Apparatus for processing a substrate and method for processing a substrate

Abstract

This invention provides an apparatus and a method for processing a substrate. Specifically, the apparatus for processing a substrate may include: a liquid processing chamber configured to process a liquid substrate; and a controller configured to control the liquid processing chamber, wherein the liquid processing chamber includes: a processing container having a processing space therein; a support unit configured to support and rotate the substrate in the processing space; a liquid supply unit configured to supply liquid to the substrate; and a lifting unit configured to adjust the relative height between the processing container and the support unit, and the controller controls the lifting unit so that, when processing the substrate by supplying liquid to the substrate while rotating the substrate, the relative height between the processing container and the support unit is adjusted according to the warpage state of the substrate supported on the support unit.

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