Display device

Abstract

The present application discloses a display device, which belongs to the field of display technology. The display device includes: a display panel, a driver chip and a flexible circuit board. The driver chip and the flexible circuit board are bound to the panel bending portion of the display panel. Since the orthographic projection of the flexible circuit board on the back of the flat portion and the orthographic projection of the driver chip on the back of the flat portion have an overlapping area, after the flexible circuit board and the driver chip are bent to the back of the display panel, the protruding width of the flexible circuit board relative to the display panel is small. In this way, the flexible circuit board occupies less space on the back of the display panel, which can effectively increase the installation space of other devices that need to be installed on the back of the display panel in the display device. For example, when the other component is a battery, the installation space of the battery in the display device is larger, thereby increasing the capacity of the battery and improving the battery life of the display device.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] With the development of display technology, the demand and application scope of display devices are constantly expanding. Commonly used display devices include mobile phones, televisions, tablet computers, laptops and monitors.

[0003] The display device may generally include a display panel, a flexible circuit board and a driver chip. The display panel has a display area and a non-display area, and the display panel may include: a first pad group and a second pad group located in the non-display area. The first pad group is used to bind to the flexible circuit board, and the second pad group is used to bind to the driver chip. In order to reduce the size of the frame in the display device, the portion of the display panel located in the non-display area is generally bent so that the flexible circuit board and the driver chip bound to the non-display area of ​​the display panel are bent to the back of the display panel (that is, the side opposite to the display surface of the display panel).

[0004] However, after the flexible circuit board and the driver chip are bent to the back of the display panel, the flexible circuit board occupies a large space, resulting in a small installation space for other devices (eg, a battery) that need to be disposed on the back of the display panel in the display device. Summary of the Invention

[0005] The present invention provides a display device in accordance with an embodiment of the present invention. This solves the problem in the prior art that, after a flexible circuit board and a driver chip are bent to the back of a display panel, the flexible circuit board occupies a large space, resulting in a small installation space for other components (e.g., a battery) that need to be disposed on the back of the display panel. The technical solution is as follows:

[0006] A display device is provided, comprising:

[0007] A display panel, the display panel comprising: a planar portion, and a panel bending portion connected to the planar portion, wherein a display area of ​​the display panel is located within the planar portion;

[0008] and a driving chip and a flexible circuit board bound and connected to the panel bending portion;

[0009] Among them, after the panel bending portion is bent, the part in the panel bending portion, the driving chip and the flexible circuit board are all located on the side of the back of the planar portion away from the display surface of the planar portion, and the orthographic projection of the flexible circuit board on the back of the planar portion and the orthographic projection of the driving chip on the back of the planar portion have an overlapping area.

[0010] Optionally, the flexible circuit board has a hollow structure, and the orthographic projection of the driving chip on the back surface of the planar portion is located within the orthographic projection of the hollow structure on the back surface of the planar portion.

[0011] Optionally, the display device also includes: a spacer located between the panel bending portion and the flexible circuit board, the spacer being connected to the panel bending portion and the flexible circuit board respectively, and the spacer, the panel bending portion and the flexible circuit board are used to form a accommodating space, and the driving chip is located in the accommodating space.

[0012] Optionally, the spacer is an annular structure, and the orthographic projection of the driver chip on the back surface of the planar portion is located within an area enclosed by the orthographic projection of the spacer on the back surface of the planar portion.

[0013] Optionally, the flexible circuit board has: a device area for fixing components, and a soldering foot area for binding and connecting with the bent portion of the panel;

[0014] Before the panel bending portion is bent, the device area is closer to the display area of ​​the display panel than the solder foot area.

[0015] Optionally, the flexible circuit board includes: a substrate, and a plurality of display signal traces, a plurality of touch signal traces, and a plurality of first solder pins located on one side of the substrate, the plurality of first solder pins being used to be bound and connected to the panel bending portion, the plurality of display signal traces being electrically connected to a portion of the plurality of first solder pins, and the plurality of touch signal traces being electrically connected to another portion of the plurality of first solder pins;

[0016] The orthographic projection of the display signal line on the substrate does not overlap with the orthographic projection of the touch signal line on the substrate.

[0017] Optionally, the plurality of display signal lines, the plurality of touch signal lines, and the plurality of first solder pins are provided in the same layer and are made of the same material.

[0018] Optionally, the plurality of touch signal lines include: a plurality of touch drive signal lines and a plurality of touch sensing signal lines;

[0019] Among the plurality of first solder pins, the first solder pin connected to the display signal line is distributed between: the first solder pin connected to the touch drive signal line and the first solder pin connected to the touch sensing signal line;

[0020] At least one of the touch drive signal routing and the touch sensing signal routing includes a winding portion, and the orthographic projection of the driver chip on the substrate is located between the orthographic projections of the plurality of first solder pins on the substrate and the orthographic projection of the winding portion on the substrate.

[0021] Optionally, the flexible circuit board further includes: a plurality of components, the plurality of components being used to be electrically connected to the plurality of display signal traces and the plurality of touch signal traces;

[0022] The plurality of components are located on a side of the substrate away from the plurality of first solder legs, and the flexible circuit board further comprises: a first reinforcing member disposed on the same side as the plurality of first solder legs, and a second reinforcing member disposed on the same side as the plurality of components, wherein the orthographic projections of the plurality of components on the substrate are located within the orthographic projection of the first reinforcing member on the substrate, and the orthographic projections of the plurality of first solder legs on the substrate are located within the orthographic projection of the second reinforcing member on the substrate;

[0023] Alternatively, the multiple components are located on a side of the substrate close to the multiple first solder feet, and the flexible circuit board further includes: a reinforcement layer located on a side of the substrate away from the multiple first solder feet, and the orthographic projections of the multiple components on the substrate and the orthographic projections of the multiple first solder feet on the substrate are both located within the orthographic projection of the reinforcement layer on the substrate.

[0024] Optionally, the display device further comprises: a support block located between the planar portion and the panel bending portion, the support block being bonded to the back surfaces of the panel bending portion and the planar portion respectively;

[0025] When the multiple components are located on a side of the substrate close to the multiple first solder legs, the display device further includes: an auxiliary support block located between the planar portion and the flexible circuit board, the auxiliary support block being bonded to the flexible circuit board and the back surface of the planar portion, respectively, and the orthographic projection of the auxiliary support block on the substrate does not overlap with the orthographic projection of the components on the substrate.

[0026] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0027] A display device includes a display panel, a driver chip, and a flexible circuit board. The driver chip and the flexible circuit board are attached to a folded portion of the display panel. Because the orthographic projection of the flexible circuit board on the back of the planar portion overlaps with the orthographic projection of the driver chip on the back of the planar portion, after the flexible circuit board and the driver chip are bent to the back of the display panel, the width of the flexible circuit board protruding from the display panel is small. This reduces the space occupied by the flexible circuit board on the back of the display panel, effectively increasing the installation space for other components that need to be installed on the back of the display panel in the display device. For example, if the other component is a battery, the battery installation space in the display device is larger, thereby increasing the battery capacity and improving the battery life of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1 This is a top view of a common display device currently;

[0030] Figure 2 This is a bottom view of a display device provided by an embodiment of the present application;

[0031] Figure 3 yes Figure 2 A side view of the display device is shown;

[0032] Figure 4 is a top view of a display device provided in an embodiment of the present application;

[0033] Figure 5 yes Figure 4 A bottom view of the panel bending portion of the display device after bending is shown;

[0034] Figure 6 yes Figure 5 A side view of the display device is shown;

[0035] Figure 7 is a side view of another display device provided by an embodiment of the present application;

[0036] Figure 8 yes Figure 6 Another schematic diagram of the panel bending portion in the display device before bending is shown;

[0037] Figure 9 yes Figure 7A schematic diagram of a panel bending portion in a display device before bending is shown;

[0038] Figure 10 Yes Figure 9 A schematic diagram of a panel bending portion in a display device after bending is shown;

[0039] Figure 11 This is a top view of a common flexible circuit board.

[0040] Figure 12 1 is a bottom view of a flexible circuit board provided in an embodiment of the present application;

[0041] Figure 13 yes Figure 12 A schematic cross-sectional view of the flexible circuit board at PP' is shown;

[0042] Figure 14 yes Figure 12 Another cross-sectional schematic diagram of the flexible circuit board at PP' is shown;

[0043] Figure 15 This is a side view of another display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0045] Please refer to Figure 1 , Figure 1 The display device 00 may include a display panel 01 , a flexible circuit board 02 , and a driver chip 03 .

[0046] The display panel 01 has a display area 01a and a non-display area 01b located outside the display area 01a. The non-display area 01b of the display panel 01 is provided with a first pad group ( Figure 1 Not shown) and the second pad group ( Figure 1 The pads in the first pad group and the pads in the second pad group can be connected by connecting wires ( Figure 1 (not shown) connection.

[0047] The ends of the flexible circuit board 02 are provided with a plurality of first solder pins 02a. The first solder pins 02a of the flexible circuit board 02 can be bonded to the solder pads of the first solder pad group provided in the display panel 01 using an anisotropic conductive film (ACF), thereby binding the flexible circuit board 02 to the first solder pad group of the display panel 01 and achieving an electrical connection between the flexible circuit board 02 and the display panel 01.

[0048] The driver chip 03 is provided with a plurality of second solder pins ( Figure 1 The second solder pins in the driver chip 03 can also be bonded to the solder pads in the second solder pad group provided in the display panel 01 through the ACF, so as to bind the driver chip 03 to the second solder pad group of the display panel 01 and realize electrical connection between the driver chip 03 and the display panel 01.

[0049] In this way, the flexible circuit board 02 can apply electrical signals to the driving chip 03 through the pads in the first pad group, the connecting leads and the pads in the second pad group in sequence, so that the driving chip 03 can apply electrical signals to the electrode structure set in the display area 01a, so that the display area 01a of the display panel 01 can display the corresponding picture.

[0050] Please refer to Figure 2 and Figure 3 , Figure 2 is a bottom view of a display device provided in an embodiment of the present application, Figure 3 yes Figure 2 A side view of the display device shown. Since the display panel 01 is generally a flexible display panel. Therefore, in order to reduce the size of the frame in the display device 00, after the flexible circuit board 02 and the driver chip 03 are bound to the non-display area 01b of the display panel 01, the portion where the first pad group and the second pad group are set in the non-display area 01b can be bent to bend the flexible circuit board 02 and the driver chip 03 to the back side of the display panel 01 (that is, the side opposite to the display surface of the display panel 01). The display device 00 may further include: a support block 04, after the portion where the first pad group and the second pad group are set in the non-display area 01b is bent, the support block 04 may be located between the bent portion and the unbent portion of the display panel 01, and the support block 04 may be bonded to the bent portion and the unbent portion of the display panel 01, respectively. However, as Figure 3As shown, after the flexible circuit board 02 and driver chip 03 are bent to the back of the display panel 01, the protrusion width d0 of the flexible circuit board 02 relative to the display panel 01 is relatively large, resulting in the flexible circuit board 02 occupying a relatively large space on the back of the display panel 01. Since the display device 00 may also include other components 05 disposed on the back of the display panel 01, the large space occupied by the flexible circuit board 02 on the back of the display panel 01 may limit the installation space for other components 05 in the display device 00. For example, if the other component 05 is a battery, this may result in a smaller installation space for the battery in the display device 00, resulting in a smaller battery capacity and a reduced battery life.

[0051] An embodiment of the present application provides a display device, which can be any electronic device with a display function, such as a mobile phone, a television, a tablet computer, a laptop computer, or a monitor.

[0052] Please refer to Figure 4 , Figure 4 FIG1 is a top view of a display device provided in an embodiment of the present application. The display device 000 may include: a display panel 100, a flexible circuit board 200, and a driver chip 300.

[0053] The display panel 100 may include: a planar portion 101 ( Figure 4 Not shown) and the panel bending portion 102 ( Figure 4 (not shown). The flat portion 101 is connected to the panel bending portion 102, and the panel bending portion 102 can be bent to the back of the flat portion 101 (i.e., the side opposite to the display surface of the display panel 100). It should be noted that Figure 4 The structure shown is the structure of the display device 000 before the panel bending portion 102 is bent.

[0054] The display panel 100 has a display area 100a and a non-display area 100b located outside the display area 100a. The display area 100a of the display panel 100 is located within the planar portion 101. It is understood that the non-display area 100b of the display panel 100 is distributed not only within the planar portion 101 but also within the panel bending portion 102.

[0055] It should also be noted that, for the convenience of subsequent description, the display panel 100 may be defined as having a front side and a back side. The front side of the display panel 100 is the side of the display panel 100 that is on the same side as the display surface, and the back side of the display panel 100 is the side of the display panel 100 that is opposite to the display surface. Thus, the front side of the planar portion 101 of the display panel 100 may include the entire display surface.

[0056] Please continue to refer to Figure 4 , the driving chip 300 and the flexible circuit board 200 in the display device 000 are both bound and connected to the panel bending portion 102. For example, the panel bending portion 102 is provided with a first pad group ( Figure 4 Not shown) and the second pad group ( Figure 4 (not shown), and the second pad group is closer to the display area 100a than the first pad group. The first pad group can be bonded to the multiple first solder pins 200a in the flexible circuit board 200 through the ACF to bind the flexible circuit board 200 to the panel bending portion 102 of the display panel 100, and to achieve electrical connection between the flexible circuit board 200 and the display panel 100. The second pad group can be bonded to the multiple second solder pins ( Figure 4 The first pad group and the second pad group can be connected by bonding (not shown) to bind the driver chip 300 to the panel bending portion 102 of the display panel 100, and to achieve electrical connection between the driver chip 300 and the display panel 100. The pads in the first pad group and the pads in the second pad group can be connected by connecting leads ( Figure 4 In this way, the flexible circuit board 200 can apply electrical signals to the driving chip 300 through the pads in the first pad group, the connecting leads, and the pads in the second pad group in sequence, so that the driving chip 300 can apply electrical signals to the electrode structure set in the display area 100a, so that the display area 100a of the display panel 100 can display the corresponding picture.

[0057] In order to more clearly see the structure of the panel bending portion 102 of the display panel 100 after bending, please refer to Figure 5 and Figure 6 , Figure 5 yes Figure 4 The bottom view of the panel bending portion of the display device after bending is shown. Figure 6 yes Figure 5A side view of a display device is shown. After the panel bend 102 of the display panel 100 is bent, the portion within the panel bend 102, the driver chip 300, and the flexible circuit board 200 are all located on the back side of the planar portion 101, facing away from the display surface of the planar portion 101. The orthographic projection of the flexible circuit board 200 on the back side of the planar portion 101 overlaps with the orthographic projection of the driver chip 300 on the back side of the planar portion 101. It is understood that at least a portion of the orthographic projection of the flexible circuit board 200 on the back side of the planar portion 101 lies within the orthographic projection of the driver chip 300 on the back side of the planar portion 101. In contrast, in the related art, the orthographic projection of the driver chip on the back side of the display panel and the orthographic projection of the flexible circuit board on the back side of the display panel do not overlap. Therefore, the width d1 of the flexible circuit board 200 protruding from the display panel 100 in this application is smaller than the width d0 of the flexible circuit board 02 protruding from the display panel 01 in the related art.

[0058] In this case, after the flexible circuit board 200 and the driver chip 300 are bent to the back of the display panel 100, the width d1 of the flexible circuit board 200 protruding from the display panel 100 is small. As a result, the flexible circuit board 200 occupies less space on the back of the display panel 100, effectively increasing the installation space for other components 500 in the display device 000 that need to be installed on the back of the display panel 100. For example, if the other component 500 is a battery, the battery installation space in the display device 000 is larger, thereby increasing the battery capacity and improving the battery life of the display device 000.

[0059] In summary, the display device provided by the embodiment of the present application includes: a display panel, a driver chip, and a flexible circuit board. The driver chip and the flexible circuit board are bound to the panel bending portion of the display panel. Because the orthographic projection of the flexible circuit board on the back of the flat portion overlaps with the orthographic projection of the driver chip on the back of the flat portion, after the flexible circuit board and the driver chip are bent to the back of the display panel, the width of the flexible circuit board protruding relative to the display panel is small. In this way, the flexible circuit board occupies less space on the back of the display panel, which can effectively increase the installation space of other components that need to be installed on the back of the display panel in the display device. For example, when the other component is a battery, the installation space of the battery in the display device is larger, which can increase the capacity of the battery and improve the battery life of the display device.

[0060] In the embodiment of the present application, after the panel bending portion 102 of the display panel 100 is bent, there are multiple optional implementation methods for creating an overlapping area between the orthographic projection of the flexible circuit board 200 on the back surface of the planar portion 101 and the orthographic projection of the driver chip 300 on the back surface of the planar portion 101. The embodiment of the present application uses the following two optional implementation methods as examples for schematic illustration:

[0061] The first optional implementation method is Figure 4 、 Figure 5 and Figure 6 As shown, the flexible circuit board 200 in the display device 000 has a hollow structure 200 b , and the orthographic projection of the driving chip 300 in the display device 000 on the back surface of the planar portion 101 is located within the orthographic projection of the hollow structure 200 b on the back surface of the planar portion 101 .

[0062] It should be noted that before the flexible circuit board 200 is bonded to the panel bend 102, a hollow structure 200b can be formed within the flexible circuit board 200 through laser cutting. After the flexible circuit board 200 is bonded to the panel bend 102, the hollow structure 200b can provide a space for accommodating the driver chip 300. The shape of the hollow structure 200b can match the shape of the driver chip 300. For example, if the orthographic projection of the driver chip 300 on the back surface of the planar portion 101 is rectangular, the orthographic projection of the driver chip 300 on the back surface of the planar portion 101 can also be rectangular.

[0063] It can be understood that the area of ​​the positive projection of the driver chip 300 on the back side of the planar portion 101 is smaller than the area of ​​the positive projection of the hollow structure 200b on the back side of the planar portion 101, so as to ensure that the driver chip 300 and the flexible circuit board 200 do not contact each other, thereby ensuring that the flexible circuit board 200 will not crush the driver chip 300 during the binding process of the flexible circuit board 200.

[0064] For the second optional implementation, please refer to Figure 7 , Figure 7 This is a side view of another display device provided by an embodiment of the present application. The display device 000 further includes a spacer 600. The spacer 600 is positioned between the panel bend 102 and the flexible circuit board 200, and can be connected to the panel bend 102 and the flexible circuit board 200, respectively. The spacer 600, the panel bend 102, and the flexible circuit board 200 together form a receiving space S, within which the driver chip 300 can be located.

[0065] It should be noted that one side of the spacer 600 can be bonded to the front of the panel bend 102, and the other side can be bonded to the side of the flexible circuit board 200 near the panel bend 102. The driver chip 300 can be located within the accommodation space S formed by the spacer 600, the flexible circuit board 200, and the panel bend 102. In a direction perpendicular to the front of the panel bend 102, the thickness of the spacer 600 can be greater than the height of the driver chip 200. For example, the thickness of the spacer 600 can range from 0.2 mm to 0.3 mm, and the height of the driver chip 300 can be approximately 0.1 mm. This ensures a certain distance between the driver chip 300 and the side of the flexible circuit board 200 near the panel bend 102, ensuring that the flexible circuit board 200 does not crush the driver chip 300 during the binding process.

[0066] Furthermore, the spacer 600 can be an annular structure, with the orthographic projection of the driver chip 300 on the back surface of the planar portion 101 located within the area enclosed by the orthographic projection of the spacer 600 on the back surface of the planar portion 101. In this case, the accommodation space S enclosed by the spacer 600, the flexible printed circuit board 200, and the panel bend 102 is a sealed space. Once the driver chip 300 is located within this accommodation space S, the spacer 600, the flexible printed circuit board 200, and the panel bend 102 prevent dust from entering the accommodation space S, thereby ensuring that the driver chip 300 does not experience adverse performance degradation due to dust intrusion from the external environment.

[0067] It is understood that the area of ​​the orthographic projection of the driver chip 300 on the back surface of the planar portion 101 is smaller than the area enclosed by the orthographic projection of the spacer 600 on the back surface of the planar portion 101. This ensures that the driver chip 300 and the spacer 600 do not come into contact with each other, further ensuring that the flexible circuit board 200 does not crush the driver chip 300 during the bonding process of the flexible circuit board 200.

[0068] In the embodiments of this application, Figure 8 and Figure 9 As shown, Figure 8 yes Figure 6 Another schematic diagram of the panel bending portion in the display device before bending is shown. Figure 9 yes Figure 7 The flexible printed circuit board 200 has a device area 200c and a soldering foot area 200d. The device area 200c is used to fix the components 204, and the soldering foot area 200d is used to bind and connect with the panel bending part 102.

[0069] For the first optional implementation method mentioned above, Figure 6 and Figure 8 As shown, since the flexible circuit board 200 needs to include a hollow structure 200b for cooperating with the driver chip 300, to ensure that the hollow structure 200b does not affect the distribution of the components 204, it is necessary to ensure that the device area 200c of the flexible circuit board 200 is distributed on the side of the solder foot area 200d away from the hollow structure 200b. Furthermore, before the panel bending portion 102 is bent, the hollow structure 200b in the flexible circuit board 200 is closer to the display area 100a of the display panel 100 than the solder foot area 200d. Therefore, before the panel bending portion 102 is bent, the solder foot area 200d in the flexible circuit board 200 is closer to the display area 100a of the display panel 100 than the device area 200c.

[0070] For the second optional implementation method mentioned above, Figure 7 and Figure 9 As shown, since there is no need to provide a hollow structure within the flexible circuit board 200, before the panel bending portion 102 is bent, the device area 200c of the flexible circuit board 200 can be closer to the display area 100a of the display panel 100 relative to the solder foot area 200d. It is understood that before the panel bending portion 102 is bent, the device area 200c of the flexible circuit board 200 is located between the solder foot area 200d and the display area 100a of the display panel 100.

[0071] In this case, no components need to be integrated into the portion of the flexible circuit board 200 that protrudes relative to the display panel 100. Figure 10 As shown, Figure 10 yes Figure 9 The schematic diagram of the panel bending portion in the display device after bending is shown. After the flexible circuit board 200 and the driver chip 300 are bent to the back of the display panel 100, the protruding width d2 of the flexible circuit board 200 relative to the display panel 100 can be further reduced, so as to further reduce the space occupied by the flexible circuit board 200 on the back of the display panel 100, thereby further increasing the installation space of other components 500 installed on the back of the display panel 100 in the display device 000.

[0072] In related art, please refer to Figure 11 , Figure 11This is a top view of a common flexible printed circuit board. Flexible printed circuit board 02 may include multiple first solder pins 02a, multiple display signal traces 02b, and multiple touch signal traces 02c. The multiple touch signal traces 02c may include multiple touch drive signal traces 02c1 and multiple touch sensing signal traces 02c2. The multiple display signal traces 02b need to be connected to the first solder pins located in the middle region of the multiple first solder pins 02a, the multiple touch drive signal traces 02c1 need to be connected to the first solder pins located on one side of the multiple first solder pins 02a, and the multiple touch sensing signal traces 02c2 need to be connected to the first solder pins located on the other side of the multiple first solder pins 02a. Furthermore, the multiple touch drive signal traces 02c1 and the multiple touch sensing signal traces 02c2 each need to be electrically connected to a touch control chip 02d integrated within the flexible printed circuit board 02. Therefore, one of the touch driving signal trace 02c1 and the touch sensing signal trace 02c2 will inevitably cross the display signal trace 02b and be connected to the driver chip 02d. Figure 11 For this explanation, the touch drive signal trace 02c1 needs to cross over the display signal trace 02b to electrically connect to the touch chip 02d. This creates a spatial intersection between the touch drive signal trace 02c1 and the display signal trace 02b in the flexible circuit board 021. This causes crosstalk between the signals transmitted by the display signal trace 02b and the touch drive signal trace 02c1 at this intersection, which in turn affects the display and touch performance of the display device.

[0073] In the embodiment of this application, please refer to Figure 12 and Figure 13 , Figure 12 This is a bottom view of a flexible circuit board provided in an embodiment of the present application. Figure 13 yes Figure 12 A schematic cross-sectional view of a flexible circuit board at point PP' is shown. The flexible circuit board 200 may include a substrate 201, multiple display signal traces 202, multiple touch signal traces 203, and multiple first solder pins 200a. The multiple display signal traces 202, multiple touch signal traces 203, and multiple first solder pins 200a in the flexible circuit board 200 are all located on one side of the substrate 201.

[0074] The plurality of first solder pins 200a are used to bind and connect to the panel bend 102. The plurality of first solder pins 200a can be evenly distributed within the solder pin area 200c of the flexible circuit board 200. The plurality of display signal traces 202 in the flexible circuit board 200 are electrically connected to a portion of the plurality of first solder pins 200a, and the plurality of touch signal traces 203 in the flexible circuit board 200 are electrically connected to another portion of the plurality of first solder pins 200a. Furthermore, the orthographic projections of the display signal traces 202 and the touch signal traces 203 on the substrate 201 do not overlap. That is to say, in the flexible circuit board 200 provided in the embodiment of the present application, there is no spatial intersection area between the display signal line 202 and the touch signal line 203 in the flexible circuit board 200, so that no crosstalk occurs between the signal transmitted by the display signal line 202 and the signal transmitted by the touch signal line 203, thereby ensuring that the display function and touch function of the display device are not interfered with.

[0075] In an embodiment of the present application, when the orthographic projection of the display signal trace 202 on the substrate 201 does not overlap with the orthographic projection of the touch signal trace 203 on the substrate 201, the multiple display signal traces 202, the multiple touch signal traces 203, and the multiple first solder pins 200a can be arranged on the same layer and made of the same material. In other words, the multiple display signal traces 202, the multiple touch signal traces, and the multiple first solder pins 200a are formed through the same patterning process. In this case, the flexible circuit board 200 can include a layer of conductive pattern, which can include: the multiple display signal traces 202, the multiple touch signal traces 203, and the multiple first solder pins 200a. This effectively simplifies the manufacturing process of the flexible circuit board 200 and reduces the manufacturing cost of the flexible circuit board 200.

[0076] For example, the multiple touch signal traces 203 in the flexible circuit board 200 may include: multiple touch drive signal traces 203a and multiple touch sensing signal traces 203b. Among the multiple first solder pins 200a, the first solder pin 200a connected to the display signal trace 202 is distributed between the first solder pin 200a connected to the touch drive signal trace 203a and the first solder pin 200a connected to the touch sensing signal trace 203b. In other words, the multiple first solder pins 200a in the flexible display panel 200 may include: multiple first solder pins located in the middle area, multiple first solder pins located on one side of the middle area, and multiple first solder pins located on the other side of the middle area. One end of the multiple display signal traces 202 in the flexible circuit board 200 can be electrically connected in a one-to-one correspondence with the multiple first solder pins 200a located in the middle area; one end of the multiple touch drive signal traces 203a in the flexible circuit board 200 can be electrically connected in a one-to-one correspondence with the multiple first solder pins 200a located on one side of the middle area; one end of the multiple touch sensing signal traces 203b in the flexible circuit board 200 can be electrically connected in a one-to-one correspondence with the multiple first solder pins 200a located on the other side of the middle area.

[0077] Here, at least one of the touch driving signal trace 203a and the touch sensing signal trace 203b includes a winding portion L1. Figure 12 The orthographic projection of the first solder legs 200a on the substrate 201 is located between the orthographic projection of the first solder legs 200a on the substrate 201 and the orthographic projection of the winding portion L1 on the substrate 201. Figure 12 The example in which the touch sensing signal trace 203b includes the winding portion L1 and the touch driving signal trace 203a does not is used for schematic illustration. In other possible implementations, the touch driving signal trace 203a may also include the winding portion L1, or both the touch driving signal trace 203a and the touch sensing signal trace 203b may include the winding portion L1. This embodiment of the present application is not limited to this.

[0078] In this case, the orthographic projections of the display signal traces 202 in the flexible printed circuit board 200 on the substrate 201 are all located on the side of the orthographic projections of the plurality of first solder pins 200a on the substrate 201 that faces away from the orthographic projection of the driver chip 300 on the substrate 201. Therefore, in the flexible printed circuit board 200, the plurality of first solder pins 200a are located between the plurality of display traces 202 and the winding portion L1. Furthermore, since the plurality of touch drive signal traces 203a and the plurality of touch sensing signal traces 203b all need to be electrically connected to the same component (e.g., the touch chip 204b) in the flexible printed circuit board 200, the touch sensing signal traces 203b need to cross over the display signal traces 202 during the connection process with the touch chip 204b. To this end, when the touch sensing signal line 203b includes a winding portion L1, and the winding portion L1 is located on the side of the multiple first solder pins 200a away from the display signal line 202, it can be ensured that the winding portion L1 and the display signal line 202 do not cross each other, and thus the touch sensing signal line 203b can be normally electrically connected to the touch chip 204b under the premise that the touch sensing signal line 203b and the display signal line 202 do not cross each other.

[0079] It should be noted that in Figure 12 In the illustrated flexible circuit board 200, the touch sensing signal trace 203b must cross multiple display signal traces 202 before it can be electrically connected to the touch chip 204b, while the touch drive signal trace 203a can be directly electrically connected to the touch chip 204b without crossing multiple display signal traces 202. Therefore, the touch sensing signal trace 203b can include a winding portion L1, while the touch drive signal trace 203a does not need to include a winding portion L1. In this case, one end of the touch drive signal trace 203a can be electrically connected to the first solder pin 200a, and the other end can be directly electrically connected to the touch chip 204b. The touch sensing signal trace 203b not only needs to include the winding portion L1, but also needs to include a first connecting portion L2 and a second connecting portion L3. Among them, one end of the first connection part L2 can be electrically connected to the first solder foot 200a, and the other end can be electrically connected to one end of the winding part L1; one end of the second connection part L3 can be electrically connected to the touch chip 204b, and the other end can be electrically connected to the other end of the winding part L1.

[0080] Optional, such as Figure 12As shown, the flexible circuit board 200 further includes a plurality of components 204. Here, the plurality of components 204 may be evenly distributed within the device area 200c of the flexible circuit board 200. The plurality of components 204 are configured to electrically connect to the plurality of display signal traces 202 and the plurality of touch signal traces 203. For example, the plurality of components 204 may include a display component 204a configured to electrically connect to the plurality of display signal traces 202, and a touch chip 204b configured to electrically connect to the plurality of touch signal traces 203. The display component 204a may include at least one of a capacitor, an inductor, and a diode. The display component 204a may be electrically connected to the driver chip 300 via the display signal trace 202, the first solder pin 200a, the pads in the first pad group of the display panel 100, the connecting leads, and the pads in the second pad group. The placement of the display component 204a within the flexible circuit board 200 assists the driver chip 300 in driving the display panel 100 to display an image, enabling the display panel 100 to achieve a display function. The touch chip 204b may be electrically connected to the display panel 100 via the touch signal trace 203, the first solder pin 200a, and the pads in the first pad group. The touch chip 204b enables the display panel 100 to achieve a touch function.

[0081] In the present application, the multiple components 204 may further include a connector 204c. A portion of the multiple display signal traces 202 may be electrically connected to the display component 204a, and another portion of the multiple display signal traces 202 may be electrically connected to the connector 204c. The connector 204c may also be electrically connected to the touch control chip 204b. Here, the connector 204c may be electrically connected to a mainboard within the display device 000. The mainboard may supply power to the touch control chip 204b via the connector 204c to enable the touch control chip 204b to function properly. The mainboard may also supply power to the driver chip 300 via the connector 204c and the display signal traces 202 to enable the driver signal 300 to function properly.

[0082] In the embodiment of the present application, there are various positional relationships between the components 204 integrated in the flexible circuit board 200 and the first solder pin 200a. The embodiment of the present application is described with the following two exemplary implementations as examples:

[0083] The first exemplary implementation is as follows: Figure 13As shown, multiple components 204 are located on a side of the substrate 201 away from the multiple first solder legs 200a. In other words, the multiple components 204 and the multiple first solder legs 200a are located on opposite sides of the substrate 201. The flexible circuit board 200 may further include a first reinforcing member 206a and a second reinforcing member 206b. The first reinforcing member 206a is located on the same side as the multiple first solder legs 200a, and the second reinforcing member 206b is located on the same side as the multiple components 204. Furthermore, the orthographic projections of the multiple components 204 on the substrate 201 are located within the orthographic projection of the first reinforcing member 206a on the substrate 201, and the orthographic projections of the multiple first solder legs 200a on the substrate 201 are located within the orthographic projection of the second reinforcing member 206b on the substrate 201. In this case, the first reinforcing member 206a ensures high strength in the portion of the flexible circuit board 200 where the components 204 are located, ensuring that the components 204 can be stably integrated within the flexible circuit board 200. The second reinforcement member 206b can ensure that the strength of the portion of the flexible circuit board 200 where the first solder foot 200a is set is high, so as to ensure that the first solder foot 200a can be stably integrated in the flexible circuit board 200, and can ensure that the flexible circuit board 200 can be normally bound to the panel bending portion 102 in the display panel 100 through the first solder foot 200a.

[0084] The second exemplary implementation method is: Figure 14 yes Figure 12 Another cross-sectional view of the flexible circuit board at the PP' line is shown. Multiple components 204 are located on the side of the substrate 201 near the multiple first solder legs 200a. In other words, the multiple components 204 and the multiple first solder legs 200a are located on the same layer of the substrate 201. The flexible circuit board 200 may further include a reinforcement layer 207. The reinforcement layer 207 is located on the side of the substrate 201 facing away from the multiple first solder legs 200a. The orthographic projections of the multiple components 204 and the multiple first solder legs 200a on the substrate 201 are both located within the orthographic projection of the reinforcement layer 207 on the substrate 201. In this case, the reinforcement layer 207 ensures high strength in the areas of the flexible circuit board 200 where the components 204 and the first solder legs 200a are located, ensuring that both the components 204 and the first solder legs 200a are stably integrated within the flexible circuit board 200.

[0085] Optionally, the first and second reinforcing members 206 and 206b in the first exemplary embodiment, as well as the reinforcing layer 207 in the second exemplary embodiment, can increase the strength of the flexible circuit board 200 and prevent damage to the components 204 and the first solder legs 200a caused by bending of the flexible circuit board 200. The first and second reinforcing members 206 and 206b, and the reinforcing layer 207 can be made of a variety of materials, such as stainless steel, plastic, or resin, and are not limited in this embodiment.

[0086] It should be noted that if Figure 13 and Figure 14 As shown, a conductive pattern 209 is provided in the flexible circuit board 200 , and a plurality of first solder legs 200 a are part of the conductive pattern 209 . The conductive pattern 209 may further include: a display signal trace 202 and a touch signal trace 203 .

[0087] Optionally, the flexible circuit board 200 may further include an insulating layer 208 located on the side of the conductive pattern layer 209 facing away from the substrate 201. The insulating layer 208 can prevent the first reinforcing member 206a or the component 204 disposed on the same side as the first solder foot 200a from interfering with the conductive pattern 209.

[0088] The portion of the insulating layer 208 at the position of the first solder leg 200 a has a notch to ensure that the first solder leg 200 a can leak out of the notch, thereby ensuring that the first solder leg 200 a can be normally bound to the panel bending portion 102 .

[0089] It should be noted that, in the first exemplary implementation described above, when the multiple components 204 and the multiple first solder legs 200a are respectively located on opposite sides of the substrate 201, an opening is provided in the substrate 201 to ensure that the components 204 can normally pass through the opening to electrically connect with the display signal traces 202 and the touch signal traces 203 in the conductive pattern 209. In the second exemplary implementation described above, when the multiple components 204 and the multiple first solder legs 200a are respectively located on the same side of the substrate 201, an opening is provided in the insulating layer 208 to ensure that the components 204 can normally pass through the opening to electrically connect with the display signal traces 202 and the touch signal traces 203 in the conductive pattern 209.

[0090] Optional, such as Figure 6 and Figure 7As shown, the display device 000 may further include a support block 400 located between the flat portion 101 and the panel bend portion 102 of the display panel 100. The support block 400 may be bonded to the back surface of the panel bend portion 102 and the flat portion 101, respectively. The support block 400 may support the flexible circuit board 200 and the driver chip 300.

[0091] It should be noted that, for the first exemplary implementation, when the plurality of components 204 and the plurality of first solder legs 200a are located on both sides of the substrate 201, as shown in FIG. Figure 6 and Figure 7 As shown, the display device 000 may only include: a supporting block 400 located between the flat portion 101 and the panel bending portion 102 .

[0092] In the second exemplary implementation, when the plurality of components 204 and the plurality of first solder legs 200a are respectively located on the same side of the substrate 201, as shown in FIG. Figure 15 As shown, Figure 15 This is a side view of another display device provided by an embodiment of the present application. Display device 000 may include not only a support block 400 positioned between the planar portion 101 and the panel bend portion 102, but also an auxiliary support block 700 positioned between the planar portion 101 and the flexible printed circuit board 200. The auxiliary support block 700 may be bonded to the back surface of the flexible printed circuit board 200 and the planar portion 101, respectively. The orthographic projection of the auxiliary support block 700 on the substrate 201 does not overlap with the orthographic projection of the component 204 on the substrate 201. This prevents damage to the component 204 caused by contact with the back surface of the planar portion 101.

[0093] In summary, the display device provided by the embodiment of the present application includes: a display panel, a driver chip, and a flexible circuit board. The driver chip and the flexible circuit board are bound to the panel bending portion of the display panel. Because the orthographic projection of the flexible circuit board on the back of the flat portion overlaps with the orthographic projection of the driver chip on the back of the flat portion, after the flexible circuit board and the driver chip are bent to the back of the display panel, the width of the flexible circuit board protruding relative to the display panel is small. In this way, the flexible circuit board occupies less space on the back of the display panel, which can effectively increase the installation space of other components that need to be installed on the back of the display panel in the display device. For example, when the other component is a battery, the installation space of the battery in the display device is larger, which can increase the capacity of the battery and improve the battery life of the display device.

[0094] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0095] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0096] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display device, characterized in that: include: A display panel, the display panel comprising: a planar portion, and a panel bending portion connected to the planar portion, wherein a display area of ​​the display panel is located within the planar portion; and a driving chip and a flexible circuit board bound and connected to the panel bending portion; wherein, after the panel bending portion is bent, a portion of the panel bending portion, the driver chip, and the flexible circuit board are all located on a side of the back surface of the planar portion that is away from the display surface of the planar portion, and the flexible circuit board has a hollow structure, the orthographic projection of the driver chip on the back surface of the planar portion is located within the orthographic projection of the hollow structure on the back surface of the planar portion, and the area of ​​the orthographic projection of the driver chip on the back surface of the planar portion is smaller than the area of ​​the orthographic projection of the hollow structure on the back surface of the planar portion; The flexible circuit board includes: a substrate, and a plurality of display signal traces, a plurality of touch signal traces, and a plurality of first solder pins located on one side of the substrate, the plurality of first solder pins being used to bind and connect with the panel bending portion, the plurality of display signal traces being electrically connected to a portion of the plurality of first solder pins, and the plurality of touch signal traces being electrically connected to another portion of the plurality of first solder pins; the orthographic projections of the display signal traces on the substrate do not overlap with the orthographic projections of the touch signal traces on the substrate; The plurality of touch signal lines include: a plurality of touch drive signal lines and a plurality of touch sensing signal lines; Among the plurality of first solder pins, the first solder pin connected to the display signal line is distributed between the first solder pin connected to the touch drive signal line and the first solder pin connected to the touch sensing signal line; At least one of the touch drive signal routing and the touch sensing signal routing includes a winding portion, and the orthographic projection of the driver chip on the substrate is located between the orthographic projections of the plurality of first solder pins on the substrate and the orthographic projection of the winding portion on the substrate.

2. The display device according to claim 1, wherein The flexible circuit board has: a device area for fixing components, and a soldering foot area for binding and connecting with the bent portion of the panel; Before the panel bending portion is bent, the device area is closer to the display area of ​​the display panel than the solder foot area.

3. The display device according to claim 1, wherein A plurality of display signal lines, a plurality of touch signal lines and a plurality of first solder pins are arranged on the same layer and are made of the same material.

4. The display device according to claim 1, wherein The flexible circuit board further includes: a plurality of components, the plurality of components being configured to be electrically connected to the plurality of display signal traces and the plurality of touch signal traces; The plurality of components are located on a side of the substrate away from the plurality of first solder legs, and the flexible circuit board further comprises: a first reinforcing member disposed on the same side as the plurality of first solder legs, and a second reinforcing member disposed on the same side as the plurality of components, wherein the orthographic projections of the plurality of components on the substrate are located within the orthographic projection of the first reinforcing member on the substrate, and the orthographic projections of the plurality of first solder legs on the substrate are located within the orthographic projection of the second reinforcing member on the substrate; Alternatively, the multiple components are located on a side of the substrate close to the multiple first solder feet, and the flexible circuit board further includes: a reinforcement layer located on a side of the substrate away from the multiple first solder feet, and the orthographic projections of the multiple components on the substrate and the orthographic projections of the multiple first solder feet on the substrate are both located within the orthographic projection of the reinforcement layer on the substrate.

5. The display device according to claim 4, wherein: The display device further comprises: a support block located between the planar portion and the panel bending portion, the support block being bonded to the back surfaces of the panel bending portion and the planar portion respectively; When the multiple components are located on a side of the substrate close to the multiple first solder legs, the display device further includes: an auxiliary support block located between the planar portion and the flexible circuit board, the auxiliary support block being bonded to the flexible circuit board and the back surface of the planar portion, respectively, and the orthographic projection of the auxiliary support block on the substrate does not overlap with the orthographic projection of the components on the substrate.

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