Control method and device for load system of semiconductor temperature control equipment

Abstract

The application provides a control method and device for a load system of a semiconductor temperature control device, and the method comprises the following steps: collecting temperature data and flow data of circulating liquid of a machine table in a belt load state; determining heat values of a heater in the load system at different sampling moments according to the temperature data and the flow data; determining duty cycles of the heater at different sampling moments according to the heat values of the heater at different sampling moments and heat parameters of the heater; and controlling on-off of the heater according to the duty cycles of the heater at different sampling moments. The application determines the heat values of the heater by using the collected temperature data and flow data, then determines the duty cycles by using the heat values and the power of the heater, controls the on-off of the heater by setting the duty cycles of the heater, realizes consistency of an outlet temperature of the heater and a collected return temperature curve, and makes the semiconductor temperature control device better meet process requirements of a main device.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a control method and apparatus for a load device of a semiconductor temperature control equipment. Background Technology

[0002] Semiconductor temperature control equipment is used to provide a stable flow rate and temperature of circulating liquid in integrated circuit manufacturing processes. During the prototype testing phase, it is necessary to simulate the field load curve as much as possible to ensure the consistency between in-plant testing and field execution.

[0003] Currently, semiconductor temperature control equipment load simulation mainly involves manually setting the heater's on-time, off-time, and on-power to simulate the operating conditions of the main equipment on-site, thereby debugging the semiconductor-specific temperature control equipment.

[0004] However, the temperature curve simulated by this scheme has a certain gap with the temperature curve of the main equipment. The outlet temperature curve and the return temperature curve are inconsistent, and a lot of parameters need to be manually input, resulting in low accuracy of the final simulated temperature curve. Summary of the Invention

[0005] In view of the above-mentioned problems in the prior art, this application provides a control method and apparatus for a load system of a semiconductor temperature control device.

[0006] In a first aspect, this application provides a control method for a load system of a semiconductor temperature control device, comprising:

[0007] The temperature and flow rate data of the circulating liquid are collected when the machine is under load.

[0008] The heat values ​​of the heaters in the load system at different sampling times are determined based on the temperature data and the flow rate data.

[0009] The duty cycle of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the heat parameters of the heater.

[0010] The on / off state of the heater is controlled according to the duty cycle of the heater at different sampling times.

[0011] Optionally, determining the duty cycle of the heater at different sampling times based on the heat values ​​and heat parameters of the heater at different sampling times includes:

[0012] Based on the heat values ​​and heat parameters of the heater at different sampling times, the initial duty cycle of the heater at different sampling times is determined;

[0013] The initial duty cycle of the heater at different sampling times is corrected by the correction coefficient corresponding to different sampling times, so as to obtain the duty cycle of the heater at different sampling times.

[0014] Optionally, the thermal parameters of the heater include the power of the heater and the switching cycle of the heater, and determining the duty cycle of the heater at different sampling times includes:

[0015] The conduction duration of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the power of the heater.

[0016] The duty cycle of the heater at different sampling times is determined based on the conduction duration of the heater at different sampling times, the switching cycle, and the correction coefficient.

[0017] Optionally, the determination of the conduction duration of the heater at different sampling times satisfies the following calculation formula:

[0018]

[0019] Where t(i) represents the conduction time of the heater at time i, Q(i) represents the heat value of the heater at time i, and Q 加热器 This indicates the power of the heater.

[0020] Optionally, the determination of the duty cycle of the heater at different sampling times satisfies the following calculation formula:

[0021]

[0022] Among them, h out (i) represents the duty cycle of the heater at time i, k(i) represents the correction coefficient of the heater at time i, t(i) represents the conduction time of the heater at time i, and T represents the switching cycle of the heater.

[0023] Optionally, controlling the on / off state of the heater based on the duty cycle of the heater at different sampling times includes:

[0024] The duty cycle of the heater at different sampling times is imported into the human-machine interface and output sequentially according to the sampling period;

[0025] The duty cycle output from the human-machine interface is then output through a programmable logic controller to control the on / off state of the heater.

[0026] Secondly, this application also provides a control device for a load system of a semiconductor temperature control device, comprising:

[0027] The data acquisition module is used to collect temperature and flow data of the circulating liquid under load.

[0028] The heat value determination module is used to determine the heat value of the heater in the load system at different sampling times based on the temperature data and the flow rate data;

[0029] The duty cycle determination module is used to determine the duty cycle of the heater at different sampling times based on the heat value of the heater at different sampling times and the heat parameters of the heater.

[0030] The control module is used to control the on / off state of the heater based on the duty cycle of the heater at different sampling times.

[0031] Optionally, the duty cycle determination module is further configured to:

[0032] Based on the heat values ​​and heat parameters of the heater at different sampling times, the initial duty cycle of the heater at different sampling times is determined;

[0033] The initial duty cycle of the heater at different sampling times is corrected by the correction coefficient corresponding to different sampling times, so as to obtain the duty cycle of the heater at different sampling times.

[0034] Optionally, the heat parameters of the heater include the power of the heater and the switching cycle of the heater, and the duty cycle determination module is further used for:

[0035] The conduction duration of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the power of the heater.

[0036] The duty cycle of the heater at different sampling times is determined based on the conduction duration of the heater at different sampling times, the switching cycle, and the correction coefficient.

[0037] Optionally, the determination of the conduction duration of the heater at different sampling times satisfies the following calculation formula:

[0038]

[0039] Where t(i) represents the conduction time of the heater at time i, Q(i) represents the heat value of the heater at time i, and q 加热器 This indicates the power of the heater.

[0040] Optionally, the determination of the duty cycle of the heater at different sampling times satisfies the following calculation formula:

[0041]

[0042] Among them, h out(i) represents the duty cycle of the heater at time i, k(i) represents the correction coefficient of the heater at time i, t(i) represents the conduction time of the heater at time i, and T represents the switching cycle of the heater.

[0043] Optionally, the control module is further configured to:

[0044] The duty cycle of the heater at different sampling times is imported into the human-machine interface and output sequentially according to the sampling period;

[0045] The duty cycle output from the human-machine interface is then output through a programmable logic controller to control the on / off state of the heater.

[0046] Thirdly, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the control method for a load system of a semiconductor temperature control device as described above.

[0047] Fourthly, this application also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements a control method for a load system of a semiconductor temperature control device as described above.

[0048] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements a control method for the load system of any of the semiconductor temperature control devices described above.

[0049] The control method and apparatus for the load system of the semiconductor temperature control equipment provided in this application determine the heat value of the heater using temperature data and flow data collected on-site, and then determine the duty cycle using the heat value and heater power. By setting the duty cycle of the heater, the on / off state of the heater is controlled, so as to achieve consistency between the heater outlet temperature and the return temperature curve collected on-site. This allows the temperature curve of the main unit load to be accurately simulated during the commissioning stage, enabling the semiconductor temperature control equipment to better meet the process requirements of the main equipment. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is one of the flowcharts illustrating a control method for a load system of a semiconductor temperature control device provided in an embodiment of this application;

[0052] Figure 2 This is a second schematic flowchart of a control method for a load system of a semiconductor temperature control device provided in an embodiment of this application;

[0053] Figure 3 This is a schematic diagram of the structure of the control device for the load system of a semiconductor temperature control device provided in the embodiments of this application;

[0054] Figure 4 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0055] In advanced integrated circuit manufacturing processes, semiconductor temperature control equipment provides the main equipment with a stable flow rate and temperature of circulating liquid. After the semiconductor temperature control equipment is connected to the main equipment, the time allotted for its commissioning is extremely short. Furthermore, the main equipment demands high temperature control accuracy from the semiconductor temperature control equipment. To better meet the main equipment's temperature control requirements, the semiconductor temperature control equipment must undergo extensive testing before leaving the factory, simulating the on-site load curves for prototype testing to ensure that the equipment meets the main equipment's process requirements during actual use.

[0056] In semiconductor manufacturing processes, temperature control equipment absorbs heat from the main equipment, causing the return temperature to rise. Simultaneously, the main equipment's process flow changes periodically, correspondingly resulting in periodic changes in the return temperature, forming a load curve.

[0057] Currently, load systems used for semiconductor temperature control equipment primarily employ a method of manually setting the heater's on / off time and power to simulate the operating conditions of the main equipment in the field, thus debugging the semiconductor temperature control equipment. This method simulates temperature curves that differ somewhat from the actual temperature curves of the main equipment and requires manual input of numerous parameters, which is prone to errors.

[0058] To address the aforementioned problems in the existing technology, this application provides a control method and apparatus for a load system of a semiconductor temperature control equipment. By setting the duty cycle of the heater, the on / off state of the heater is controlled, thereby enabling the temperature curve of the main equipment load to be accurately simulated during the commissioning phase, allowing the semiconductor temperature control equipment to better meet the process requirements of the main equipment.

[0059] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0060] Figure 1 This is one of the flowcharts illustrating a control method for a load system of a semiconductor temperature control device provided in this application embodiment, such as... Figure 1 As shown, the method includes at least the following steps:

[0061] Step 101: Collect temperature and flow data of the circulating liquid under load.

[0062] Specifically, temperature and flow data of the circulating liquid under load are collected on-site. The temperature data mainly refers to the outlet temperature T. out and return temperature T in The flow data mainly refers to the outflow flow rate F. This data can be obtained directly from the data stored on the touchscreen of the semiconductor temperature control equipment.

[0063] Step 102: Determine the heat value of the heater in the load system at different sampling times based on the temperature data and the flow rate data.

[0064] Specifically, based on the heat calculation formula, combined with temperature data such as the outlet and return temperatures collected on-site, and flow data such as the outlet flow rate, the heat value of the heater at different sampling times can be calculated. The heater included in the load system can consist of multiple heating rods.

[0065] Optionally, the heat values ​​of the heaters in the load system at different sampling times are determined based on the outlet temperature, return temperature, and outlet flow rate, satisfying the following calculation formula:

[0066] Q(i) = cm[T out (i)-T in (i)]

[0067] =cρF[T out (i)-T in (i)]

[0068] Where Q(i) represents the heat value of the heater at time i, c represents the specific heat capacity of the circulating liquid, m represents the mass of the circulating liquid, and T out (i) represents the outlet temperature of the circulating liquid at time i, T in (i) represents the return temperature of the circulating liquid at time i, ρ represents the density of the circulating liquid, and F represents the outlet flow rate of the circulating liquid.

[0069] Step 103: Determine the duty cycle of the heater at different sampling times based on the heat values ​​and heat parameters of the heater at different sampling times.

[0070] Specifically, the heat value of the load heater can be determined not only using the heat calculation formula, but also using the power of the load heater and the actual conduction time of the heater switch. Therefore, after determining the heat value of the heater at different times using data such as outlet temperature, return temperature, and outlet flow rate collected at different times, the actual conduction time of the heater switch at different times can be determined using the power value of the heater, thereby determining the duty cycle of the heater at different times.

[0071] The heat parameters of a heater mainly refer to its power value, which is a constant. Duty cycle refers to the proportion of energized time relative to the total time within a pulse cycle. In this application, the duty cycle of the heater, or rather the heater switch, can be determined based on the actual conduction time of the heater within a switching cycle.

[0072] Step 104: Control the on / off state of the heater according to the duty cycle of the heater at different sampling times.

[0073] Specifically, the on / off state of the heater is controlled according to the duty cycle of the heater in the load system at different sampling times, so as to keep the heater outlet temperature consistent with the return temperature curve collected on site, thereby improving the accuracy of temperature curve simulation.

[0074] The control method for the load system of semiconductor temperature control equipment provided in this application uses temperature data and flow data collected on-site to determine the heat value of the heater, and then uses the heat value and heater power to determine the duty cycle. By setting the duty cycle of the heater, the on / off state of the heater is controlled, so as to achieve consistency between the heater outlet temperature and the return temperature curve collected on-site. This allows the temperature curve of the main unit load to be accurately simulated during the commissioning stage, so that the semiconductor temperature control equipment can better meet the process requirements of the main equipment.

[0075] Optionally, determining the duty cycle of the heater at different sampling times based on the heat values ​​and heat parameters of the heater at different sampling times includes:

[0076] Based on the heat values ​​and heat parameters of the heater at different sampling times, the initial duty cycle of the heater at different sampling times is determined;

[0077] The initial duty cycle of the heater at different sampling times is corrected by the correction coefficient corresponding to different sampling times, so as to obtain the duty cycle of the heater at different sampling times.

[0078] Specifically, the heat values ​​of the heater at different sampling times are obtained based on data collected on-site. The duty cycle calculated using the heater's power value is only an initial value. Considering heat loss during heater heating and the circulation of the liquid during transport, the initial duty cycle needs to be corrected.

[0079] The initial duty cycle at different sampling times is corrected according to the correction coefficient corresponding to different sampling times. The magnitude of the correction coefficient can be set according to actual needs. Finally, the duty cycle of the heater at different sampling times is output as the control value of the final heater load.

[0080] The control method for the load system of semiconductor temperature control equipment provided in this application uses temperature data and flow data collected on-site to determine the heat value of the heater. Then, the duty cycle is determined using the heat value and the heater power, and the duty cycle is corrected according to the correction coefficient. By setting the duty cycle of the heater, the on-off state of the heater is controlled, so as to achieve consistency between the heater outlet temperature and the return temperature curve collected on-site. This allows the temperature curve of the main unit load to be accurately simulated during the commissioning stage, so that the semiconductor temperature control equipment can better meet the process requirements of the main equipment.

[0081] Optionally, the thermal parameters of the heater include the power of the heater and the switching cycle of the heater, and determining the duty cycle of the heater at different sampling times includes:

[0082] The conduction duration of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the power of the heater.

[0083] The duty cycle of the heater at different sampling times is determined based on the conduction duration of the heater at different sampling times, the switching cycle, and the correction coefficient.

[0084] Specifically, the heater's thermal parameters include its power and switching cycle. The switching cycle indicates the heater's operating cycle, and its magnitude can be set by the heater's controller. Using the heater's thermal values ​​and power values ​​at different sampling times, the conduction duration of the heater at those times can be determined. Then, based on the conduction duration and switching cycle at different sampling times, the initial duty cycle is determined. A correction factor is then used to correct the initial duty cycle, yielding the heater's duty cycle at different sampling times.

[0085] Optionally, the determination of the conduction duration of the heater at different sampling times satisfies the following calculation formula:

[0086]

[0087] Where t(i) represents the conduction time of the heater at time i, Q(i) represents the heat value of the heater at time i, and Q 加热器 This indicates the power of the heater.

[0088] Optionally, the determination of the duty cycle of the heater at different sampling times satisfies the following calculation formula:

[0089]

[0090] Among them, h out (i) represents the duty cycle of the heater at time i, k(i) represents the correction coefficient of the heater at time i, t(i) represents the conduction time of the heater at time i, and T represents the switching cycle of the heater.

[0091] The control method for the load system of semiconductor temperature control equipment provided in this application determines the conduction time of the heater by using the heat value and power of the heater, and then determines the duty cycle by using the conduction time of the heater, the switching cycle and the correction coefficient. By setting the duty cycle of the heater, the on and off of the heater is controlled, so as to achieve the consistency between the heater outlet temperature and the return temperature curve collected on site. This allows the temperature curve of the main unit load to be accurately simulated during the commissioning stage, so that the semiconductor temperature control equipment can better meet the process requirements of the main equipment.

[0092] Optionally, controlling the on / off state of the heater based on the duty cycle of the heater at different sampling times includes:

[0093] The duty cycle of the heater at different sampling times is imported into the human-machine interface and output sequentially according to the sampling period;

[0094] The duty cycle output from the human-machine interface is then output through a programmable logic controller to control the on / off state of the heater.

[0095] Specifically, a load system for semiconductor temperature control equipment includes a heater, a flow check switch, a temperature protection switch, a programmable logic controller (PLC), a human machine interface (HMI), a contactor, a solid-state relay, etc.

[0096] During the operation of the load system, the HMI can set the temperature range, load heater power, etc. After obtaining the duty cycle of the heater at different sampling times using the aforementioned method, its value is imported into the HMI. When the semiconductor temperature control equipment needs to be loaded, clicking the load button on the HMI will output the duty cycle sequentially according to the sampling period. After being output by the PLC, the heater's on / off state is controlled, thereby achieving consistency between the heater outlet temperature and the return temperature curve collected on-site.

[0097] Figure 2 This is a second schematic flowchart of a control method for a load system of a semiconductor temperature control device provided in this application embodiment, as shown below. Figure 2 As shown, the duty cycle data of the heater is imported through the HMI touch screen or server, and then the PLC outputs the data to control the heater load.

[0098] The control method for the load system of semiconductor temperature control equipment provided in this application embodiment can accurately simulate the temperature control curve of the host computer on site, and is used for pre-shipment debugging of semiconductor temperature control equipment. It realizes automated testing to replace manual testing, which not only improves the consistency and accuracy of testing, but also reduces the degree of human intervention and improves testing efficiency.

[0099] The control device for the load system of a semiconductor temperature control device provided in this application is described below. The control device for the load system of a semiconductor temperature control device described below can be referred to in correspondence with the control method for the load system of a semiconductor temperature control device described above.

[0100] Figure 3 This is a schematic diagram of the structure of the control device for the load system of a semiconductor temperature control device provided in the embodiments of this application, as shown below. Figure 3 As shown, the device includes:

[0101] Data acquisition module 301 is used to acquire temperature and flow data of circulating liquid when the machine is under load;

[0102] The heat value determination module 302 is used to determine the heat value of the heater in the load system at different sampling times based on the temperature data and the flow rate data;

[0103] The duty cycle determination module 303 is used to determine the duty cycle of the heater at different sampling times based on the heat value of the heater at different sampling times and the heat parameters of the heater.

[0104] The control module 304 is used to control the on / off state of the heater according to the duty cycle of the heater at different sampling times.

[0105] Optionally, the duty cycle determination module is further configured to:

[0106] Based on the heat values ​​and heat parameters of the heater at different sampling times, the initial duty cycle of the heater at different sampling times is determined;

[0107] The initial duty cycle of the heater at different sampling times is corrected by the correction coefficient corresponding to different sampling times, so as to obtain the duty cycle of the heater at different sampling times.

[0108] Optionally, the heat parameters of the heater include the power of the heater and the switching cycle of the heater, and the duty cycle determination module is further used for:

[0109] The conduction duration of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the power of the heater.

[0110] The duty cycle of the heater at different sampling times is determined based on the conduction duration of the heater at different sampling times, the switching cycle, and the correction coefficient.

[0111] Optionally, the determination of the conduction duration of the heater at different sampling times satisfies the following calculation formula:

[0112]

[0113] Where t(i) represents the conduction time of the heater at time i, Q(i) represents the heat value of the heater at time i, and Q 加热器 This indicates the power of the heater.

[0114] Optionally, the determination of the duty cycle of the heater at different sampling times satisfies the following calculation formula:

[0115]

[0116] Among them, h out (i) represents the duty cycle of the heater at time i, k(i) represents the correction coefficient of the heater at time i, t(i) represents the conduction time of the heater at time i, and T represents the switching cycle of the heater.

[0117] Optionally, the control module is further configured to:

[0118] The duty cycle of the heater at different sampling times is imported into the human-machine interface and output sequentially according to the sampling period;

[0119] The duty cycle output from the human-machine interface is then output through a programmable logic controller to control the on / off state of the heater.

[0120] Figure 4 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application, such as... Figure 4As shown, the electronic device may include: a processor 401, a communication interface 402, a memory 403, and a communication bus 404, wherein the processor 401, the communication interface 402, and the memory 403 communicate with each other through the communication bus 404.

[0121] Furthermore, the logical instructions in the aforementioned memory 403 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0122] The processor 401 can invoke logic instructions in the memory 403 to execute a control method for a load system of a semiconductor temperature control device, the method including:

[0123] The temperature and flow rate data of the circulating liquid are collected when the machine is under load.

[0124] The heat values ​​of the heaters in the load system at different sampling times are determined based on the temperature data and the flow rate data.

[0125] The duty cycle of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the heat parameters of the heater.

[0126] The on / off state of the heater is controlled according to the duty cycle of the heater at different sampling times.

[0127] Optionally, determining the duty cycle of the heater at different sampling times based on the heat values ​​and heat parameters of the heater at different sampling times includes:

[0128] Based on the heat values ​​and heat parameters of the heater at different sampling times, the initial duty cycle of the heater at different sampling times is determined;

[0129] The initial duty cycle of the heater at different sampling times is corrected by the correction coefficient corresponding to different sampling times, so as to obtain the duty cycle of the heater at different sampling times.

[0130] Optionally, the thermal parameters of the heater include the power of the heater and the switching cycle of the heater, and determining the duty cycle of the heater at different sampling times includes:

[0131] The conduction duration of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the power of the heater.

[0132] The duty cycle of the heater at different sampling times is determined based on the conduction duration of the heater at different sampling times, the switching cycle, and the correction coefficient.

[0133] Optionally, the determination of the conduction duration of the heater at different sampling times satisfies the following calculation formula:

[0134]

[0135] Where t(i) represents the conduction time of the heater at time i, Q(i) represents the heat value of the heater at time i, and Q 加热器 This indicates the power of the heater.

[0136] Optionally, the determination of the duty cycle of the heater at different sampling times satisfies the following calculation formula:

[0137]

[0138] Among them, h out (i) represents the duty cycle of the heater at time i, k(i) represents the correction coefficient of the heater at time i, t(i) represents the conduction time of the heater at time i, and T represents the switching cycle of the heater.

[0139] Optionally, controlling the on / off state of the heater based on the duty cycle of the heater at different sampling times includes:

[0140] The duty cycle of the heater at different sampling times is imported into the human-machine interface and output sequentially according to the sampling period;

[0141] The duty cycle output from the human-machine interface is then output through a programmable logic controller to control the on / off state of the heater.

[0142] On the other hand, this application also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer is able to execute the control method for the load system of a semiconductor temperature control device provided by the above methods. This method may include:

[0143] The temperature and flow rate data of the circulating liquid are collected when the machine is under load.

[0144] The heat values ​​of the heaters in the load system at different sampling times are determined based on the temperature data and the flow rate data.

[0145] The duty cycle of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the heat parameters of the heater.

[0146] The on / off state of the heater is controlled according to the duty cycle of the heater at different sampling times.

[0147] In another aspect, this application also provides a non-transitory computer-readable storage medium storing a computer program thereon, which, when executed by a processor, is implemented to perform the control method for a load system of a semiconductor temperature control device provided by the methods described above. This method may include:

[0148] The temperature and flow rate data of the circulating liquid are collected when the machine is under load.

[0149] The heat values ​​of the heaters in the load system at different sampling times are determined based on the temperature data and the flow rate data.

[0150] The duty cycle of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the heat parameters of the heater.

[0151] The on / off state of the heater is controlled according to the duty cycle of the heater at different sampling times.

[0152] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0153] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0154] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A control method for a load system of a semiconductor temperature control device, characterized in that, include: The temperature and flow rate data of the circulating liquid are collected when the machine is under load. The heat values ​​of the heaters in the load system at different sampling times are determined based on the temperature data and the flow rate data. The duty cycle of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the heat parameters of the heater. The on / off state of the heater is controlled according to the duty cycle of the heater at different sampling times; The step of determining the duty cycle of the heater at different sampling times based on the heat values ​​and heat parameters of the heater at different sampling times includes: Based on the heat values ​​and heat parameters of the heater at different sampling times, the initial duty cycle of the heater at different sampling times is determined; The initial duty cycle at different sampling times is corrected by the correction coefficient corresponding to different sampling times, so as to obtain the duty cycle of the heater at different sampling times. The thermal parameters of the heater include the power of the heater and the switching cycle of the heater. Determining the duty cycle of the heater at different sampling times includes: The conduction duration of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the power of the heater. The duty cycle of the heater at different sampling times is determined based on the conduction duration of the heater at different sampling times, the switching cycle, and the correction coefficient.

2. The control method for a load system of a semiconductor temperature control device according to claim 1, characterized in that, The conduction duration of the heater at different sampling times is determined by the following calculation formula: ； in, express The duration of conduction of the heater. express The heat value of the heater at all times. This indicates the power of the heater.

3. The control method for a load system of a semiconductor temperature control device according to claim 2, characterized in that, The duty cycle of the heater at different sampling times is determined by the following calculation formula: ； in, express The duty cycle of the heater at any given time. express Correction factor for the heater at any time. express The conduction time of the heater is denoted by T, which represents the switching cycle of the heater.

4. The control method for a load system of a semiconductor temperature control device according to claim 1, characterized in that, The step of controlling the on / off state of the heater based on the duty cycle of the heater at different sampling times includes: The duty cycle of the heater at different sampling times is imported into the human-machine interface and output sequentially according to the sampling period; The duty cycle output from the human-machine interface is then output through a programmable logic controller to control the on / off state of the heater.

5. A control device for a load system of a semiconductor temperature control equipment, characterized in that, include: The data acquisition module is used to collect temperature and flow data of the circulating liquid under load. The heat value determination module is used to determine the heat value of the heater in the load system at different sampling times based on the temperature data and the flow rate data; The duty cycle determination module is used to determine the duty cycle of the heater at different sampling times based on the heat value of the heater at different sampling times and the heat parameters of the heater. The control module is used to control the on / off state of the heater according to the duty cycle of the heater at different sampling times; The duty cycle determination module is further used for: Based on the heat values ​​and heat parameters of the heater at different sampling times, the initial duty cycle of the heater at different sampling times is determined; The initial duty cycle at different sampling times is corrected by the correction coefficient corresponding to different sampling times, so as to obtain the duty cycle of the heater at different sampling times. The heat parameters of the heater include the power of the heater and the switching cycle of the heater. The duty cycle determination module is also used for: The conduction duration of the heater at different sampling times is determined based on the heat value of the heater at different sampling times and the power of the heater. The duty cycle of the heater at different sampling times is determined based on the conduction duration of the heater at different sampling times, the switching cycle, and the correction coefficient.

6. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the control method for a load system of a semiconductor temperature control device as described in any one of claims 1 to 4.

7. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the control method for a load system of a semiconductor temperature control device as described in any one of claims 1 to 4.

8. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the control method for a load system of a semiconductor temperature control device as described in any one of claims 1 to 4.

Images