Data estimation method and device for sound guiding cavity, electronic equipment and medium

Abstract

The present disclosure provides a data estimation method and device for a sound guide cavity, electronic equipment and medium. The method comprises: obtaining initial data of the sound guide cavity; determining reference data, the reference data being data related to a component associated with the sound guide cavity and / or data related to a sound field of an environment in which the sound guide cavity is located; and performing compensation processing on the initial data according to the reference data to obtain target data of the sound guide cavity. Through the present disclosure, the estimation accuracy of data related to the sound guide front cavity can be effectively improved, and the estimation effect can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and particularly relates to a data estimation method and device for a sound guide cavity, an electronic device and a medium. BACKGROUND

[0002] In an electronic device, a microphone mainly functions to capture sound and transmit the sound to a voice processing component. The sound quality picked up by the microphone is related to the microphone body on one hand, and related to the sound guide cavity of the microphone in the electronic device on the other hand. In the electronic device, it is required that the resonance frequency of the sound guide cavity does not affect the pickup of voice, that is, generally it is required that the resonance frequency of the sound guide cavity of the microphone is greater than 10 KHz. At the beginning of designing the microphone cavity, the cavity structure needs to be reasonably analyzed so that the cavity itself does not affect the pickup of voice or reduces the influence on the pickup of voice as much as possible, so that the electronic device receives higher quality voice.

[0003] In the related art, a circuit simulation method is usually used to estimate the data related to the sound guide cavity of the microphone (for example, the resonance frequency).

[0004] In this way, human interference factors are easily introduced, resulting in inaccurate estimation results of the data related to the sound guide cavity and poor estimation effect. SUMMARY

[0005] The present disclosure aims to at least solve one of the technical problems in the related art to some extent.

[0006] To this end, the purpose of the present disclosure is to provide a data estimation method and device for a sound guide cavity, an electronic device and a medium, which can effectively improve the estimation accuracy of the data related to the sound guide cavity and improve the estimation effect.

[0007] To achieve the above purpose, the data estimation method for a sound guide cavity provided by the first aspect of the present disclosure comprises: obtaining initial data of a sound guide cavity; determining reference data, the reference data being data related to a component associated with the sound guide cavity and / or data related to a sound wave field of an environment in which the sound guide cavity is located; and performing compensation processing on the initial data according to the reference data to obtain target data of the sound guide cavity.

[0008] The data estimation method of the sound guide cavity provided in the first aspect of the present disclosure comprises the following steps: obtaining initial data of the sound guide cavity; determining reference data, wherein the reference data is data related to a component associated with the sound guide cavity and / or data related to a sound wave field of an environment in which the sound guide cavity is located; and performing compensation processing on the initial data according to the reference data to obtain target data of the sound guide cavity. Since the reference data related to the component associated with the sound guide cavity and / or the data related to the sound wave field of the environment in which the sound guide cavity is located is used to estimate the target data, the estimation accuracy of the data related to the sound guide front cavity can be effectively improved, and the estimation effect is improved.

[0009] To achieve the above object, the data estimation device of the sound guide cavity provided in the second aspect of the present disclosure comprises: an obtaining module configured to obtain initial data of the sound guide cavity; a determining module configured to determine reference data, wherein the reference data is data related to a component associated with the sound guide cavity and / or data related to a sound wave field of an environment in which the sound guide cavity is located; and a compensation processing module configured to perform compensation processing on the initial data according to the reference data to obtain target data of the sound guide cavity.

[0010] The data estimation device of the sound guide cavity provided in the second aspect of the present disclosure comprises the following steps: obtaining initial data of the sound guide cavity; determining reference data, wherein the reference data is data related to a component associated with the sound guide cavity and / or data related to a sound wave field of an environment in which the sound guide cavity is located; and performing compensation processing on the initial data according to the reference data to obtain target data of the sound guide cavity. Since the reference data related to the component associated with the sound guide cavity and / or the data related to the sound wave field of the environment in which the sound guide cavity is located is used to estimate the target data, the estimation accuracy of the data related to the sound guide front cavity can be effectively improved, and the estimation effect is improved.

[0011] The third aspect of the present disclosure provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the data estimation method of the sound guide cavity provided in the first aspect of the present disclosure when executing the program.

[0012] The fourth aspect of the present disclosure provides a non-transitory computer readable storage medium having a computer program stored thereon, wherein the program is executed by a processor to implement the data estimation method of the sound guide cavity provided in the first aspect of the present disclosure.

[0013] The fifth aspect of the present disclosure provides a computer program product, wherein the instructions in the computer program product are executed by a processor to implement the data estimation method of the sound guide cavity provided in the first aspect of the present disclosure.

[0014] Additional aspects and advantages of this disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this disclosure. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this disclosure will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 This is a schematic flowchart of a data estimation method for a sound-conducting cavity proposed in an embodiment of this disclosure;

[0017] Figure 2 This is a partial structural diagram of the microphone in an embodiment of this disclosure;

[0018] Figure 3 This is a schematic diagram of the sound-conducting cavity model in an embodiment of this disclosure;

[0019] Figure 4 This is a schematic diagram of the target sound-conducting cavity model in an embodiment of this disclosure;

[0020] Figure 5 This is a schematic flowchart of a data estimation method for a sound-conducting cavity proposed in another embodiment of this disclosure;

[0021] Figure 6 This is a schematic diagram of the structure of a data estimation device for a sound-conducting cavity according to an embodiment of the present disclosure;

[0022] Figure 7 This is a schematic diagram of the structure of a data estimation device for a sound-conducting cavity according to another embodiment of this disclosure;

[0023] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this disclosure. Detailed Implementation

[0024] Embodiments of this disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are used only to explain this disclosure, and should not be construed as limiting this disclosure. Rather, embodiments of this disclosure include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0025] Figure 1 This is a schematic flowchart of a data estimation method for a sound-conducting cavity proposed in one embodiment of this disclosure.

[0026] It should be noted that the execution subject of the data estimation method for the sound-conducting cavity in this embodiment is the data estimation device for the sound-conducting cavity. This device can be implemented by software and / or hardware. This device can be configured in an electronic device, which may include, but is not limited to, a terminal, a server, etc.

[0027] like Figure 1 As shown, the data estimation method for the sound-conducting cavity includes:

[0028] S101: Obtain the initial data of the sound-conducting cavity.

[0029] In this embodiment of the disclosure, the sound-conducting cavity refers to the sound-conducting cavity of a microphone in an electronic device.

[0030] like Figure 2 As shown, Figure 2 This is a partial structural diagram of a microphone in an embodiment of the present disclosure. The partial structure 21 of the microphone includes a sound-conducting cavity 22 and a pickup port 23. The sound-conducting cavity 22 can be regarded as a pickup channel, and the microphone captures sound through the pickup channel and the pickup port 23.

[0031] The initial data for the sound-conducting cavity can be, for example, data used to model the sound-conducting cavity, such as sound pressure level data, sound wave field data, etc., related to the sound-conducting cavity.

[0032] The sound-conducting cavity model can be a structural model used to assist in estimating target data. This structural model can be used to simulate the air domain corresponding to the actual device. For example, the sound-conducting cavity model corresponding to the sound-conducting cavity has a corresponding air domain, which indicates the air domain stacked by the sound-conducting cavity in the electronic device.

[0033] The sound-conducting cavity model can be obtained by modeling and simulating its structure using a finite element method (FEM) application (such as COMSOL, which can be used for multiphysics modeling and simulation). Figure 3 As shown, Figure 3 This is a schematic diagram of a sound-conducting cavity model in an embodiment of the present disclosure. The sound-conducting cavity model simulates the air domain created by stacking sound-conducting cavities in an electronic device.

[0034] S102: Determine reference data, which is data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located.

[0035] Data related to components associated with the sound-conducting cavity, data related to the sound wave field of the environment in which the sound-conducting cavity is located, or a combination of both, can all be referred to as reference data. This reference data can be used to assist in the above-mentioned... Figure 3 The sound-conducting cavity model shown is optimized to compensate for the initial data.

[0036] Among them, the data related to the components associated with the sound-conducting cavity can be, for example, the sound pressure level data and sound wave field data of the components. This data can be used to optimize the sound-conducting cavity model to adapt it. The data related to the sound wave field of the environment in which the sound-conducting cavity is located can be, for example, the sound pressure and sound frequency in the environment. This data can be used to optimize the sound-conducting cavity model accordingly. For specific optimization methods, please refer to the following embodiments.

[0037] Optionally, in some embodiments, determining the reference data may involve determining the cavity of the microphone to which the sound-conducting cavity belongs, and determining the inner wall of the channel between the microphone and the sound-conducting cavity. The microphone cavity and the inner wall of the channel together constitute an associated component. First reference data for the microphone cavity and the inner wall of the channel are determined respectively, and second reference data for the sound wave field in the environment where the sound-conducting cavity is located is determined. The first reference data and the second reference data are used together as reference data. Since the microphone cavity, the inner wall of the channel, and the sound wave field in the environment where the sound-conducting cavity is located have a significant impact on the air vibration in the microphone sound-conducting cavity, the reference value of the reference data can be effectively guaranteed, and the accuracy of subsequent related data estimation can be guaranteed.

[0038] The first reference data can be, for example, the sound pressure level data and sound wave field data of the microphone cavity and channel inner wall. The second reference data can be, for example, the sound pressure and sound frequency in the environment. Of course, the reference data can also be the sound pressure level data, sound wave field data, etc. of any other possible components associated with the sound guide cavity, or it can be other parameter data that affect air vibration in the environment. There are no restrictions on this.

[0039] S103: Compensate the initial data based on the reference data to obtain the target data for the sound-conducting cavity.

[0040] After obtaining the initial data of the sound-conducting cavity and determining the reference data, which is data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located, the initial data can be compensated based on the reference data to obtain the target data of the sound-conducting cavity.

[0041] In this embodiment of the disclosure, after obtaining the initial data of the sound guiding cavity, the sound guiding cavity model can be optimized by referring to the data related to the components associated with the sound guiding cavity and / or the data related to the sound wave field of the environment in which the sound guiding cavity is located, so as to obtain a target sound guiding cavity model. The target sound guiding cavity model can simultaneously simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body.

[0042] like Figure 4 As shown, Figure 4 This is a schematic diagram of the target sound-conducting cavity model in an embodiment of the present disclosure. The target sound-conducting cavity model can simultaneously simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body.

[0043] In other words, this embodiment supports combining data related to components associated with the sound-conducting cavity and / or data related to the acoustic field of the environment in which the sound-conducting cavity is located to assist in simulating the air domain outside the electronic device and the forward air domain inside the microphone body. This allows for the simultaneous analysis of the microphone's front cavity, for example, by numerically calculating and analyzing the stacked air domain within the simulated electronic device corresponding to the sound-conducting cavity model. Figure 4 Numerical analysis and calculation are performed on the air domain outside the electronic device and the forward air domain inside the microphone body to help estimate more accurate target data for the sound guide cavity.

[0044] Because it uses data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located, the sound-conducting cavity model is optimized to obtain the target sound-conducting cavity model. After optimization, the target sound-conducting cavity model is used to simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body. This enables the combined use of the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body to support numerical analysis. This compensates for the numerical analysis based solely on the air domain stacked in the electronic device in related technologies, greatly improving the numerical analysis effect and the estimation accuracy of the data related to the sound-conducting cavity.

[0045] In this embodiment of the disclosure, when constructing and optimizing the sound-conducting cavity model, initial data can be input into a finite element modeling and analysis application to generate a sound-conducting cavity model corresponding to the sound-conducting cavity. Then, the initial data, the first reference data, and the second reference data can be input into the finite element modeling and analysis application to generate the target sound-conducting cavity model. This can effectively improve the optimization efficiency and convenience of the data related to the sound-conducting cavity.

[0046] Alternatively, the first and second reference data can be used to optimize the existing sound-conducting cavity model; there are no restrictions on this.

[0047] Finite element modeling and analysis applications, such as COMSOL, which can be used for multiphysics modeling and simulation, or any other application that can support multiphysics modeling and simulation, are not limited in this regard.

[0048] Of course, any other possible methods can be used to compensate the initial data based on the reference data to obtain the target data of the sound-conducting cavity, such as artificial intelligence models, engineering methods, etc., without any restrictions.

[0049] In this embodiment, initial data of the sound-conducting cavity is acquired, and reference data is determined. The reference data is data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located. The initial data is then compensated based on the reference data to obtain the target data of the sound-conducting cavity. Since the target data is estimated by referring to the data related to the components associated with the sound-conducting cavity and / or the data related to the sound wave field of the environment in which the sound-conducting cavity is located, the estimation accuracy of the data related to the sound-conducting cavity can be effectively improved, thereby improving the estimation effect.

[0050] Figure 5 This is a schematic flowchart of a data estimation method for a sound-conducting cavity proposed in another embodiment of this disclosure.

[0051] like Figure 5 As shown, the data estimation method for the sound-conducting cavity includes:

[0052] S501: Obtain the initial data of the sound guide cavity.

[0053] S502: Determine reference data, which is data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located.

[0054] Examples of S501-S502 can be found in the above embodiments, and will not be repeated here.

[0055] S503: Construct a sound-conducting cavity model based on the initial data. The sound-conducting cavity model is used to simulate the stacked air domain in electronic devices.

[0056] For example, the structure of the sound-conducting cavity can be modeled and simulated using a finite element modeling and analysis application (such as COMSOL, which can be used for multiphysics modeling and simulation). The sound-conducting cavity model can then be obtained. Figure 3 As shown, the sound-conducting cavity model simulates the air domain created by stacking sound-conducting cavities in electronic devices.

[0057] S504: The sound-conducting cavity model is optimized based on the first reference data and the second reference data to obtain the target sound-conducting cavity model. After optimization, the target sound-conducting cavity model is used to simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body.

[0058] For example, in conjunction with the above Figure 4 As shown, after obtaining the initial data of the sound guide cavity, the sound guide cavity model can be optimized by referring to the data related to the components associated with the sound guide cavity (first reference data) and / or the data related to the sound wave field of the environment in which the sound guide cavity is located (second reference data) to obtain the target sound guide cavity model. The target sound guide cavity model can simultaneously simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body.

[0059] S505: Configure the target sound-conducting cavity model to obtain the sound-conducting cavity model to be analyzed. The sound-conducting cavity model to be analyzed includes: a target plane, and the distance between the target plane and the microphone diaphragm is less than a set distance.

[0060] The model obtained after target configuration of the target sound-conducting cavity model can be called the sound-conducting cavity model to be analyzed. Target configuration of the target sound-conducting cavity model can effectively facilitate multiphysics modeling and simulation of the target sound-conducting cavity model, which is convenient for subsequent numerical analysis and calculation, and makes the estimation results of the target data more accurate.

[0061] Optionally, the microphone includes: a pickup port (the location of the pickup port is shown in the diagram above). Figure 2As shown, the target sound-conducting cavity model is configured to obtain the sound-conducting cavity model to be analyzed. This can be achieved by setting the reference plane of the target sound-conducting cavity model as a hard acoustic field wall, where the pickup port in the target sound-conducting cavity model is located, determining the plane to be processed opposite to the reference plane, setting the plane to be processed as a plane wave radiation surface, configuring a sound-absorbing layer on the remaining plane surface, and adding an incident field to the target sound-conducting cavity model to obtain the sound-conducting cavity model to be analyzed. The remaining plane, the reference plane, and the plane to be processed together constitute multiple planes in the target sound-conducting cavity model, thereby effectively improving the effect of multiphysics modeling and simulation of the target sound-conducting cavity model. This allows the multiphysics model to characterize the acoustic vibration characteristics of the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body, thus helping to improve the accuracy of target data estimation.

[0062] Wherein, the reference plane is the plane where the pickup port is located in the target sound-conducting cavity model, that is to say, the above Figure 2 The image shows the position of the pickup port in the solid structure diagram of the sound guide cavity. When the target sound guide cavity model is obtained by modeling based on the solid structure diagram of the sound guide cavity, the pickup port in the solid structure diagram is mapped into the target sound guide cavity model, and the model plane where the mapped pickup port is located can be called the reference plane.

[0063] The plane to be processed is the plane opposite to the reference plane.

[0064] In other words, the target sound-conducting cavity model will include multiple planes, which consist of a reference plane, a plane to be processed, and the remaining planes. The aforementioned planes can be initialized and configured accordingly to achieve multiphysics modeling and simulation of the target sound-conducting cavity model.

[0065] For example, one can first extract the solid structure diagram of the microphone's sound-conducting cavity based on the structural diagram of the electronic device. Then, import the solid structure diagram of the sound-conducting cavity into the COMSOL application. The COMSOL application can then parse the relevant initial data involved in the solid structure diagram of the sound-conducting cavity and perform modeling to obtain the sound-conducting cavity model. Next, a cuboid is extruded at the sound pickup outlet of the sound-conducting cavity model. The reference plane where the sound pickup outlet is located is set as a hard sound field wall, and the plane to be processed opposite the reference plane is set as a plane wave radiation surface. Incident light is then added. In the field, the remaining plane is set with a sound-absorbing layer; then, the pickup cavity part of the target sound-conducting cavity model can be set as a thermoviscous acoustic module, and the rest can be set as a pressure acoustic module. When performing multiphysics modeling and simulation, the multiphysics coupling boundary of pressure acoustics and thermoviscous acoustics can be established; the non-perfectly matched layer domain is freely meshed, and the perfect matched layer is meshed with more than 8 layers by frequency sweeping. The mesh size can meet the minimum mesh size of 20KHz sound wave. A boundary layer is set for the thermoviscous region, which can meet the minimum mesh setting of the thermoviscous boundary layer.

[0066] After completing the target configuration for the target sound-conducting cavity model as described above, the target plane can be determined from the sound-conducting cavity model to be analyzed. The distance between the target plane and the microphone diaphragm is less than a set distance. For example, multiple distances between multiple planes and the microphone diaphragm can be determined, and the plane corresponding to the smallest distance can be taken as the target plane, thereby helping to improve the accuracy of subsequent frequency sweep calculations.

[0067] S506: Perform frequency sweep calculations on the target plane to determine the sound pressure level information on the target plane, and determine the target data of the sound guiding cavity based on the sound pressure level information.

[0068] Optionally, in some embodiments, frequency sweep calculations are performed on the target plane to determine the sound pressure level information on the target plane, and the target data of the sound-guiding cavity is determined based on the sound pressure level information. This can be achieved by forming a sound pressure level curve based on the sound pressure level information on the target plane. The sound pressure level curve is obtained by fitting multiple frequency points on the target plane and the sound pressure level corresponding to the frequency points. The target sound pressure level is determined, and the target frequency point corresponding to the target sound pressure level is used as the target data. The target sound pressure level is the peak sound pressure level among multiple sound pressure levels. This achieves data compensation processing based on multiphysics modeling and simulation. Furthermore, the target plane is determined from the sound-guiding cavity model to be analyzed. The sound-guiding cavity model to be analyzed can simulate the acoustic vibration characteristics in the stacked air domain in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body. This makes the target data obtained by frequency sweep calculation highly accurate and valuable.

[0069] For example, a frequency sweep calculation can be performed on the entire sound-guiding cavity model to be analyzed. In the post-processing of the calculation results, the surface of the sound-guiding cavity model closest to the microphone diaphragm (i.e., the target plane) can be selected by deriving values. The average sound pressure level on the target plane (this average sound pressure level can be called the sound pressure level information) is calculated. Then, based on multiple frequency points on the target plane and the sound pressure level curve obtained by fitting the sound pressure level corresponding to the frequency points, the frequency point corresponding to the peak sound pressure level in the sound pressure level curve is the resonant frequency point of the sound-guiding cavity. This resonant frequency point can be called the target data obtained by compensation processing. For the specific method of performing a frequency sweep calculation on the entire sound-guiding cavity model to be analyzed, please refer to the relevant technology, which will not be elaborated here.

[0070] For example, the measured resonant frequency of the electronic device is 7.7-7.8 kHz. The estimation method in related technologies estimates it to be 8.626 kHz, while the estimation result obtained using the embodiment of this disclosure is 7.9 kHz. Therefore, in the embodiment of this disclosure, by performing compensation processing, a more accurate resonant frequency point of the sound-conducting cavity can be obtained. This can help guide the optimization of the design parameters such as the shape, length, and width of the sound-conducting cavity in actual projects, so as to improve the sound pickup effect of the sound-conducting cavity.

[0071] In this embodiment, initial data of the sound-conducting cavity is acquired, and reference data is determined. The reference data is data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located. The initial data is then compensated based on the reference data to obtain the target data of the sound-conducting cavity. Since the target data is estimated by referring to the data related to the components associated with the sound-conducting cavity and / or the data related to the sound wave field of the environment in which the sound-conducting cavity is located, the estimation accuracy of the data related to the sound-conducting cavity can be effectively improved, thereby improving the estimation effect.

[0072] Figure 6 This is a schematic diagram of the structure of a data estimation device for a sound-conducting cavity according to an embodiment of the present disclosure.

[0073] like Figure 6 As shown, the data estimation device 60 for the sound-conducting cavity includes:

[0074] The acquisition module 601 is used to acquire the initial data of the sound-conducting cavity;

[0075] Module 602 is used to determine reference data, which is data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located; and

[0076] The compensation processing module 603 is used to compensate the initial data according to the reference data to obtain the target data of the sound-conducting cavity.

[0077] In some embodiments of this disclosure, the determining module 602 is specifically used for:

[0078] Identify the microphone cavity to which the sound guide cavity belongs, and determine the inner wall of the channel between the microphone and the sound guide cavity. The microphone cavity and the inner wall of the channel together constitute the associated components.

[0079] Determine the first reference data for the microphone cavity and the inner wall of the channel, respectively;

[0080] The second reference data for determining the sound wave field in the environment where the sound guide cavity is located is used together as the reference data.

[0081] In some embodiments of this disclosure, such as Figure 7 As shown, Figure 7 This is a schematic diagram of the structure of a data estimation device for a sound-conducting cavity according to another embodiment of this disclosure. The compensation processing module 603 includes:

[0082] Submodule 6031 is constructed to build a sound-conducting cavity model based on the initial data. The sound-conducting cavity model is used to simulate the air domain stacked in electronic devices.

[0083] The processing submodule 6032 is used to optimize the sound-conducting cavity model according to the first reference data and the second reference data to obtain the target sound-conducting cavity model. After optimization, the target sound-conducting cavity model is used to simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body.

[0084] Configuration submodule 6033 is used to configure the target sound-conducting cavity model to obtain the sound-conducting cavity model to be analyzed. The sound-conducting cavity model to be analyzed includes: a target plane, and the distance between the target plane and the microphone diaphragm is less than a set distance.

[0085] The calculation submodule 6034 is used to perform frequency sweep calculation on the target plane to determine the sound pressure level information on the target plane, and to determine the target data of the sound guiding cavity based on the sound pressure level information.

[0086] In some embodiments of this disclosure, submodule 6031 is specifically used for:

[0087] Input the initial data into the finite element modeling and analysis application to generate a sound-conducting cavity model corresponding to the sound-conducting cavity;

[0088] The sound-conducting cavity model is optimized based on the first and second reference data to obtain the target sound-conducting cavity model, including:

[0089] Input the initial data, the first reference data, and the second reference data into the finite element modeling and analysis application to generate the target sound-conducting cavity model.

[0090] In some embodiments of this disclosure, the microphone includes: a pickup port, and a configuration submodule 6033, specifically used for:

[0091] The reference plane of the target sound-conducting cavity model is set as the hard sound field wall. The reference plane is the plane where the pickup port is located in the target sound-conducting cavity model.

[0092] Determine the plane to be processed relative to the reference plane, and set the plane to be processed as the plane wave radiation surface;

[0093] A sound-absorbing layer is placed on the remaining plane surface, and an incident field is added to the target sound-conducting cavity model to obtain the sound-conducting cavity model to be analyzed. The remaining plane, the reference plane, and the plane to be processed together constitute multiple planes in the target sound-conducting cavity model.

[0094] In some embodiments of this disclosure, the computation submodule 6034 is specifically used for:

[0095] A sound pressure level curve is formed based on the sound pressure level information on the target plane. The sound pressure level curve is obtained by fitting multiple frequency points on the target plane and the sound pressure level corresponding to each frequency point.

[0096] Determine the target sound pressure level and use the target frequency point corresponding to the target sound pressure level as the target data. The target sound pressure level is the peak sound pressure level among multiple sound pressure levels.

[0097] It should be noted that the foregoing explanation of the data estimation method embodiment for the sound-conducting cavity also applies to the data estimation device for the sound-conducting cavity in this embodiment, and will not be repeated here.

[0098] In this embodiment, initial data of the sound-conducting cavity is acquired, and reference data is determined. The reference data is data related to the components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located. The initial data is then compensated based on the reference data to obtain the target data of the sound-conducting cavity. Since the target data is estimated by referring to the data related to the components associated with the sound-conducting cavity and / or the data related to the sound wave field of the environment in which the sound-conducting cavity is located, the estimation accuracy of the data related to the sound-conducting cavity can be effectively improved, thereby improving the estimation effect.

[0099] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this disclosure.

[0100] The electronic device includes: a memory 801, a processor 802, and a computer program stored on the memory 801 and executable on the processor 802.

[0101] When the processor 802 executes the program, it implements the data estimation method for the sound-conducting cavity provided in the above embodiments.

[0102] In one possible implementation, the electronic device includes:

[0103] Communication interface 803 is used for communication between memory 801 and processor 802.

[0104] The memory 801 is used to store computer programs that can run on the processor 802.

[0105] The memory 801 may include high-speed RAM or non-volatile memory, such as at least one disk drive.

[0106] The processor 802 is used to implement the data estimation method for the sound-conducting cavity in the above embodiment when executing the program.

[0107] If the memory 801, processor 802, and communication interface 803 are implemented independently, then the communication interface 803, memory 801, and processor 802 can be interconnected via a bus to complete communication between them. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be divided into address buses, data buses, control buses, etc. For ease of representation, Figure 8 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0108] Optionally, in a specific implementation, if the memory 801, processor 802, and communication interface 803 are integrated on a single chip, then the memory 801, processor 802, and communication interface 803 can communicate with each other through an internal interface.

[0109] The processor 802 may be a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement embodiments of the present disclosure.

[0110] This embodiment also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the data estimation method for the sound-conducting cavity as described above.

[0111] To implement the above embodiments, this disclosure also proposes a computer program product that, when the instructions in the computer program product are executed by a processor, performs the data estimation method for the sound guide cavity shown in the above embodiments.

[0112] It should be noted that in the description of this disclosure, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0113] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of preferred embodiments of this disclosure includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this disclosure pertain.

[0114] It should be understood that various parts of this disclosure can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0115] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0116] Furthermore, the functional units in the various embodiments of this disclosure can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0117] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0118] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0119] Although embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present disclosure.

Claims

1. A data estimation method for a sound-conducting cavity, characterized in that, The method includes: Obtain the initial data of the sound-conducting cavity; Determine reference data, which is data related to components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located; and A sound-conducting cavity model is constructed based on the initial data. This model simulates the air domain stacked in an electronic device. The sound-conducting cavity model is then optimized based on the reference data to obtain a target sound-conducting cavity model. Target configuration is performed on the target sound-conducting cavity model to obtain a sound-conducting cavity model to be analyzed. Frequency sweep calculations are performed on the target plane in the sound-conducting cavity model to be analyzed to determine the sound pressure level information on the target plane. Based on the sound pressure level information, the target data of the sound-conducting cavity is determined, wherein the distance between the target plane and the microphone diaphragm is less than a set distance.

2. The method as described in claim 1, characterized in that, The determined reference data includes: The cavity of the microphone to which the sound guide cavity belongs is determined, and the inner wall of the channel between the microphone and the sound guide cavity is determined, wherein the microphone cavity and the inner wall of the channel together constitute the associated component; First reference data are determined for the microphone cavity and the inner wall of the channel, respectively. A second reference data for the sound wave field in the environment where the sound-conducting cavity is located is determined, and the first reference data and the second reference data are used together as the reference data.

3. The method as described in claim 2, characterized in that, The step of optimizing the sound-conducting cavity model based on the reference data to obtain the target sound-conducting cavity model includes: The sound-conducting cavity model is optimized based on the first reference data and the second reference data to obtain a target sound-conducting cavity model; wherein, after the optimization process, the target sound-conducting cavity model is used to simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body.

4. The method as described in claim 3, characterized in that, The step of constructing the sound-conducting cavity model based on the initial data includes: The initial data is input into a finite element modeling and analysis application to generate a sound-conducting cavity model corresponding to the sound-conducting cavity. The step of optimizing the sound-conducting cavity model based on the first reference data and the second reference data to obtain the target sound-conducting cavity model includes: The initial data, the first reference data, and the second reference data are input into the finite element modeling and analysis application to generate the target sound-conducting cavity model.

5. The method as described in claim 4, characterized in that, The microphone includes a pickup port. The process of configuring the target sound-conducting cavity model to obtain the sound-conducting cavity model to be analyzed includes: The reference plane of the target sound-conducting cavity model is set as a hard sound field wall, and the reference plane is the plane where the pickup port is located in the target sound-conducting cavity model; Determine the plane to be processed relative to the reference plane, and set the plane to be processed as a plane wave radiation surface; A sound-absorbing layer is disposed on the remaining plane surface, and an incident field is added to the target sound-conducting cavity model to obtain the sound-conducting cavity model to be analyzed. The remaining plane, the reference plane, and the plane to be processed together constitute multiple planes in the target sound-conducting cavity model.

6. The method as described in claim 5, characterized in that, The step of performing frequency sweep calculations on the target plane to determine the sound pressure level information on the target plane, and determining the target data of the sound-conducting cavity based on the sound pressure level information, includes: A sound pressure level curve is formed based on the sound pressure level information on the target plane. The sound pressure level curve is obtained by fitting multiple frequency points on the target plane and the sound pressure level corresponding to the frequency points. A target sound pressure level is determined, and the target frequency point corresponding to the target sound pressure level is used as the target data. The target sound pressure level is the peak sound pressure level among multiple sound pressure levels.

7. A data estimation device for a sound-conducting cavity, characterized in that, The device includes: The acquisition module is used to acquire the initial data of the sound-conducting cavity; A determining module is used to determine reference data, which is data related to components associated with the sound-conducting cavity and / or data related to the sound wave field of the environment in which the sound-conducting cavity is located; and The compensation processing module includes a construction submodule, a processing submodule, a configuration submodule, and a calculation submodule. The construction submodule is used to construct a sound-conducting cavity model based on the initial data. This sound-conducting cavity model is used to simulate the air domain stacked in an electronic device. The processing submodule is used to optimize the sound-conducting cavity model based on the reference data to obtain a target sound-conducting cavity model. The configuration submodule is used to perform target configuration on the target sound-conducting cavity model to obtain a sound-conducting cavity model to be analyzed. The calculation submodule is used to perform frequency sweep calculations on the target plane in the sound-conducting cavity model to be analyzed to determine the sound pressure level information on the target plane, and to determine the target data of the sound-conducting cavity based on the sound pressure level information. The distance between the target plane and the microphone diaphragm is less than a set distance.

8. The apparatus as claimed in claim 7, characterized in that, The determining module is specifically used for: The cavity of the microphone to which the sound guide cavity belongs is determined, and the inner wall of the channel between the microphone and the sound guide cavity is determined, wherein the microphone cavity and the inner wall of the channel together constitute the associated component; First reference data are determined for the microphone cavity and the inner wall of the channel, respectively. A second reference data for the sound wave field in the environment where the sound-conducting cavity is located is determined, and the first reference data and the second reference data are used together as the reference data.

9. The apparatus as claimed in claim 8, characterized in that, The processing submodule is specifically used to optimize the sound-conducting cavity model according to the first reference data and the second reference data to obtain a target sound-conducting cavity model. After the optimization process, the target sound-conducting cavity model is used to simulate the air domain stacked in the electronic device, the air domain outside the electronic device, and the forward air domain inside the microphone body.

10. The apparatus as claimed in claim 9, characterized in that, The construction submodule is specifically used for: The initial data is input into a finite element modeling and analysis application to generate a sound-conducting cavity model corresponding to the sound-conducting cavity. The step of optimizing the sound-conducting cavity model based on the first reference data and the second reference data to obtain the target sound-conducting cavity model includes: The initial data, the first reference data, and the second reference data are input into the finite element modeling and analysis application to generate the target sound-conducting cavity model.

11. The apparatus as claimed in claim 10, characterized in that, The microphone includes a pickup port, and the configuration submodule is specifically used for: The reference plane of the target sound-conducting cavity model is set as a hard sound field wall, and the reference plane is the plane where the pickup port is located in the target sound-conducting cavity model; Determine the plane to be processed relative to the reference plane, and set the plane to be processed as a plane wave radiation surface; A sound-absorbing layer is disposed on the remaining plane surface, and an incident field is added to the target sound-conducting cavity model to obtain the sound-conducting cavity model to be analyzed. The remaining plane, the reference plane, and the plane to be processed together constitute multiple planes in the target sound-conducting cavity model.

12. The apparatus as claimed in claim 11, characterized in that, The calculation submodule is specifically used for: A sound pressure level curve is formed based on the sound pressure level information on the target plane. The sound pressure level curve is obtained by fitting multiple frequency points on the target plane and the sound pressure level corresponding to the frequency points. A target sound pressure level is determined, and the target frequency point corresponding to the target sound pressure level is used as the target data. The target sound pressure level is the peak sound pressure level among multiple sound pressure levels.

13. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, it implements the method as described in any one of claims 1-6.

14. A storage medium, wherein instructions in the storage medium, when executed by a processor of an electronic device, enable the electronic device to perform the method as described in any one of claims 1-6.

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