A manual wafer film pasting machine

Abstract

The application provides a manual wafer film pasting machine, which comprises a machine shell, a first machine cover movably connected to the middle position of the machine shell in the length direction, a second machine cover movably connected to the rear side of the machine shell, a workbench mechanism and a film pasting table mechanism arranged below the first machine cover, a roller mechanism arranged between the first machine cover and the second machine cover, and a material cylinder mechanism arranged below the second machine cover, and a circular cutter mechanism arranged above the workbench mechanism and the film pasting table mechanism is arranged on the first machine cover. The film pasting table mechanism is used for placing wafers of different sizes, the roller mechanism can not only firmly paste the film on the wafer, but also cut the film in the transverse direction, the material cylinder mechanism is used for collecting new films and release films, and can separate the release film on the new film, and the circular cutter mechanism can cut the film in the circumferential direction. The manual wafer film pasting machine is convenient for the operator to operate, and the working efficiency of film pasting is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer lamination technology, and in particular to a manual wafer lamination machine. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer. Domestic wafer production lines mainly use 8-inch and 12-inch wafers. Current wafer processing requires wafer lamination, but existing wafer lamination machines are inconvenient for operators and have low efficiency. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a manual wafer laminating machine to solve the problems of inconvenience for operators and low work efficiency in the prior art.

[0004] To achieve the above and other related objectives, the present invention provides a manual wafer laminating machine, comprising a housing, a first cover movably connected to the middle position of the housing along its length, and a second cover movably connected to the rear side of the housing. The inner side of the housing is provided with a worktable mechanism and a laminating tray mechanism located below the first cover, a roller mechanism located between the first and second covers, and a material cylinder mechanism located below the second cover. The laminating tray mechanism is mounted on the worktable mechanism. The worktable mechanism, roller mechanism, and material cylinder mechanism are sequentially installed inside the housing from front to back along its length. A circular cutter mechanism is mounted on the first cover above the worktable mechanism and the laminating tray mechanism.

[0005] In one embodiment of the present invention, an operation panel is provided on the front side of the housing, and the operation panel is provided with a power switch, a temperature control button, a heating switch and a vacuum switch from left to right.

[0006] In one embodiment of the present invention, the worktable mechanism includes a worktable, on which a placement groove for placing a film-applying tray mechanism is provided. The worktable has a plurality of mounting holes evenly spaced along the circumference of the placement groove. A set screw hole for mounting set screws is provided on the side of each mounting hole. Two transverse cutting grooves are provided on the worktable behind the placement groove, with two film-stretching notches located at the rearmost of the transverse cutting grooves. Two positioning pins are provided on the worktable between the two film-stretching notches. A magnet for fixing an iron ring is provided on the bottom side of the worktable.

[0007] In one embodiment of the present invention, the film application tray mechanism includes a tray base and a film application tray mounted on the tray base. The tray base has a plurality of connecting holes evenly spaced along the circumference of the tray base corresponding to the mounting holes. The film application tray is circular, and a vacuum inlet is provided at the center of the film application tray. A vacuum groove communicating with the vacuum inlet is provided on the film application tray. A 4-inch wafer positioning line, a 6-inch wafer positioning line, and an 8-inch wafer positioning line are arranged sequentially from the inside to the outside on the film application tray.

[0008] In one embodiment of the present invention, the roller mechanism includes two side plates and a horizontal plate located on the top side of the two side plates. A guide rail is installed on the front side of the two side plates, and a cross-cutting mechanism is slidably connected on the guide rail. The cross-cutting mechanism includes a cross-cutting blade and a cross-cutting blade handle located on the top side of the cross-cutting blade. Two drive cylinders are installed on the horizontal plate, and the two drive cylinders are connected to a film-applying roller through the horizontal plate.

[0009] In one embodiment of the present invention, a first bearing sleeve is provided on the opposite side of the two side plates, and two first linear shafts are provided on the inner side of the housing and slidably connected to the first bearing sleeves. A second bearing sleeve is provided on the horizontal plate, and a second linear shaft connected to the film-applying roller is slidably connected inside the second bearing sleeve. A handle is provided on the horizontal plate between the two second bearing sleeves. The number of the second bearing sleeves and the second linear shafts are both two.

[0010] In one embodiment of the present invention, the material cylinder mechanism includes a fixed plate mounted on the housing, a new film timing pulley and a release film timing pulley located on one side of the fixed plate, and a new film cylinder and a release film cylinder located on the other side of the fixed plate. The new film timing pulley and the release film timing pulley are connected by belt drive. The new film timing pulley is connected to the new film cylinder through a first rotating shaft. The release film timing pulley and the release film cylinder are connected by a friction pulley.

[0011] In one embodiment of the present invention, an airbag is installed inside the new membrane tube, and an air inlet communicating with the airbag is opened at the center of the new membrane synchronous belt pulley. Two membrane tensioning rods are provided behind the roller mechanism, and the release membrane tube is located between the new membrane tube and the membrane tensioning rods.

[0012] In one embodiment of the present invention, the circular cutter mechanism includes a circular cutter handle and a circular cutter rod mounted on a first cover. The end of the circular cutter handle is connected to the circular cutter rod via a rotating mechanism. A rubber wheel is mounted on one end of the circular cutter rod, and a circular cutter is mounted on the other end of the circular cutter rod. The rotating mechanism includes a second bearing mounted inside the first cover and a second rotating shaft rotatably connected to the second bearing. One end of the second rotating shaft is connected to the circular cutter handle, and the other end of the second rotating shaft is connected to the circular cutter rod.

[0013] As described above, the manual wafer lamination machine of the present invention has the following beneficial effects:

[0014] In this invention, the worktable mechanism is used to install the film-applying tray mechanism. The iron ring positioning pins and magnets on the worktable can position and firmly fix the iron ring on the worktable. The film-applying tray mechanism is used to place wafers of different sizes, and the vacuum inlet and vacuum groove on the film-applying tray can firmly adsorb the wafers onto the film-applying tray. The film-applying rollers in the roller mechanism can firmly apply the film to the wafer. The cross-cutting blade in the roller mechanism can cut the film horizontally. The barrel mechanism can be used to wind up the new film and release film, and can separate the release film from the new film. The circular cutter in the circular cutter mechanism can cut the film circumferentially, thereby realizing the wafer film-applying work. This manual wafer film-applying machine is easy for operators to operate and improves the efficiency of film-applying work. Attached Figure Description

[0015] Figure 1 The image shown is a right-side frontal perspective perspective view of the manual wafer laminating machine disclosed in an embodiment of the present invention;

[0016] Figure 2 The diagram shown is a three-dimensional schematic of the worktable mechanism in the manual wafer laminating machine disclosed in an embodiment of the present invention.

[0017] Figure 3 The diagram shown is a three-dimensional schematic of the film application platform mechanism in the manual wafer film application machine disclosed in an embodiment of the present invention.

[0018] Figure 4 The diagram shown is a three-dimensional schematic of the roller mechanism in the manual wafer laminating machine disclosed in an embodiment of the present invention.

[0019] Figure 5 The image shown is a left rear-view perspective stereoscopic view of the manual wafer laminating machine disclosed in an embodiment of the present invention.

[0020] Figure 6 The diagram shown is a schematic diagram of the film insertion mechanism of the material cylinder in the manual wafer laminating machine disclosed in an embodiment of the present invention.

[0021] Component designation explanation

[0022] 1. Casing; 2. First Cover; 3. Second Cover; 4. Control Panel; 5. Workbench Mechanism; 501. Workbench; 502. Placement Slot; 503. Cross-cutting Slot; 504. Film Pulling Notch; 505. Iron Ring Positioning Pin; 506. Top Screw Hole; 507. Mounting Hole; 6. Film Applying Tray Mechanism; 601. Film Applying Tray; 602. Tray Base; 603. Connecting Hole; 604. Vacuum Inlet; 605. Vacuum Chamber; 606. 4-inch Wafer Positioning Line; 607. 6-inch Wafer Positioning Line; 608. 8-inch Wafer Positioning Line; 7. Roller Mechanism; 701. Side Plate; 702. Drive Cylinder; 703. First Bearing Sleeve; 704. Handle; 70 5. Second linear shaft; 706. Film-applying roller; 707. Guide rail; 708. Cross-cutting knife handle; 709. Cross-cutting knife; 710. Second bearing sleeve; 711. Horizontal plate; 8. Circular cutting knife mechanism; 801. Circular cutting knife rod; 802. Circular cutting knife; 803. Rubber wheel; 804. Circular cutting knife handle; 9. Material cylinder mechanism; 901. New film synchronous belt pulley; 902. New film cylinder; 903. Airbag; 904. Airbag inlet; 905. Release film synchronous belt pulley; 906. Release film cylinder; 907. Film tensioning rod; 908. Fixing plate; 10. Through-hole; 11. Electric push rod; 12. Stop bar; 13. Transparent window; 14. New film; 15. Release film; 16. Film. Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0024] Please see Figures 1 to 6 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading. They are not intended to limit the scope of the invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of the invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0025] Please see Figures 1 to 6This invention provides a manual wafer laminating machine, including a housing 1. A first cover 2 is movably connected to the middle of the housing 1 along its length, and a second cover 3 is movably connected to the rear side of the housing 1. In this embodiment, the first cover 2 is movably connected to the housing 1 by a pin, and the second cover 3 is movably connected to the housing 1 by a hinge. In practical applications, snap-fit ​​or other methods can also be used to install the first cover 2 and the second cover 3 onto the housing 1. The first cover 2 has a transparent window 13, and two electric push rods 11 are hinged to the inner side of the housing 1 and the inner side of the first cover 2. An operation panel 4 is provided on the front side of the housing 1, and the operation panel 4 has a power switch and a temperature control button arranged from left to right. The machine housing 1 has a button, a heating switch and a vacuum switch. A baffle 12 is provided on the front side of the machine housing 1 above the operation panel 4. The inner side of the machine housing 1 has a worktable mechanism 5 and a film application tray mechanism 6 located below the first cover 2, a roller mechanism 7 located between the first cover 2 and the second cover 3, and a material cylinder mechanism 9 located below the second cover 3. The first cover 2 has an opening 10 for the roller mechanism 7 to pass through. The film application tray mechanism 6 is installed on the worktable mechanism 5. The worktable mechanism 5, the roller mechanism 7 and the material cylinder mechanism 9 are installed in the machine housing 1 from front to back along the length of the machine housing 1. A circular cutter mechanism 8 is installed on the first cover 2 above the worktable mechanism 5 and the film application tray mechanism 6.

[0026] Specifically, the first cover 2 can be opened and closed by extending and shortening the electric push rod 11. In actual installation, the film application tray mechanism 6 is installed on the worktable mechanism 5. The worktable mechanism 5 is used to position the iron ring and firmly fix the iron ring on the worktable 501. The film application tray mechanism 6 is used to place wafers of different sizes and can firmly adsorb the wafers onto the film application tray 601. The roller mechanism 7 can firmly attach the film 16 to the wafer and can cut the film 16 in the transverse direction. The barrel mechanism 9 can be used to wind up the new film 14 and the release film 15 and can separate the release film 15 from the new film 14. The circular cutter mechanism 8 can cut the film 16 in the circumferential direction, thereby realizing the wafer film application work.

[0027] Please see Figure 1 and Figure 2The worktable mechanism 5 includes a worktable 501. The worktable 501 has a placement groove 502 for placing the film application tray mechanism 6. The worktable 501 has a plurality of mounting holes 507 evenly spaced around the circumference of the placement groove 502. The side of the mounting holes 507 has a set screw hole 506 for installing set screws. In this embodiment, there are three mounting holes 507 and three set screw holes 506. In actual applications, the number of mounting holes 507 and set screw holes 506 can also be set to other values. The worktable 501 has two cross-cutting grooves 503 behind the placement groove 502. One of the cross-cutting grooves 503 further back has two film pulling notches 504. The worktable 501 has two positioning pins located between the two film pulling notches 504. The bottom side of the worktable 501 has a magnet for fixing the iron ring.

[0028] Specifically, when the film application tray mechanism 6 is installed on the worktable mechanism 5, the worktable 501 is first fitted onto the film application tray mechanism 6. At this time, the tray base 602 is in contact with the bottom side of the worktable 501, and the film application tray 601 is located in the placement groove 502. Then, three bolts are threaded through the mounting hole 507 and connected to the connecting hole 603 on the tray base 602, thereby installing the film application tray mechanism 6 on the worktable mechanism 5. The relative horizontal position of the film application tray 601 and the worktable 501 can be adjusted by the set screw in the set screw hole 506, thereby adjusting the contact surface between the film application tray 601 and the film 16 and the film application roller 706, so that the pressure on both sides of the film application tray 601 is the same when the film application roller 706 rolls the film, ensuring that the film application effect is uniform and wrinkle-free.

[0029] Please see Figure 1 and Figure 3 The film application tray mechanism 6 includes a tray base 602 and a film application tray 601 mounted on the tray base 602. The film application tray 601 is equipped with a heating device. The tray base 602 has multiple connecting holes 603 evenly spaced along its circumference, corresponding to the mounting holes 507. The film application tray 601 is circular, and a vacuum inlet 604 is located at its center. A vacuum inlet 604 is provided on the film application tray 601 that communicates with the vacuum inlet 604. Vacuum groove 605, wherein, in this embodiment, the vacuum groove 605 is 0.6mm wide and 0.6mm deep, a part of the vacuum groove 605 is circular, and a cross-shaped vacuum groove 605 is provided inside the circular vacuum groove 605. In practical applications, the size and shape of the vacuum groove 605 can be set to other shapes. The film application tray 601 is provided with 4-inch wafer positioning lines 606, 6-inch wafer positioning lines 607 and 8-inch wafer positioning lines 608 arranged sequentially from the inside to the outside.

[0030] Specifically, the vacuum inlet 604 and vacuum tank 605 enable the film application tray 601 to adsorb wafers during film application. The film application tray 601 is also equipped with wafer positioning lines of different sizes, which makes it convenient for staff to place wafers of different sizes on the film application tray 601.

[0031] Please see Figure 1 and Figure 4 The roller mechanism 7 includes two side plates 701 and a horizontal plate 711 located on the top side of the two side plates 701. A guide rail 707 is mounted on the front side of the two side plates 701, and a cross-cutting mechanism is slidably connected to the guide rail 707. The cross-cutting mechanism includes a cross-cutting blade 709 and a cross-cutting blade handle 708 located on the top side of the cross-cutting blade 709. The cross-cutting blade handle 708 is a pressing handle; when the operator presses the cross-cutting blade handle 708, the cross-cutting blade 709 moves downwards. Two drive cylinders 702 are mounted on the horizontal plate 711. 2. A film-applying roller 706 is connected through the horizontal plate 711. A first bearing sleeve 703 is provided on the opposite side of the two side plates 701. Two first linear shafts are provided on the inner side of the housing 1 and are slidably connected to the first bearing sleeves 703. A second bearing sleeve 710 is provided on the horizontal plate 711. A second linear shaft 705 connected to the film-applying roller 706 is slidably connected inside the second bearing sleeve 710. A handle 704 is provided on the horizontal plate 711 between the two second bearing sleeves 710. There are two second bearing sleeves 710 and two linear shafts 705.

[0032] Specifically, by pushing the handle 704, and with the cooperation of the first bearing sleeve 703 sliding on the first linear shaft, the roller mechanism 7 can move back and forth, thereby driving the film-applying roller 706 to move back and forth. By pushing the cross-cutting mechanism to slide left and right on the guide rail 707, the cross-cutting blade 709 can move left and right. By extending and retracting the drive cylinder 702, and with the cooperation of the second linear shaft 705 sliding in the second bearing sleeve 710, the film-applying roller 706 can move downward and upward, thereby allowing the film-applying roller 706 to contact the film.

[0033] Please see Figure 1 , Figure 5 and Figure 6The material cylinder mechanism 9 includes a fixed plate 908 mounted on the housing 1, a new film timing pulley 901 and a release film timing pulley 905 located on one side of the fixed plate 908, and a new film cylinder 902 and a release film cylinder 906 located on the other side of the fixed plate. The new film timing pulley 901 and the release film timing pulley 905 are connected by belt drive. The new film timing pulley 901 is connected to the new film cylinder 902 through a first rotating shaft. The first rotating shaft is connected to the fixed plate 908 through a first bearing. The release film timing pulley 905 and the release film cylinder 906 are driven by friction. An air bladder 903 is installed inside the new film cylinder 902. An air bladder inlet 904 connected to the air bladder 903 is opened at the center of the new film timing pulley 901. Two film tensioning rods 907 are provided behind the roller mechanism 7. The release film cylinder 906 is located between the new film cylinder 902 and the film tensioning rods 907.

[0034] Specifically, when the operator pulls the film 16, the new film 14 rotates, causing the new film roll 902 to rotate, which in turn drives the new film timing pulley 901 to rotate. Then, the new film timing pulley 901 drives the release film timing pulley 905 to rotate. The release film timing pulley 905 drives the release film roll 906 to rotate and retract the release film 15 through friction. This design not only prevents the new film 14 from rotating arbitrarily, i.e., forming a reverse pulling force when pulling the film 16, preventing it from rotating freely with a slight pull, but also automatically retracts the release film 15 when pulling the film 16. Furthermore, the airbag 903 expands and firmly presses against the inner wall of the new film roll. The pressure of the airbag 903 increases the friction between the new film roll 902 and the new film roll, effectively preventing the new film roll from slipping and thus improving the reliability of the roll operation.

[0035] Please see Figure 1 and Figure 5 The circular cutter mechanism 8 includes a circular cutter handle 804 and a circular cutter rod 801 mounted on the first cover 2. The end of the circular cutter handle 804 is connected to the circular cutter rod 801 through a rotating mechanism. One end of the circular cutter rod 801 is equipped with a rubber wheel 803, and the other end of the circular cutter rod 801 is equipped with a circular cutter 802. The rotating mechanism includes a second bearing mounted inside the first cover 2 and a second rotating shaft rotatably connected to the second bearing. One end of the second rotating shaft is connected to the circular cutter handle 804, and the other end of the second rotating shaft is connected to the circular cutter rod 801.

[0036] Specifically, the operator rotates the circular cutter handle 804 to drive the second rotating shaft to rotate, which in turn drives the circular cutter rod 801 to rotate, and then drives the rubber wheels 803 and the circular cutter 802 at both ends of the circular cutter rod 801 to rotate, thereby achieving the circumferential cutting of the film 16.

[0037] To elaborate further, the first step in operating the manual film applicator after the air and electricity are connected is to thread the film 16. First, pull the beginning part of the film 16 to the film pulling notch 504 on the worktable 501. Then, turn on the heating switch to heat the film applicator tray 601 to the set temperature, which can improve the adhesion of the protective film 16 during application. Next, place the wafer to be applicated onto the middle film applicator tray 601, and then turn on the vacuum switch. The wafer will be adsorbed onto the film applicator tray 601 and cannot move freely. Then, place the iron ring on the worktable 501 and use the iron ring positioning pin 505 for positioning. At this time, the roller mechanism 7 is in the rear limit position, and the cross-cutting blade 709 is directly above the cross-cutting groove 503 on the worktable 501. The operator slowly pulls the film 16 from the film pulling notch 504 on the worktable 501 to the front stop strip 12 of the machine housing 1 and sticks it there. Then, the roller mechanism... 7. Pull forward to the front limit. During this process, when the roller mechanism 7 moves to the frontmost position, the drive cylinder 702 will start working. The drive cylinder 702 extends and drives the film-applying roller 706 to move downward. Then, pull the handle 704 to make the film-applying roller 706 roll the film-applying tray 601. After two back and forth movements, the film 16 can be firmly applied to the wafer. After the rolling is completed, the roller mechanism 7 is returned to the rear limit. Then, press the cross-cutting knife handle 708 to make the cross-cutting knife 709 move downward. Then, drive the cross-cutting knife 709 to move left and right to cross-cut the film 16. Then, close the first cover 2 and rotate the circular cutter handle 804 twice to separate the film 16 inside and outside the iron ring. At this time, the film application is completed. Turn off the vacuum switch and remove the iron ring, wafer, and the applied film 16 as a whole (finished product). Then, collect the waste film 16 cut off outside the iron ring and proceed to the next wafer for film application.

[0038] In summary, the workbench mechanism 5 of this invention is used to install the film-applying tray mechanism 6. The iron ring positioning pins and magnets on the workbench 501 can position the iron ring and firmly fix it on the workbench 501. The film-applying tray mechanism 6 is used to place wafers of different sizes, and the vacuum inlet 604 and vacuum groove 605 on the film-applying tray 601 can firmly adsorb the wafer onto the film-applying tray 601. The film-applying roller 706 in the roller mechanism 7 can firmly apply the film 16 onto the wafer. The cross-cutting blade 709 in the roller mechanism 7 can cut the film horizontally. The barrel mechanism 9 can be used to wind up the new film 14 and the release film 15, and can separate the release film 15 from the new film 14. The circular cutter 802 in the circular cutter mechanism 8 can cut the film 16 circumferentially, thereby realizing the wafer film-applying work. This manual wafer film-applying machine is easy for workers to operate and improves the efficiency of film-applying work. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0039] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A manual wafer laminating machine, comprising a housing, wherein a first cover is movably connected to the middle position of the housing along its length, and a second cover is movably connected to the rear side of the housing, characterized in that: The inner side of the machine housing is provided with a worktable mechanism and a film-applying tray mechanism located below the first cover, a roller mechanism located between the first cover and the second cover, and a material cylinder mechanism located below the second cover. The film-applying tray mechanism is mounted on the worktable mechanism. The worktable mechanism, roller mechanism, and material cylinder mechanism are sequentially installed inside the machine housing from front to back along the length of the housing. A circular cutter mechanism is mounted on the first cover above the worktable mechanism and the film-applying tray mechanism. The roller mechanism includes two side plates and a horizontal plate located on the top side of the two side plates. Guide rails are mounted on the front side of the two side plates, and a cross-cutting mechanism is slidably connected to the guide rails. The cross-cutting mechanism includes a cross-cutting blade and a material cylinder mechanism located below the second cover. The cross-cutting blade has a handle on its top side. Two drive cylinders are mounted on the cross plate, and the two drive cylinders pass through the cross plate and are connected to a film-applying roller. First bearing sleeves are provided on opposite sides of the two side plates. Two first linear shafts are slidably connected to the first bearing sleeves inside the housing. Second bearing sleeves pass through the cross plate, and second linear shafts connected to the film-applying rollers are slidably connected within the second bearing sleeves. A handle is located between the two second bearing sleeves on the cross plate. The film-applying tray mechanism is used to place wafers of different sizes and can firmly adhere the wafers to the film-applying tray. The barrel mechanism can be used to wind up new film and release film, and can separate the release film from the new film.

2. The manual wafer laminating machine according to claim 1, characterized in that: The front side of the housing is provided with an operation panel, which has a power switch, a temperature control button, a heating switch and a vacuum switch arranged from left to right.

3. A manual wafer laminating machine according to claim 1, characterized in that: The worktable mechanism includes a worktable, on which a placement groove for placing a film-applying tray mechanism is provided. The worktable has multiple mounting holes evenly spaced along the circumference of the placement groove. The sides of the mounting holes have set screw holes for installing set screws. The worktable has two cross-cutting grooves behind the placement groove. One of the cross-cutting grooves further back has two film-stretching notches. The worktable has two positioning pins located between the two film-stretching notches.

4. A manual wafer laminating machine according to claim 1, characterized in that: The film application tray mechanism includes a tray base and a film application tray mounted on the tray base. The tray base has multiple connecting holes evenly spaced along the circumference of the tray base corresponding to the mounting holes. A vacuum air inlet is located at the center of the film application tray. A vacuum groove connected to the vacuum air inlet is located on the film application tray. 4-inch wafer positioning lines, 6-inch wafer positioning lines, and 8-inch wafer positioning lines are arranged sequentially from the inside to the outside of the film application tray.

5. A manual wafer laminating machine according to claim 1, characterized in that: The material cylinder mechanism includes a fixed plate mounted on the machine housing, a new film timing pulley and a release film timing pulley located on one side of the fixed plate, and a new film cylinder and a release film cylinder located on the other side of the fixed plate. The new film timing pulley and the release film timing pulley are connected by belt drive. The new film timing pulley is connected to the new film cylinder through a first rotating shaft. The release film timing pulley and the release film cylinder are connected by a friction pulley.

6. A manual wafer laminating machine according to claim 5, characterized in that: An air bladder is installed inside the new membrane tube. An air inlet connected to the air bladder is opened at the center of the new membrane synchronous belt pulley. Two membrane tensioning rods are provided behind the roller mechanism. The release membrane tube is located between the new membrane tube and the membrane tensioning rods.

7. A manual wafer laminating machine according to claim 1, characterized in that: The circular cutter mechanism includes a circular cutter handle and a circular cutter rod mounted on the first cover. The end of the circular cutter handle is connected to the circular cutter rod via a rotating mechanism. A rubber wheel is mounted on one end of the circular cutter rod, and a circular cutter is mounted on the other end of the circular cutter rod.

Images