Heat dissipation structure and laser chip aging device

Abstract

The application relates to a heat dissipation structure and a laser chip aging device. The heat dissipation structure comprises a substrate, a heat dissipation groove is formed in the top surface of the substrate, a heat dissipation pipeline for circulating cooling liquid is formed in the bottom surface of the substrate, the heat dissipation pipeline comprises a plurality of shunt channels, a first through hole and a second through hole are formed in the substrate, the first through hole and the second through hole are communicated with the heat dissipation groove, and the first through hole and the second through hole are respectively communicated with two different shunt channels. A cover plate is sealingly matched with the heat dissipation groove, the cover plate is used for contacting or facing elements to be cooled, the first through hole and / or the second through hole are arranged towards the cover plate, and a sealing plate is sealingly matched with the plurality of shunt channels. The heat dissipation structure has high heat dissipation efficiency and can ensure the consistency of the temperatures of the plurality of elements to be cooled. The laser chip aging device comprises the heat dissipation structure, and the test result of chip aging is more accurate.

Description

Technical Field

[0001] This invention relates to the field of water cooling technology, and in particular to a heat dissipation structure and a laser chip aging device. Background Technology

[0002] With the development of electronic technology, electronic devices are capable of performing more and more functions, and their power is also gradually increasing. This leads to a significant amount of heat being generated during the use of these devices. Traditionally, water cooling is commonly used to dissipate heat from these electronic devices.

[0003] Current water cooling methods primarily involve circulating cooling water through inlet pipes. The coolant within these pipes absorbs and carries away the heat generated by electronic devices, thus dissipating heat. However, this method is inefficient at absorbing heat and has poor cooling performance. Summary of the Invention

[0004] Therefore, it is necessary to provide a heat dissipation structure and a laser chip aging device to address the heat dissipation efficiency problem of the heat dissipation structure.

[0005] A heat dissipation structure, the heat dissipation structure comprising:

[0006] The substrate has a heat dissipation groove on its top surface and a heat dissipation pipe for circulating coolant on its bottom surface. The heat dissipation pipe includes multiple branch channels. The substrate also has a first through hole and a second through hole, both of which are connected to the heat dissipation groove. The first through hole and the second through hole are also connected to two different branch channels.

[0007] A cover plate is sealed to the heat dissipation groove. The cover plate is used to contact or face the component to be dissipated. The first through hole and / or the second through hole are arranged facing the cover plate.

[0008] The sealing plates are respectively sealed and fitted with the multiple flow channels.

[0009] In one embodiment, there are multiple heat dissipation slots, which are spaced apart on the top surface of the substrate. The number of the first through holes and the second through holes corresponds to the number of heat dissipation slots. One end of each of the first through holes and the second through holes is connected to one of the heat dissipation slots, and the other end of each is connected to two adjacent distribution channels.

[0010] In one embodiment, the first through hole is formed on the bottom wall of the distribution channel and connects to the heat dissipation groove to allow coolant to be introduced into the heat dissipation groove, and the second through hole is formed on the bottom wall of the heat dissipation groove and connects to the distribution channel to allow coolant to be introduced into the distribution channel.

[0011] In one embodiment, the cross-sectional area of ​​the first through hole is smaller than the cross-sectional area of ​​the flow channel in the direction from the bottom surface to the top surface; and / or;

[0012] Along the direction from the bottom surface to the top surface, the cross-sectional area of ​​the second through hole is smaller than the cross-sectional area of ​​the flow channel.

[0013] In one embodiment, the cover plate is provided with a plurality of fins extending into the heat dissipation groove, and the plurality of fins are spaced apart.

[0014] In one embodiment, the bottom wall of the heat dissipation groove is recessed to form a first receiving groove and a second receiving groove arranged side by side, the first through hole is formed on at least a portion of the bottom wall of the first receiving groove, and the second through hole is formed on the bottom wall and / or side wall of the second receiving groove.

[0015] In one embodiment, the plurality of fins are in contact with the bottom wall of the heat dissipation groove, the first receiving groove and the second receiving groove are both strip grooves, the extending direction of the first receiving groove and the second receiving groove intersects with the extending direction of the gap between the plurality of fins, and the first receiving groove and the second receiving groove are connected to each other through the gap between the plurality of fins.

[0016] In one embodiment, a second receiving tank is provided on one side of the first receiving tank and another second receiving tank is provided on the other side. The bottom wall and / or side wall of the second receiving tank are provided with second through holes. Along the flow direction of the coolant, the cross-sectional area of ​​the second through hole is smaller than the cross-sectional area of ​​the first through hole.

[0017] In one embodiment, the heat dissipation structure further includes a sealing ring, a first sealing ring groove is formed on the top surface of the substrate, the bottom wall of the first sealing ring groove is recessed to form the heat dissipation groove, the sealing ring is disposed around the groove wall of the heat dissipation groove, and one side of the sealing ring abuts against the bottom wall of the first sealing ring groove, and the other side of the sealing ring abuts against the cover plate.

[0018] In one embodiment, there are multiple heat dissipation slots, and the heat dissipation pipes are connected in series with the multiple heat dissipation slots. The heat dissipation pipes are distributed on the substrate in a tortuous manner to form at least two heat dissipation slots arranged side by side. The cover plate can simultaneously seal with the two heat dissipation slots arranged side by side.

[0019] A laser chip aging device, comprising:

[0020] Multiple chips and a power supply structure, wherein the power supply structure is used to supply power to the multiple chips;

[0021] The heat dissipation structure as described in any one of the embodiments is used to dissipate heat from the plurality of chips.

[0022] In the aforementioned heat dissipation structure, both the first and second through holes are connected to the heat dissipation groove, and each through hole also connects to two different flow channels. This means that the cooperation of the first and second through holes and the heat dissipation groove allows the two flow channels to be interconnected, enabling coolant to circulate on the substrate. The cover plate contacts or faces the component to be cooled, and the cover plate is sealed to the heat dissipation groove. This means the cover plate can absorb heat from the component and transfer that heat through the coolant flowing within the heat dissipation groove. In this configuration, the cover plate transfers heat from the component to the coolant, thus dissipating heat from the component.

[0023] Furthermore, the distribution channels and heat dissipation grooves are respectively located on the bottom and top surfaces of the substrate, with the first and / or second through holes facing the cover plate. This allows the coolant in the distribution channels to impact the cover plate upwards under water pressure, improving the efficiency of heat absorption by the cover plate. Moreover, since the heat dissipation grooves have a certain volume, they can store at least a certain amount of coolant. Compared to traditional technologies that rely solely on water pipes for heat dissipation, this design ensures that the coolant has more time to fully exchange heat with the cover plate, guaranteeing efficient heat dissipation for the cover plate. Attached Figure Description

[0024] Figure 1 This is an axial view of a heat dissipation structure provided in an embodiment of the present invention;

[0025] Figure 2 for Figure 1 An exploded view of the heat dissipation structure shown.

[0026] Figure 3 For part of the heat dissipation structure along Figure 1 Sectional view of line AA in the middle;

[0027] Figure 4 for Figure 2 Top view of the substrate in the heat dissipation structure shown;

[0028] Figure 5 for Figure 2 A bottom view of the substrate in the heat dissipation structure shown;

[0029] Figure 6 This is a schematic diagram of the substrate in the heat dissipation structure shown in Figure 2.

[0030] Figure 7 for Figure 6 A magnified view of a section at point C;

[0031] Figure 8 for Figure 2 A schematic diagram of the cover plate in the heat dissipation structure shown;

[0032] Figure 9 for Figure 5 A magnified view of a section at point B in the middle.

[0033] Reference numerals: 10, heat dissipation structure; 100, substrate; 101, top surface; 102, bottom surface; 1100, heat dissipation groove; 1110, first receiving groove; 1120, second receiving groove; 1121, second through hole; 1200, heat dissipation pipe; 1210, distribution channel; 1211, first through hole; 130, first sealing ring groove; 140, connecting groove; 150, mounting groove; 200, cover plate; 210, plate body; 220, fin; 300, sealing ring; 400, water inlet pipe; 500, water outlet pipe. Detailed Implementation

[0034] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0040] See Figures 1 to 3 , Figure 1 A schematic diagram of the heat dissipation structure according to an embodiment of the present invention is shown. Figure 2 for Figure 1 An exploded view of the heat dissipation structure shown. Figure 3 For part of the heat dissipation structure along Figure 1The figure shows a cross-sectional view along line AA. An embodiment of the present invention provides a heat dissipation structure 10 including a substrate 100, a cover plate 200, and a sealing plate (not shown in the figure, the same below). A heat dissipation groove 1100 is formed on the top surface 101 of the substrate 100, and a heat dissipation pipe 1200 for circulating coolant is formed on the bottom surface 102 of the substrate 100. The heat dissipation pipe 1200 includes multiple branch channels 1210. A first through hole 1211 and a second through hole 1121 are also formed on the substrate 100. Both the first through hole 1211 and the second through hole 1121 communicate with the heat dissipation groove 1100, and the first through hole 1211 and the second through hole 1121 also communicate with two different branch channels 1210 respectively. Thus, through the cooperation of the first through hole 1211, the second through hole 1121, and the heat dissipation groove 1100, the two branch channels 1210 can be interconnected, allowing coolant to circulate within the substrate 100. The cover plate 200 contacts or faces the component to be cooled, and the cover plate 200 is sealed to the heat sink 1100. That is, the cover plate 200 can absorb the heat from the component to be cooled and transfer the heat through contact with the coolant flowing in the heat sink 1100. With this configuration, the heat from the component to be cooled can be transferred to the coolant through the cover plate 200 to dissipate heat from the component.

[0041] The cover plate 200 is sealed to the heat dissipation channel 1100. The cover plate 200 is used to contact or face the component to be cooled. The first through hole 1211 and / or the second through hole 1121 are provided facing the cover plate 200. The sealing plate is sealed to multiple distribution channels 1210 to ensure that the coolant in the multiple distribution channels 1210 does not leak. Since the distribution channels 1210 and the heat dissipation channel 1100 are respectively located on the bottom surface 102 and the top surface 101 of the substrate 100, and the first through hole 1211 and / or the second through hole 1121 are provided facing the cover plate 200, the coolant in the distribution channels 1210 can impact the cover plate 200 upward under the action of water pressure, which can increase the flow rate of the coolant near the cover plate 200, thereby improving the heat absorption efficiency. Furthermore, since the heat dissipation slot 1100 has a certain volume space, it can store at least a certain amount of coolant. Compared with the traditional technology that only dissipates heat through water pipes, this setting can ensure that the coolant has more time to fully exchange heat with the cover plate 200, thus ensuring the heat dissipation efficiency of the cover plate 200.

[0042] In other words, by providing the flow channel 1210 and the heat dissipation groove 1100 on the bottom surface 102 and top surface 101 of the substrate 100 respectively, and by providing the first through hole 1211 and / or the second through hole 1121 facing the cover plate 200, it is possible to ensure that the coolant has a high flow velocity when it contacts the cover plate 200, thereby improving the efficiency of heat dissipation from the cover plate 200. Furthermore, by providing the heat dissipation groove 1100 to hold a certain amount of coolant, it is possible to ensure that the coolant has sufficient time to fully exchange heat with the cover plate 200, thereby further improving the heat dissipation efficiency.

[0043] An embodiment of the present invention also provides a laser chip aging apparatus (not shown in the figures, the same below). The laser chip aging apparatus includes multiple chips (not shown in the figures, the same below), a power supply structure (not shown in the figures, the same below), and a heat dissipation structure 10 as described in various embodiments. The power supply structure is used to supply power to the chips to simulate the actual working scenario of the chips. The heat dissipation structure 10 is used to dissipate heat from the multiple chips, so that the temperature of the multiple chips is uniform, so as to test the aging of the chips at the same temperature.

[0044] In other words, the component to be cooled can be a chip, especially a high-power chip. The heat dissipation structure 10 described in each embodiment can be specifically applied to the aging test of high-power chips. Because the heat dissipation structure 10 described in each embodiment has high efficiency in heat dissipation, it can quickly reduce the temperature of each chip to a uniform temperature, thus achieving temperature consistency among the chips. It should be noted that when performing temperature aging tests on chips, it is necessary to ensure that the temperature of each chip is consistent during testing in order to obtain more accurate test results. The heat dissipation structure 10 described in each embodiment can ensure the temperature consistency of each chip, thereby ensuring the accuracy of temperature aging tests on the chips.

[0045] Of course, the heat dissipation structure 10 can also be applied to other electronic devices that require heat dissipation.

[0046] Please see Figure 4 In one embodiment, there are multiple heat dissipation slots 1100, which are spaced apart on the top surface 101 of the substrate 100. The number of first through holes 1211 and second through holes 1121 corresponds to the number of heat dissipation slots 1100. One end of each of the first through holes 1211 and the second through holes 1121 is connected to one of the heat dissipation slots 1100, and the other ends are respectively connected to two adjacent distribution channels 1210. In other words, for the same distribution channel 1210, one end is connected to one heat dissipation slot 1100 through the first through hole 1211, and the other end is connected to another heat dissipation slot 1100 through the second through hole 1121. Thus, by using segmented flow channels 1210 and heat dissipation tanks 1100 connected in series between each segment of flow channels 1210, coolant can circulate in the substrate 100, so as to dissipate heat on the cover plate 200 located in each heat dissipation tank 1100 at the same time, so as to dissipate heat on multiple components to be dissipated at the same time, or to dissipate heat on different areas of the components to be dissipated at the same time.

[0047] Please see Figure 5In one embodiment, the heat dissipation structure 10 further includes an inlet pipe 400 and an outlet pipe 500. One end of both the inlet pipe 400 and the outlet pipe 500 is connected to a water tank (not shown, the same below), and the other end is connected to a heat dissipation pipe 1200. Thus, coolant from the water tank can be transported to the heat dissipation pipe 1200 through the inlet pipe 400, and coolant that has absorbed heat in the heat dissipation pipe 1200 can be returned to the water tank through the outlet pipe 500. Specifically, the inlet pipe 400 can be connected to a branch channel 1210 at the beginning of the heat dissipation pipe 1200, and the outlet pipe 500 can be connected to a branch channel 1210 at the end of the heat dissipation pipe 1200. It is understood that the aforementioned beginning and end refer to the flow direction of the coolant.

[0048] For ease of understanding and explanation, the following description will use the example of a first through hole 1211 being formed on the bottom wall of a distribution channel 1210 and a second through hole 1121 being formed on the bottom wall of a heat dissipation tank 1100. The reverse is also true, so it will not be repeated. Specifically, the first through hole 1211 is formed on the bottom wall of the distribution channel 1210 and connects to the heat dissipation tank 1100, and is used to input coolant into the heat dissipation tank 1100; the second through hole 1121 is formed on the bottom wall of the heat dissipation tank 1100 and connects to the distribution channel 1210, and is used to input coolant from the heat dissipation tank 1100 into the distribution channel 1210. In this way, the same heat dissipation tank 1100 can connect to two adjacent distribution channels 1210, and the distribution channel 1210 can connect to two adjacent heat dissipation tanks 1100, thereby allowing all the coolant in the substrate 100 to flow in series. In this embodiment, at least the first through hole 1211 is provided facing the cover plate 200.

[0049] Please refer to it again. Figure 3 In one embodiment, the cross-sectional area of ​​the first through-hole 1211 is smaller than the cross-sectional area of ​​the distribution channel 1210 in the direction from the bottom surface 102 to the top surface 101. It is understood that, under constant conditions, the smaller the cross-sectional area of ​​the coolant flow, the greater the flow velocity. Therefore, by setting the cross-sectional area of ​​the first through-hole 1211 to be smaller than the cross-sectional area of ​​the distribution channel 1210, the flow velocity will increase when the coolant flows from the distribution channel 1210 into the heat dissipation tank 1100 through the first through-hole 1211. This further increases the flow velocity of the coolant when it impacts the cover plate 200, thereby further improving heat dissipation efficiency. (See also: The direction from the bottom surface 102 to the top surface 101 is described above.) Figure 3 The middle arrow K. Since the flow channel 1210 is located on the bottom surface 102 of the substrate 100, the heat dissipation groove 1100 is located on the top surface 101 of the substrate 100, and the first through hole 1211 is located facing the cover plate 200, the direction from the bottom surface 102 to the top surface 101 is the flow direction of the coolant.

[0050] Of course, in some embodiments, the cross-sectional area of ​​the first through hole 1211 can be set to be greater than or equal to the cross-sectional area of ​​the diversion channel 1210 in the direction from the bottom surface 102 to the top surface 101. In this case, the cooling efficiency can be improved by controlling the water pressure in the heat dissipation pipe 1200 so that the coolant can impact the cover plate 200.

[0051] Please see Figure 6 , Figure 7 and combined Figure 3 In one embodiment, the bottom wall of the heat dissipation tank 1100 is recessed to form a first receiving groove 1110 and a second receiving groove 1120 arranged side by side, thereby increasing the overall volume of the heat dissipation tank 1100 and ensuring that the coolant in the heat dissipation tank 1100 can fully exchange heat with the cover plate 200. At this time, a first through hole 1211 is formed on at least a portion of the bottom wall of the first receiving groove 1110, and a second through hole 1121 is formed on the bottom wall and / or side wall of the second receiving groove 1120. That is, after the coolant flows into the heat dissipation tank 1100 through the first through hole 1211, it must at least cross the wall of the first receiving groove 1110 to flow into the second receiving groove 1120 and then flow out through the second through hole 1121. Compared to directly placing the first through hole 1211 and the second through hole 1121 on the bottom wall of the heat dissipation tank 1100, this arrangement can increase the flow path of the coolant in the heat dissipation tank 1100, so that the coolant can fully exchange heat with the cover plate 200.

[0052] Please see Figure 8 In one embodiment, the cover plate 200 includes a plate body 210 and fins 220, with the fins 220 disposed on the plate body 210 and extending into the heat dissipation groove 1100. This allows the coolant to impact and directly contact the fins 220 for heat exchange. Multiple fins 220 are spaced apart to ensure sufficient contact between the coolant and the fins 220. By providing fins 220, the contact area between the cover plate 200 and the coolant is increased, thereby improving the efficiency of heat exchange between the coolant and the cover plate 200.

[0053] Please see Figure 3 and Figure 8In one embodiment, multiple fins 220 contact the bottom wall of the heat dissipation tank 1100. Both the first receiving tank 1110 and the second receiving tank 1120 are strip-shaped grooves. The extending directions of the first receiving tank 1110 and the second receiving tank 1120 intersect the extending direction of the gaps between the multiple fins 220, and the first receiving tank 1110 and the second receiving tank 1120 are interconnected through the gaps between the multiple fins 220. Thus, the coolant in the first receiving tank 1110 can flow through and wash the outer surface of the fins 220 under the guiding action of the fins 220, preventing the coolant in the gaps between the fins 220 from being independent of the flowing coolant and unable to fully exchange heat. Furthermore, the gaps between the fins 220 can guide the coolant flow from the first receiving tank 1110 to the second receiving tank 1120, facilitating the flow of coolant between different distribution channels 1210 and within different heat dissipation tanks 1100. Figure 7 The aforementioned strip grooves refer to the longitudinal cross-sectional shapes of the first receiving groove 1110 and the second receiving groove 1120 being rectangular, elliptical, or waist-shaped, etc.

[0054] It is understandable that the first through hole 1211 can also be a strip-shaped hole. Thus, the coolant flowing out of the first through hole 1211 can directly impact each fin 220 on the plate 210, achieving efficient cooling for each fin 220.

[0055] In some embodiments, there may be a certain gap between the fins 220 and the bottom wall of the heat sink 1100. Since the first through hole 1211 is set towards the cover plate 200, the upward flowing coolant can enter the gap between the fins 220.

[0056] In one embodiment, the extending directions of the first receiving groove 1110 and the second receiving groove 1120 may be perpendicular to the extending direction of the gap between the plurality of fins 220.

[0057] In one embodiment, the projection of the first receiving groove 1110 onto the plate 210 at least partially intersects with the plurality of fins 220 on the cover plate 200 corresponding to the heat dissipation groove 1100, so as to ensure that the coolant in the first receiving groove 1110 can flow into the gap between any two adjacent fins 220.

[0058] Please see Figure 3 and Figure 8In one embodiment, a second receiving tank 1120 is provided on one side of the first receiving tank 1110, and another second receiving tank 1120 is provided on the other side. That is, the number of second receiving tanks 1120 can be more than one, which can further increase the volume within the heat dissipation tank 1100, further increase the heat exchange time between the coolant and the cover plate 200 within the heat dissipation tank 1100, and improve heat dissipation efficiency. Second through holes 1121 are provided on the bottom wall and / or side wall of both second receiving tanks 1120. Furthermore, since the first receiving tank 1110 is located in the middle of the two second receiving tanks 1120, the coolant flowing out of the first receiving tank 1110 can flow to the second receiving tanks 1120 on both sides under the guidance of the fins 220, ensuring comprehensive contact of the coolant with the fins 220. Along the flow direction of the coolant, the cross-sectional area of ​​the second through hole 1121 is smaller than the cross-sectional area of ​​the first through hole 1211, which facilitates increasing the time the coolant remains in the second receiving tank 1120. Furthermore, since there are two second through holes 1121, the two through holes simultaneously supply coolant to another branch channel 1210, ensuring that the coolant in the branch channel 1210 is sufficient.

[0059] In some embodiments, the cross-sectional area of ​​the second through hole 1121 can be set along the direction from the bottom surface 102 to the top surface 101, and the cross-sectional area of ​​the flow channel 1210 is smaller than that of the flow channel 1210.

[0060] Please see Figure 3 In one embodiment, the projection of the first receiving groove 1110 onto the bottom surface 102 may at least partially overlap with the distribution channel 1210. The first through hole 1211 penetrates the bottom wall of the first receiving groove 1110 and the bottom wall of the distribution channel 1210. It is understood that the bottom wall of the first receiving groove 1110 may have the same structure as a portion of the bottom wall of the distribution channel 1210. This arrangement fully utilizes the internal space of the substrate 100, as the first through hole 1211 only needs to penetrate the aforementioned bottom wall to achieve communication between the distribution channel 1210 and the heat dissipation groove 1100. Furthermore, the first through hole 1211 and the first receiving groove 1110 may be directly configured to have the same structure, i.e., the first receiving groove 1110 does not have a bottom wall, and the first through hole 1211 directly penetrates the bottom wall of the heat dissipation groove 1100 and the bottom wall of the distribution channel 1210. Of course, in some embodiments, the first through hole 1211 and the first receiving groove 1110 may have some structural differences.

[0061] Please see Figure 9Specifically, the distribution channel 1210 can be Y-shaped, with its two bifurcated ends connected to two second through holes 1121 respectively. The converging end of the distribution channel 1210 has a first through hole 1211 to transport coolant to another heat dissipation tank 1100. It is understood that this arrangement fully utilizes the space on the substrate 100 and avoids interference between the space of the second receiving tank 1120 and the space of the distribution channel 1210.

[0062] Please continue reading. Figure 7 In one embodiment, the heat dissipation structure 10 further includes a sealing ring 300. A first sealing ring groove 130 is formed on the top surface 101 of the substrate 100, and the bottom wall of the first sealing ring groove 130 is recessed to form a heat dissipation groove 1100 as described in various embodiments. The sealing ring 300 is disposed around the groove wall of the heat dissipation groove 1100, with one side of the sealing ring 300 abutting against the bottom wall of the first sealing ring groove 130, and the other side of the sealing ring 300 abutting against the cover plate 200. This arrangement prevents coolant leakage between the heat dissipation groove 1100 and the cover plate 200.

[0063] Similarly, a second sealing ring groove (not shown) can be formed on the bottom surface 102 of the substrate 100, and a sealing ring 300 can be disposed in the second sealing ring groove to maintain a seal between the bottom surface 102 of the substrate 100 and the sealing plate, preventing leakage of coolant in the heat dissipation pipe 1200. Alternatively, the sealing plate can be directly welded to the bottom surface 102 of the substrate 100 to form a single integral structure, further ensuring the sealing performance of the heat dissipation pipe 1200. It is understood that, compared to the cover plate 200, the sealing plate has virtually no need for disassembly; therefore, welding the cover plate 200 to the substrate 100 can provide better sealing performance for the heat dissipation pipe 1200.

[0064] Please see Figure 5 and Figure 9 In one embodiment, the bottom surface 102 of the substrate 100 is provided with a connecting groove 140, and a heat dissipation pipe 1200 is formed on the bottom wall of the connecting groove 140. The shape of the connecting groove 140 matches the shape of the heat dissipation pipe 1200. A sealing plate matches the shape of the connecting groove 140 to achieve a sealing fit with the connecting groove 140.

[0065] Please see Figure 7 In one embodiment, there are multiple heat dissipation slots 1100, and heat dissipation pipes 1200 are connected in series with the multiple heat dissipation slots 1100. The heat dissipation pipes 1200 are distributed in a tortuous manner on the substrate 100, forming at least two heat dissipation slots 1100 arranged side by side. The cover plate 200 can simultaneously seal with two side-by-side heat dissipation slots 1100. That is, the same cover plate 200 can be cooled simultaneously by two heat dissipation slots 1100.

[0066] Specifically, the cover plate 200 has multiple fins 220 on its plate 210. The multiple fins 220 are divided into two areas, and the two areas correspond to two heat dissipation slots 1100 respectively.

[0067] Please continue reading. Figure 7 In one embodiment, a mounting groove 150 is further provided on the top surface 101 of the substrate 100, and a heat dissipation groove 1100 is formed on the bottom wall of the mounting groove 150. The plate body 210 is connected to the bottom wall or side wall of the mounting groove 150 to maintain and fix it to the substrate 100 as a whole and clamp the sealing ring 300. See reference Figure 7 It is understood that a mounting groove 150 is formed on the top surface 101 of the substrate 100, and a portion of the bottom wall of the mounting groove 150 is recessed to form a first sealing ring groove 130, and a portion of the bottom wall of the first sealing ring groove 130 is recessed to form a heat dissipation groove 1100. That is, the mounting groove 150, the first sealing ring groove 130, and the heat dissipation groove 1100 on the top surface 101 of the substrate 100 are progressively recessed.

[0068] Please refer to it again. Figure 4 and Figure 5 In one embodiment, at least two heat dissipation pipes 1200 may be provided on the same substrate 100, and the two heat dissipation pipes 1200 are respectively connected to different heat dissipation slots 1100.

[0069] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: A substrate has heat dissipation grooves on its top surface, and the number of heat dissipation grooves is multiple. The heat dissipation grooves are spaced apart on the top surface of the substrate. A heat dissipation pipe for circulating coolant is formed on the bottom surface of the substrate. The heat dissipation pipe includes multiple branch channels. A first through hole and a second through hole are also formed on the substrate. The first through hole and the second through hole are both connected to the heat dissipation grooves. The first through hole and the second through hole are also connected to two different branch channels respectively. A cover plate is sealed to the heat dissipation groove. The cover plate is used to contact or face the component to be dissipated. The first through hole and / or the second through hole are arranged facing the cover plate. The sealing plates are respectively sealed to fit with the plurality of the flow channels; The number of the first through hole and the second through hole corresponds to the number of the heat dissipation slots. One end of each of the first through hole and the second through hole is connected to one of the heat dissipation slots, and the other end of each is connected to two adjacent distribution channels. The first through hole is formed on the bottom wall of the distribution channel and connects to the heat dissipation tank to allow coolant to be introduced into the heat dissipation tank. The second through hole is formed on the bottom wall of the heat dissipation tank and connects to the distribution channel to allow coolant to be introduced into the distribution channel. This allows the same heat dissipation tank to connect two adjacent distribution channels, and the distribution channel to connect two adjacent heat dissipation tanks, so that the coolant in the substrate can flow in series.

2. The heat dissipation structure according to claim 1, characterized in that, Along the direction from the bottom surface to the top surface, the cross-sectional area of ​​the first through hole is smaller than the cross-sectional area of ​​the flow channel.

3. The heat dissipation structure according to claim 1, characterized in that, Along the direction from the bottom surface to the top surface, the cross-sectional area of ​​the second through hole is smaller than the cross-sectional area of ​​the flow channel.

4. The heat dissipation structure according to claim 1, characterized in that, The cover plate is provided with a plurality of fins extending into the heat dissipation groove, and the plurality of fins are spaced apart.

5. The heat dissipation structure according to claim 4, characterized in that, The bottom wall of the heat dissipation groove is recessed to form a first receiving groove and a second receiving groove arranged side by side. The first through hole is opened on at least a part of the bottom wall of the first receiving groove, and the second through hole is opened on the bottom wall and / or side wall of the second receiving groove.

6. The heat dissipation structure according to claim 5, characterized in that, The plurality of fins are in contact with the bottom wall of the heat dissipation groove. The first receiving groove and the second receiving groove are both strip-shaped grooves. The extending directions of the first receiving groove and the second receiving groove intersect with the extending direction of the gap between the plurality of fins. The first receiving groove and the second receiving groove are connected to each other through the gap between the plurality of fins.

7. The heat dissipation structure according to claim 5, characterized in that, A second receiving tank is provided on one side of the first receiving tank and another second receiving tank is provided on the other side. The bottom wall and / or side wall of the second receiving tank are provided with second through holes. Along the flow direction of the coolant, the cross-sectional area of ​​the second through hole is smaller than the cross-sectional area of ​​the first through hole.

8. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes a sealing ring. A first sealing ring groove is formed on the top surface of the substrate. The bottom wall of the first sealing ring groove is recessed to form the heat dissipation groove. The sealing ring is arranged around the groove wall of the heat dissipation groove, and one side of the sealing ring abuts against the bottom wall of the first sealing ring groove, while the other side of the sealing ring abuts against the cover plate.

9. The heat dissipation structure according to any one of claims 1 to 8, characterized in that, The number of heat dissipation slots is multiple, and the heat dissipation pipes are connected in series to the multiple heat dissipation slots. The heat dissipation pipes are distributed on the substrate in a tortuous manner to form at least two heat dissipation slots arranged side by side. The cover plate can simultaneously seal and cooperate with the two heat dissipation slots arranged side by side.

10. A laser chip aging device, characterized in that, include; Multiple chips and a power supply structure, wherein the power supply structure is used to supply power to the multiple chips; The heat dissipation structure according to any one of claims 1 to 9 is used to dissipate heat from the plurality of the chips.

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