A curing mold plastic sealing device for diode production

Abstract

The present invention discloses a curing mold encapsulation device for diode production, which relates to the technical field of diode production. In order to solve the problem of being unable to quickly demold a cured diode, the device specifically comprises a bracket, the top surface of which is provided with a cooling cavity, the interior of the cooling cavity being connected to a lower mold base via a height adjustment portion, an upper mold base being provided on one side edge of the lower mold base, and mold cavities being provided on opposite sides of the upper mold base and the lower mold base; an automatic ejection structure is provided inside the lower mold base, the automatic ejection structure comprising a bracket clamped to the bottom inner wall of the mold cavity, a cylinder fixedly connected to the bottom surface of the bracket, a push rod that forms a rotational fit with the bottom end of the cylinder via a rotating shaft, an inclined channel provided on the bottom inner wall of the lower mold base, and a side surface of the push rod near one end being rotationally connected to the inner wall of one side of the inclined channel, so that the cylinder forms a sliding fit with the inner wall of the lower mold base. The present invention quickly demolds cured objects, thereby improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of diode production, and in particular to a curing mold plastic packaging device for diode production. Background Art

[0002] A diode is a device with two electrodes that allows current to flow in only one direction. To manufacture a diode, a chip is soldered to a lead frame with a pre-set structure for each path. The frame, connected to the chip, is then placed into an injection mold. A fluid insulating material is then injected into the mold using an injection molding machine. Once the insulating material cools and takes shape, it is removed from the mold and cut into individual diodes.

[0003] Existing diode production curing mold encapsulation devices require manual demolding of the encapsulated and cured object, either directly or with the aid of external tools. This also suffers from the inability to quickly demold the cured object, resulting in low production efficiency. Based on this, we propose a diode production curing mold encapsulation device that enables rapid demolding. Summary of the Invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a curing mold plastic packaging device for diode production.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A curing mold encapsulation device for diode production includes a bracket, a cooling cavity is provided on the top surface of the bracket, a lower mold base is connected to the interior of the cooling cavity via a height adjustment portion, an upper mold base is provided on one side edge of the lower mold base, and mold cavities are provided on opposite sides of the upper mold base and the lower mold base;

[0007] An automatic ejection structure is provided inside the lower die base, and the automatic ejection structure includes a bracket clamped to the inner wall of the bottom of the mold cavity, a cylinder fixedly connected to the bottom surface of the bracket, a push rod rotatably engaged with the bottom end of the cylinder via a rotating shaft, and an inclined channel provided on the inner wall of the bottom of the lower die base, wherein a side surface of the push rod close to one end is rotatably connected to an inner wall of one side of the inclined channel, and the cylinder and the inner wall of the lower die base form a sliding fit;

[0008] A protrusion is fixedly connected to one side surface of the upper die seat.

[0009] Preferably, the top inner wall of the inclined channel and the top surface of the top rod are fixedly connected with a same elastic member.

[0010] Preferably, the outer walls of the top of the bracket on both sides of the cooling chamber are fixedly connected with a liquid collecting box and a coolant box respectively;

[0011] A liquid outlet is fixedly connected to the inner wall of the cooling chamber on one side close to the liquid collecting box, and the output end of the liquid outlet is connected to the input end of the liquid collecting box through a conduit;

[0012] An outlet is fixedly connected to the inner wall of one side of the cooling cavity close to the coolant box, and the input end of the outlet is connected to the output end of the coolant box through a conduit.

[0013] Preferably, an electric one-way valve A is fixedly connected to the circumferential outer wall of the liquid outlet.

[0014] Preferably, an electric one-way valve B is fixedly connected to an outer wall of one side of the outlet, and a baffle is provided at the output port of the outlet, and one side of the baffle is in the same vertical line as one side of the lower mold base.

[0015] Preferably, one side outer wall of the bracket is connected to a water pump via a support plate, and the input end and output end of the water pump are connected to the second delivery conduit and the first delivery conduit respectively;

[0016] The outer wall of the delivery conduit 1 is sheathed with a refrigeration box fixed on the outer wall of one side of the bracket.

[0017] Preferably, a glue injection port is fixedly connected to the top outer wall of the upper mold base, and an ejector pin is fixedly mounted on the circumferential inner wall of the glue injection port via a fixing bar.

[0018] Preferably, a liquid level sensor is fixedly connected to an inner wall of one side of the cooling chamber; and an alarm is fixedly connected to an outer wall of one side of the bracket.

[0019] Preferably, the height adjustment portion includes a supporting member fixedly connected to the inner wall of the bottom of the bracket, a guide groove provided on the inner wall of one side of the cooling chamber, and one side surface of the lower mold base is slidably connected to the inner wall of the guide groove through a slider.

[0020] Preferably, sealing strips are fixedly connected to opposite side surfaces of the upper die base and the lower die base.

[0021] The beneficial effects of the present invention are:

[0022] 1. The present invention sets an automatic ejection structure, etc., to lift up the upper mold base and turn it outward. When the protrusion on it abuts and slowly presses the part of the ejector pin protruding from the inclined channel, one end of the ejector pin is pressed in the inclined channel and tilted, causing the elastic member to stretch, while the other end of the ejector pin pushes up the cylinder, causing it to push the bracket upward, thereby ejecting the plastic-sealed diode body and pushing it out of the mold cavity, thereby completing the rapid demolding of the cured object. It is easy to use and improves production efficiency.

[0023] 2. The present invention continuously introduces cooling water into the cooling chamber through the cooling liquid box to cool the lower mold base and the upper mold base after injection molding. The liquid exceeding the water level will also be continuously discharged from the liquid outlet. While cooling the lower mold base and the upper mold base, it can ensure that the temperature of the liquid in the cooling chamber is always at a low temperature.

[0024] 3. In the present invention, when it is observed that the recovered liquid content in the liquid collection box is relatively high, the water pump is started to pump the recovered liquid into the coolant box through the delivery conduit 2 and the delivery conduit 1. During the period of pumping the recovered liquid through the delivery conduit 1, it is rapidly cooled by the peripheral refrigeration box and then sent to the coolant box for reuse, thereby achieving the purpose of saving water resources.

[0025] 4. In the present invention, when the injection port of the external injection molding machine coincides with the glue injection port, the push pin pushes up the injection port to ensure smooth flow of the glue and prevent the injection port of the external injection molding machine from being blocked; the sealing strip isolates the internal and external environments of the mold cavity to ensure the quality of plastic sealing.

[0026] 5. In the present invention, when the upper die base is closed, the protrusion moves away from one end of the ejector pin, and the elastic member resets to drive the ejector pin to restore a balanced state, so as to control the bracket to automatically engage with the die cavity of the lower die base. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a front cross-sectional structural diagram of a curing mold plastic packaging device for diode production proposed by the present invention;

[0028] Figure 2 This is a schematic top view of the structure of a curing mold plastic packaging device for diode production proposed by the present invention;

[0029] Figure 3 This is a schematic side cross-sectional structural diagram of a curing mold plastic packaging device for diode production proposed by the present invention;

[0030] Figure 4 This is a schematic diagram of the structure of the curing mold plastic packaging device for diode production proposed by the present invention, with the lower mold base and the upper mold base in the open state;

[0031] Figure 5 This is a schematic side view of the structure of the lower mold base and upper mold base of the curing mold plastic packaging device for diode production proposed by the present invention in the open state;

[0032] Figure 6 This is a schematic structural diagram of a state in which one end of an ejector pin of a curing mold plastic packaging device for diode production proposed by the present invention is placed on a supporting seat;

[0033] Figure 7 This is a schematic diagram of the circuit flow of a curing mold plastic packaging device for diode production proposed by the present invention.

[0034] In the figure: 1 bracket, 2 lower mold base, 3 upper mold base, 4 liquid level sensor, 5 cooling chamber, 6 liquid collecting box, 7 electric one-way valve A, 8 coolant box, 9 alarm, 10 water pump, 11 delivery conduit 1, 12 refrigeration box, 13 glue injection port, 14 electric one-way valve B, 15 stop door, 16 support member, 17 guide groove, 18 sealing strip, 19 bracket, 20 mold cavity, 21 inclined channel, 22 ejector pin, 23 bump, 24 ejector pin, 25 cylinder, 26 elastic member. DETAILED DESCRIPTION

[0035] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0036] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0037] Example 1:

[0038] A curing mold plastic sealing device for diode production, such as Figure 1-3 and Figure 7 As shown, it includes a bracket 1, a cooling cavity 5 is formed on the top surface of the bracket 1, the interior of the cooling cavity 5 is connected to the lower die base 2 through a height adjustment portion, and an upper die base 3 is hingedly connected to one side edge of the lower die base 2; a liquid collecting box 6 and a coolant box 8 are respectively fixed to the outer wall of the top of the bracket 1 on both sides of the cooling cavity 5 by bolts;

[0039] Preferably, the surfaces of the lower die base 2 and the upper die base 3 are made of heat-conducting material.

[0040] An outlet is fixed to the inner wall of the cooling chamber 5 on one side near the coolant box 8 by bolts, and the input end of the outlet is connected to the output end of the coolant box 8 through a conduit, and an electric one-way valve B14 is fixed to the outer wall of one side of the outlet by bolts, and the output port of the outlet is hinged with a baffle 15, and one side of the baffle 15 is in the same vertical line as one side of the lower mold base 2; the lower mold base 2 and its upper structure are adjusted to move up a certain height by the height adjustment part, so that one side of the lower mold base 2 is away from the baffle 15 and no longer blocks it, and then the electric one-way valve B14 is controlled to open, and the cooling water introduced from the coolant box 8 will automatically flush the baffle 15 and enter the cooling chamber 5, so as to cool the lower mold base 2 and the upper mold base 3 after glue filling, thereby achieving the purpose of improving the rapid completion of diode mold packaging.

[0041] Furthermore, a liquid level sensor 4 for detecting changes in the water level in the cooling chamber 5 is fixed by bolts on one side inner wall of the cooling chamber 5, and the model of the liquid level sensor 4 is LK1022; an alarm 9 is fixed by bolts on one side outer wall of the bracket 1, and the alarm 9 and the liquid level sensor 4 are respectively communicated with the control module; the liquid level sensor 4 detects changes in the liquid level in the cooling chamber 5 in real time, and transmits a signal to the control module when the set liquid level value is reached, which controls the alarm 9 to start so as to prompt people.

[0042] A liquid outlet is fixed to the inner wall of the cooling chamber 5 on one side near the liquid collecting box 6 by bolts, and the output end of the liquid outlet is connected to the input end of the liquid collecting box 6 by a conduit, and an electric one-way valve A7 is fixed to the circumferential outer wall of the liquid outlet by bolts, and the electric one-way valve A7 is communicated with the control module; in order to prevent the liquid from overflowing, the control module controls the electric one-way valve A7 to open so as to lead the liquid in the cooling chamber 5 into the liquid collecting box 6, that is, cooling water is continuously introduced into the cooling chamber 5 through the coolant box 8 to cool the lower mold base 2 and the upper mold base 3 after injection molding, and the liquid exceeding the water level will also be continuously discharged from the liquid outlet. While cooling the lower mold base 2 and the upper mold base 3, it can be ensured that the liquid temperature in the cooling chamber 5 is always at a low temperature.

[0043] Furthermore, a water pump 10 is connected to the outer wall of one side of the bracket 1 through a support plate, and the input and output ends of the water pump 10 are respectively connected to a delivery conduit 2 and a delivery conduit 11, and the outer wall of the delivery conduit 11 is provided with a refrigeration box 12 fixed on the outer wall of one side of the bracket 1; when it is observed that the recovered liquid content in the liquid collection box 6 is relatively large, the water pump 10 is started to pump the recovered liquid into the coolant box 8 through the delivery conduit 2 and the delivery conduit 11. During the period of pumping the recovered liquid through the delivery conduit 11, it is affected by the outer refrigeration box 12 for rapid cooling and then sent to the coolant box 8 for reuse, thereby achieving the purpose of saving water resources.

[0044] Preferably, the refrigeration box 12 can be physically refrigerated, such as filled with ice cubes, etc., which is not limited here.

[0045] Furthermore, the height adjustment portion includes a supporting member 16 fixed to the inner wall of the bottom of the bracket 1 by bolts, a guide groove 17 opened on the inner wall of one side of the cooling chamber 5, and one side surface of the lower mold base 2 is slidably connected to the inner wall of the guide groove 17 through a slider;

[0046] Preferably, the supporting member 16 can be a hydraulic column, a cylinder, etc.; starting the supporting member 16 pushes up the lower die base 2 and its upper structure to move in the guide groove 17, thereby changing the use height of the lower die base 2.

[0047] In order to prevent the injection port of the external injection molding machine from being blocked; Figure 2 and Figure 5As shown, the top outer wall of the upper mold base 3 is fixed with a glue injection port 13 by bolts, and the circumferential inner wall of the glue injection port 13 is fixed with an ejector pin 24 by a fixing strip; when the injection port of the external injection molding machine coincides with the glue injection port 13, the ejector pin 24 pushes up the injection port to ensure smooth flow of the glue.

[0048] like Figure 4 As shown, a mold cavity 20 is provided on the opposite side of the upper mold base 3 and the lower mold base 2; a sealing strip 18 is welded on the opposite side of the upper mold base 3 and the lower mold base 2 to prevent the flow of gas inside and outside the mold cavity 20, so that the internal and external environments of the mold cavity 20 are isolated to ensure the quality of plastic sealing.

[0049] When this embodiment is in use, the lower mold base 2 and its upper structure are first adjusted to a certain height through the height adjustment part, so that one side of the lower mold base 2 is away from the baffle 15 and no longer blocks it; the diode body with the chip and the like fixed thereon is placed into the mold cavity 20, and then the lower mold base 2 and the upper mold base 3 are controlled to be closed, and then an external injection molding machine is used to perform injection molding into the mold cavity 20; then the electric one-way valve B14 is controlled to open, and the cooling water introduced from the coolant box 8 will automatically flush the baffle 15 and enter the cooling chamber 5, so as to cool the lower mold base 2 and the upper mold base 3 after the glue filling.

[0050] Liquid level sensor 4 monitors the liquid level in cooling chamber 5 in real time. When the set level is reached, it transmits a signal to the control module, which opens alarm 9 and electric one-way valve A7, alerting users and draining the liquid from cooling chamber 5 through the liquid outlet into liquid collection box 6. When a high level of recovered liquid is observed in liquid collection box 6, water pump 10 is activated to pump the recovered liquid through delivery conduits 2 and 11 into coolant box 8. While being pumped through delivery conduit 11, the recovered liquid is rapidly cooled by the surrounding refrigeration box 12 before being returned to coolant box 8 for reuse.

[0051] Example 2:

[0052] A curing mold plastic sealing device for diode production, such as Figure 4-6 As shown, in order to eject the encapsulated diode body, this embodiment makes the following improvements on the basis of embodiment 1: an automatic ejection structure is provided inside the lower mold base 2, and the automatic ejection structure includes a bracket 19 clamped on the bottom inner wall of the mold cavity 20, a cylinder 25 welded to the bottom surface of the bracket 19, a push rod 22 that is rotatably matched with the bottom end of the cylinder 25 through a rotating shaft, and an inclined channel 21 is provided on the bottom inner wall of the lower mold base 2, and a side surface of the push rod 22 near one end is rotatably connected to one side inner wall of the inclined channel 21, and the cylinder 25 forms a sliding fit with the inner wall of the lower mold base 2, which is used to limit the movement of the bracket 19 up and down;

[0053] Furthermore, a protrusion 23 is fixed to one side of the upper mold base 3 by a bolt; after the injection molding is completed, the upper mold base 3 is opened to turn it outward, and when the protrusion 23 thereon abuts and slowly presses the portion of the ejector pin 22 protruding from the inclined channel 21, one end of the ejector pin 22 is pressed in the inclined channel 21 and tilted, causing the elastic member 26 to stretch, and the other end of the ejector pin 22 that is tilted pushes up the cylinder 25, causing it to push the bracket 19 upward, as shown in FIG. Figure 6 As shown, the encapsulated diode body is ejected and pushed out from the mold cavity 20, thereby completing the automatic ejection action, which is convenient to use; conversely, when the upper mold base 3 is closed, the protrusion 23 is away from one end of the ejector pin 22, and the elastic member 26 is reset to drive the ejector pin 22 to restore the balance state, so as to control the bracket 19 to automatically engage with the mold cavity 20 of the lower mold base 2.

[0054] Furthermore, the top inner wall of the inclined channel 21 and the top surface of the top rod 22 are welded with the same elastic member 26, which is preferably a spring, a buffer, etc.;

[0055] After the injection molding is completed in this embodiment, the lower mold base 2 and its upper structure are first adjusted by the height adjustment part to move up to the inclined channel 21 above the wrapping range of the cooling chamber 5, and then the upper mold base 3 is opened to turn it outward. When the protrusion 23 thereon abuts and slowly presses the part of the ejector pin 22 protruding from the inclined channel 21, one end of the ejector pin 22 is pressed in the inclined channel 21 and tilted, causing the elastic member 26 to stretch, and the other end of the ejector pin 22 pushes up the cylinder 25, causing it to push the bracket 19 upward. Figure 6 As shown, the encapsulated diode body is ejected and pushed out of the mold cavity 20; when the upper mold base 3 is closed, the protrusion 23 moves away from one end of the ejector pin 22, and the elastic member 26 is reset to drive the ejector pin 22 to restore the balance state, so as to control the bracket 19 to automatically engage with the mold cavity 20 of the lower mold base 2.

[0056] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A curing mold plastic packaging device for diode production, comprising a bracket (1), characterized in that: A cooling cavity (5) is provided on the top surface of the bracket (1), the interior of the cooling cavity (5) is connected to a lower die base (2) via a height adjustment portion, an upper die base (3) is provided on one side edge of the lower die base (2), and mold cavities (20) are provided on opposite sides of the upper die base (3) and the lower die base (2); An automatic ejection structure is provided inside the lower die base (2), and the automatic ejection structure comprises a bracket (19) clamped on the inner wall of the bottom of the die cavity (20), a cylinder (25) fixedly connected to the bottom surface of the bracket (19), a push rod (22) which is rotatably matched with the bottom end of the cylinder (25) through a rotating shaft, and an inclined channel (21) provided on the inner wall of the bottom of the lower die base (2), wherein a side surface of the push rod (22) close to one end is rotatably connected to an inner wall of one side of the inclined channel (21), and the cylinder (25) forms a sliding fit with the inner wall of the lower die base (2); A convex block (23) is fixedly connected to one side of the upper die base (3); The upper die base (3) is opened to turn it outward, and the protrusion (23) thereon abuts and slowly presses the portion of the ejector rod (22) protruding from the inclined channel (21).

2. The curing mold plastic sealing device for diode production according to claim 1, characterized in that: The top inner wall of the inclined channel (21) and the top surface of the top rod (22) are fixedly connected with a same elastic member (26).

3. The curing mold plastic sealing device for diode production according to claim 1, characterized in that: The top outer walls of the bracket (1) located on both sides of the cooling cavity (5) are respectively fixedly connected with a liquid collecting box (6) and a cooling liquid box (8); A liquid outlet is fixedly connected to the inner wall of one side of the cooling chamber (5) close to the liquid collecting box (6), and the output end of the liquid outlet is connected to the input end of the liquid collecting box (6) through a conduit; An outlet is fixedly connected to the inner wall of one side of the cooling cavity (5) close to the coolant box (8), and the input end of the outlet is connected to the output end of the coolant box (8) through a conduit.

4. The curing mold plastic sealing device for diode production according to claim 3, characterized in that: An electric one-way valve A (7) is fixedly connected to the circumferential outer wall of the liquid outlet.

5. The curing mold plastic sealing device for diode production according to claim 4, characterized in that: An electric one-way valve B (14) is fixedly connected to an outer wall of one side of the outlet, and a baffle (15) is provided at the output port of the outlet, and one side of the baffle (15) is in the same vertical line as one side of the lower die base (2).

6. The curing mold plastic sealing device for diode production according to claim 5, characterized in that: One side outer wall of the bracket (1) is connected to a water pump (10) via a support plate, and the input end and output end of the water pump (10) are respectively connected to a second delivery conduit and a first delivery conduit (11); The outer wall of the delivery conduit (11) is provided with a refrigeration box (12) fixed on the outer wall of one side of the bracket (1).

7. The curing mold plastic packaging device for diode production according to claim 1, characterized in that: The top outer wall of the upper die seat (3) is fixedly connected with a glue injection port (13), and a thimble (24) is fixedly installed on the circumferential inner wall of the glue injection port (13) via a fixing strip.

8. The curing mold plastic sealing device for diode production according to claim 1, characterized in that: A liquid level sensor (4) is fixedly connected to an inner wall of one side of the cooling chamber (5); and an alarm (9) is fixedly connected to an outer wall of one side of the bracket (1).

9. The curing mold plastic packaging device for diode production according to claim 1, characterized in that: The height adjustment portion comprises a supporting member (16) fixedly connected to the inner wall of the bottom of the bracket (1), a guide groove (17) arranged on the inner wall of one side of the cooling chamber (5), and a side surface of the lower mold base (2) is slidably connected to the inner wall of the guide groove (17) through a slider.

10. The curing mold plastic packaging device for diode production according to claim 8, characterized in that: The upper die base (3) and the lower die base (2) are both fixedly connected to opposite side surfaces with sealing strips (18).

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