A board chip air-cooled liquid-cooled coupled heat dissipation structure

Abstract

The present invention discloses a heat dissipation structure for air-cooled and liquid-cooled coupling of a chip on a board, comprising a heat dissipation body, on which a plurality of heat dissipation fins are arranged, the heat dissipation body is a hollow profile structure, a liquid inlet is arranged at the lower left front portion of the heat dissipation body, and a liquid outlet is arranged at the upper left rear portion of the heat dissipation body; a heat dissipation fan is arranged at one side of the heat dissipation body, and one or two heat dissipation fans are arranged; lugs are arranged at both sides of the heat dissipation body, a cross bar is connected to one side of the lug, a longitudinal bar is arranged at one end of the cross bar, a U-shaped seat is arranged at the lower end of the longitudinal bar, and the U-shaped seats on both sides are clamped on both sides of the board; the heat dissipation body of the air-cooled and liquid-cooled coupling heat dissipation structure for the chip on the board is provided with one or more groups according to the heat dissipation area, and when the heat dissipation body is provided with multiple groups, adjacent heat dissipation bodies are connected by connecting pieces. The present invention couples air cooling and liquid cooling in a heat dissipation structure, and flexibly arranges the heat dissipation structure above the chip that needs to be cooled, effectively solving the heat dissipation problem of the chip on the board.

Description

Technical Field

[0001] The invention belongs to the technical field of radiators, and in particular relates to an air-cooled and liquid-cooled coupled heat dissipation structure for a board chip. Background Art

[0002] The heat dissipation of the board chip directly affects the performance of the board, so how to provide these boards with an efficient and low-energy heat dissipation structure is an urgent problem to be solved. The chips on the network cards, Raid cards, GPUs and other boards currently used in servers usually use traditional heat sinks and dissipate heat through server fans. The fan turbine effect is used to increase the replacement of cold air to improve the heat dissipation efficiency, but the profile inserts of the fan bottom support seat are usually rectangular or sunflower-shaped, which are in full contact with the heat-generating electronic components, and the circulation of the bottom air fluid is insufficient, resulting in cold air replacement and insufficient contact with the profile. The fan hood structure affects the installation and reduces the fan installation diameter, affecting the safety protection strength, resulting in poor energy efficiency.

[0003] Liquid-cooled radiators are also called water-cooled radiators. Cold water pipes are set inside the heat dissipation body profile to achieve the purpose of cooling through cold water heat transfer. However, the distribution of cold water pipes in the heat dissipation body profile is limited, resulting in slow heat transfer at the edge of the profile, making it difficult to achieve the expected energy efficiency effect. In addition, whether it is an existing air-cooled radiator or a liquid-cooled radiator, the radiator is currently fixed above the commonly used chip to dissipate heat for the chip with large heat dissipation, which cannot meet the heat dissipation requirements of other chips on the board. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a board chip air-cooling and liquid-cooling coupled heat dissipation structure to solve the heat dissipation problem of the chip on the board.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is:

[0006] A card chip air-cooling and liquid-cooling coupled heat dissipation structure comprises a heat dissipation body, the heat dissipation body is an H-shaped structure, a plurality of heat dissipation fins are arranged on the heat dissipation body, the heat dissipation body is a hollow profile structure, the hollow structure extends to the inside of the heat dissipation fins, and a bottom plate is arranged at the lower part of the heat dissipation body; a liquid inlet is arranged at the lower left front part of the heat dissipation body, a liquid inlet pipe is connected to the liquid inlet, a liquid outlet is arranged at the upper left rear part of the heat dissipation body, a liquid outlet is connected to the liquid outlet, and the liquid inlet pipe and the liquid outlet pipe are connected to a circulation pump (not shown in the figure); a heat dissipation fan is arranged on one side of the heat dissipation body, and one or two heat dissipation fans are arranged. When there is one, it is installed on the upper or lower part of the heat dissipation body, and the wind direction blows toward the chip or away from the chip. When there are two heat dissipation fans, they are installed symmetrically on both sides of the heat dissipation body, and the wind directions of the two heat dissipation fans blow toward the chip or away from the chip at the same time; lugs are provided on both sides of the heat dissipation body, a cross bar is connected to one side of the lug, a longitudinal bar is connected to one end of the cross bar, a U-shaped seat is provided at the lower end of the longitudinal bar, and the U-shaped seats on both sides are clamped on both sides of the board; the heat dissipation body of the air-cooled and liquid-cooled coupled heat dissipation structure of the board chip is provided with one or more groups according to the heat dissipation area. When multiple groups of heat dissipation bodies are provided, adjacent heat dissipation bodies are connected by connecting pieces.

[0007] As a further optimization of the present technical solution, a plurality of partitions are provided on the bottom plate, and the partitions on the bottom plates on both sides are arranged alternately front to back, so that the coolant circulates alternately left to right inside the heat dissipation body, thereby extending the travel of the coolant in the heat dissipation body, thereby extending the heat exchange time of the coolant and enhancing the heat dissipation effect of the radiator.

[0008] As a further preferred embodiment of the present technical solution, U-shaped card plates are symmetrically provided on both sides of the partition, a card slot is formed between the two U-shaped card plates, the partition is installed inside the card slot, a wavy sealing strip is provided inside the U-shaped card plate, the front end of the sealing strip extends into the card slot, and the wavy sealing strip forms a multi-level seal on the partition, thereby ensuring the sealing effect between the partition and the heat dissipation body and avoiding the cross-flow of the coolant.

[0009] As a further preferred embodiment of the present technical solution, a telescopic sleeve is provided on the outside of the cross bar, and a first adjusting bolt is threadedly connected to the telescopic sleeve for adjusting the lateral position of the heat dissipation body. A sleeve is provided at the end of the cross bar, and the sleeve is slidably connected to the longitudinal rod. A second adjusting bolt is threadedly connected to one side of the sleeve, and the end of the second adjusting bolt is abutted against the longitudinal rod for adjusting the height of the heat dissipation body.

[0010] As a further preferred embodiment of the present technical solution, a limiting end plate is provided at the upper end of the longitudinal rod to limit the adjustment range of the sleeve, thereby preventing the sleeve from slipping off the upper end of the longitudinal rod.

[0011] As a further optimization of the technical solution, a plurality of tube clamps are provided on the upper part of the liquid inlet. The tube clamps are U-shaped structures, one side of the tube clamps is fixedly connected to the heat dissipation body, and the liquid inlet pipe is connected to the liquid inlet and clamped inside the tube clamp, thereby enhancing the aesthetics of the liquid inlet pipe and avoiding the liquid inlet pipe being placed on the board chip.

[0012] As a further optimization of the present technical solution, horizontal bars are fixedly connected on both sides of the lower part of the heat dissipation body, a number of pins are integrally formed on the horizontal bars, a number of air guide plates are provided between the horizontal bars on both sides, pin holes are provided at both ends of the air guide plates, and the pins are interference connected with the pin holes. When the space above the chip is small or not suitable for installing the heat dissipation structure, the heat dissipation mechanism can be installed on one side of the chip, and the angle of the air guide plate can be adjusted to dissipate heat to the chip. The interference fit between the pins and the pin holes avoids the change of the air guide angle when the heat dissipation structure is working, thereby ensuring the heat dissipation effect of the chip.

[0013] As a further optimization of the present technical solution, the upper part of the U-shaped seat is rotatably connected to a fixed shaft, and a plurality of eccentric wheels are fixedly connected to the fixed shaft, and when the eccentric wheels are pressed against the upper surface of the board, the large diameter outer edge of the eccentric wheels abuts against the board; connecting rods are fixedly connected to both ends of the fixed shaft, and the connecting rods on both sides are connected by pressing rods; when installing the heat dissipation structure, the U-shaped seats on both sides are clamped on the board, and the pressing rod is lifted upward so that the large diameter outer edge of the eccentric wheel abuts against the board, and the U-shaped seat can be quickly installed.

[0014] As a further preferred embodiment of the present technical solution, a buffer pad is provided at the bottom of the U-shaped seat, and the eccentric wheel is made of plastic, thereby preventing the U-shaped seat from damaging the board and card, while ensuring the stability of the connection between the U-shaped seat and the board and card.

[0015] As a further optimization of the technical solution, a buckle is provided on one side of the longitudinal rod, and a notch is provided on one side of the buckle. After the pressing rod is lifted, it is snapped into the buckle, further ensuring the stability of the connection between the U-shaped seat and the board.

[0016] The beneficial effects of the present invention are:

[0017] 1) The present invention couples air cooling and liquid cooling in a heat dissipation structure, and flexibly arranges the heat dissipation structure above the chip that needs heat dissipation, thereby effectively solving the heat dissipation problem of the board chip.

[0018] 2) A plurality of partitions are arranged on the bottom plate, and the partitions on the bottom plates on both sides are arranged in an alternating manner, so that the coolant circulates alternately left and right inside the heat dissipation body, thereby extending the travel of the coolant in the heat dissipation body, thereby extending the heat exchange time of the coolant and enhancing the heat dissipation effect of the radiator.

[0019] 3) U-shaped card plates are symmetrically arranged on both sides of the partition, and a card slot is formed between the two U-shaped card plates. The partition is installed inside the card slot. A wavy sealing strip is arranged inside the U-shaped card plate, and the front end of the sealing strip extends into the card slot. The wavy sealing strip forms a multi-level seal for the partition, thereby ensuring the sealing effect between the partition and the heat dissipation body and avoiding the cross-flow of the coolant.

[0020] 4) A telescopic sleeve is provided on the outside of the crossbar, and a first adjusting bolt is threadedly connected to the telescopic sleeve for adjusting the lateral position of the heat dissipation body. A sleeve is provided at the end of the crossbar, and the sleeve is slidably connected to the longitudinal rod. A second adjusting bolt is threadedly connected to one side of the sleeve, and the end of the second adjusting bolt is abutted against the longitudinal rod for adjusting the height of the heat dissipation body.

[0021] 5) A limit end plate is provided at the upper end of the longitudinal rod to limit the adjustment range of the sleeve and prevent the sleeve from slipping off the upper end of the longitudinal rod.

[0022] 6) A number of tube clamps are provided on the upper part of the liquid inlet. The tube clamps are U-shaped structures. One side of the tube clamp is fixedly connected to the heat dissipation body. After the liquid inlet pipe is connected to the liquid inlet, it is clamped inside the tube clamp, which enhances the aesthetics of the liquid inlet pipe and avoids the liquid inlet pipe being placed on the board chip.

[0023] 7) Horizontal bars are fixedly connected on both sides of the lower part of the heat dissipation body, and a number of pins are integrally formed on the horizontal bars. A number of air guide plates are arranged between the horizontal bars on both sides, and pin holes are arranged at both ends of the air guide plates. The pins and the pin holes are connected by interference fit. When the space above the chip is narrow or not suitable for installing the heat dissipation structure, the heat dissipation mechanism can be installed on one side of the chip, and the angle of the air guide plate can be adjusted to dissipate heat for the chip. The interference fit between the pins and the pin holes avoids the change of the air guide angle when the heat dissipation structure is working, thereby ensuring the heat dissipation effect of the chip.

[0024] 8) A fixed shaft is rotatably connected to the upper part of the U-shaped seat, and a plurality of eccentric wheels are fixedly connected to the fixed shaft, and when the eccentric wheels are pressed against the upper surface of the board, the large diameter outer edge of the eccentric wheels abuts against the board; connecting rods are fixedly connected to both ends of the fixed shaft, and the connecting rods on both sides are connected by pressing rods; when installing the heat dissipation structure, the U-shaped seats on both sides are clamped on the board, and the pressing rods are lifted upwards so that the large diameter outer edge of the eccentric wheel abuts against the board, and the U-shaped seat can be quickly installed.

[0025] 9) A buffer pad is provided at the bottom of the U-shaped seat, and the eccentric wheel is made of plastic, which prevents the U-shaped seat from damaging the board and ensures the stability of the connection between the U-shaped seat and the board.

[0026] 10) A buckle is provided on one side of the longitudinal rod, and a notch is provided on one side of the buckle. After the pressing rod is lifted, it is inserted into the buckle, further ensuring the stability of the connection between the U-shaped seat and the board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Attached Figure 1It is a schematic diagram of a board chip air-cooling and liquid-cooling coupled heat dissipation structure of the present invention.

[0028] Attached Figure 2 It is a bottom view of a heat dissipation body in an air-cooled and liquid-cooled coupled heat dissipation structure for a board chip of the present invention.

[0029] Attached Figure 3 It is a schematic diagram of the heat dissipation body structure in a board chip air-cooling and liquid-cooling coupled heat dissipation structure of the present invention.

[0030] Attached Figure 4 It is a schematic diagram of the interior of a heat dissipation body in an air-cooled and liquid-cooled coupled heat dissipation structure for a board chip of the present invention.

[0031] Attached Figure 5 The present invention is a card chip air-cooled liquid-cooled coupled heat dissipation structure Figure 4 A partial enlarged view of point A in the middle.

[0032] Attached Figure 6 It is a schematic diagram of the bottom plate structure in a board chip air-cooling and liquid-cooling coupled heat dissipation structure of the present invention.

[0033] Attached Figure 7 It is a schematic diagram of the connection between a longitudinal rod and a U-shaped seat in an air-cooled and liquid-cooled coupled heat dissipation structure for a board chip of the present invention.

[0034] Attached Figure 8 It is a schematic diagram of the structure of an air guide plate in an air-cooled and liquid-cooled coupled heat dissipation structure for a board chip of the present invention.

[0035] Attached Fig. 9 It is a schematic diagram of the combined use of an air-cooled and liquid-cooled coupled heat dissipation structure for a board chip of the present invention.

[0036] In the figure: 1. heat dissipation body; 2. liquid inlet; 3. liquid outlet; 4. bottom plate; 5. partition; 6. cross bar; 7. telescopic sleeve; 8. first adjusting bolt; 9. longitudinal rod; 10. sleeve; 11. second adjusting bolt; 12. limit end plate; 13. U-shaped seat; 14. heat dissipation fan; 15. air guide plate; 16. pin hole; 17. cross bar; 18. pin shaft; 19. pipe clamp; 20. lug; 21. U-shaped clamp; 22. sealing strip; 23. buffer pad; 24. eccentric wheel; 25. fixed shaft; 26. connecting rod; 27. pressing rod; 28. buckle; 29. ​​connecting piece. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-9 , the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, specific orientation structure and operation, and therefore should not be understood as a limitation on the present invention.

[0039] like Figure 1-4 As shown, a board chip air-cooling and liquid-cooling coupled heat dissipation structure includes a heat dissipation body 1, the heat dissipation body 1 is an H-shaped structure, a plurality of heat dissipation fins are arranged on the heat dissipation body 1, the heat dissipation body 1 is a hollow profile structure, the hollow structure extends to the inside of the heat dissipation fins, and a bottom plate 4 is arranged at the lower part of the heat dissipation body 1; a liquid inlet 2 is arranged at the lower left front part of the heat dissipation body 1, a liquid inlet pipe is connected to the liquid inlet 2, a liquid outlet 3 is arranged at the upper left rear part of the heat dissipation body 1, a liquid outlet 3 is connected to the liquid outlet 3, and the liquid inlet pipe and the liquid outlet pipe are connected to a circulation pump (not shown in the figure); a heat dissipation fan 14 is arranged on one side of the heat dissipation body 1, and the heat dissipation fan 14 is provided with one or two, and the heat dissipation fan 14 is provided with When there is one, it is installed on the upper or lower part of the heat dissipation body 1, and the wind direction blows toward the chip or away from the chip. When there are two heat dissipation fans 14, they are symmetrically installed on both sides of the heat dissipation body 1, and the wind directions of the two heat dissipation fans 14 blow toward the chip or away from the chip at the same time; lugs 20 are provided on both sides of the heat dissipation body 1, and a cross bar 6 is connected to one side of the lug 20. One end of the cross bar 6 is provided with a longitudinal bar 9 connected, and a U-shaped seat 13 is provided at the lower end of the longitudinal bar 9, and the U-shaped seats 13 on both sides are clamped on both sides of the board; the heat dissipation body 1 of the air-cooled and liquid-cooled coupled heat dissipation structure of the board chip is provided with one or more groups according to the heat dissipation area. When the heat dissipation body 1 is provided with multiple groups, the adjacent heat dissipation bodies 1 are connected by connecting pieces 29.

[0040] like Figure 6 As shown, in this embodiment, a plurality of partitions 5 are provided on the bottom plate 4, and the partitions 5 on the bottom plates 4 on both sides are arranged alternately front to back, so that the coolant circulates alternately left to right inside the heat dissipation body 1, thereby extending the travel of the coolant in the heat dissipation body 1, thereby extending the heat exchange time of the coolant and enhancing the heat dissipation effect of the radiator.

[0041] like Figure 4-5As shown, in this embodiment, U-shaped card plates 21 are symmetrically provided on both sides of the partition 5, and a card slot is formed between the two U-shaped card plates 21. The partition 5 is installed inside the card slot. A wavy sealing strip 22 is provided inside the U-shaped card plate 21. The front end of the sealing strip 22 extends into the card slot. The wavy sealing strip 22 forms a multi-stage seal for the partition 5, thereby ensuring the sealing effect between the partition 5 and the heat dissipation body 1 and avoiding the cross-flow of the coolant.

[0042] like Figure 1 As shown, in this embodiment, a telescopic sleeve 7 is provided on the outside of the cross bar 6, and a first adjusting bolt 8 is threadedly connected to the telescopic sleeve 7 for adjusting the lateral position of the heat dissipation body 1. A sleeve 10 is provided at the end of the cross bar 6, and the sleeve 10 is slidably connected to the longitudinal rod 9. A second adjusting bolt 11 is threadedly connected to one side of the sleeve 10, and the end of the second adjusting bolt 11 is abutted against the longitudinal rod 9 for adjusting the height of the heat dissipation body 1.

[0043] like Figure 7 As shown, in this embodiment, a limiting end plate 12 is provided at the upper end of the longitudinal rod 9 to limit the adjustment range of the sleeve 10 and prevent the sleeve 10 from slipping off the upper end of the longitudinal rod 9.

[0044] like Figure 3 As shown, in this embodiment, a plurality of tube clamps 19 are provided on the upper part of the liquid inlet 2. The tube clamp 19 is a U-shaped structure. One side of the tube clamp 19 is fixedly connected to the heat dissipation body 1. After the liquid inlet pipe is connected to the liquid inlet 2, it is clamped inside the tube clamp 19, which enhances the aesthetics of the liquid inlet pipe and avoids the liquid inlet pipe being placed on the board chip.

[0045] like Figure 2-3 , Figure 8 As shown, in this embodiment, horizontal bars 17 are fixedly connected on both sides of the lower part of the heat dissipation body 1, and a plurality of pins 18 are integrally formed on the horizontal bars 17. A plurality of air guide plates 15 are provided between the horizontal bars 17 on both sides, and pin holes 16 are provided at both ends of the air guide plates 15. The pins 18 are interference connected with the pin holes 16. When the space above the chip is narrow or not suitable for installing the heat dissipation structure, the heat dissipation mechanism can be installed on one side of the chip, and the angle of the air guide plate 15 can be adjusted to dissipate heat for the chip. The interference fit between the pins 18 and the pin holes 16 avoids the change of the air guide angle when the heat dissipation structure is working, thereby ensuring the heat dissipation effect of the chip.

[0046] like Figure 7As shown, in this embodiment, the upper part of the U-shaped seat 13 is rotatably connected to a fixed shaft 25, and a plurality of eccentric wheels 24 are fixedly connected to the fixed shaft 25, and when the eccentric wheels 24 are pressed against the upper surface of the board, the large diameter outer edge of the eccentric wheels 24 abuts against the board; connecting rods 26 are fixedly connected to both ends of the fixed shaft 25, and the connecting rods 26 on both sides are connected by pressing rods 27; when installing the heat dissipation structure, the U-shaped seats 13 on both sides are clamped on the board, and the pressing rods 27 are lifted upward so that the large diameter outer edge of the eccentric wheels 24 abuts against the board, and the U-shaped seat 13 can be quickly installed.

[0047] like Figure 7 As shown, in this embodiment, a buffer pad 23 is provided at the bottom of the U-shaped seat 13, and the eccentric wheel 24 is made of plastic, which prevents the U-shaped seat 13 from causing damage to the board and ensures the stability of the connection between the U-shaped seat 13 and the board.

[0048] like Figure 7 As shown, in this embodiment, a buckle 28 is provided on one side of the longitudinal rod 9, and a notch is provided on one side of the buckle 28. After the pressing rod 27 is lifted, it is snapped into the buckle 28, further ensuring the stability of the connection between the U-shaped seat 13 and the board.

[0049] When in use, the installation position of the U-shaped seat 13 is determined according to the position of the required heat dissipation chip. After the U-shaped seat 13 is clamped on both sides of the board, the pressing rod 27 is lifted upward and the pressing rod 27 is clamped into the inside of the buckle 28 to complete the fixation of the U-shaped seat 13 and the longitudinal rod 9, and then the height of the cross bar 6 is adjusted according to the height of the chip, and the position of the heat dissipation body 1 on the cross bar 6 is adjusted according to the position of the chip; the coolant exchanges heat with the heat dissipation body 1, and when the wind direction of the heat dissipation fan 14 blows toward the chip, the cold wind around the heat dissipation body 1 serves as the wind source, which effectively reduces the temperature of the air and ensures the heat dissipation effect of the chip; when the wind direction of the heat dissipation fan 14 is away from the chip, the heat generated by the chip is drained by the heat dissipation fan 14 to the heat dissipation body 1 for rapid cooling. In addition, the side wall of the heat dissipation body 1 with an H-shaped structure also has a heat dissipation effect on the chip, ensuring the heat dissipation effect of the chip. When the space above the chip is narrow or not suitable for installing the heat dissipation structure, the heat dissipation mechanism is installed on one side of the chip, and the angle of the air guide plate 15 is adjusted to dissipate heat for the chip. The interference fit between the pin shaft 18 and the pin hole 16 avoids the change of the air guide angle when the heat dissipation structure is working, thereby ensuring the heat dissipation effect of the chip.

[0050] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

Claims

1. A card chip air-cooling and liquid-cooling coupled heat dissipation structure, comprising a heat dissipation body, It is characterized in that The heat dissipation body is an H-shaped structure, and a plurality of heat dissipation fins are arranged on the heat dissipation body. The heat dissipation body is a hollow profile structure, and the hollow structure extends to the inside of the heat dissipation fins. A bottom plate is arranged at the lower part of the heat dissipation body; a liquid inlet is arranged at the lower left front part of the heat dissipation body, and a liquid inlet pipe is connected to the liquid inlet; a liquid outlet is arranged at the upper left rear part of the heat dissipation body, and a liquid outlet is connected to the liquid outlet, and the liquid inlet pipe and the liquid outlet pipe are connected to a circulation pump; a heat dissipation fan is arranged on one side of the heat dissipation body, and one or two heat dissipation fans are arranged. When one heat dissipation fan is arranged, it is installed at the upper part or the lower part of the heat dissipation body, and the wind direction blows toward the chip or away from the chip. When two heat dissipation fans are arranged, they are symmetrically installed on both sides of the heat dissipation body, and the wind directions of the two heat dissipation fans blow toward the chip or away from the chip at the same time; the heat dissipation Lugs are provided on both sides of the body, one side of the lug is connected to a cross bar, one end of the cross bar is provided with a longitudinal bar, the lower end of the longitudinal bar is provided with a U-shaped seat, and the U-shaped seats on both sides are clamped on both sides of the board; the heat dissipation body of the air-cooled and liquid-cooled coupled heat dissipation structure of the board chip is provided with one or more groups according to the heat dissipation area. When the heat dissipation body is provided with multiple groups, the adjacent heat dissipation bodies are connected by connecting parts; a plurality of partitions are provided on the bottom plate, and the partitions on the bottom plates on both sides are arranged front and back in an alternating manner, so that the coolant circulates alternately left and right inside the heat dissipation body; U-shaped card boards are symmetrically provided on both sides of the partition, and a card slot is formed between the two U-shaped card boards, and the partition board is installed inside the card slot, and a wavy sealing strip is provided inside the U-shaped card board, and the front end of the sealing strip extends into the card slot, and the wavy sealing strip forms a multi-stage seal on the partition board.

2. The air-cooled and liquid-cooled coupled heat dissipation structure of a card chip according to claim 1, It is characterized in that The outer sleeve of the crossbar is provided with a telescopic sleeve, and a first adjusting bolt is threadedly connected to the telescopic sleeve. A sleeve is provided at the end of the crossbar, and the sleeve is slidably connected to the longitudinal rod. A second adjusting bolt is threadedly connected to one side of the sleeve, and the end of the second adjusting bolt is against the longitudinal rod.

3. The air-cooled and liquid-cooled coupled heat dissipation structure of a card chip according to claim 2, It is characterized in that A limiting end plate is provided at the upper end of the longitudinal rod.

4. The air-cooled and liquid-cooled coupled heat dissipation structure of a card chip according to claim 1, It is characterized in that A plurality of pipe clamps are arranged on the upper part of the liquid inlet, and the pipe clamps are of U-shaped structure. One side of the pipe clamps is fixedly connected with the heat dissipation body, and the liquid inlet pipe is connected with the liquid inlet and clamped inside the pipe clamps.

5. The air-cooled and liquid-cooled coupled heat dissipation structure of a card chip according to claim 1, It is characterized in that The lower sides of the heat dissipation body are fixedly connected with horizontal bars, and a plurality of pins are integrally formed on the horizontal bars. A plurality of air guide plates are arranged between the horizontal bars on both sides, and pin holes are arranged at both ends of the air guide plates. The pins are interference connected with the pin holes. When the space above the chip is narrow or not suitable for installing the heat dissipation structure, the heat dissipation mechanism is installed on one side of the chip, and the angle of the air guide plate is adjusted to dissipate heat for the chip.

6. The air-cooled and liquid-cooled coupled heat dissipation structure for a card chip according to any one of claims 1 to 5, It is characterized in that The upper part of the U-shaped seat is rotatably connected to a fixed shaft, and a plurality of eccentric wheels are fixedly connected to the fixed shaft. When the eccentric wheels are pressed against the upper surface of the plate, the large diameter outer edge of the eccentric wheels abuts against the plate. Connecting rods are fixedly connected to both ends of the fixed shaft, and the connecting rods on both sides are connected by pressing rods.

7. The air-cooled and liquid-cooled coupled heat dissipation structure of a card chip according to claim 6, It is characterized in that A buffer pad is arranged at the bottom of the U-shaped seat, and the eccentric wheel is made of plastic.

8. The air-cooled and liquid-cooled coupled heat dissipation structure of a card chip according to claim 6, It is characterized in that A buckle is provided on one side of the longitudinal rod, and a notch is provided on one side of the buckle. After the pressing rod is lifted, it is clamped into the buckle.

Images