A finished semiconductor measurement device and its measurement method

Abstract

The present invention discloses a finished semiconductor measuring device and a measuring method thereof, belonging to the technical field of semiconductor measuring devices. The device comprises a measuring mechanism, a calibration mechanism, a conveying mechanism and a storage mechanism. The measuring mechanism comprises a lower frame, the rear end of the lower frame is rotatably connected to an upper frame and a No. 1 electric telescopic rod. The No. 2 electric telescopic rod is contracted to drive the folding frame and then drive the hollow cylinder to move toward the center plate. At this time, the end drives the driving end and the slider to slide along the slide groove, and the extension rod contracts with the movement of the end. While the driving end moves, it drives a group of driving ends on the side to move through the linkage frame, and finally realizes the synchronous movement function of the hollow cylinder. The semiconductor product is pushed to the center position of the center plate through the hollow cylinder. While fixing the semiconductor product, the inductive contact can perform power-on measurement on the semiconductor product. The arc frame is driven by the extension of the No. 1 electric telescopic rod, so that the upper frame is closed, ensuring the optical measurement effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor measuring devices, and in particular relates to a finished semiconductor measuring device. Background Art

[0002] A semiconductor measuring device is a specialized device that measures the usability and various parameters of finished semiconductor products through inductive or optical measurement. However, due to the lack of corresponding light-shielding and position calibration structures in traditional semiconductor measuring devices, errors in the placement of finished semiconductor products or the penetration of external light sources during the inductive or optical measurement process can affect the accuracy of measurement results, necessitating improvements.

[0003] In view of this, the present invention is proposed. Summary of the Invention

[0004] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:

[0005] A finished semiconductor measuring device includes a measuring mechanism, a calibration mechanism, a conveying mechanism and a storage mechanism, the measuring mechanism includes a lower frame, the rear end of the lower frame is rotatably connected to the upper frame and a No. 1 electric telescopic rod, the rear end of the upper frame is equipped with an arc frame, the inner side of the upper frame is equipped with an optical detector, the inner side of the lower frame is provided with a center plate, the inner side of the center plate is equipped with an inductive contact, the upper surface of the center plate is provided with a semiconductor product, the calibration mechanism is provided on the inner side of the lower frame, the calibration mechanism includes a slide rail, both sides of the upper surface of the slide rail are provided with slide grooves, the inner side of the slide groove is slidably connected to a slider, the upper surface of the slider is equipped with a driving end, a linkage frame is provided between the driving ends, and a terminal is provided at the top of the driving end.

[0006] As a further solution of the present invention: the output end of the No. 1 electric telescopic rod is rotatably connected to the arc frame, the upper frame is fitted with the lower frame, the semiconductor product is fitted with the upper surface of the center plate, the semiconductor product is electrically connected to the output end of the inductive contact, and the semiconductor product is located below the optical detector.

[0007] As a further solution of the present invention: the slide rails are distributed at equal intervals around the circumference, the linkage frame and the end heads are both sleeved on the outer surface of the driving end, a hollow cylinder is provided between the end heads, both ends of the hollow cylinder are slidably connected with extension rods, the extension rods are fixedly connected to the end heads, a No. 2 electric telescopic rod is installed between the center plate and the lower frame, the output end of the No. 2 electric telescopic rod is equipped with a folding frame, and one end of the folding frame is fixedly connected to the hollow cylinder.

[0008] As a further solution of the present invention: the conveying mechanism includes a No. 1 support frame and a No. 2 support frame, a No. 1 conveyor belt is installed between the No. 1 support frame, a No. 2 conveyor belt, a No. 3 conveyor belt, a No. 1 slide and a No. 2 slide are installed between the No. 2 support frame, and the No. 1 slide is installed on the lower surface of the lower frame.

[0009] As a further solution of the present invention: the No. 1 slide and the No. 2 slide are both configured as inclined structures, the No. 1 slide is fixedly connected to the No. 2 conveyor belt, the No. 2 slide is fixedly connected to the No. 3 conveyor belt, and the front end of the No. 1 slide is equipped with a No. 3 support frame.

[0010] As a further solution of the present invention: a limit frame is installed at the top of the No. 3 support frame, a No. 1 motor is installed on the outer surface of the limit frame, a No. 3 electric telescopic rod is installed at the output end of the No. 1 motor, and the No. 3 electric telescopic rod is rotatably connected to the inner side of the limit frame.

[0011] As a further solution of the present invention: the output end of the No. 3 electric telescopic rod is equipped with a No. 2 motor, the output end of the No. 2 motor is equipped with a connecting frame, the outer surface of the connecting frame is equipped with a No. 3 motor, the output end of the No. 3 motor is equipped with a vacuum suction nozzle, and the vacuum suction nozzle is rotatably connected to the inner side of the connecting frame.

[0012] As a further solution of the present invention: the storage mechanism includes an outer frame, the inner bottom end of the outer frame is rotatably connected to the No. 4 electric telescopic rod, the output end of the No. 4 electric telescopic rod is rotatably connected to the lifting plate, and limit blocks are installed on both sides of the lifting plate. Limit grooves are provided on both sides of the inner wall of the outer frame, and the limit grooves are sleeved on the outer surface of the limit blocks.

[0013] As a further solution of the present invention: a storage frame is provided on the upper surface of the lifting plate, the storage frame is in contact with the upper surface of the lifting plate, and the storage frame is in contact with the No. 3 conveyor belt.

[0014] A method for measuring a finished semiconductor measuring device, comprising the following steps:

[0015] S1: The user places the finished semiconductor product on the upper surface of conveyor belt No. 1, which transports the finished semiconductor product. After the finished semiconductor product reaches a certain position, the finished semiconductor product is sucked by a vacuum nozzle. The operation of motor No. 1 drives the rotation of electric telescopic rod No. 3. The finished semiconductor product is placed above the center plate by the extension and retraction of electric telescopic rod No. 3. The rotation of motors No. 2 and No. 3 drives the rotation of the connecting frame and vacuum nozzle to adjust the placement angle of the finished semiconductor product.

[0016] S2: The contraction of the second electric telescopic rod drives the folding frame and then the hollow cylinder to move toward the center plate. At this time, the end head drives the driving end and the slider to slide along the slide groove. The extension rod contracts with the movement of the end head. While the driving end moves, it drives a group of driving ends on the side to move through the linkage frame, ultimately achieving the synchronous movement function of the hollow cylinder. The semiconductor product is pushed to the center position of the center plate through the hollow cylinder. While fixing the semiconductor product, the inductive contact can perform power measurement on the semiconductor product.

[0017] S3: By extending the No. 1 electric telescopic rod, the arc frame is driven to close the upper frame to ensure the optical measurement effect. At this time, the optical detector is located directly above the semiconductor product and performs optical measurement on the semiconductor product. After the measurement is completed, the No. 1 electric telescopic rod is retracted to expand the upper frame, and then the No. 2 electric telescopic rod is extended to separate the hollow cylinder from the semiconductor product.

[0018] S4: Based on the test results, the semiconductor finished product is moved through the coordination of motor No. 1, electric telescopic rod No. 3, motor No. 2, connecting frame, motor No. 3, and vacuum nozzle. If it is a defective part, it is moved to the inside of slide No. 1 and transported by conveyor No. 2. If it is a qualified part, it is moved to the inside of slide No. 2 and transported by conveyor No. 3.

[0019] S5: Qualified parts are transported to the inside of the storage frame along with the operation of the No. 3 conveyor belt. The No. 4 electric telescopic rod is used to apply force to the lifting plate, and the limit block slides on the inside of the limit slot to limit the movement trajectory of the lifting plate. The lifting plate drives the storage frame to move up and down to stack multiple groups of assembled parts. After the storage frame is full, it is pulled out from the front to remove the parts. Beneficial effects

[0020] By contracting the No. 2 electric telescopic rod, the folding frame and then the hollow cylinder are driven to move toward the center plate. At this time, the end drives the driving end and the slider to slide along the slide groove, and the extension rod contracts with the movement of the end. While the driving end moves, it drives a group of driving ends on the side to move through the linkage frame, and finally realizes the synchronous movement function of the hollow cylinder. The semiconductor product is pushed to the center position of the center plate through the hollow cylinder. While fixing the semiconductor product, the inductive contact can perform power-on measurement on the semiconductor product. By extending the No. 1 electric telescopic rod, the arc frame is driven to close the upper frame to ensure the optical measurement effect. At this time, the optical detector is located directly above the semiconductor product, and optical measurement is performed on the semiconductor product. This method avoids the position offset of the semiconductor product or the penetration of external light source, thereby ensuring the accuracy of the measurement results.

[0021] The finished semiconductor products are transported by conveyor belt No. 1, and after being transported to a certain position, the finished semiconductor products are adsorbed by the vacuum nozzle, and the operation of motor No. 1 drives the rotation of electric telescopic rod No. 3, and the finished semiconductor products are placed above the center plate by the extension and contraction of electric telescopic rod No. 3. The rotation of motor No. 2 and motor No. 3 drives the connecting frame and vacuum nozzle to rotate, and the placement angle of the finished semiconductor products is adjusted. According to the test results, the finished semiconductor products are moved by the cooperation of motor No. 1, electric telescopic rod No. 3, motor No. 2, connecting frame, motor No. 3 and vacuum nozzle. If it is a defective part, it is moved to the inside of slide No. 1 and transported by the operation of conveyor belt No. 2. If it is a qualified part, it is moved to the inside of slide No. 2 and transported by the operation of conveyor belt No. 3. In this way, the automatic transportation function of semiconductor products to be measured, defective parts and qualified parts is realized.

[0022] Through the operation of the No. 4 electric telescopic rod, force is applied to the lifting plate, and the movement trajectory of the lifting plate is limited by the sliding of the limit block on the inside of the limit groove, so that the lifting plate drives the storage frame to move up and down, and multiple groups of components are stacked. After the storage frame is full, the storage frame is pulled out from the front end to retrieve the components. This method provides convenience for the stacking, storage and retrieval of qualified components.

[0023] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In the attached figure:

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the explosion of the measuring mechanism of the present invention;

[0027] Figure 3 For the present invention Figure 2 Schematic diagram from a side perspective;

[0028] Figure 4 This is an exploded schematic diagram of the calibration mechanism of the present invention;

[0029] Figure 5 Schematic diagram of the transmission mechanism of the present invention;

[0030] Figure 6 For the present invention Figure 5 Schematic diagram of part of the structure;

[0031] Figure 7 This is a schematic diagram of the storage mechanism of the present invention;

[0032] Figure 8 This is an exploded schematic diagram of the storage mechanism of the present invention.

[0033] Figure: 1, lower frame; 2, No. 1 electric telescopic rod; 3, curved frame; 4, upper frame; 5, optical detector; 6, center plate; 7, inductive contact; 8, finished semiconductor product; 9, slide rail; 10, slide trough; 11, slider; 12, drive end; 13, linkage frame; 14, end; 15, hollow cylinder; 16, extension rod; 17, No. 2 electric telescopic rod; 18, angle frame; 19, No. 1 support frame; 20, No. 2 support frame; 21, No. 1. Conveyor belt No. 1; 22. Conveyor belt No. 2; 23. Conveyor belt No. 3; 24. Slide No. 1; 25. Slide No. 2; 26. Support frame No. 3; 27. Limit frame; 28. Motor No. 1; 29. Electric telescopic rod No. 3; 30. Motor No. 2; 31. Connecting frame; 32. Motor No. 3; 33. Vacuum nozzle; 34. Outer frame; 35. Electric telescopic rod No. 4; 36. Lifting plate; 37. Limit slot; 38. Limit block; 39. Storage frame. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0035] like Figures 1 to 4 As shown, a finished semiconductor measuring device includes a measuring mechanism, a calibration mechanism, a conveying mechanism and a storage mechanism. The measuring mechanism includes a lower frame 1, the rear end of the lower frame 1 is rotatably connected to the upper frame 4 and the No. 1 electric telescopic rod 2, the rear end of the upper frame 4 is equipped with an arc frame 3, the inner side of the upper frame 4 is equipped with an optical detector 5, the inner side of the lower frame 1 is provided with a center plate 6, the inner side of the center plate 6 is equipped with an inductive contact 7, the upper surface of the center plate 6 is provided with a semiconductor finished product 8, the calibration mechanism is provided on the inner side of the lower frame 1, the calibration mechanism includes a slide rail 9, a linkage frame 13, an end 14, a hollow cylinder 15, an extension rod 16, the No. 2 electric telescopic rod 17 and an angle frame 18, both sides of the upper surface of the slide rail 9 are provided with a slide groove 10, the inner side of the slide groove 10 is slidably connected to a slider 11, the upper surface of the slider 11 is equipped with a driving end 12, a linkage frame 13 is provided between the driving ends 12, and the top of the driving end 12 is provided with an end 14.

[0036] By contracting the No. 2 electric telescopic rod 17, the folding frame 18 is driven to drive the hollow cylinder 15 to move toward the center plate 6. At this time, the end head 14 drives the driving end 12 and the slider 11 to slide along the slide groove 10, and the extension rod 16 contracts with the movement of the end head 14. While the driving end 12 moves, it drives a group of driving ends 12 on the side to move through the linkage frame 13, and finally realizes the synchronous movement function of the hollow cylinder 15. The semiconductor finished product 8 is pushed to the center position of the center plate 6 by the hollow cylinder 15. While fixing the semiconductor finished product 8, the inductive contact 7 can perform power-on measurement on the semiconductor finished product 8. By extending the No. 1 electric telescopic rod 2, the arc frame 3 is driven to close the upper frame 4 to ensure the optical measurement effect. At this time, the optical detector 5 is located directly above the semiconductor finished product 8 and performs optical measurement on the semiconductor finished product 8. In this way, the position displacement of the semiconductor finished product 8 or the penetration of external light source is avoided, thereby ensuring the accuracy of the measurement results.

[0037] Specifically, such as Figure 2 As shown, the output end of the No. 1 electric telescopic rod 2 is rotatably connected to the arc frame 3, the upper frame 4 is fitted with the lower frame 1, the semiconductor product 8 is fitted with the upper surface of the center plate 6, the semiconductor product 8 is electrically connected to the output end of the inductive contact 7, and the semiconductor product 8 is located below the optical detector 5.

[0038] This design is to realize the driving function of the No. 1 electric telescopic rod 2 on the arc frame 3, and then drive the upper frame 4 to adjust the angle. By further setting the position of the upper frame 4, the measurement effect of the optical detector 5 is ensured. By further setting the inductive contact 7 and the optical detector 5, it is ensured that both can perform inspection work on the semiconductor finished product 8.

[0039] Specifically, such as Figure 4 As shown, the slide rails 9 are distributed at equal intervals around the circumference, the linkage frame 13 and the end head 14 are both sleeved on the outer surface of the driving end 12, a hollow cylinder 15 is provided between the end heads 14, both ends of the hollow cylinder 15 are slidably connected with an extension rod 16, the extension rod 16 is fixedly connected to the end head 14, a No. 2 electric telescopic rod 17 is installed between the center plate 6 and the lower frame 1, and a folding frame 18 is installed at the output end of the No. 2 electric telescopic rod 17, and one end of the folding frame 18 is fixedly connected to the hollow cylinder 15.

[0040] By contracting the No. 2 electric telescopic rod 17, the folding frame 18 is driven to move the hollow cylinder 15 toward the center plate 6. At this time, the end head 14 drives the driving end 12 and the slider 11 to slide along the slide groove 10. The extension rod 16 contracts with the movement of the end head 14. While the driving end 12 moves, it drives a group of driving ends 12 on the side to move through the linkage frame 13, and finally realizes the synchronous movement function of the hollow cylinder 15. The semiconductor product 8 is pushed to the center position of the center plate 6 through the hollow cylinder 15. While fixing the semiconductor product 8, the inductive contact 7 can perform power-on measurement on the semiconductor product 8.

[0041] Specifically, such as Figure 5 As shown, the conveying mechanism includes a No. 1 support frame 19 and a No. 2 support frame 20, a No. 1 conveyor belt 21 is installed between the No. 1 support frame 19, and a No. 2 conveyor belt 22, a No. 3 conveyor belt 23, a No. 1 slide 24 and a No. 2 slide 25 are installed between the No. 2 support frames 20, and the No. 1 slide 24 is installed on the lower surface of the lower frame 1.

[0042] The No. 1 support frame 19 and the No. 2 support frame 20 can provide stable support for the conveying mechanism, and the No. 1 slideway 24 can provide support for the lower frame 1.

[0043] Specifically, such as Figure 5 As shown, slide No. 1 24 and slide No. 2 25 are both configured as inclined structures, slide No. 1 24 is fixedly connected to conveyor No. 2 22 , slide No. 2 25 is fixedly connected to conveyor No. 3 23 , and a support frame No. 3 26 is installed at the front end of slide No. 1 24 .

[0044] The defective parts slide to the surface of No. 2 conveyor belt 22 through the No. 1 slide 24, and are transported by the operation of No. 2 conveyor belt 22. The qualified parts slide to the surface of No. 3 conveyor belt 23 through the No. 2 slide 25, and are transported by the operation of No. 3 conveyor belt 23.

[0045] Specifically, such as Figure 6 As shown, a limit frame 27 is installed at the top of the No. 3 support frame 26, and a No. 1 motor 28 is installed on the outer surface of the limit frame 27. The output end of the No. 1 motor 28 is installed with a No. 3 electric telescopic rod 29, which is rotatably connected to the inner side of the limit frame 27.

[0046] The operation of the No. 1 motor 28 drives the No. 3 electric telescopic rod 29 to rotate, and the semiconductor product 8 is placed above the center plate 6 through the extension and retraction of the No. 3 electric telescopic rod 29 .

[0047] Specifically, such as Figure 6As shown, the output end of the No. 3 electric telescopic rod 29 is equipped with a No. 2 motor 30, the output end of the No. 2 motor 30 is equipped with a connecting frame 31, the outer surface of the connecting frame 31 is equipped with a No. 3 motor 32, and the output end of the No. 3 motor 32 is equipped with a vacuum suction nozzle 33, which is rotatably connected to the inner side of the connecting frame 31.

[0048] The semiconductor product 8 is adsorbed by the vacuum suction nozzle 33 , and the connection frame 31 and the vacuum suction nozzle 33 are driven to rotate by the rotation of the second motor 30 and the third motor 32 to adjust the placement angle of the semiconductor product 8 .

[0049] Specifically, such as Figure 8 As shown, the storage mechanism includes an outer frame 34, the inner bottom end of the outer frame 34 is rotatably connected to the fourth electric telescopic rod 35, the output end of the fourth electric telescopic rod 35 is rotatably connected to the lifting plate 36, and both sides of the lifting plate 36 are equipped with limit blocks 38, and both sides of the inner wall of the outer frame 34 are provided with limit grooves 37, and the limit grooves 37 are sleeved on the outer surface of the limit blocks 38.

[0050] Through the operation of the No. 4 electric telescopic rod 35, force is applied to the lifting plate 36, and the movement trajectory of the lifting plate 36 is limited by the sliding of the limit block 38 inside the limit groove 37, so that the lifting plate 36 drives the storage frame 39 to move up and down.

[0051] Specifically, such as Figure 7 As shown, a storage frame 39 is provided on the upper surface of the lifting plate 36 , and the storage frame 39 is in contact with the upper surface of the lifting plate 36 , and the storage frame 39 is in contact with the third conveyor belt 23 .

[0052] The qualified pieces are transported to the inner side of the storage frame 39 along with the operation of the No. 3 conveyor belt 23. After the storage frame 39 is full, the storage frame 39 is pulled out from the front end to remove the pieces.

[0053] A method for measuring a finished semiconductor measuring device, comprising the following steps:

[0054] S1: The user places the finished semiconductor product 8 on the upper surface of the No. 1 conveyor belt 21. The No. 1 conveyor belt 21 conveys the finished semiconductor product 8. After the finished semiconductor product 8 reaches a certain position, the finished semiconductor product 8 is sucked by the vacuum nozzle 33. The operation of the No. 1 motor 28 drives the No. 3 electric telescopic rod 29 to rotate. The No. 3 electric telescopic rod 29 is extended and retracted to place the finished semiconductor product 8 above the center plate 6. The rotation of the No. 2 motor 30 and the No. 3 motor 32 drives the connecting frame 31 and the vacuum nozzle 33 to rotate, thereby adjusting the placement angle of the finished semiconductor product 8.

[0055] S2: The contraction of the second electric telescopic rod 17 drives the folding frame 18 and then drives the hollow cylinder 15 to move toward the center plate 6. At this time, the end head 14 drives the driving end 12 and the slider 11 to slide along the slide groove 10. The extension rod 16 contracts with the movement of the end head 14. While the driving end 12 moves, it drives a group of driving ends 12 on the side to move through the linkage frame 13, ultimately achieving the synchronous movement function of the hollow cylinder 15. The semiconductor product 8 is pushed to the center position of the center plate 6 through the hollow cylinder 15. While fixing the semiconductor product 8, the inductive contact 7 can perform power measurement on the semiconductor product 8.

[0056] S3: The first electric telescopic rod 2 is extended to drive the arc frame 3, so that the upper frame 4 is closed to ensure the optical measurement effect. At this time, the optical detector 5 is located directly above the semiconductor product 8 and performs optical measurement on the semiconductor product 8. After the measurement is completed, the first electric telescopic rod 2 is retracted to expand the upper frame 4, and then the second electric telescopic rod 17 is extended to separate the hollow cylinder 15 from the semiconductor product 8.

[0057] S4: Based on the test results, the semiconductor product 8 is moved by the cooperation of the No. 1 motor 28, the No. 3 electric telescopic rod 29, the No. 2 motor 30, the connecting frame 31, the No. 3 motor 32, and the vacuum nozzle 33. If the semiconductor product 8 is a defective part, it is moved to the inside of the No. 1 slide 24 and transported by the No. 2 conveyor belt 22. If the semiconductor product is a qualified part, it is moved to the inside of the No. 2 slide 25 and transported by the No. 3 conveyor belt 23.

[0058] S5: Qualified parts are transported to the inside of the storage frame 39 along with the operation of the No. 3 conveyor belt 23. The lifting plate 36 is forced by the operation of the No. 4 electric telescopic rod 35, and the movement trajectory of the lifting plate 36 is limited by the sliding of the limit block 38 on the inside of the limit groove 37, so that the lifting plate 36 drives the storage frame 39 to move up and down, and multiple groups of assembled parts are stacked. After the storage frame 39 is full, the storage frame 39 is pulled out from the front end to take out the parts.

[0059] Working principle:

[0060] The user places the finished semiconductor product 8 on the upper surface of the No. 1 conveyor belt 21, and the finished semiconductor product 8 is transported by the No. 1 conveyor belt 21. After the conveyor reaches a certain position, the finished semiconductor product 8 is adsorbed by the vacuum nozzle 33. The operation of the No. 1 motor 28 drives the No. 3 electric telescopic rod 29 to rotate. The finished semiconductor product 8 is placed above the center plate 6 by the extension and contraction of the No. 3 electric telescopic rod 29. The rotation of the No. 2 motor 30 and the No. 3 motor 32 drives the connection frame 31 and the vacuum nozzle 33 to rotate, and the placement angle of the finished semiconductor product 8 is adjusted. By contracting the No. 2 electric telescopic rod 17, The angle frame 18 is driven to drive the hollow cylinder 15 to move toward the center plate 6. At this time, the end head 14 drives the driving end 12 and the slider 11 to slide along the slide groove 10. The extension rod 16 contracts with the movement of the end head 14. While the driving end 12 moves, it drives a group of driving ends 12 on the side to move through the linkage frame 13, and finally realizes the synchronous movement function of the hollow cylinder 15. The semiconductor product 8 is pushed to the center position of the center plate 6 by the hollow cylinder 15. While fixing the semiconductor product 8, the inductive contact 7 can perform power measurement on the semiconductor product 8. The arc frame 3 is driven by the extension of the No. 1 electric telescopic rod 2. The upper frame 4 is closed to ensure the optical measurement effect. At this time, the optical detector 5 is located directly above the semiconductor product 8 and performs optical measurement on the semiconductor product 8. After the measurement is completed, the upper frame 4 is expanded by contracting the No. 1 electric telescopic rod 2, and then the hollow cylinder 15 is separated from the semiconductor product 8 by extending the No. 2 electric telescopic rod 17. According to the test results, the semiconductor product 8 is moved by the cooperation of the No. 1 motor 28, the No. 3 electric telescopic rod 29, the No. 2 motor 30, the connecting frame 31, the No. 3 motor 32, and the vacuum nozzle 33. If it is a defective part, it is moved to the inside of the No. 1 slide 24. The problem pieces are conveyed by the operation of the No. 2 conveyor belt 22. If they are qualified pieces, they are moved to the inside of the No. 2 slide 25 and conveyed by the operation of the No. 3 conveyor belt 23. The qualified pieces are conveyed to the inside of the storage frame 39 along with the operation of the No. 3 conveyor belt 23. The lifting plate 36 is applied with force by the operation of the No. 4 electric telescopic rod 35, and the movement trajectory of the lifting plate 36 is limited by the sliding of the limit block 38 on the inside of the limit groove 37, so that the lifting plate 36 drives the storage frame 39 to move up and down, and multiple groups of assembled pieces are stacked. After the storage frame 39 is full, the storage frame 39 is pulled out from the front end to take out the pieces.

[0061] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A finished semiconductor measuring device, comprising a measuring mechanism, a calibration mechanism, a conveying mechanism and a storage mechanism, characterized in that: The measuring mechanism comprises a lower frame (1), the rear end of the lower frame (1) is rotatably connected to an upper frame (4) and a No. 1 electric telescopic rod (2), the rear end of the upper frame (4) is provided with an arc frame (3), the inner side of the upper frame (4) is provided with an optical detector (5), the inner side of the lower frame (1) is provided with a center plate (6), the inner side of the center plate (6) is provided with an inductive contact (7), the upper surface of the center plate (6) is provided with a semiconductor product (8), and the calibration mechanism is provided on the inner side of the lower frame (1). The calibration mechanism includes a slide rail (9), a linkage frame (13), an end (14), a hollow cylinder (15), an extension rod (16), a second electric telescopic rod (17) and a folding frame (18), wherein both sides of the upper surface of the slide rail (9) are provided with a slide groove (10), the inner side of the slide groove (10) is slidably connected to a slider (11), the upper surface of the slider (11) is provided with a driving end (12), a linkage frame (13) is provided between the driving ends (12), and a end (14) is provided at the top end of the driving end (12); The slide rails (9) are distributed at equal intervals around the circumference, the linkage frame (13) and the end head (14) are both sleeved on the outer surface of the driving end (12), a hollow cylinder (15) is provided between the end heads (14), both ends of the hollow cylinder (15) are slidably connected to an extension rod (16), the extension rod (16) is fixedly connected to the end head (14), a No. 2 electric telescopic rod (17) is installed between the center plate (6) and the lower frame (1), and a folding frame (18) is installed at the output end of the No. 2 electric telescopic rod (17), and one end of the folding frame (18) is fixedly connected to the hollow cylinder (15).

2. A finished semiconductor measuring device according to claim 1, characterized in that: The output end of the No. 1 electric telescopic rod (2) is rotatably connected to the arc frame (3), the upper frame (4) is fitted with the lower frame (1), the semiconductor product (8) is fitted with the upper surface of the center plate (6), the semiconductor product (8) is electrically connected to the output end of the inductive contact (7), and the semiconductor product (8) is located below the optical detector (5).

3. A finished semiconductor measuring device according to claim 1, characterized in that: The conveying mechanism comprises a No. 1 support frame (19) and a No. 2 support frame (20), a No. 1 conveyor belt (21) is installed between the No. 1 support frame (19), a No. 2 conveyor belt (22), a No. 3 conveyor belt (23), a No. 1 slideway (24) and a No. 2 slideway (25) are installed between the No. 2 support frame (20), and the No. 1 slideway (24) is installed on the lower surface of the lower frame (1).

4. A finished semiconductor measuring device according to claim 3, characterized in that: The No. 1 slideway (24) and the No. 2 slideway (25) are both configured as inclined structures. The No. 1 slideway (24) is fixedly connected to the No. 2 conveyor belt (22), and the No. 2 slideway (25) is fixedly connected to the No. 3 conveyor belt (23). The front end of the No. 1 slideway (24) is provided with a No. 3 support frame (26).

5. A finished semiconductor measuring device according to claim 4, characterized in that: A limiting frame (27) is installed at the top end of the third support frame (26), a first motor (28) is installed on the outer surface of the limiting frame (27), a third electric telescopic rod (29) is installed at the output end of the first motor (28), and the third electric telescopic rod (29) is rotatably connected to the inner side of the limiting frame (27).

6. A finished semiconductor measuring device according to claim 5, characterized in that: The output end of the No. 3 electric telescopic rod (29) is equipped with a No. 2 motor (30), the output end of the No. 2 motor (30) is equipped with a connecting frame (31), the outer surface of the connecting frame (31) is equipped with a No. 3 motor (32), the output end of the No. 3 motor (32) is equipped with a vacuum suction nozzle (33), and the vacuum suction nozzle (33) is rotatably connected to the inner side of the connecting frame (31).

7. A finished semiconductor measuring device according to claim 6, characterized in that: The storage mechanism comprises an outer frame (34), the inner bottom end of the outer frame (34) is rotatably connected to a No. 4 electric telescopic rod (35), the output end of the No. 4 electric telescopic rod (35) is rotatably connected to a lifting plate (36), both sides of the lifting plate (36) are provided with limit blocks (38), and both sides of the inner wall of the outer frame (34) are provided with limit grooves (37), and the limit grooves (37) are sleeved on the outer surface of the limit blocks (38).

8. A finished semiconductor measuring device according to claim 7, characterized in that: A storage frame (39) is provided on the upper surface of the lifting plate (36), and the storage frame (39) is in contact with the upper surface of the lifting plate (36), and the storage frame (39) is in contact with the third conveyor belt (23).

9. A method for measuring a finished semiconductor measuring device, using the finished semiconductor measuring device according to claim 8, characterized in that: The following steps are involved: S1: The user places the semiconductor finished product (8) on the upper surface of the No. 1 conveyor belt (21), and the semiconductor finished product (8) is transported by the No. 1 conveyor belt (21). After the semiconductor finished product (8) is transported to a certain position, the semiconductor finished product (8) is adsorbed by the vacuum suction nozzle (33), and the No. 3 electric telescopic rod (29) is driven to rotate by the operation of the No. 1 motor (28). The semiconductor finished product (8) is placed above the center plate (6) by the extension and contraction of the No. 3 electric telescopic rod (29), and the No. 2 motor (30) and the No. 3 motor (32) are driven to rotate the connecting frame (31) and the vacuum suction nozzle (33), so as to adjust the placement angle of the semiconductor finished product (8); S2: By contracting the second electric telescopic rod (17), the folding frame (18) is driven to drive the hollow cylinder (15) to move toward the center plate (6). At this time, the end head (14) drives the driving end (12) and the slider (11) to slide along the slide groove (10). The extension rod (16) contracts with the movement of the end head (14). While the driving end (12) moves, it drives a group of driving ends (12) on the side to move through the linkage frame (13), and finally realizes the synchronous movement function of the hollow cylinder (15). The semiconductor product (8) is pushed to the center position of the center plate (6) through the hollow cylinder (15). While fixing the semiconductor product (8), the inductive contact (7) can perform power-on measurement on the semiconductor product (8); S3: By extending the No. 1 electric telescopic rod (2), the arc frame (3) is driven to close the upper frame (4) to ensure the optical measurement effect. At this time, the optical detector (5) is located directly above the semiconductor finished product (8) to perform optical measurement on the semiconductor finished product (8). After the measurement is completed, the No. 1 electric telescopic rod (2) is retracted to expand the upper frame (4), and then the No. 2 electric telescopic rod (17) is extended to separate the hollow cylinder (15) from the semiconductor finished product (8); S4: According to the test results, the semiconductor finished product (8) is moved by the cooperation of the No. 1 motor (28), the No. 3 electric telescopic rod (29), the No. 2 motor (30), the connecting frame (31), the No. 3 motor (32), and the vacuum nozzle (33). If it is a defective part, it is moved to the inside of the No. 1 slide (24) and transported by the operation of the No. 2 conveyor belt (22). If it is a qualified part, it is moved to the inside of the No. 2 slide (25) and transported by the operation of the No. 3 conveyor belt (23); S5: The qualified pieces are transported to the inside of the storage frame (39) by the operation of the No. 3 conveyor belt (23). The lifting plate (36) is forced by the operation of the No. 4 electric telescopic rod (35). The movement trajectory of the lifting plate (36) is limited by the sliding of the limit block (38) on the inside of the limit groove (37). The lifting plate (36) drives the storage frame (39) to move up and down, and multiple groups of assembled pieces are stacked. After the storage frame (39) is fully stacked, the storage frame (39) is pulled out from the front end to remove the pieces.

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