Fully automatic loading and bending test equipment and method thereof

Abstract

The application discloses a full-automatic feeding and bending test equipment and method. The equipment comprises a feeding mechanism, a discharging mechanism, a bending mechanism and a ring flow line test mechanism. The ring flow line test mechanism comprises a circulating track, a plurality of circulating carriers arranged on the circulating track and used for positioning products, an RF test module, an ICT test module and an AOI test module arranged along the circulating direction of the circulating track. An upper feeding adsorption module for transferring the products is arranged between the feeding mechanism and the bending mechanism. A mechanical hand adsorption module for transferring the products is arranged between the bending mechanism and the ring flow line test mechanism. The application realizes the movement of the products in the circulating track by using the universal carrier, integrates the test mechanisms of multiple different test types on the circulating track, improves the transfer rhythm of the products between the test devices, and realizes the feeding, bending, multiple tests and discharging of the products by the whole automatic equipment.

Description

Technical Field

[0001] This invention belongs to the field of automation equipment technology, and in particular relates to a fully automatic feeding bending test equipment and method. Background Technology

[0002] During the manufacturing process of printed circuit board assemblies, multiple testing and inspection procedures are often required. Conventionally, multiple workstations are connected in series using a linear arrangement. Existing patent number CN202110258845.0 discloses an automatic antenna testing device, which discloses a rack sequentially equipped with a tray loading mechanism, an antenna product bending mechanism, a product misalignment and flipping mechanism at the loading position, a semi-inspection tray mechanism for placing bent and unloaded products, an RF annular streamline testing mechanism for RF testing of the antenna, an RF test tray mechanism for placing RF-tested products, a secondary misalignment and flipping mechanism for flipping products, an ICT annular streamline testing mechanism for ICT testing of products, and an ICT test tray for placing tested products. The existing testing equipment, from the tray loading mechanism to the antenna product bending mechanism, requires the product to go through the loading position product misalignment and flipping mechanism, the product to the semi-inspection tray mechanism, the first robot arm mechanism, the RF test tray mechanism, the RF unloading robot arm, the second misalignment and flipping mechanism, and the ICT loading and unloading robot arm. Each time the product passes through a station, it is handled by a robot arm, which reduces the production cycle. Multiple mechanisms work together, requiring high precision in transfer coordination. Due to the separate setup of the workstations of each testing mechanism, each workstation of the testing mechanism corresponds to a different tray, making it impossible to achieve a correlated and efficient flow of production operations. Summary of the Invention

[0003] The purpose of this invention is to solve the aforementioned technical problems by providing a fully automated feeding, bending, and testing equipment and method. This allows for the movement of products within a circular track using a universal carrier, integrating various testing mechanisms of different types onto the track. This improves the product transfer cycle between different testing devices, and the entire automated equipment completes product feeding, bending, multiple tests, and unloading. To achieve the above objectives, the technical solution of this invention is as follows:

[0004] A fully automated feeding and bending testing device and method are disclosed. The device includes a feeding mechanism, a discharging mechanism, a bending mechanism, and a circular streamline testing mechanism. The circular streamline testing mechanism includes a circulating track, several circulating carriers for positioning products on the circulating track, and RF testing modules, ICT testing modules, and AOI testing modules arranged along the circulating direction of the circulating track. A feeding adsorption module for transferring products is provided between the feeding mechanism and the bending mechanism, and a robotic arm adsorption module for transferring products is provided between the bending mechanism and the circular streamline testing mechanism. Each circulating carrier includes an upper fixed block, and a first groove for accommodating a first pressing block assembly is provided in the upper fixed block. A second pressing block assembly is provided on the upper fixed plate. The first pressing block assembly includes a base block that cooperates with the first groove for movably pressing the side of the positioned product, and the second pressing block assembly includes a self-weight pressure plate for rotatably pressing multiple product surfaces.

[0005] By utilizing universal carriers to move products within a circular track, various testing mechanisms of different types are integrated onto the track, improving the product transfer cycle between different testing devices. The entire automated equipment completes product loading, bending, multiple tests, and unloading. For PCB products, considering their thinness and fragility, a suitable circular carrier is designed, enabling products to be positioned and tested accurately and without damage, achieving highly efficient automated processing on the production line.

[0006] Compared with existing technologies, the advantages of the fully automatic feeding bending test equipment and method of the present invention are mainly reflected in:

[0007] A storage device is installed between the feeding mechanism and the bending mechanism. This device controls the product spacing before they enter the bending mechanism, allowing for pre-adjustment of the spacing between multiple products. This facilitates the direct grouping of products by the feeding and adsorption module, increasing feeding speed. The bending mechanism features a movable lower bending module. After bending, the product can detach from the processing position along with the lower bending module. This lower bending module has a bending forming component that serves both forming and ejecting functions, enabling rapid product unloading. This allows the robotic arm adsorption module to directly group products to the circulating carrier. The circulating carrier cleverly incorporates a first and second pressure block assembly. The first assembly provides side clamping and positioning of the product, while the second assembly provides surface pressing and positioning of grouped products. Combined with the side push module, this allows for synchronous positioning of all products within the circulating carrier. For small products like PCBAs, this provides high-precision synchronous positioning and effectively avoids areas requiring inspection. The following components are arranged sequentially along the circulating carrier. The system includes a loading area, a barcode scanning area, an RF testing area, an ICT testing area, an AOI testing area, and an unloading area. After bending, products do not need to be placed in other workstations or repositioned to the circulating carrier. Instead, a robotic arm adsorption module directly transports the products to the circulating carrier for testing, avoiding the need for traditional linear workstation layouts with multiple pause stations and robotic arms. The RF, ICT, and AOI testing areas are centrally designed on the circulating track, enabling multi-functional product testing with a high level of automation. Utilizing the circulating track and linkage components, the mounting base of the circulating carrier can be precisely positioned, and the circulation of the circulating carrier into each testing area is tightly scheduled. Both the RF and ICT testing modules use an upward pushing method to inspect the circulating carrier. The circulating carrier and testing modules are elastically positioned, providing a buffer for the carrier's positioning. The RF and ICT testing modules can accurately perform performance testing on the products. The AOI testing module performs visual inspection and judgment on the products, ensuring that the products are ultimately qualified for unloading. Attached Figure Description

[0008] Figure 1 This is a top view of the overall device structure according to an embodiment of the present invention;

[0009] Figure 2 This is a schematic diagram of the feeding mechanism in this embodiment;

[0010] Figure 3 This is a partial structural diagram of the feeding hopper device in this embodiment;

[0011] Figure 4 This is a schematic diagram of the storage device structure in this embodiment;

[0012] Figure 5This is a schematic diagram of the bending mechanism in this embodiment;

[0013] Figure 6 This is a schematic diagram showing the cooperation between the lower bending module and the upper bending module in this embodiment;

[0014] Figure 7 This is a schematic diagram of the punching process in this embodiment;

[0015] Figure 8 This is a schematic diagram of the bent part in this embodiment;

[0016] Figure 9 This is a schematic diagram showing the product positioning within the first gripper in this embodiment;

[0017] Figure 10 This is a schematic diagram of the annular streamline testing mechanism in this embodiment;

[0018] Figure 11 This is a schematic diagram of the loop track structure in this embodiment;

[0019] Figure 12 This is a schematic diagram of the cyclic vehicle structure in this embodiment;

[0020] Figure 13 This is a partial schematic diagram of the cyclic vehicle in this embodiment;

[0021] Figure 14 This is a schematic diagram of the first pressing block assembly in this embodiment;

[0022] Figure 15 This is a schematic diagram of the second pressing block assembly in this embodiment;

[0023] Figure 16 This is a schematic diagram of the side-push module structure in this embodiment;

[0024] Figure 17 This is a schematic diagram of the RF test module in this embodiment;

[0025] Figure 18 This is a partial schematic diagram of the RF test module in this embodiment;

[0026] Figure 19 This is a schematic diagram of the ICT test module in this embodiment;

[0027] Figure 20 This is a partial schematic diagram of the ICT test module in this embodiment;

[0028] Figure 21 This is a schematic diagram of the feeding mechanism in this embodiment;

[0029] Figure 22 This is a schematic diagram of the AOI test module in this embodiment;

[0030] The numbers in the image represent:

[0031] 1. Feeding mechanism; 11. Feeding adsorption module; 12. Robotic arm adsorption module; 13. Feeding bin device; 131. Feeding bin frame; 132. Feeding pallet; 133. Feeding drive device; 134. Limiting component; 135. Fork plate; 14. Defective product unloading line; 15. Storage device; 151. Barcode scanner; 152. Storage plate; 153. Carrier block; 154. First gripper; 16. Feeding variable distance adsorption assembly; 17. Feeding fixed adsorption assembly.

[0032] 2. Bending mechanism; 21. Lower bending module; 211. Lower fixing plate; 212. Second claw; 213. Bending forming part; 214. Arc-shaped protrusion; 22. Upper bending module; 221. Upper fixing plate; 222. Punch.

[0033] 3. Circular streamline testing mechanism; 31. Circulating track; 311. Main drive wheel; 312. Driven wheel; 313. Belt conveyor; 314. Mounting base; 32. Linkage assembly; 321. Linkage; 322. Limiting rod.

[0034] 4. Feeding mechanism, 41. Feeding bin device, 42. Defective product rejection line, 43. Feeding adsorption module, 44. Temporary storage tray, 45. Discharge adsorption module.

[0035] 5. Cyclic vehicle, 51. Download plate, 511. Mounting plate, 512. Guide post, 52. Lower fixing block, 53. Upper fixing block, 531. Connecting rib, 532. Pressure plate seat, 533. Self-weight pressure plate, 534. Self-weight block, 535. Sliding groove, 54. Upper loading plate, 55. Window, 56. First groove, 57. Second groove, 58. Push rod, 581. Base block, 582. Metal block, 583. Inner surface, 584. Elastic self-rotating wheel, 59. Side push module, 591. First insert plate, 592. Second insert plate, 593. Insert post.

[0036] 6RF test module, 61RF detection board, 62RF probe, 63RF detection head, 64 first lifting plate, 65 first guide head,

[0037] 7ICT test module, 71ICT test board, 72ICT test head, 73 second lifting plate, 74 second guide head,

[0038] 8AOI test modules, 81 cameras

[0039] 9. Product, 91. Chip area, 92. Lead area, 93. PCB board, 94. Bending area, 94. Carrier tray. Detailed Implementation

[0040] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0041] Example 1:

[0042] Reference Figure 1-22 As shown, this embodiment is a fully automatic feeding and bending testing equipment, including a feeding mechanism 1, a bending mechanism 2, a circular streamline testing mechanism 3, and a discharging mechanism 4; the circular streamline testing mechanism 3 includes a circulating track 31, several circulating carriers 5 for positioning products on the circulating track 3, an RF testing module 6, an ICT testing module 7, and an AOI testing module 8 arranged along the circulating direction of the circulating track 31; a feeding adsorption module 11 for transferring products 9 is provided between the feeding mechanism 1 and the bending mechanism 2, and a robotic arm adsorption module 12 for transferring products 9 is provided between the bending mechanism 2 and the circular streamline testing mechanism 3.

[0043] In this embodiment, product 9 is a printed circuit board assembly. Product 9 includes a chip region 91 and a lead region 92, which are disposed on a PCB board 93. A bending region 94 is provided on the PCB board 93 at the transition position between the chip region 91 and the lead region 92. The bending angle of the bending region 94 is designed to meet the assembly and installation requirements of the printed circuit board assembly. The chip region 91 is at a higher horizontal position than the lead region 92.

[0044] The feeding mechanism 1 includes a feeding bin device 13 and a defective product unloading line 14. A storage device 15 is provided on the side of the feeding bin device 13, and the defective product unloading line 14 is provided on the side of the storage device 15. The feeding adsorption module 11 is arranged across the feeding bin device 13, the storage device 15, and the defective product unloading line 14, thereby realizing the transfer and positioning of product 9 to different workstations.

[0045] The feeding hopper device 13 includes a feeding hopper frame 131, a feeding tray 132 for stacking several trays 94 fully loaded with products 9, a feeding drive device 133 located at the bottom of the feeding tray 132 to drive it to move along the arrangement direction of the feeding hopper frame 131, and a limiting member 134 located on both sides of the feeding tray 132 for cooperating with the feeding tray 132 to limit the bottom tray 94; the feeding hopper frame 131 is divided into a full tray area, a transfer area and an empty tray area. The two sides of the full tray area are equipped with telescopic fork plates 135. The fork plates 135 are located in the gap space between the bottom tray 94 and the upper tray 94. When the bottom tray 94 needs to be transferred, the feeding drive device 133 lifts up all the upper trays 94. The fork plates 135 extend and limit the upper trays 94 and raise and position the trays 94. The bottom tray 94 remains on the feeding pallet 132. The feeding pallet 132 is moved to the transfer area with the feeding drive device 133.

[0046] The feeding drive device 133 includes a linear module and a feeding cylinder mounted on the linear module, which lifts and passes through the feeding tray 132. The feeding cylinder pushes against the carrier tray 94 above the feeding tray 132, thereby realizing the movement and tray changing action of the carrier tray 94 one by one. The linear module is equipped with a bracket for supporting the feeding tray 132. Correspondingly, a set of brackets is set on the linear module, which has two feeding trays 132, so that the feeding tray 132 can continuously circulate in the full tray area, the transfer area and the empty tray area.

[0047] A side-push cylinder is installed at the bottom of the loading tray 132. The drive end of the side-push cylinder is connected to the limiting member 134. The limiting member 134 has a set of pressure blocks. The pressure blocks can extend and retract to engage with the side of the carrier tray 94 to limit its position and maintain the stability of the carrier tray 94 on the loading tray 132.

[0048] The loading pallet 132 supports a single tray 94 fully loaded with products 9 into the transfer area, where the product 9 is moved out of the tray 94 by the loading adsorption module 11. The loading pallet 132 then moves the empty tray 94 into the empty tray area. Anti-reverse rotation blocks are provided on both sides of the empty tray area. When the tray 94 is pushed upwards past the anti-reverse rotation blocks, it rests on the blocks and will not sink or fall. The loading pallet 132 can then be recycled to other areas.

[0049] The feeding mechanism 1 also includes a storage device 15, which includes a movable carrier module and a barcode scanner 151 located above the carrier module for detecting and identifying the products positioned inside. The carrier module includes a storage plate 152, a plurality of carrier blocks 153 located on the storage plate 152, and storage cylinders located on both sides of the storage plate 152 for adjusting the movement of the plurality of carrier blocks 153. The bottom of the storage plate 152 is mounted on the linear module to enable the adjustment and movement of the carrier block module. Several carrier blocks 153 have first slide rails mounted on the storage plate 152 at their bottoms. These carrier blocks 153 move along the first slide rails. When the storage cylinders on both sides push the carrier blocks 153, their positions are finely adjusted. This is to cooperate with the feeding and adsorption module 11 to correct the position of the products on the carrier blocks 153 before they enter the bending mechanism. This ensures that the feeding and adsorption module 11 can directly adsorb and transfer the products from the carrier blocks to the bending mechanism 2 without needing to readjust the product spacing, thus ensuring the accuracy of the product spacing distance when the products are fed into the bending mechanism 2. The top of the carrier blocks 153 is provided with several sets of first claws 154 for positioning the products 9. The sidewalls of the first claws 154 have sliding ramps. The first claws 154 enclose a positioning space for the product 9, used to position the chip area 91 and the lead wire area 92.

[0050] The feeding adsorption module 11 includes a movable feeding variable-pitch adsorption component 16 and a feeding fixed adsorption component 17. Both the feeding variable-pitch adsorption component 16 and the feeding fixed adsorption component 17 are mounted on the same linear module. The feeding variable-pitch adsorption component 16 includes multiple first suction nozzles arranged in groups at intervals. Each first suction nozzle is driven to move up and down by a cylinder. The multiple groups of first suction nozzles are driven by the cylinder to achieve a grouped variable-pitch opening and closing action. At the same time, the multiple groups of first suction nozzles are driven by a rotary motor to achieve a rotation function. The feeding fixed adsorption component 17 includes multiple second suction nozzles arranged in groups at intervals. Each second suction nozzle is driven to move up and down. The multiple groups of second suction nozzles are driven by a rotary motor to achieve a rotation function. The difference between the variable-pitch feeding adsorption assembly 16 and the fixed-pitch feeding adsorption assembly 17 is that the fixed-pitch feeding adsorption assembly 16 consists of groups of suction nozzles with a fixed interval. When the variable-pitch feeding adsorption assembly 16 transfers the product 9 from the feeding mechanism 1 out of the transfer area, the variable-pitch setting of the grouped products is completed, and the product 9 is positioned in the storage device 15 for barcode scanning. The fixed-pitch feeding adsorption assembly 17 then removes the product 9 from the storage device 15, maintaining a constant spacing between the grouped products 9. No further adjustment is needed before it can be placed into the bending mechanism 2 for the next process. If the barcode scanning detects an abnormality, the fixed-pitch feeding adsorption assembly 17 places the abnormal product 9 into the defective product unloading line 14.

[0051] The bending mechanism 2 includes a horizontally movable lower bending module 21 and a vertically movable upper bending module 22. The lower bending module 21 and the upper bending module 22 move and align respectively to achieve bending of the product 9. The bending mechanism 2 also includes a second slide rail for sliding the lower bending module 21 and a cylinder for driving the lower bending module 21 to move along the second slide rail. The lower bending module 21 includes a lower fixed plate 211, several sets of second claws 212 disposed on the top of the lower fixed plate 211, and a bending forming part 213 that penetrates the lower fixed plate 211 and is vertically movable. The bending forming part 213 serves to position the product during bending and also has a material-lifting function. The several second claws 212 enclose a positioning space for the product 9, and the bending forming part 213 is disposed within this positioning space. The surface of the bending forming part 213 has an arc-shaped protrusion 214 for forming the bending area 94 of the product 9. The bending mechanism 2 also includes a third slide rail for sliding the upper bending module 22 and a cylinder for driving the upper bending module 22 to move along the third slide rail. The upper bending module 22 includes an upper fixed plate 221 and several punches 222 that pass through the upper fixed plate 221 and are arranged for lifting and lowering. Each punch 222 is connected to a cylinder that drives its lifting and lowering movement. The punches 222 are positioned corresponding to the arc-shaped protrusions 214. The punches 222 cooperate with the arc-shaped protrusions 214 to act on the product 9, forming the bending area 94 of the product 9 through the stamping action. After the product 9 is stamped, the lower bending module 21 moves out of the bending station, and the bent forming part 213 pushes the product 9 out of the positioning space of the second chuck 212, which is beneficial for the robot arm adsorption module 12 to transport the product 9 to the next station.

[0052] The robotic arm adsorption module 12 includes a multi-axis robotic arm and several third suction nozzles driven by the multi-axis robotic arm; the third suction nozzles are connected to cylinders that drive them to rise and fall, and the third suction nozzles are set to adsorb products 9 in the second claw 212 on the lower fixed plate 211. The robotic arm adsorption module 12 adsorbs and transfers products 9 to the annular streamline testing mechanism 3.

[0053] The annular streamline testing mechanism 3 also includes several drive wheel assemblies disposed inside the circulating track 31. In this embodiment, the circulating track has a nearly elliptical structure. The drive wheel assembly includes a set of synchronized main drive wheels 311 and a set of driven drive wheels 312. The drive wheel assembly is fitted with a belt line 313 arranged along the inner circle of the circulating track 31. The main drive wheels 311 and the driven drive wheels 312 jointly drive the belt line 313 to circulate. Several mounting seats 314 for mounting the circulating carrier 5 are provided on the circulating track 31. The inner side of the mounting seat 314 is connected to the belt line 313. The belt line 313 drives the mounting seat 314 to move along the circulating track 31. A number of linkage assemblies 32 are provided on the outer periphery of the circulation track 31. The number of linkage assemblies 32 corresponds to the number of mounting seats 314. The linkage assemblies 32 limit the mounting seats 314 from the outer periphery of the circulation track 31. The linkage assembly 32 includes a connecting rod 321 that is driven to rotate and a set of limiting rods 322 fitted on the connecting rod 321. The arrangement direction of the connecting rod 321 is consistent with the arrangement direction of the circulation track 31. The limiting ends of the set of limiting rods 322 are located in different angular directions. Through rotation, the two limiting rods 322 in the linkage assembly 32 alternately limit the position of the mounting seat 314. The outer side of the mounting seat 314 is provided with a socket corresponding to the limiting rod 322. When the mounting seat 314 moves to the position along the circulation track 31, the limiting rod 322 rotates and positions itself in the socket, realizing the stable positioning of the mounting seat 314 and the circulation carrier 5. Because a set of limiting rods 322 are provided on the connecting rod 321, the limiting rods 322 on the adjacent connecting rod assemblies 32 are staggered and alternately positioned to position the mounting seats 314. The front mounting seat 314 is positioned by the front limiting rod 322 of a connecting rod assembly 32, while the rear mounting seat 314 is positioned by the rear limiting rod 322 of another connecting rod assembly 32. All mounting seats 314 on the circulating track 31 are positioned synchronously. The transition of the mounting seat 314 from positioning on one connecting rod assembly 32 to another connecting rod assembly 32 is compact, which can achieve stable positioning and fast turnover speed.

[0054] The circulating carrier 5 includes a download plate 51, a plurality of lower fixing blocks 52 arranged at intervals on the download plate 51, an upper fixing block 53 disposed on top of the lower fixing blocks 52, and an upper loading plate 54 disposed above the upper fixing block 53 and elastically connected to the download plate 51. The upper loading plate 54 is provided with a window 55 corresponding to avoid the upper fixing block 53. A first groove 56 for accommodating a first pressing block assembly and a second groove 57 for accommodating a second pressing block assembly are formed between the lower fixing blocks 52 and the upper fixing blocks 53. In this embodiment, a set of first pressing block assemblies and a second pressing block assembly are arranged at intervals in the lower fixing block 52 and the corresponding upper fixing block 53. The first pressure block assembly includes a rotatable push rod 58, a base block 581 that movably abuts against the end of the push rod 58, and a metal block 582 for supporting the product 9. In this embodiment, the metal block 582 is a copper block. When the product 9 is subjected to RF testing, the feed end of the product 9 contacts the copper block, which amplifies the vector characteristics of the product. The network analyzer displays a more obvious resonant point trough, making it easier to identify unqualified products 9. The base block 581 is exposed outside the first groove 56, and the upper fixing block 53 is provided with a connecting rib 531 for limiting the product 9. Specifically, it limits the separation position between the chip area 91 and the lead area 92 of the product 9, so as to effectively support the separation position and prevent damage caused by the fragility of the separation position. The base block 581 has an inner abutment surface 583 that slides against the top corner of the product 9. The product 9 is limited to abutting against the groove wall of the first groove 56. The bottom of the base block 581 is provided with an elastic self-rotating wheel 584 that abuts against the push rod 58. When the push rod 58 is subjected to external force, the push rod 58 moves at a certain angle to drive the elastic self-rotating wheel 584 to rotate, thereby pushing the base block 581 to slide against the product 9 for positioning. The product 9 is stably positioned under the action of the connecting rib 531 and the inner abutment surface 583. When the external force is removed from the push rod 58, the elastic self-rotating wheel 584 rotates back to release the rebound force, and the base block 581 slides back to its original position. The second pressing block assembly includes a pressing plate seat 532 detachably fixed to the upper fixing block 53, a self-weight pressing plate 533 axially connected to the pressing plate seat 532 and located above the second groove, and a self-weight block 534 connected to the self-weight pressing plate 533 and located in the second groove. The two ends of the self-weight pressing plate 533 extend to the top of the first groove. When the self-weight pressing plate 533 rotates to its position, its two ends press against the surface of the product 9 to achieve positioning. The self-weight block 534 has a sliding groove 535. The self-weight block 534 and the self-weight pressing plate 533 are connected to form a right angle. The connection position between the self-weight block 534 and the self-weight pressing plate 533 is provided with a rotating shaft of the pressing plate seat 532. When the self-weight block 534 is in a natural state and not subjected to external force, the self-weight block 534 is in a vertical state on the rotating shaft due to its own weight. The corresponding self-weight pressing plate 533 rotates around the rotating shaft and is in a horizontal state. The self-weight pressing plate 533 can be positioned and pressed against the product 9. When the self-weight block 534 is subjected to an external force, the self-weight block 534 rotates around the rotation axis, and the self-weight pressure plate 533 is lifted and detached from the product 9.

[0055] The circulating track 31 is divided into a loading area, a barcode scanning and identification area, an RF testing area, an ICT testing area, an AOI testing area, and a unloading area. Both the loading and unloading areas are equipped with side-push modules 59 located inside the circulating track 31. The first groove 56 and the second groove 57 respectively penetrate the side walls of the upper fixed block 53 and the lower fixed block 52. The side-push module 59 includes a first insert plate 591 corresponding to the first groove 56 and a second insert plate 592 corresponding to the second groove 57, which are horizontally movable. The first insert plate 591 movably abuts against the push rod 58, and the second insert plate 592 movably abuts against the self-weight block 534. Specifically, the second insert plate 592 is provided with a post 593, which is vertically positioned on the surface of the second insert plate 592 and movably positioned within the sliding slot 535. The first insert plate 591 acts on the push rod 58 to achieve the opening and closing clamping action of the base block 581; the second insert plate 592 acts on the self-weight block 534 to achieve the opening and closing clamping action of the self-weight pressure plate 533. When the product 9 is transferred to the loading area, the side push module 59 approaches the circulating carrier 5, the base block 581 and the self-weight pressure plate 533 are in the open state, the product 9 can be accurately placed into the upper fixing block 53, the side push module 59 is removed from the circulating carrier 5, and the product 9 is clamped and positioned; when the product 9 is transferred to the unloading area, the side push module 59 approaches the circulating carrier 5 again, the base block 581 and the self-weight pressure plate 533 are in the open state, and the product 9 can be unloaded.

[0056] The barcode scanning area is located on the outside of the circulation track 31. A barcode scanner is installed to detect the products 9 inside the circulation carrier 5. Information is identified for each product 9 placed in the circulation carrier 5, which is beneficial for accurate judgment in subsequent inspection operations.

[0057] The RF test module 6 is set in the RF test area. When the cyclic carrier 5 cycles to the RF test area, the RF test module 6 performs RF testing on the product 9. The RF test module 6 includes an RF detection board 61, an RF probe 62 located at the bottom of the RF detection board 61, and an RF detection head 63. The RF probe 62 is electrically connected to the metal block inside the cyclic carrier 5 by crimping. The RF detection head 63 is electrically connected to the lead position of the product 9 by crimping. The RF detection head 63 is externally connected to a network analyzer to realize the RF test data analysis of the product 9. The RF test module 6 also includes a first lifting plate 64 located below the circulation track 31 and with a lifting mechanism. The circulation carrier 5 also includes a mounting plate 511 located at the bottom of the download plate 51. The mounting plate 511 is detachably connected to the mounting base 314. Several guide posts 512 are provided between the download plate 51 and the upper plate 54, passing through the mounting plate 511. Several springs are provided between the download plate 51 and the upper plate 54. The first lifting plate 64 is connected to a cylinder. The first lifting plate 64 is driven to push the download plate 51 to move. The mounting plate 511 has space to avoid the first lifting plate 64. The bottom of the RF detection plate 61 is provided with several first guide heads 65 that are inserted into and positioned by the upper fixing block 53. When the first lifting plate 64 pushes the download plate 51, the first guide heads 65 are inserted into and engaged with the upper fixing block 53. The RF detection plate 61 and the upper plate 54 are abutted and floated in contact, thereby realizing the detection stroke of the RF probe 62 and the RF detection head 63.

[0058] The ICT test module 7 is located in the ICT test area. When the circulating carrier 5 cycles to the ICT test area, the ICT test module 7 performs ICT tests on the product 9. The in-circuit tester (ICT) uses test probes to contact the test points laid out on the PCB to detect open circuits, short circuits, and the soldering status of all components in the PCBA. It can be divided into open circuit testing, short circuit testing, resistance testing, capacitance testing, diode testing, transistor testing, MOSFET testing, IC pin testing, and other general and special component testing for faults such as missing components, incorrect components, parameter value deviations, solder joint bridging, and open / short circuits on the circuit board. The ICT test module 7 includes an ICT detection board 71, an ICT detection head 72 located at the bottom of the ICT detection board 71, and a second lifting plate 73 located below the circulating track 31 with a lifting mechanism. The second lifting plate 73 has the same structure and driving method as the first lifting plate 64. The bottom of the ICT testing board 71 is provided with several second guide heads 74 that plug into and position the upper fixing block 53. The cooperation method between the second guide head 74 and the circulating carrier 5 and the second lifting plate 73 is the same as the cooperation method between the first guide head 65 and the circulating carrier 5 and the first lifting plate 64. When the second lifting plate 73 pushes the download plate 51, the second guide head 74 plugs into and cooperates with the upper fixing block 53, and the ICT testing board 71 floats and adheres to the upper carrier plate 54, thereby realizing the detection stroke of the ICT testing head 72. The ICT testing head 72 is electrically connected to the lead wire of the product 9 by crimping. The external connection of the ICT testing head 72 is an automatic online tester to analyze and process the data detected by the ICT testing head.

[0059] The AOI test module 8 is set in the AOI test area. The AOI test module 8 includes several cameras 81 set above the circulating track 31. The automatic optical inspection equipment (AOI) automatically scans the PCB and collects images during automatic inspection. The tested solder joints are compared with qualified parameters in the database. After image processing, defects on the PCB are detected and displayed / marked on the display or automatic marker for repair personnel to fix.

[0060] The unloading mechanism 4 includes an unloading bin device 41 and a defective product rejection line 42. In this embodiment, the unloading bin device 41 and the loading bin device 13 have the same structure, which will not be described again. The unloading mechanism 4 also includes an unloading adsorption module 43 corresponding to the unloading area of ​​the circulation track 31. A temporary storage tray 44 for temporarily storing products is provided between the unloading bin device 41 and the circulation track 31. The unloading adsorption module 43 transports the product 9 away from the circulation carrier 5. Products 9 that meet the test requirements are directly placed into the temporary storage tray 44, while products 9 that do not meet the test requirements flow into the defective product rejection line 42. Above the unloading bin device 41 is a discharge adsorption module 45 that transfers the products 9 in the temporary storage tray 44 to the unloading bin device 41. Both the unloading adsorption module 43 and the discharge adsorption module 45 are adsorption nozzle connected to cylinder structures, realizing the parallel adsorption and transfer of multiple sets of products.

[0061] In this embodiment, a storage device 15 is provided between the feeding mechanism 1 and the bending mechanism 2. The storage device 15 serves as a device for controlling the spacing between products 9 before they enter the bending mechanism 2, allowing multiple products 9 to be pre-adjusted in terms of spacing. This facilitates the direct grouping and transport of products 9 to the bending mechanism 2 by the feeding adsorption module 11, thereby increasing the feeding speed. The bending mechanism 2 is equipped with a movable lower bending module 21. After the product 9 is bent, it can move away from the processing position along with the lower bending module 21. At the same time, the lower bending module 21 has a bending forming part 213, which is a bending forming part. The lifting mechanism also functions as a material ejector, enabling rapid detachment and unloading of product 9. This facilitates the direct, grouped transport of product 9 to the circulating carrier 5 by the robotic arm's adsorption module 12. The circulating carrier 5 features a cleverly designed first and second pressing block assembly. The first pressing block assembly provides side clamping and positioning of product 9, while the second pressing block assembly provides surface pressing and positioning of the grouped product 9. Combined with the side-pushing module 59, this allows for synchronous positioning of all products 9 within the circulating carrier 5. For small products like PCBAs, this provides high-precision synchronous positioning and effectively avoids areas requiring inspection of product 9. The components are arranged sequentially along the circulating carrier 5. The loading area, barcode scanning area, RF testing area, ICT testing area, AOI testing area, and unloading area are all included. After the product 9 undergoes bending, it does not need to be placed in other workstations or repositioned to the circulating carrier 5. Instead, the robotic arm adsorption module 12 directly transports the product 9 to the circulating carrier 5 for testing, avoiding the traditional linear workstation layout that requires multiple pause stations and robotic arms. The RF testing area, ICT testing area, and AOI testing area are centrally designed on the circulating track 31, enabling multi-functional testing of the product 9. This achieves a high level of automation. 1. In conjunction with the linkage assembly 32, it can accurately position the mounting base 314 of the cyclic carrier 5, and the cyclic carrier 5 flows into each test area in a compact rhythm; both the RF test module 6 and the ICT test module 7 adopt the detection method of pushing the cyclic carrier 5 from bottom to top. The cyclic carrier 5 is elastically positioned with the test module, which provides a buffer for the positioning of the cyclic carrier 5. The RF test module 6 and the ICT test module 7 can accurately perform performance tests on the product 9, while avoiding excessive wire movement and confusion caused by the movement of the test module; the AOI test module 8 performs visual inspection and judgment on the product 9 to ensure that the product 9 is finally qualified for unloading.

[0062] Example 2:

[0063] The fully automated feeding and bending test method includes the following steps:

[0064] Product 9 is automatically fed and arranged by feeding mechanism 1, with multiple products 9 arranged in groups at intervals;

[0065] The feeding and adsorption module 11 adsorbs the product 9 and enters the bending mechanism 2, where the bending mechanism 2 performs the bending process on the product 9. At the same time, the bending mechanism 2 has an unloading function.

[0066] The robotic arm adsorption module 12 adsorbs the product 9 and enters the annular streamline testing mechanism 3. The product 9 enters the feeding area and is positioned in the circulating carrier 5. The circulating carrier 5 has the function of clamping and positioning the product 9. Specifically, the product 9 is recessed in the circulating carrier 5 and positioned by the side of the product 9 and the surface of the pressed product. The product 9 is exposed at the position to be tested.

[0067] Product 9 follows the circular carrier 5 and travels in a circular loop. When product 9 enters the barcode scanning and identification area, the barcode scanner identifies each product.

[0068] Product 9 enters the RF test area, and RF test module 6 performs RF testing on product 9. The cyclic carrier 5 is driven from bottom to top to approach the RF detection position. Specifically, the RF detection head 63 in RF test module 6 is electrically connected to the lead position of product 9. The RF test is performed using a dedicated RF instrument, which is a network analyzer and is an existing device.

[0069] Product 9 enters the ICT testing area, and ICT testing module 7 performs ICT testing on the product. The cyclic carrier 5 is driven from bottom to top to approach the ICT detection position. Specifically, the ICT detection head 72 in ICT testing module 7 is electrically connected to the lead position of product 9. The product is then tested using a dedicated ICT instrument, which is an automatic online tester and is an existing device.

[0070] When the product enters the AOI testing area, the AOI testing module 8 performs AOI testing on the product 9. The camera 81 in the AOI testing module 8 performs visual testing on the product 9 from various angles.

[0071] Product 9 is circulated to the unloading area, where it is unloaded by the unloading adsorption module 43. Defective products are removed, and product 9 is then fed into the unloading hopper device 41.

[0072] In the description of this invention, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0073] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0074] While the embodiments disclosed in this invention are as described above, the content is merely for the purpose of facilitating understanding of the invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A full-automatic feeding and bending test device, comprising a feeding mechanism and a discharging mechanism, characterized in that: Further comprising a bending mechanism and a ring-shaped flow line test mechanism, the ring-shaped flow line test mechanism comprising a circulating track, a plurality of circulating carriers arranged on the circulating track for positioning products, an RF test module arranged along a circulating direction of the circulating track, an ICT test module, and an AOI test module; a feeding suction module for transferring the products is arranged between the feeding mechanism and the bending mechanism, a mechanical hand suction module for transferring the products is arranged between the bending mechanism and the ring-shaped flow line test mechanism, The circulating carrier comprises a lower plate, a plurality of spaced lower fixing blocks arranged on the lower plate, upper fixing blocks arranged on top of the lower fixing blocks, and upper loading plates arranged above the upper fixing blocks and elastically connected with the lower plate, the lower fixing blocks and corresponding upper fixing blocks are provided with spaced first pressing block assemblies and second pressing block assemblies; the lower fixing blocks and the upper fixing blocks form first groove bodies accommodating the first pressing block assemblies and second groove bodies accommodating the second pressing block assemblies; the first pressing block assembly comprises a base block for active pressing and positioning the side edges of the products, and the second pressing block assembly comprises a deadweight pressing plate for rotating and pressing the surfaces of a plurality of products; The first pressing block assembly comprises a rotating push rod and a metal block for supporting the products, the base block is movably arranged against the end of the push rod, the second pressing block assembly comprises a pressing plate seat fixedly arranged on the upper fixing block, a deadweight pressing plate rotatably arranged on the pressing plate seat and located above the second groove body, and a deadweight block connected with the deadweight pressing plate and located in the second groove body; The circulating track is divided into a feeding area, a code scanning and identifying area, an RF test area, an ICT test area, an AOI test area, and a discharging area; the feeding area and the discharging area are both provided with a side pushing module located on the inner side of the circulating track, the first groove body and the second groove body penetrate the side walls of the upper fixing blocks and the lower fixing blocks respectively, the side pushing module comprises a first insertion plate corresponding to the first groove body and a second insertion plate corresponding to the second groove body, the first insertion plate is movably arranged against the push rod, and the second insertion plate is movably arranged against the deadweight block; the first insertion plate acts on the push rod to realize the opening and closing clamping action of the base block, and the second insertion plate acts on the deadweight block to realize the opening and closing clamping action of the deadweight pressing plate.

2. The full-automatic loading and bending test device according to claim 1, characterized in that: The products comprise PCBs, chip regions, and lead regions arranged on the PCBs; the bending regions are arranged at the positions exceeding the chip regions and the lead regions. 3.The full-automatic loading and bending test device according to claim 1, characterized in that: The feeding mechanism comprises a feeding bin device and a defective product discharging line, the feeding bin device comprises a feeding bin frame, a plurality of loading trays for stacking a plurality of full loading products, a feeding driving device arranged at the bottom of the loading tray and driving the loading tray to move along the arrangement direction of the feeding bin frame, and limiting members arranged at both sides of the loading tray and telescopically arranged for limiting the bottommost loading tray in cooperation with the loading tray, the feeding bin frame is divided into a full tray area, a material transferring area, and an empty tray area, and the two sides of the full tray area are respectively provided with telescopically movable fork plates.

4. The full-automatic loading and bending test device according to claim 1, characterized in that: The feeding mechanism further comprises a storage device, the storage device comprises a movable loading block module and a code scanner arranged above the loading block module for detecting and identifying the products positioned in the loading block module.

5. The full-automatic loading and bending test device according to claim 2, characterized in that: The bending mechanism comprises a lower bending die set arranged horizontally and an upper bending die set arranged vertically; the lower bending die set comprises a lower fixed plate, a plurality of second clamping jaws arranged on the top of the lower fixed plate, and a bending forming part arranged vertically through the lower fixed plate; the plurality of second clamping jaws form a positioning space for a product, and the bending forming part is arranged in the positioning space; the surface of the bending forming part is provided with an arc-shaped protrusion corresponding to the bending area of the product; the upper bending die set comprises an upper fixed plate and a plurality of punches arranged vertically through the upper fixed plate; the punches are arranged corresponding to the positions of the arc-shaped protrusions.

6. The fully automatic loading and bending test device according to claim 1, characterized in that: The annular flow line test mechanism further comprises a plurality of drive wheel assemblies arranged inside the circulating track, each drive wheel assembly comprising a set of synchronous main drive wheels and a set of driven drive wheels, and the drive wheel assembly is sleeved with a belt line arranged along the inner ring of the circulating track; the circulating track is provided with a plurality of mounting seats for mounting circulating carriers; the inner side of the mounting seat is connected to the belt line.

7. The fully automatic loading and bending test device according to claim 6, characterized in that: The outer periphery of the circulating track is provided with a plurality of link assemblies, each link assembly comprising a link arranged to be driven to rotate and a set of limiting rods sleeved on the link; the outer side of the mounting seat is provided with a socket corresponding to the limiting rods. 8.The full-automatic loading and bending test method of the full-automatic loading and bending test device according to any one of claims 1-7, characterized in that, The method comprises the following steps: The products are automatically fed and arranged by the feeding mechanism, and a plurality of products are arranged in groups and at intervals; The feeding and adsorbing module adsorbs the products into the bending mechanism, and the products are bent by the bending mechanism; The mechanical hand adsorbing module adsorbs the products into the annular flow line test mechanism, the products are positioned in the circulating carriers in the feeding area, the products are retracted in the circulating carriers, and the products are positioned by positioning the side edges and the surfaces of the products; the positions of the products to be tested are exposed; The products follow the circulating carriers to circulate and travel, the products enter the code scanning and identifying area, and each product is identified by a code scanner; The products enter the RF test area, the RF test module tests the products, the circulating carriers are driven to approach the RF detection position from bottom to top, and the RF detection head in the RF test module is electrically connected to the lead position of the product for testing; The products enter the ICT test area, the ICT test module tests the products, the circulating carriers are driven to approach the ICT detection position from bottom to top, and the ICT detection head in the ICT test module is electrically connected to the lead position of the product for testing; The products enter the AOI test area, the AOI test module tests the products, and the camera in the AOI test module tests the products from different angles; The products circulate to the discharging area, are adsorbed by the discharging adsorbing module, and the defective products are removed, and the products are put into the discharging bin device.

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