Maintenance method for a polishing system and related articles

Abstract

Embodiments herein relate to chemical dip applicators and associated application methods that can be used to provide a hydrophobic surface on a CMP system component. In one embodiment, a method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove polishing fluid residue therefrom and applying a chemical solution that results in hydrophobicity to the surface of the polishing system component.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacture of semiconductor devices. Specifically, embodiments herein relate to methods for maintaining hydrophobic component surfaces in a CMP system and associated hydrophobicity applicator articles. Background Technology

[0002] Chemical mechanical polishing (CMP) is commonly used in the fabrication of semiconductor devices to planarize or polish material layers deposited on substrate surfaces. In a typical CMP process, the substrate is held in a substrate carrier that presses the back side of the substrate toward a rotating polishing pad in the presence of a polishing fluid. Generally, the polishing fluid comprises an aqueous solution of one or more chemical components and nanoscale abrasive particles suspended in the aqueous solution. Material is removed across the surface of the material layer in contact with the polishing pad through a combination of the chemical and mechanical activity provided by the polishing fluid and the relative motion between the substrate and the polishing pad.

[0003] CMP is generally considered a wet process, and the accumulation of undesirable byproducts of the polishing fluid, which has dried on the surface, is largely unavoidable within the humid environment of a CMP system. This accumulation typically includes agglomerated abrasive particles left behind as the polishing fluid, oversprayed from the CMP process, dries on the system surface. Unlike individual nanoscale abrasive particles that remain suspended in carefully formulated polishing fluid, these dried agglomerated particles can cause significant damage to the substrate surface if they come into contact with the substrate during the CMP process. This damage often manifests as scratches on the substrate surface, such as microscratches, which can adversely affect the performance of devices formed thereon, or in some cases, render the device inoperable.

[0004] Therefore, there is a need in this field for objects and related methods to solve the problems described above. Summary of the Invention

[0005] This disclosure generally relates to chemical impregnation applicators and related application methods that can be used to provide hydrophobic surfaces on CMP system components.

[0006] In one embodiment, a method is provided for forming a hydrophobic coating on the surface of a polishing system component. The method includes cleaning the surface of the polishing system component to remove polishing fluid residue therefrom and applying a chemical solution that results in hydrophobicity to the surface of the polishing system component.

[0007] In another embodiment, a method is provided for forming a hydrophobic coating on the surface of a polishing system component. The polishing system component is disposed within a substrate processing environment of the polishing system. The method includes cleaning the surface of the polishing system component to remove polishing fluid residue therefrom and applying a chemical solution that results in hydrophobicity to the surface of the polishing system component. In some embodiments, the hydrophobic solution is applied to the surface of the polishing system component without removing the polishing system component from the substrate processing environment.

[0008] In another embodiment, a hydrophobic applicator is provided. Generally, the hydrophobic applicator includes an applicator object formed of an open-celled foam material with a porosity of about 60% or greater and a chemical solution that causes hydrophobicity. In some embodiments, the applicator and the chemical solution causing hydrophobicity are packaged together in a sealed container. Attached Figure Description

[0009] To gain a more detailed understanding of the features described above in this disclosure, a more specific description of the disclosure, which has been briefly summarized above, can be obtained by referring to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings only illustrate typical embodiments of this disclosure and are not intended to limit its scope, as other equivalent and effective embodiments are permissible.

[0010] Figure 1A This is a schematic side view of an exemplary polishing system according to one embodiment that can be used with the methods provided herein.

[0011] Figure 1B It is based on one implementation method and Figure 1A A schematic cross-sectional view of a portion of a substrate carrier used in conjunction with a polishing system.

[0012] Figure 2 This is a schematic isometric view of a hydrophobic applicator that can be used to perform the methods described herein, according to one embodiment.

[0013] Figure 3 This is a schematic isometric view of a hydrophobic applicator that can be used to perform the methods described herein, according to another embodiment.

[0014] Figure 4A This is a schematic isometric view of a hydrophobic applicator that can be used to perform the methods described herein, according to another embodiment.

[0015] Figure 4B This further illustrates the compatibility according to one embodiment. Figure 4A A schematic isometric view of the clamp used with the hydrophobic applicator described in the figure.

[0016] Figure 5 This is a schematic isometric view of a hydrophobic applicator that can be used to perform the methods described herein, according to another embodiment.

[0017] Figure 6 These are aspects of one implementation method that can be used to perform the methods described herein. Figure 1A A schematic side view of a portion of the polishing system and the applicator device described in the figure.

[0018] Figure 7 This is a diagram illustrating a method of applying a hydrophobic coating to the surface of a polishing system component according to one embodiment.

[0019] Figure 8 It is based on Figure 7 The method described herein forms a portion of the surface of a polishing system component, and according to one embodiment, a schematic cross-sectional view of the contact angle of water droplets disposed on the surface is further shown.

[0020] For ease of understanding, the same reference numerals have been used to identify common elements in the figures where possible. It is anticipated that elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0021] Embodiments of this disclosure generally relate to objects used for maintaining chemical mechanical polishing (CMP) systems. More specifically, embodiments herein relate to hydrophobic applicators and associated methods that can be used to provide hydrophobic surfaces on CMP system components.

[0022] Typical polishing fluids used in CMP processes may comprise an aqueous solution of one or more chemical components along with nanoscale abrasive particles suspended in the aqueous solution. Typically, dried residues of the polishing fluid, such as abrasive particle aggregates, accumulate on or near the surfaces of components positioned above or near the polishing pad during the polishing process. For example, as polishing fluid is dispensed onto CMP system components positioned above the polishing pad (such as substrate carriers, pad conditioner assemblies, or fluid delivery arms), dried residues of the polishing fluid typically accumulate on the surfaces of these CMP system components. If these accumulated residues are not removed, the abrasive particle aggregates can detach from the component surface onto the polishing pad and cause undue damage to the material surface of the substrate subsequently polished thereon, such as scratches. Removing accumulated residues is typically laborious and time-consuming. Aggregated abrasive particles often form a cement-like layer on the component surface, thus resulting in undesirable, prolonged, and frequent polishing system downtime for consumable replacement and preventative maintenance (PM) procedures.

[0023] Typically, the surface of a polished component exposed to oversprayed polishing fluid is formed of a material that is chemically and / or corrosively resistant to the polishing fluid. In some embodiments, the surface may be formed of a hydrophobic material and / or have a hydrophobic coating, making it easier for droplets of polishing fluid to flow off the component surface before drying and forming undesirable polishing fluid residues. Unfortunately, the fragile liquid-surface interface that provides hydrophobicity for such materials and / or coatings has limited durability. Therefore, in a typical CMP processing environment, the hydrophobicity of the surface of a CMP component can deteriorate significantly long before the component's service life ends. For example, routine maintenance procedures for cleaning polishing fluid residues from CMP components and the materials used with them (such as abrasive cleaning cloths, corrosive chemicals, and particles in accumulated polishing fluid residues) often abrade the component surface, thus reducing its hydrophobicity. Once the component surface has been abraded, the rate of polishing fluid residue accumulation on it increases due to the reduced ability of the surface to repel droplets of polishing fluid. Therefore, embodiments herein advantageously provide methods for periodically restoring the hydrophobicity of CMP component surfaces and hydrophobic applicators that can be used to implement these methods. In this paper, the hydrophobic applicator is packaged in a single-use encapsulation container, including the applicator object and the hydrophobic solution, in order to avoid common limitations on the storage and transportation of liquid containers within the substrate processing section of a semiconductor device manufacturing facility.

[0024] In some implementations, the method includes treating the component surface during a CMP consumable replacement procedure. CMP consumables generally include items used in the CMP process, which, depending on the number of substrates processed on or with them, or the accumulated substrate processing time, have a limited lifespan and therefore require periodic replacement due to wear and tear associated with the substrate processing. Examples of CMP consumables include polishing pads, pad adjustment discs, and some components of substrate carriers. The method generally involves cleaning any accumulated polishing fluid residue from the CMP component surface and subsequently treating the component surface to refresh its hydrophobicity. The newly refreshed hydrophobic surface advantageously reduces the amount of polishing fluid residue that can accumulate on the component surface between consumable replacements or other maintenance procedures, which in turn advantageously reduces cleaning time and associated manpower. Figure 1A The figure illustrates an exemplary polishing system that can benefit from the embodiments described herein.

[0025] Figure 1A This is a schematic side view of an exemplary polishing system 100 according to one embodiment, which can benefit from the applicator and related methods provided herein. Figure 1B It is based on one implementation method and Figure 1A A schematic cross-sectional view of a portion of the substrate carrier assembly 104 used in conjunction with the polishing system 100.

[0026] Typically, the polishing system 100 has a frame (not shown) and multiple panels 101 that define a substrate processing environment 103. The polishing system 100 includes multiple polishing stations 102 (one shown) and multiple substrate carrier assemblies 104 (one shown) disposed within the substrate processing environment 103.

[0027] like Figure 1A As shown, the polishing station 102 includes a platform 106, a polishing pad 108 mounted on and fixed to the platform 106, a pad adjuster assembly 110 for cleaning and / or restoring the polishing pad, and a fluid delivery arm 112 for distributing polishing fluid to the polishing pad 108. Here, the platform 106 is positioned above a base plate 114 and limited by a platform shield 120 (both illustrated in cross-sectional view), which together define a drainage basin 116. The drainage basin 116 collects fluid rotating radially outward from the platform 106 and discharges the fluid via a drain port 118 in fluid communication with it.

[0028] The pad adjuster assembly 110 is used to clean and / or restore the polishing pad 108 by means such as blowing polishing byproducts from it with a brush (not shown) and / or by abrading the polishing pad adjuster disc 124 (e.g., a diamond dip disc) against it. The pad adjustment operation can be performed between polishing substrates (i.e., off-site adjustment), simultaneously with the polishing substrates (i.e., in-situ adjustment), or both.

[0029] Here, the pad adjuster assembly 110 includes a first actuator 126 disposed on a base plate 114, an adjuster arm 128 coupled to the first actuator 126, and an adjuster mounting plate 130 having an adjuster disk 124 fixedly coupled thereto. A first end of the adjuster arm 128 is coupled to the first actuator 126, and the mounting plate 130 is coupled to a second end of the adjuster arm 128 remote from the first end. The first actuator 126 is used to sweep the adjuster arm 128 about axis C, and thus sweep the adjuster disk 124, causing the adjuster disk 124 to oscillate between the inner diameter and the outer diameter of the polishing pad 108, while the polishing pad 108 rotates beneath it. In some embodiments, the pad adjuster assembly 110 further includes a second actuator 132 disposed at and coupled to the second end of the adjuster arm 128, the second actuator 132 being used to rotate the adjuster disk 124 about axis D. Typically, the mounting plate 130 is coupled to the second actuator 132 using a shaft 134 disposed therebetween.

[0030] Generally, the rotating substrate carrier assembly 104 swirls back and forth from the inner diameter to the outer diameter of the platform 106, while the platform 106 and therefore the polishing pad 108 rotates about the platform axis B beneath it. Polishing fluid is delivered to the polishing pad 108 via a fluid delivery arm 112 positioned above it, and further to the polishing interface between the polishing pad 108 and the substrate 122, by rotating the polishing pad 108 about the platform axis B. Typically, the fluid delivery arm 112 further includes a plurality of nozzles (not shown) for delivering relatively high-pressure vapor of cleaning or fluid (e.g., deionized water) to the polishing pad 108.

[0031] like Figure 1B As shown, the substrate carrier assembly 104 has a carrier head 140, a carrier ring assembly 142 coupled to the carrier head 140, and a flexible membrane 148 disposed radially inward from the carrier ring assembly 142 to provide a mounting surface for the substrate 122. The carrier ring assembly 142 includes a lower annular portion and an upper annular portion, here a substrate retaining ring 144 and a backing ring 146, respectively. The substrate retaining ring 144 is typically formed of a polymer bonded to the backing ring 146 using an adhesive layer (not shown) disposed therebetween. The backing ring 146 is formed of a rigid material (such as metal or ceramic) and is secured to the carrier head 140 using a plurality of fasteners (not shown). Examples of suitable materials for forming the substrate retaining ring 144 and the backing ring 146 include any or a combination of polishing fluid chemically resistant polymers, metals, and / or ceramics described herein. The flexible membrane 148 is typically coupled to the carrier head 140 using one or more annular membrane clamps 150 to jointly define the volume 152.

[0032] During substrate processing, a substrate holding ring 144 surrounds substrate 122 to prevent substrate 122 from sliding off substrate carrier assembly 104. Typically, during polishing, a pressurized volume 152 is applied to cause the flexible film 148 to exert a downward force on substrate 122, while substrate carrier assembly 104 rotates about carrier axis A, thus pushing substrate 122 against polishing pad 108. Before and after polishing, a vacuum is applied to volume 152, causing the flexible film 148 to deflect upward to create a low-pressure pocket between the flexible film 148 and substrate 122, thus vacuum-chucking substrate 122 onto substrate carrier assembly 104.

[0033] Typically, the inner diameter of the substrate holding ring 144 is larger than the diameter of the substrate 122 to allow for some spacing therebetween during polishing processes and substrate loading and unloading operations, such as greater than about 2 mm or more, or greater than about 3 mm or more. Similarly, the outer diameter of the substrate mounting surface of the flexible membrane 148 is smaller than the inner diameter of the substrate holding ring 144 to allow the flexible membrane 148 to move relative to it. A gap G is created between the substrate 122 and the substrate holding ring 144, and between the flexible membrane 148 and the substrate holding ring 144. Typically, polishing fluid will enter the gap G, and polishing fluid residue may form on one or more surfaces therein, such as the radially inward surfaces of one or both of the substrate holding ring 144 and the back ring 146, and the radially outward surfaces of one or more of the annular membrane clamp 150. In some embodiments, the substrate carrier assembly 104 further includes a top cover 154 disposed on the carrier head 140.

[0034] In this document, one or more surfaces of the polishing system 100 and / or its components (e.g., the surfaces of the pad adjuster assembly 110, the platform shield 120, and the substrate carrier assembly 104) are treated with the hydrophobic applicator and / or spraying methods described herein to prevent and / or substantially reduce the accumulation of polishing fluid residues thereon.

[0035] Figure 2 This is a schematic isometric view of a hydrophobic applicator 200 according to one embodiment, which can be used with the methods described herein. Here, the hydrophobic applicator 200 includes an applicator object 202 impregnated with a chemical solution 204 that results in hydrophobicity. In this embodiment, the applicator object 202 is formed of a fiber-free foamed material, such as polyvinyl alcohol (PVA) or polyurethane (PU) foam suitable for cleanroom environments in semiconductor device manufacturing facilities. Typically, the foamed material used to form the applicator object 202 has an open-cell structure and a porosity of about 60% or greater, such as about 65% or greater, about 70% or greater, about 75% or greater, about 80% or greater, or about 90% or greater. In some embodiments, the foamed material used to form the applicator object 202 has a porosity of about 50 kg / m³. 3 Or a higher density, such as approximately 60 kg / m³ 3 Or larger, approximately 70 kg / m 3 Or even larger, for example, about 80 kg / m 3Or larger. In some embodiments, the applicator object 202 is soft and pliable at room temperature and therefore typically has a glass transition temperature (Tg) of about 25°C or less, such as about 20°C or less, about 15°C or less, or, for example, about 10°C or less. One or both of the pore size and density may vary throughout the applicator object 202 (as shown), or one or both of the pore size and density may be uniformly distributed across the applicator object 202. In other embodiments, the applicator object 202 may be formed from a suitable fiber-based synthetic material, such as polyester fabric.

[0036] Here, the hydrophobic chemical solution 204 includes solutions, mixtures, and / or emulsions having a solvent and a hydrophobic agent. In some embodiments, the hydrophobic chemical solution 204 further includes a surfactant, such as a carboxylic acid-based component. Examples of suitable solvents include hydrocarbon solvents, fluorinated solvents, or combinations thereof. In some embodiments, the fluorinated solvent is a hydrofluoroether (HFE)-based solvent, such as 2-trifluoromethyl-3-ethoxydodecylfluorohexane. Examples of suitable hydrophobic agents include monomers, oligomers, and / or other functional groups of siloxanes, fluoroacrylates, or combinations thereof. Examples of suitable fluorinated acrylic monomers include: pentafluorophenyl acrylate, hexafluoroisopropyl methacrylate; 1H,1H,3H-hexafluorobutyl methacrylate; 2,2,2-trifluoroethyl acrylate; 2,2,2-trifluoroethyl methacrylate; 1H,1H,2H,2H-heptafluorodecyl methacrylate (HDFDMA); 1H,1H,5H-octafluoropentyl methacrylate; and combinations thereof. Carboxylic acid-based components can be carboxylic acids, carboxylates, carboxylic acid derivatives, or combinations thereof.

[0037] Here, before or simultaneously with encapsulation in container 206 (shown in partial cross-section), the applicator object 202 is impregnated with a hydrophobic chemical solution 204, and the container is sealed to prevent exposure of the hydrophobic applicator 200 to the atmosphere. Container 206 may be formed of any suitable material generally acceptable for use in cleanroom environments, such as antistatic polyethylene. Generally, the encapsulated applicator object 202 is not fully saturated with the hydrophobic chemical solution 204 to provide improved control over the thickness of the hydrophobic coating formed during the application method described herein. For example, if X represents the maximum amount of hydrophobic chemical solution 204 that can be absorbed by the applicator object 202 by weight, the encapsulated applicator object 202 may have an actual saturation of about 0.9X or less by weight, such as about 0.8X or less, about 0.7X or less, about 0.6X or less, about 0.5X or less, or about 0.4X or less. In some embodiments, the encapsulated applicator object 202 has an actual saturation of the hydrophobic chemical solution 204 in the range of about 0.1X to about 0.5X by weight, such as about 0.2X to about 0.5X, or about 0.3X to about 0.5X. In some embodiments, the encapsulated applicator object 202 has an actual saturation of the hydrophobic chemical solution 204 in the range of about 0.5X to about 0.9X by weight, such as about 0.6X to about 0.9X, or about 0.7X to about 0.9X. In some embodiments, the encapsulated applicator object 202 has an actual saturation of the hydrophobic chemical solution 204 in the range of about 0.2X to about 0.8X by weight, such as about 0.3X to about 0.7X, or about 0.4X to about 0.5X.

[0038] Figure 3 This is a schematic isometric view of a hydrophobic applicator 300 according to another embodiment, which can be used with the methods described herein. Here, the container 306 (shown in partial cross-section) is substantially the same as... Figure 2 The container 206 described herein is similar to and further includes an impermeable membrane 308 that divides the container 306 into a first volume 310 and a second volume 312. The applicator object 302 and the hydrophobic chemical solution 204 are disposed in the first volume 310 and the second volume 312, respectively, and are thus separated by the membrane 308. Prior to the method described herein, the user manipulates the container 306 to disrupt the membrane 308, thereby allowing the hydrophobic chemical solution 204 to be absorbed by and / or coated onto the surface of the applicator object 302 to form a hydrophobic applicator 300. Here, the applicator object 302 is substantially similar to... Figure 2The applicator object 202 described herein is similar to or the same. Typically, once the film 308 is broken, the amount of the hydrophobic chemical solution 204 disposed in the second volume 312 is selected to provide the desired actual saturation of the applicator object 302 with the hydrophobic chemical solution 204. In some embodiments, the desired actual saturation of the applicator object 302 is as follows: Figure 2 The actual saturation of the applicator object 202 described herein is within the same range.

[0039] Figure 4A This is a schematic isometric view of a hydrophobic applicator 400 according to another embodiment, which can be used with the methods described herein. The hydrophobic applicator 400 includes an applicator object 402 impregnated with a hydrophobic chemical solution 204. Here, the size and shape of the applicator object 402 are adjusted to apply the hydrophobic chemical solution 204 to the surface of the pad adjuster assembly 110, such as... Figure 1A The regulator mounting plate 130 and the second actuator 132 are mounted on the surface therebetween.

[0040] The applicator object 402 includes a cylindrical disc having a diameter and a thickness, and an opening 406 sized to fit around the shaft 134. The diameter is substantially the same as or larger than the diameter of the adjuster mounting plate 130, and the thickness is substantially the same as or smaller than the distance between the mounting plate 130 and the second actuator 132. For example, in some embodiments, the applicator object 402 has a diameter of about 100 mm or greater, such as about 150 mm or greater, or about 200 mm or greater, or between about 100 mm and about 300 mm, and a thickness of about 50 mm or less, such as about 40 mm or less, or about 30 mm or less, or between about 10 mm and about 50 mm. An opening 406, generally circular in shape, is disposed through the center of the cylindrical disk (or adjacent to the cylindrical disk) and has a diameter that is generally the same as or slightly smaller than the diameter of the shaft 134. For example, in some embodiments, the diameter of the opening 406 is between about 10 mm and about 30 mm, such as between about 10 mm and about 20 mm. A slit 408 connects the opening 406 to the outer periphery of the applicator object 402, such that the applicator object 402 can be positioned around the shaft 134 without removing the mounting plate 130 from the pad adjuster assembly 110.

[0041] In some embodiments, the material used to form the applicator article 402 is substantially the same as that used to form Figure 2 The materials of the applicator object 202 described herein are similar to or the same. The applicator object 402 and the chemical solution 204 that causes hydrophobicity can be used respectively in… Figure 2 and Figure 3 Encapsulated by either container 206 or 306 as described herein. In some embodiments, the actual or desired actual saturation of the applicator object 402 is related to the target Figure 2 The actual saturation of the applicator object 202 described herein is within the same range.

[0042] Figure 4B This is a schematic isometric view further illustrating a clamp 412 that can be used with a hydrophobic applicator 400 according to some embodiments. Figure 4B As shown, clamp 412 secures the edge of the hydrophobic applicator 400 and provides an ergonomic handle for the user to facilitate the method described herein. The clamp is typically formed of a non-rigid or semi-rigid material with suitable chemical resistance to polishing fluids, such as non-rigid or semi-rigid polymers, rubber, or synthetic rubber materials, which allows for hand strength to hold the hydrophobic applicator 400 in place during the method described herein. In some embodiments, the material used to form clamp 412 has a Shore A hardness in the range of about 60 to about 85.

[0043] Figure 5 This is a schematic isometric view of a hydrophobic applicator 500 according to another embodiment, which can be used with the methods described herein. The hydrophobic applicator 500 includes an applicator article 502 impregnated with a chemical solution 204 that causes hydrophobicity. In some embodiments, the material used to form the applicator article 502 is substantially the same as that used to form... Figure 2 The material of the applicator object 202 described herein is similar to or the same as that used in some embodiments. In some embodiments, the actual or desired actual saturation of the applicator object 502 with the chemical solution 204 that causes hydrophobicity is equal to or similar to that used for... Figure 2 The actual saturation of the applicator object 202 described herein is within the same range.

[0044] Here, the applicator object 502 is secured to a fastener layer, such as a first fastener layer 508, using an adhesive 506. In some embodiments, the first fastener layer 508 includes a hook and a loopfastener system for mounting the hydrophobic applicator 500. Figure 6 The applicator device 600 described herein. An applicator object 502 having a first fastener layer 508 to which it is fixed and a chemical solution 204 causing hydrophobicity can be used respectively in… Figure 2 and Figure 3 It is encapsulated in either container 206 or 306 as described herein.

[0045] Figure 6This is a schematic side view of a polishing system 100, illustrating an applicator device 600 according to one embodiment, which can be used in conjunction with the method described herein for applying a hydrophobic chemical solution 204 to a portion of a platform shield 120. Typically, the applicator device 600 is used between polishing pad replacement procedures to push a hydrophobic applicator 500 against the radially inward surface of the platform shield 120, thus applying a layer of the hydrophobic chemical solution 204 thereto. For example, in Figure 6 In this process, the applicator device 600 is temporarily coupled to the circumferential edge of the platform 106 using a clamp 602 disposed thereon and / or a fastener 604 (shown in dashed lines) disposed in a corresponding opening on the radially outward surface of the platform 106.

[0046] Here, the applicator device 600 includes an applicator mounting portion 606 and a fastener layer, such as a second fastener layer 608, which includes a second portion of a hook and loop fastener system. The second fastener layer 608 is secured to the surface of the applicator mounting portion 606 using an adhesive, and the hydrophobic applicator 500 is temporarily secured to the applicator mounting portion 606 using the hook and loop fastener system. Typically, the applicator device 600 further includes features for rotating as the platform 106 about the platform axis B. Figure 1A The elastic member 610, such as a spring, of the hydrophobic applicator 500 is pushed against the radially inward surface of the platform shield 120. The applicator device 600 advantageously implements the method described herein without requiring the time-consuming procedure of removing the platform shield 120 from the polishing system 100, thus resulting in the desired reduction of system downtime for routine maintenance.

[0047] Figure 7 This illustrates a polishing system component (such as...) according to one embodiment. Figure 1A The figure shows a method 700 for applying a hydrophobic coating to the surface of a component of a polishing system 100. Typically, method 700 is performed during polishing system downtime in a regularly scheduled maintenance procedure, such as a consumables replacement procedure or preventive maintenance (PM) procedure.

[0048] Figure 8This is a schematic cross-sectional view of a portion of a polishing system component 800 used to illustrate various aspects of method 700. Here, polishing system component 800 refers to any component and / or other surface of polishing system 100 that may be exposed to oversprayed polishing fluid during a substrate polishing process. For example, polishing system component 800 may be any of the following: panel 101, substrate carrier assembly 104, components of pad adjuster assembly 110, fluid delivery arm 112, platform 106 and / or its peripheral surface, platform shield 120, or any other surface or component used with and / or disposed within the substrate processing environment 103 of polishing system 100. Typically, system component 800 and / or its pre-applied surface 802 are formed of a polishing fluid chemically resistant material. Examples of suitable materials include silica glass, quartz, ceramics (e.g., alumina), polishing fluid chemically resistant metals, and polishing fluid chemically resistant polymers. Examples of suitable metals include stainless steel alloys, nickel-chromium alloys, nickel-chromium-molybdenum alloys, nickel-iron-chromium-molybdenum alloys, cobalt-nickel-chromium-molybdenum alloys, and titanium alloys. Examples of suitable polymers include polyphenylsulfide (PPS), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyimide (PI), polybutylene terephthalate (PBT), acetal polyoxymethylene (POM), polyamideimide (PAI), polytetrafluoroethylene (PTFE), polybenzimidazole (PBI), polyetheramine (PEI), and their complexes.

[0049] At activity 705, method 700 includes removing polishing fluid residue from a surface of a polishing system component, such as pre-applied surface 802. Typically, removing polishing fluid residue from a component involves pushing a cleaning object, such as a sponge or cloth, against pre-applied surface 802 in the presence of a cleaning fluid. In some embodiments, the cleaning object may have an abrasive surface. Generally, the cleaning fluid is selected based on the type of polishing fluid used with the exemplary polishing system 100 and the suitability of the cleaning fluid to dissolve residual deposits of that polishing fluid. Examples of suitable cleaning fluids include diluted solutions of hydrogen peroxide, ammonium hydroxide, and various acids, such as citric acid. In some embodiments, the cleaning fluid may comprise a diluted aqueous solution having at least some of the same components used in the polishing fluid. For example, if the polishing fluid includes potassium hydroxide, the cleaning fluid may comprise an aqueous solution of potassium hydroxide. In some embodiments, the cleaning fluid is deionized water. In some embodiments, the cleaning fluid includes a surfactant. In some embodiments, removing polishing fluid residue also removes a portion of a hydrophobic coating applied during a previous consumable replacement or preventative maintenance procedure. Typically, after removing polishing fluid residue from the polishing system component 800, the pre-applied surface 802 is rinsed with deionized water and dried, for example, by blowing the surface with clean dry air (CDA).

[0050] At activity 710, method 700 includes applying a hydrophobic chemical solution (such as hydrophobic chemical solution 204 described herein) to a pre-application surface 802 of a polishing system component. Here, the application of hydrophobic chemical solution 204 to the pre-application surface 802 forms a hydrophobic coating 804 having a post-application surface 806. Here, water droplets 808 disposed on the system component form a contact angle θ with the post-application surface 806 of approximately 60° or greater, approximately 65° or greater, approximately 70° or greater, approximately 75° or greater, approximately 80° or greater, approximately 85° or greater, approximately 90° or greater, approximately 95° or greater, approximately 100° or greater, approximately 105° or greater, or, for example, approximately 110° or greater. In some embodiments, the hydrophobic coating 804 has a thickness T of about 100 μm or less, such as about 85 μm or less, about 80 μm or less, about 75 μm or less, about 70 μm or less, about 65 μm or less, about 60 μm or less, about 55 μm or less, or about 50 μm or less.

[0051] As discussed herein, repeated exposure to polishing fluid and abrasion and corrosion of the pre-applied surface 802 from its cleaning polishing fluid residues can reduce the hydrophobicity of the pre-applied surface 802 during the service life of the system component 800. Therefore, in some embodiments, the pre-applied surface 802 may have a water contact angle of about 100° or less, such as about 95° or less, about 90° or less, about 85° or less, about 80° or less, about 75° or less, about 70° or less, about 65° or less, about 60° or less, about 55° or less, or about 50° or less. In some embodiments, applying a chemical solution 204 that induces hydrophobicity advantageously provides an increase in hydrophobicity of about 10% or more, such as about 15% or more, about 20% or more, about 25% or more, about 30% or more, about 35% or more, about 40% or more, about 45% or more, about 50% or more, about 65% or more, about 70% or more, for example about 75% or more. Here, the increase in hydrophobicity is determined using the difference in water droplet contact angle θ between the pre-applied surface 802 and the post-applied surface 806.

[0052] In some embodiments, the hydrophobic coating 804 formed on the surface of system component 800 exhibits oleophobic surface properties, for example, increased resistance to non-aqueous contaminants such as dust, oil, and / or other particles. Therefore, in some embodiments, the hydrophobic coating 804 has an oil contact angle of about 50° or greater (here, the hexadecane droplet contact angle), such as about 55° or greater, about 60° or greater, about 65° or greater, for example, about 70° or greater. The hexadecane droplet contact angle is measured relative to the subsequently applied surface 806, such as for… Figure 8 The contact angle θ of the water droplet is shown in the figure.

[0053] In some embodiments, applying the hydrophobic chemical solution 204 to system component 800 includes wiping or pushing an applicator object impregnated with the hydrophobic chemical solution 204 against a pre-application surface 802. For example, in some embodiments, method 700 may be performed using any of the hydrophobic applicators 200, 300, 400, and / or 500 described herein.

[0054] In some embodiments of method 700, a hydrophobic solution is applied to the surface of the polishing system component without removing the polishing system component from the substrate processing environment. For example, in some embodiments, system component 800 includes platform shield 120 and uses... Figure 6The applicator device 600 described herein applies a hydrophobic chemical solution 204 to the radially inward surface of the platform shield 120. In those embodiments, applying the hydrophobic chemical solution 204 may include rotating the polishing platform 106 and thus rotating the applicator device 600 coupled thereto to push the hydrophobic applicator 500 against the radially inward surface of the platform shield 120.

[0055] In other embodiments, system component 800 includes components of pad adjuster assembly 110, such as first actuator 126, adjuster arm 128, adjuster mounting plate 130, second actuator 132, shaft 134, or combinations thereof. In those embodiments, applying the chemical solution 204 that results in hydrophobicity may include sliding the hydrophobic applicator 400 into a gap disposed between the adjuster mounting plate 130 and the second actuator 132, such that the shaft 134 is positioned through opening 406 before the hydrophobic applicator 400 is moved about the shaft 134.

[0056] In another embodiment, after the system component 800 has been removed from the substrate processing environment 103, a hydrophobic coating 804 may be applied to the surface of the system component 800. In some embodiments, the hydrophobic coating 804 is applied to a pre-application surface 802 of the system component 800 using an atomization method to generate droplets of a hydrophobic chemical solution 204 and expose the pre-application surface 802 to these droplets; this is referred to herein as a "spraying process". Examples of suitable spraying processes include ultrasonic spraying using an ultrasonic nozzle, pressure spraying, and electrospraying.

[0057] A typical ultrasonic spraying process involves operating an ultrasonic nozzle to convert high-frequency sound waves into mechanical energy that is transmitted into a liquid (e.g., a chemical solution 204 that results in hydrophobicity). This mechanical energy atomizes the liquid as it exits the nozzle orifice. The ultrasonic nozzle is configured to operate at a resonant frequency that determines the intermediate droplet size of the liquid droplets it provides. Generally, ultrasonic nozzles operating at higher frequencies provide relatively smaller intermediate droplet sizes compared to ultrasonic nozzles operating at lower frequencies. In one embodiment, an ultrasonic nozzle operating at frequencies in the range of 10 kHz to 200 kHz is used to apply a chemical solution 204 that results in hydrophobicity, such as about 200 kHz or less, about 190 kHz or less, about 180 kHz or less, about 170 kHz or less, about 160 kHz or less, about 150 kHz or less, about 140 kHz or less, about 130 kHz or less, about 120 kHz or less, about 110 kHz or less, about 100 kHz or less, about 90 kHz or less, about 80 kHz or less, about 70 kHz or less, about 60 kHz or less, about 50 kHz or less, about 40 kHz or less, for example about 30 kHz or less. In some implementations, the ultrasonic nozzle operates at frequencies of about 10 kHz or greater, such as about 20 kHz or greater, about 30 kHz or greater, about 40 kHz or greater, about 50 kHz or greater, about 60 kHz or greater, about 70 kHz or greater, about 80 kHz or greater, about 90 kHz or greater, about 100 kHz or greater, about 110 kHz or greater, about 120 kHz or greater, about 130 kHz or greater, about 140 kHz or greater, for example about 150 kHz or greater.

[0058] The pressurized spraying process typically involves using a pressurized propellant to provide an aerosol of a chemical solution 204 that results in hydrophobicity and exposing the pre-applied surface 802 of the system component 800 to the aerosol.

[0059] In electrostatic spraying, a liquid (e.g., a hydrophobic chemical solution 204) is charged electrostatically by applying a relatively high voltage (such as about 1000V or greater) to the spray nozzle. The electrostatic charge causes the fluid to be atomized into a fine mist via electrostatic repulsion. Typically, the system component 800 to be coated is positioned on a grounded platform, such that charged droplets are attracted to its surface. Advantageously, electrostatic spraying can be used to provide a substantially uniform hydrophobic coating 804 across system components 800 having relatively non-uniform surfaces.

[0060] In some embodiments, the various activities of method 700 may be used during the renewal of system component 800, such as during the renewal of substrate carrier assembly 104. In one embodiment, method 700 includes removing substrate carrier assembly 104, removing polishing fluid residues accumulated on its component surfaces, and applying a hydrophobic coating 804 thereto using one or a combination of hydrophobic applicators 200, 300, 400, or 500 and / or spraying processes. Thus, in some embodiments, the hydrophobic coating 804 is applied to the surfaces of carrier ring assembly 142 (e.g., inner and outer diameters), carrier head 140, top cap 154, and the surfaces of one or more annular film clamps 150 that may be exposed to polishing fluids during the polishing process. In some embodiments, at least some system components are new, and therefore method 700 may not include removing polishing fluid residues thereto.

[0061] Advantageously, method 700 and / or the hydrophobic applicators 200, 300, 400, and / or 500 described herein facilitate the application of a hydrophobic coating 804 to the surface of system component 800. The hydrophobic coating 804 reduces the amount of polishing fluid residue that can accumulate on the component surface between consumable replacements and other maintenance procedures, providing a generally cleaner system and reducing substrate processing defects, such as surface scratches, associated with excessive residue. By reducing the amount of polishing fluid residue generated on the component surface, the methods and objects provided herein advantageously reduce the manpower and time required to clean those residues and advantageously increase the service life of the system component. In some embodiments, such as during the renewal (reconstruction) of substrate carrier assembly 104, the method can be performed at a location remote from the polishing system 100. In other embodiments, method 700 can be performed without removing the polishing system component 800 from the substrate processing environment 103. Applying a hydrophobic coating to the system component without disassembling and / or removing the component from the substrate processing environment also advantageously reduces the manpower, time, and costs that may result when removing the system component from the polishing system.

[0062] Although the foregoing relates to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is defined by the following claims.

Claims

1. A method of forming a hydrophobic coating on a surface of a polishing system component, comprising the steps of: cleaning the surface of the polishing system component to remove polishing fluid residue therefrom; and applying a hydrophobicity-inducing chemical solution to the surface of the polishing system component using a hydrophobic applicator, the hydrophobic applicator comprising: An applicator article is formed from an open-cell foam material having a porosity of 60% or greater, a density of 50 kg / m 3 or greater and a glass transition temperature (Tg) of 25°C or less.

2. The method of claim 1, wherein the applicator article and the hydrophobicity- inducing chemical solution are packaged in a sealed container.

3. The method of claim 2, wherein the applicator article disposed in the sealed container is impregnated with the hydrophobicity-inducing chemical solution.

4. The method of claim 2, wherein the sealed container comprises a film layer separating the applicator article from the hydrophobicity-causing chemical solution, and the method further comprises the steps of: rupturing the membrane layer to impregnate the applicator article with the hydrophobicity- inducing chemical solution.

5. The method of claim 1, wherein the polishing system component comprises a platen shield, the hydrophobic applicator is coupled to a polishing platen, and The step of applying the chemical solution that results in hydrophobicity comprises the steps of: rotating the polishing platen to push the hydrophobic applicator against a radially inward surface of the platen shield.

6. The method of claim 1, wherein the polishing system component is disposed within a substrate processing environment of a polishing system, and applying the hydrophobicity-inducing chemical solution to the surface of the polishing system component without removing the polishing system component from the substrate processing environment.

7. The method of claim 6, wherein the polishing system component comprises an adjuster mounting plate having a first surface for mounting a pad conditioner adjustment disk and a second surface opposite the first surface, and applying the hydrophobicity-inducing chemical solution to the second surface without disassembling the pad conditioner adjuster assembly from the adjuster mounting plate.

8. A hydrophobic applicator, comprising: An applicator article formed from an open-cell foam material having a porosity of 60% or greater, a density of 50 kg / m 3 or greater and a glass transition temperature (Tg) of 25°C or less; and a hydrophobicity-inducing chemical solution, wherein the applicator article and the hydrophobicity-inducing chemical solution are packaged in a sealed container.

9. The hydrophobic applicator of claim 8, wherein the applicator article disposed in the sealed container is impregnated with the hydrophobicity-inducing chemical solution.

10. The hydrophobic applicator of claim 8, wherein the sealed container comprises a membrane layer separating the applicator article from the hydrophobicity-inducing chemical solution.

11. The hydrophobic applicator of claim 8, wherein an amount by weight of the hydrophobicity-inducing chemical solution within the sealed container is 0.9X or less than an amount by weight that would be required to fully saturate the applicator article, wherein X represents a maximum amount by weight of the hydrophobicity-inducing chemical solution that can be absorbed by the applicator article.

12. The hydrophobic applicator of claim 8, wherein a surface coating formed by the hydrophobicity-inducing chemical solution has a water contact angle of 85° or greater.

13. The hydrophobic applicator of claim 8, wherein the applicator article is secured to a fastener layer, and wherein the fastener layer comprises a portion of a carabiner and loop fastening system.

14. The hydrophobic applicator of claim 8, wherein the hydrophobicity-inducing chemical solution comprises a siloxane, a fluoropropenoate, or a combination thereof.

15. The hydrophobic applicator of claim 14, wherein the hydrophobicity- inducing chemical solution further comprises a hydrocarbon solvent, a fluorine solvent, or a combination thereof.

16. The hydrophobic applicator of claim 15, wherein the hydrophobicity- inducing chemical solution further comprises a carboxylic acid, a carboxylic acid salt, a carboxylic acid derivative, or a combination thereof.

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