Wafer detection device and semiconductor process equipment

Abstract

The utility model relates to a wafer detection device and semiconductor process equipment, the semiconductor process equipment comprises the wafer detection device, the wafer detection device comprises a linear module and a mobile support, the linear module is provided with a slide block, and the slide block is in transmission connection with a servo motor; the movable bracket is arranged on the peripheral side of a wafer preset detection area and is fixedly arranged on the sliding block; the movable support is provided with a first sensor, and the sensing end of the first sensor faces a wafer preset detection area. Under the driving action of the servo motor, the sliding block can drive the movable support to move linearly in the axial direction, so that the first sensor detects the state of the wafer. According to the wafer detection device and the semiconductor process equipment, the positions of the wafers to be detected can be accurately detected in real time, and then the actual positions of the wafers, the number of the wafers and the distance between the adjacent wafers can be detected, and whether the wafers have abnormal conditions such as inclination, wafer missing, wafer lamination, dislocation and lap joint or not can be detected.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a wafer inspection device and semiconductor process equipment. Background Technology

[0002] Chips are key products in the semiconductor industry. As the requirements for chip quality continue to increase, the requirements for equipment in the chip manufacturing process are also becoming more and more stringent. Therefore, it is necessary to ensure the integrity of the wafer and the accuracy of its position during the manufacturing process.

[0003] In related technologies, sensors are used to detect whether the wafer is placed correctly. For example, a cylinder drives a support equipped with a sensor to move linearly along the wafer's axis, thereby detecting the wafers in the inlet and outlet areas of the wafer transport box. When an abnormality is detected in the wafer at the inlet and outlet, it is determined that the corresponding wafer may not meet the requirements. This detection method has two problems. First, the cylinder, as the driving element of the sensor, has poor movement stability, so it cannot guarantee the accuracy of wafer detection. For example, it cannot detect the spacing between adjacent wafers. Second, it can only detect the wafer edges at the inlet and outlet of the wafer transport box, and cannot detect whether there are any abnormalities in the wafer inside the wafer transport box. That is, it cannot comprehensively detect the integrity of the wafer. Utility Model Content

[0004] The purpose of this invention is to provide a wafer inspection device and semiconductor process equipment to solve at least one of the technical problems mentioned in the background art.

[0005] The wafer inspection device provided by this utility model includes a linear module and a movable support;

[0006] The linear module has a slider, and the slider is connected to a servo motor.

[0007] A movable support is disposed on the outer periphery of the preset detection area of ​​the wafer and fixed to the slider; a first sensor is provided on the movable support, and the sensing end of the first sensor faces the preset detection area of ​​the wafer;

[0008] The wafer inspection device is configured such that, driven by the servo motor, the slider can drive the moving bracket to move linearly along the axial direction, so that the first sensor can detect the wafer status; wherein, the linear axial movement is the axial extension direction of the wafer in its normal position state within the preset wafer inspection area.

[0009] Optionally, the movable support includes a left cantilever, a right cantilever, and a connecting arm; the left cantilever and the right cantilever are both fixed to the connecting arm and are spaced apart from each other.

[0010] The left cantilever, the right cantilever, and the connecting arm are all located on the outer periphery of the preset detection area of ​​the wafer, and the first sensor is located on the left cantilever and / or the right cantilever.

[0011] Optionally, the wafer preset detection area is used to accommodate vertically placed wafers;

[0012] Both the left and right cantilever arms extend vertically, and the connecting arm extends horizontally and is located above the preset detection area of ​​the wafer.

[0013] Optionally, the first sensor has at least two sensors, which are spaced apart in a vertical direction, and can detect at least the area where the upper half of the wafer is located and the area where the lower half of the wafer is located.

[0014] Optionally, the first sensor includes a through-beam sensor, and the detection areas of at least one pair of the through-beam sensors are located in the upper half of the wafer, and the detection areas of at least one pair of the through-beam sensors are located in the lower half of the wafer.

[0015] Optionally, the linear module also has a fixed base and a cable chain; the servo motor is mounted on the fixed base, one end of the cable chain is fixed to the fixed base, and the other end is fixed to the movable bracket, and the cable chain is configured to secure the cable of the first sensor.

[0016] Optionally, the system also includes a column fixed to the slider, and the movable bracket fixed to the column.

[0017] Optionally, the movable bracket has a black surface facing the transmitter and receiver of the first sensor.

[0018] Optionally, the black surface is generated by anodizing.

[0019] The semiconductor process equipment provided in this embodiment includes a wafer transfer device and the aforementioned wafer inspection device. The wafer transfer device is configured to: transfer the wafer to be inspected to the preset wafer inspection area, or transfer the inspected wafer from the preset wafer inspection area to the next process step.

[0020] Optionally, the wafer transfer device includes a support disposed in the preset detection area of ​​the wafer and has a positioning part configured to support and position the edge portion of the wafer.

[0021] Optionally, the support is provided with a second sensor, the sensing end of the second sensor facing upward, configured to sense the vertical end face of the wafer.

[0022] Optionally, the second sensor is a diffuse reflection sensor.

[0023] The wafer inspection device and semiconductor process equipment provided in this embodiment of the utility model have the following characteristics:

[0024] Beneficial effects:

[0025] The servo motor drives the slider of the linear module to move linearly along the axial direction, which in turn drives the moving bracket and the first sensor to move linearly along the axial direction. During the linear movement along the axial direction, the first sensor detects the wafer at the corresponding position. On the one hand, due to the power transmission and smooth movement characteristics of the servo motor and the linear module, the slider position can be driven and fed back in real time, thereby accurately detecting the actual position of the wafer, the number of wafers, and the spacing between adjacent wafers. On the other hand, it can at least detect whether the wafer in the area sensed by the first sensor is damaged. Furthermore, based on the relative position of adjacent wafers detected by the first sensor, it can detect whether the wafer is tilted, missing, stacked, or misaligned, overlapping, or other abnormalities. This avoids wafer scratches, damage, or unnecessary economic losses during the transfer of abnormal wafers to the next process step. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1a , Figure 1b This is a three-dimensional structural diagram of the semiconductor process equipment provided in an embodiment of the present utility model. In one view, the movable support is located at the initial position, and in another view, the movable support is located at the scanning end point position.

[0028] Figure 2 This is a three-dimensional structural diagram of the wafer inspection device provided in an embodiment of the present invention;

[0029] Figure 3a This is a three-dimensional structural diagram of a wafer with stacking anomalies in an embodiment of the present invention;

[0030] Figure 3b This is a schematic diagram of an embodiment of the present invention in which a wafer has its top overlapping with an adjacent wafer;

[0031] Figure 3c This is a schematic diagram illustrating the misalignment anomaly of the wafer in an embodiment of this utility model;

[0032] Figure 3d This is a schematic diagram illustrating an abnormal breakage at the top of the wafer in an embodiment of this utility model;

[0033] Figure 3e This is a schematic diagram illustrating the abnormal damage on the side of the wafer in an embodiment of this utility model;

[0034] Figure 4a This is a schematic diagram of the robotic arm not holding a wafer during the wafer picking and placing process in this embodiment of the present invention.

[0035] Figure 4b This is a schematic diagram of the robotic arm holding the wafer during the wafer picking and placing process in this embodiment of the present invention.

[0036] Figure 4c for Figure 4b The image shows a top-down view of the robotic arm holding a wafer during the wafer handling process.

[0037] Figure 5 This is a schematic diagram of a wafer notch alignment device in the wafer alignment process.

[0038] Explanation of reference numerals in the attached figures:

[0039] 100-Wafer Inspection Device;

[0040] 110 - Linear module; 111 - Slider; 112 - Servo motor; 113 - Mounting base; 114 - Cable chain;

[0041] 120-Mobile stand;

[0042] 121 - First sensor; 122 - Left cantilever; 123 - Right cantilever; 124 - Connecting arm;

[0043] 130-Column;

[0044] 200-Wafer Transfer Device;

[0045] 210-Support; 211-Positioning part; 212-Second sensor;

[0046] 300-Wafer;

[0047] 400-robotic arm;

[0048] 500 - Wafer alignment device; 501 - Roller. Detailed Implementation

[0049] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0050] In wafer fabrication, when a process step requires the wafer to be placed vertically, if the vertical placement is not neat and does not meet the preset vertical placement requirements, proceeding directly with the process will fail to meet the wafer process requirements of that step and subsequent steps, and may even prevent the completion of the corresponding process, thus compromising wafer process quality, causing unnecessary waste, and increasing process costs. For example, Figure 5 The wafer notch alignment device shown in the diagram aligns wafer 300 during the alignment process by driving roller 501 to rotate (e.g., around...). Figure 5 (T2 rotation), further driving wafer 300 to rotate (such as around) Figure 5 The roller 501 rotates (in the T1 direction) to complete the corresponding alignment process requirements. During the rotation, the roller 501 can not only drive the wafer 300 to rotate, but may also cause the wafer 300 to move along its axial direction, resulting in the wafer 300 being in an abnormal position. Under normal circumstances, it is not possible to detect whether the wafer 300 has an abnormality in real time during the process. It is necessary to detect the wafer 300 before or after the process. For example, along the T1 direction... Figure 5 The wafer is sent to the inspection unit in the middle M direction to check for abnormalities such as stacking, tilting, breakage, and overlap, so as to eliminate the corresponding abnormalities in time and avoid unnecessary damage and economic losses to the wafer 300 process due to further transmission of the abnormalities.

[0051] In related technologies, when inspecting the 300-state of a wafer before or after the process, the wafer under test is typically placed horizontally in a designated chamber, such as a wafer inspection box / wafer transfer box. This chamber is sealed on three sides with only one door open. A cylinder drives a sensor to move along the scanning direction (the axis of the wafer under test). During the wafer inspection process, firstly, the stability of the cylinder movement is difficult to control, thus the accuracy of wafer inspection is difficult to guarantee, and it is impossible to detect whether the spacing between adjacent wafers under test is consistent. Secondly, it can only detect whether there is any damage or abnormality at the edge of the wafer located at the chamber door, and cannot know whether there is any damage or abnormality in other parts of the wafer inside the chamber. Therefore, it is impossible to perform a comprehensive scan inspection of the wafer under test. Furthermore, because the wafer under test is placed horizontally in related technologies, this placement method requires at least the two edges of the center part of the wafer under test to be supported to keep the wafer under test in a horizontal position. At this time, during the wafer scanning inspection process, only the outer edge of the wafer under test can be scanned, thus making it impossible to perform a comprehensive scan inspection.

[0052] This utility model provides a wafer inspection device and semiconductor process equipment. A servo motor and a linear module connected to it drive a movable support equipped with sensors to move along the axial extension direction of the wafer in its normal position within the wafer inspection area. This allows the sensors to accurately detect the precise position of the wafer under test in real time. The wafer is placed vertically, with support points only at its bottom; the rest of the wafer can be inspected, enabling comprehensive scanning and inspection. It should be noted that this comprehensive inspection does not mean absolutely comprehensive inspection, but rather inspection of the vast majority of the wafer area. The following detailed description, using specific embodiments and accompanying drawings, further illustrates this utility model.

[0053] This utility model provides a wafer inspection device, such as... Figure 1a As shown, the wafer inspection device 100 includes a linear module 110 and a moving bracket 120. The linear module 110 has a slider 111, which is connected to a servo motor 112. The moving bracket 120 is disposed on the outer periphery of the wafer preset inspection area and fixed to the slider 111. A first sensor 121 is provided on the moving bracket 120, and the sensing end of the first sensor 121 faces the wafer preset inspection area. The wafer inspection device is configured such that, under the driving action of the servo motor 112, the slider 111 can drive the moving bracket 120 to move linearly along the axial direction, so that the first sensor 121 can detect the wafer status. The axial linear movement is the axial extension direction of the wafer in its normal position state within the wafer preset inspection area, such as... Figure 1a , Figure 1b , Figure 2 , Figures 3a-3c , Figure 4aThe direction indicated by F1 is the direction of linear motion along that axis.

[0054] In this embodiment of the invention, the servo motor 112 is connected to the linear module 110, thereby driving the slider 111 of the linear module 110 to move linearly along the axial direction. The slider 111 further drives the moving bracket 120 and the first sensor 121 mounted on the moving bracket 120 to move linearly along the axial direction. The direction of this linear movement is the axial extension direction when the wafer is in its normal position. During the linear movement along the axial direction, the first sensor 121 detects the wafer 300 at the corresponding position. On the one hand, because the connection between the servo motor 112 and the linear module 110 has the characteristics of power transmission and smooth movement, it can accurately drive and feedback the position of the slider 111 in real time, thereby accurately detecting the wafer 300. The device can detect the actual position of the wafer, the number of wafers, and the spacing between adjacent wafers. On the other hand, it can at least detect whether the wafers in the area sensed by the first sensor 121 are damaged. Furthermore, based on the relative positions of adjacent wafers detected by the first sensor 121, it can detect whether the wafers are tilted, missing wafers, stacked wafers, or have misaligned or overlapping abnormalities. This helps to prevent abnormal wafers from being transferred to the next process step, thus avoiding wafer scratches, damage, and unnecessary economic losses. In addition, this wafer detection device can detect various wafer abnormalities by simply setting up a servo motor, a linear module, and sensors. It has the advantages of simple structure, easy maintenance, and high detection efficiency.

[0055] Specifically, the servo motor 112 can accurately report its rotation status, thereby accurately reporting the movement position of the slider 111 and the moving bracket 120, thus accurately reporting the scanning position of the first sensor 121, and accurately reporting the specific position status of the wafer under test sensed by the first sensor 121, thereby accurately detecting the spacing between adjacent wafers; the wafer status is determined based on the spacing between adjacent wafers or the sensing time of the wafer sensed by the first sensor 121. For example, if different parts of adjacent wafers are detected to have spacing, but the spacing is not equal and gradually increases or decreases, then there is a high probability of wafer tilt. Specifically, taking a certain diameter of the wafer as a boundary, along the scanning direction of the first sensor 121, if the spacing between one half of the wafer 300 and its upstream adjacent wafer is greater than the spacing between the other half and its upstream adjacent wafer, it indicates that there is an abnormal wafer tilt position. Alternatively, if the first sensor 121 senses one half of the wafer with a time lag, while sensing the other half of the wafer with a time lead, it also indicates that the wafer has an abnormal tilt position. For example, the edge of the wafer overlaps with its adjacent wafer, or the wafer is tilted or misaligned. When the first sensor 121 senses a certain target... If the thickness of a wafer is greater than its normal thickness, for example, if the thickness is doubled, it indicates a wafer stacking anomaly. If the first sensor 121 detects that the spacing between two adjacent wafers is the same, but the spacing is more than twice the normal spacing, it indicates a wafer missing anomaly. If the first sensor 121 detects that some of the spacing between two adjacent wafers is the same as the normal spacing, while some of the spacing is twice the normal spacing, it indicates a wafer breakage anomaly, and the broken part is precisely the part where the spacing is twice the normal spacing. It should be noted that the wafer timing sensed by the first sensor 121 corresponds to the spacing between adjacent wafers sensed. Examples of the sensed wafer timing will not be provided here.

[0056] In this embodiment of the utility model, such as Figure 2As shown, the movable support 120 includes a left cantilever 122, a right cantilever 123, and a connecting arm 124. Both the left cantilever 122 and the right cantilever 123 are fixed to the connecting arm 124 and are spaced apart from each other. Specifically, the left end of the connecting arm 124 is fixed to the upper end of the left cantilever 122, and the right end is fixed to the upper end of the right cantilever 123, thus forming an arc-shaped / arched frame structure. The left cantilever 122, the right cantilever 123, and the connecting arm 124 are all located on the outer periphery of the pre-set detection area of ​​the wafer, i.e., the arc-shaped / arched frame structure. The enclosed area corresponds to the preset detection area of ​​the wafer. This structure can effectively avoid contact with the wafer and damage to the wafer 300, thereby ensuring the yield of the wafer 300. The first sensor 121 is located on the left cantilever 122 and / or the right cantilever 123. That is, the first sensor 121 can be located on the left cantilever 122 or the right cantilever 123, or both the left cantilever 122 and the right cantilever 123 are equipped with the first sensor 121. The specific location of the first sensor 121 is not limited here.

[0057] In this embodiment of the utility model, such as Figure 1a , Figure 1b , Figures 3a-3e As shown, the wafer preset detection area is used to accommodate the vertically placed wafer 300; the left cantilever 122 and the right cantilever 123 both extend in the vertical direction, and the connecting arm 124 extends in the horizontal direction and is located above the wafer preset detection area, and is perpendicular to the axial extension direction of the wafer in its normal position state. This axial extension direction is the scanning direction of the wafer detection device during the detection process.

[0058] In this embodiment of the utility model, such as Figures 1a-1b , Figure 2 As shown, the first sensor 121 has at least two sensors, which are spaced apart in a vertical direction and can detect at least the upper half and the lower half of the wafer 300. Specifically, taking the first sensor 121 including through-beam sensors as an example, the detection areas of at least one pair of through-beam sensors are located in the upper half of the wafer 300, and the detection areas of at least one pair of through-beam sensors are located in the lower half of the wafer 300. Taking two pairs of through-beam sensors as an example, one pair is used to detect the upper half of the wafer 300, and the other pair is used to detect the lower half of the wafer 300. The through-beam sensors can be fixedly installed at the corresponding positions of the movable bracket 120 by screws or other fasteners.

[0059] Continuing with the example of setting up two pairs of through-beam sensors, in the actual detection process, the detection results of the two pairs of through-beam sensors can be combined to determine whether the wafer is in a normal state. When each wafer is in a normal state, the thickness of each wafer and the spacing between adjacent wafers are consistent. This consistency is not absolute consistency, but rather consistency that meets process requirements or is within the allowable error range. In layman's terms, it is almost consistent. At this time, the wafer conditions detected by the upper and lower pairs of through-beam sensors are consistent. When they are inconsistent, the wafer is abnormal, such as stacking, tilting, missing wafers, or breakage. During the process of the moving bracket 120 driving the through-beam sensors to move along the scanning direction, there will be a difference between the actual scanning value of the wafer with abnormal conditions and the normal scanning value. The specific type of abnormality of the wafer can be determined by the specific situation of this difference, and an alarm can be triggered by the alarm device.

[0060] Specifically, during the movement of the two pair of photodetectors along the scanning direction, if both pairs of sensors detect a wafer being blocked for a longer duration than normal, it indicates that the wafer thickness at that detection location is excessive. For example, if the blocking time doubles, it suggests that two wafers are stacked. Figure 3a When an abnormality is detected in the wafer at the location indicated by the middle arrow DP, an alarm message can be sent to alert and resolve the abnormality.

[0061] During the movement of the two pairs of photoelectric sensors along the scanning direction, if the two pairs of photoelectric sensors are not blocked at any preset position of a wafer, or if no corresponding wafer is detected at any preset position, or if the actual distance between a certain adjacent wafer is close to twice the preset distance, it indicates that a wafer is missing at that position, which is a wafer missing anomaly (not shown in the figure). When the wafer missing anomaly is detected, an alarm message can be sent to warn and eliminate the anomaly.

[0062] During the movement of the two photoelectric sensors along the scanning direction, if both sensors exhibit a lag or a lead when they are blocked by a wafer compared to the normal time, and the lag or lead durations are inconsistent, it indicates that the wafer is tilted. For example, the top edge of one wafer may overlap with the top edge of an adjacent wafer. Figure 3b When the wafer indicated by the middle arrow DJ is detected to have an abnormal overlap, an alarm message can be sent to alert and resolve the issue.

[0063] During the movement of the two pairs of photoelectric sensors along the scanning direction, if the moment when one pair of photoelectric sensors is blocked by a certain wafer is lagging behind the normal moment, while the moment when the other pair of photoelectric sensors is blocked by the same wafer is ahead of the normal moment, it indicates that the wafer has been misaligned, as shown by the wafer indicated by arrow CW in Figure 3. Once this misalignment is detected, an alarm message can be sent to alert and eliminate the abnormality.

[0064] During the movement of the two photoelectric sensors along the scanning direction, if one pair of photoelectric sensors operates normally when blocked by a wafer (meaning the actual spacing between adjacent wafers at that position is the same as the normal spacing), while the corresponding position of the other pair of photoelectric sensors is not blocked by a wafer (meaning the actual spacing between adjacent wafers at that position is greater than the normal spacing), it indicates that the wafer is damaged. Figure 3d In the middle, the sensing area L2 of the lower through-beam sensor is normally blocked by the wafer, while the sensing area L1 of the upper through-beam sensor is not blocked by the wafer, indicating that there is a break or missing part in the upper part of the wafer. When this abnormality is detected, an alarm message can be sent to alert and eliminate the abnormality.

[0065] like Figure 3e As shown, when the side of the wafer is damaged, since the wafer is placed vertically, the damaged wafer will tilt slightly due to the shift in its center of gravity. During the movement of the two pairs of photoelectric sensors along the scanning direction, there will be a difference between the actual scanning values ​​of the photoelectric sensors and the normal values, indicating that there is an abnormality in the wafer. This can also be determined by the moment when the two pairs of photoelectric sensors are blocked by a wafer, or by combining the information sensed by other sensors, such as combining it with the second sensor (diffuse reflection sensor, which will be further explained later) set on the support. When the damage abnormality is detected, an alarm message can be sent to alert and eliminate the abnormality.

[0066] The above examples all use through-beam sensors located at the lower and upper parts of the wafer, respectively, to effectively detect the wafer from all directions. It should be noted that this embodiment uses two pairs of through-beam sensors as an example; however, other numbers of through-beam sensors can be used, such as 3, 4, 5, 6, etc., without limitation. When the number of through-beam sensors exceeds two pairs, the corresponding pairs can be vertically spaced, for example, through-beam sensors can be placed at the locations directly opposite the upper edge, upper middle, middle, lower middle, and lower edge of the wafer. Sensors can also be placed on the connecting arm 124 to combine with the detection results of the through-beam sensors, thereby achieving more comprehensive wafer detection, without limitation.

[0067] It should be noted that in this embodiment of the utility model, only a through-beam sensor is used as an example for illustration. In addition to using a through-beam sensor, other sensors can also be used, such as distance sensors, etc., which are not limited here.

[0068] In this embodiment of the utility model, such as Figure 1a , Figure 2 As shown, the linear module 110 also has a fixed base 113 and a cable chain 114. Specifically, the fixed base 113 has a fixed base plate and side plates fixed to the fixed base plate. The length direction of the fixed base plate extends along the scanning direction / the linear movement direction of the linear module. The side plates are fixed at both ends of the fixed base plate along its length direction. The guide rail of the linear module 110 is mounted on the side plates, and the slider 111 is slidably connected to the guide rail. The power transmission structure of the linear module is mounted on the corresponding side plates or the fixed base plate. For example, the power transmission structure is a lead screw assembly. The two ends of the lead screw are pivotally connected to the side plates, and one end is driven to the output shaft of the servo motor 112. The two can be directly fixedly connected by a coupling or indirectly driven by a reducer, so that the servo motor 112 directly drives the lead screw to rotate. The lead screw is connected to a nut / screw, which is fixedly connected to the slider 111. It should be noted that the nut / screw and the slider can be an integral structure or a detachable fixed connection structure. The servo motor 112 is mounted on the fixed base 113. Specifically, the housing of the servo motor 112 is directly or indirectly fixed to the fixed base 113. For example, the housing of the servo motor 112 can be directly fixed to one of the side plates using fasteners such as screws. One end of the cable chain 114 is fixed to the fixed base 113, and the other end is fixed to the movable bracket 120. Specifically, the lower end of the cable chain 114 can be fixed to the middle part of the fixed base 113 using fasteners such as bolts. For example, the lower end of the cable chain 114 is fixed to the middle part of the fixed base plate along its length. The cable chain 114 can be directly... Alternatively, it can be indirectly fixed to the movable bracket 120. For example, the upper end of the drag chain 114 is fixedly connected to the lower end of the movable bracket 120 by bolts or other fasteners. The drag chain 114 is configured to secure the cable of the first sensor 121. With this configuration, as the first sensor 121 moves along the scanning direction, the drag chain 114 moves with the movable bracket 120, and the cable of the first sensor 121 will move with the drag chain 114, preventing cable entanglement and wear, thereby effectively protecting the cable and ensuring its stable and safe operation.

[0069] In this embodiment of the present invention, the wafer inspection device 100 further includes a column 130, which is fixedly mounted on the slider 111, and a movable support 120 is fixedly mounted on the column 130. Specifically, as shown... Figure 1a , Figure 2As shown, the column 130 can be configured as a vertically extending plate-like structure and can be fixedly connected to the left cantilever 122 or the right cantilever 123 of the movable bracket 120 by bolts or other fasteners. Taking the fixed connection to the right cantilever 123 as an example, the left cantilever 122, the right cantilever 123, and the connecting arm 124 can all be plate-like structures. The three can be detachably fixedly connected or be an integral structure. To enhance the connection stability and strength between the right cantilever 123 and the column 130, a reinforcing rib can be fixed between them. The bottom end of the column 130 and the slider 111 can be fixedly connected by bolts or other fasteners.

[0070] In this embodiment of the invention, the movable bracket 120 has a black surface facing the transmitting and receiving ends of the first sensor 121. This arrangement reduces or even avoids unnecessary reflected light from the sensor, which could affect the sensor's detection accuracy and cause false alarms, thereby improving the accuracy of wafer detection. Specifically, the black surface can be generated through anodizing. The outer surfaces of the movable bracket 120, the column 130, and the outer walls of other components fixed on them can all be made black to effectively reduce the light beam emitted by the through-beam sensor when detecting the wafer, which is refracted and reflected by the wafer and other components, thus reducing the detection effect of the through-beam sensor. The black surface can absorb the refracted and reflected light points of the through-beam sensor detecting the wafer, effectively improving the detection accuracy of the through-beam sensor. In addition, the movable bracket 120, the column 130, and other components can all be made of aluminum. It should be noted that the black here is not pure black in the absolute sense, but a dark color close to pure black.

[0071] This utility model embodiment also provides a semiconductor process equipment, such as... Figure 1a , Figure 1b As shown, the semiconductor process equipment includes a wafer transfer device 200 and the aforementioned wafer inspection device 100. The wafer transfer device 200 is configured to: transfer the wafer to be inspected to a preset wafer inspection area, or transfer the inspected wafer from the preset wafer inspection area to the next process step. This semiconductor process equipment has all the advantages of the aforementioned wafer inspection device 100, which will not be elaborated further here.

[0072] In this embodiment of the utility model, such as Figure 1a , Figure 1bAs shown, the wafer transfer device 200 includes a support 210 disposed in the wafer preset detection area and has a positioning part 211 configured to support and position the edge portion of the wafer 300. Specifically, the positioning part 211 can be a positioning groove (not shown in the figure), which is used to accommodate, support, and position the edge portion of the wafer 300. The transfer device 210 may also include a conveying structure such as a conveyor belt / conveyor chain (not shown in the figure), in which the support 210 is fixed to the conveyor belt / conveyor chain, or it can be an integral structure, that is, the support 210 is part of the conveyor belt / conveyor chain; of course, in addition to the conveyor belt / conveyor chain, other transfer methods can also be used, for example, a temporary storage station, in which the support 210 is fixed, and the area where this position is located is the wafer preset detection area.

[0073] Specifically, the wafer inspection device 100 can be installed beside the wafer transport device 200. For example, the linear module 110 can be installed at the corresponding position on the base of the wafer transport device 200 so that the wafer 300 can be inspected simultaneously when the wafer is transported between process stations. When the wafer 300 is abnormal, the transport of the wafer 300 is stopped to prevent the abnormal wafer from entering the next process station. The abnormal wafer 300 is then processed accordingly, such as rejecting the abnormal wafer, replacing it with a qualified wafer, or adjusting the wafer position, until all wafers are normal and then directly transported to the next process station. This effectively ensures process quality, reduces unnecessary waste, lowers process costs, and improves process efficiency.

[0074] In this embodiment of the invention, the support 210 is provided with a second sensor 212, the sensing end of which faces upwards and is configured to sense the vertical end face of the wafer 300. Specifically, the second sensor 212 can be configured as a diffuse reflection sensor. The second sensor 212 can be combined with the first sensor 121 to accurately locate the abnormal breakage position on the end face of the wafer, such as... Figure 3e As shown, for wafers with abnormal damage on the left side, the second sensor 212 can sense the specific location of the damage upwards to accurately detect the specific damaged area and other abnormal conditions of the wafer. It should be noted that the second sensor 212 can be any type of sensor besides a diffuse reflection sensor, as long as it can sense the vertical end face of the wafer; there are no limitations here.

[0075] like Figure 4a , Figure 4b , Figure 4c As shown in this embodiment of the invention, the semiconductor process equipment also includes a robotic arm 400, which can place one or more sets of wafers to be tested onto the corresponding positions of the support 210, or remove the tested wafers from the support 210. Specifically, the robotic arm 400 moves to a position above the preset testing area of ​​the wafer, and the moving bracket 120 moves to its origin position (e.g., ...). Figure 4a As shown), the movable support 120 moves to one end of the linear module 110 to provide clearance for the robotic arm 400, facilitating its descent to the wafer location to grasp it. Specifically, the robotic arm 400 slowly descends, placing the wafer to be tested into the preset testing area or removing the tested wafer from the preset testing area; where, as Figures 4a-4b In the diagram, F2 represents the approximate direction of movement of the robotic arm 400 when picking up and placing wafers.

[0076] It should be noted that, please continue to refer to Figure 4a , Figure 4b , Figure 4c The wafers located in the pre-set testing area are placed vertically. This configuration allows for pre-detection of any anomalies occurring before the wafer enters the next process step, enabling timely alarm detection and troubleshooting. Furthermore, vertical wafer placement shortens the spacing between adjacent wafers. This spacing can be the standard 10mm, or smaller than 5mm. This allows for batch testing of more wafers within the same testing space. For example, wafers from multiple wafer testing boxes can be placed in the same pre-set testing area for batch testing. This enables non-contact simultaneous testing of multiple wafers in multiple testing boxes on a single transport device. The number of wafers can range from 1 to 50, or even more than 50, achieving larger batch testing to improve efficiency, or smaller batch testing in smaller spaces to reduce the space occupied by the testing equipment, thus miniaturizing the pre-set testing area. On the other hand, placing the wafer vertically allows for minimal support points to be used to support the wafer under test. For example, only the bottom edge of the wafer needs to be supported. This facilitates the first sensor 121 on the movable support 120 to perform comprehensive scanning and detection of other parts of the wafer, thereby meeting the requirements for comprehensive wafer detection as much as possible, improving the accuracy and convenience of wafer detection, promptly eliminating wafer anomalies, preventing abnormal wafers from entering the next process, avoiding wafer damage during the process and causing unnecessary economic losses, and ensuring the process quality and efficiency of subsequent processes.

[0077] Furthermore, in this embodiment of the invention, the wafer to be tested is placed vertically in the wafer preset detection area of ​​the transmission device. When the wafer is detected without error or the abnormality is eliminated, the qualified wafer can be directly transferred to the next process station for processing. There is no need to set up a separate detection station in another location. That is, the wafer detection station is combined with the wafer transmission station, which not only saves space but also reduces the number of operation steps and further improves process efficiency.

[0078] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0079] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the term "installation" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; and it can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer inspection device, characterized in that, Includes a linear module (110) and a movable support (120); The linear module (110) has a slider (111), and the slider (111) is connected to a servo motor (112). A movable support (120) is disposed on the outer periphery of the preset detection area of ​​the wafer and fixed to the slider (111); a first sensor (121) is provided on the movable support (120), and the sensing end of the first sensor (121) faces the preset detection area of ​​the wafer; The wafer inspection device is configured such that, under the driving action of the servo motor (112), the slider (111) can drive the moving bracket (120) to move linearly along the axial direction so that the first sensor (121) can detect the wafer status; wherein, the linear axial movement is the axial extension direction of the wafer in its normal position state within the wafer preset detection area.

2. The wafer inspection apparatus according to claim 1, characterized in that, The movable support (120) includes a left cantilever (122), a right cantilever (123), and a connecting arm (124); the left cantilever (122) and the right cantilever (123) are both fixed to the connecting arm (124) and are arranged at intervals relative to each other; The left cantilever (122), the right cantilever (123) and the connecting arm (124) are all located on the outer periphery of the preset detection area of ​​the wafer, and the first sensor (121) is disposed on the left cantilever (122) and / or the right cantilever (123).

3. The wafer inspection apparatus according to claim 2, characterized in that, The wafer preset detection area is used to accommodate vertically placed wafers (300); The left cantilever (122) and the right cantilever (123) both extend vertically, and the connecting arm (124) extends horizontally and is located above the preset detection area of ​​the wafer.

4. The wafer inspection apparatus according to claim 3, characterized in that, The first sensor (121) has at least two and is arranged at intervals along the vertical direction, and can detect at least the area where the upper half of the wafer (300) is located and the area where the lower half of the wafer (300) is located.

5. The wafer inspection apparatus according to claim 4, characterized in that, The first sensor (121) includes a through-beam sensor, and the detection areas of at least one pair of the through-beam sensors are located in the upper half of the wafer (300), and the detection areas of at least one pair of the through-beam sensors are located in the lower half of the wafer (300).

6. The wafer inspection apparatus according to any one of claims 1-5, characterized in that, The linear module (110) also has a fixed base (113) and a cable chain (114); the servo motor (112) is mounted on the fixed base (113), one end of the cable chain (114) is fixed to the fixed base (113), and the other end is fixed to the movable bracket (120). The cable chain (114) is configured to secure the cable of the first sensor (121).

7. The wafer inspection apparatus according to any one of claims 1-5, characterized in that, It also includes a column (130) fixed to the slider (111) and a movable bracket (120) fixed to the column (130).

8. The wafer inspection apparatus according to any one of claims 1-5, characterized in that, The movable support (120) has a black surface facing the transmitter and receiver of the first sensor (121).

9. The wafer inspection apparatus according to claim 8, characterized in that, The black surface is formed through anodizing.

10. A semiconductor process apparatus, characterized in that, The device includes a wafer transfer device (200) and a wafer inspection device (100) according to any one of claims 1-9. The wafer transfer device (200) is configured to: transfer the wafer to be inspected to the wafer preset inspection area, or transfer the inspected wafer from the wafer preset inspection area to the next process station.

11. The semiconductor process equipment according to claim 10, characterized in that, The wafer transfer device (200) includes a support (210) disposed in the preset detection area of ​​the wafer and has a positioning part (211) configured to support and position the edge portion of the wafer (300).

12. The semiconductor process equipment according to claim 11, characterized in that, The support (210) is provided with a second sensor (212), the sensing end of the second sensor (212) facing upward, configured to sense the vertical end face of the wafer (300).

13. The semiconductor process equipment according to claim 12, characterized in that, The second sensor (212) is a diffuse reflection sensor.

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