intermediate, so that the inserted electrode unit makes conductive contact with the intermediate, and the lateral fit gap between the electrode unit and the porous surface structure is not less than zero, so that the electrode unit and the porous surface structure are completely non-contact or have no pressure fit contact.

12. The method as described in claim 9, characterized in that, At least a portion of the pores within the porous surface structure are filled with powdered conductive material, filamentous conductive material, or mesh conductive material, or injected with molten conductive medium, or filled with a conductive medium whose melting point is lower than that of the substrate and / or the melting point of the porous surface structure, and the conductive medium is molten at high temperature.

13. The method as described in claim 9, characterized in that, At least a portion of the surface of the porous surface structure is covered with a deformable conductive medium in the form of a solid thin film, the deformable conductive medium being located between the first polar electrode and the porous surface structure; And / or, at least a portion of the porous surface structure is coated with a conductive medium between its surface and the first polar electrode.

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