Wafer regeneration feeding device

Abstract

The application relates to the technical field of wafers, in particular to a wafer reloading device and method thereof, which comprises a base, a displacement fixing mechanism, a height adjusting mechanism and a splicing and transferring mechanism, the displacement fixing mechanism is fixedly installed on the two sides of the bottom of the base, the height adjusting mechanism is fixedly installed on the top of the base, and the height adjusting mechanism comprises a lifting platform; the displacement adjusting mechanism, the rotating mechanism and the limiting and clamping mechanism are arranged; the protective pad is pushed to make the protective pad drive the movable hook into contact with the movable block; the movable hook is continuously pushed to be folded inward on the two sides until passing through the movable block; the movable hook rebounds again to be fixedly connected with the movable block; the protective pad is fixedly installed on the inner side of the limiting groove; the wafer can be better protected during clamping; the wafer is prevented from being damaged during use; and the position of the wafer can be better limited through the limiting groove to prevent shaking during reloading.

Description

Technical Field

[0001] This invention relates to the field of wafer technology, specifically a wafer regeneration feeding device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. The main wafer processing methods are wafer fabrication and batch processing, which involve processing one or more wafers simultaneously. As semiconductor feature sizes shrink and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. Wafer regeneration requires various processing steps, and the entire processing flow necessitates continuous feeding and transfer of wafers to facilitate different processing procedures.

[0003] The existing technology has the following problems:

[0004] (1) Existing feeding devices usually cannot adjust the angle and position of the device more conveniently and quickly during use. They cannot move the position of the device according to different usage conditions during feeding and cannot adapt to different usage conditions.

[0005] (2) Existing feeding devices are usually not convenient to adjust the height and position of the device during use, and cannot be matched with different processing devices according to the needs of use, which has certain limitations. Summary of the Invention

[0006] The purpose of this invention is to provide a wafer regeneration feeding device to solve the problems mentioned in the background art.

[0007] The technical solution of the present invention is: a wafer regeneration feeding device, including a base, and further including a shifting and fixing mechanism, a height adjustment mechanism, and a splicing and transfer mechanism. The shifting and fixing mechanism is fixedly installed on both sides of the bottom of the base, and the height adjustment mechanism is fixedly installed on the top of the base. The height adjustment mechanism includes a lifting platform, and extension mechanisms are provided on both sides of the lifting platform. The shifting and adjusting mechanism is fixedly installed on both sides of the top of the extension mechanism. The shifting and adjusting mechanism includes four mounting plates, four lead screw slides respectively fixedly installed on the top of the four mounting plates, two first support plates respectively fixedly installed on the top of the sliding blocks of the four lead screw slides, two first electric turntables respectively fixedly installed on the top of the two first support plates, two connecting blocks respectively fixedly installed on the top of the two first electric turntables, two electric lifting sleeves respectively fixedly installed on the top of the two connecting blocks, and two rocker arms respectively fixedly installed on the telescopic ends of the two electric lifting sleeves. A rotating mechanism is fixedly installed at the bottom of each of the two rocker arms, and a limit clamping mechanism is fixedly installed at the bottom of the rotating mechanism. The splicing and transfer mechanism is fixedly installed on one side of the lifting platform.

[0008] Preferably, the displacement and fixing mechanism includes four rollers respectively fixedly installed on both sides of the bottom of the base, two fixing plates respectively fixedly installed on both sides of the base, four hydraulic rods respectively fixedly installed on the bottom of the two fixing plates, and four fixing feet respectively fixedly installed on the bottom of the four hydraulic rods.

[0009] Preferably, the height adjustment mechanism includes a chassis, a servo motor, a threaded rod, a rotating block, a top plate, a lifting platform, and two guide rods respectively fixedly connected between the chassis and the top plate. The chassis is fixedly installed on the top of the base, the servo motor is fixedly installed inside the chassis, the threaded rod is fixedly installed at the output end of the servo motor, the rotating block is fixedly installed on the top of the threaded rod, the top plate is fixedly installed on the top of the rotating block, and the lifting platform is fitted onto the outside of the threaded rod.

[0010] Preferably, the extension mechanism includes two mounting slots respectively opened on both sides of the lifting platform, a plurality of electric push rods respectively fixedly installed inside the two mounting slots, and two extension plates respectively fixedly installed on the telescopic ends of the plurality of electric push rods.

[0011] Preferably, the rotating mechanism includes two mounting blocks respectively fixedly mounted on the bottom of the two rocker arms, two second electric turntables respectively fixedly mounted on the bottom of the two mounting blocks, and two second support plates respectively fixedly mounted on the bottom of the two second electric turntables.

[0012] Preferably, the limiting clamping mechanism includes two positioning plates respectively fixedly installed on one side of the bottom of the two second support plates, two electric slide rails respectively fixedly installed on the bottom of the two second support plates, two movable plates respectively fixedly installed on the bottom of the sliding blocks of the two electric slide rails, four telescopic sleeves respectively fixedly installed on the inner sides of the two movable plates and the two positioning plates, a plurality of fixing blocks respectively fixedly installed inside the four telescopic sleeves, and four telescopic clamping plates respectively fitted and installed on the inner sides of the four telescopic sleeves. Each fixing block and telescopic clamping plate is connected to a telescopic spring.

[0013] Preferably, the limiting clamping mechanism further includes four limiting grooves respectively opened on one side of the four telescopic clamping plates, multiple movable blocks respectively fixedly installed on one side of the four limiting grooves, four movable hooks respectively fitted and installed inside the four movable blocks, and four protective pads respectively fixedly installed on one side of the multiple movable hooks.

[0014] Preferably, the splicing and transfer mechanism includes a connecting plate, a slot, a block, and a conveyor belt. The connecting plate is fixedly installed on one side of the lifting platform, the slot is opened on one side of the connecting plate, the block is fitted inside the slot, and the conveyor belt is fixedly connected to one side of the block.

[0015] This invention provides an improved wafer regeneration feeding device, which, compared with the prior art, has the following improvements and advantages:

[0016] Firstly, this invention incorporates a displacement adjustment mechanism, a rotation mechanism, and a limiting clamping mechanism. Pushing the protective pad causes the movable hook to contact the movable block. Continuous pushing folds the sides of the movable hook inwards until it passes the movable block, at which point the hook springs back, thus fixing the hook to the block. This securely mounts the protective pad inside the limiting groove, providing better protection for the wafer during clamping and preventing damage. The limiting groove also better limits the wafer's position, preventing wobbling during loading. Next, the lead screw slide moves the first support plate above the wafer. Then, the electric lifting rod moves the rocker arm downwards until the two telescopic clamps are positioned on either side of the wafer. Finally, the electric slide rail moves one of the telescopic clamps inwards until the protective pad is in contact with the wafer. When the two sides come into contact, the telescopic clamping plate drives the telescopic spring to retract inward, while the telescopic spring generates a rebound force, thus providing a better stable clamping effect for the wafer and preventing shaking during the loading process, which could lead to it falling off and affecting subsequent use. After the wafer is clamped, the first electric turntable is opened, causing the first electric turntable to drive the rocker arm to rotate, so that the rocker arm drives the wafer to rotate to the required position, and then the wafer is slowly placed down. The setting of the mounting plate, lead screw slide, first support plate, first electric turntable, connecting block, electric lifting sleeve rod and rocker arm can more conveniently adjust the position of the clamping device according to the position of the wafer, so that the device can adapt to different usage conditions, making it more convenient to use and easy to pick up and put down the wafer. At the same time, the first electric turntable can transfer the wafer to various positions, making its application range wider. The setting of the second electric turntable can make it easier to adjust the angle of the wafer.

[0017] Secondly, this invention incorporates a displacement and fixing mechanism, a height adjustment mechanism, and a splicing and transfer mechanism. Pushing the base causes the rollers to roll, moving the device to the side of the processing equipment. Then, the hydraulic rod moves the fixing foot downwards until it is firmly fixed to the ground, stabilizing the base. This allows for easier relocation of the device according to usage needs, making it more convenient to use. Next, the servo motor drives the threaded rod to rotate via the rotating block. During rotation, the lifting platform moves up or down along the guide rod, adjusting the device's height to match the processing equipment. This ensures more accurate wafer loading and greater ease of use. When the distance between the device and the processing equipment is significant, pushing the conveyor belt causes the locking block to engage with the locking slot, fixing the conveyor belt to one side of the lifting platform for secondary wafer transfer. This allows for greater adaptability to various equipment, significantly expanding the device's applicability. Attached Figure Description

[0018] The present invention will be further explained below with reference to the accompanying drawings and embodiments:

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a schematic diagram of the height adjustment mechanism and extension mechanism of the present invention;

[0021] Figure 3 This is a schematic diagram of the splicing and transfer mechanism of the present invention;

[0022] Figure 4 This is a schematic diagram of the displacement adjustment mechanism of the present invention;

[0023] Figure 5 This is a schematic diagram of the rotating mechanism and the limiting clamping mechanism of the present invention;

[0024] Figure 6 This is the invention Figure 5 Enlarged structural diagram at point A in the middle.

[0025] Explanation of reference numerals in the attached drawings: 1. Base; 2. Shifting and fixing mechanism; 21. Roller; 22. Fixing plate; 23. Hydraulic rod; 24. Fixing foot; 3. Height adjustment mechanism; 31. Chassis; 32. Servo motor; 33. Threaded rod; 34. Rotating block; 35. Top plate; 36. Guide rod; 37. Lifting platform; 4. Extension mechanism; 41. Mounting slot; 42. Electric push rod; 43. Extension plate; 5. Shifting and adjusting mechanism; 51. Mounting plate; 52. Screw slide; 53. First support plate; 54. First electric turntable; 55. 56. Connecting block; 57. Electric lifting sleeve; 68. Rocker arm; 79. Rotating mechanism; 80. Mounting block; 91. Second electric turntable; 10. Second support plate; 11. Limiting clamping mechanism; 12. Positioning plate; 13. Electric slide rail; 14. Movable plate; 15. Telescopic sleeve; 16. Fixing block; 17. Telescopic spring; 18. Telescopic clamping plate; 19. Limiting groove; 10. Movable block; 11. Movable hook; 12. Protective pad; 13. Splicing and transfer mechanism; 14. Connecting plate; 15. Slot; 16. Locking block; 17. Conveyor belt. Detailed Implementation

[0026] The present invention will now be described in detail, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] This invention provides an improved wafer regeneration feeding device. The technical solution of this invention is as follows:

[0028] Example 1:

[0029] like Figures 1-4 As shown, a wafer regeneration feeding device includes a base 1, a shifting and fixing mechanism 2, a height adjustment mechanism 3, and a splicing and transfer mechanism 8. The shifting and fixing mechanism 2 is fixedly installed on both sides of the bottom of the base 1, and the height adjustment mechanism 3 is fixedly installed on the top of the base 1. The height adjustment mechanism 3 includes a lifting platform 37, with extension mechanisms 4 on both sides of the lifting platform 37. Shifting and adjusting mechanisms 5 are fixedly installed on both sides of the top of the extension mechanisms 4. The shifting and adjusting mechanism 5 includes four mounting plates 51, four lead screw slides 52 respectively fixedly installed on the top of the four mounting plates 51, and two slides respectively fixedly installed on the four lead screws. The slide table 52 has a first support plate 53 on top of the sliding block, two first electric turntables 54 respectively fixedly installed on top of the two first support plates 53, two connecting blocks 55 respectively fixedly installed on top of the two first electric turntables 54, two electric lifting rods 56 respectively fixedly installed on top of the two connecting blocks 55, and two rocker arms 57 respectively fixedly installed on the telescopic ends of the two electric lifting rods 56. The bottom of the two rocker arms 57 is fixedly installed with a rotating mechanism 6, and the bottom of the rotating mechanism 6 is fixedly installed with a limit clamping mechanism 7. The splicing and transfer mechanism 8 is fixedly installed on one side of the lifting table 37.

[0030] The specific implementation scheme is as follows: Open the lead screw slide 52 to move the first support plate 53 above the wafer, and then open the electric lifting sleeve 56 to move the rocker arm 57 downward until the two telescopic clamping plates 77 move to the two sides of the wafer respectively. This allows for more convenient adjustment of the position of the clamping device according to the position of the wafer, so that the device can adapt to different usage conditions, making it more convenient to use and easier to pick up and put down the wafer.

[0031] Specifically, the displacement and fixing mechanism 2 includes four rollers 21 respectively fixedly installed on both sides of the bottom of the base 1, two fixing plates 22 respectively fixedly installed on both sides of the base 1, four hydraulic rods 23 respectively fixedly installed on the bottom of the two fixing plates 22, and four fixing feet 24 respectively fixedly installed on the bottom of the four hydraulic rods 23. By setting the rollers 21, fixing plates 22, hydraulic rods 23 and fixing feet 24, the base 1 is kept stable, and the device can be moved more conveniently according to the needs of use, making it more convenient to use.

[0032] Specifically, the height adjustment mechanism 3 includes a chassis 31, a servo motor 32, a threaded rod 33, a rotating block 34, a top plate 35, a lifting platform 37, and two guide rods 36 respectively fixedly connected between the chassis 31 and the top plate 35. The chassis 31 is fixedly installed on the top of the base 1, the servo motor 32 is fixedly installed inside the chassis 31, the threaded rod 33 is fixedly installed at the output end of the servo motor 32, the rotating block 34 is fixedly installed on the top of the threaded rod 33, the top plate 35 is fixedly installed on the top of the rotating block 34, and the lifting platform 37 is installed outside the threaded rod 33. By setting up the chassis 31, servo motor 32, threaded rod 33, rotating block 34, top plate 35, guide rods 36, and lifting platform 37, the height of the device can be adjusted so that the height of the feeding device matches the height of the processing equipment, so that the wafers can be fed more accurately and the use is more convenient.

[0033] Specifically, the extension mechanism 4 includes two mounting slots 41 respectively opened on both sides of the lifting platform 37, multiple electric push rods 42 respectively fixedly installed inside the two mounting slots 41, and two extension plates 43 respectively fixedly installed on the telescopic ends of the multiple electric push rods 42. By setting the mounting slots 41, electric push rods 42 and extension plates 43, the width of the device can be adjusted more conveniently according to the needs of use, so as to simultaneously feed the wafers on both sides, effectively improving the efficiency of the device.

[0034] Specifically, the rotating mechanism 6 includes two mounting blocks 61 respectively fixedly installed at the bottom of the two rocker arms 57, two second electric turntables 62 respectively fixedly installed at the bottom of the two mounting blocks 61, and two second support plates 63 respectively fixedly installed at the bottom of the two second electric turntables 62. By providing mounting blocks 61, second electric turntables 62 and second support plates 63, it is easier to adjust the angle of the wafer.

[0035] Specifically, the limiting clamping mechanism 7 includes two positioning plates 71 respectively fixedly installed on one side of the bottom of the two second support plates 63, two electric slide rails 72 respectively fixedly installed on the bottom of the two second support plates 63, two movable plates 73 respectively fixedly installed on the bottom of the sliding blocks of the two electric slide rails 72, four telescopic sleeves 74 respectively fixedly installed on the inner sides of the two movable plates 73 and the two positioning plates 71, multiple fixing blocks 75 respectively fixedly installed inside the four telescopic sleeves 74, and four telescopic clamping plates 77 respectively fitted inside the four telescopic sleeves 74. Each fixing block 75 and telescopic clamping plate 77 is connected to a telescopic spring 76. By setting the positioning plates 71, electric slide rails 72, movable plates 73, telescopic sleeves 74, fixing blocks 75, telescopic springs 76 and telescopic clamping plates 77, the telescopic clamping plates 77 drive the telescopic springs 76 to retract inward, and at the same time the telescopic springs 76 generate a rebound force, thereby better stabilizing the wafer clamping effect and avoiding shaking during the loading process, which could lead to detachment and affect subsequent use.

[0036] Specifically, the limiting clamping mechanism 7 also includes four limiting grooves 78 respectively opened on one side of the four telescopic clamping plates 77, multiple movable blocks 79 respectively fixedly installed on one side of the four limiting grooves 78, four movable hooks 710 respectively installed in cooperation with the inner side of the four movable blocks 79, and four protective pads 711 respectively fixedly installed on one side of the multiple movable hooks 710. By setting the limiting grooves 78, movable blocks 79, movable hooks 710 and protective pads 711, the wafer can be better protected during the wafer clamping process, avoiding damage to the wafer during use. At the same time, the setting of the limiting grooves 78 can better limit the position of the wafer and prevent shaking during loading.

[0037] Specifically, the splicing and transfer mechanism 8 includes a connecting plate 81, a slot 82, a block 83, and a conveyor belt 84. The connecting plate 81 is fixedly installed on one side of the lifting platform 37, the slot 82 is opened on one side of the connecting plate 81, the block 83 is installed inside the slot 82, and the conveyor belt 84 is fixedly connected to one side of the block 83. By setting up the connecting plate 81, the slot 82, the block 83, and the conveyor belt 84, it is possible to perform secondary transfer of wafers, which can more conveniently adapt to various equipment and greatly improve the applicability of the device.

[0038] Working principle: First, connect the external power supply and push the base 1 to make the roller 21 roll, moving the device to one side of the processing equipment. Then, open the hydraulic rod 23 to move the fixed foot 24 downward until the fixed foot 24 is firmly fixed to the ground, thus stabilizing the base 1. Next, turn on the servo motor 32 to drive the threaded rod 33 to rotate through the rotating block 34. During the rotation of the threaded rod 33, the lifting platform 37 moves up or down along the guide rod 36 to adjust the height of the device. Then, when the distance between the device and the processing equipment is far, push the conveyor belt. 84. The conveyor belt 84 drives the locking block 83 to engage and fix with the locking slot 82, thereby fixing the conveyor belt 84 to one side of the lifting platform 37. Then, open the electric push rod 42 to drive the extension plate 43 to extend to the desired position. Next, push the protective pad 711 to drive the movable hook 710 to contact the movable block 79. Continue pushing to fold the two sides of the movable hook 710 inward until it passes the movable block 79. The movable hook 710 then springs back, thereby fixing the movable hook 710 to the movable block 79. This fixes the protective pad 711 inside the limiting groove 78. Then, open the screw... The slide bar 52 moves the first support plate 53 above the wafer. Then, the electric lifting lever 56 moves the rocker arm 57 downwards until the two telescopic clamping plates 77 are positioned on either side of the wafer. Next, the electric slide rail 72 moves one of the telescopic clamping plates 77 inwards until the protective pad 711 contacts both sides of the wafer. The telescopic clamping plate 77 then causes the telescopic spring 76 to retract inwards, simultaneously generating a rebound force, thus providing better stable clamping of the wafer. Finally, after the wafer is clamped, the first electric... The rotating turntable 54 causes the first electric turntable 54 to rotate the rocker arm 57, which in turn rotates the wafer to the desired position. The wafer is then slowly placed in the turntable. The hydraulic rod 23 is model CDM2B25, the servo motor 32 is model YE2-132S-4, the electric push rod 42 is model YS-NZ100-12A, the lead screw slide 52 is model PKH40, the first electric turntable 54 is model DG60-5, the electric lifting sleeve 56 is model XYDHA24-800, and the electric slide rail 72 is model PKH40.

[0039] The foregoing description enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer regeneration feeding device, comprising a base (1), characterized in that: It also includes a displacement fixing mechanism (2), a height adjustment mechanism (3), and a splicing and transfer mechanism (8). The displacement fixing mechanism (2) is fixedly installed on both sides of the bottom of the base (1). The height adjustment mechanism (3) is fixedly installed on the top of the base (1). The height adjustment mechanism (3) includes a lifting platform (37). An extension mechanism (4) is provided on both sides of the lifting platform (37). A displacement adjustment mechanism (5) is fixedly installed on both sides of the top of the extension mechanism (4). The displacement adjustment mechanism (5) includes four mounting plates (51), four screw slides (52) fixedly installed on the top of the four mounting plates (51), and two... A first support plate (53) is fixedly installed on the top of the sliding block of the four lead screw slides (52), two first electric turntables (54) are fixedly installed on the top of the two first support plates (53), two connecting blocks (55) are fixedly installed on the top of the two first electric turntables (54), two electric lifting rods (56) are fixedly installed on the top of the two connecting blocks (55), and two rocker arms (57) are fixedly installed on the telescopic ends of the two electric lifting rods (56). A rotating mechanism (6) is fixedly installed at the bottom of each of the two rocker arms (57). The limiting clamping mechanism (7) is fixedly installed on one side of the lifting platform (37). The limiting clamping mechanism (7) includes two positioning plates (71) fixedly installed on one side of the bottom of the two second support plates (63), two electric slide rails (72) fixedly installed on the bottom of the two second support plates (63), two movable plates (73) fixedly installed on the bottom of the sliding blocks of the two electric slide rails (72), four telescopic sleeves (74) fixedly installed on the inner sides of the two movable plates (73) and the two positioning plates (71), and multiple sleeves fixedly installed inside the four telescopic sleeves (74). The fixed block (75) and four telescopic clamps (77) respectively installed inside the four telescopic sleeves (74) are connected to each fixed block (75) and telescopic clamp (77) by a telescopic spring (76); the limiting clamping mechanism (7) also includes four limiting grooves (78) respectively opened on one side of the four telescopic clamps (77), multiple movable blocks (79) respectively fixedly installed on one side of the four limiting grooves (78), four movable hooks (710) respectively installed inside the four movable blocks (79), and four protective pads (711) respectively fixedly installed on one side of the multiple movable hooks (710).

2. The wafer regeneration feeding device according to claim 1, characterized in that: The displacement fixing mechanism (2) includes four rollers (21) respectively fixedly installed on both sides of the bottom of the base (1), two fixing plates (22) respectively fixedly installed on both sides of the base (1), four hydraulic rods (23) respectively fixedly installed on the bottom of the two fixing plates (22), and four fixing feet (24) respectively fixedly installed on the bottom of the four hydraulic rods (23).

3. The wafer regeneration feeding device according to claim 1, characterized in that: The height adjustment mechanism (3) includes a chassis (31), a servo motor (32), a threaded rod (33), a rotating block (34), a top plate (35), a lifting platform (37), and two guide rods (36) that are respectively fixedly connected between the chassis (31) and the top plate (35). The chassis (31) is fixedly installed on the top of the base (1), the servo motor (32) is fixedly installed inside the chassis (31), the threaded rod (33) is fixedly installed at the output end of the servo motor (32), the rotating block (34) is fixedly installed on the top of the threaded rod (33), the top plate (35) is fixedly installed on the top of the rotating block (34), and the lifting platform (37) is fitted and installed outside the threaded rod (33).

4. The wafer regeneration feeding device according to claim 3, characterized in that: The extension mechanism (4) includes two mounting slots (41) respectively opened on both sides of the lifting platform (37), multiple electric push rods (42) respectively fixedly installed inside the two mounting slots (41), and two extension plates (43) respectively fixedly installed on the telescopic ends of the multiple electric push rods (42).

5. The wafer regeneration feeding device according to claim 1, characterized in that: The rotating mechanism (6) includes two mounting blocks (61) respectively fixedly mounted on the bottom of two rocker arms (57), two second electric turntables (62) respectively fixedly mounted on the bottom of the two mounting blocks (61), and two second support plates (63) respectively fixedly mounted on the bottom of the two second electric turntables (62).

6. The wafer regeneration feeding device according to claim 1, characterized in that: The splicing and transfer mechanism (8) includes a connecting plate (81), a slot (82), a block (83), and a conveyor belt (84). The connecting plate (81) is fixedly installed on one side of the lifting platform (37). The slot (82) is opened on one side of the connecting plate (81). The block (83) is installed inside the slot (82). The conveyor belt (84) is fixedly connected to one side of the block (83).

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