A top surface putty robot puts pressure on the structure and method of adjusting pressure

Abstract

The application discloses a top-surface putty robot putty smearing pressure regulating structure and a pressure regulating method, belongs to the technical field of building decoration putty scraping and batching, and is characterized in that a pressure regulating structure is arranged between a scraper structure and a putty spraying structure, the pressure regulating structure comprises a guide column fixedly limited with a top plate of the putty spraying structure and a bottom plate of the scraper structure, a spring is nested on the surface of the guide column, and the two ends of the spring are respectively abutted against the top plate of the putty spraying structure and the bottom plate of the scraper structure, and a laser module is vertically fixed at the bottom of the pressure regulating structure. When the putty is smeared, the spring of the pressure regulating structure can buffer the scraper structure and the putty spraying structure, direct hard contact between the scraper structure and the working surface is avoided, the working surface is prevented from being scratched, meanwhile, the pressure between the scraper structure and the working surface can be adjusted according to the deformation of the spring, the pressure between the scraper structure and the working surface is consistent, the situation that the top surface is deviated or the ceiling is excessively pressed during scraping and coating is avoided, and the safety of work is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of building decoration putty scraping and batching, and particularly relates to a top surface puttying robot puttying pressure regulating structure and a pressure regulating method. BACKGROUND

[0002] In the process of top surface putty spraying and scraping by a wall surface top surface puttying robot, an inclined ceiling is often encountered. If the same height is maintained for putty scraping, the scraper will gradually deviate from the top surface or excessively extrude the ceiling due to the inclination of the ceiling, which greatly affects the putty scraping effect and also poses a certain risk. Therefore, the pressure of the scraper needs to be detected and regulated in real time during putty scraping to ensure the consistency of the putty scraping pressure and thus the consistency of the operation effect and the safety of the operation. SUMMARY

[0003] The present application aims to provide a top surface puttying robot puttying pressure regulating structure and a pressure regulating method to solve the technical problem of inconsistent scraper pressure caused by the inclination of the top surface in the prior art.

[0004] The present application provides a top surface puttying robot puttying pressure regulating structure, which is used in a top surface putty construction robot. The robot comprises an AGV chassis for ground walking, a lifting structure for height lifting, a horizontal translocation structure for horizontal translocation, a scraper structure for putty scraping, and a putty spraying structure for putty spraying. A pressure regulating structure is arranged between the scraper structure and the putty spraying structure. The pressure regulating structure comprises a guide column fixedly limited with the top plate of the putty spraying structure and the bottom plate of the scraper structure. A spring is nested on the surface of the guide column, and the two ends of the spring are respectively in contact with the top plate of the putty spraying structure and the bottom plate of the scraper structure. A laser module is vertically fixed at the bottom of the pressure regulating structure.

[0005] A top surface puttying robot puttying pressure regulating method is provided, which is used in a top surface putty construction robot additionally provided with a pressure regulating structure. The method comprises the following steps:

[0006] Sp1: obtaining a pressure maintaining value y. Before the robot starts scraping putty each time, i.e., when the scraper structure is not in contact with the ceiling, the current distance value x1 from the baffle is recorded and saved by the laser module. According to the required pressure F for scraping putty, the required spring deformation amount Δx is calculated according to Hooke's law: F=kΔx, and thus y=x1-Δx.

[0007] Sp2: origin pressure regulation: the lifting structure is lifted to the working surface, after waiting for the work to be ready, according to the distance value x2 between the laser and the bottom plate of the scraping plate structure, and compared with the pressure holding value y, if the difference value offset between the distance value x2 and the holding value y is within the laser accuracy range, the origin pressure regulation is completed; otherwise, according to the value of offset, the lifting structure is controlled to lift and lower to regulate the pressure;

[0008] Sp3: horizontal transverse movement pressure regulation: after the origin pressure regulation is completed, the horizontal transverse movement structure works to drive the scraping plate structure to perform horizontal putty scraping work, and the distance value x3 between the laser module and the bottom plate of the scraping plate structure is monitored in real time during the work, and the difference value offset between the distance value x3 and the pressure holding value y is monitored, when the difference value offset is too large or too small, the lifting structure is controlled to lift and lower to maintain the fit pressure of the scraping plate structure and the working surface of the ceiling top, and after the horizontal transverse movement structure moves to the end, the pressure regulation is completed, and the lifting structure is lowered, thereby preparing for the second putty scraping cycle.

[0009] Further, in the method, serial port TTL technology is used to interact with the laser module to collect the laser distance value.

[0010] Further, in the method, the laser module accuracy used is ±1.5mm, and the data response time is 5Hz.

[0011] Further, in the method, the main control board sends control instructions to the servo driver through CAN communication, and the servo motor drives the profile of the lifting structure to move up and down.

[0012] Further, the main control board controls the horizontal transverse motor in the horizontal transverse movement structure through PWM to drive the synchronous belt to drag the scraping plate structure, thereby realizing the horizontal putty scraping movement.

[0013] Compared with the prior art, the beneficial effects of the present application are as follows:

[0014] Firstly, in the prior art, the wall surface top putty scraping robot often encounters inclined ceilings during the top putty spraying and scraping work, if the same height is maintained for putty scraping, the scraping plate will gradually deviate from the top surface or excessively press the ceiling along with the inclination of the ceiling, which will greatly affect the putty scraping effect and also pose a certain risk, in view of such problems, the present application designs a putty scraping pressure regulating structure, which is arranged between the scraping plate structure and the putty spraying structure, when the putty is scraped, the spring in the pressure regulating structure buffers the scraping plate structure and the putty spraying structure, avoiding the direct hard contact between the scraping plate structure and the working surface, preventing the scraping plate structure from scratching the working surface, and also adjusting the pressure of the scraping plate structure and the working surface according to the deformation of the spring, so that the pressure of the scraping plate structure and the working surface is consistent, and the deviation from the top surface or excessive pressing of the ceiling during scraping is avoided, and the safety of the work is improved.

[0015] Secondly, in the present application, the relationship between external force and spring deformation F=k△x is mainly used. The same spring is used, and the elastic coefficient k is consistent. Therefore, as long as the spring deformation △x is obtained, the size of the pressure F can be obtained. In the present method, the laser module and the bottom plate of the scraper structure are used to detect the change value of the spring deformation △x, so as to realize the adjustment of the pressure of the scraper structure. When the scraper has no external force, the laser is on the bottom plate of the scraper structure compressed by the four springs, and the distance position x1 is on the bottom plate of the scraper structure. When the external force is applied to the scraper structure, the four springs are compressed to produce deformation, and the bottom plate of the scraper structure is pressed down. At this time, the distance between the bottom plate of the scraper structure and the laser module is x2, so that △x=x1-x2. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the specific embodiments or prior art of the present application, the drawings needed in the specific embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0017] Figure 1 Flowchart of the present application;

[0018] Figure 2 Structure diagram of the top putty construction robot in the present application;

[0019] Figure 3 Structure diagram of the natural state of the pressure regulating structure in the present application;

[0020] Figure 4 Structure diagram of the pressure regulating structure after external force is applied in the present application;

[0021] Figure 5 Effect diagram of the origin pressure regulation in the present application.

[0022] Reference signs:

[0023] 1, guide column; 2, spring; 3, laser module; 4, pressure regulating structure; 5, scraper structure; 6, putty spraying structure; 7, AGV chassis; 8, lifting structure; 9, horizontal transverse structure. DETAILED DESCRIPTION

[0024] The technical solutions of the present application will be described below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all embodiments.

[0025] The components of the embodiments of the application described and illustrated herein can be arranged and designed in a wide variety of different configurations. Therefore, the following detailed description of the embodiments of the application, as provided in the accompanying drawings, is not intended to limit the scope of the application, but is merely representative of selected embodiments of the application.

[0026] All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present application without creative effort, fall within the scope of the present application.

[0027] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] Embodiment 1:

[0030] The following will be described in conjunction with Figures 2 to 5As shown, this embodiment of the invention provides a pressure regulating structure for a top surface putty application robot. The pressure regulating structure 4 is used for a top surface putty application robot. The robot includes an AGV chassis 7 for ground walking, a lifting structure 8 for height adjustment, a horizontal lateral movement structure 9 for horizontal movement, a scraper structure 5 for putty scraping, and a putty spraying structure 6 for putty spraying. A pressure regulating structure 4 is provided between the scraper structure 5 and the putty spraying structure 6. The pressure regulating structure 4 includes a guide post 1 that is fixed to the top plate of the putty spraying structure 6 and the bottom plate of the scraper structure 5. A spring 2 is nested on the surface of the guide post 1, and the two ends of the spring 2 abut against the top plate of the putty spraying structure 6 and the bottom plate of the scraper structure 5, respectively. A laser module 3 is vertically fixed at the bottom of the pressure regulating structure 4. When wall and ceiling putty application robots are spraying and scraping putty on ceilings, they often encounter sloping ceilings. If the putty is applied at the same height, the scraper will gradually deviate from the ceiling or excessively press against it, greatly affecting the putty application effect and posing a certain degree of danger. To address this problem, this invention designs a putty application pressure regulating structure 4. The pressure regulating structure 4 is set between the scraper structure 5 and the putty spraying structure 6. During putty application, the spring 2 in the pressure regulating structure 4 buffers the scraper structure 5 and the putty spraying structure 6, avoiding direct hard contact between the scraper structure 5 and the work surface, preventing scratches. At the same time, the pressure between the scraper structure 5 and the work surface can be adjusted according to the deformation of the spring 2, ensuring that the pressure of the scraper structure 5 and the work surface is consistent, preventing deviation from the ceiling or excessive pressure during application, and improving the safety of the operation.

[0031] Example 2:

[0032] like Figure 1 As shown, this real-time example provides a method for adjusting the pressure of a top surface putty application robot. This pressure adjustment method is used for a top surface putty application robot equipped with a pressure adjustment structure 4, and includes the following steps:

[0033] Sp1: Obtain pressure holding value y: Before the robot starts scraping putty each time, that is, when the scraper structure 5 is not in contact with the ceiling, the laser module 3 emits a laser to record and save the current distance value x1 between the robot and the baffle. Based on the pressure F required for scraping putty, according to Hooke's Law: F=k△x, the required deformation △x of the spring 2 is calculated, and thus y=x1-△x is calculated.

[0034] Sp2: Origin pressure adjustment: The lifting structure 8 is raised to the working surface and waits for the work to be ready. The distance value x2 between the laser and the bottom plate of the scraper structure 5 is compared with the pressure holding value y. If the difference △offset between the distance value x2 and the holding value y is within the laser accuracy range, the origin pressure adjustment ends; otherwise, the lifting structure 8 is controlled to lift and adjust the pressure according to the △offset value.

[0035] Sp3: Horizontal Shift Pressure Adjustment: After the pressure adjustment at the origin is completed, the horizontal shift structure 9 works, driving the scraper structure 5 to perform horizontal putty application. During the operation, the distance value x3 between the laser module 3 and the base plate of the scraper structure 5, and the difference △offset between the distance value x3 and the pressure holding value y are monitored in real time. When △offset is too large or too small, the lifting structure 8 is controlled to lift and lower to maintain the contact pressure between the scraper structure 5 and the working surface of the ceiling. After the horizontal shift structure 9 moves to the end point, the pressure adjustment ends, and the lifting structure 8 descends, thus preparing for the second putty application cycle.

[0036] In this method, the relationship between the external force and the deformation of spring 2, F = kΔx, is mainly utilized. Since the elastic coefficient k is consistent when using the same spring 2, the magnitude of the pressure F can be obtained by obtaining the deformation Δx of spring 2. In this method, the laser module 3 and the bottom plate of the scraper structure 5 are used to detect the change value of the deformation Δx of spring 2, thereby realizing the adjustment of the pressure of scraper structure 5. When there is no external force on the scraper, the laser hits the bottom plate of scraper structure 5, which is compressed by the four springs 2, at a distance of x1. When an external force is applied to scraper structure 5, the four springs 2 are compressed and deformed, and the bottom plate of scraper structure 5 is pressed down. At this time, the distance between the bottom plate of scraper structure 5 and laser module 3 is x2, so Δx = x1 - x2.

[0037] Specifically, in this method, serial TTL technology is used to exchange data with laser module 3 to collect laser distance values.

[0038] Specifically, in this method, the laser module 3 used has an accuracy of ±1.5mm and a data response time of 5Hz.

[0039] Specifically, in this method, the main control board sends control commands to the servo driver via CAN communication, and the servo motor drives the profile of the lifting structure 8 to move up and down.

[0040] Specifically, the main control board controls the rotation of the horizontal traverse motor in the horizontal traverse structure 9 via PWM, which drives the synchronous belt to drag the scraper structure 5, thereby realizing the horizontal putty scraping movement.

[0041] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A pressure regulating structure for a top surface putty application robot, the pressure regulating structure (4) being used for a top surface putty application robot, the robot comprising an AGV chassis (7) for ground walking, a lifting structure (8) for height adjustment, a horizontal lateral movement structure (9) for horizontal movement, a scraper structure (5) for putty application, and a putty spraying structure (6) for putty spraying, characterized in that: A pressure regulating structure (4) is provided between the scraper structure (5) and the putty spraying structure (6). The pressure regulating structure (4) includes a guide post (1) that is fixed to the top plate of the putty spraying structure (6) and the bottom plate of the scraper structure (5). A spring (2) is nested on the surface of the guide post (1), and the two ends of the spring (2) abut against the top plate of the putty spraying structure (6) and the bottom plate of the scraper structure (5), respectively. A laser module (3) is vertically fixed at the bottom of the pressure regulating structure (4).

2. A method for adjusting the pressure of a top surface putty application robot, the method being based on the pressure adjusting structure of the top surface putty application robot as described in claim 1, the method being used for a top surface putty application robot equipped with a pressure adjusting structure (4), characterized in that: Includes the following steps: Sp1: Obtain pressure holding value y: Before the robot starts scraping putty each time, that is, when the scraper structure (5) is not in contact with the ceiling, the laser module (3) emits a laser to record and save the current distance value x1 between the laser module (3) and the bottom plate of the scraper structure (5). Based on the pressure F required for scraping putty, according to Hooke's law: F=k△x, the required deformation △x of the spring (2) is calculated, and thus y=x1-△x is calculated. Sp2: Origin pressure adjustment: The lifting structure (8) is raised to the working surface. After the work is ready, the distance value x2 between the laser and the bottom plate of the scraper structure (5) is compared with the pressure holding value y. If the difference △offset between the distance value x2 and the holding value y is within the laser accuracy range, the origin pressure adjustment ends; otherwise, the lifting structure (8) is controlled to lift and adjust the pressure according to the △offset value. Sp3: Horizontal Shift Pressure Adjustment: After the pressure adjustment at the origin is completed, the horizontal shift structure (9) works, driving the scraper structure (5) to perform horizontal putty scraping operation. During the operation, the distance value x3 between the laser module (3) and the bottom plate of the scraper structure (5) and the difference △offset between them and the pressure holding value y are monitored in real time. When △offset is too large or too small, the lifting structure (8) is controlled to lift and lower to maintain the contact pressure between the scraper structure (5) and the working surface of the ceiling. After the horizontal shift structure (9) moves to the end point, the pressure adjustment ends and the lifting structure (8) descends, thus preparing for the second putty scraping cycle.

3. The method for adjusting the pressure of a top surface putty application robot according to claim 2, characterized in that: In this method, serial port TTL technology is used to interact with the laser module (3) to collect laser distance values.

4. The method for adjusting the pressure of a top surface putty application robot according to claim 2, characterized in that: In this method, the laser module (3) used has an accuracy of ±1.5mm and a data response time of 5Hz.

5. The method for adjusting the pressure of a top surface putty application robot according to claim 2, characterized in that: In this method, the main control board sends control commands to the servo driver via CAN communication, and the servo motor drives the profile of the lifting structure (8) to move up and down.

6. The method for adjusting the pressure of a top surface putty application robot according to claim 2, characterized in that: The main control board controls the rotation of the horizontal traverse motor in the horizontal traverse structure (9) through PWM, which drives the synchronous belt to drag the scraper structure (5), thereby realizing the horizontal putty scraping movement.

Images