Wafer carrier apparatus for a thermal processing system

Abstract

The application provides a wafer bearing device of a heat treatment equipment, which comprises at least one carrier plate movably arranged in the heat treatment equipment, an upper side of the carrier plate is provided with a wafer groove, and a plurality of through holes are arranged on the carrier plate; a jacking structure is arranged below the carrier plate and can be lifted under the driving of a telescopic driving component; a top plate is movably arranged between the jacking structure and the carrier plate; lower ends of a plurality of guide columns are connected with the top plate, upper ends of each guide column movably penetrate one through hole, an end face of the upper end of the guide column is provided with a positioning piece, the positioning piece is a conical table with a smaller upper end diameter than lower end diameter, the lower end diameter of the positioning piece is smaller than the diameter of the guide column, the positioning piece is coaxial with the guide column, and the outer periphery of the lower end of the positioning piece is tangent to the groove wall of the wafer groove. The application solves the problem that the difference between the inner diameter of the wafer groove and the outer diameter of the wafer is too large, the wafer edge effect is increased when the wafer is heat treated in the wafer groove, and the wafer yield is reduced, and improves the wafer yield after heat treatment.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, and more specifically, relates to a wafer carrier device for a heat treatment equipment. Background Technology

[0002] In the field of semiconductor integrated circuit manufacturing, integrated circuits are typically fabricated on wafers, and the fabrication of a complete chip requires multiple steps. During each process step, the wafer needs to be placed into the corresponding semiconductor equipment's process cavity. Wafer placement is automated, and wafer lifting devices are used to move the wafer up and down within the process cavity during this automated process.

[0003] Multi-wafer carriers enable the placement and removal of multiple wafers. However, due to manufacturing, assembly, and structural limitations, when the wafer slot is only slightly larger than the wafer's outer diameter, it's difficult to ensure that multiple wafers can be accurately placed into the slot. To ensure that multiple wafers can be correctly placed into the slot via a robot, the traditional method involves enlarging the wafer slot. However, enlarging the wafer slot leads to increased edge effects during heat treatment, which is very detrimental to wafer heat treatment. Summary of the Invention

[0004] The present invention addresses the shortcomings of existing technologies by providing a wafer carrier device for a heat treatment apparatus. A top plate is movably positioned between a lifting structure and a carrier plate. The carrier plate has wafer slots for placing wafers. The lower end of a guide post contacts the lifting structure, and the upper end of the guide post movably penetrates a through-hole and can rise and fall under the drive of a telescopic drive component. A positioning element is provided at the upper end of the guide post. The outer periphery of the lower end of the positioning element is tangent to the wall of the wafer slot. The positioning element has a conical frustum-shaped outer peripheral surface that is tangent to the outer periphery of the wafer it supports, thus achieving accurate positioning of the wafer. This ensures that the wafer it supports falls precisely into the corresponding wafer slot, thereby avoiding the need to enlarge the wafer slot in traditional methods to address the problem of excessive difference between the inner diameter of the slot and the outer diameter of the wafer, which increases the wafer edge effect during heat treatment and leads to a decrease in wafer yield. This invention improves the yield of wafers after heat treatment.

[0005] To achieve the above objectives, the technical solution of the present invention is as follows:

[0006] A wafer carrier device for a heat treatment apparatus, comprising:

[0007] At least one carrier plate is movably disposed inside the heat treatment equipment. A plate groove is provided on the upper side of the carrier plate, and a plurality of through holes are provided on the carrier plate along the circumference of the plate groove.

[0008] A lifting structure is provided below the carrier plate, and the lifting structure can be raised and lowered under the drive of the telescopic drive component;

[0009] A top plate, which is movably disposed between the lifting structure and the carrier plate;

[0010] The guide post is provided in multiple configurations. The lower end of each guide post is connected to the top plate. The upper end of each guide post movably passes through a through hole. A positioning element is provided on the upper end face of the guide post. The positioning element is a truncated cone shape with an upper diameter smaller than its lower diameter. The lower diameter of the positioning element is smaller than the diameter of the guide post. The positioning element is coaxial with the guide post. The outer periphery of the lower end of the positioning element is tangent to the groove wall of the plate groove.

[0011] Preferably, it also includes a positioning component, which includes:

[0012] A displacement section is connected to the carrier disk, and the displacement section is used to adjust the displacement of the carrier disk in the horizontal direction;

[0013] A positioning detection module is electrically connected to the displacement section and is disposed on the carrier disk and the top disk. The positioning detection module is used to detect the relative position of the guide post and the through hole in real time when the guide post is about to penetrate the carrier disk to receive the wafer, so that the through hole and the guide post are automatically aligned.

[0014] Preferably, the positioning element is in the shape of a frustum, a truncated pyramid, a pyramid, or a cone.

[0015] Preferably, the positioning detection module includes:

[0016] Multiple infrared emitters are mounted on the top plate;

[0017] An infrared receiver is provided in the same number as the infrared transmitter. The infrared receiver is located on the side of the carrier plate facing the top plate and corresponds to the position of the infrared transmitter, and is used to receive the infrared signal from the infrared transmitter.

[0018] The controller is electrically connected to the infrared receiver and the displacement unit. The controller controls the displacement unit according to the relative position of the guide post and the through hole, so that the displacement unit adjusts the carrier plate in the horizontal direction. When each infrared receiver receives the infrared signal emitted by the corresponding infrared transmitter, each guide post can automatically align with the corresponding through hole coaxially.

[0019] Preferably, the top plate has a Y-shaped structure, the top plate has three ends, and the infrared emitter is configured as three, with each infrared emitter disposed on one of the ends.

[0020] Preferably, a gap is provided between the through hole and the guide post.

[0021] Preferably, the lifting structure includes:

[0022] A push pin and a disc, wherein the disc is disposed at one end of the push pin and contacts the push plate, and the other end of the push pin is connected to the telescopic drive component.

[0023] Preferably, the telescopic drive component includes a cylinder, and the output end of the cylinder is connected to the ejector pin.

[0024] Preferably, the top plate, the guide post, and the positioning element are made of quartz, and the carrier plate is made of a ceramic tray.

[0025] Preferably, the displacement part includes a robotic arm.

[0026] The beneficial effects of the technical solution of the present invention are as follows:

[0027] This invention utilizes a top plate movably positioned between a lifting structure and a carrier plate. The carrier plate has wafer slots for placing wafers. The lower end of a guide post contacts the lifting structure, while the upper end of the guide post movably penetrates a through hole and can rise and fall under the drive of a telescopic drive component. A positioning element is provided at the upper end of the guide post. The outer periphery of the lower end of the positioning element is tangent to the wall of the wafer slot. The positioning element has a conical frustum-shaped outer peripheral surface that is tangent to the outer periphery of the wafer it supports, thereby achieving accurate positioning of the wafer. This ensures that the wafer it supports falls precisely into the corresponding wafer slot, thus avoiding the problem in traditional methods where the wafer slot needs to be enlarged to address the excessive difference between the inner diameter of the wafer slot and the outer diameter of the wafer. This leads to increased wafer edge effects during heat treatment in the wafer slot, resulting in a decrease in wafer yield. This invention improves the yield of wafers after heat treatment.

[0028] Furthermore, a positioning detection module is provided on the top plate and the carrier plate. The positioning detection module is connected to the displacement part, and the carrier plate is connected to the displacement part. When the guide post is about to pass through the through hole to receive the wafer, the positioning detection module detects the relative position of the guide post and the through hole in real time. The displacement part adjusts the displacement of the carrier plate in the horizontal direction so that the through hole and the guide post are automatically aligned. Attached Figure Description

[0029] The above and other objects, features and advantages of the present invention will become more apparent from the more detailed description of exemplary embodiments of the invention in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the invention.

[0030] Figure 1 An exploded view of the structure of a wafer carrier device for a heat treatment apparatus provided by the present invention is shown.

[0031] Figure 2 It shows Figure 1 Enlarged view of the structure at point A in the middle;

[0032] Figure 3 It shows Figure 1 Enlarged view of the structure at point B;

[0033] Figure 4 This diagram shows the lifting effect of the lifting structure of the wafer carrier device of a heat treatment equipment provided by the present invention;

[0034] Figure 5 It shows Figure 4 Enlarged view of the structure at point C;

[0035] Figure 6 This diagram illustrates the retraction effect of the lifting structure of a wafer carrier device in a heat treatment apparatus provided by the present invention.

[0036] Figure 7 It shows Figure 6 Enlarged view of the structure at point D;

[0037] Figure 8 This invention provides a top view of a wafer carrier device for a heat treatment apparatus.

[0038] Figure 9 This invention provides a schematic diagram of the structure of a wafer carrier device and positioning assembly for a heat treatment apparatus.

[0039] Figure 10 It shows Figure 9 Enlarged view of the structure at point E in the middle.

[0040] Explanation of reference numerals in the attached figures:

[0041] 001, Carrier tray; 002, Guide post; 003, Top plate; 004, Ejector pin; 005, Wafer slot; 006, Through hole; 007, Positioning element; 008, Wafer; 009, Displacement part; 010, Infrared receiver; 011, Infrared transmitter. Detailed Implementation

[0042] Preferred embodiments of the invention will now be described in more detail. While preferred embodiments of the invention are described below, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0043] Reference Figure 1-8 As shown, the present invention provides a wafer carrier device for a heat treatment apparatus, comprising:

[0044] At least one carrier plate 001 is movably disposed inside the heat treatment equipment. A plate groove 005 is provided on the upper side of the carrier plate 001, and a plurality of through holes 006 are provided on the carrier plate 001 along the circumference of the plate groove 005.

[0045] The lifting structure is located below the carrier plate 001 and can be raised and lowered under the drive of the telescopic drive component.

[0046] Top plate 003 is movably positioned between the lifting structure and the carrier plate 001;

[0047] Guide pillar 002, multiple guide pillars 002 are provided. The lower end of the guide pillar 002 is connected to the top plate 003. The upper end of each guide pillar 002 is movably connected through a through hole 006. A positioning element 007 is provided on the end face of the upper end of the guide pillar 002. The positioning element 007 is a truncated cone shape with an upper diameter smaller than the lower diameter. The lower diameter of the positioning element 007 is smaller than the diameter of the guide pillar 002. The positioning element 007 is coaxial with the guide pillar 002. The outer periphery of the lower end of the positioning element 007 is tangent to the groove wall of the plate groove 005.

[0048] Specifically, the carrier disk 001 has multiple through holes 006 arranged in a ring array on its circumference, and the wafer slot 005 is circular, with the center of the wafer slot 005 coaxially arranged with the ring array of multiple through holes 006. Therefore, multiple guide posts 002 are needed to match the through holes 006. The wafer is supported by multiple guide posts 002 and positioning elements 007, which can improve the stability of wafer support. The lifting structure causes the top plate 003 to move, and the top plate 003 causes the guide post 002 to rise and fall relative to the carrier plate 001. The guide post 002, which is set on the top plate 003, passes through the carrier plate 001 through the through hole 006 to support the wafer. When the guide post 002 moves downward, the guide post 002 will carry the wafer downward together. Through the positioning element 007 set on the guide post 002, the edge of the wafer is tangent to the outer periphery of the positioning element 007, and the outer periphery of the lower end of the positioning element 007 is tangent to the groove wall of the wafer groove 005. This allows the wafer to gradually enter the wafer groove 005 along with the tangent surface during the descent, until the bottom surface of the wafer contacts the inner bottom surface of the wafer groove 005. The guide post 002 further drives the positioning component 007 to move downwards, and the positioning component 007 is completely separated from the wafer, so that the wafer is completely located in the wafer slot 005. In this way, the wafer is guided to be accurately positioned into the wafer slot 005, which is of similar size to the wafer. This avoids the problem that the wafer slot needs to be enlarged in the traditional way to solve the problem that the difference between the inner diameter of the wafer slot and the outer diameter of the wafer is too large, which increases the edge effect of the wafer during heat treatment in the wafer slot and leads to a decrease in wafer yield. This improves the yield of the wafer after heat treatment.

[0049] Preferably, depending on the equipment process requirements, different models of equipment have different cavity sizes. Therefore, the number of carrier disks that can be set according to the cavity size is 4, 9 or 16. According to the above scheme, it can be ensured that multiple wafers can be accurately placed into the wafer slot.

[0050] Furthermore, since the positioning element 007 is a truncated cone shape with an upper diameter smaller than the lower diameter, the outer diameter of the wafer that the positioning element 007 can support is within a certain range. This range is the difference between the lower outer diameter and the upper outer diameter of the positioning element 007, which makes the wafer support device able to support a certain range of wafer specifications, increasing the range of applicable wafers of different specifications.

[0051] Furthermore, the positioning element 007 is in the shape of a frustum, a truncated pyramid, a pyramid, or a cone.

[0052] A preferred example, see reference Figure 9-10 As shown, it also includes a positioning component, which includes:

[0053] Displacement part 009 is connected to carrier plate 001 and is used to adjust the displacement of carrier plate 001 in the horizontal direction.

[0054] The positioning detection module is electrically connected to the displacement part 009. The positioning detection module is set on the carrier disk 001 and the top disk 003. When the guide post 002 is about to penetrate the carrier disk 001 to receive the wafer, the relative position of the guide post 002 and the through hole 006 is detected in real time, so that the through hole 006 and the guide post 002 are automatically aligned.

[0055] Specifically, due to factors such as vibration during the operation of the heat treatment equipment, misalignment errors may occur in the components within the equipment. For example, the guide post 002 and the through hole 006 cannot be precisely aligned every time. Therefore, the guide post 002 needs to be precisely aligned with the through hole 006 on the carrier tray 001 when carrying the wafer. By setting a positioning detection module on the top tray 003 and the carrier tray 001, and connecting the positioning detection module to the displacement part 009, when the guide post 002 receives the wafer through the through hole 006, the positioning detection module detects the relative position of the guide post 002 and the through hole 006 in real time, and drives the displacement part 009 to adjust the position of the carrier tray 001 in the horizontal direction. This allows the through hole 006 of the carrier tray 001 to automatically align with the guide post 002, enabling the guide post 002 to accurately pass through the through hole 006 to receive the wafer loaded by the robot. This avoids the situation where the guide post 002 and the through hole 006 cannot be precisely aligned, thereby improving the working efficiency of the heat treatment equipment in processing wafers. Heat treatment equipment operates at high temperatures, and the positioning and detection module typically has a heat insulation layer on its outer casing to protect the internal components from the effects of high external temperatures.

[0056] A preferred example, see reference Figure 10 As shown, the positioning detection module includes:

[0057] Multiple infrared emitters 011 are mounted on the top plate 003;

[0058] The same number of infrared receivers 010 as the infrared transmitters 011 are arranged. The infrared receivers 010 are arranged on the side of the carrier plate 001 facing the top plate 003 and correspond to the position of the infrared transmitters 011. They are used to receive the infrared signals from the infrared transmitters 011.

[0059] The controller is electrically connected to the infrared receiver 010 and the displacement unit 009. The controller controls the displacement unit 009 according to the relative position of the guide post 002 and the through hole 006, so that the displacement unit 009 adjusts the carrier plate 001 in the horizontal direction. When each infrared receiver 010 receives the infrared signal emitted by the corresponding infrared transmitter 011, each guide post 002 can be automatically aligned coaxially with the corresponding through hole 006.

[0060] Specifically, the infrared transmitter 011 is mounted on the top plate 003, and the infrared receiver 010 is mounted on the side of the carrier plate 001 facing the top plate 003, corresponding to the infrared transmitter 011. The controller is electrically connected to the infrared receiver 010 and the displacement unit 009. The infrared receiver 010 can receive infrared rays emitted from the infrared transmitter 011. The controller controls the displacement unit 009 to adjust the position of the carrier plate 001 in the horizontal direction in real time according to the infrared signals received by the infrared receiver 010. Only when each infrared receiver can receive the infrared signal emitted by the corresponding infrared transmitter will the position of the carrier plate 001 be automatically adjusted into place. That is, each guide post 002 can be coaxially aligned with the corresponding through hole 006, which improves the alignment accuracy between components.

[0061] In a preferred example, the top plate 003 has a Y-shaped structure and three ends. There are three infrared emitters 011, with each infrared emitter 011 located on one end.

[0062] Specifically, by drawing a circle using a triangle, three points are selected on the plate groove 005 as the setting points for the infrared transmitter 011. The infrared receivers 010 on the carrier plate 001 are set accordingly. When the three infrared receivers 010 simultaneously receive the infrared signals emitted by the three infrared transmitters 011, the guide post 002 and the through hole 006 are aligned coaxially. The infrared receiving and transmitting device set with the triangle points can provide a good auxiliary effect for the cooperation between the guide post 002 and the carrier plate 001.

[0063] In a preferred example, a gap is provided between the through hole 006 and the guide post 002.

[0064] Specifically, since there is a gap between the through hole 006 and the guide post 002, the guide post 002 can be easily assembled with the through hole 006, allowing the guide post 002 to move more smoothly relative to the through hole 006.

[0065] In a preferred example, the lifting structure includes:

[0066] The ejector pin 004 and the disc are arranged at one end of the ejector pin 004 and the disc is in contact with the top plate 003. The other end of the ejector pin 004 is connected to the telescopic drive component.

[0067] Specifically, when the lifting structure lifts and lowers the top plate 003, the displacement of the ejector pin 004 can be controlled by the telescopic drive component. The disc is set at one end of the ejector pin 004, and the disc is driven to lift and lower. After the disc contacts the top plate 003, it drives the guide column 002 on the top plate 003 to move vertically.

[0068] In a preferred example, the telescopic drive component includes a cylinder, the output end of which is connected to a push pin 004.

[0069] Specifically, the telescopic drive component uses a cylinder as the telescopic assembly, which is stable in operation and easy to use. The telescopic drive component can also use electric cylinders, hydraulic cylinders and other devices.

[0070] In a preferred example, the top plate 003, guide post 002, and positioning element 007 are made of quartz, and the carrier plate 001 is made of a ceramic tray.

[0071] Specifically, since the top plate 003, guide column 002 and positioning component 007 are made of quartz, which has high temperature resistance, the service life of the equipment components is improved. Other high temperature resistant materials can also be used. The carrier plate 001 is made of ceramic tray. Zirconia ceramic has the characteristics of corrosion resistance, wear resistance, no static electricity, non-reflective, and never turning white. It can replace stainless steel, hard alloy, tungsten steel and other metals.

[0072] In a preferred example, the displacement unit 009 includes a robotic arm.

[0073] Specifically, since the displacement unit 009 includes a robotic arm, when the positioning detection module detects that the position of the guide post 002 does not correspond to the position of the through hole 006 on the carrier plate 001, the robotic arm is used to make horizontal fine adjustments to the position of the carrier plate 001.

[0074] Example 1

[0075] Reference Figure 1-10As shown, this embodiment provides a wafer carrier device for a heat treatment apparatus, comprising:

[0076] At least one carrier plate 001 is movably disposed inside the heat treatment equipment. A plate groove 005 is provided on the upper side of the carrier plate 001, and a plurality of through holes 006 are provided on the carrier plate 001 along the circumference of the plate groove 005.

[0077] The lifting structure is located below the carrier plate 001 and can be raised and lowered under the drive of the telescopic drive component.

[0078] Top plate 003 is movably positioned between the lifting structure and the carrier plate 001;

[0079] Guide pillar 002, multiple guide pillars 002 are provided. The lower end of the guide pillar 002 is connected to the top plate 003. The upper end of each guide pillar 002 is movably connected through a through hole 006. A positioning element 007 is provided on the end face of the upper end of the guide pillar 002. The positioning element 007 is a truncated cone shape with an upper diameter smaller than the lower diameter. The lower diameter of the positioning element 007 is smaller than the diameter of the guide pillar 002. The positioning element 007 is coaxial with the guide pillar 002. The outer periphery of the lower end of the positioning element 007 is tangent to the groove wall of the plate groove 005.

[0080] In this embodiment, the positioning element 007 is conical.

[0081] In this embodiment, a positioning component is also included, which includes:

[0082] Displacement part 009 is connected to carrier plate 001 and is used to adjust the displacement of carrier plate 001 in the horizontal direction.

[0083] The positioning detection module is electrically connected to the displacement part 009. The positioning detection module is set on the carrier disk 001 and the top disk 003. When the guide post 002 is about to penetrate the carrier disk 001 to receive the wafer, the relative position of the guide post 002 and the through hole 006 is detected in real time, so that the through hole 006 and the guide post 002 are automatically aligned.

[0084] In this embodiment, the positioning detection module includes:

[0085] Multiple infrared emitters 011 are mounted on the top plate 003;

[0086] The same number of infrared receivers 010 as the infrared transmitters 011 are arranged. The infrared receivers 010 are arranged on the side of the carrier plate 001 facing the top plate 003 and correspond to the position of the infrared transmitters 011. They are used to receive the infrared signals from the infrared transmitters 011.

[0087] The controller is electrically connected to the infrared receiver 010 and the displacement unit 009. The controller controls the displacement unit 009 according to the relative position of the guide post 002 and the through hole 006, so that the displacement unit 009 adjusts the carrier plate 001 in the horizontal direction. When each infrared receiver 010 receives the infrared signal emitted by the corresponding infrared transmitter 011, each guide post 002 can be automatically aligned coaxially with the corresponding through hole 006.

[0088] In this embodiment, the top plate 003 has a Y-shaped structure and three ends. There are three infrared emitters 011, with each infrared emitter 011 located on one end.

[0089] In this embodiment, a gap is provided between the through hole 006 and the guide post 002.

[0090] In this embodiment, the lifting structure includes:

[0091] The ejector pin 004 and the disc are arranged at one end of the ejector pin 004 and the disc is in contact with the top plate 003. The other end of the ejector pin 004 is connected to the telescopic drive component.

[0092] In this embodiment, the telescopic drive component includes a cylinder, and the output end of the cylinder is connected to the ejector pin 004.

[0093] In this embodiment, the top plate 003, guide post 002 and positioning element 007 are made of quartz, and the carrier plate 001 is made of a ceramic tray.

[0094] In this embodiment, the displacement unit 009 includes a robotic arm.

[0095] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A wafer carrier device for a heat treatment apparatus, characterized in that, include: At least one carrier plate is movably disposed inside the heat treatment equipment. A plate groove is provided on the upper side of the carrier plate, and a plurality of through holes are provided on the carrier plate along the circumference of the plate groove. A lifting structure is provided below the carrier plate, and the lifting structure can be raised and lowered under the drive of the telescopic drive component; A top plate, which is movably disposed between the lifting structure and the carrier plate; The guide post is provided in multiple configurations. The lower end of each guide post is connected to the top plate. The upper end of each guide post movably passes through a through hole. A positioning element is provided on the upper end face of the guide post. The positioning element is a truncated cone shape with an upper diameter smaller than its lower diameter. The lower diameter of the positioning element is smaller than the diameter of the guide post. The positioning element is coaxial with the guide post. The outer periphery of the lower end of the positioning element is tangent to the groove wall of the plate groove. The positioning component includes: A displacement section is connected to the carrier disk, and the displacement section is used to adjust the displacement of the carrier disk in the horizontal direction; A positioning detection module is electrically connected to the displacement section and is disposed on the carrier disk and the top disk. The positioning detection module is used to detect the relative position of the guide post and the through hole in real time when the guide post is about to penetrate the carrier disk to receive the wafer, so that the through hole and the guide post are automatically aligned.

2. The wafer carrier device of the heat treatment equipment according to claim 1, characterized in that, The positioning element is in the shape of a frustum, a truncated pyramid, a pyramid, or a cone.

3. The wafer carrier device of the heat treatment equipment according to claim 1, characterized in that, The positioning detection module includes: Multiple infrared emitters are mounted on the top plate; An infrared receiver is provided in the same number as the infrared transmitter. The infrared receiver is located on the side of the carrier plate facing the top plate and corresponds to the position of the infrared transmitter, and is used to receive the infrared signal from the infrared transmitter. The controller is electrically connected to the infrared receiver and the displacement unit. The controller controls the displacement unit according to the relative position of the guide post and the through hole, so that the displacement unit adjusts the carrier plate in the horizontal direction. When each infrared receiver receives the infrared signal emitted by the corresponding infrared transmitter, each guide post can automatically align with the corresponding through hole coaxially.

4. The wafer carrier device of the heat treatment equipment according to claim 3, characterized in that, The top plate has a Y-shaped structure and three ends. There are three infrared emitters, each of which is located on one of the ends.

5. The wafer carrier device of the heat treatment equipment according to claim 1, characterized in that, A gap is provided between the through hole and the guide post.

6. The wafer carrier device of the heat treatment equipment according to claim 1, characterized in that, The lifting structure includes: A push pin and a disc, wherein the disc is disposed at one end of the push pin and contacts the push plate, and the other end of the push pin is connected to the telescopic drive component.

7. The wafer carrier device of the heat treatment equipment according to claim 6, characterized in that, The telescopic drive component includes a cylinder, and the output end of the cylinder is connected to the ejector pin.

8. The wafer carrier device of the heat treatment equipment according to claim 1, characterized in that, The top plate, the guide post, and the positioning element are made of quartz, and the carrier plate is made of a ceramic tray.

9. The wafer carrier device of the heat treatment equipment according to claim 1, characterized in that, The displacement unit includes a robotic arm.

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