Inductor component and mounting configuration of inductor component

Abstract

The present application relates to an inductor component and a mounting structure of an inductor component. The inductor component includes a substrate, a coil provided on the substrate and wound in a spiral shape along an axis, and first and second external electrodes provided on the substrate and electrically connected to the coil. The substrate includes a substrate having first and second main surfaces facing each other. The axis of the coil is arranged in parallel with the direction of the short dimension among the length, width, and height of the substrate. The coil includes a plurality of first coil wirings provided on the first main surface, a plurality of second coil wirings provided on the second main surface, a plurality of first through wirings penetrating the substrate from the first main surface to the second main surface and arranged along the axis, and a plurality of second through wirings penetrating the substrate from the first main surface to the second main surface, arranged on the opposite side of the first through wirings with respect to the axis, and arranged along the axis. The first coil wirings, the first through wirings, the second coil wirings, and the second through wirings are sequentially connected.

Description

TECHNICAL FIELD

[0001] The present application relates to an inductor component and a mounting structure of an inductor component. BACKGROUND

[0002] In the past, as an inductor component, there has been a technology described in Japanese Patent Application Publication No. 11-251146 (Patent Document 1). The inductor component has a base body having a length, a width, and a height; a coil provided inside the base body and wound along an axial direction; and a first external electrode and a second external electrode provided to the base body and electrically connected to the coil. The length of the base body is longer than the width and the height of the base body. The axis of the coil is arranged in parallel with the length direction of the base body.

[0003] Patent Document 1: Japanese Patent Application Publication No. 11-251146

[0004] However, in the above-described conventional inductor component, since the coil is wound along the length direction of the base body, the inner diameter of the coil is determined by the width and the height of the base body. Since the width and the height are shorter than the length, the inner diameter of the coil becomes small, and it is difficult to improve the efficiency of obtaining inductance. SUMMARY

[0005] Therefore, an object of the present application is to provide an inductor component and a mounting structure of an inductor component, which can increase the inner diameter of a coil and secure the number of turns of the coil, can improve the efficiency of obtaining inductance, and can secure the number of turns of the coil and the strength against thermal stress caused by a difference in linear expansion coefficient between the coil and a base body.

[0006] To solve the above problems, an inductor component according to one embodiment of the present disclosure includes a substrate having a length, a width, and a height; a coil disposed on the substrate and wound in a spiral shape along an axis; and a first external electrode and a second external electrode disposed on the substrate and electrically connected to the coil. The substrate includes a first main surface and a second main surface facing each other. The axis of the coil is arranged in parallel with a direction of a short dimension among the length, the width, and the height of the substrate. The coil includes a plurality of first coil wirings disposed on the first main surface, a plurality of second coil wirings disposed on the second main surface, a plurality of first through wirings arranged to penetrate the substrate from the first main surface to the second main surface and arranged in line along the axis, and a plurality of second through wirings arranged to penetrate the substrate from the first main surface to the second main surface and arranged in line along the axis on the opposite side of the first through wirings with respect to the axis. The first coil wirings, the first through wirings, the second coil wirings, and the second through wirings are sequentially connected to form at least a portion of the spiral shape. For two first through wirings adjacent in the axis direction, a radius of an equivalent circle diameter of an end surface of the first through wirings is r1, and a minimum distance between the end surfaces of the two first through wirings is g1, r1 / g1≤4 is satisfied on the first main surface. For two second through wirings adjacent in the axis direction, a radius of an equivalent circle diameter of an end surface of the second through wirings is r2, and a minimum distance between the end surfaces of the two second through wirings is g2, r2 / g2≤4 is satisfied on the first main surface.

[0007] Here, the short dimension refers to either of the two dimensions other than the longest dimension when the length, the width, and the height are all different, either of the two dimensions when the length, the width, and the height are the same and the two dimensions are shorter than the other dimension, the other dimension when the length, the width, and the height are the same and the two dimensions are longer than the other dimension, and any of the three dimensions when the length, the width, and the height are all the same.

[0008] In addition, the main surface of the substrate does not refer to an absolute one direction such as a direction vertically upward in a direction of gravity, but refers to a direction toward an outer side of the substrate with the main surface as a boundary, among an outer side and an inner side of the substrate. Therefore, "on the main surface" refers to a relative direction determined by the orientation of the main surface. In addition, "above" with respect to an element includes not only a position above the element, i.e., a position on the element on an upper side of other objects, a position on an upper side with a clearance, but also a position on directly above the element (on).

[0009] According to the above-described configuration, the axis of the coil is arranged in parallel with the direction of the short dimension among the length, width, and height of the base body, and thus the coil is wound in the direction of the short dimension of the base body. Therefore, the maximum value of the inner diameter of the coil can be extended to the long dimension among the length, width, and height of the base body, and the inner diameter of the coil can be increased. In addition, the coil includes the plurality of first coil wirings, the plurality of second coil wirings, the plurality of first through-wirings, and the plurality of second through-wirings, and thus the number of turns of the coil can be ensured. Therefore, the inner diameter of the coil can be increased and the number of turns of the coil can be ensured, and the efficiency of obtaining the inductance can be improved.

[0010] In addition, since r1 / g1≤4 is satisfied, the volume of the substrate between two first through-wirings adjacent in the axial direction can be ensured, and since r2 / g2≤4 is satisfied, the volume of the substrate between two second through-wirings adjacent in the axial direction can be ensured. Therefore, although there is a difference in linear expansion coefficient between the through-wirings and the substrate, and shear stress occurs in the substrate due to thermal stress, since the volume of the substrate between the through-wirings can be ensured, the shear stress can be reduced and the strength of the substrate can be ensured. Therefore, the number of through-wirings can be increased and the number of turns of the coil can be ensured, and the strength against thermal stress can be ensured. Furthermore, r1 / g1≤4 means that r1 is satisfied for either of the two first through-wirings adjacent in the axial direction. However, it is not necessary that r1 / g1≤4 be satisfied in all groups of two first through-wirings adjacent, but it is sufficient that r1 / g1≤4 be satisfied in at least one group of two first through-wirings adjacent. The same applies to r2 / g2≤4.

[0011] Preferably, in one embodiment of the inductor component, the base body includes an insulating layer that covers at least one of the first coil wirings on the first main surface and the second coil wirings on the second main surface.

[0012] According to the above-described embodiment, the coil wirings can be protected from solder and environmental stress at the time of mounting by the insulating layer. In addition, by improving the insulating property of the insulating layer compared to the substrate, eddy current can be suppressed and the Q value can be improved.

[0013] Preferably, in one embodiment of the inductor component, the first through-wirings and the second through-wirings extend in a direction orthogonal to the first main surface.

[0014] According to the above-described embodiment, since the length of the first through-wirings and the second through-wirings can be shortened, Rdc (direct current resistance) can be suppressed.

[0015] Preferably, in one embodiment of the inductor component, the axis of the coil is arranged in parallel with the direction of the shortest dimension among the length, width, and height of the base body.

[0016] According to the above-described embodiment, the coil inner diameter can be further increased, and the efficiency of obtaining inductance can be further improved.

[0017] Preferably, in one embodiment of the inductor component, in the above-described first main surface, a line connecting the centers of gravity of the end surfaces of the plurality of above-described first through-wiring is parallel to the above-described axis of the coil, and a line connecting the centers of gravity of the end surfaces of the plurality of above-described second through-wiring is parallel to the above-described axis of the coil.

[0018] According to the above-described embodiment, the coil inner diameter can be constantly increased in the axial direction, and the efficiency of obtaining inductance can be further improved.

[0019] Preferably, in one embodiment of the inductor component, the above-described first coil wiring extends in only one direction.

[0020] According to the above-described embodiment, the first coil wiring extends in only one direction, and thus, by using, for example, a deformation illumination in a photolithography process, a fine first coil wiring can be formed, and thus, the inductor component can be miniaturized.

[0021] Here, in the photolithography process, if a deformation illumination such as a ring illumination, a dipole illumination, or the like is used, the pattern resolution in a specific direction can be improved, and a finer pattern can be formed.

[0022] Preferably, in one embodiment of the inductor component, the above-described second coil wiring extends in only one direction.

[0023] According to the above-described embodiment, the second coil wiring extends in only one direction, and thus, by using, for example, a deformation illumination in a photolithography process, a fine second coil wiring can be formed, and thus, the inductor component can be miniaturized.

[0024] Preferably, in one embodiment of the inductor component, as viewed from a direction orthogonal to the above-described first main surface, a first end portion of the above-described first coil wiring overlaps a first end portion of the above-described second coil wiring, and an angle formed by the above-described first coil wiring and the above-described second coil wiring is 5 degrees or more and 45 degrees or less.

[0025] According to the above-described embodiment, the coil is tightly wound, and thus, the inductance can be improved.

[0026] Preferably, in one embodiment of the inductor component, at least one of the above-described first through-wiring and the above-described second through-wiring is composed of a plurality of conductive layers.

[0027] According to the above-described embodiment, the type of the conductive layer can be selected, and the through-wiring corresponding to the use can be formed.

[0028] Preferably, in one embodiment of the inductor component, the number of the first through-wiring is the same as the number of the second through-wiring, and the first through-wiring and the second through-wiring are line-symmetrical with respect to the axis of the coil as viewed from a direction orthogonal to the first main surface.

[0029] According to the above embodiment, in the case where the number of the first through-wiring and the number of the second through-wiring are the same, the size of the axis direction of the coil can be reduced compared to the case where they are asymmetrical with respect to the axis of the coil, and thus the inductor component can be downsized.

[0030] Preferably, in one embodiment of the inductor component, the difference between the number of the first through-wiring and the number of the second through-wiring is 1, and the first through-wiring and the second through-wiring are alternately arranged with respect to the axis along the axis direction of the coil as viewed from a direction orthogonal to the first main surface.

[0031] According to the above embodiment, in the case where the difference between the number of the first through-wiring and the number of the second through-wiring is 1, the size of the axis direction of the coil can be reduced compared to the case where they are line-symmetrical with respect to the axis of the coil, and thus the inductor component can be downsized.

[0032] Preferably, in one embodiment of the inductor component, the volume of the inductor component is 0.08 mm 3 Hereinafter, and the size of the long side of the inductor component is 0.65 mm or less.

[0033] Here, the size of the long side of the inductor component refers to the largest value among the length, the width, and the height of the inductor component.

[0034] According to the above embodiment, since the volume of the inductor component is small, and the long side of the inductor component is also small, the weight of the inductor component is light. Therefore, even if the external electrode is small, the required mounting strength can be obtained.

[0035] Preferably, in one embodiment of the inductor component, the length of the extension direction of the first through-wiring is 5 times or more with respect to the equivalent circle diameter of the end surface of the first through-wiring in the first main surface, and the length of the extension direction of the second through-wiring is 5 times or more with respect to the equivalent circle diameter of the end surface of the second through-wiring in the first main surface.

[0036] According to the above embodiment, the aspect ratio of the first through-wiring and the second through-wiring can be improved, and thus the inner diameter of the coil can be increased, and the inductance acquisition efficiency can be further improved.

[0037] Preferably, in one embodiment of the mounting structure of the inductor component, there are provided: a mounting substrate; and the inductor component mounted to a mounting surface of the mounting substrate, the axis of the coil being parallel with respect to the mounting surface.

[0038] According to the above embodiment, the axis of the coil is parallel with respect to the mounting surface, so the magnetic flux of the inductor component is not affected by the wiring portion of the mounting substrate, and the efficiency of obtaining inductance can be suppressed from decreasing.

[0039] Preferably, in one embodiment of the mounting structure of the inductor component, there are provided: a mounting substrate; and the inductor component mounted to a mounting surface of the mounting substrate, the axis of the coil being orthogonal with respect to the mounting surface.

[0040] According to the above embodiment, the axis of the coil is orthogonal with respect to the mounting surface, so the magnetic flux of the inductor component does not affect other inductor components adjacent to the inductor component, and the degree of freedom of mounting layout is improved.

[0041] Preferably, in one embodiment of the mounting structure of the inductor component, the mounting substrate has a wiring portion on the mounting surface, and the axis of the coil does not overlap with the wiring portion.

[0042] According to the above embodiment, the axis of the coil does not overlap with the wiring portion, so the magnetic flux of the inductor component can be suppressed from being hindered by the wiring portion, and the efficiency of obtaining inductance can be suppressed from decreasing.

[0043] Preferably, in one embodiment of the mounting structure of the inductor component, the inductor component is arranged on the mounting surface so that the direction of the shortest dimension among the length, width, and height of the base body is orthogonal with respect to the mounting surface.

[0044] According to the above embodiment, the direction of the shortest dimension among the length, width, and height of the base body becomes the thickness direction in the state of being arranged on the mounting surface, and the thickness of the inductor component can be made thin.

[0045] Preferably, in one embodiment of the mounting structure of the inductor component, the inductor component is arranged on the mounting surface so that the direction of the longest dimension among the length, width, and height of the base body is orthogonal with respect to the mounting surface.

[0046] According to the above embodiment, the direction of the shortest dimension among the length, width, and height of the base body determines the mounting surface of the inductor component, and the mounting area of the inductor component can be reduced.

[0047] According to the inductor component and the mounting structure of the inductor component according to one embodiment of the present disclosure, the inner diameter of the coil can be increased and the number of turns of the coil can be ensured, the efficiency of obtaining inductance can be improved, and in addition, the number of turns of the coil can be ensured and the strength against thermal stress caused by the difference in linear expansion coefficient between the coil and the base can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0048] Figure 1 is a schematic perspective view of the inductor component viewed from the bottom surface side.

[0049] Figure 2 is a schematic bottom view of the inductor component viewed from the bottom surface side.

[0050] Figure 3 is an A-A cross-sectional view of Figure 2

[0051] Figure 4A is a view of the first through-wiring viewed from the bottom surface side.

[0052] Figure 4B is a view of the second through-wiring viewed from the bottom surface side.

[0053] Figure 5 is a graph showing the relationship between r1 / g1 and the maximum value of the shear stress.

[0054] Figure 6 is an explanatory view that explains the state of the shear stress applied to the first through-wiring and the second through-wiring and the substrate.

[0055] Figure 7A is a schematic cross-sectional view that explains the manufacturing method of the inductor component.

[0056] Figure 7B is a schematic cross-sectional view that explains the manufacturing method of the inductor component.

[0057] Figure 7C is a schematic cross-sectional view that explains the manufacturing method of the inductor component.

[0058] Figure 7D is a schematic cross-sectional view that explains the manufacturing method of the inductor component.

[0059] Figure 7E is a schematic cross-sectional view that explains the manufacturing method of the inductor component.

[0060] Figure 7F is a schematic cross-sectional view that explains the manufacturing method of the inductor component.

[0061] Figure 7G is a schematic cross-sectional view that explains the manufacturing method of the inductor component. ​

[0062] Figure 8 is a schematic bottom view showing a modification example of the inductor component, viewed from the bottom surface side.

[0063] Figure 9 is a schematic view showing a mounting configuration of the inductor component.

[0064] Figure 10 is a schematic view showing a modification example of the mounting configuration of the inductor component.

[0065] Explanation of Reference Numerals

[0066] 1... inductor component; 5... mounting substrate; 10... base; 1 lb... bottom surface wiring (first coil wiring); 1 It... top surface wiring (second coil wiring); 13... first through wiring; 13b, 13t... end surface; 14... second through wiring; 14b, 14t... end surface; 21... substrate; 21b... bottom surface (first main surface); 21t... top surface (second main surface); 22... insulating layer; 50... mounting surface; 51... wiring portion; 100... outer surface; 100b... bottom surface; 100t... top surface; 100s1... first side surface; 100s2... second side surface; 100e1... first end surface; 100e2... second end surface; 110... coil; 121... first external electrode; 121b... first bottom surface portion; 121e... first end surface portion; 121e1... first portion; 121e2... second portion; 121e3... third portion; 122... second external electrode; 122b... second bottom surface portion; 122e... second end surface portion; 122e1... first portion; 122e2... second portion; 122e3... third portion; AX... axis; r1... radius of first through wiring; r2... radius of second through wiring; g1... minimum distance between first through wirings; g2... minimum distance between second through wirings; V... through hole; Θ... angle formed by bottom surface wiring and top surface wiring. DETAILED DESCRIPTION

[0067] Hereinafter, an inductor component and a mounting configuration of the inductor component as one embodiment of the present disclosure will be described in detail according to the illustrated embodiments. Furthermore, the drawings contain a part of the components that are schematic, and there are cases where actual dimensions, ratios are not reflected.

[0068] <First Embodiment>

[0069] Hereinafter, the inductor component 1 related to the first embodiment will be described. Figure 1 is a schematic perspective view of the inductor component 1, viewed from the bottom surface side. Figure 2 is a schematic bottom view of the inductor component 1, viewed from the bottom surface side. Figure 3 is a cross-sectional view of A-A of Figure 2 . Furthermore, inFigure 2 For convenience, the insulating layer of the substrate is omitted and depicted, and a portion of the external electrode (bottom surface) is depicted with a double-dotted line.

[0070] 1. Overview Structure

[0071] The general structure of inductor component 1 will be described. Inductor component 1 is, for example, a surface-mount type inductor component used in high-frequency signal transmission circuits. Figure 1 , Figure 2 as well as Figure 3 As shown, the inductor component 1 includes: a base 10; a coil 110 disposed on the base 10 and wound into a spiral shape along the axis AX; and a first external electrode 121 and a second external electrode 122 disposed on the base 10 and electrically connected to the coil 110. The axis AX of the coil 110 is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction orthogonal to the axis AX.

[0072] The substrate 10 has a length, a width, and a height. The substrate 10 has a first end face 100e1 and a second end face 100e2 located at both ends in the length direction, a first side face 100s1 and a second side face 100s2 located at both ends in the width direction, and a bottom surface 100b and a top surface 100t located at both ends in the height direction. That is, the outer surface 100 of the substrate 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, and the bottom surface 100b and the top surface 100t.

[0073] Furthermore, as shown in the attached figures, for ease of explanation, the length direction (long side direction) of the base 10, i.e., the direction from the first end face 100e1 to the second end face 100e2, is designated as the X direction. The width direction of the base 10, i.e., the direction from the first side face 100s1 to the second side face 100s2, is designated as the Y direction. The height direction of the base 10, i.e., the direction from the bottom face 100b to the top face 100t, is designated as the Z direction. The X, Y, and Z directions are orthogonal to each other and, when arranged in the order X, Y, Z, form a right-handed system.

[0074] In the present specification, the "outer surface 100 of the base" including the first end surface 100el, the second end surface 100e2, the first side surface 100sl, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the base 10 does not mean only the surface facing the outer peripheral side of the base 10, but also the surface that becomes the boundary between the outer side and the inner side of the base 10. In addition, the "upper side of the outer surface 100 of the base 10" is not an absolute one direction like the vertical upper side defined by the direction of gravity, but means the direction toward the outer side among the outer side and the inner side that are boundaries of the outer surface 100. Therefore, the "upper side of the outer surface 100" means the relative direction determined by the orientation of the outer surface 100. In addition, the "upper side (above)" with respect to a certain element includes not only the position above the element, that is, the position on the upper side of the element through other objects, the position on the upper side with a gap, but also the position on (on) the directly upper side of the element.

[0075] The base 10 includes a substrate 21 and an insulating layer 22 provided on the substrate 21. The substrate 21 has a bottom surface 21b and a top surface 21t that face each other in the Z direction. The insulating layer 22 is provided on the bottom surface 21b of the substrate 21. The bottom surface 21b corresponds to one example of the "first main surface" described in the technical solution, and the top surface 21t corresponds to one example of the "second main surface" described in the technical solution.

[0076] The axis AX of the coil 110 is arranged in parallel with the direction of the short dimension among the length, the width, and the height of the base 10. Here, in the base 10, the length (the dimension in the X direction), the height (the dimension in the Z direction), and the width (the dimension in the Y direction) are sequentially shortened. Since the length, the width, and the height are all different, the short dimension means either one of the two dimensions (the height and the width) other than the longest dimension (the length). In the present embodiment, the short dimension is the width, and the axis AX of the coil 110 is arranged in parallel with the width direction of the base 10.

[0077] The coil 110 includes a plurality of bottom surface wirings 11b provided on the bottom surface 21b and covered with the insulating layer 22, a plurality of top surface wirings 11t provided on the top surface 21t, a plurality of first through wirings 13 provided so as to penetrate the substrate 21 from the bottom surface 21b to the top surface 21t and arranged along the axis AX, and a plurality of second through wirings 14 provided so as to penetrate the substrate 21 from the bottom surface 21b to the top surface 21t, arranged on the opposite side to the first through wirings 13 with respect to the axis AX, and arranged along the axis AX.

[0078] The bottom surface wiring 11b corresponds to an example of the "first coil wiring" recited in the technical solution, and the top surface wiring 11t corresponds to an example of the "second coil wiring" recited in the technical solution. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are sequentially connected, thereby constituting at least a portion of a spiral shape.

[0079] The first external electrode 121 is provided on the bottom surface 100b and the first end surface 100el of the base 10. Specifically, a portion of the first external electrode 121 is provided above the bottom surface wiring 11b, and is provided on the insulating layer 22 in a manner separated from the bottom surface wiring 11b, and the other portion of the first external electrode 121 is embedded in the first end surface 100el in a manner exposed from the first end surface 100el.

[0080] The second external electrode 122 is provided on the bottom surface 100b and the second end surface 100e2 of the base 10. Specifically, a portion of the second external electrode 122 is provided above the bottom surface wiring 11b, and is provided on the insulating layer 22 in a manner separated from the bottom surface wiring 11b, and the other portion of the second external electrode 122 is embedded in the second end surface 100e2 in a manner exposed from the second end surface 100e2.

[0081] As shown in FIG. 1, the first through wiring 13 has a bottom surface side end surface 13b connected to the bottom surface wiring 11b, and a top surface side end surface 13t connected to the top surface wiring 11t. Similarly, the second through wiring 14 has a bottom surface side end surface 14b connected to the bottom surface wiring 11b, and a top surface side end surface 14t connected to the top surface wiring 11t. Figure 3

[0082] FIG. 2 is a view of the first through wiring 13 as viewed from the bottom surface 21b side. As shown in FIG. 2, for two first through wirings 13 adjacent in the axial AX direction (parallel to the Y direction), on the bottom surface 21b, when a radius of an equivalent circle diameter of the end surface 13b of the first through wiring 13 is set to r1, and a minimum distance between the end surfaces 13b of the two first through wirings 13 is set to g1, r1 / g1≤4 is satisfied. At this time, it is preferable that r1 / g1≤4 is satisfied in all of the first through wirings 13, but it is sufficient that r1 / g1≤4 is satisfied in at least one group of the two first through wirings 13 adjacent to each other. In all of the first through wirings 13, r1 / g1 is preferably the same, but can be different. Figure 4A Figure 4A FIG. 3 is a view of the second through wiring 14 as viewed from the bottom surface 21b side. As shown in FIG. 3, for two second through wirings 14 adjacent in the axial AX direction (parallel to the Y direction), on the bottom surface 21b, when a radius of an equivalent circle diameter of the end surface 14b of the second through wiring 14 is set to r2, and a minimum distance between the end surfaces 14b of the two second through wirings 14 is set to g2, r2 / g2≤4 is satisfied. At this time, it is preferable that r2 / g2≤4 is satisfied in all of the second through wirings 14, but it is sufficient that r2 / g2≤4 is satisfied in at least one group of the two second through wirings 14 adjacent to each other. In all of the second through wirings 14, r2 / g2 is preferably the same, but can be different.

[0083] Figure 4B Figure 4B ​​As shown, for two second through-wirings 14 adjacent in the axial direction AX, in the bottom surface 21, when a radius of an equivalent circle diameter of the end surface 14b of the second through-wiring 14 is set to r2, and a minimum distance between the end surfaces 14b of the two second through-wirings 14 is set to g2, r2 / g2≤4 is satisfied. At this time, it is preferable that r2 / g2≤4 be satisfied in all of the second through-wirings 14, but it is sufficient that r2 / g2≤4 be satisfied in at least one group of two second through-wirings 14 adjacent to each other. In all of the second through-wirings 14, r2 / g2 is preferably the same, but can be different.

[0084] According to the above structure, the axis of the coil 110 is arranged in parallel with the direction of the short dimension of the length, the width, and the height of the base 10, and thus the coil 110 is wound in the direction of the short dimension of the base 10. Therefore, the maximum value of the inner diameter of the coil 110 can be extended to the long dimension of the length, the width, and the height of the base 10, and thus the inner diameter of the coil 110 can be increased. In addition, the coil 110 includes the plurality of bottom surface wirings 11b, the plurality of top surface wirings 11t, the plurality of first through-wirings 13, and the plurality of second through-wirings 14, and thus the number of turns of the coil 110 can be ensured. Therefore, the inner diameter of the coil 110 can be increased and the number of turns of the coil 110 can be ensured, and the efficiency of obtaining the inductance can be improved.

[0085] In addition, since r1 / g1≤4 is satisfied, the volume of the substrate 21 between two first through-wirings 13 adjacent in the axial direction AX can be ensured, and since r2 / g2≤4 is satisfied, the volume of the substrate 21 between two second through-wirings 14 adjacent in the axial direction AX can be ensured. Therefore, although the first through-wirings 13 and the second through-wirings 14 differ in the linear expansion coefficient from the substrate 21, and shear stress occurs in the substrate 21 due to thermal stress, since the volume of the substrate 21 between adjacent first through-wirings 13 and the volume of the substrate 21 between adjacent second through-wirings 14 can be ensured, the shear stress can be reduced and the strength of the substrate 21 can be ensured. Therefore, the number of the first through-wirings 13 and the second through-wirings 14 can be increased and the number of turns of the coil 110 can be ensured, and the strength against thermal stress can be ensured.

[0086] Preferably, for two adjacent first through-wires 13 in the AX direction, on the top surface 21t, when the radius of the equivalent circle diameter of the end face 13t on the top surface side of the first through-wire 13 is set as r1, and the minimum distance between the end faces 13t on the top surface side of the two first through-wires 13 is set as g1, r1 / g1≤4 is satisfied. In this case, it is preferable that r1 / g1≤4 is satisfied in all first through-wires 13, but it is sufficient that r1 / g1≤4 is satisfied in at least one set of two adjacent first through-wires 13. Furthermore, r1 / g1 is preferably the same in all first through-wires 13, but it can also be different. Preferably, for two adjacent second through-wires 14 in the AX direction, on the top surface 21t, when the radius of the equivalent circle diameter of the end face 14t on the top surface side of the second through-wire 14 is set as r2, and the minimum distance between the end faces 14t on the top surface side of the two second through-wires 14 is set as g2, r2 / g2≤4 is satisfied. At this point, it is preferable that r2 / g2 ≤ 4 is satisfied in all the second through-wires 14, but it is sufficient as long as r2 / g2 ≤ 4 is satisfied in at least one set of two adjacent second through-wires 14. Furthermore, r2 / g2 is preferably the same in all the second through-wires 14, but it can also be different. Therefore, it is possible to increase the number of first through-wires 13 and second through-wires 14 to ensure the number of turns of the coil 110, and also to further ensure the strength against heat load.

[0087] 2. Structure of each part

[0088] (Inductor component 1)

[0089] The volume of inductor component 1 is 0.08 mm. 3 Furthermore, the length of the long side of the inductor component 1 is 0.65 mm or less. The length of the long side of the inductor component 1 refers to the maximum value among its length, width, and height; in this embodiment, it refers to the length in the X direction. Based on the above structure, the inductor component 1 has a small volume and a short long side, thus reducing its weight. Therefore, even with small external electrodes 121 and 122, the required mounting strength can be achieved.

[0090] Specifically, the dimensions (length (X direction) × width (Y direction) × height (Z direction)) of inductor component 1 are 0.6mm × 0.3mm × 0.3mm, 0.4mm × 0.2mm × 0.2mm, 0.25mm × 0.125mm × 0.120mm, etc. Alternatively, the width and height can be different, for example, 0.4mm × 0.2mm × 0.3mm, etc.

[0091] (Matrix 10)

[0092] The base 10 has a substrate 21 having a bottom surface 21b and a top surface 21t on both end sides in the Z direction, and an insulating layer 22 covering the bottom surface 21b of the substrate 21. In this way, the insulating layer 22 covers the bottom surface wiring 11b, and thus the bottom surface wiring 11b can be protected from solder and environmental stress during mounting by the insulating layer 22. Further, by improving the insulating property of the insulating layer 22 compared to the substrate 21, eddy current can be suppressed, and the Q value can be improved. Furthermore, the insulating layer 22 can be provided on each of the bottom surface 21b and the top surface 21t. That is, the insulating layer 22 need only cover at least one of the bottom surface wiring 11b and the top surface wiring 11t.

[0093] The material of the substrate 21 is preferably glass, whereby, since the insulating property of glass is high, eddy current can be suppressed, and the Q value can be improved. It is preferable that the substrate 21 contain Si element, whereby the thermal stability of the substrate 21 is high, and thus variation in the size of the base 10 and the like caused by heat can be suppressed, and the electrical characteristic deviation can be reduced.

[0094] The substrate 21 is preferably a single-layer glass plate. Thereby, the strength of the base 10 can be ensured. Further, in the case of a single-layer glass plate, the dielectric loss is small, and thus the Q value at high frequencies can be improved. Further, since there is no sintering process like a sintered body, deformation of the base 10 at the time of sintering can be suppressed, and thus pattern deviation can be suppressed, and an inductor component with a small inductance tolerance can be provided.

[0095] As the material of the single-layer glass plate, from the viewpoint of the manufacturing method, a glass plate having photosensitivity typified by "Foturan II" (registered trademark of Schott AG) is preferable. In particular, the single-layer glass plate preferably contains cerium oxide (cerium dioxide: CeO2), and in this case, the cerium oxide becomes a sensitizer, and processing using photolithography becomes easier.

[0096] However, since the single-layer glass plate can be processed by mechanical processing such as a drill, sandblasting, dry / wet etching processing using a photoresist, a metal mask, and the like, and laser processing, the single-layer glass plate can also be a glass plate that does not have photosensitivity. Further, the single-layer glass plate can be a glass plate sintered from a glass paste, or can be formed by a known method such as a float method.

[0097] The single-layer glass plate is a single-layer plate-like member in which an internal conductor or the like inside a glass body is integrated without introducing a wiring (a part of the coil 110). In particular, the single-layer glass plate has an outer surface that is a boundary between the outside and the inside of the glass body. The through hole V formed by the single-layer glass plate is also a boundary between the outside and the inside of the glass body, and thus is included in the outer surface 100 of the base 10.

[0098] The single-layer glass plate is substantially in an amorphous state, but can also have a crystalline portion. For example, in the case of Foturan II described above, the dielectric constant of the glass in the amorphous state is 6.4, and in contrast, by crystallizing it, the dielectric constant can be reduced to 5.8. Thus, the stray capacitance between the conductors (wires) in the vicinity of the crystalline portion can be reduced.

[0099] The insulating layer 22 is a member that has a function of protecting the wire from external force by covering the wire (bottom surface wire 11b) to prevent damage to the wire, and a function of improving the insulation of the wire. The insulating layer 22 is, for example, preferably an inorganic film such as silicon, hafnium oxide, nitride, or oxynitride, which is excellent in insulating properties and thin film formation. However, the insulating layer 22 can also be a resin film such as epoxy or polyimide, which is easier to form. In particular, the insulating layer 22 is preferably composed of a material with a low dielectric constant, whereby in the case where the insulating layer 22 is present between the coil 110 and the external electrodes 121, 122, the stray capacitance formed between the coil 110 and the external electrodes 121, 122 can be reduced.

[0100] The insulating layer 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Inc.), or by applying a paste-like resin and performing heat curing or the like.

[0101] The thickness of the insulating layer 22 is preferably 1 / 3 or less of the thickness of the substrate 21, and the dielectric constant of the insulating layer 22 is smaller than the dielectric constant of the substrate 21. The thickness refers to the maximum value of the size in the direction orthogonal to the bottom surface 21b. Thus, the thickness of the insulating layer 22 is made thin, and the inductor component 1 can be made small. In addition, even if the thickness of the insulating layer 22 is made thin, the distance between the first external electrode 121, the second external electrode 122, and the bottom surface wire 11b is made short, and since the dielectric constant of the insulating layer 22 is smaller than the dielectric constant of the substrate 21, the stray capacitance between the first external electrode 121, the second external electrode 122, and the bottom surface wire 11b can be reduced, and the Q value can be improved.

[0102] Further, the base body 10 can also include a sintered body, that is, the substrate 21 can also be a sintered body, and the strength of the base body 10 can be ensured. In addition, by using ferrite or the like for the sintered body, the efficiency of obtaining inductance can be improved.

[0103] The base body 10 can also further have an insulating film that covers a portion of the insulating layer 22 on the side of the bottom surface 21b. That is, the insulating film is at least positioned between the first external electrode 121 and the second external electrode 122 provided on the insulating layer 22, and the short circuit of the first external electrode 121 and the second external electrode 122 can be more reliably prevented. The material of the insulating film is, for example, the same material as the insulating layer 22.

[0104] (The coil 110)

[0105] The coil 110 includes: a bottom surface wiring 11b disposed above the bottom surface 21b of the substrate 21 and covered by an insulating layer 22; a top surface wiring 11t disposed above the top surface 21t of the substrate 21; and a pair of through wirings 13 and 14 extending through the substrate 21 to the bottom surface 21b and the top surface 21t, and disposed on opposite sides of each other relative to the axis AX. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are sequentially connected to form at least a portion of the coil 110 wound along the axis AX.

[0106] According to the above structure, the coil 110 is a so-called spiral-shaped coil 110. Therefore, in the cross section orthogonal to the axis AX, the area where the bottom surface wiring 11b, the top surface wiring 11t, and the through wirings 13 and 14 are parallel along the winding direction of the coil 110 can be reduced, and the stray capacitance in the coil 110 can be reduced.

[0107] Here, a spiral shape refers to a shape where the total number of turns of the coil is greater than one, but the number of turns of the coil in a cross-section orthogonal to the axis is less than one. Regarding the number of turns of the coil in a cross-section orthogonal to the axis, "more than one turn" means that in a cross-section orthogonal to the axis, the coil wiring has portions that are radially adjacent and parallel in the winding direction when viewed from the axial direction; "less than one turn" means that in a cross-section orthogonal to the axis, the coil wiring does not have portions that are radially adjacent and parallel in the winding direction when viewed from the axial direction. Furthermore, the parallel portions of the wiring include not only extensions extending along the winding direction of the wiring, but also pad portions connected to the ends of the extensions and having a width greater than the width of the extensions.

[0108] The axis AX of coil 110 is arranged parallel to the width direction, which is the shortest dimension among the length, width, and height of the base 10. This allows for a further increase in the inner diameter of coil 110, thereby further improving the efficiency of inductance.

[0109] Preferred options Figure 2 As shown, on the bottom surface 21b, the line (dotted line) connecting the centroids of the end faces 13b of the plurality of first through-wires 13 is parallel to the axis AX of the coil 110, and the line (dotted line) connecting the centroids of the end faces 14b of the plurality of second through-wires 14 is parallel to the axis AX of the coil 110. This allows the inner diameter of the coil to increase constantly along the axial direction, further improving the efficiency of inductance. More preferably, on the top surface 21t, the line connecting the centroids of the end faces 13t of the plurality of first through-wires 13 is parallel to the axis AX of the coil 110, and the line connecting the centroids of the end faces 14t of the plurality of second through-wires 14 is parallel to the axis AX of the coil 110.

[0110] The bottom surface wiring 11b extends in only one direction. Specifically, the bottom surface wiring 11b is slightly inclined toward the Y direction and extends in the X direction. A plurality of bottom surface wirings 11b are arranged along the Y direction and arranged in parallel with each other. Here, in the photolithography process, if a deformed illumination such as annular illumination, dipole illumination, or the like is used, the pattern resolution in a specific direction can be improved, and a finer pattern can be formed. According to the above structure, the bottom surface wiring 11b extends in only one direction, and thus by using, for example, deformed illumination in the photolithography process, a fine bottom surface wiring 11b can be formed, and the inductor component 1 can be downsized. Specifically, in the case where the bottom surface wiring 11b extends in only one direction, the lines between the bottom surface wirings 11b are in a direction orthogonal to the one direction, and thus by improving the pattern resolution in the orthogonal direction, the formation accuracy of the lines between the bottom surface wirings 11b can be improved compared to usual.

[0111] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t is a shape extending in the X direction. A plurality of top surface wirings 11t are arranged along the Y direction and arranged in parallel with each other. According to the above structure, the top surface wiring 11t extends in only one direction, and thus by using, for example, deformed illumination in the photolithography process, a fine top surface wiring 11t can be formed, and the inductor component 1 can be downsized.

[0112] The first through wiring 13 is arranged on the first end surface 100e1 side with respect to the axis AX inside the through hole V of the base 10, and the second through wiring 14 is arranged on the second end surface 100e2 side with respect to the axis AX inside the through hole V of the base 10. The first through wiring 13 and the second through wiring 14 respectively extend in a direction orthogonal to the bottom surface 21b and the top surface 21t (the bottom surface 100b and the top surface 100t). Thus, the length of the first through wiring 13 and the second through wiring 14 can be shortened, and thus the direct current resistance (Rdc) can be suppressed. A plurality of first through wirings 13 and a plurality of second through wirings 14 are respectively arranged along the Y direction and arranged in parallel with each other.

[0113] The bottom surface wiring 11b and the top surface wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy thereof. The bottom surface wiring 11b and the top surface wiring 11t can be a metal film formed by plating, vapor deposition, sputtering, or the like, or can be a metal sintered body obtained by applying a conductor paste and sintering. In addition, the bottom surface wiring 11b and the top surface wiring 11t can be a multilayer structure in which a plurality of metal layers are stacked. The thickness of the bottom surface wiring 11b and the top surface wiring 11t is preferably 5 μm or more and 50 μm or less.

[0114] The first through-wire 13 and the second through-wire 14 can be formed in the through-hole V pre-formed in the substrate 10 using the materials and manufacturing methods exemplified by the bottom surface wiring 11b and the top surface wiring 11t. Preferably, at least one of the first through-wire 13 and the second through-wire 14 is composed of multiple conductive layers. Thus, the type of conductive layer can be selected, and through-wires corresponding to the application can be formed. For example, through-wires 13 and 14 can be formed by combining conductive layers such as TiN or Ti, Ni, which have high barrier properties and closeness but low conductivity, with conductive layers such as Cu, Ag, which have high conductivity. In addition, through-wires 13 and 14 with low cost and low Rdc can be formed by filling the voids after isotropic conformal plating using a printing method with conductive paste containing Cu or Ag filler. Furthermore, in order to alleviate stress, voids can also exist in a portion of the through-wires 13 and 14.

[0115] Preferably, the bottom surface wiring 11b, the top surface wiring 11t, the first through wiring 13, and the second through wiring 14 are primarily composed of copper. Therefore, by using inexpensive and highly conductive copper as the wiring material, the mass production capability of the inductor component 1 can be improved, and the Q value can be increased.

[0116] Preferred options Figure 2 As shown, when viewed from a direction orthogonal to the bottom surface 21b, the first end of the bottom surface wiring 11b overlaps with the first end of the top surface wiring 11t, and the angle θ between the bottom surface wiring 11b and the top surface wiring 11t is greater than 5 degrees and less than 45 degrees. Angle θ refers to the angle between the center line (dotted line) of the width of the bottom surface wiring 11b and the center line (dotted line) of the width of the top surface wiring 11t when viewed from a direction orthogonal to the bottom surface 21b.

[0117] According to the above structure, when the angle θ is 45 degrees or less, the coil 110 is tightly wound, thus increasing the inductance. Furthermore, when the angle θ is 5 degrees or more, it ensures proper spacing between adjacent bottom surface wirings 11b, adjacent top surface wirings 11t, adjacent first through wirings 13, or adjacent second through wirings 14, reducing the occurrence of short circuits. Moreover, it is acceptable for the angle θ to be 5 degrees or more and 45 degrees or less in at least one group of bottom surface wirings 11b and top surface wirings 11t; preferably, the angle θ to be 5 degrees or more and 45 degrees or less in all groups of bottom surface wirings 11b and top surface wirings 11t.

[0118] Preferred options Figure 2 As shown, the number of first through-wires 13 is the same as the number of second through-wires 14. When viewed from a direction orthogonal to the bottom surface 21b, the first through-wires 13 and the second through-wires 14 are linearly symmetrical with respect to the axis AX of the coil 110. In this embodiment, the number of first through-wires 13 and the number of second through-wires 14 are four each.

[0119] According to the above structure, in the case where the number of the first through-wiring 13 and the second through-wiring 14 is the same, compared with the case where they are asymmetric with respect to the axis AX of the coil 110, the size in the axis AX direction of the coil 110 can be reduced, and the inductor component 1 can be miniaturized.

[0120] Preferably, as shown in Figure 3 the length L in the extension direction of the first through-wiring 13 is 5 times or more the equivalent circle diameter R of the end surface 13b of the first through-wiring 13 in the bottom surface 21b. Similarly, the length L in the extension direction of the second through-wiring 14 is 5 times or more the equivalent circle diameter R of the end surface 14b of the second through-wiring 14 in the bottom surface 21b. Thereby, the aspect ratio of the first through-wiring 13 and the second through-wiring 14 can be improved, and thus the inner diameter of the coil 110 can be increased, and the inductance acquisition efficiency can be further improved. Further, it is further preferable that the length L in the extension direction of the first through-wiring 13 be 5 times or more the equivalent circle diameter R of the end surface 13t of the first through-wiring 13 in the top surface 21t. Similarly, it is further preferable that the length L in the extension direction of the second through-wiring 14 be 5 times or more the equivalent circle diameter R of the end surface 14t of the second through-wiring 14 in the top surface 21t.

[0121] (First external electrode 121 and second external electrode 122)

[0122] The first external electrode 121 is provided on the first end surface 100e1 side with respect to the center of the X direction of the base 10 in a manner so as to be exposed from the outer surface 100 of the base 10. The second external electrode 122 is provided on the second end surface 100e2 side with respect to the center of the X direction of the base 10 in a manner so as to be exposed from the outer surface 100 of the base 10.

[0123] The first external electrode 121 is connected to the first end of the coil 110, and the second external electrode 122 is connected to the second end of the coil 110. The first external electrode 121 and the second external electrode 122 can each be composed of a single layer of a conductive material, or can be composed of a plurality of layers of a conductive material. In the case of a single layer of a conductive material, for example, the same material as the coil 110 is used, and in the case of a plurality of layers of a conductive material, for example, a base layer of the same material as the coil 110 and a plating layer covering the base layer are used.

[0124] The first external electrode 121 is provided continuously with the first end surface 100e1 and the bottom surface 100b. According to the above structure, the first external electrode 121 is a so-called L-shaped electrode, and thus when the inductor component 1 is mounted to a mounting substrate, a solder tail can be formed in the first external electrode 121. Thereby, the mounting strength of the inductor component 1 can be improved, and in addition, the mounting posture of the inductor component 1 can be further stabilized.

[0125] The first external electrode 121 has a first end surface portion 121e provided to the first end surface 100e1, and a first bottom surface portion 121b provided to the bottom surface 100b. The first end surface portion 121e is connected to the first bottom surface portion 121b. The first end surface portion 121e is embedded in the first end surface 100e1 in a manner to protrude from the first end surface 100e1. The first bottom surface portion 121b is arranged on the bottom surface 100b in a manner to protrude from the bottom surface 100b. The first end surface portion 121e is connected to the first through-wiring 13 of the coil 110.

[0126] The first end surface portion 121e has a first portion 121e1, a second portion 121e2, and a third portion 121e3 connected in this order in the Z direction. The first portion 121e1 is connected to the first bottom surface portion 121b at the bottom surface 100b. The second portion 121e2 is connected to the first through-wiring 13 within the base body 10. The third portion 121e3 protrudes from the substrate 21.

[0127] The second external electrode 122 is continuously provided to the second end surface 100e2 and the bottom surface 100b. According to the above-described structure, the second external electrode 122 is a so-called L-shaped electrode, and thus a solder tail can be formed in the second external electrode 122 when the inductor component 1 is mounted to a mounting substrate. Thus, the mounting strength of the inductor component 1 can be improved, and in addition, the mounting posture of the inductor component 1 can be more stabilized.

[0128] The second external electrode 122 has a second end surface portion 122e provided to the second end surface 100e2, and a second bottom surface portion 122b provided to the bottom surface 100b. The second end surface portion 122e is connected to the second bottom surface portion 122b. The second end surface portion 122e is connected to the second through-wiring 14 of the coil 110. The second end surface portion 122e is embedded in the second end surface 100e2 in a manner to protrude from the second end surface 100e2. The second bottom surface portion 122b is arranged on the bottom surface 100b in a manner to protrude from the bottom surface 100b.

[0129] The second end surface portion 122e has a first portion 122e1, a second portion 122e2, and a third portion 122e3 connected in this order in the Z direction. The first portion 122e1 is connected to the second bottom surface portion 122b at the bottom surface 100b. The second portion 122e2 is connected to the second through-wiring 14 within the base body 10. The third portion 122e3 protrudes from the substrate 21.

[0130] (r1 / g1 and r2 / g2 and shear stress)

[0131] In two first through-wiring 13 adjacent in the axis AX direction, from the direction orthogonal to the bottom surface 21b, when a radius of an equivalent circle diameter of the end surface 13b of the first through-wiring 13, that is, a value of 1 / 2 of the equivalent circle diameter is set to r1, and a minimum distance between the end surfaces 13b of the two first through-wirings 13 is set to g1, a relationship of r1 / g1 and a maximum value of the shear stress is explained.

[0132] Figure 5 is a graph showing the relationship of r1 / g1 and the maximum value of the shear stress. The material of the substrate 21 is a glass substrate, and the material of the first through-wiring 13 is copper. The linear expansion coefficient of the glass substrate is 5.5 x 10 －7 [1 / deg.], and the linear expansion coefficient of copper is 1.65 x 10 －5 [1 / deg.]. The maximum value of the shear stress applied to the substrate 21 and the first through-wiring 13 is found by increasing the temperature by 250°C. The maximum value of the shear stress is found as a relative value with the shear stress when r1 / g1 = 1 being 1. In all of the first through-wirings 13, r1 is made the same, and g1 is made the same.

[0133] As shown in Figure 5 , as r1 / g1 is less than 4, the maximum value of the shear stress decreases approximately linearly. On the other hand, when r1 / g1 is greater than 4, the maximum value of the shear stress is approximately constant. The same is true for the second through-wiring 14, as r2 / g2 is less than 4, the maximum value of the shear stress decreases approximately linearly, and when r2 / g2 is greater than 4, the maximum value of the shear stress is approximately constant.

[0134] Figure 6 is an explanatory diagram showing the state of the shear stress applied to the first through-wiring 13 and the second through-wiring 14 and the substrate 21. The magnitude of the shear stress is shown by the depth of the hatching, and the greater the shear stress, the greater the density of the lines of the hatching.

[0135] As shown in Figure 6 , in the substrate 21 between two first through-wirings 13 adjacent in the axis AX direction, the shear stress is the greatest. It is considered that this is because the portion between the adjacent first through-wirings 13 in the substrate 21 is smaller in volume as a continuous portion of the substrate 21 than other portions in the substrate 21, and thus the shear stress is the greatest in the portion between the adjacent first through-wirings 13 in the substrate 21. Similarly, in the substrate 21 between two second through-wirings 14 adjacent in the axis AX direction, the shear stress is the greatest.

[0136] As described above, by satisfying r1 / g1 < 4, the volume of the substrate 21 between two first through-wiring 13 adjacent in the axis AX direction in which the shear stress becomes large can be ensured, and by satisfying r2 / g2 < 4, the volume of the substrate 21 between two second through-wiring 14 adjacent in the axis AX direction in which the shear stress becomes large can be ensured. In this way, the volume of the substrate 21 between the adjacent first through-wiring 13 and the volume of the substrate 21 between the adjacent second through-wiring 14 can be ensured, and thus the shear stress can be effectively reduced and the strength of the substrate 21 can be ensured. Therefore, the number of the first through-wiring 13 and the second through-wiring 14 can be increased and the number of turns of the coil 110 can be ensured, and the strength against the thermal stress can be ensured.

[0137] Here, if the number of the through-wiring is increased only to increase the number of turns of the coil, the strength of the substrate decreases. In particular, a hole is provided in the substrate to form the through-wiring in the manufacturing process, but if the number of the through-wiring is too large, the volume of the substrate between the through-wirings becomes small. Therefore, due to the difference in the linear expansion coefficient between the through-wiring and the substrate, a crack occurs in the substrate between the through-wirings due to the thermal stress, and thus there is a concern that the adjacent through-wirings short-circuit.

[0138] Therefore, in the present embodiment, as described above, it is found that the shear stress applied to the substrate due to the thermal stress becomes the maximum in the substrate between the through-wirings, and the maximum of the shear stress decreases approximately linearly as r1 / g1 and r2 / g2 are less than 4, and by making r1 / g1 and r2 / g2 be 4 or less, the strength of the substrate can be ensured. On the other hand, it is found that the maximum of the shear stress is almost saturated when r1 / g1 and r2 / g2 are greater than 4, and at this time, the strength of the substrate between the through-wirings becomes very fragile.

[0139] It is preferable to satisfy r1 / g1 > 0.5 and satisfy r2 / g2 > 0.5. Thereby, by reducing the leakage magnetic flux passing between the first through-wirings 13 and between the second through-wirings 14 and reducing the length of the coil (the length of the coil 110 in the axis AX direction), the Q value is improved. In other words, by satisfying r1 / g1 > 0.5, that is, 2r1 > g1, the upper limit of the minimum distance g1 between the first through-wirings 13 is determined in accordance with the equivalent circle diameter 2r1 of the end surface of the first through-wiring 13, and thus the unnecessary gap in the axis AX direction of the coil 110 can be eliminated. The same applies to r2 / g2 > 0.5. It is preferable that g1 and g2 be 40 μm or more, and more preferably 60 μm or more.

[0140] (Method of manufacturing the inductor component 1)

[0141] Next, the method of manufacturing the inductor component 1 will be described. Figures 7A to 7G The method of manufacturing the inductor component 1 will be described. Figures 7A to 7G is the same as Figure 2The diagram corresponding to section AA.

[0142] like Figure 7A As shown, a glass substrate 1021 is prepared to become substrate 21. The glass substrate 1021 is a single-layer glass plate. Multiple through holes V are provided at predetermined positions on the glass substrate 1021. At this time, the glass substrate 1021 is opened by laser processing, or it can be opened by dry or wet etching, or by mechanical processing such as drilling.

[0143] like Figure 7B As shown, a seed layer (not shown) is formed on the entire surface of the glass substrate 1021. A copper layer is formed on the seed layer by electroplating. The seed layer and copper layer on the entire surface of the glass substrate 1021, except inside the through-hole V, are removed by wet etching or dry etching. As a result, a through conductor layer 1013, which becomes the first through wiring 13, is formed inside the through-hole V of the glass substrate 1021. At the same time, although not shown, a through conductor layer, which becomes the second through wiring 14, is also formed inside the through-hole V. In addition, a third base layer is formed as the base of the third portion 121e3 of the first end face portion 121e, and a third base layer is formed as the base of the third portion 122e3 of the second end face portion 122e.

[0144] like Figure 7C As shown, a seed layer (not shown) is formed on the entire surface of the glass substrate 1021, and a patterned photoresist is formed on the seed layer. Next, a copper layer is formed on the seed layer at the opening of the photoresist by electroplating. Then, the photoresist and the seed layer are removed by wet etching or dry etching. As a result, a bottom conductor layer 1011b, patterned into an arbitrary shape, is formed, which becomes the bottom surface wiring 11b, and a top surface conductor layer 1011t, which becomes the top surface wiring 11t. At this time, although not shown, a second base layer is formed, which becomes the base of the second portion 121e2 of the first end face portion 121e, and a second base layer is formed, which becomes the base of the second portion 122e2 of the second end face portion 122e.

[0145] In addition, Figure 7B Alternatively, the bottom conductor layer 1011b and the top conductor layer 1011t can be formed without removing the copper layer. In this case, the upper surface of the bottom conductor layer 1011b and the top conductor layer 1011t corresponding to the through hole V becomes concave.

[0146] like Figure 7D As shown, an insulating resin layer 1022, which serves as an insulating layer 22, is applied to a glass substrate 1021 and cured to cover the bottom conductor layer 1011b.

[0147] like Figure 7EAs shown, a seed layer not shown is provided on the insulating resin layer 1022, and a patterned photoresist 1023 is formed on the seed layer. Next, a copper layer is formed on the seed layer in the opening of the photoresist 1023 by electroplating. Then, as shown Figure 7F As shown, the photoresist and the seed layer are removed by wet etching or dry etching. Thus, a first bottom base layer 1121b, which becomes the base of the first bottom surface portion 121b and is patterned into an arbitrary shape, is formed. At this time, although not shown, a second bottom base layer, which becomes the base of the second bottom surface portion 122b, is formed. In addition, a first base layer, which becomes the base of the first portion 121e1 of the first end surface portion 121e, is formed, and a first base layer, which becomes the base of the first portion 122e1 of the second end surface portion 122e, is formed.

[0148] As shown Figure 7G As shown, the photoresist and the seed layer are removed by wet etching or dry etching. Thus, a first bottom base layer 1121b, which becomes the base of the first bottom surface portion 121b and is patterned into an arbitrary shape, is formed. At this time, although not shown, a second bottom base layer, which becomes the base of the second bottom surface portion 122b, is formed. In addition, a first base layer, which becomes the base of the first portion 121e1 of the first end surface portion 121e, is formed, and a first base layer, which becomes the base of the first portion 122e1 of the second end surface portion 122e, is formed.

[0149] The plating layer is composed of, for example, two layers of Ni / Sn. In addition, the plating layer can also be composed of, for example, multiple layers of Cu / Ni / Au, Cu / Ni / Pd / Au, or the like. In addition, as the external electrode, the plating layer can not be provided and only the base layer can be provided, as long as a suitable optimum material is selected from the viewpoint of rust prevention or solder wettability, electromigration resistance, or the like.

[0150] In addition, in the above manufacturing method, the copper layer is removed by wet etching or dry etching, but CMP processing or mechanical processing can also be used in the removal of the copper layer. In addition, when the through conductor layer, which becomes the through wiring, is formed in the through hole V, the entire through conductor layer is formed by plating, but the through conductor layer can also be formed by plating in part and then filling the gap portion with a conductive resin.

[0151] In addition, in the above manufacturing method, a glass substrate is used as the base, but a sintered material can also be used as the base. In this case, the inductor wiring of one turn or less is formed by printing using a conductive paste. Here, as the conductive paste, a material having a good conductivity, such as Ag, Cu, or the like, is selected.

[0152] Next, an insulating paste, such as glass, ferrite, or the like, is printed, and this operation is repeated. By forming an opening in the above insulating paste, which opens the connection portion to the inductor wiring, and filling the opening with a conductive paste, the connection portions of the inductor wiring between the layers can be electrically connected.

[0153] Then, after sintering the insulating paste by heat treatment at a high temperature, the insulator is divided, external terminals are formed, and the inductor component is manufactured. If the insulating paste uses a material with high insulation such as glass, an inductor component with a high Q can be obtained even at a high frequency. If the insulating paste uses ferrite, an inductor component with a high inductance can be obtained.

[0154] 3. Modification

[0155] Figure 8 is a schematic bottom view of a modification of the inductor component, viewed from the bottom surface 100b (bottom surface 21b) side.

[0156] As shown in Figure 8 , the number of the first through-wiring 13 is one more than the number of the second through-wiring 14, and the first through-wiring 13 and the second through-wiring 14 are alternately arranged with respect to the axis AX of the coil 110 in a direction orthogonal to the bottom surface 21b. In this embodiment, the number of the first through-wiring 13 is four, and the number of the second through-wiring 14 is three.

[0157] In other words, with respect to the position in the axis AX direction, the second through-wiring 14 is positioned between adjacent first through-wirings 13, and the first through-wiring 13 is positioned between adjacent second through-wirings 14. That is, the first through-wiring 13 and the second through-wiring 14 are alternately arranged in the axis AX direction.

[0158] According to the above structure, in the case where the number of the first through-wiring 13 is one more than the number of the second through-wiring 14, the size of the axis AX of the coil 110 can be reduced compared to the case where they are line-symmetric with respect to the axis AX of the coil 110, and the inductor component 1 can be downsized.

[0159] <Second Embodiment>

[0160] Figure 9 is a schematic view of a mounting structure of an inductor component. As shown in Figure 9 , the mounting structure of the inductor component has the mounting substrate 5 and the inductor component 1 of the above first embodiment mounted on the mounting surface 50 of the mounting substrate 5. The mounting substrate 5 has a wiring portion 51 on the mounting surface 50. The wiring portion 51 is a wiring of a conductor such as a printed circuit wiring, and also includes a ground pattern that is electrically and physically connected to a mounting component such as an inductor component. The axis AX of the coil 110 is parallel to the mounting surface 50. Further, although not clearly described in Figure 9 , the surface of the portion of the mounting substrate 5 that does not have the wiring portion 51 can be subjected to insulation treatment using a solder resist or the like.

[0161] According to the above structure, the axis AX of the coil 110 is parallel with respect to the mounting surface 50, and thus the magnetic flux of the inductor component 1 is not affected by the wiring portion 51 of the mounting substrate 5, and the decrease in the efficiency of the inductance can be suppressed.

[0162] Figure 10 is a schematic view showing a modification example of the mounting structure of the inductor component. As shown in Figure 10 , the mounting structure of the inductor component has the mounting substrate 5 and the inductor component 1 of the above-described first embodiment mounted to the mounting surface 50 of the mounting substrate 5. The axis AX of the coil 110 is orthogonal with respect to the mounting surface 50.

[0163] According to the above structure, the axis AX of the coil 110 is orthogonal with respect to the mounting surface 50, and thus the magnetic flux of the inductor component 1 does not affect other inductor components 1 adjacent to the inductor component 1, and the degree of freedom of the mounting layout is improved.

[0164] It is preferable that the axis AX of the coil 110 does not overlap the wiring portion 51. Thereby, the magnetic flux of the inductor component 1 can be suppressed from being hindered by the wiring portion 51, and the decrease in the efficiency of the inductance can be suppressed.

[0165] Further, in Figure 9 and Figure 10 , the inductor component can also be arranged on the mounting surface so that the direction of the shortest dimension among the length, the width, and the height of the base body is orthogonal with respect to the mounting surface. Thereby, the direction of the shortest dimension among the length, the width, and the height of the base body becomes the thickness direction in the state of being arranged on the mounting surface, and the thickness of the inductor component can be made thin.

[0166] In addition, in Figure 9 and Figure 10 , the inductor component can also be arranged on the mounting surface so that the direction of the longest dimension among the length, the width, and the height of the base body is orthogonal with respect to the mounting surface. Thereby, the direction of the shortest dimension among the length, the width, and the height of the base body determines the mounting surface of the inductor component, and the mounting area of the inductor component can be reduced.

[0167] Further, the present disclosure is not limited to the above-described embodiments, and design changes can be made within the scope of the gist of the present disclosure. For example, the characteristic points of the first embodiment and the second embodiment can be variously combined.

Claims

1. An inductor component, wherein, Possessing: a base body having a length, a width, and a height; a coil provided to the base body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode provided to the base body and electrically connected to the coil, the base body includes a substrate having a first main surface and a second main surface facing each other, the axis of the coil is arranged in parallel with a direction of a short dimension among the length, the width, and the height of the base body, the coil includes: a plurality of first coil wirings provided on the first main surface; a plurality of second coil wirings provided on the second main surface; a plurality of first through-wirings arranged so as to penetrate the substrate from the first main surface to the second main surface and aligned along the axis; and a plurality of second through-wirings arranged so as to penetrate the substrate from the first main surface to the second main surface and arranged on the opposite side of the first through-wirings with respect to the axis and aligned along the axis, the first coil wirings, the first through-wirings, the second coil wirings, and the second through-wirings are sequentially connected, thereby constituting at least a part of the spiral shape, for two first through-wirings adjacent in the axis direction, on the first main surface, when a radius of an equivalent circle diameter of an end surface of the first through-wiring is set as r1 and a minimum distance between end surfaces of the two first through-wirings is set as g1, r1 / g1≤4 is satisfied, for two second through-wirings adjacent in the axis direction, on the first main surface, when a radius of an equivalent circle diameter of an end surface of the second through-wiring is set as r2 and a minimum distance between end surfaces of the two second through-wirings is set as g2, r2 / g2≤4 is satisfied.

2. The inductor component according to claim 1, wherein the base body includes an insulating layer covering at least one of the first coil wirings on the first main surface and the second coil wirings on the second main surface.

3. The inductor component according to claim 1 or 2, wherein the first through-wirings and the second through-wirings extend in a direction orthogonal to the first main surface.

4. The inductor component according to claim 1 or 2, wherein the axis of the coil is arranged in parallel with a direction of a shortest dimension among the length, the width, and the height of the base body.

5. The inductor component according to claim 1 or 2, wherein on the first main surface, a line connecting centers of gravity of end surfaces of a plurality of the first through-wirings is parallel to the axis of the coil, and a line connecting centers of gravity of end surfaces of a plurality of the second through-wirings is parallel to the axis of the coil.

6. The inductor component according to claim 1 or 2, wherein the first coil wirings extend in only one direction.

7. The inductor component according to claim 1 or 2, wherein the second coil wirings extend in only one direction.

8. The inductor component according to claim 1 or 2, wherein The first end portion of the first coil wiring overlaps the first end portion of the second coil wiring as viewed in a direction orthogonal to the first main surface, and an angle formed by the first coil wiring and the second coil wiring is 5 degrees or more and 45 degrees or less.

9. The inductor component according to claim 1 or 2, wherein At least one of the first through wiring and the second through wiring is composed of a plurality of conductive layers.

10. The inductor component according to claim 1 or 2, wherein The number of the first through wirings is the same as the number of the second through wirings, The first through wiring and the second through wiring are line-symmetric with respect to the axis of the coil as viewed in a direction orthogonal to the first main surface.

11. The inductor component according to claim 1 or 2, wherein The difference between the number of the first through wirings and the number of the second through wirings is 1, The first through wiring and the second through wiring are alternately arranged with respect to the axis along the axis of the coil as viewed in a direction orthogonal to the first main surface.

12. The inductor component according to claim 1 or 2, wherein The volume of the inductor component is 0.08mm 3 Hereinafter, and the size of the long side of the inductor component is 0.65mm or less.

13. The inductor component according to claim 1 or 2, wherein The length of the extension direction of the first through wiring is 5 times or more with respect to the equivalent circle diameter of the end surface of the first through wiring in the first main surface, The length of the extension direction of the second through wiring is 5 times or more with respect to the equivalent circle diameter of the end surface of the second through wiring in the first main surface.

14. An inductor component mounting configuration wherein, Possessing: a mounting substrate; and The inductor component according to any one of claims 1 to 13 is mounted to a mounting surface of the mounting substrate, The axis of the coil is parallel with respect to the mounting surface.

15. An inductor component mounting configuration wherein, Possessing: a mounting substrate; and The inductor component according to any one of claims 1 to 13 is mounted to a mounting surface of the mounting substrate, The axis of the coil is orthogonal with respect to the mounting surface.

16. The mounting configuration of the inductor component according to claim 15, wherein The mounting substrate has a wiring portion in the mounting surface, The axis of the coil does not overlap the wiring portion.

17. The mounting configuration of the inductor component according to any one of claims 14 to 16, wherein The inductor component is arranged on the mounting surface so that the direction of the shortest dimension among the length, the width, and the height of the base body is orthogonal with respect to the mounting surface.

18. The mounting configuration of the inductor component according to any one of claims 14 to 16, wherein The inductor component is arranged on the mounting surface so that the direction of the longest dimension among the length, the width, and the height of the base body is orthogonal with respect to the mounting surface.

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