Submarine air conditioning system

Abstract

The application provides a kind of submarine air conditioning system, including inner and outer shell, first and second semiconductor cold heat exchanger, and air valve, air port and fan assembly. Annular cavity is formed between inner and outer shell. First and second semiconductor cold heat exchanger is arranged in right side and left side in annular cavity respectively, first semiconductor cold heat exchanger is connected with diffusion structure, and second semiconductor cold heat exchanger is connected with solid dehumidification structure. First air valve is between two semiconductor cold heat exchangers at upper side in annular cavity, and second air valve is at lower side in annular cavity. First air port is located between first semiconductor cold heat exchanger and first air valve;Second air port is located between first semiconductor cold heat exchanger and second air valve;Third air port is located between second semiconductor cold heat exchanger and first air valve;Fourth air port is located between second semiconductor cold heat exchanger and second air valve. First fan is arranged between first and second air ports, and second fan is arranged between third and fourth air ports. The air conditioning system of the application is small in size and high in safety.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of submersible air conditioning, in particular to a submersible air conditioning system. BACKGROUND

[0002] As a kind of water-borne equipment with important strategic value, deep-sea manned submersible can carry scientific research and engineering technical personnel to study marine biological environment and provide important help for seabed mineral resources exploration and development.

[0003] However, there are significant differences between deep-sea manned submersible and surface navigation ship design, and the underwater navigation period of deep-sea manned submersible usually needs more than ten hours, and the internal air of manned submersible is completely isolated from the outside environment during underwater navigation, so the internal air temperature and humidity control is also very important to ensure the health, comfort and work efficiency of the crew.

[0004] At present, ship air conditioning mainly adopts vapor compression refrigeration unit, which completes air cooling, dehumidification and heating through freon refrigerant, but for deep-sea manned submersible, vapor compression refrigeration unit has the disadvantages of large size and noise, which is not suitable for manned submersible with small cabin space, and once freon leakage occurs, it is easy to destroy the air environment in the small cabin space of deep-sea manned submersible in a short time, causing serious consequences such as suffocation of the crew. SUMMARY

[0005] The purpose of the embodiment of the present application is to provide a submersible air conditioning system, all components are integrated and installed in the annular cavity between the outer shell and the inner shell of the submersible, without occupying any cabin space inside the submersible. At the same time, the semiconductor cold and hot heater has no moving parts in the process of refrigeration and heating, small size and almost no noise.

[0006] The application discloses a kind of submarine air conditioning systems, including shell, inner shell, first semiconductor cold heater, second semiconductor cold heater, air valve assembly, air port assembly and fan assembly.Inner shell is nested in shell, annular cavity is formed between inner shell and shell, and cabin space of submarine is inside inner shell.First semiconductor cold heater is arranged in annular cavity and is located right side, one side surface of first semiconductor cold heater is attached to the inner wall of shell, and the other side surface of first semiconductor cold heater is connected with diffusion structure with gap.The second semiconductor cold heater is arranged in annular cavity and is located left side, one side surface of second semiconductor cold heater is attached to the inner wall of shell, and the other side surface of second semiconductor cold heater is connected with solid dehumidification structure.Air valve assembly includes first air valve and second air valve;First air valve is arranged in the upper side of annular cavity and is between first semiconductor cold heater and second semiconductor cold heater, for blocking or communicating annular cavity;Second air valve is arranged in the lower side of annular cavity and is between first semiconductor cold heater and second semiconductor cold heater, for closing or communicating annular cavity.Air port assembly includes first air port, second air port, third air port and fourth air port;All air ports are opened on inner shell, to communicate annular cavity and cabin space, and each air port can be closed or opened;First air port is between first semiconductor cold heater and first air valve;Second air port is between first semiconductor cold heater and second air valve;Third air port is between second semiconductor cold heater and first air valve;Fourth air port is between second semiconductor cold heater and second air valve.Fan assembly includes first fan and second fan;First fan is arranged in annular cavity between first air port and second air port;Second fan is arranged in annular cavity between third air port and fourth air port.

[0007] In an implementable scheme, the first fan is arranged in annular cavity opposite to the first air port;Second fan is arranged in annular cavity opposite to the third air port.

[0008] In an implementable scheme, diffusion structure is uniformly arranged fin structure or uniformly arranged column structure, and diffusion structure is made of heat-conducting material.

[0009] In an implementable scheme, solid dehumidification structure is multilayer wave structure, and wave structure is made of heat-conducting and moisture-absorbing material.

[0010] In an implementable scheme, in addition to the part that first semiconductor cold heater and second semiconductor cold heater contact with the inner surface of shell, heat insulation layer is applied to other inner surface of shell.

[0011] In an embodiment, the submersible air conditioning system comprises a cooling mode, in which the first and second air valves are closed; the first and second air inlets are opened; the first semiconductor cooler is working and the second semiconductor cooler is stopped; the side of the first semiconductor cooler connected with the diffusion structure is the refrigeration side and the side of the first semiconductor cooler contacting the inner surface of the shell is the heating side; the first air fan is started to make the air flow from the cabin space into the annular cavity through the second air inlet, and then the air flow flows through the surface of the diffusion structure and is discharged into the cabin space through the first air inlet.

[0012] In an embodiment, the submersible air conditioning system comprises a dehumidification mode, in which the first and second air valves are closed; the third and fourth air inlets are opened; the first semiconductor cooler is stopped and the second semiconductor cooler is working or stopped; the side of the second semiconductor cooler connected with the solid dehumidification structure is the refrigeration side and the side of the second semiconductor cooler contacting the inner surface of the shell is the heating side; the second air fan is started to make the air flow from the cabin space into the annular cavity through the fourth air inlet, and then the air flow flows through the surface of the solid dehumidification structure and is discharged into the cabin space through the third air inlet.

[0013] In an embodiment, the submersible air conditioning system comprises a cooling and dehumidification mode, in which the first air valve is closed and the second air valve is opened; the first air inlet is opened and the second air inlet is closed; the third air inlet is opened and the fourth air inlet is closed; the first semiconductor cooler is working and the side of the first semiconductor cooler connected with the diffusion structure is the refrigeration side and the side of the first semiconductor cooler contacting the inner surface of the shell is the heating side; the second semiconductor cooler is working or stopped and the side of the second semiconductor cooler connected with the solid dehumidification structure is the refrigeration side and the side of the second semiconductor cooler contacting the inner surface of the shell is the heating side; the second air fan is started to make the air flow from the cabin space into the annular cavity through the first air inlet, and then the air flow flows through the surface of the diffusion structure and the surface of the solid dehumidification structure and is discharged into the cabin space through the third air inlet.

[0014] In an embodiment, the submersible air conditioning system comprises a heating mode, in which the first and second air valves are closed; the first and second air inlets are opened; the first semiconductor cooler is working and the second semiconductor cooler is stopped; the side of the first semiconductor cooler connected with the diffusion structure is the heating side and the side of the first semiconductor cooler contacting the inner surface of the shell is the refrigeration side; the first air fan is started to make the air flow from the cabin space into the annular cavity through the second air inlet, and then the air flow flows through the surface of the diffusion structure and is discharged into the cabin space through the first air inlet.

[0015] In an implementable solution, the submersible air conditioning system has a dehumidification regeneration mode, in which the first air valve is closed, the second air valve is opened; the first air port is opened, the second air port is closed, the third air port is opened, and the fourth air port is closed; the first semiconductor cold heater works, and the side of the first semiconductor cold heater connected with the diffusion structure is a heating side, and the contact side of the first semiconductor cold heater with the inner surface of the shell is a refrigeration side; the second semiconductor cold heater works, and the side of the second semiconductor cold heater connected with the solid dehumidification structure is a heating side, and the contact side of the second semiconductor cold heater with the inner surface of the shell is a refrigeration side; the second air fan is started, so that the air flow is sucked into the annular cavity from the cabin space through the first air port, flows through the surfaces of the diffusion structure and the solid dehumidification structure in sequence, and is then discharged into the cabin space through the third air port, and then discharged to the outside through the hatch of the submersible.

[0016] Compared with the prior art, the application has the following beneficial effects:

[0017] All the components related to heating, refrigeration and dehumidification in the submersible air conditioning system of the application, such as semiconductor cold heaters, air valves and air fans, are all integrated and installed in the annular cavity between the shell and the inner shell, without occupying any cabin space inside the submersible. At the same time, the semiconductor cold heater has no moving parts in the process of refrigeration and heating, has small volume and almost no noise, and the refrigeration and heating functions of the semiconductor cold heater do not require freon, thus directly eliminating the hidden danger of freon leakage.

[0018] The submersible air conditioning system of the application can at least realize five working modes of cooling mode, dehumidification mode, cooling and dehumidification mode, heating mode and dehumidification regeneration mode, and better meets the environmental regulation requirements inside the submersible. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope, and other related drawings can also be obtained by those skilled in the art without creative labor.

[0020] Figure 1 It is a whole structure schematic diagram of a submersible air conditioning system according to an embodiment of the application;

[0021] Figure 2 It is a front view schematic diagram of a diffusion structure of a submersible air conditioning system according to an embodiment of the application;

[0022] Figure 3 It is a schematic diagram of a solid dehumidification structure of a submersible air conditioning system according to an embodiment of the application;

[0023] Figure 4A cooling mode air flow direction diagram for a submersible air conditioning system according to an embodiment of the present application;

[0024] Figure 5 A dehumidification mode air flow direction diagram for a submersible air conditioning system according to an embodiment of the present application;

[0025] Figure 6 A cooling and dehumidification mode air flow direction diagram for a submersible air conditioning system according to an embodiment of the present application;

[0026] Figure 7 A heating mode air flow direction diagram for a submersible air conditioning system according to an embodiment of the present application;

[0027] Figure 8 A dehumidification regeneration mode air flow direction diagram for a submersible air conditioning system according to an embodiment of the present application.

[0028] In the figure: 10, outer shell; 20, inner shell; 30, first semiconductor cold heat exchanger; 31, diffusion structure; 40, second semiconductor cold heat exchanger; 41, solid dehumidification structure; 51, first air valve; 52, second air valve; 61, first air port; 62, second air port; 63, third air port; 64, fourth air port; 71, first air fan; 72, second air fan; 80, thermal insulation layer; 100, annular cavity; 200, cabin space. DETAILED DESCRIPTION

[0029] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to clearly and completely describe the technical solutions of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application but not all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0031] As Figure 1 shown, the present application provides a submersible air conditioning system, which includes an outer shell 10, an inner shell 20, a first semiconductor cold heat exchanger 30, a second semiconductor cold heat exchanger 40, an air valve assembly, an air port assembly and an air fan assembly.

[0032] The inner shell 20 is nested in the outer shell 10, and an annular cavity 100 is formed between the inner shell 20 and the outer shell 10, and the inner shell 20 is internally provided with a cabin space 200 of the submersible vehicle. The first semiconductor cooler 30 is arranged in the annular cavity 100 and located on the right side, one side surface of the first semiconductor cooler 30 is attached to the inner wall of the outer shell 10, and the other side surface of the first semiconductor cooler 30 is connected with a diffusion structure 31 with uniform gaps. The second semiconductor cooler 40 is arranged in the annular cavity 100 and located on the left side, one side surface of the second semiconductor cooler 40 is attached to the inner wall of the outer shell 10, and the other side surface of the second semiconductor cooler 40 is connected with a solid dehumidification structure 41. The air valve assembly includes a first air valve 51 and a second air valve 52; the first air valve 51 is arranged on the upper side of the annular cavity 100 and between the first semiconductor cooler 30 and the second semiconductor cooler 40, and is used to block or communicate the annular cavity 100; the second air valve 52 is arranged on the lower side of the annular cavity 100 and between the first semiconductor cooler 30 and the second semiconductor cooler 40, and is used to close or communicate the annular cavity 100. The air port assembly includes a first air port 61, a second air port 62, a third air port 63 and a fourth air port 64; all the air ports are arranged on the inner shell 20 and are used to communicate the annular cavity 100 and the cabin space 200, and each air port can be closed or opened; the first air port 61 is located between the first semiconductor cooler 30 and the first air valve 51; the second air port 62 is located between the first semiconductor cooler 30 and the second air valve 52; the third air port 63 is located between the second semiconductor cooler 40 and the first air valve 51; and the fourth air port 64 is located between the second semiconductor cooler 40 and the second air valve 52. The fan assembly includes a first fan 71 and a second fan 72; the first fan 71 is arranged in the annular cavity 100 between the first air port 61 and the second air port 62; and the second fan 72 is arranged in the annular cavity 100 between the third air port 63 and the fourth air port 64.

[0033] All the components related to heating, cooling and dehumidification in the submersible vehicle air conditioning system of the present application, such as the semiconductor cooler, the air valve and the fan, are all integrated and arranged in the annular cavity 100 between the outer shell 10 and the inner shell 20, and do not occupy any cabin space 200 inside the submersible vehicle. At the same time, the semiconductor cooler has no moving parts during the cooling and heating process, has small volume and almost no noise, and the cooling and heating functions of the semiconductor cooler do not require freon, thus directly eliminating the hidden danger of freon leakage.

[0034] In an embodiment, as shown in Figure 1 The first fan 71 is arranged in the annular cavity 100 opposite to the first air port 61; and the second fan 72 is arranged in the annular cavity 100 opposite to the third air port 63. The arrangement is more conducive to blowing air into the interior of the submersible vehicle and facilitating air circulation.

[0035] In one embodiment, the diffusion structure 31 is a uniformly arranged rib structure or a uniformly arranged column structure. The diffusion structure 31 is made of a thermally conductive material, not limited to materials with good thermal conductivity such as copper, aluminum and graphite.

[0036] In one implementation scheme, such as Figure 3 As shown, the solid dehumidification structure 41 is a multi-layered corrugated structure, which is made of thermally conductive and moisture-absorbing materials. During the fabrication of the corrugated structure, thermally conductive particles can be incorporated into the moisture-absorbing material to increase its thermal conductivity. The selection of solid moisture-absorbing materials is not limited to lithium chloride, silica gel, and zeolite molecular sieves, and the material of the thermally conductive particles within the solid moisture-absorbing material is not limited to materials with good thermal conductivity such as copper, aluminum, and graphite.

[0037] In one implementation scheme, such as Figure 1 As shown, in addition to the portions of the first semiconductor heater 30 and the second semiconductor heater 40 that are in contact with the inner surface of the outer casing 10, an insulation layer 70 is applied to the other inner surfaces of the outer casing 10 to reduce and slow down the heat exchange between the cabin air and the seawater, thereby improving the temperature retention effect.

[0038] In one implementation, the submarine's air conditioning system includes a cooling mode. For example... Figure 4 As shown, in the cooling mode, both the first air valve 51 and the second air valve 52 are closed; the first air vent 61 is open and the second air vent 62 is open; the first semiconductor heat exchanger 30 is working and the second semiconductor heat exchanger 40 is shut down; the side of the first semiconductor heat exchanger 30 connected to the diffusion structure 31 is the cooling surface, and the contact surface with the inner surface of the outer shell 10 is the heating surface; the first fan 71 is started, so that the airflow is drawn from the chamber space 200 into the annular cavity 100 through the second air vent 62, flows through the surface of the diffusion structure 31, and is discharged into the chamber space 200 through the first air vent 61.

[0039] In one implementation, the submarine's air conditioning system includes a dehumidification mode. For example... Figure 5 As shown, in dehumidification mode, both the first air valve 51 and the second air valve 52 are closed; the third air vent 63 and the fourth air vent 64 are open; the first semiconductor heater 30 is off; and the second semiconductor heater 40 is either off or operating. When the second semiconductor heater 40 is operating, the side connected to the solid dehumidification structure 41 is the cooling surface, and the surface in contact with the inner surface of the outer casing 10 is the heating surface. The second fan 72 is started, causing airflow to be drawn from the chamber space 200 into the annular cavity 100 through the fourth air vent 64, flowing over the surface of the solid dehumidification structure 41, and then discharged back into the chamber space 200 through the third air vent 63. The solid dehumidification structure 41, cooled by the second semiconductor heater 40, accelerates the condensation of moisture in the air, increasing the air dehumidification rate.

[0040] In one implementation, the submarine's air conditioning system includes a cooling and dehumidification mode. For example...Figure 6 As shown, in the cooling and dehumidification mode, the first air valve 51 is closed and the second air valve 52 is open; the first air outlet 61 is open, the second air outlet 62 is closed, the third air outlet 63 is open, and the fourth air outlet 64 is closed; the first semiconductor cooler 30 is working, and the side of the first semiconductor cooler 30 connected to the diffusion structure 31 is the cooling surface, and the contact surface with the inner surface of the outer shell 10 is the heating surface; the second semiconductor cooler 40 is either off or working. When it is working, the side of the second semiconductor cooler 40 connected to the solid dehumidification structure 41 is the cooling surface, and the contact surface with the inner surface of the outer shell 10 is the heating surface; the second fan 72 is started, so that the airflow is drawn from the chamber space 200 into the annular cavity 100 through the first air outlet 61, flows through the surface of the diffusion structure 31 and the surface of the solid dehumidification structure 41, and then is discharged into the chamber space 200 through the third air outlet 63.

[0041] It should be noted that when the first semiconductor cooler 30 in the cooling dehumidification mode is working, it only needs to bear the sensible heat load of the air. The surface temperature of its diffusion structure 31 does not need to be reduced to the air dew point temperature, thus keeping its power at a relatively low level. Similarly, the solid dehumidification structure 41 only bears the latent heat load of the air. Because the solid dehumidification structure 41 generates heat during the absorption of water vapor from the air, its ability to absorb water vapor decreases. If rapid dehumidification of the air is required, the second semiconductor cooler 40 is activated, making its contact surface with the solid dehumidification structure 41 a cooling surface. The second semiconductor cooler 40 cools the solid dehumidification structure 41, which can further improve the air dehumidification rate.

[0042] In one implementation, the submarine's air conditioning system includes a heating mode. For example... Figure 7 As shown, in the heating mode, both the first air valve 51 and the second air valve 52 are closed; the first air vent 61 is open and the second air vent 62 is open; the first semiconductor heater 30 is working and the second semiconductor heater 40 is off; the side of the first semiconductor heater 30 connected to the diffusion structure 31 is the heating surface, and the contact surface with the inner surface of the outer shell 10 is the cooling surface; the first fan 71 is started, so that the airflow is drawn from the chamber space 200 into the annular cavity 100 through the second air vent 62, flows through the surface of the diffusion structure 31, and is discharged into the chamber space 200 through the first air vent 61.

[0043] In one implementation, the submersible's air conditioning system uses a dehumidification and regeneration mode. For example... Figure 8As shown, in the dehumidification regeneration mode, the first air valve 51 is closed, and the second air valve 52 is opened; the first air port 61 is opened, the second air port 62 is closed, and the third air port 63 is opened; the fourth air port 64 is closed; the first semiconductor cold heat exchanger 30 works, and the side of the first semiconductor cold heat exchanger 30 connected with the diffusion structure 31 is the heating side, and the contact side with the inner surface of the shell 10 is the cooling side; the second semiconductor cold heat exchanger 40 works, and the side of the second semiconductor cold heat exchanger 40 connected with the solid dehumidification structure 41 is the heating side, and the contact side with the inner surface of the shell 10 is the cooling side; the second air fan 72 is started, so that the air flow is sucked into the annular cavity 100 from the cabin space 200 through the first air port 61, and then flows through the surfaces of the diffusion structure 31 and the solid dehumidification structure 41, and is discharged into the cabin space 200 through the third air port 63, and then is discharged to the outside through the hatch of the submarine, so as to reduce the moisture in the solid dehumidification structure 41, and restore the water absorption capacity of the solid dehumidification structure 41.

[0044] In conclusion, the submarine air conditioning system of the present application can at least realize five working modes of the cooling mode, the dehumidification mode, the cooling and dehumidification mode, the heating mode and the dehumidification regeneration mode, and better meets the environmental regulation requirements in the submarine.

[0045] The preferred embodiments of the present application have been described above, but the present application is not limited to the above, and various modifications and changes can be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A submersible air conditioning system, characterized by, The utility model relates to a submarine air conditioning system, which comprises: a shell (10); a inner shell (20) nested in the shell (10), forming an annular cavity (100) between the shell (10) and the inner shell (20), and the inner part of the inner shell (20) being a cabin space (200) of a submarine; a first semiconductor cooler (30) disposed in the annular cavity (100) and located on the right side, one side surface of the first semiconductor cooler (30) being attached to the inner wall of the shell (10), and the other side surface of the first semiconductor cooler (30) being connected with a diffusion structure (31) with uniform gaps; a second semiconductor cooler (40) disposed in the annular cavity (100) and located on the left side, one side surface of the second semiconductor cooler (40) being attached to the inner wall of the shell (10), and the other side surface of the second semiconductor cooler (40) being connected with a solid dehumidification structure (41); a wind valve assembly comprising a first wind valve (51) and a second wind valve (52), the first wind valve (51) being disposed on the upper side of the annular cavity (100) and between the first semiconductor cooler (30) and the second semiconductor cooler (40) for blocking or connecting the annular cavity (100), and the second wind valve (52) being disposed on the lower side of the annular cavity (100) and between the first semiconductor cooler (30) and the second semiconductor cooler (40) for closing or connecting the annular cavity (100); a air outlet assembly comprising a first air outlet (61), a second air outlet (62), a third air outlet (63), and a fourth air outlet (64), all the air outlets being opened on the inner shell (20) to connect the annular cavity (100) and the cabin space (200), and each air outlet being closable or openable, the first air outlet (61) being located between the first semiconductor cooler (30) and the first wind valve (51), the second air outlet (62) being located between the first semiconductor cooler (30) and the second wind valve (52), the third air outlet (63) being located between the second semiconductor cooler (40) and the first wind valve (51), and the fourth air outlet (64) being located between the second semiconductor cooler (40) and the second wind valve (52); a fan assembly comprising a first fan (71) and a second fan (72), the first fan (71) being disposed in the annular cavity (100) between the first air outlet (61) and the second air outlet (62), and the second fan (72) being disposed in the annular cavity (100) between the third air outlet (63) and the fourth air outlet (64).

2. The submersible air conditioning system of claim 1, wherein, The first fan (71) is disposed in the annular cavity (100) directly opposite the first air outlet (61), and the second fan (72) is disposed in the annular cavity (100) directly opposite the third air outlet (63).

3. The submersible air conditioning system of claim 1, wherein, The diffusion structure (31) is a uniformly arranged rib structure or a uniformly arranged column structure, and the diffusion structure (31) is made of a heat-conductive material.

4. The submersible air conditioning system of claim 1, wherein, The solid dehumidification structure (41) is a multi-layer wavy structure, and the wavy structure is made of a heat-conductive and moisture-absorbing material.

5. The submersible air conditioning system of claim 1, wherein, In addition to the portions of the first semiconductor cooler (30) and the second semiconductor cooler (40) that are in contact with the inner surface of the shell (10), a thermal insulation layer (70) is applied to other inner surfaces of the shell (10).

6. The submersible air conditioning system of any one of claims 1-5, wherein, The submarine air conditioning system comprises a cooling mode, in which the first air valve (51) and the second air valve (52) are both closed; The first air outlet (61) is open, and the second air outlet (62) is open; The first semiconductor cooler (30) is working, and the second semiconductor cooler (40) is stopped; The side of the first semiconductor cooler (30) connected with the diffusion structure (31) is a refrigeration side, and the side in contact with the inner surface of the shell (10) is a heating side; The first air fan (71) is started, so that air is sucked from the cabin space (200) into the annular cavity (100) through the second air outlet (62), flows through the surface of the diffusion structure (31), and is then discharged into the cabin space (200) through the first air outlet (61).

7. The submersible air conditioning system of any one of claims 1-5, wherein, The submarine air conditioning system comprises a dehumidification mode, in which the first air valve (51) and the second air valve (52) are both closed; The third air outlet (63) is open, the fourth air outlet (64) is open, the first semiconductor cooler (30) is stopped, and the second semiconductor cooler (40) is stopped or working; When the second semiconductor cooler (40) is working, the side of the second semiconductor cooler (40) connected with the solid dehumidification structure (41) is a refrigeration side, and the side in contact with the inner surface of the shell (10) is a heating side; The second air fan (72) is started, so that air is sucked from the cabin space (200) into the annular cavity (100) through the fourth air outlet (64), flows through the surface of the solid dehumidification structure (41), and is then discharged into the cabin space (200) through the third air outlet (63).

8. The submersible air conditioning system of any one of claims 1-5, wherein, The submarine air conditioning system comprises a cooling and dehumidification mode, in which the first air valve (51) is closed, and the second air valve (52) is open; The first air outlet (61) is open, the second air outlet (62) is closed, the third air outlet (63) is open, and the fourth air outlet (64) is closed; The first semiconductor cooler (30) is working, and the side of the first semiconductor cooler (30) connected with the diffusion structure (31) is a refrigeration side, and the side in contact with the inner surface of the shell (10) is a heating side; The second semiconductor cooler (40) is stopped or working, and when the second semiconductor cooler (40) is working, the side of the second semiconductor cooler (40) connected with the solid dehumidification structure (41) is a refrigeration side, and the side in contact with the inner surface of the shell (10) is a heating side; The second fan (72) is started, and air current is sucked from the cabin space (200) into the annular cavity (100) through the first air port (61), flows through the surface of the diffusion structure (31) and the surface of the solid dehumidification structure (41) in sequence, and is discharged into the cabin space (200) through the third air port (63).

9. The submersible air conditioning system of any one of claims 1-5, wherein, The submarine air conditioning system comprises a heating mode in which the first air valve (51) and the second air valve (52) are both closed; The first air port (61) is opened, and the second air port (62) is opened; The first semiconductor cooler-heater (30) is in operation, and the second semiconductor cooler-heater (40) is stopped; The first semiconductor cooler-heater (30) is connected with the diffusion structure (31) on one side as a heating surface, and is connected with the inner surface of the shell (10) on the other side as a cooling surface; The first fan (71) is started, and air current is sucked from the cabin space (200) into the annular cavity (100) through the second air port (62), and is discharged into the cabin space (200) through the first air port (61) after flowing through the surface of the diffusion structure (31).

10. The submersible air conditioning system of any one of claims 1-5, wherein, The submarine air conditioning system comprises a dehumidification and regeneration mode in which the first air valve (51) is closed, and the second air valve (52) is opened; The first air port (61) is opened, the second air port (62) is closed, the third air port (63) is opened, and the fourth air port (64) is closed; The first semiconductor cooler-heater (30) is in operation, and the first semiconductor cooler-heater (30) is connected with the diffusion structure (31) on one side as a heating surface, and is connected with the inner surface of the shell (10) on the other side as a cooling surface; The second semiconductor cooler-heater (40) is in operation, and the second semiconductor cooler-heater (40) is connected with the solid dehumidification structure (41) on one side as a heating surface, and is connected with the inner surface of the shell (10) on the other side as a cooling surface; The second fan (72) is started, and air current is sucked from the cabin space (200) into the annular cavity (100) through the first air port (61), flows through the surface of the diffusion structure (31) and the surface of the solid dehumidification structure (41) in sequence, and is discharged into the cabin space (200) through the third air port (63), and is then discharged to the outside through the hatch of the submarine.

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