Integrated circuit wafer gripping device

Abstract

The application discloses an integrated circuit wafer grabbing device, comprising: a mounting plate, which is an I-shaped plate structure; a first jaw assembly arranged on one side of one end of the mounting plate; a second jaw assembly arranged on the other side of the one end of the mounting plate; two third jaw assemblies respectively arranged on the two sides of the other end of the mounting plate; and a material pressing detection assembly arranged above the mounting plate; wherein the material pressing detection assembly detects that the integrated circuit wafer has reached above, and then the first jaw assembly, the second jaw assembly and the two third jaw assemblies grab the integrated circuit wafer. The application controls the jaw assemblies to grab the integrated circuit wafer, and then the grabbed integrated circuit wafer is transmitted to a designated position. The grabbing of the integrated circuit wafer is very stable in the whole process, and the grabbing is also very stable even for the material strip with relatively large hardness and deformation or the material strip with small plastic packages, so that the problem of yield reduction of marked products is effectively avoided.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit packaging technology, and more specifically to an integrated circuit die gripping device. Background Technology

[0002] Laser marking refers to using a laser beam to create permanent marks on the surface of various materials. The marking effect is achieved by evaporating the surface material to expose the deeper material, by causing chemical and physical changes in the surface material through light energy to "etch" a mark, or by burning away part of the material with light energy to reveal the desired pattern or text.

[0003] Existing integrated circuit laser marking machines use a suction cup structure to pick up and transport the material strip. The disadvantage of this suction cup method is that it is prone to vacuum breaking when handling material strips with high hardness or those that are easily deformed, or small plastic encapsulated parts. This leads to unstable material handling and a decrease in the output of marked products.

[0004] It should be noted that this section is intended to provide background or context for the embodiments of this disclosure set forth in the claims. The description herein does not constitute an admission that it is prior art simply because it is included in this section. Summary of the Invention

[0005] This invention provides an integrated circuit wafer gripping device to solve the problem that the existing integrated circuit laser marking machine, which uses a suction cup structure to pick up wafers, is prone to vacuum breaking, resulting in unstable material suction and reduced production of marked products.

[0006] This invention provides an integrated circuit wafer gripping device, comprising:

[0007] The mounting plate is an I-shaped plate structure.

[0008] The first gripper assembly is disposed on one side of one end of the mounting plate;

[0009] The second gripper assembly is disposed on the other side of one end of the mounting plate;

[0010] Two third gripper assemblies are respectively disposed on both sides of the other end of the mounting plate;

[0011] A material pressure detection component is disposed above the mounting plate;

[0012] When the pressing detection component detects that the integrated circuit wafer has reached the top of the integrated circuit wafer, the first gripper assembly, the second gripper assembly, and the two third gripper assemblies grip the integrated circuit wafer.

[0013] In a preferred embodiment of the present invention, the first gripper assembly includes a first gripper support, which has an n-shaped structure. A first cavity is provided at its upper part, and a first piston is provided inside the first cavity. A first micro-joint is provided at its top, and the first micro-joint communicates with the first cavity. A first rotating seat is provided at the middle of one side of the first rotating seat via a first rotating shaft. The upper part of the first rotating seat is in contact with one side of the first cavity, and a first connecting spring is provided at its lower part. The other end of the first connecting spring is provided on the first gripper support, and a first gripper is provided at its lower end.

[0014] A first blocking plate is provided on the upper part of the other side of the first gripper support, and the first blocking plate is in contact with the other side of the first cavity.

[0015] In a preferred embodiment of the present invention, a first sealing ring is provided between the first gripper support and the first blocking plate.

[0016] In a preferred embodiment of the present invention, the second gripper assembly includes a second gripper support, which has an n-shaped structure. A second cavity is provided at its upper part, and a second piston is disposed within the second cavity. A second micro-joint is provided at its top, communicating with the second cavity. A second rotating seat is provided on one side of the second rotating seat via a second rotating shaft. The upper part of the second rotating seat is in contact with one side of the second cavity, and a second connecting spring is provided at its lower part. The other end of the second connecting spring is disposed on the second gripper support, and a second gripper is provided at its lower end.

[0017] A second blocking plate is provided on the upper part of the other side of the second gripper support, and the second blocking plate fits against the other side of the second cavity.

[0018] In a preferred embodiment of the present invention, a second sealing ring is provided between the second gripper support and the second blocking plate.

[0019] In a preferred embodiment of the present invention, the third gripper assembly includes a third gripper support, which has an n-shaped structure. A third cavity and a fourth cavity are arranged side-by-side on its upper part. A third piston is disposed in the third cavity, and a fourth piston is disposed in the fourth cavity. A third micro-joint is disposed at its top, communicating with both the third and fourth cavities. A third rotating seat is disposed on one side of the third rotating seat via a third rotating shaft, and a fourth rotating seat is disposed on a fourth rotating shaft. The upper part of the third rotating seat is fitted against one side of the third cavity, and a third connecting spring is disposed at its lower part. The other end of the third connecting spring is disposed on the third gripper support, and a third gripper is disposed at its lower end. The upper part of the fourth rotating seat is fitted against one side of the fourth cavity, and a fourth connecting spring is disposed at its lower part. The other end of the fourth connecting spring is disposed on the third gripper support, and a fourth gripper is disposed at its lower end.

[0020] A third blocking plate is provided on the upper part of the other side of the third gripper support, and the third blocking plate is respectively attached to the other side of the third cavity and the fourth cavity.

[0021] In a preferred embodiment of the present invention, a third sealing ring is provided between the third gripper support and the third blocking plate.

[0022] In a preferred embodiment of the present invention, the pressing detection assembly includes two guide shafts disposed in the middle of the mounting plate, the lower ends of which are vertically fixed to the mounting plate by guide shaft seats disposed below the mounting plate; bearing seats are sleeved on the top of the two guide shafts, and two linear flange bearings are disposed on the bearing seats, each linear flange bearing being movable up and down along the corresponding guide shaft;

[0023] The material pressing detection assembly further includes a first sensor and a second sensor respectively disposed above both ends of the mounting plate, and a first pressing block and a second pressing block respectively disposed below the mounting plate; the first pressing block is fixed below the mounting plate by a first pad, and a first sensor sensing shaft that can extend out of the mounting plate and the first pressing block is movably disposed inside the first pressing block; the second pressing block is fixed below the mounting plate by a second pad, and a second sensor sensing shaft that can extend out of the mounting plate and the second pressing block is movably disposed inside the second pressing block.

[0024] In a preferred embodiment of the present invention, an anti-foolproof plate is provided at the upper end of the linear flange bearing, and a buffer pad is provided between the anti-foolproof plate and the linear flange bearing.

[0025] In a preferred embodiment of the present invention, a buffer spring is further sleeved on the guide shaft, and the two ends of the buffer spring abut against the bearing seat and the mounting plate, respectively. The first lateral positioning assembly includes a first lead screw and a first slider. The first slider is engaged with the first limiting rod and the second limiting rod respectively through first sliding grooves provided on both sides of it. The first lead screw passes through the first screw hole on the connecting rod and is then connected to the first slider.

[0026] The integrated circuit wafer gripping device provided in this embodiment of the invention has four sets of gripper assemblies arranged on both sides of the mounting plate, and a pressing detection assembly is set on the mounting plate. When the pressing detection assembly detects that the entire gripping device has reached above the integrated circuit wafer to be gripped, it controls each gripper assembly to grip the integrated circuit wafer and then transmits the gripped integrated circuit wafer to a designated position.

[0027] Throughout the process, the gripping of integrated circuit wafers was very stable. Even for wafers with high hardness and deformation or small plastic packages, the gripping was stable, effectively avoiding the problem of reduced production of marked products. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of an integrated circuit wafer gripping device provided in an embodiment of the present invention;

[0030] Figure 2 for Figure 1 Front view of the integrated circuit wafer gripping device shown in the figure;

[0031] Figure 3 for Figure 1 A top view of the integrated circuit wafer gripping device shown in the figure;

[0032] Figure 4 This is a schematic diagram of the structure of the first gripper assembly in an integrated circuit wafer gripping device according to an embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of the structure of the second gripper assembly in an integrated circuit wafer gripping device according to an embodiment of the present invention;

[0034] Figure 6 This is a schematic diagram of the structure of the third gripper assembly in an integrated circuit wafer gripping device according to an embodiment of the present invention;

[0035] Figure 7 This is a schematic diagram of the pressing and detection component in an integrated circuit wafer gripping device provided in an embodiment of the present invention.

[0036] In the picture:

[0037] 100. Mounting plate;

[0038] 200. First gripper assembly; 201. First gripper support; 202. First cavity; 203. First piston; 204. First micro-joint; 205. First rotating shaft; 206. First rotating seat; 207. First gripper; 208. First blocking plate.

[0039] 300. Second gripper assembly; 301. Second gripper support; 302. Second micro-joint; 303. Second rotating shaft; 304. Second rotating seat; 305. Second gripper; 306. Second blocking plate.

[0040] 400. Third gripper assembly; 401. Third gripper support; 402. Third micro-adjustment joint; 403. Third rotating shaft; 404. Third rotating seat; 405. Fourth rotating seat; 406. Third connecting spring; 407. Third gripper; 408. Fourth gripper; 409. Third blocking plate; 410. Fourth rotating shaft.

[0041] 500. Material pressing detection assembly; 501. Guide shaft; 502. Guide shaft seat; 503. Bearing seat; 504. Linear flange bearing; 505. First sensor; 506. Second sensor; 507. First pressing block; 508. Second pressing block; 509. First pad; 510. Second pad; 511. First sensor sensing shaft; 512. Second sensor sensing shaft; 513. Anti-fool plate; 514. Buffer pad; 515. Buffer spring. Detailed Implementation

[0042] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0044] Reference Figures 1-7As shown in the figure, an embodiment of the present invention discloses an integrated circuit wafer gripping device, which mainly includes:

[0045] Mounting plate 100, which is an I-shaped plate structure;

[0046] The first gripper assembly 200 is disposed on one side of one end of the mounting plate 100;

[0047] The second gripper assembly 300 is disposed on the other side of one end of the mounting plate 100;

[0048] Two third gripper assemblies 400 are respectively disposed on both sides of the other end of the mounting plate 100;

[0049] The material pressure detection component 500 is positioned above the mounting plate 100;

[0050] When the pressing detection component 500 detects that the integrated circuit wafer has reached the top of the integrated circuit wafer, the first gripper component 200, the second gripper component 300, and the two third gripper components 400 grip the integrated circuit wafer.

[0051] In this embodiment, the integrated circuit wafer gripping device mainly includes a mounting plate, a first gripper assembly, a second gripper assembly, two third gripper assemblies, and a pressing detection assembly. When the pressing detection assembly detects that the entire gripping device has reached above the integrated circuit wafer to be gripped, each gripper assembly can simultaneously and stably grip the integrated circuit wafer and transfer the gripped integrated circuit wafer to a designated position, effectively avoiding the problem of reduced production of marked products.

[0052] Specifically, the mounting plate is designed as an I-shaped plate structure, with its two ends being wider than the middle part, and its top and the broken sides are provided with multiple mounting holes and mounting slots for installing other components.

[0053] The first gripper assembly is located on one side of one end of the mounting plate and is vertically fixed through a mounting groove there. The second gripper assembly is located on the other side of one end of the mounting plate, symmetrically positioned to the first gripper assembly, and is vertically fixed through a mounting groove there as well. Two third gripper assemblies are located on opposite sides of the other end of the mounting plate, symmetrically arranged, and are each vertically fixed through a mounting groove there as well.

[0054] The material pressure detection component is located above the mounting plate, mainly in the middle and both ends of the mounting plate.

[0055] The material clamping detection component is used to detect whether the entire integrated circuit wafer gripping device has reached above the integrated circuit wafer to be gripped. The four sets of gripper assemblies are used to grip the integrated circuit wafer. The material clamping detection component is connected to an external PLC and cylinders, transmitting the detected signals to the PLC in real time. The PLC controls the movement of the cylinders by controlling the on / off state of the solenoid valves connected to the cylinders, thereby controlling the movement of the material clamping detection component. The four sets of gripper assemblies are also connected to external cylinders, and the PLC controls the movement of the cylinders by controlling the on / off state of the solenoid valves connected to the cylinders, thereby controlling the movement of the four sets of gripper assemblies.

[0056] When the integrated circuit printer's feed magazine reaches its position, the entire device starts. When the feed detection component detects that it has reached above the integrated circuit wafer, it transmits the detected signal to the PLC in real time. The PLC controls the solenoid valve to move the cylinder downwards, simultaneously opening the first gripper assembly, the second gripper assembly, and the two third gripper assemblies. When the feed detection component further detects that it is close to the integrated circuit wafer, it transmits the detected signal to the PLC in real time. After all the gripper assemblies clamp the integrated circuit wafer, the PLC controls the solenoid valve to clamp the integrated circuit wafer again, and then controls the cylinder to move upwards, thus picking up the integrated circuit wafer.

[0057] Once the entire device has grasped the integrated circuit wafer and moved it to the conveying position on the equipment's conveying track, the PLC controls the solenoid valve to move the cylinder downwards to its lower limit position. After this, all gripper assemblies open, placing the integrated circuit wafer into the equipment's conveying track. Then, the entire device returns to the initial gripping position, completing the entire gripping process, and waits to grip the next integrated circuit wafer.

[0058] Throughout the gripping process, the gripping of integrated circuit wafers is very stable. Even for wafers with high hardness and deformation or small plastic packages, the gripping is very stable, effectively avoiding the problem of reduced production of marked products.

[0059] Based on the above embodiments, in an optional embodiment provided in this application, please refer to the following for details. Figure 4 As shown, the first gripper assembly 200 includes a first gripper support 201, which has an n-shaped structure. A first cavity 202 is provided on its upper part, and a first piston 203 is provided inside the first cavity 202. A first micro-joint 204 is provided on its top, and the first micro-joint 204 communicates with the first cavity 202. A first rotating seat 206 is provided on one side of its middle part through a first rotating shaft 205. The upper part of the first rotating seat 206 is in contact with one side of the first cavity 202, and a first connecting spring is provided on its lower part. The other end of the first connecting spring is provided on the first gripper support 201, and the lower end of the first gripper 204 is provided.

[0060] A first blocking plate 208 is provided on the upper part of the other side of the first gripper support 201, and the first blocking plate 208 fits against the other side of the first cavity 202.

[0061] In this embodiment, the first gripper assembly mainly includes a first gripper support, a first piston, a first micro-joint, a first rotary seat, and a first gripper.

[0062] The first gripper support has an n-shaped structure, and two mounting platforms are provided on the side near the mounting plate. The first gripper support can be fixed to the mounting groove of the mounting plate through these two mounting platforms. A first cavity is provided at the upper part of the first gripper support, and a first micro-joint is provided at the top of the cavity, which is connected to the first cavity. A first piston is provided in the first cavity.

[0063] A first rotating seat is provided on the middle of one side of the mounting platform on the first gripper support via a first rotating shaft. The first rotating seat can rotate around the first rotating shaft. Its upper part fits against one side of the first cavity, and its lower part is provided with a first connecting spring. The other end of the first connecting spring is provided on the first gripper support, and its lower end is also provided with a first gripper.

[0064] A first blocking plate is provided on the upper part of the other side of the first gripper support where the mounting platform is not provided. The first blocking plate fits against the other side of the first cavity. Thus, the upper part of the first rotating seat, the first blocking plate, and the first micro-joint form a sealed cavity for the first cavity.

[0065] The first micro-adjustment is connected to an external cylinder. When compressed air from the cylinder enters the first cavity through the first micro-adjustment, it pushes the first piston to move. The first piston pushes the upper part of the first rotating seat to rotate around the first axis, thereby compressing the first connecting spring connected to its lower part and causing the first gripper to open. Conversely, when there is no compressed air, the reaction force of the compressed first connecting spring causes the first rotating seat to rotate in the opposite direction, thereby causing the first gripper to clamp.

[0066] Preferably, a first sealing ring is provided between the first gripper support 201 and the first blocking plate 208.

[0067] Specifically, a first sealing ring is provided between the first gripper support and the first blocking plate to further ensure the airtightness of the first cavity, thereby making it easier for the first piston to push the first rotating seat to rotate.

[0068] Based on the above embodiments, in an optional embodiment provided in this application, please refer to the following for details. Figure 5As shown, the second gripper assembly 300 includes a second gripper support 301, which has an n-shaped structure. A second cavity is provided on its upper part, and a second piston is provided inside the second cavity. A second micro-joint 302 is provided on its top, and the second micro-joint 302 communicates with the second cavity. A second rotating seat 304 is provided on one side of its middle part through a second rotating shaft 303. The upper part of the second rotating seat 304 fits against one side of the second cavity, and a second connecting spring is provided on its lower part. The other end of the second connecting spring is provided on the second gripper support 301, and a second gripper 305 is provided on its lower end through the second connecting spring.

[0069] A second blocking plate 306 is provided on the upper part of the other side of the second gripper support 301, and the second blocking plate 306 fits against the other side of the second cavity.

[0070] In this embodiment, the second gripper assembly mainly includes a second gripper support, a second piston, a second micro-adjustment joint, a second rotary seat, and a second gripper. The structure of the second gripper assembly is similar to that of the first gripper assembly, the only difference being that some parts of their structures are symmetrical. Therefore, the structure of the second gripper assembly will not be described in detail in this embodiment; please refer to the structural description of the first gripper assembly in the preceding embodiments.

[0071] The second micro-adjustment is connected to an external cylinder. When compressed air from the cylinder enters the second cavity through the second micro-adjustment, it pushes the second piston to move. The second piston pushes the upper part of the second rotating seat to rotate around the second axis, thereby compressing the second connecting spring connected to its lower part and opening the second gripper. Conversely, when there is no compressed air, the reaction force of the compressed second connecting spring causes the second rotating seat to rotate in the opposite direction, thereby clamping the second gripper.

[0072] Preferably, a second sealing ring is provided between the second gripper support 301 and the second blocking plate 306.

[0073] Specifically, using the same principle, a second sealing ring is set between the second gripper support and the second blocking plate, which can further ensure the airtightness of the second cavity, thereby making it easier for the second piston to push the second rotating seat to rotate.

[0074] Based on the above embodiments, in an optional embodiment provided in this application, please refer to the following for details. Figure 6As shown, the third gripper assembly 400 includes a third gripper support 401, which has an n-shaped structure. A third cavity and a fourth cavity are arranged side-by-side on its upper part. A third piston is disposed in the third cavity, and a fourth piston is disposed in the fourth cavity. A third micro-joint 402 is disposed on its top, communicating with both the third and fourth cavities. A third rotating seat 404 is disposed on one side of its middle via a third rotating shaft 403, and a fourth rotating shaft 410 is also provided with... There is a fourth rotating seat 405. The upper part of the third rotating seat 404 is attached to one side of the third cavity, and a third connecting spring 406 is provided at its lower part. The other end of the third connecting spring 406 is provided on the third gripper support 401, and a third gripper 407 is provided at its lower end. The upper part of the fourth rotating seat 405 is attached to one side of the fourth cavity, and a fourth connecting spring is provided at its lower part. The other end of the fourth connecting spring is provided on the third gripper support 401, and a fourth gripper 408 is provided at its lower end.

[0075] A third blocking plate 409 is provided on the upper part of the other side of the third gripper support 401. The third blocking plate 409 is respectively attached to the other side of the third cavity and the fourth cavity.

[0076] In this embodiment, the third gripper assembly mainly includes a third gripper support, a third piston, a fourth piston, a third micro-adhesive joint, a fourth micro-adhesive joint, a third rotary seat, a fourth rotary seat, a third gripper, and a fourth gripper.

[0077] The structure of the third gripper assembly is essentially a combination of the first gripper assembly and the second gripper assembly, and is similar to the structure of the first gripper assembly and the second gripper assembly.

[0078] Specifically, the third gripper support also has an n-shaped structure, with two mounting platforms on the side near the mounting plate. These platforms allow the third gripper support to be fixed to the mounting groove on the mounting plate. A third cavity and a fourth cavity are arranged side-by-side on the upper part of the third gripper support. A third micro-adjustment is located at the top of the third gripper support, communicating with both the third and fourth cavities. A third piston is located within the third cavity, and a fourth piston is located within the fourth cavity.

[0079] A third rotating seat is mounted on the middle of one side of the third gripper support, which is equipped with a mounting platform. A fourth rotating seat is mounted on the middle of the third rotating shaft. The third and fourth rotating seats are respectively positioned close to the two mounting platforms.

[0080] The third rotating seat can rotate around the third rotating axis. Its upper part is in contact with one side of the third cavity, and its lower part is provided with a third connecting spring. The other end of the third connecting spring is provided on the third gripper support, and its lower end is also provided with a third gripper. The fourth rotating seat can rotate around the fourth rotating axis. Its upper part is in contact with one side of the fourth cavity, and its lower part is provided with a fourth connecting spring. The other end of the fourth connecting spring is provided on the third gripper support, and its lower end is also provided with a fourth gripper.

[0081] A third blocking plate is provided on the upper part of the other side of the third gripper support where no mounting platform is provided. This third blocking plate fits against the other side of the third cavity and the fourth cavity. Thus, the upper part of the third rotating seat, the third blocking plate, and the third micro-movement joint form a sealed cavity for the third cavity, and at the same time, the upper part of the fourth rotating seat, the third blocking plate, and the third micro-movement joint form a sealed cavity for the fourth cavity as well.

[0082] The third micro-adjustment connects to an external cylinder. When compressed air from the cylinder enters the third cavity through the third micro-adjustment, it pushes the third piston to move. When it enters the fourth cavity, it pushes the fourth piston to move. The third piston pushes the upper part of the third rotating seat to rotate around the third axis, thereby compressing the third connecting spring connected to its lower part and opening the third gripper. The fourth piston pushes the upper part of the fourth rotating seat to rotate around the fourth axis, thereby compressing the fourth connecting spring connected to its lower part and opening the fourth gripper. Conversely, when there is no compressed air, the reaction force of the compressed third or fourth connecting spring causes the third or fourth rotating seat to rotate in the opposite direction, thereby clamping the third or fourth gripper.

[0083] Preferably, a third sealing ring is provided between the third gripper support 401 and the third blocking plate 409.

[0084] Specifically, using the same principle, a third sealing ring is set between the third gripper support and the third blocking plate, which can further ensure the airtightness of the third cavity and the fourth cavity, thereby making it easier for the third piston or the fourth piston to push the third rotating seat or the fourth rotating seat to rotate.

[0085] Based on the above embodiments, in an optional embodiment provided in this application, please refer to the following for details. Figure 7 As shown, the material pressing detection assembly 500 includes two guide shafts 501 disposed in the middle of the mounting plate, the lower ends of which are vertically fixed to the mounting plate 100 by guide shaft seats 502 disposed below the mounting plate 100; bearing seats 503 are sleeved on the top of the two guide shafts 501, and two linear flange bearings 504 are disposed on the bearing seats 503, and each linear flange bearing 504 can move up and down along the corresponding guide shaft 501;

[0086] The pressure detection assembly also includes a first sensor 505 and a second sensor 506 respectively disposed above both ends of the mounting plate 100, and a first pressure block 507 and a second pressure block 508 respectively disposed below the mounting plate 100; the first pressure block 507 is fixed below the mounting plate 100 by a first pad 509, and a first sensor sensing shaft 511 that can extend out of the mounting plate 100 and the first pressure block 507 is movably disposed inside the first pressure block 507; the second pressure block 508 is fixed below the mounting plate 100 by a second pad 510, and a second sensor sensing shaft 512 that can extend out of the mounting plate 100 and the second pressure block 508 is movably disposed inside the second pressure block 510.

[0087] In this embodiment, the material pressing detection component includes a guide structure disposed in the middle of the mounting plate and two detection structures disposed at both ends of the mounting plate.

[0088] The guiding structure mainly includes two guide shafts, guide shaft seats, bearing seats, and two linear flange bearings. The two guide shafts are vertically fixed to the mounting plate, with their lower ends secured by a guide shaft seat located below the mounting plate. A bearing seat is fitted onto the top of each guide shaft, and each bearing seat houses two linear flange bearings. The bearing seats are also connected to an external cylinder via a connecting block. Under the control of a PLC, each linear flange bearing can move up and down along its corresponding guide shaft under the action of the cylinder.

[0089] Once the entire device has reached above the integrated circuit wafer to be grasped, each linear flange bearing moves up and down along its corresponding guide shaft. The guide structure enables the entire device to maintain its positional stability as it continues to move downwards towards the integrated circuit wafer, thereby ensuring the grasping accuracy.

[0090] The detection structures are respectively set above both ends of the mounting plate. The detection mechanism located at the same end as the first gripper assembly and the second gripper assembly mainly includes a first sensor, a first pressure block, a first pad block and a first sensor sensing shaft. The detection mechanism located at the same end as the two third gripper assemblies mainly includes a second sensor, a second pressure block, a second pad block and a second sensor sensing shaft. The two have the same structure and are set in symmetrical positions.

[0091] The first sensor is positioned above the mounting plate, and the first pressure block is positioned below the mounting plate via a first pad, directly below the first sensor. The first pressure block houses a movable sensing shaft for the first sensor, with its upper and lower ends extending out of the mounting plate and the first pressure block, respectively. Normally, the entire device is suspended, with the lower end of the first sensor's sensing shaft extending beyond the first pressure block. When the device moves downwards close to the integrated circuit wafer, the first sensor's sensing shaft first contacts the wafer and is lifted by it, causing its upper end to extend beyond the mounting plate. At this point, the first sensor mounted on the mounting plate detects the signal and transmits it to the PLC.

[0092] The second sensor is positioned above the mounting plate, and the second pressure block is positioned below the mounting plate via a second pad, directly below the second sensor. The second pressure block houses a movable sensing shaft for the second sensor, with its upper and lower ends extending out from the mounting plate and the second pressure block, respectively. Normally, the entire device is suspended in mid-air, with the lower end of the second sensor's sensing shaft extending beyond the second pressure block. When the device moves downwards close to the integrated circuit wafer, the second sensor's sensing shaft first contacts the wafer and is lifted up, causing its upper end to extend beyond the mounting plate. At this point, the second sensor mounted on the mounting plate detects the signal and transmits it to the PLC.

[0093] A first pressure block and a second pressure block are set below the mounting plate. When each gripper assembly picks up the integrated circuit wafer, the first pressure block and the second pressure block will flatten the integrated circuit wafer, thereby facilitating the gripping of each gripper assembly.

[0094] Preferably, a foolproof plate 513 is provided at the upper end of the linear flange bearing 504, and a buffer pad 514 is provided between the foolproof plate 513 and the linear flange bearing 504.

[0095] Specifically, anti-fooling plates are installed on the upper end of each linear flange bearing, and a buffer pad is also installed between the anti-fooling plates and the linear flange bearing. The buffer pad can effectively reduce the collision between the linear flange bearing and the anti-fooling plates, which not only improves the service life of the anti-fooling plates, but also effectively reduces noise.

[0096] Preferably, a buffer spring 515 is also sleeved on the guide shaft 501, and the two ends of the buffer spring 515 abut against the bearing seat 503 and the mounting plate 100 respectively.

[0097] Specifically, a buffer spring is also fitted on each guide shaft, with its two ends abutting against the bearing seat and the mounting plate, respectively. This buffer spring provides effective cushioning, preventing the integrated circuit wafers from being squeezed and deformed due to excessive cylinder air pressure.

[0098] It should be noted that, due to limitations imposed by the accompanying drawings, some structures of the integrated circuit wafer device described in the embodiments of the present invention are not shown in the drawings. However, this does not affect the understanding and implementation of the technical solution by those skilled in the art. Those skilled in the art can implement the technical solution and achieve the expected technical effect based on the description in the specification and the accompanying drawings.

[0099] Based on the structure described in the above embodiments, the workflow of the integrated circuit wafer provided by the embodiments of the present invention will be described in detail below.

[0100] When the integrated circuit printer's feed magazine reaches its position, the entire device starts. When the pressure detection component detects that the feed magazine has reached above the integrated circuit wafer, it transmits the detected signal to the PLC in real time. The PLC controls the solenoid valve to move the cylinder downwards, simultaneously opening the first gripper assembly, the second gripper assembly, and the two third gripper assemblies. As the entire device moves downwards and approaches the integrated circuit wafer, the first and second sensor shafts first contact the wafer and are lifted by it, their upper ends extending beyond the mounting plate. At this point, the first and second sensors mounted on the mounting plate detect this and transmit the signal to the PLC. The PLC controls the solenoid valve to clamp the integrated circuit wafer with all gripper assemblies, then controls the cylinder to move upwards, thus gripping the integrated circuit wafer.

[0101] Once the entire device has grasped the integrated circuit wafer and moved it to the conveying position on the equipment's conveying track, the PLC controls the solenoid valve to move the cylinder downwards to its lower limit position. After this, all gripper assemblies open, placing the integrated circuit wafer into the equipment's conveying track. Then, the entire device returns to the initial gripping position, completing the entire gripping process, and waits to grip the next integrated circuit wafer.

[0102] In summary, the integrated circuit wafer gripping device provided in this embodiment of the invention, by setting four sets of gripper assemblies on both sides of the mounting plate and setting a pressing detection assembly on the mounting plate, controls each gripper assembly to grip the integrated circuit wafer when the pressing detection assembly detects that the entire gripping device has reached above the integrated circuit wafer to be gripped, and then transmits the gripped integrated circuit wafer to the designated position.

[0103] Throughout the process, the gripping of integrated circuit wafers was very stable. Even for wafers with high hardness and deformation or small plastic packages, the gripping was stable, effectively avoiding the problem of reduced production of marked products.

[0104] In the description of this invention, it should be noted that the orientations or positional relationships indicated by terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" are based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships that are commonly used when the product is in use. They are only for the purpose of facilitating the description of this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0105] Furthermore, the terms "first," "second," and "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0106] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0107] In the above embodiments of the present invention, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated circuit wafer gripping device, characterized in that, include: The mounting plate is an I-shaped plate structure. The first gripper assembly is disposed on one side of one end of the mounting plate; The second gripper assembly is disposed on the other side of one end of the mounting plate; Two third gripper assemblies are respectively disposed on both sides of the other end of the mounting plate; A material pressure detection component is disposed above the mounting plate; When the pressing detection component detects that the material has reached above the integrated circuit wafer, the first gripper assembly, the second gripper assembly, and the two third gripper assemblies grip the integrated circuit wafer. The first gripper assembly, the second gripper assembly, and the two third gripper assemblies are respectively connected to an external cylinder. The PLC controls the movement of the cylinder by controlling the opening and closing of the solenoid valves connected to the cylinder, thereby controlling the movement of the four gripper assemblies. The first gripper assembly includes a first gripper support, which has an n-shaped structure. A first cavity is provided at its upper part, and a first piston is provided inside the first cavity. A first micro-joint is provided at its top, and the first micro-joint communicates with the first cavity. A first rotating seat is provided at the middle of one side of the first rotating seat via a first rotating shaft. The upper part of the first rotating seat fits against one side of the first cavity, and a first connecting spring is provided at its lower part. The other end of the first connecting spring is provided on the first gripper support, and a first gripper is provided at its lower end. A first blocking plate is provided on the upper part of the other side of the first gripper support, and the first blocking plate fits against the other side of the first cavity; The first micro-adhesive is connected to an external cylinder; The third gripper assembly includes a third gripper support, which has an n-shaped structure. A third cavity and a fourth cavity are arranged side-by-side on its upper part. A third piston is disposed in the third cavity, and a fourth piston is disposed in the fourth cavity. A third micro-adjustment is disposed at its top, communicating with both the third and fourth cavities. A third rotating seat is disposed on one side of the third rotating seat via a third rotating shaft, and a fourth rotating seat is disposed on a fourth rotating shaft. The upper part of the third rotating seat is in contact with one side of the third cavity, and a third connecting spring is disposed at its lower part. The other end of the third connecting spring is disposed on the third gripper support, and a third gripper is disposed at its lower end. The upper part of the fourth rotating seat is in contact with one side of the fourth cavity, and a fourth connecting spring is disposed at its lower part. The other end of the fourth connecting spring is disposed on the third gripper support, and a fourth gripper is disposed at its lower end. A third blocking plate is provided on the upper part of the other side of the third gripper support, and the third blocking plate is respectively attached to the other side of the third cavity and the fourth cavity; The material pressing detection assembly includes two guide shafts disposed in the middle of the mounting plate, the lower ends of which are vertically fixed to the mounting plate by guide shaft seats disposed below the mounting plate; bearing seats are sleeved on the top of the two guide shafts, and two linear flange bearings are disposed on the bearing seats, each linear flange bearing being movable up and down along the corresponding guide shaft; The material pressing detection assembly further includes a first sensor and a second sensor respectively disposed above both ends of the mounting plate, and a first pressing block and a second pressing block respectively disposed below the mounting plate; the first pressing block is fixed below the mounting plate by a first pad, and a first sensor sensing shaft that can extend out of the mounting plate and the first pressing block is movably disposed inside the first pressing block; the second pressing block is fixed below the mounting plate by a second pad, and a second sensor sensing shaft that can extend out of the mounting plate and the second pressing block is movably disposed inside the second pressing block.

2. The apparatus according to claim 1, characterized in that, A first sealing ring is provided between the first gripper support and the first blocking plate.

3. The apparatus according to claim 1, characterized in that, The second gripper assembly includes a second gripper support, which has an n-shaped structure. A second cavity is provided at its upper part, and a second piston is provided inside the second cavity. A second micro-joint is provided at its top, and the second micro-joint communicates with the second cavity. A second rotating seat is provided at the middle of one side of the second rotating seat via a second rotating shaft. The upper part of the second rotating seat fits against one side of the second cavity, and a second connecting spring is provided at its lower part. The other end of the second connecting spring is provided on the second gripper support, and a second gripper is provided at its lower end. A second blocking plate is provided on the upper part of the other side of the second gripper support, and the second blocking plate fits against the other side of the second cavity.

4. The apparatus according to claim 3, characterized in that, A second sealing ring is provided between the second gripper support and the second blocking plate.

5. The apparatus according to claim 4, characterized in that, A third sealing ring is provided between the third gripper support and the third blocking plate.

6. The apparatus according to claim 5, characterized in that, An anti-fool plate is provided at the upper end of the linear flange bearing, and a buffer pad is provided between the anti-fool plate and the linear flange bearing.

7. The apparatus according to claim 6, characterized in that, A buffer spring is also fitted on the guide shaft, and the two ends of the buffer spring abut against the bearing seat and the mounting plate, respectively.

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