Debonding device

Abstract

The application provides a debonding device, and relates to the technical field of chip manufacturing, which comprises an upper chuck assembly, a lower chuck and a piercing mechanism. The upper chuck assembly is located above the lower chuck and can be close to or away from the lower chuck. The suction surface of the lower chuck is a slope and is away from the piercing mechanism. The height of the suction surface of the lower chuck gradually increases. The piercing mechanism moves along a direction parallel to the suction surface of the lower chuck. The upper chuck assembly comprises a mounting plate and a plurality of telescopic chuck units. The plurality of chuck units are arranged on the mounting plate in a spaced manner along the moving direction of the piercing mechanism. The wafer is adsorbed on the lower chuck. The upper chuck assembly moves downward so that all the chuck units are in contact with and adsorb the upper wafer. The compression amount of the chuck units close to the piercing mechanism is less than that of the chuck units on the other side. The piercing mechanism pierces into the bonding surface. The upper chuck assembly moves upward along the direction away from the piercing mechanism. The chuck units drive the upper wafer to gradually separate from one side to the other side. The deformation amount during the separation is relatively safe, and warping and damage are avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip manufacturing, in particular to a debonding device. BACKGROUND

[0002] In advanced wafer process, two wafers (or wafer and carrier) are often temporarily bonded together to complete subsequent processes, which is called temporary bonding. Temporary bonding can be divided into variable adhesion medium layer bonding and hydrogen bond direct bonding. After completing the subsequent process steps, two independent wafers can be separated by different technical means, which is called debonding.

[0003] In the prior art, a lower wafer is adsorbed by a vacuum chuck, and an upper wafer is adsorbed by multiple corrugated vacuum nozzles in a certain distribution mode. The multiple vacuum nozzles can rise vertically. When separating, the lower wafer is adsorbed by the lower chuck, and the upper wafer is not adsorbed. First, a knife is used to pierce the edge of the bonding layer to form a cracking trend of the bonding layer. At this time, the vacuum nozzle array is lowered to adsorb the upper wafer and slowly lifted upward to complete the debonding.

[0004] The above prior art only relies on the elasticity of the vacuum nozzle itself, and it is difficult to control the wafer deformation. Once the local bonding force is less than the vacuum suction force, the position will quickly separate, and there is a risk of permanent warping or even breaking of the wafer. SUMMARY

[0005] The present application aims to provide a debonding device to alleviate the technical problem that the prior debonding scheme only relies on the elasticity of the vacuum nozzle itself, and it is difficult to control the wafer deformation. Once the local bonding force is less than the vacuum suction force, the position will quickly separate, and there is a risk of permanent warping or even breaking of the wafer.

[0006] The debonding device provided by the present application comprises an upper chuck assembly, a lower chuck and a piercing mechanism.

[0007] The upper chuck assembly is located above the lower chuck and can approach or move away from the lower chuck. The piercing mechanism is located laterally of the lower chuck. The adsorption surface of the lower chuck is a slope, and gradually increases in height away from the piercing mechanism. The piercing mechanism can move parallel to the adsorption surface of the lower chuck.

[0008] The upper chuck assembly comprises a mounting plate and a plurality of telescopic chuck units. The plurality of chuck units are arranged on the mounting plate in the moving direction of the piercing mechanism.

[0009] Further, the height difference between the highest point of the adsorption surface of the lower chuck and the lowest point of the adsorption surface of the lower chuck is 1mm-5mm.

[0010] Further, the suction cup unit comprises a flat suction cup, an extension rod and an elastic member;

[0011] The flat suction cup is connected to the lower end of the extension rod, the elastic member is sleeved on the extension rod for controlling the length of the extension rod, and the upper end of the extension rod is connected to the mounting plate.

[0012] Further, the extension rod is provided with a height adjusting structure at the joint with the mounting plate, and the height adjusting structure is used to adjust the distance between the flat suction cup and the mounting plate.

[0013] Further, a plurality of mounting grooves are arranged on the mounting plate in a direction away from the piercing mechanism, and each mounting groove is provided with at least one suction cup unit.

[0014] Further, the upper suction cup assembly further comprises a first driving mechanism connected to the mounting plate for driving the mounting plate and the suction cup unit to move close to or away from the lower suction cup.

[0015] Further, the first driving mechanism comprises a fixed frame and a first extension cylinder.

[0016] The first extension cylinder is fixedly connected to the fixed frame, and the driving end of the first extension cylinder is connected to the mounting plate.

[0017] Further, the upper suction cup assembly further comprises a guide assembly for guiding the movement of the mounting plate.

[0018] Further, the guide assembly comprises an optical axis arranged in a vertical direction and a linear bearing connected to the optical axis, and the mounting plate is connected to the linear bearing.

[0019] Alternatively, the guide assembly comprises a guide rail arranged in a vertical direction and a sliding block slidingly connected to the guide rail, and the mounting plate is connected to the sliding block.

[0020] Further, the debonding device further comprises a jacking mechanism arranged below the lower suction cup, and the jacking mechanism comprises a plurality of jacking pins and a second driving mechanism; the lower suction cup is provided with a plurality of through holes corresponding to the jacking pins one by one, the jacking pins are slidingly inserted into the through holes, and the second driving mechanism is connected to the plurality of jacking pins respectively for driving the jacking pins to move in the through holes.

[0021] Further, the piercing mechanism comprises a knife and a third driving mechanism.

[0022] The driving end of the third driving mechanism is connected to the knife for driving the knife to extend or retract.

[0023] Further, the lower chuck is provided with a positioning structure in the circumferential direction, which is used to define the position of the wafer pair on the lower chuck.

[0024] The unbonding device provided by the application comprises an upper chuck assembly, a lower chuck and a piercing mechanism. The upper chuck assembly is located above the lower chuck and can move towards or away from the lower chuck. The piercing mechanism is located laterally of the lower chuck. The suction surface of the lower chuck is a slope and gradually increases in height in the direction away from the piercing mechanism. The piercing mechanism can move parallel to the suction surface of the lower chuck. The upper chuck assembly comprises a mounting plate and a plurality of telescopic chuck units. The chuck units are arranged on the mounting plate in the moving direction of the piercing mechanism.

[0025] In actual use, the wafer pair is placed on the lower chuck. The lower chuck opens the vacuum to adsorb the lower wafer. The upper chuck assembly moves towards the lower chuck until all the chuck units on the mounting plate are in contact with the upper wafer. The chuck units open the vacuum and adsorb the upper wafer. Since the suction surface of the lower chuck is a slope, the compression amount of the chuck units in the upper chuck assembly in the direction away from the piercing mechanism is different, that is, the compression amount of the chuck units on the side close to the piercing mechanism is small, and the compression amount of the chuck units on the side away from the piercing mechanism is large. After the upper and lower wafers are stably adsorbed, the piercing mechanism pierces the bonding surface of the upper and lower wafers to formally start the unbonding. The upper chuck assembly moves away from the lower chuck, and the mounting plate slowly rises. At this time, the chuck units with small compression amount will first rebound to the initial state, and then an upward lifting force is generated at the corresponding position of the upper wafer, driving the upper wafer in this area to separate upward. With the lifting of the mounting plate, the chuck units drive the upper wafer to gradually separate from one side to the other side in the direction away from the piercing mechanism, and the difference between the two adjacent rows is small, which ensures that the upper wafer generates a relatively safe deformation amount when the wafer pair is separated, avoiding the risk of warping and damage when the wafer pair is separated. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the specific embodiments of the application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0027] Figure 1 The structure diagram of the unbonding device provided by the embodiment of the application is shown in the figure.

[0028] Figure 2 The side view of the unbonding device provided by the embodiment of the application is shown in the figure.

[0029] Figure 3 Structure diagram of the upper suction disc assembly of the debonding device provided by the embodiment of the present application;

[0030] Figure 4 Side view of the upper suction disc assembly of the debonding device provided by the embodiment of the present application;

[0031] Figure 5 Top view of the connection between the mounting plate and the suction disc unit of the debonding device provided by the embodiment of the present application;

[0032] Figure 6 Side view of the connection between the mounting plate and the suction disc unit of the debonding device provided by the embodiment of the present application;

[0033] Figure 7 Structure diagram of the suction disc unit of the debonding device provided by the embodiment of the present application;

[0034] Figure 8 Arrangement schematic diagram of the suction disc unit of the debonding device provided by the embodiment of the present application;

[0035] Figure 9 Position schematic diagram of the lower suction disc and the piercing mechanism of the debonding device provided by the embodiment of the present application;

[0036] Figure 10 Side view of the lower suction disc of the debonding device provided by the embodiment of the present application;

[0037] Figure 11 Structure diagram of the jacking mechanism of the debonding device provided by the embodiment of the present application.

[0038] Figure legend: 100-upper suction disc assembly; 110-suction disc unit; 111-flat suction disc; 112- telescopic rod; 113-spring; 114-adjusting nut; 115-joint; 120-mounting plate; 121-mounting groove; 130-first telescopic cylinder; 140-fixing frame; 150-guide assembly structure; 151-optical axis; 152-linear bearing; 200-lower suction disc; 210-through hole; 300-piercing mechanism; 310-inserting knife; 320-electric cylinder; 400-jacking mechanism; 410-jacking pin; 420-lifting air cylinder; 430-bracket; 500-fixing seat. DETAILED DESCRIPTION

[0039] The technical solutions of the present application will be described clearly and completely below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0040] AsFigures 1 to 11 As shown, the debonding device provided in the embodiment comprises an upper chuck assembly 100, a lower chuck 200, and a piercing mechanism 300; the upper chuck assembly 100 is located above the lower chuck 200 and can move close to or away from the lower chuck 200; the piercing mechanism 300 is located laterally to the lower chuck 200; the suction surface of the lower chuck 200 is a slope surface and gradually increases in height along the direction away from the piercing mechanism 300; and the piercing mechanism 300 can move along the direction parallel to the suction surface of the lower chuck 200.

[0041] The upper chuck assembly 100 comprises a mounting plate 120 and a plurality of telescopic chuck units 110; the plurality of chuck units 110 are arranged on the mounting plate 120 in the moving direction of the piercing mechanism 300.

[0042] Compared with the prior art, in actual use, the wafer pair is placed on the lower chuck 200, the lower chuck 200 opens the vacuum adsorption of the lower wafer, the upper chuck assembly 100 moves towards the lower chuck 200 until all the chuck units 110 on the mounting plate 120 are in contact with the upper wafer, the chuck units 110 open the vacuum and adsorb the upper wafer, and because the suction surface of the lower chuck 200 is a slope surface, the compression amount of the chuck units 110 in the upper chuck assembly 100 along the direction away from the piercing mechanism 300 is different, that is, the compression amount of the chuck units 110 on the side close to the piercing mechanism 300 is small, and the compression amount of the chuck units 110 on the side away from the piercing mechanism 300 is large. After the upper and lower wafers are stably adsorbed, the piercing mechanism 300 pierces into the bonding surface of the upper and lower wafers, and the debonding formally starts. The upper chuck assembly 100 moves away from the lower chuck 200, and the mounting plate 120 slowly rises, at this time, the chuck units 110 with small compression amount will first rebound to the initial state, then an upward lifting force is generated at the corresponding position of the upper wafer, driving the upper wafer in this area to separate upward, and with the lifting of the mounting plate 120, the chuck units 110 drive the upper wafer to gradually separate from one side to the other side along the direction away from the piercing mechanism 300, and the difference between the two adjacent rows is small, which ensures that the upper wafer generates a relatively safe deformation amount when the wafer pair is separated, avoiding the risk of warping and damage when the wafer pair is separated.

[0043] Specifically, in the embodiment, the debonding device further comprises a fixing seat 500, and the lower chuck 200 and the piercing mechanism 300 are fixed on the fixing seat 500; the separation trend of the wafer pair in the embodiment is provided by the inclination of the suction surface of the lower chuck 200, and then the deformation amount of the upper wafer is controlled by the different compression amounts of the different chuck units 110, thereby preventing the risk of warping and breaking during the debonding process.

[0044] Further, the lower chuck 200 is provided with a positioning structure in the circumferential direction, and the positioning structure is used to limit the position of the wafer pair on the lower chuck 200.

[0045] In the embodiment, the suction surface of the lower suction plate 200 is an inclined surface. When the wafer pair is placed on the lower suction plate 200 and not adsorbed, the circumferential direction of the lower suction plate 200 can be provided with a positioning structure for preventing the wafer pair from sliding. Specifically, the positioning structure can include a plurality of stop blocks arranged at intervals along the circumferential direction of the lower suction plate 200. It should be noted that the number of stop blocks can be two, which are arranged on both sides of the piercing mechanism 300 and symmetrically arranged with respect to the piercing mechanism 300, so as to support the wafer pair that tends to slide downward.

[0046] Further, the height difference A between the highest point of the adsorption surface of the lower suction plate 200 and the lowest point of the adsorption surface of the lower suction plate 200 is 1mm-5mm.

[0047] Specifically, the lower suction plate 200 is fixedly installed, and the adsorption surface of the lower suction plate 200 is a hard vacuum suction plate with a certain inclination angle, which can be made of aluminum alloy or plastic. It should be noted that the diameter of the lower suction plate 200 can be greater than the diameter of the wafer pair, and the entire adsorption surface is a plane. The side close to the piercing mechanism 300 is lower in height, and the side away from the piercing mechanism 300 is relatively higher in height. Specifically, the height difference A between the highest point of the adsorption surface of the lower suction plate 200 and the lowest point of the adsorption surface of the lower suction plate 200 is in the range of 1mm-5mm, and preferably, the height difference A of the two sides of the adsorption surface can be 3mm. It should be noted that the above value range can be appropriately adjusted for different occasions.

[0048] Further, the suction plate unit 110 includes a flat suction plate 111, a telescopic rod 112 and an elastic member. The flat suction plate 111 is connected to the lower end of the telescopic rod 112, the elastic member is sleeved on the telescopic rod 112 for controlling the length of the telescopic rod 112, and the upper end of the telescopic rod 112 is connected with the mounting plate 120.

[0049] Specifically, the telescopic rod 112 can include a first rod member and a second rod member sleeved with each other. The first rod member is located at the lower end of the second rod member, and both the first rod member and the second rod member are hollow structures. The elastic member is preferably a spring 113, which is sleeved on the first rod member and the second rod member, and the two ends thereof are connected with the first rod member and the second rod member, respectively. The flat suction plate 111 is connected to the lower end of the first rod member, the second rod member is connected with the mounting plate 120, and the upper end of the second rod member is connected with a connector 115 for connection with a vacuum pumping device. When the spring 113 is pressed, the first rod member can slide relative to the second rod member, and the length of the telescopic rod 112 is shortened. When the external force is removed, the telescopic rod 112 returns to the initial length.

[0050] In the embodiment, when the upper chuck assembly 100 is not in contact with the wafer pair, the flat chucks 111 of the plurality of chuck units 110 on the mounting plate 120 are in the same horizontal plane, and when the flat chucks 111 are in contact with the wafer pair on the lower chuck 200, the chuck units 110 have different compression amounts.

[0051] Further, the telescopic rod 112 is provided with a height adjustment structure at the joint with the mounting plate 120, and the height adjustment structure is used to adjust the distance between the flat chuck 111 and the mounting plate 120.

[0052] Specifically, the height adjustment structure can change the distance between the flat chuck 111 and the mounting plate 120, so that the installation height of the chuck unit 110 can be finely adjusted. In the embodiment, the height adjustment structure includes two adjusting nuts 114, which are screwed on the upper end of the telescopic rod 112. By rotating the two adjusting nuts 114, the distance between the flat chuck 111 and the mounting plate 120 can be changed.

[0053] It should be noted that one of the adjusting nuts 114 is above the mounting plate 120, and the other adjusting nut 114 is below the mounting plate 120, and the mounting plate 120 is between the two adjusting nuts 114. By the two adjusting nuts 114, the mounting plate 120 is connected, and when the elastic member is in the initial state, the plurality of flat chucks 111 are installed to the same height and horizontal position.

[0054] Preferably, a plurality of mounting grooves 121 are arranged on the mounting plate 120 in the direction away from the piercing mechanism 300, and each mounting groove 121 is provided with at least one chuck unit 110.

[0055] Specifically, in order to realize the separation of the wafer pair with constant deformation, the spacing between the plurality of mounting grooves 121 can be the same, and when the lower chuck 200 separates from one side to the other side, the compression amount of the adjacent two chuck units 110 is the same, so that the lifting force and movement of the wafer pair during the debonding process are uniform, and thus the wafer pair can be separated with constant deformation.

[0056] In the embodiment, five mounting grooves 121 are arranged on the mounting plate 120, and the mounting plate 120 is provided with five telescopic rods 112. Figure XAs shown in FIG. 1, the first mounting groove 121 is provided with one suction disc unit 110 from right to left, the second mounting groove 121 is provided with two suction disc units 110 at intervals, the third mounting groove 121 is provided with three suction disc units 110 at intervals, the fourth mounting groove 121 is provided with two suction disc units 110 at intervals, and the fifth mounting groove 121 is provided with one suction disc unit 110. Among them, the suction disc unit 110 in the middle of the third mounting groove 121 is at the center position of the mounting plate 120, corresponding to the center of the wafer pair, and the other suction disc units 110 are located in the circumferential direction of the suction disc unit 110, which can be arranged in a circumferential array.

[0057] Further, the upper suction disc assembly 100 further comprises a first driving mechanism connected with the mounting plate 120, used for driving the mounting plate 120 and the suction disc unit 110 to approach or move away from the lower suction disc 200.

[0058] In this embodiment, the first driving mechanism comprises a fixed frame 140 and a first telescopic cylinder 130. The lower end of the fixed frame 140 is connected to the fixed seat 500, and the first telescopic cylinder 130 is fixedly connected to the fixed frame 140. The driving end of the first telescopic cylinder 130 is connected with the mounting plate 120.

[0059] Specifically, the first telescopic cylinder 130 can be an electric cylinder, a pneumatic cylinder or a hydraulic cylinder. Preferably, an electric cylinder is adopted. The electric cylinder is fixed to the fixed frame 140, and the driving end of the electric cylinder is connected with the mounting plate 120, used for driving the mounting plate 120 to approach or move away from the lower suction disc 200 in the vertical direction.

[0060] It should be noted that the first driving mechanism can also be a sliding table structure, which can also realize the up-down movement of the mounting plate 120.

[0061] In order to improve the stability and precision of the movement of the mounting plate 120, the upper suction disc assembly 100 further comprises a guide assembly 150 used for guiding the movement of the mounting plate 120.

[0062] Preferably, in this embodiment, the guide assembly 150 comprises an optical axis 151 arranged in the vertical direction and a linear bearing 152 connected to the optical axis 151, and the mounting plate 120 is connected with the linear bearing 152. Specifically, the number of optical axes 151 is two, and they are arranged at intervals on both sides of the mounting plate 120. The optical axes 151 are fixed to the fixed frame 140. The mounting plate 120 is respectively connected with one linear bearing 152 on both sides. The linear bearing 152 is sleeved on the optical axis 151 and can move along the length direction of the optical axis 151, so that the mounting plate 120 can move stably under the combined action of the electric cylinder, the optical axis 151 and the linear bearing 152.

[0063] It should be noted that the guide assembly 150 can also include guide rails arranged in the vertical direction and sliding blocks connected to the guide rails, and the mounting plate 120 is connected to the sliding blocks. Similarly, the number of guide rails is two, which are arranged on the two side fixing frames 140, and the two sides of the mounting plate 120 are respectively connected with a sliding block matched with the guide rail, so that the mounting plate 120 stably rises and falls under the cooperation of the guide rail and the sliding block.

[0064] Further, the debonding device further comprises a jacking mechanism 400 arranged below the lower chuck 200, and the jacking mechanism 400 comprises a plurality of jacking pins 410 and a second driving mechanism; the lower chuck 200 is provided with a plurality of through holes 210 corresponding to the jacking pins 410, the jacking pins 410 are slidingly inserted into the through holes 210, and the second driving mechanism is connected with the plurality of jacking pins 410 respectively and used for driving the jacking pins 410 to move in the through holes 210.

[0065] Specifically, the second driving mechanism is connected with the plurality of jacking pins 410 through a support 430, and the second driving mechanism can comprise a lifting cylinder 420, which can be connected to the bottom of the fixed seat 500 through a mounting support, and the lifting cylinder 420 can be connected with the plurality of jacking pins 410 through the support 430 and used for driving the plurality of jacking pins 410 to lift, and in the embodiment, the number of jacking pins 410 is three, and the plane formed by the top ends of the three jacking pins 410 is parallel to the horizontal plane and can be used for transferring the wafer pair with an automated handling system (which can be a mechanical hand transferring the wafer pair).

[0066] Further, the piercing mechanism 300 comprises a knife 310 and a third driving mechanism; the third driving mechanism can be mounted on the fixed seat 500, and a driving end of the third driving mechanism is connected with the knife 310 and used for driving the knife 310 to stretch and retract.

[0067] The third driving mechanism can be an electric cylinder 320 or a sliding table, and in the embodiment, the third driving mechanism is the electric cylinder 320, which is connected with the knife 310 and drives the knife 310 to move. Preferably, the third driving mechanism can comprise a thrust feedback mechanism or has a thrust feedback function, so as to monitor the thrust state of the knife 310 piercing into the wafer pair. Wherein, the piercing mechanism 300 is installed at the same angle as the adsorption surface of the lower chuck 200, the movement track of the knife 310 is parallel to the adsorption surface of the lower chuck 200, and the knife tip of the knife 310 points to the bonding surface of the wafer pair. It should be noted that the material of the knife 310 can be a relatively hard non-metallic material, which can be PEEK (polyether ether ketone) or other wear-resistant engineering plastics.

[0068] Compared with the prior art, the debonding device provided by the embodiment realizes separation of two wafers with constant deformation and is suitable for automatic loading and unloading of wafer pairs, through the telescopic suction cup unit 110 and the lower suction cup 200 with a certain inclination angle on the suction surface.

[0069] The wafer pair is transmitted into the device by the manipulator, the jacking mechanism 400 is lifted, the jacking pin 410 receives the wafer pair, after the manipulator is withdrawn, the jacking pin 410 is lowered, and the wafer pair is placed on the lower suction cup 200, and the lower suction cup 200 is opened to vacuum adsorb the lower wafer. The upper suction cup assembly 100 is lowered to a predetermined height until the flat suction cups 111 of all the suction cup units 110 in the upper suction cup assembly 100 contact the upper wafer, at which time the upper suction cup assembly 100 is vacuumed to adsorb the upper wafer. Due to the inclination angle of the suction surface of the lower suction cup 200, the compression amounts of the telescopic rods 112 of the flat suction cups 111 in the plurality of suction cup units 110 are different, that is, the compression amount of the telescopic rod 112 on the side close to the piercing mechanism 300 is small, and the compression amount on the other side is large. After the upper and lower wafers are stably adsorbed, the electric cylinder of the piercing mechanism 300 drives the knife 310 to pierce into the bonding surface, and the debonding formally starts. The mounting plate 120 is slowly lifted under the action of the first driving mechanism, at which time the telescopic rod 112 with a small compression amount will first return to the initial state, generating an upward lifting force on the flat suction cup 111 in this area, driving the upper wafer in this area to separate upward. In this way, the telescopic rods 112 sequentially become the initial state from one side to the other side with a fixed difference, and the upper wafer is gradually separated from one side to the other side through the respective flat suction cups 111, and the difference between the two adjacent rows is very small, so that the wafer forms a fixed and safe deformation amount. After separation is completed, the lower suction cup 200 assembly releases the vacuum, the jacking mechanism 400 lifts the lower wafer, and the wafer is returned from the inclined state to the horizontal state and is carried out by the manipulator. At this time, the upper wafer is adsorbed on the upper suction cup assembly 100 and is also in a horizontal state and is carried out by the manipulator. Thus, the debonding process is completed, each component returns to the initial state, and the above operation is repeated to complete the debonding of the next wafer pair.

[0070] In summary, the wafer pair is placed on the lower chuck 200 in actual use, the lower chuck 200 opens the vacuum adsorption of the lower wafer, the upper chuck assembly 100 moves towards the lower chuck 200 until all the chuck units 110 on the mounting plate 120 contact the upper wafer, the chuck units 110 open the vacuum and adsorb the upper wafer, because the adsorption surface of the lower chuck 200 is a slope, resulting in different compression amounts of the chuck units 110 in the upper chuck assembly 100 away from the piercing mechanism 300, that is, the compression amount of the chuck units 110 close to the piercing mechanism 300 is small, and the compression amount of the chuck units 110 away from the piercing mechanism 300 is large. After the upper and lower wafers are stably adsorbed, the piercing mechanism 300 pierces the bonding surface of the upper and lower wafers, and the debonding formally begins. The upper chuck assembly 100 moves away from the lower chuck 200, and the mounting plate 120 slowly lifts, at this time, the chuck units 110 with small compression amounts will first rebound to the initial state, then an upward lifting force is generated at the corresponding position of the upper wafer, driving the upper wafer in this area to separate upward, with the lifting of the mounting plate 120, the chuck units 110 drive the upper wafer to gradually separate from one side to the other side along the direction away from the piercing mechanism 300, and the difference between the two adjacent rows is small, ensuring that the upper wafer generates a relatively safe deformation amount when the wafer pair is separated, avoiding the risk of warping and damage when the wafer pair is separated.

[0071] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A debonding device, characterized in that, It includes an upper suction cup assembly (100), a lower suction cup (200), and a piercing mechanism (300); The upper suction cup assembly (100) is located above the lower suction cup (200) and can approach or move away from the lower suction cup (200). The piercing mechanism (300) is located to the side of the lower suction cup (200). The suction surface of the lower suction cup (200) is inclined and gradually increases in height along the direction away from the piercing mechanism (300). The piercing mechanism (300) can move along the suction surface parallel to the lower suction cup (200). The upper suction cup assembly (100) includes a mounting plate (120) and a plurality of retractable suction cup units (110), which are spaced apart on the mounting plate (120) along the moving direction of the piercing mechanism (300).

2. The debonding device according to claim 1, characterized in that, The height difference between the highest point and the lowest point of the adsorption surface of the lower suction cup (200) is 1mm-5mm.

3. The debonding device according to claim 1, characterized in that, The suction cup unit (110) includes a flat suction cup (111), a telescopic rod (112), and an elastic element; The flat suction cup (111) is connected to the lower end of the telescopic rod (112), the elastic element is sleeved on the telescopic rod (112) and used to control the length of the telescopic rod (112), and the upper end of the telescopic rod (112) is connected to the mounting plate (120).

4. The debonding device according to claim 3, characterized in that, The telescopic rod (112) is provided with a height adjustment structure at the junction with the mounting plate (120), which is used to adjust the distance between the flat suction cup (111) and the mounting plate (120).

5. The debonding device according to claim 1, characterized in that, Along a direction away from the piercing mechanism (300), the mounting plate (120) is provided with a plurality of mounting slots (121) spaced apart, and each mounting slot (121) contains at least one suction cup unit (110).

6. The debonding device according to claim 1, characterized in that, The upper suction cup assembly (100) further includes a first driving mechanism, which is connected to the mounting plate (120) and is used to drive the mounting plate (120) and the suction cup unit (110) to move closer to or away from the lower suction cup (200).

7. The debonding apparatus according to claim 6, characterized in that, The first drive mechanism includes a fixed frame (140) and a first telescopic cylinder (130); The first telescopic cylinder (130) is fixedly connected to the fixed frame (140), and the drive end of the first telescopic cylinder (130) is connected to the mounting plate (120).

8. The debonding device according to claim 6, characterized in that, The upper suction cup assembly (100) also includes a guide assembly (150) for guiding the mounting plate (120) during movement.

9. The debonding device according to claim 8, characterized in that, The guide assembly (150) includes an optical axis (151) arranged in a vertical direction and a linear bearing (152) connected to the optical axis (151), and the mounting plate (120) is connected to the linear bearing (152); Alternatively, the guide assembly (150) may include a guide rail arranged in a vertical direction and a slider slidably connected to the guide rail, with the mounting plate (120) connected to the slider.

10. The debonding apparatus according to any one of claims 1-9, characterized in that, The debonding device further includes a lifting mechanism (400) disposed below the lower suction cup (200). The lifting mechanism (400) includes a plurality of top pins (410) and a second driving mechanism. The lower suction cup (200) is provided with a plurality of through holes (210) corresponding one-to-one with the top pins (410). The top pins (410) are slidably inserted into the through holes (210). The second driving mechanism is connected to the plurality of top pins (410) respectively and is used to drive the top pins (410) to move within the through holes (210).

11. The debonding apparatus according to any one of claims 1-9, characterized in that, The piercing mechanism (300) includes a piercing blade (310) and a third drive mechanism; The driving end of the third driving mechanism is connected to the insert (310) and is used to drive the insert (310) to extend and retract.

12. The debonding apparatus according to any one of claims 1-9, characterized in that, The lower suction cup (200) is provided with a positioning structure in the circumferential direction, which is used to define the position of the wafer pair on the lower suction cup (200).

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